CN101392325A - A method of extracting gold from waste printed circuit boards - Google Patents
A method of extracting gold from waste printed circuit boards Download PDFInfo
- Publication number
- CN101392325A CN101392325A CNA2008102014200A CN200810201420A CN101392325A CN 101392325 A CN101392325 A CN 101392325A CN A2008102014200 A CNA2008102014200 A CN A2008102014200A CN 200810201420 A CN200810201420 A CN 200810201420A CN 101392325 A CN101392325 A CN 101392325A
- Authority
- CN
- China
- Prior art keywords
- iodine
- printed circuit
- circuit board
- gold
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010931 gold Substances 0.000 title claims abstract description 43
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 42
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000002699 waste material Substances 0.000 title abstract description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000011630 iodine Substances 0.000 claims abstract description 63
- 229910052740 iodine Inorganic materials 0.000 claims abstract description 63
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 230000003244 pro-oxidative effect Effects 0.000 claims abstract description 22
- 239000000243 solution Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000706 filtrate Substances 0.000 claims abstract description 14
- 239000011259 mixed solution Substances 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000004033 plastic Substances 0.000 claims abstract description 9
- 229920003023 plastic Polymers 0.000 claims abstract description 9
- 239000000047 product Substances 0.000 claims abstract description 9
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000010298 pulverizing process Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 36
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 17
- 238000005868 electrolysis reaction Methods 0.000 claims description 16
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 claims description 14
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 claims description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- 239000003011 anion exchange membrane Substances 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000003014 ion exchange membrane Substances 0.000 claims description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 claims description 5
- 238000005349 anion exchange Methods 0.000 claims description 4
- ZRDJERPXCFOFCP-UHFFFAOYSA-N azane;iodic acid Chemical compound [NH4+].[O-]I(=O)=O ZRDJERPXCFOFCP-UHFFFAOYSA-N 0.000 claims description 4
- 239000003637 basic solution Substances 0.000 claims description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 235000010755 mineral Nutrition 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 235000009518 sodium iodide Nutrition 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 239000003929 acidic solution Substances 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 238000013467 fragmentation Methods 0.000 claims description 2
- 238000006062 fragmentation reaction Methods 0.000 claims description 2
- 235000007715 potassium iodide Nutrition 0.000 claims description 2
- 229960004839 potassium iodide Drugs 0.000 claims description 2
- 229940083599 sodium iodide Drugs 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 238000002386 leaching Methods 0.000 abstract description 7
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract description 3
- 229910017604 nitric acid Inorganic materials 0.000 abstract description 3
- 239000012670 alkaline solution Substances 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 abstract 1
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- 238000002791 soaking Methods 0.000 description 14
- 230000008021 deposition Effects 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000013528 metallic particle Substances 0.000 description 5
- 239000010970 precious metal Substances 0.000 description 5
- 235000011121 sodium hydroxide Nutrition 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000010953 base metal Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000012451 post-reaction mixture Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 231100000252 nontoxic Toxicity 0.000 description 3
- 230000003000 nontoxic effect Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- DKNPRRRKHAEUMW-UHFFFAOYSA-N Iodine aqueous Chemical compound [K+].I[I-]I DKNPRRRKHAEUMW-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000010793 electronic waste Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009854 hydrometallurgy Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000009853 pyrometallurgy Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electrolytic Production Of Metals (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
本发明提供了一种从废弃印刷线路板中提取金的方法，具体步骤为：第一步：将废弃印刷线路板破碎、粉碎，分离金属与塑料；第二步：将第一步得到的金属与硝酸溶液混合，在10～80℃恒温条件下搅拌反应1～6h，将产物过滤，从滤液中提取铜，将滤渣洗涤烘干；第三步：将第二步得到的滤渣加到第一碘液和助氧化剂的混合液中，用无机酸和碱性溶液控制反应pH值为3～9，在10～60℃恒温振荡器中反应2～5h。第四步：将第三步的产物过滤，滤液放入电解槽中的阴极区，将由碘、水溶性碘化物和水组成的第二碘液作为电解质放入阳极区，电解，过滤阴极区溶液，得到的滤渣即为金泥，回收阳极区的第二碘液。本发明浸金率高，成本低，环境污染小。The invention provides a method for extracting gold from waste printed circuit boards. The specific steps are as follows: the first step: breaking and pulverizing the waste printed circuit boards, and separating metal and plastic; Mix with nitric acid solution, stir and react at a constant temperature of 10-80°C for 1-6 hours, filter the product, extract copper from the filtrate, wash and dry the filter residue; the third step: add the filter residue obtained in the second step to the first In the mixed solution of iodine solution and pro-oxidant, inorganic acid and alkaline solution are used to control the reaction pH value to 3-9, and the reaction is carried out in a constant temperature oscillator at 10-60° C. for 2-5 hours. The fourth step: filter the product of the third step, put the filtrate into the cathode area in the electrolytic cell, put the second iodine solution composed of iodine, water-soluble iodide and water as the electrolyte into the anode area, electrolyze, and filter the solution in the cathode area , the filter residue obtained is gold mud, and the second iodine solution in the anode area is recovered. The invention has high gold leaching rate, low cost and little environmental pollution.
