CN101397486B - Bi-component epoxide-resin adhesive and preparation method thereof - Google Patents
Bi-component epoxide-resin adhesive and preparation method thereof Download PDFInfo
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- CN101397486B CN101397486B CN2008102017641A CN200810201764A CN101397486B CN 101397486 B CN101397486 B CN 101397486B CN 2008102017641 A CN2008102017641 A CN 2008102017641A CN 200810201764 A CN200810201764 A CN 200810201764A CN 101397486 B CN101397486 B CN 101397486B
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 41
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 41
- 239000000853 adhesive Substances 0.000 title claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 17
- MOIKCNRNYNKVGS-UHFFFAOYSA-N 4-[4-(2,4-diaminophenoxy)phenoxy]benzene-1,3-diamine Chemical compound NC1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1N MOIKCNRNYNKVGS-UHFFFAOYSA-N 0.000 claims abstract description 13
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920003986 novolac Polymers 0.000 claims abstract description 9
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 7
- -1 2, 4-diaminophenoxy Chemical group 0.000 claims abstract description 3
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000000047 product Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 claims description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 2
- 239000012452 mother liquor Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000002244 precipitate Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- HQFCELSVOFCACS-UHFFFAOYSA-N 2,4-dinitro-1-phenoxybenzene Chemical compound [O-][N+](=O)C1=CC([N+](=O)[O-])=CC=C1OC1=CC=CC=C1 HQFCELSVOFCACS-UHFFFAOYSA-N 0.000 claims 1
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 claims 1
- 239000000706 filtrate Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- DARCHGCFBMXFFD-UHFFFAOYSA-N 1-[4-(2,4-dinitrophenoxy)phenoxy]-2,4-dinitrobenzene Chemical compound [O-][N+](=O)C1=CC([N+](=O)[O-])=CC=C1OC(C=C1)=CC=C1OC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O DARCHGCFBMXFFD-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid group Chemical group C(CCCCC)(=O)O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
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- Epoxy Resins (AREA)
Abstract
本发明涉及一种双组分环氧树脂胶粘剂，其组分包括：A组分酚醛环氧树脂、脂环型环氧树脂和端羧基丁腈橡胶，B组分1，4-双(2，4-二氨基苯氧基)苯，其中脂环型环氧树脂的质量百分数为酚醛型环氧树脂的20-35％，端羧基丁腈橡胶CTBN的质量百分数为酚醛型环氧树脂的12％，1，4-双(2，4-二氨基苯氧基)苯的质量百分数为酚醛环氧树脂的15-20％，其制备包括：待用时将组分A和组分B混合均匀即可。本发明的导电胶用双组分环氧树脂胶粘剂耐热性能好，拉伸剪切强度平均可达21.28MPa，该制备过程简单，使用无溶剂操作，起到了保护环境的作用。
The present invention relates to a kind of two-component epoxy resin adhesive, and its component comprises: A component novolac epoxy resin, alicyclic epoxy resin and carboxyl-terminated nitrile rubber, B component 1,4-bis(2, 4-diaminophenoxy group) benzene, wherein the mass percent of alicyclic epoxy resin is 20-35% of novolac epoxy resin, and the mass percent of carboxy-terminated nitrile rubber CTBN is 12% of novolac epoxy resin , the mass percent of 1,4-bis(2,4-diaminophenoxy)benzene is 15-20% of novolak epoxy resin, and its preparation comprises: mixing component A and component B uniformly when ready for use . The two-component epoxy resin adhesive for conductive adhesives of the present invention has good heat resistance, and the average tensile shear strength can reach 21.28 MPa. The preparation process is simple, and the solvent-free operation is used to protect the environment.
Description
技术领域 technical field
本发明属有机胶粘剂的制备领域，特别是涉及一种双组分环氧树脂胶粘剂及其制备方法。The invention belongs to the field of preparation of organic adhesives, in particular to a two-component epoxy resin adhesive and a preparation method thereof.
