CN101373341B - Photoresist apparatus for removing edge - Google Patents
Photoresist apparatus for removing edge Download PDFInfo
- Publication number
- CN101373341B CN101373341B CN2007101207305A CN200710120730A CN101373341B CN 101373341 B CN101373341 B CN 101373341B CN 2007101207305 A CN2007101207305 A CN 2007101207305A CN 200710120730 A CN200710120730 A CN 200710120730A CN 101373341 B CN101373341 B CN 101373341B
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- China
- Prior art keywords
- glass substrate
- nozzle needle
- chemical liquid
- main body
- edge bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920002120 photoresistant polymer Polymers 0.000 title description 23
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 239000011521 glass Substances 0.000 claims abstract description 48
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 239000000126 substance Substances 0.000 claims abstract description 30
- 239000007921 spray Substances 0.000 claims abstract description 11
- 239000011324 bead Substances 0.000 claims description 20
- 230000008676 import Effects 0.000 claims description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 239000003814 drug Substances 0.000 abstract 3
- 239000007789 gas Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000005086 pumping Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to an edge-removing optical resist device which comprises a device main body. A racking pipe for pumping residual liquid on the edge of a glass substrate through negative pressure is arranged in the device main body; an upper spray needle and a lower spray needle for spraying chemical liquid medicine at the end part of the glass substrate in a sloping direction from the upper part and the lower part are connected to the device body. By changing an inlet pipe duct and the spray direction of the chemical liquid medicine, and arranging the racking pipe with the negative pressure, the invention avoids gas liquid interference appearing in the use of the prior device, reduces ill probability formation caused by sputtering the chemical liquid medicine on the glass substrate, saves nitrogen at the same time, and reduces manufacture cost.
Description
Technical field
The present invention relates to the removal photoresist device that uses in a kind of display panels production, especially a kind of removal edge bead device.
Background technology
In liquid crystal display (LCD), main Presentation Function device is liquid crystal panel, liquid crystal panel structure is generally formed box by the up and down two-layer substrate, centre is liquid crystal layer, its displaying principle is dielectric anisotropy and the electric anisotropy that utilizes liquid crystal molecule to have, on the two-layer substrate of up and down, be formed with respectively counter electrode, thereby between two substrates, produce electric field, in the middle of during extra electric field, making, the conversion of the ordered state of liquid crystal molecule, produce various photoelectric effect.On one substrate, have a plurality of pixel electrodes of matrix array, the LCD that another substrate has public electrode occupies leading position in market, it is by thin film transistor (TFT) (TFT) as gauge tap, and control is applied to the difference of voltage on pixel electrode and produces different images.
Fig. 2 is the structural representation of thin film transistor (TFT).As shown in Figure 2, at first the manufacturing process of thin film transistor (TFT) is to form metal gate electrode thin film on glass substrate 1, the grid film is formed by sputtering sedimentation by aluminum or aluminum alloy, through photo-mask process (gluing, exposure, development and etching), the grid film is formed to gate electrode 2 and gate line (not sectioning out); Next utilizes chemical vapor deposition successively depositing insulating layer, semiconductor layer and doping semiconductor layer successively on gate electrode 2, semiconductor layer and doping semiconductor layer is carried out to photo-mask process for the second time and form insulation course 3, semiconductor layer 4 and doping semiconductor layer 5; Then on said structure, utilize sputtering technology to form source metal/leakage film (Mo-Al-Mo three-layer metal composition), then by the source metal/drain structure 6 of photo-mask process formation for the third time, thereby the thin film transistor (TFT) (TFT) with three terminals formed.
In the photo-mask process of above-mentioned manufacturing process, photoresist is uniformly coated on whole substrate surface, before entering subsequent processing, the photoresist of substrate edges will be got rid of, otherwise the photoresist at edge drops onto in follow-up unit and can form bad and affect the normal operation of equipment, reduction mobility.Therefore in the manufacturing process of TFT, removing the edge bead device is a visual plant that affects yields.