Description
Technical field
The present invention relates to a kind of method of from abandoned printed circuit board, extracting gold, be specifically related to a kind of novel environment friendly, efficient, the economic method of from abandoned printed circuit board, extracting gold.
Background technology
Along with constantly upgrading and the social continual renovation to electrical type consuming product demand of electronic industry state of the art, electronic product is eliminated and depleted speed is more and more faster, quantity is more and more.As the important component part of electronic product, the discarded amount of printed-wiring board (PWB) (Printed Circuit Board) also grows with each passing day.Abandoned printed circuit board belongs to danger wastes, and the growth of its quantity brings great pressure to environment, becomes urgent problem in the Economic development so it is reasonably handled and dispose.
In the composition of printed-wiring board (PWB) except containing a large amount of plastics (Resins, epoxy etc.) and base metal (copper, lead, zinc etc.), also generally contain rare precious metal (gold and silver, platinum etc.), wherein Jin content reaches 80g/t, is higher than the gold grade in the general gold mine ore far away.Reclaim so abandoned printed circuit board is carried out resource utilization, not only can obtain valuable rare precious metal resource, can also prevent that the heavy metal in the abandoned printed circuit board from producing severe contamination to environment.
Now mainly contain the method that mechanical treatment, pyrometallurgy, hydrometallurgy or several technology combine for the most frequently used recovery technology of abandoned printed circuit board.But mechanical treatment only can be realized separating of metal and plastics, and the metallic particles body that obtains after the processing also needs further processing just can obtain the precious metals such as gold of enrichment.Pyrometallurgy and hydrometallurgical technology are then non-heavy serious to the pollution of environment, traditional cyanide gold-leaching technology in the hydrometallurgical processes especially, because prussiate is a highly toxic substance, its environmental pollution that causes is very serious.
Therefore, in today that nonferrous metal resource shortage, price rise steadily and the abandoned printed circuit board environmental pollution is serious, develop and a kind ofly from abandoned printed circuit board, can extract metal efficiently, economically, can reduce environmental hazard again, nontoxic processing method has become a kind of exigence.
Summary of the invention
The purpose of this invention is to provide a kind of method of from abandoned printed circuit board, extracting gold, it can overcome, and the metal recovery rate that exists in the existing recovery technology is low, environmental pollution serious and medicament has shortcomings such as toxicity, can extract metal efficiently, economically, can reduce again environmental hazard.
In order to achieve the above object, technical scheme of the present invention provides a kind of method of extracting gold from abandoned printed circuit board, it is characterized in that concrete steps are:
The first step: with abandoned printed circuit board fragmentation, pulverizing, separating metal and plastics;
Second step: the metal that the first step is obtained and mass concentration are that 15%～25% salpeter solution is that mix 1:1～45 by mass ratio, stirring reaction 1～6h under 10～80 ℃ of constant temperatures, product is filtered, from filtrate, extract copper, residue washing is dried with ion-exchange membrane electrolysis;
The 3rd step: is that 1:1～25 are added in the mixed solution of the first iodine liquid be made up of iodine, water-soluble iodate thing and water and pro-oxidant with second filter residue that obtain of step by mass ratio, with mineral acid and basic solution control pH value in reaction is 3～9, in 10～60 ℃ of constant temperature oscillators, react 2～5h, wherein, the mass concentration of pro-oxidant is 0.1%～10% in the mixed solution of the first iodine liquid and pro-oxidant, iodine is 1:1～13 with water-soluble iodate amount ratio in the first iodine liquid, and the mass concentration of iodine is 0.2%～2.0%;
The 4th step: the product in the 3rd step is filtered, filtrate is put into the cathodic area of electrolyzer, will be by iodine, the second iodine liquid that water-soluble iodate thing and water are formed is put into the positive column as ionogen, electrolysis, filtering cathode district solution, the filter residue that obtains is gold mud, wherein, iodine is 1:1～13 with water-soluble iodate amount ratio in the described second iodine liquid, and the mass concentration of iodine is 0.1%～2.0%, and it is negative electrode that described electrolyzer adopts carbon-point, the titanium plate, the titanium net, stainless steel plate, stainless (steel) wire, platinum titanium plate or platinum titanium net are anode, bath voltage is 1～20V, and strength of current is 0.01～0.4A, and current density is 5～200A/m
2, temperature of reaction is 20～30 ℃, electrolysis time is 0.25h～5h.
