CN101370365A - electronic device - Google Patents

Abstract

The invention relates to an electronic device which comprises a body unit and at least one buffer component. The main body unit is provided with a first sub-shell, a second sub-shell and a host, the first sub-shell and the second sub-shell cover the host, the first sub-shell or the second sub-shell is a metal shell, and the metal shell is provided with a plurality of holes. The buffer component is arranged on at least one part of the metal shell and is provided with a combining part and a buffer part, the combining part is arranged between the buffer part and the metal shell, one part of the combining part penetrates through the holes and is combined with the metal shell, and the combining part and the buffer part are formed by double-material injection molding.

Description

electronic device

technical field

The invention relates to an electronic device, in particular to an electronic device with a buffer material.

Background technique

With the continuous advancement of technology, the types of electronic products are becoming more and more diversified. Among them, portable electronic devices, such as personal digital assistants (Personal Digital Assistant, PDA), mobile phones and notebook computers and other related electronic consumer products, are more deeply involved in people's daily life due to their convenience.

Please refer to FIG. 1 , a known electronic device 1 such as a PDA may include a body unit 11 , and the body unit 11 has a host 111 , an upper case 112 and a lower case 113 . The upper case 112 and the lower case 113 cover and protect the host 111 , wherein the material of the upper case 112 and the lower case 113 is, for example, plastic.

However, it is known that the plastic materials used as the upper case 112 and the lower case 113 are generally not resistant to impact, therefore, when the known electronic device 1 is dropped from a high place, the upper case 112 or the lower case 113 will often be broken. situation. In this way, not only the appearance of the electronic device 1 will be damaged, but also the internal structure or function of the electronic device 1 will be damaged, and even the fragments of the upper casing 112 or the lower casing 113 will cause injury to the user.

In addition, generally, if a thermoplastic elastomer (Thermoplastic Elastomer, TPE) material is added as a buffer component to join with the metal upper shell 112 or lower shell 113, it must be joined by gluing, but it is easy to cause The reliability of the detachment and gluing of the cushioning components is yet to be confirmed.

Contents of the invention

The purpose of the present invention is to overcome the defects existing in the existing electronic devices, and provide a new type of anti-collision and drop-resistant electronic device, which is very suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. An electronic device proposed according to the present invention is characterized in that it includes: a body unit having a first sub-housing, a second sub-housing and a host, the first sub-housing and the second sub-housing The body covers the above-mentioned host, the above-mentioned first sub-housing or the above-mentioned second sub-housing is a metal shell, and the above-mentioned metal shell has a plurality of holes; and at least one buffer component is arranged on at least a part of the above-mentioned metal shell, The above-mentioned buffer assembly has a joint part and a buffer part, the above-mentioned joint part is located between the above-mentioned buffer part and the above-mentioned metal shell, a part of the above-mentioned joint part passes through the above-mentioned holes and joins with the above-mentioned metal shell, wherein the above-mentioned joint part and the above-mentioned metal shell The above-mentioned buffer part is double-material injection molding.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned electronic device, the buffer component is disposed on a part of the metal casing.

The aforementioned electronic device, wherein the bonding portion is thermally bonded to the metal casing.

In the aforementioned electronic device, the material of the metal casing is aluminum-magnesium alloy.

In the aforementioned electronic device, the material of the joint portion is selected from the group consisting of acrylonitrile-butadiene-styrene copolymer and polycarbonate.

In the aforementioned electronic device, the material of the buffer portion is a thermoplastic elastomer.

The aforementioned electronic device, wherein the thermoplastic elastomer is thermoplastic rubber or thermoplastic polyurethane.