In traditional removal edge bead technique, after substrate enters and removes the edge bead device, by four moving nozzles, divide four strokes (turning back twice) to its edge's spray chemical liquid, after dissolving, by comb, discharge, reach the effect of removing photoresist.Tradition is removed in the edge bead device, and liquid, from vertical nozzle needle, being sprayed onto on substrate edges, dissolves photoresist.For the photoresist after preventing from dissolving drops onto in equipment, in the outside, be 45 ° to be distributed with the nitrogen nozzle needle simultaneously, last stroke is enabled, and the photoresist after dissolving is blown in comb and drains.Actual production shows, the liquid that this structure can make the nitrogen of 45 a ° of injections and vertical injection in the end stroke sprays simultaneously, and when distortion appearred in certain or part nozzle needle, the gas-liquid angulation was poor, and chemical liquid is splashed on substrate, produces bad.
Summary of the invention
The purpose of this invention is to provide a kind of removal edge bead device, effectively solve existing apparatus and use herb liquid easily to be splashed on substrate to form the technological deficiencies such as bad.
To achieve these goals, the invention provides a kind of removal edge bead device, comprise apparatus main body, in described apparatus main body, be provided with the comb that aspirates the glass substrate edge raffinate by negative pressure, on described apparatus main body, be connected with and from the glass substrate above and below, with vergence direction, to the glass substrate end, spray upper nozzle needle and the lower nozzle needle of chemical liquid.
Described upper nozzle needle is connected with described apparatus main body by upper connector, on described upper connector, is provided with the upper liquid import that imports chemical liquid.
Described lower nozzle needle is connected with described apparatus main body by lower web member, on described lower web member, also is provided with the lower liquid import that imports chemical liquid.
On the technique scheme basis, the angle of described upper nozzle needle and glass substrate is 30 °～60 °, and the angle of described lower nozzle needle and glass substrate is 30 °～60 °.Preferably, the angle of described upper nozzle needle and glass substrate is 45 °, and the angle of described lower nozzle needle and glass substrate is 45 °.
On the technique scheme basis, the end of described upper nozzle needle and the vertical range of glass substrate are 1mm～1.5mm, and the end of described lower nozzle needle and the vertical range of glass substrate are 1mm～1.5mm.Preferably, the end of described upper nozzle needle and the vertical range of glass substrate are 1.25mm, and the end of described lower nozzle needle and the vertical range of glass substrate are 1.25mm.
On the technique scheme basis, the negative pressure in described comb is 300pa～800pa.
The present invention is directed to existing apparatus use in chemical liquid easily be splashed on substrate and form the technological deficiencies such as bad, by changing the comb that pipeline, injection direction and setting have negative pressure that enters of chemical liquid, a kind of removal edge bead device of new structure has been proposed.With the technical scheme of prior art nitrogen blowing, compare, technical solution of the present invention is cancelled the vertical nozzle needle of prior art, no longer nitrogen blowing, therefore avoided the gas-liquid interference that occurs in the existing apparatus use, reduced chemical liquid and be splashed to the bad probability of formation on glass substrate.The present invention is the upper nozzle needle through being obliquely installed and the ejection of lower nozzle needle by chemical liquid, simultaneously negative pressure is set in comb, in time siphons away the photoresist of dissolving, can remove fast photoresist on the one hand, reduce on the other hand the sputter probability of chemical liquid, saved simultaneously nitrogen, reduced production cost.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
The accompanying drawing explanation
Fig. 1 is that the present invention removes edge bead apparatus structure schematic diagram;
Fig. 2 is the structural representation of thin film transistor (TFT).
Description of reference numerals:
The 1-glass substrate; The 2-gate electrode; The 3-insulation course;
The 4-semiconductor layer; The 5-doping semiconductor layer; 6-source/drain structure;
The 7-apparatus main body; 8-comb mouth; The 9-upper connector;
The upper liquid import of 10-; The upper nozzle needle of 11-; Nozzle needle under 13-;
Liquid import under 14-; Web member under 15-; The 16-comb.