Further, in the described the first step printed-wiring board (PWB) is crushed to granularity and is preferably 0.5-1mm.
Pro-oxidant is preferably hydrogen peroxide in described the 3rd step.
Mineral acid is preferably hydrochloric acid in described the 3rd step, and basic solution is preferably sodium hydroxide solution.
Electric tank cathode district and positive column are preferably separated by anion-exchange membrane in described the 4th step.Described anion-exchange membrane is homogeneous-phase anion exchange film or out-phase anion-exchange membrane.
In described the 4th step in the electric tank cathode district mass concentration of gold be preferably 1～90ppm.
Water-soluble iodate thing is preferably potassiumiodide, sodium iodide or iodate ammonia respectively in the described first iodine liquid and the second iodine liquid.
The present invention be adopt the iodine liquid of non-cyanogen leaching from printed-wiring board (PWB) gold lixiviation, again with the electrolysis deposited gold and reclaim the method for iodine, principle of work of the present invention is as follows:
The present invention utilizes other base metals of parcel gold in the nitric acid oxidation dissolving wiring board earlier; The iodine liquid selectivity that re-uses nontoxic non-cyanogen leaching leaches precious metals such as gold and silver, palladium, realizes separating fully of metal and indifferent oxide and separating of base metals such as precious metals such as gold and silver, palladium and copper; At last lixivium is adopted metals such as electrolytic process deposition gold and silver, palladium, and reclaim simultaneously and obtain iodine liquid and be re-used as ionogen or directly be used for soaking gold.The present invention can eliminate electronic waste and pollute, and improves the resource reutilization rate.
At first, the adding of nitric acid makes the base metal simple substance in the printed-wiring board (PWB) particle form soluble salt with it, and these soluble salts enter the aqueous solution and reached the purpose of separating with other insoluble materials.With copper is example, and following reaction formula is arranged:
3Cu+8HNO
3→3Cu
2++6NO
3 -+4H
2O+2NO↑
Go residue behind the copper through after the washing repeatedly, add water-soluble iodate thing leaching solution of iodo-and pro-oxidant hydrogen peroxide, I
2Elder generation and I
-Reaction generates I
3 -, I then
-, I
3 -React with Au and to form stable AuI
2 -Gold is dissolved in the solution, finishes the golden process of soaking.The pro-oxidant hydrogen peroxide plays and improves the effect of soaking golden efficient.
I
2+I
-——I
3 -
2Au+I
-+I
3 -——2AuI
2 -
AuI
2 -+I
3 -——AuI
4 -+I
-
AuI+I
-——AuI
2 -
2Au+4I
-+H
2O
2——2AuI
2 -+2OH
-
The electrolysis lixivium, in the cathodic area, deposition of gold has hydrogen to separate out in the bottom of electrolyzer simultaneously:
AuI
2 -+e——Au+2I
-
2H
2O+2e——H
2+2OH
-
AuI
4 -+3e——Au+4I
-
Deposit in the positive column simultaneously, reclaim iodine, and have oxygen to emit:
2H
2O-4e——O
2+4H
+
2I
--2e——I
2
Printed-wiring board (PWB) of the present invention comprises various types of wiring boards that computer, TV, mobile phone, game machine, electronic cards, main equipment etc. use.