The purpose of the present invention and the solution to its technical problem also adopt the following technical solutions to achieve. An electronic device proposed according to the present invention is characterized in that it includes: a body unit having a first sub-housing, a second sub-housing and a host, the first sub-housing and the second sub-housing body covering the above-mentioned host; a display unit having a third sub-housing, a fourth sub-housing and a display panel, the third sub-housing and the fourth sub-housing covering the above-mentioned display panel, the above-mentioned first sub-housing At least one of the sub-housing, the second sub-housing, the third sub-housing or the fourth sub-housing is a metal casing, and the metal casing has a plurality of holes; and at least one buffer assembly, Set on at least a part of the above-mentioned metal shell, the above-mentioned buffer assembly has a joint part and a buffer part, the above-mentioned joint part is located between the above-mentioned buffer part and the above-mentioned metal shell, a part of the above-mentioned joint part passes through the above-mentioned holes and is connected with the above-mentioned The metal shell is joined, wherein the above-mentioned joint part and the above-mentioned buffer part are double-material injection molding.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned electronic device, the buffer component is disposed on a part of the metal casing.

The aforementioned electronic device, wherein the bonding portion is thermally bonded to the metal casing.

In the aforementioned electronic device, the material of the metal casing is aluminum-magnesium alloy.

In the aforementioned electronic device, the material of the joint portion is selected from the group consisting of acrylonitrile-butadiene-styrene copolymer and polycarbonate.

In the aforementioned electronic device, the material of the buffer portion is a thermoplastic elastomer.

The aforementioned electronic device, wherein the thermoplastic elastomer is thermoplastic rubber or thermoplastic polyurethane.

In the aforementioned electronic device, the second sub-housing and the third sub-housing are superimposed on each other.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. As can be seen from above technical scheme, main technical content of the present invention is as follows:

The reason is that, to achieve the above purpose, an electronic device according to the present invention includes a body unit and at least one buffer component. The body unit has a first sub-housing, a second sub-housing and a main body, the first sub-housing and the second sub-housing cover the main body, and the first sub-housing or the second sub-housing is a metal shell Body, the metal shell has many holes. The buffer assembly is arranged on at least a part of the metal shell, the buffer assembly has a joint part and a buffer part, the joint part is located between the buffer part and the metal shell, a part of the joint part passes through the holes and joins with the metal shell, Wherein the joint part and the buffer part are double-material injection molding.

In addition, to achieve the above purpose, an electronic device according to the present invention includes a body unit, a display unit and at least one buffer component. The body unit has a first sub-housing, a second sub-housing and a main machine, and the first sub-housing and the second sub-housing cover the main machine. The display unit has a third sub-housing, a fourth sub-housing and a display panel, the third sub-housing and the fourth sub-housing cover the display panel, the first sub-housing, the second sub-housing, the second sub-housing At least one of the third sub-housing or the fourth sub-housing is a metal casing, and the metal casing has a plurality of holes. The buffer assembly is arranged on at least a part of the metal shell, the buffer assembly has a joint part and a buffer part, the joint part is located between the buffer part and the metal shell, a part of the joint part passes through the holes and joins with the metal shell, Wherein the joint part and the buffer part are double-material injection molding.

With the above technical solution, the electronic device of the present invention has at least the following advantages and beneficial effects:

An electronic device of the present invention is provided with a shock-absorbing and impact-absorbing buffer component on the side and/or corner of the metal case where it is easily impacted by external forces. When the electronic device is impacted or dropped from a high place , the impact force can be absorbed by the buffer component to avoid damage to the electronic device. In addition, the present invention uses impact-resistant plastic material to protect the electronic device, and through the method of double-material injection molding, the metal shell and the plastic material are thermally bonded by the hot-melt column, thereby avoiding the gap between the buffer component and the metal shell. Due to different materials, it is not easy to combine with each other and easy to fall off, so as to ensure the quality of the electronic device.

To sum up, the present invention has the above-mentioned many advantages and practical value, it has great improvement no matter in product structure or function, has significant progress in technology, and has produced easy-to-use and practical effect, and compared with existing Some electronic devices have enhanced outstanding functions, so they are more suitable for practical use, and have wide application value in the industry, which is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

1 is a schematic diagram of a known electronic device;

2 is a schematic diagram of an electronic device according to a first embodiment of the present invention;

3 is a sectional view of the combination of the buffer assembly and the metal shell of the present invention;

4A is a partial schematic diagram of a host unit of an electronic device according to a second embodiment of the present invention;

4B is a partial schematic diagram of a display unit of an electronic device according to a second embodiment of the present invention; and

FIG. 4C is a schematic diagram of an electronic device according to a second embodiment of the present invention.