Embodiment
Fig. 1 is that the present invention removes edge bead apparatus structure schematic diagram.As shown in Figure 1, remove the edge bead device and comprise apparatus main body 7, in apparatus main body 7, be provided with the comb 16 that produces negative pressure, the top of comb 16 is comb mouth 8, glass substrate 1 horizontal positioned, end is stretched in comb mouth 8, and the raffinate at glass substrate 1 edge is sucked from comb mouth 8, and this raffinate comprises photoresist and the remaining chemical liquid of dissolving.On apparatus main body 7, also be connected with upper connector 9 and lower web member 15, the upper end of upper connector 9 is affixed with the upper liquid import 10 that imports chemical liquid, and lower end is provided with the upper nozzle needle 11 that sprays chemical liquid with the end of α angle glass substrate 1; The lower end of lower web member 15 is affixed with the lower liquid import 14 that imports chemical liquid, and upper end is provided with the lower nozzle needle 13 that sprays chemical liquid with the end of α angle glass substrate 1.Wherein the α angle is upper nozzle needle 11 or lower nozzle needle 13 and the surperficial angle that forms of glass substrate 1.
During work, glass substrate 1 makes it to be positioned at by the carrying arm working position that the present invention removes the edge bead device, the upper nozzle needle 11 that is positioned at glass substrate 1 top sprays chemical liquid to the end of glass substrate 1 respectively with the lower nozzle needle 13 that is positioned at glass substrate 1 bottom, to dissolve the photoresist of glass substrate 1 end, the comb mouth 8 that photoresist after dissolving and remaining chemical liquid are had negative-pressure sucking sucks, and discharge by comb 16, reach the purpose of removing photoresist.After completing, then by the carrying arm, glass substrate is transported to delivering position and waits for and to enter next step station.Due to upper nozzle needle 11 and lower nozzle needle 13, all be arranged to skewedly, with glass substrate 1, form angle α, so chemical liquid also sprays to the end of glass substrate 1 with vergence direction, in the present embodiment, angle α is 30 °～60 °.When angle α was 30 °, the photoresist after the chemical liquid of injection and dissolving can be siphoned away by comb mouth 8 fast, not there will be chemical liquid to be splashed on substrate and forms unfavorable condition; When angle α was 60 °, the chemical liquid of injection had larger surge pressure, can fast the photoresist of glass substrate 1 end be removed, and elimination efficiency is high.Simultaneously, in order to guarantee to remove the effect of glass substrate end photoresist, the vertical range of the end of upper nozzle needle 11 and glass substrate 1 is 1mm～1.5mm, and the vertical range of the end of lower nozzle needle 13 and glass substrate 1 is 1mm～1.5mm.Preferred angle α is 45 °, and the vertical range of nozzle needle end and glass substrate is 1.25mm, and the photoresist that makes to remove fast photoresist and in time siphon away dissolving is realized organic combination, brings into play to greatest extent effect of the present invention.
With the technical scheme of prior art nitrogen blowing, compare, technique scheme of the present invention redesigns apparatus structure, cancel the vertical nozzle needle of prior art, nitrogen blowing no longer, therefore the gas-liquid of having avoided prior art to occur is interfered, and has reduced chemical liquid and has been splashed to the bad probability of formation on glass substrate.The present invention is the upper nozzle needle through being obliquely installed and the ejection of lower nozzle needle by chemical liquid, negative pressure is set simultaneously in comb, in time siphon away the photoresist of dissolving, in actual production, negative pressure in comb is 300pa～800pa, depending on removing the photoresist situation, can prevent that to greatest extent chemical liquid from dropping onto on glass substrate or in equipment by adjusting negative pressure in comb 162.Simultaneously, can adapt to need of production by adjusting jet velocity (flow) and adjusting upper and lower nozzle needle angle.One aspect of the present invention can be removed photoresist fast, when minimizing is bad, saves on the other hand nitrogen, has reduced production cost.
Finally it should be noted that: above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although with reference to preferred embodiment, the present invention is had been described in detail, those of ordinary skill in the art is to be understood that, can modify or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (7)
1. remove the edge bead device for one kind, comprise apparatus main body, it is characterized in that, in described apparatus main body, be provided with the comb that aspirates the glass substrate edge raffinate by negative pressure, on described apparatus main body, be connected with and from the glass substrate above and below, with vergence direction, to the glass substrate end, spray upper nozzle needle and the lower nozzle needle of chemical liquid; The angle of described upper nozzle needle and glass substrate is 30 °～60 °, and the angle of described lower nozzle needle and glass substrate is 30 °～60 °.