The present invention adopts the water-soluble iodate thing of nontoxic iodo-to soak under the condition of golden agent in lower processing costs, realized the higher golden rate of soaking, and has realized the efficient deposition of gold then by electrolytic reaction, and regeneration, reuse simultaneously soak golden medicament.The present invention can realize innoxious, the minimizing and the resource utilization of electronic waste.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Embodiment 1
Discarded printed circuit boards is crushed to 0.5mm, separating metal and plastics, in reactor, abandoned printed circuit board metallic particles that separation is obtained and mass concentration are 15% HNO
3Mix and pour in the reactor, the mass ratio of the two is 1:1, stirring reaction 1h under 10 ℃ constant temperature.Post reaction mixture is filtered, and filtrate is extracted copper with ion-exchange membrane electrolysis; Mixed solution with the first iodine liquid and pro-oxidant hydrogen peroxide after the reaction residues washing and drying mixes by mass ratio 1:1.The massfraction of iodine is 0.2% in the first iodine liquid, and iodine and potassiumiodide mass ratio are 1:1, and the massfraction of pro-oxidant hydrogen peroxide is 0.1%, is 3 with the pH value of hydrochloric acid and sodium hydrate regulator solution, under 10 ℃, and oscillatory reaction 2h.Wherein, the extraction yield of copper is 32.3%, and soaking golden rate is 5.5%.(carbon-point is made negative electrode to put into electrolyzer with filtrate (golden amount concentration is 1ppm), the titanium plate is made anode) the cathodic area, the second iodine liquid is put in the positive column, and (massfraction of iodine is 0.1%, iodine and potassiumiodide mass ratio are 1:1), cathodic area and positive column homogeneous-phase anion exchange film (membrane material: polymers such as tetrafluoroethylene; Thickness: 0.2mm; Exchange capacity 〉=1.6mol/Kg (doing); Face resistance≤4.0 Ω .cm
2Select transmitance 〉=97%) separate, bath voltage is 1V, and strength of current is 0.01A, and current density is 5A/m
2, temperature of reaction is 20 ℃, and electrolysis time is 0.25h, and the deposition of cathodic area gold is 61.3%, and the iodine liquid of positive column can be brought and do electrolytic next time ionogen, improves its iodine quality mark, final as the purpose of soaking gold once more to reach.
Embodiment 2
Discarded printed circuit boards is crushed to 1mm, separating metal and plastics, in reactor, abandoned printed circuit board metallic particles that separation is obtained and mass concentration are 25% HNO
3Mix and pour in the reactor, the mass ratio of the two is 1:45, stirring reaction 6h under 80 ℃ constant temperature.Post reaction mixture is filtered, and filtrate is extracted copper with ion-exchange membrane electrolysis; Mixed solution with the first iodine liquid and pro-oxidant hydrogen peroxide after the reaction residues washing and drying mixes.Wherein residue is 1:25 with the mass ratio of leaching mixing solutions, the massfraction of iodine is 2.0% in the first iodine liquid, iodine and sodium iodide mass ratio are 1:13, the massfraction of pro-oxidant hydrogen peroxide is 10% in the mixed solution of the first iodine liquid and pro-oxidant hydrogen peroxide, regulating the pH value with the NaOH solution of the HCl and 1% (mass concentration) of 1% (mass concentration) is 9, reacts 5h in 60 ℃ of constant temperature oscillators.Wherein, the extraction yield of copper is 83.5%, and soaking golden rate is 77.2%.(carbon-point is made negative electrode to put into electrolyzer will to soak golden filtrate (golden amount concentration is 90ppm), the titanium net is made anode) the cathodic area, the second iodine liquid is put in the positive column, and (massfraction of iodine is 2.0%, iodine and sodium iodide mass ratio are 1:13), cathodic area and positive column out-phase anion-exchange membrane (membrane material: polymers such as polyethylene; Thickness: 0.42mm; Exchange capacity 〉=1.8mol/Kg (doing); Face resistance≤12 Ω .cm
2Select transmitance 〉=89%) separate, bath voltage is 20V, and strength of current is 0.4A, and current density is 200A/m
2, 30 ℃ of temperature of reaction, electrolysis time is 5h, and the deposition of cathodic area gold is 89.5%, and the iodine liquid of positive column directly is used for soaking once more gold from abandoned printed circuit board, and soaking golden rate is 92.6%.
Embodiment 3
Discarded printed circuit boards is crushed to 0.75mm, separating metal and plastics, in reactor, abandoned printed circuit board metallic particles that separation is obtained and mass concentration are 20% HNO
3Mix and pour in the reactor, the mass ratio of the two is 1:27, stirring reaction 4h under 20 ℃ constant temperature.Post reaction mixture is filtered, and filtrate is extracted copper with ion-exchange membrane electrolysis; Mix with the first iodine liquid and pro-oxidant hydrogen peroxide mixed solution after the reaction residues washing and drying.Wherein residue is 1:10 with the mass ratio of leaching mixing solutions, the massfraction of iodine is 1.2% in the first iodine liquid, iodine and iodate ammonia mass ratio are 1:6, the massfraction of pro-oxidant hydrogen peroxide is 1.0% in the first iodine liquid and the pro-oxidant hydrogen peroxide mixed solution, regulating the pH value with the NaOH solution of the HCl and 1% (mass concentration) of 1% (mass concentration) is 5, reacts 3h in 50 ℃ of constant temperature oscillators.Wherein, the extraction yield of copper is 95.8%, and soaking golden rate is 97.6%.(carbon-point is made negative electrode to put into electrolyzer will to soak golden filtrate (golden amount concentration is 12ppm), stainless steel plate is made anode) the cathodic area, the second iodine liquid is put in the positive column, and (massfraction of iodine is 0.1%, iodine and iodate ammonia mass ratio are 1:2), cathodic area and positive column homogeneous-phase anion exchange film (membrane material: polymers such as tetrafluoroethylene; Thickness: 0.2mm; Exchange capacity 〉=1.6mol/Kg (doing); Face resistance≤4.0 Ω .cm
2Select transmitance 〉=97%) separate, bath voltage is 14.0V, and strength of current is 0.12A, and current density is 60.0A/m
2, electrolysis time is 4h, and the deposition of cathodic area gold is 95.5%, and the iodine liquid of positive column can be brought and do electrolytic next time ionogen, improves its iodine quality mark, final as the purpose of soaking gold once more to reach.