Detailed ways

In order to further explain the technical means and functions adopted by the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and functions of the electronic device proposed according to the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments. The description is as follows.

An electronic device according to a preferred embodiment of the present invention will be described below with reference to related drawings.

first embodiment

Please refer to FIG. 2 , the electronic device 2 of the present invention is, for example, a personal digital assistant (PDA), which includes a body unit 21 and at least one buffer component 22 .

The main body unit 21 has a main body 211 , a first sub-housing 212 and a second sub-housing 213 , and the first sub-housing 212 and the second sub-housing 213 cover the main body 211 . Wherein, the first sub-housing 212 or the second sub-housing 213 may be a metal casing. In this embodiment, the first sub-housing 212 is a metal casing as an example for illustration. The material of the first sub-housing 212 is, for example, aluminum-magnesium alloy, and has a plurality of holes 214 . Of course, in addition to the host 211 , the first sub-case 212 and the second sub-case 213 can further cover a display panel 215 .

The buffer assembly 22 is disposed on at least a part of the first sub-housing 212 . In this embodiment, the buffer assembly 22 is disposed on two opposite sides S1 of the first sub-housing 212 as an example for illustration. Wherein, the buffer assembly 22 has a joint portion 221 and a buffer portion 222, both of which are double-molded, and the joint portion 221 is used to engage with the first sub-housing 212, so the joint portion 221 is located near the buffer assembly 22 One side of the sub-housing 212 .

In this example, the material of the joint part 221 can preferably be selected from the group consisting of acrylonitrile butadiene styrene copolymer (ABS) and polycarbonate (polycarbonate, PC). The material of the portion 222 is a thermoplastic elastomer, such as thermoplastic rubber (Thermoplastic Rubber, TPR) or thermoplastic polyurethane (Thermoplastic Polyurethane, TPU).

In addition, it should be noted that in order to clarify the details of this embodiment, the coupling portion 221 and the buffer portion 222 are shown separately in FIG. 2 , but the buffer assembly 22 should be an integrated component.

Next, please refer to FIG. 2 and FIG. 3 at the same time. FIG. 3 is a schematic cross-sectional view showing the combination of the buffer assembly 22 and the first sub-housing 212 . The joint part 221 has a plurality of protrusions 223, and the protrusions 223 pass through the holes 214 on the first sub-housing 212, and the part of the protrusions 223 passing through the first sub-housing 212 is melted by means of thermal melting, so that it The surface is larger than the hole 214 , so that the buffer assembly 22 can be engaged with the first sub-housing 212 to be fixed.

Therefore, with the buffer component 22 disposed on the side S1 of the electronic device 2 , when the electronic device 2 is impacted or dropped from a height, the impact force can be absorbed by the buffer component 22 to prevent the electronic device 2 from being damaged.

second embodiment

Please also refer to FIG. 4A, FIG. 4B and FIG. 4C. The difference between the electronic device 3 of the second embodiment of the present invention and the first embodiment is that the electronic device 3 of this embodiment is, for example, a portable computer (Notebook, NB ).

The electronic device 3 includes a body unit 31 , a display unit 32 and a buffer component 33 . A host 311 of the main body unit 31 (as shown in FIG. 4A ) is interposed between the first sub-housing 312 and the second sub-housing 313 , and a display panel 321 of the display unit 32 ( FIG. 4B ) is interposed between the first sub-housing 312 and the second sub-housing 313 . Between the third sub-housing 322 and the fourth sub-housing 323 , the display unit 32 and the main body unit 31 are connected to each other by a pivot T.

