CN101378649A - Abnormality detection method and device - Google Patents

Abstract

The present invention provides an abnormality detection method and device capable of detecting abnormalities caused by aging of components such as lighting and structural components that affect mounting accuracy in normal production processes without knowing normal values. When identifying the same object (part mark 6B or solder paste 8) of the same object (printed board 6) in multiple devices (mounting devices 10A, 10B, 10C), detect device abnormality based on the difference in recognition results between devices . When there are three or more devices, it is possible to estimate an abnormal device from the error distribution of the recognition result.

Description

Abnormal detection method and device

technical field

The present invention relates to an abnormality detection method and device when the same object of the same object is recognized by a plurality of devices.

Background technique

As shown in FIG. 1 , an electronic component mounting device (also referred to as a mounting machine) 10 has a suction head 12 movable in the XYZ directions, which suctions and arranges electronic components placed in a component supply device 14 such as a tape feeder, and mounts them on the printed substrate 6 or a substrate such as a liquid crystal substrate.

The substrate transport device 16 transports the substrate 6 in the X direction, the X-axis moving mechanism 18 moves the suction head 12 in the X direction, and the Y-axis moving mechanism 20 moves the suction head 12 in the Y direction together with the X-axis moving mechanism 18 .

In the above-mentioned electronic component mounting apparatus 10, when electronic components are mounted on the substrate 6, the substrate positioning marks (also referred to as substrate marks) 6A as illustrated in FIG. The substrate recognition camera 22 on the head 12 performs imaging and recognition to recognize the posture of the substrate 6 . On the other hand, the recognition camera 24 etc. fixed upward to the main body of the mounting device 10 takes an image and recognizes the electronic component sucked on the suction head 12 , thereby recognizing the displacement of the suction position of the sucked electronic component. Then, the electronic components are positioned and mounted on the substrate by using the recognition of the attitude of the substrate 6 and the recognition of the displacement of the suction position of the electronic components. In FIG. 2 , 6B is a component mark for correcting the mounting position of components, etc., and 6C is an electrode pad of an IC or the like.

However, in the case of recognition using a camera as described above, the illuminance of the recognition camera illumination may change due to aging or the like, or the adjustment of mechanical structural parts may malfunction, and the mounting accuracy of parts may deteriorate.

For this purpose, for example, as described in Patent Document 1, a camera is used to image an inspection chip, and a relative positional displacement between the nozzle and the camera is detected to perform data correction.

In addition, as described in Patent Document 2, the positional deviation of the component image acquired by the image reading device from the reference position is detected, and whether it is a qualified product, a warning or a defective product is judged according to the amount of deviation, and notification is made before becoming a defective product. operator.

Patent Document 1: JP-A-2001-223500 Gazette

Patent Document 2: JP-A-2005-228949 Gazette

Contents of the invention

However, in the technical means described in Patent Document 1, not only an inspection chip and a spacer for abnormality detection but also an inspection process different from the production process are required.

In addition, in the technical means described in any one of Patent Documents 1 and 2, abnormality is determined individually for each mounting device. Therefore, if the board mark can be recognized in each mounting device, the result is used as a reference to mount the component. Therefore, in the normal board production process, it is impossible to detect the recognition device caused by the aging of the mounting device or mount the recognition device. Abnormality of the installation device of the device.

The object of the present invention is to solve the above-mentioned problems of the prior art, and to detect an abnormality of the device even if the normal value is not known during the normal substrate production operation.

The present invention is characterized in that, when the same object of the same object is recognized by a plurality of devices, an abnormality of the device is detected based on a difference in recognition results between the devices.

Also, when there are three or more devices, an abnormal device is estimated from the distribution of errors in the recognition results.

The present invention is also characterized by having means for detecting an abnormality of a device based on a difference in recognition results between devices when the same object of the same object is recognized by a plurality of devices.

It also has means for estimating that there is an abnormal device from the distribution of errors in the recognition results when there are three or more devices.

The effect of the invention

According to the present invention, even if normal values are not known in normal production processes, it is possible to detect abnormalities caused by deterioration of parts such as lighting and structural components that affect mounting accuracy. In addition, when an abnormality of the device is detected, production can be stopped to prevent the occurrence of defective products due to poor mounting accuracy. In addition, the history of recognition results can be recorded, and abnormalities of devices in the past can be traced.

In particular, when there are three or more mounting devices, it is possible to estimate a device with a high possibility of abnormality from the distribution of errors in the recognition results.

Description of drawings

FIG. 1 is a perspective view showing the structure of an example of a component mounting device.

FIG. 2 is a plan view showing an example of a substrate.

FIG. 3 is a block diagram showing a system configuration in the embodiment of the present invention.

FIG. 4 is a flowchart showing the processing procedure of the first embodiment of the present invention.

Fig. 5 is a plan view showing a recognition object according to a second embodiment of the present invention.

FIG. 6 is a block diagram showing a system configuration in a modified example of the present invention.

Detailed ways

Embodiments of the present invention will be described in detail below with reference to the drawings.

In the first embodiment of the present invention, the present invention is applied to the recognition of the part mark 6B on the substrate 6 shown in FIG. 2 .

In the present embodiment, in a production line having, for example, three mounting devices 10A, 10B, and 10C shown in FIG. 3 , as shown in the flow of FIG. The printed substrate 6 is sent into the mounting device 10 by the substrate conveying device 16 , and the printed substrate 6 is fixed. Then, board recognition camera 22 mounted on suction head 12 movable relative to printed board 6 recognizes board mark 6A shown in FIG. 2 of printed board 6 to detect the posture of board 6 .