Embodiment 4
Discarded printed circuit boards is crushed to 0.75mm, separating metal and plastics, in reactor, abandoned printed circuit board metallic particles that separation is obtained and mass concentration are 17% HNO
3Mix and pour in the reactor, the mass ratio of the two is 1:22, stirring reaction 2h under 60 ℃ constant temperature.Post reaction mixture is filtered, and filtrate is extracted copper with ion-exchange membrane electrolysis; Mixed solution with the first iodine liquid and pro-oxidant hydrogen peroxide after the reaction residues washing and drying is that 1:12 mixes with the mass ratio.The massfraction of iodine is 1.1% in the first iodine liquid, iodine is 1:10 with water-soluble iodate amount ratio, the massfraction of pro-oxidant hydrogen peroxide is 1.5% in the mixed solution of the first iodine liquid and pro-oxidant hydrogen peroxide, regulating the pH value with the NaOH solution of the HCl and 1% (mass concentration) of 1% (mass concentration) is 6, reacts 5h in 40 ℃ of constant temperature oscillators.Wherein, the extraction yield of copper is 96.2%, and soaking golden rate is 97.0%.(carbon-point is made negative electrode to put into electrolyzer will to soak golden filtrate (golden amount concentration is 50ppm), platinum titanium plate is made anode) the cathodic area, the second iodine liquid is put in the positive column, and (massfraction of iodine is 0.8%, iodine is 1:6 with water-soluble iodate amount ratio), cathodic area and positive column out-phase anion-exchange membrane (membrane material: polymers such as polyethylene; Thickness: 0.42mm; Exchange capacity 〉=1.8mol/Kg (doing); Face resistance≤12 Ω .cm
2Select transmitance 〉=89%) separate, bath voltage is 10.0V, and strength of current is 0.06A, and current density is 30.0A/m
2, electrolysis time is 4h, and the deposition of cathodic area gold is 95.2%, and the iodine liquid of positive column directly is used for soaking once more gold from abandoned printed circuit board, and soaking golden rate is 94.7%.
Claims (8)
1. one kind is extracted golden method from abandoned printed circuit board, it is characterized in that concrete steps are:
The first step: with abandoned printed circuit board fragmentation, pulverizing, separating metal and plastics;
Second step: the metal that the first step is obtained and mass concentration are that 15%～25% salpeter solution is that mix 1:1～45 by mass ratio, stirring reaction 1～6h under 10～80 ℃ of constant temperatures, product is filtered, from filtrate, extract copper, residue washing is dried with ion-exchange membrane electrolysis;
The 3rd step: is that 1:1～25 are added in the mixed solution of the first iodine liquid be made up of iodine, water-soluble iodate thing and water and pro-oxidant with second filter residue that obtain of step by mass ratio, with mineral acid and basic solution control pH value in reaction is 3～9, in 10～60 ℃ of constant temperature oscillators, react 2～5h, wherein, the mass concentration of pro-oxidant is 0.1%～10% in the mixed solution of the first iodine liquid and pro-oxidant, iodine is 1:1～13 with water-soluble iodate amount ratio in the first iodine liquid, and the mass concentration of iodine is 0.2%～2.0%;
The 4th step: the product in the 3rd step is filtered, filtrate is put into the cathodic area of electrolyzer, will be by iodine, the second iodine liquid that water-soluble iodate thing and water are formed is put into the positive column as ionogen, electrolysis, filtering cathode district solution, the filter residue that obtains is gold mud, wherein, iodine is 1:1～13 with water-soluble iodate amount ratio in the described second iodine liquid, and the mass concentration of iodine is 0.1%～2.0%, and it is negative electrode that described electrolyzer adopts carbon-point, the titanium plate, the titanium net, stainless steel plate, stainless (steel) wire, platinum titanium plate or platinum titanium net are anode, bath voltage is 1～20V, and strength of current is 0.01～0.4A, and current density is 5～200A/m
2, temperature of reaction is 20～30 ℃, electrolysis time is 0.25h～5h.
2. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 1 is characterized in that in the described the first step printed-wiring board (PWB) being crushed to granularity is 0.5-1mm.
3. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 1 is characterized in that, pro-oxidant is a hydrogen peroxide in described the 3rd step.
4. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 1 is characterized in that, mineral acid is a hydrochloric acid in described the 3rd step, and basic solution is a sodium hydroxide solution.
5. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 1 is characterized in that, electric tank cathode district and positive column are separated by anion-exchange membrane in described the 4th step.
6. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 5 is characterized in that described anion-exchange membrane is homogeneous-phase anion exchange film or out-phase anion-exchange membrane.
7. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 1 is characterized in that, in described the 4th step in the electric tank cathode district mass concentration of gold be 1～90ppm.
8. a kind of method of extracting gold from abandoned printed circuit board as claimed in claim 1 is characterized in that water-soluble iodate thing is respectively potassiumiodide, sodium iodide or iodate ammonia in the described first iodine liquid and the second iodine liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102014200A CN101392325B (en) | 2008-10-21 | 2008-10-21 | Method for extracting gold from waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102014200A CN101392325B (en) | 2008-10-21 | 2008-10-21 | Method for extracting gold from waste printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101392325A true CN101392325A (en) | 2009-03-25 |
| CN101392325B CN101392325B (en) | 2010-08-11 |
Family
ID=40492833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102014200A Expired - Fee Related CN101392325B (en) | 2008-10-21 | 2008-10-21 | Method for extracting gold from waste printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101392325B (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101928840A (en) * | 2010-08-02 | 2010-12-29 | 惠州市奥美特环境科技有限公司 | Method for recovering gold and silver from waste circuit boards |
| CN102329960A (en) * | 2011-08-18 | 2012-01-25 | 华星集团环保产业发展有限公司 | Method for extracting gold from waste and old circuit board |
| CN103194769A (en) * | 2013-04-22 | 2013-07-10 | 北京工业大学 | Electrolytic device and method for recovering high-purity copper from waste circuit board |
| CN103540748A (en) * | 2012-07-16 | 2014-01-29 | 中国科学院化学研究所 | Separating method for metals and nonmetals of waste printed circuit board substrate |
| CN105018725A (en) * | 2015-08-07 | 2015-11-04 | 珠海格力电器股份有限公司 | Gold leaching solution and method for recovering gold |
| CN105350017A (en) * | 2015-11-30 | 2016-02-24 | 长春黄金研究院 | Method increasing rate of filtration of desorbed and electrolyzed gold mud |
| CN105400958A (en) * | 2015-12-03 | 2016-03-16 | 福建工程学院 | Method and device for rapidly leaching out gold in waste circuit board |
| CN105420500A (en) * | 2015-11-10 | 2016-03-23 | 森蓝环保(上海)有限公司 | Method for separating and extracting all metal components from waste printed circuit boards through wet metallurgy |
| CN105543495A (en) * | 2014-11-04 | 2016-05-04 | 杨毓华 | Novel environmentally-friendly gold extraction agent |
| CN105586494A (en) * | 2016-03-21 | 2016-05-18 | 黑龙江科技大学 | Method for recycling gold from iodide gold leaching pregnant solution on basis of recycling of waste solution |
| CN105624422A (en) * | 2016-03-22 | 2016-06-01 | 黑龙江科技大学 | Recovery method for gold in iodized gold leaching noble solution considering recycling of waste liquor |
| CN103695653B (en) * | 2014-01-02 | 2016-06-08 | 沈少波 | A kind of method of noble metal on wet underwater welding circuit board |
| CN105648232A (en) * | 2016-04-11 | 2016-06-08 | 许良秋 | Method for refining gold by using I2 and KI |
| CN105731382A (en) * | 2016-01-25 | 2016-07-06 | 珠海格力电器股份有限公司 | Method for preparing iodide from regenerated iodine in iodinated gold leaching agent and iodinated gold leaching agent |
| CN105821444A (en) * | 2016-05-23 | 2016-08-03 | 深圳市瑞世兴科技有限公司 | Method for recovering tin from circuit board waste |
| CN105838900A (en) * | 2016-04-11 | 2016-08-10 | 许良秋 | Method for refining gold through I2 and NaI |