背景技术 Background technique
导电胶是把导电颗粒和添加剂均一地分散于树脂中形成的一种导电材料，随着电子工业的发展，导电胶的使用范围越来越广。随着高新技术的发展，对导电胶的耐热性能的要求越来越高(长时间耐热在200℃以上，瞬间耐热在250℃)，尤其是在航空、航天、军工、电子、电力、汽车、机械等方面。导电胶主要由树脂基体和导电粒子组成，其中树脂基体赋予导电胶物理和机械性能，因此树脂基体的选择就十分重要。酚醛环氧树脂由于出色的粘结性能和优良的耐化学性和耐老化性得到广泛关注，脂环型环氧树脂作为调节体系粘度的稀释剂同样具有很好的耐热性能，同时环氧树脂必须与固化剂反应生成三维立体结构才具有实用价值，也就是说固化剂也是树脂基体的重要组成部分，其性能在一定程度上决定了基体树脂的品质。Conductive adhesive is a conductive material formed by uniformly dispersing conductive particles and additives in resin. With the development of the electronics industry, the use of conductive adhesive is becoming wider and wider. With the development of high technology, the heat resistance of conductive adhesives is increasingly demanding (long-term heat resistance above 200°C, instantaneous heat resistance at 250°C), especially in aviation, aerospace, military, electronics, electric power , automobiles, machinery, etc. The conductive adhesive is mainly composed of a resin matrix and conductive particles. The resin matrix endows the conductive adhesive with physical and mechanical properties, so the choice of the resin matrix is very important. Novolac epoxy resin has attracted widespread attention due to its excellent bonding performance and excellent chemical resistance and aging resistance. Alicyclic epoxy resin also has good heat resistance as a diluent for adjusting the viscosity of the system. At the same time, epoxy resin It must react with the curing agent to form a three-dimensional structure to have practical value, that is to say, the curing agent is also an important part of the resin matrix, and its performance determines the quality of the matrix resin to a certain extent.
目前，国内对耐高温胶粘剂的研究很多，但是能同时达到高的连接强度又能达到理想的耐热性能的胶粘剂却不是很多。北京航空材料研究所赵升龙、刘青方等人在2003年10月《航空材料学报》第23卷增刊上介绍了通过高官能度环氧树脂AG-80和双酚A型环氧树脂混合，采用混合胺类固化剂，制成了室温固化的可以耐热200℃的胶粘剂，但此种胶粘剂在高温下的拉伸剪切强度却不太理想，仅为3MPa。王超、张斌等人在《中国胶粘剂》1998年第8卷第3期上介绍了一种无溶剂耐高温的环氧树脂，采用双马来酰亚胺作为基体树脂，以4，4’-二氨基二苯甲烷作为固化剂，在250℃时剪切强度高达10MPa，但其固化工艺复杂，不利于施工。At present, there are many researches on high-temperature resistant adhesives in China, but there are not many adhesives that can achieve high connection strength and ideal heat resistance at the same time. Beijing Institute of Aeronautical Materials Zhao Shenglong, Liu Qingfang and others introduced in the Supplement to Volume 23 of "Journal of Aeronautical Materials" in October 2003 that by mixing high-functionality epoxy resin AG-80 and bisphenol A epoxy resin, using mixed amine A type of curing agent has been made into an adhesive that can be cured at room temperature and can withstand heat at 200°C, but the tensile shear strength of this adhesive at high temperature is not ideal, only 3MPa. Wang Chao, Zhang Bin and others introduced a solvent-free high-temperature resistant epoxy resin in "China Adhesives", Volume 8, Issue 3, 1998, using bismaleimide as the matrix resin, and using 4,4' - As a curing agent, diaminodiphenylmethane has a shear strength of up to 10MPa at 250°C, but its curing process is complicated, which is not conducive to construction.
发明内容 Contents of the invention
本发明所要解决的技术问题是提供一种双组分环氧树脂胶粘剂及其制备方法，本发明的导电胶用双组分环氧树脂胶粘剂耐热性能好，拉伸剪切强度平均可达21.28MPa，该制备过程简单，使用无溶剂操作，起到了保护环境的作用。The technical problem to be solved by the present invention is to provide a two-component epoxy resin adhesive and its preparation method. The two-component epoxy resin adhesive for conductive adhesive of the present invention has good heat resistance, and the average tensile shear strength can reach 21.28. MPa, the preparation process is simple, and the solvent-free operation is used to protect the environment.
本发明的一种双组分环氧树脂胶粘剂，其组分包括：A组分酚醛环氧树脂、脂环型环氧树脂和端羧基丁腈橡胶，B组分1，4-双(2，4-二氨基苯氧基)苯，其中脂环型环氧树脂的质量百分数为酚醛型环氧树脂的20-35％，端羧基丁腈橡胶CTBN的质量百分数为酚醛型环氧树脂的12％，1，4-双(2，4-二氨基苯氧基)苯的质量百分数为酚醛环氧树脂的15-20％。A kind of two-component epoxy resin adhesive of the present invention, its component comprises: A component novolac epoxy resin, alicyclic epoxy resin and carboxyl-terminated nitrile rubber,
所述的1，4-双(2，4-二氨基苯氧基)苯的制备方法，主要步骤包括：1，4-双(2，4-二硝基苯氧基)苯，在钯/炭、水合肼溶液和乙醇溶剂于70℃-85℃温度范围内反应1～5小时后，趁热过滤，冷却母液，析出晶体产物，过滤，真空干燥，得到1，4-双(2，4-二氨基苯氧基)苯晶体粉末。The preparation method of described 1,4-bis(2,4-diaminophenoxy)benzene, main steps include: 1,4-bis(2,4-dinitrophenoxy)benzene, palladium/ After reacting charcoal, hydrazine hydrate solution and ethanol solvent in the temperature range of 70°C-85°C for 1 to 5 hours, filter while hot, cool the mother liquor, precipitate crystal product, filter, and dry in vacuum to obtain 1,4-bis(2,4 - diaminophenoxy)benzene crystalline powder.