Then, the position of the component mark 6B is calculated from the posture of the substrate 6 detected just now, and the actual position of the component mark 6B is recognized by the component recognition camera 24. This component mark 6B is used for correcting the mounting position of the component, etc. (Fig. Step 100).

At this time, the error between the position where the part mark 6B should have been calculated from the board mark 6A and the position actually recognized and detected by the part recognition camera 24 is stored (step 110 ).

Thereafter, mounting of electronic components is carried out, and normal substrate production is carried out (step 120).

Then, as shown in FIG. 3 , the substrate 6 identical to the substrate identified just now is sent to the second mounting apparatus 10B constituting the production line together with the first mounting apparatus 10A, in the same manner as in the case of the first mounting apparatus 10A. Identify the error between the position where the original part mark 6B should be and the actual part recognition position 6B calculated from the recognition result of the substrate mark 6A by the recognition device (step 130), and store the result (step 140).

The error of the result of identifying the same part mark 6B of the same substrate 6 obtained in this way is compared between the mounting devices by using the communication function between the mounting devices (step 150), and if the error is large, a warning is displayed, or Production is stopped (step 160).

Mounting of electronic components is performed without stopping production (step 170).

Similarly, the position of the component mark 6B is also recognized (step 180), stored (step 190) and compared among mounting devices (step 200) in the third station and thereafter.

When the data of 3 or more sets are acquired, it is possible to infer the mounting device with high possibility of abnormality from the error distribution status, for example, there is a mounting device with particularly large error (step 210). On the other hand, when the error among the three machines is small, it is judged that all three machines are normal (step 220).

In addition, it is possible to trace past device abnormalities by referring to the history of past results.

Next, a second embodiment of the present invention will be described in detail.

In this embodiment, the present invention is applied to identification of solder paste printed on the printed circuit board 6 .

The recognition function of the solder paste is a function that, after the recognition of the substrate mark 6A shown in FIG. 2 , the chip on the printed substrate 6 shown in FIG. The solder paste 8 printed on the mounting position (electrode pad 6C) is detected for a deviation (printing deviation) d between the position where the solder paste 8 should have been printed and calculated from the board mark 6A.

As in the case of the first embodiment shown in FIG. 4 , first, the printed board 6 on which the solder paste 8 is printed is sent to the first apparatus 10A, and the board mark 6A is recognized by the board recognition camera 22 . Based on the recognition result of the board mark 6A, the positional shift at the time of board clamping is calculated. Based on the calculated amount of positional shift during clamping, the position of the solder paste 8 on which the chip is mounted is calculated, and the substrate recognition camera 22 is moved to the recognition coordinates of the solder paste 8 . Thus, the positional deviation d of the solder paste 8 is detected using the identification parameter of the solder paste.

The recognition error of the solder paste 8 is 0 if there are no deviations in solder printing, errors in mark recognition, and errors in structural parts and the like. On the other hand, if a certain value has an error, the sum of its errors is detected. In addition, as long as the same solder paste 8 is identified, substantially the same value should be detected for the amount of printing deviation d in the other mounting devices 10B and 10C. Thereafter, electronic components are mounted, and normal substrate production is carried out.

Then, in the mounting device 10B of the second station, the substrate 6 used in the first station is carried in similarly to the mounting device 10A of the first station, and after the substrate mark 6A is recognized, the solder paste 8 is recognized. Here, communication is performed between mounting devices, and the recognition results of the same solder paste are compared. If the error is large, it is considered that there is some abnormality in the recognition device or the mounting device on which the recognition device is installed, so a message is displayed, or discontinue production.

In the same way, the third and subsequent units recognize the board mark 6A after the board is carried in, and recognize the positional deviation d of the solder paste 8 . Similarly, use the communication function to compare the recognition results with other installed devices. When there are three or more mounting devices, it can be estimated that there is a high possibility of an abnormality occurring in the mounting device whose results are outstanding.

In addition, by referring to the history of past results, it is possible to trace past device abnormalities.

In addition, in the above-mentioned embodiment, as shown in FIG. 3 , communication is directly performed between mounting devices, but as shown in a modified example of FIG. 6 , data may be evaluated via the host computer 30 . The number of installation devices is not limited to 3, but 2 or 4 or more than 4 are also possible.

In addition, in the above-mentioned embodiment, the component mark 6B and the solder paste 8 are recognized, but the application object of the present invention is not limited to this, and in addition, the same recognition that does not cause a recognition error due to the mounting device can also be used. Object that detects anomalies in mounted devices. The detection object is not limited to the installation device, either.

The object of error identification is not limited to the deviation between the detected position and the original position, and may also be the distance between two marks, or the relative relationship between three or more marks.

Claims (4)

1. An anomaly detection method, characterized in that, When the same object of the same object is recognized by a plurality of devices, an abnormality of the device is detected based on a difference in recognition results between the devices. 2. The abnormality detection method according to claim 1, characterized in that, When there are three or more devices, an abnormal device is estimated from the distribution of errors in the recognition results. 3. An abnormality detection device, characterized in that, A means for detecting an abnormality of a device based on a difference in recognition results between the devices when the same object of the same object is recognized by a plurality of devices is provided. 4. The abnormality detection device according to claim 3, wherein: It also has means for estimating that there is an abnormal device from the distribution of errors in the recognition results when there are three or more devices.

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