| CN106086417A (en) * | 2016-06-27 | 2016-11-09 | 南开大学 | A kind of method extracting copper and gold from waste mobile phone circuit board |
| CN106435196A (en) * | 2016-11-30 | 2017-02-22 | 福建工程学院 | Device and process for leaching out gold from waste circuit boards |
| CN108754554A (en) * | 2018-09-18 | 2018-11-06 | 泉州益丰贵金属科技有限公司 | A kind of gold plating liquid and a kind of gold plating method |
| CN109797407A (en) * | 2019-03-13 | 2019-05-24 | 上海第二工业大学 | A method of selective electrolysis leaches recycling gold, copper from waste and old memory bar |
| CN110656251A (en) * | 2019-09-24 | 2020-01-07 | 广东工业大学 | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method |
| CN113046569A (en) * | 2021-03-03 | 2021-06-29 | 南昌航空大学 | Method for selectively recovering gold from waste circuit board |
| US11136681B2 (en) | 2015-06-24 | 2021-10-05 | Greene Lyon Group, Inc. | Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions |
| US11193214B2 (en) | 2013-12-20 | 2021-12-07 | Greene Lyon Group, Inc. | Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap |
-
2008
- 2008-10-21 CN CN2008102014200A patent/CN101392325B/en not_active Expired - Fee Related
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101928840A (en) * | 2010-08-02 | 2010-12-29 | 惠州市奥美特环境科技有限公司 | Method for recovering gold and silver from waste circuit boards |
| CN102329960A (en) * | 2011-08-18 | 2012-01-25 | 华星集团环保产业发展有限公司 | Method for extracting gold from waste and old circuit board |
| CN103540748A (en) * | 2012-07-16 | 2014-01-29 | 中国科学院化学研究所 | Separating method for metals and nonmetals of waste printed circuit board substrate |
| CN103540748B (en) * | 2012-07-16 | 2015-10-28 | 中国科学院化学研究所 | A kind of metal of waste printed circuit board substrate and nonmetallic separation method |
| CN103194769A (en) * | 2013-04-22 | 2013-07-10 | 北京工业大学 | Electrolytic device and method for recovering high-purity copper from waste circuit board |
| CN103194769B (en) * | 2013-04-22 | 2016-02-17 | 北京工业大学 | A kind of electrolyzer and method thereof reclaiming high purity copper from discarded circuit board |
| US11193214B2 (en) | 2013-12-20 | 2021-12-07 | Greene Lyon Group, Inc. | Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap |
| CN103695653B (en) * | 2014-01-02 | 2016-06-08 | 沈少波 | A kind of method of noble metal on wet underwater welding circuit board |
| CN105543495A (en) * | 2014-11-04 | 2016-05-04 | 杨毓华 | Novel environmentally-friendly gold extraction agent |
| US11566334B2 (en) | 2015-06-24 | 2023-01-31 | Greene Lyon Group, Inc. | Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions |
| US11136681B2 (en) | 2015-06-24 | 2021-10-05 | Greene Lyon Group, Inc. | Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions |
| CN105018725A (en) * | 2015-08-07 | 2015-11-04 | 珠海格力电器股份有限公司 | Gold leaching solution and method for recovering gold |
| CN105420500A (en) * | 2015-11-10 | 2016-03-23 | 森蓝环保(上海)有限公司 | Method for separating and extracting all metal components from waste printed circuit boards through wet metallurgy |
| CN105420500B (en) * | 2015-11-10 | 2017-04-19 | 森蓝环保(上海)有限公司 | Method for separating and extracting all metal components from waste printed circuit boards through wet metallurgy |
| CN105350017A (en) * | 2015-11-30 | 2016-02-24 | 长春黄金研究院 | Method increasing rate of filtration of desorbed and electrolyzed gold mud |
| CN105350017B (en) * | 2015-11-30 | 2017-05-03 | 长春黄金研究院 | Method increasing rate of filtration of desorbed and electrolyzed gold mud |
| CN105400958A (en) * | 2015-12-03 | 2016-03-16 | 福建工程学院 | Method and device for rapidly leaching out gold in waste circuit board |
| CN105400958B (en) * | 2015-12-03 | 2018-02-02 | 福建工程学院 | Golden method and device in a kind of Rapid Leaching waste printed circuit board |
| CN105731382A (en) * | 2016-01-25 | 2016-07-06 | 珠海格力电器股份有限公司 | Method for preparing iodide from regenerated iodine in iodinated gold leaching agent and iodinated gold leaching agent |
| CN105586494A (en) * | 2016-03-21 | 2016-05-18 | 黑龙江科技大学 | Method for recycling gold from iodide gold leaching pregnant solution on basis of recycling of waste solution |
| CN105624422A (en) * | 2016-03-22 | 2016-06-01 | 黑龙江科技大学 | Recovery method for gold in iodized gold leaching noble solution considering recycling of waste liquor |
| CN105648232A (en) * | 2016-04-11 | 2016-06-08 | 许良秋 | Method for refining gold by using I2 and KI |