When the electronic device 3 is closed, the second sub-case 313 and the third sub-case 322 can overlap each other. Wherein, at least one of the first sub-housing 312, the second sub-housing 313, the third sub-housing 322 and the fourth sub-housing 323 is a metal housing. In this embodiment, the first sub-housing The body 312 and the fourth sub-housing 323 are metal casings as an example for illustration. And the buffer components 33 , 34 and 35 are respectively disposed on at least one side S2 and/or a corner K of the first sub-housing 312 and the fourth sub-housing 323 .

In this embodiment, the material of the buffer components 33, 34 and 35 can be the same material as that of the buffer component 22 in the first embodiment, and the buffer components 33, 34 and 35 and the first sub-housing 312 and the fourth sub-housing The bonding method of the body 323 is also the same thermal fusion bonding method as that of the buffer assembly 22 and the first sub-housing 212 in the first embodiment, which will not be repeated here. Wherein, the buffer assembly 33 has a joint portion 331 and a buffer portion 332 , the buffer assembly 34 has a joint portion 341 and a buffer portion 342 , and the buffer assembly 35 has a joint portion 351 and a buffer portion 352 .

Please refer to FIG. 4A first to illustrate the combination of the first sub-housing 312 of the body unit 31 and the buffer assembly 33 . In this embodiment, a plurality of cushioning components 33 are respectively disposed on two opposite sides S2 of the first sub-housing 312 , and cover the corners K of the four corners at the same time. These places are vulnerable to external forces when the body unit 31 is dropped or hit. The presence of the buffer assembly 33 can reduce the impact of external forces on the host 311 .

In addition, the first sub-housing 312 further has a plurality of first through holes 3121 , and the joint portion 331 and the buffer portion 332 of the buffer component 33 also have a plurality of second through holes 333 formed corresponding to the first through holes 3121 . In this way, the first sub-housing 312 and the buffer assembly 33 can pass through the second through hole 333 and the first through hole 3121 through a plurality of screws (not shown) to connect the first sub-housing 312 and a part of the main body 311 (e.g. optical drive) screw in.

Next, please refer to FIG. 4B to illustrate the combination of the fourth sub-housing 323 and the buffer components 34 and 35 in the display unit 32 of this embodiment. The buffer assemblies 34 and 35 are disposed on at least a part of the fourth sub-housing 323. In this embodiment, the two buffer assemblies 34 are respectively disposed on the two opposite sides S2 and the corners of the four corners of the fourth sub-housing 323. K, and another buffer assembly 35 is disposed on the front side S3 of the fourth sub-housing 323 . These places are the parts that are easily damaged by external force when the display unit 32 is dropped or impacted, so setting the buffer components 34 and 35 can reduce the impact of external force on the display panel 321 .

It should be noted that the buffer component 35 disposed on the front side S3 of the fourth sub-housing 323, the buffer part 352 only covers the two ends of the joint part 351, so as to prevent the joint part 351 from covering the middle with the antenna component. The part C further affects the receiving effect of the entire electronic device 3 (as shown in FIG. 4C ). Finally, please refer to FIG. 4C , which shows the first sub-housing 312, the second sub-housing 313, the third sub-housing 322, the fourth sub-housing 323 and the buffer assembly 33 of the electronic device 3 of this embodiment. , 34 and 35 are combined to complete the schematic diagram.

Furthermore, the electronic devices 2 and 3 are not limited to PDAs or notebook computers. Different electronic devices can also use the cushioning components of the same material as the present invention according to the same anti-collision and drop resistance requirements. Of course, the shape of the cushioning components can be changed by itself.

To sum up, an electronic device of the present invention can be equipped with shock-absorbing and impact-absorbing buffer components on the side and/or corner of the metal case, when the electronic device is hit or dropped from a height , the impact force can be absorbed by the buffer component to avoid damage to the electronic device. In addition, the present invention uses impact-resistant plastic material to protect the electronic device, and through the method of double-material injection molding, the metal shell and the plastic material are thermally bonded, so as to avoid the difficulty between the buffer component and the metal shell due to different materials. The situation that it is easy to fall off when combined with each other occurs.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes. Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solution of the present invention.