2. removal edge bead device according to claim 1, is characterized in that, described upper nozzle needle is connected with described apparatus main body by upper connector, on described upper connector, is provided with the upper liquid import that imports chemical liquid.
3. removal edge bead device according to claim 1, is characterized in that, described lower nozzle needle is connected with described apparatus main body by lower web member, on described lower web member, also is provided with the lower liquid import that imports chemical liquid.
4. removal edge bead device according to claim 1, is characterized in that, the angle of described upper nozzle needle and glass substrate is 45 °, and the angle of described lower nozzle needle and glass substrate is 45 °.
5. the described removal edge bead of arbitrary claim device according to claim 1～3, it is characterized in that, the end of described upper nozzle needle and the vertical range of glass substrate are 1mm～1.5mm, and the end of described lower nozzle needle and the vertical range of glass substrate are 1mm～1.5mm.
6. removal edge bead device according to claim 5, is characterized in that, the end of described upper nozzle needle and the vertical range of glass substrate are 1.25mm, and the end of described lower nozzle needle and the vertical range of glass substrate are 1.25mm.
7. the described removal edge bead of arbitrary claim device according to claim 1～3, is characterized in that, the negative pressure in described comb is 300pa～800pa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101207305A CN101373341B (en) | 2007-08-24 | 2007-08-24 | Photoresist apparatus for removing edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101207305A CN101373341B (en) | 2007-08-24 | 2007-08-24 | Photoresist apparatus for removing edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101373341A CN101373341A (en) | 2009-02-25 |
| CN101373341B true CN101373341B (en) | 2013-11-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101207305A Expired - Fee Related CN101373341B (en) | 2007-08-24 | 2007-08-24 | Photoresist apparatus for removing edge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101373341B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105242503B (en) * | 2015-09-22 | 2019-05-28 | 中国科学院上海技术物理研究所 | A kind of multi-chip side glue minimizing technology |
| CN117950270B (en) * | 2023-12-28 | 2025-02-25 | 上海传芯半导体有限公司 | Device and method for removing edge photoresist |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1501442A (en) * | 2002-11-12 | 2004-06-02 | 阿泰技术有限公社 | Photoresist deposition apparatus and method for forming photoresist film with the same |
| WO2004095550A1 (en) * | 2003-04-21 | 2004-11-04 | Sekisui Chemical Co. Ltd. | Organic matter removing apparatus, organic matter removing method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate |
| CN1794099A (en) * | 2004-12-24 | 2006-06-28 | 精工爱普生株式会社 | Solvent removal apparatus and method |
-
2007
- 2007-08-24 CN CN2007101207305A patent/CN101373341B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1501442A (en) * | 2002-11-12 | 2004-06-02 | 阿泰技术有限公社 | Photoresist deposition apparatus and method for forming photoresist film with the same |
| WO2004095550A1 (en) * | 2003-04-21 | 2004-11-04 | Sekisui Chemical Co. Ltd. | Organic matter removing apparatus, organic matter removing method, ozone water jet nozzle, and organic matter removing apparatus for mask substrate |
| CN1794099A (en) * | 2004-12-24 | 2006-06-28 | 精工爱普生株式会社 | Solvent removal apparatus and method |
Non-Patent Citations (2)
| Title |
|---|
| JP平11-031654A 1999.02.02 |
| JP平9-213616A 1997.08.15 |
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| Publication number | Publication date |
|---|---|
| CN101373341A (en) | 2009-02-25 |
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Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150713 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150713 |
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Effective date of registration: 20150713 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee after: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20201130 Address after: 215200 No. 1700, Wujiang economic and Technological Development Zone, Suzhou, Jiangsu, Zhongshan North Road Patentee after: K-TRONICS (SUZHOU) TECHNOLOGY Co.,Ltd. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee before: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee before: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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Granted publication date: 20131120 |
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