| CN105838900A (en) * | 2016-04-11 | 2016-08-10 | 许良秋 | Method for refining gold through I2 and NaI |
| CN105648232B (en) * | 2016-04-11 | 2017-09-26 | 许良秋 | One kind uses I2The method that gold refining is carried out with KI |
| CN105821444A (en) * | 2016-05-23 | 2016-08-03 | 深圳市瑞世兴科技有限公司 | Method for recovering tin from circuit board waste |
| CN106086417A (en) * | 2016-06-27 | 2016-11-09 | 南开大学 | A kind of method extracting copper and gold from waste mobile phone circuit board |
| CN106435196B (en) * | 2016-11-30 | 2018-12-18 | 福建工程学院 | A kind of technique of old circuit board Leaching of Gold |
| CN106435196A (en) * | 2016-11-30 | 2017-02-22 | 福建工程学院 | Device and process for leaching out gold from waste circuit boards |
| CN108754554A (en) * | 2018-09-18 | 2018-11-06 | 泉州益丰贵金属科技有限公司 | A kind of gold plating liquid and a kind of gold plating method |
| CN109797407A (en) * | 2019-03-13 | 2019-05-24 | 上海第二工业大学 | A method of selective electrolysis leaches recycling gold, copper from waste and old memory bar |
| CN109797407B (en) * | 2019-03-13 | 2020-11-27 | 上海第二工业大学 | Method for recovering gold and copper by selective electrolytic leaching from waste memory sticks |
| CN110656251A (en) * | 2019-09-24 | 2020-01-07 | 广东工业大学 | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method |
| CN110656251B (en) * | 2019-09-24 | 2021-11-26 | 广东工业大学 | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method |
| CN113046569A (en) * | 2021-03-03 | 2021-06-29 | 南昌航空大学 | Method for selectively recovering gold from waste circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101392325B (en) | 2010-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101392325B (en) | Method for extracting gold from waste printed circuit board | |
| CN101787547B (en) | Method for recovering valuable metals from waste printed circuit board | |
| CN101575715B (en) | Method for extracting valuable metals from electronic waste | |
| CN101775490B (en) | Gold extracting method by thiosulfate using polyamine compoud as additive | |
| CN101230421A (en) | A method of extracting gold from waste circuit boards | |
| CN101812591B (en) | Gold, copper, copper sulfate, copper chloride waste liquid recovery method of waste circuit board | |
| CN103276206B (en) | A kind of efficient and stable alkaline thiourea system is used for the method of leaching gold | |
| CN111041207A (en) | Electrochemical gold leaching agent and method for recovering gold from waste gold-plated circuit board | |
| Liang et al. | Electrolyte circulation: Metal recovery from waste printed circuit boards of mobile phones by alkaline slurry electrolysis | |
| CN101100706A (en) | A method of immersion gold from printed circuit board | |
| AU2014328409A1 (en) | Process for preparing a ferric nitrate reagent from copper raffinate solution | |
| CN104046785A (en) | Method for processing waste copper/iron-based diamond tool bit | |
| CN104775034A (en) | Method for leaching and recycling metals in waste printed circuit boards in steps by using ionic liquid | |
| Ashiq et al. | Electrochemical enhanced metal extraction from E-waste | |
| CN101122034A (en) | Method for extracting high-grade metal zinc powder from zinc-containing material | |
| CN102002597B (en) | Method for comprehensively recovering valuable metals from low-grade tellurium slag | |
| CN104178629B (en) | The method that valuable metal is reclaimed from many metal dusts of waste electronic wiring board | |
| CN105967153A (en) | Technology for recovering tellurium from high-tellurium slag | |
| CN109735710B (en) | Method for electrolyzing silver from silver-plated connector waste | |
| CN102240663A (en) | Method for separating and recycling rare noble metals and waste plastics in waste circuit board | |
| CN115928150A (en) | Method for recovering silver from silver-containing waste | |
| CN104109762A (en) | Environment-friendly nontoxic gold extractant, and preparation method and gold extraction method thereof | |
| Imre-Lucaci et al. | COPPER RECOVERY FROM REAL SAMPLES OF WPCBs BY ANODIC DISSOLUTION. | |
| CN101760629A (en) | Thiosulfate gold extracting method taking triethylene tetramine as additive | |
| CN112921356B (en) | A method of recovering copper from waste printed circuit boards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20121021 |