Claims (15)

1. an electronic installation is characterized in that, comprises:

One body unit, have one first sub-housing, one second sub-housing and a main frame, the above-mentioned first sub-housing and the above-mentioned second sub-housing coat above-mentioned main frame, and the above-mentioned first sub-housing or the above-mentioned second sub-housing are a metal shell, and above-mentioned metal shell has most holes; And

At least one Buffer Unit, be arranged at least a portion of above-mentioned metal shell, above-mentioned Buffer Unit has a joint portion and a buffer part, above-mentioned binding site is between above-mentioned buffer part and above-mentioned metal shell, the part of above-mentioned joint portion is passed above-mentioned these holes and is engaged with above-mentioned metal shell, and wherein above-mentioned joint portion and above-mentioned buffer part are double-material jet formation.

2. electronic installation according to claim 1 is characterized in that wherein above-mentioned Buffer Unit is arranged at the part of above-mentioned metal shell.

3. electronic installation according to claim 1 is characterized in that, wherein above-mentioned joint portion and above-mentioned metal-back body heat fuse closes.

4. electronic installation according to claim 1 is characterized in that, wherein the material of above-mentioned metal shell is an almag.

5. electronic installation according to claim 1 is characterized in that wherein the material of above-mentioned joint portion is selected from the group that acrylonitrile-butadiene-styrene copolymer and Merlon constitute.

6. electronic installation according to claim 1 is characterized in that, wherein the material of above-mentioned buffer part is thermoplastics type's elastomer.

7. electronic installation according to claim 6 is characterized in that, wherein above-mentioned thermoplastics type's elastomer is thermoplastics type's rubber or thermoplastics type's polyurethane.

8. an electronic installation is characterized in that, comprises:

One body unit has one first sub-housing, one second sub-housing and a main frame, and the above-mentioned first sub-housing and the above-mentioned second sub-housing coat above-mentioned main frame;

One display unit, have one the 3rd sub-housing, one the 4th sub-housing and a display floater, the above-mentioned the 3rd sub-housing and the above-mentioned the 4th sub-housing coat above-mentioned display floater, one of them is a metal shell at least for the above-mentioned first sub-housing, the above-mentioned second sub-housing, the above-mentioned the 3rd sub-housing or the above-mentioned the 4th sub-housing, and above-mentioned metal shell has most holes; And

At least one Buffer Unit, be arranged at least a portion of above-mentioned metal shell, above-mentioned Buffer Unit has a joint portion and a buffer part, above-mentioned binding site is between above-mentioned buffer part and above-mentioned metal shell, the part of above-mentioned joint portion is passed above-mentioned these holes and is engaged with above-mentioned metal shell, and wherein above-mentioned joint portion and above-mentioned buffer part are double-material jet formation.

9. electronic installation according to claim 8 is characterized in that wherein above-mentioned Buffer Unit is arranged at the part of above-mentioned metal shell.

10. electronic installation according to claim 8 is characterized in that, wherein above-mentioned joint portion and above-mentioned metal-back body heat fuse closes.

11. electronic installation according to claim 8 is characterized in that, wherein the material of above-mentioned metal shell is an almag.

12. electronic installation according to claim 8 is characterized in that, wherein the material of above-mentioned joint portion is selected from the group that acrylonitrile-butadiene-styrene copolymer and Merlon constitute.

13. electronic installation according to claim 8 is characterized in that, wherein the material of above-mentioned buffer part is thermoplastics type's elastomer.

14. electronic installation according to claim 13 is characterized in that, wherein above-mentioned thermoplastics type's elastomer is thermoplastics type's rubber or thermoplastics type's polyurethane.

15. electronic installation according to claim 8 is characterized in that, wherein when above-mentioned electronic installation was closed, the above-mentioned second sub-housing and the above-mentioned the 3rd sub-housing were superimposed with each other.

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