所述的酚醛环氧树脂的环氧值为0.526-0.588；The epoxy value of described novolac epoxy resin is 0.526-0.588;
所述的脂环型环氧树脂为3，4-环氧基环己甲酸-3’，4’-环氧基环己甲酯；Described cycloaliphatic epoxy resin is 3,4-epoxy cyclohexane carboxylate-3',4'-epoxy cyclohexyl methyl ester;
所述的端羧基丁腈橡胶为上海EMST电子材料有限公司生产。The carboxyl-terminated nitrile rubber is produced by Shanghai EMST Electronic Materials Co., Ltd.
本发明的一种双组分环氧树脂胶粘剂的制备，包括：将组分A和组分B常温下混合，搅拌均匀即可。The preparation of a two-component epoxy resin adhesive of the present invention includes: mixing component A and component B at normal temperature and stirring evenly.
本发明的双组分环氧树脂胶粘剂具有很好的耐热性能，该特点取决于作为树脂基体的酚醛环氧树脂，活性稀释剂的脂环族环氧树脂(3，4-环氧基环己甲酸-3’，4’-环氧基环己甲酯)以及作为固化剂的1，4-双(2，4-二氨基苯氧基)苯，这些组分为固化后的胶粘剂提供了刚性的骨架，有利于耐热性能的提高。The two-component epoxy resin adhesive of the present invention has good heat resistance, and this feature depends on the novolak epoxy resin as the resin matrix, the alicyclic epoxy resin (3,4-epoxy ring) of reactive diluent Hexanoic acid-3', 4'-epoxycyclohexylmethyl ester) and 1,4-bis(2,4-diaminophenoxy)benzene as a curing agent, these components provide the cured adhesive The rigid skeleton is conducive to the improvement of heat resistance.
本发明的双组分环氧树脂胶粘剂相对于传统的导电胶来说，其拉伸剪切强度有着明显的改善，这种改变取决于多元芳胺结构，它使得固化物具有更高的交联密度，同时与苯环相连的醚键结构改善了结构的柔韧性。Compared with the traditional conductive adhesive, the two-component epoxy resin adhesive of the present invention has obvious improvement in tensile shear strength. This change depends on the structure of polyarylamine, which makes the cured product have higher crosslinking Density, while the ether bond structure connected to the benzene ring improves the flexibility of the structure.
有益效果Beneficial effect
(1)本发明的导电胶用双组分环氧树脂胶粘剂，耐热性能好，拉伸剪切强度平均可达21.28MPa。(1) The two-component epoxy resin adhesive for conductive adhesive of the present invention has good heat resistance, and the average tensile shear strength can reach 21.28 MPa.
(2)该制备过程简单，使用无溶剂操作，起到了保护环境的作用。(2) The preparation process is simple, and the solvent-free operation is used to protect the environment.
附图说明 Description of drawings
图1为双组分环氧树脂胶粘剂的热失重曲线Figure 1 is the thermal weight loss curve of the two-component epoxy resin adhesive
具体实施方式 Detailed ways
下面结合具体实施例，进一步阐述本发明。应理解，这些实施例仅用于说明本发明而不用于限制本发明的范围。此外应理解，在阅读了本发明讲授的内容之后，本领域技术人员可以对本发明作各种改动或修改，这些等价形式同样落于本申请所附权利要求书所限定的范围。Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
实施例1Example 1
按酚醛环氧树脂重量100为单位计算Calculated by the weight of novolac epoxy resin in units of 100
A组分 B组分Component A Component B
酚醛环氧树脂 100 1，4-双(2，4-二氨基苯氧基)苯20Novolak epoxy
CTBN 12CTBN 12
脂环型环氧树脂 24Alicyclic epoxy resin 24
待用时将两种组分混合均匀即可，其性能测试如表1所示。通过热失重分析发现，此种胶粘剂固化后的产物，在200℃热失重仅为1.51％。When ready to use, just mix the two components evenly, and its performance test is shown in Table 1. Through thermogravimetric analysis, it is found that the cured product of this adhesive has a thermogravimetric loss of only 1.51% at 200°C.
从图1中可以看出，实施例1固化产物具有很好的耐热性能，200℃热失重仅为1.51％，300℃的热失重仅为4.49％。It can be seen from Figure 1 that the cured product of Example 1 has good heat resistance, the thermal weight loss at 200°C is only 1.51%, and the thermal weight loss at 300°C is only 4.49%.
对比实施例1Comparative Example 1
按酚醛环氧树脂重量100为单位计算Calculated by the weight of novolac epoxy resin in units of 100
酚醛环氧树脂 100Novolak
CTBN 12CTBN 12
稀释剂 24Thinner 24
双氰胺 20
待各成分混合均匀即可，其性能测试如表1所示。It is enough to mix the ingredients evenly, and its performance test is shown in Table 1.
表1 实施例1和对比实施例1的拉伸剪切强度测试The tensile shear strength test of table 1
由表1可以看出，实施例1的拉伸剪切强度明显大于对比实施例，1，4-双(2，4-二氨基苯氧基)苯作为固化剂，对树脂体系的粘接强度有明显改善，拉伸剪切强度平均可达21.28MPa。As can be seen from Table 1, the tensile shear strength of Example 1 is significantly greater than that of Comparative Example, and 1,4-bis(2,4-diaminophenoxy)benzene is used as curing agent to bond strength to resin system There is obvious improvement, and the average tensile shear strength can reach 21.28MPa.
实施例2Example 2
按酚醛环氧树脂重量100为单位计算Calculated by the weight of novolac epoxy resin in units of 100
A组分 B组分Component A Component B
酚醛环氧树脂 100 1，4-双(2，4-二氨基苯氧基)苯20Novolak epoxy
CTBN 12CTBN 12
脂环型环氧树脂 30
待用时将两种组分混合均匀即可。When ready to use, mix the two components evenly.
实施例3Example 3
按酚醛环氧树脂重量100为单位计算Calculated by the weight of novolac epoxy resin in units of 100
A组分 B组分A component B component
酚醛环氧树脂 100 1，4-双(2，4-二氨基苯氧基)苯20Novolak
CTBN 12CTBN 12
脂环型环氧树脂 35Alicyclic epoxy resin 35
待用时将两种组分混合均匀即可。When ready to use, mix the two components evenly.
实施例4Example 4
按酚醛环氧树脂重量100为单位计算Calculated by the weight of novolac epoxy resin in units of 100
A组分 B组分A component B component
酚醛环氧树脂 100 1，4-双(2，4-二氨基苯氧基)苯15Novolak
CTBN 12CTBN 12
脂环型环氧树脂 24Alicyclic epoxy resin 24
待用时将两种组分混合均匀即可。When ready to use, mix the two components evenly.
Claims (4)
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| CN101544879B (en) * | 2009-04-30 | 2012-06-13 | 东华大学 | Preparation method for high strength solventless epoxy adhesive |
| CN101602926B (en) * | 2009-07-16 | 2012-05-02 | 常熟市江南粘合剂有限公司 | Room temperature curing epoxy resin adhesive and preparation method thereof |
| CN102031082B (en) * | 2010-12-10 | 2013-04-03 | 东华大学 | Benzimidazole diamine curing type epoxy adhesive and preparation method thereof |
| CN102732201B (en) * | 2012-06-25 | 2014-04-09 | 烟台开发区泰盛精化新材料有限公司 | Wear-resistant and weather-resistant epoxy resin coating adhesive and its preparation method |
| CN103214793B (en) * | 2013-04-22 | 2015-06-03 | 东华大学 | Advanced composite material matrix resin and preparation method thereof |
| CN104293270B (en) * | 2014-10-31 | 2015-11-04 | 浙江红高梁木业有限公司 | A kind of epoxyn for timber floor and preparation method thereof |
| CN105331305A (en) * | 2015-12-16 | 2016-02-17 | 太仓康盛化工有限公司 | Fast-curing epoxy resin adhesive |
| CN112280247A (en) * | 2020-10-29 | 2021-01-29 | 西安永兴科技发展有限公司 | High-temperature-resistant high-humidity-heat-resistant fiber-reinforced composite material and preparation method thereof |
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| US6265469B1 (en) * | 1999-09-02 | 2001-07-24 | Du Pont Wirex Ltd | Epoxy resin adhesive for flexible printed circuits |
| CN101130679A (en) * | 2006-08-25 | 2008-02-27 | 比亚迪股份有限公司 | Adhesion agent and method of manufacturing the same |
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| US6265469B1 (en) * | 1999-09-02 | 2001-07-24 | Du Pont Wirex Ltd | Epoxy resin adhesive for flexible printed circuits |
| CN101130679A (en) * | 2006-08-25 | 2008-02-27 | 比亚迪股份有限公司 | Adhesion agent and method of manufacturing the same |
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