CN101359139B - Liquid crystal display panel and manufacturing method thereof - Google Patents

Abstract

The present invention provides an FFS type liquid crystal display panel in which an upper electrode and a lower electrode are arranged on a flat film to improve the reliability of a mounting terminal portion. It is characterized in that the mounting terminal portion (33A) includes: a gate insulating film (14) and a passivation film (17) covering the surface of the mounting terminal wiring (34); a contact hole (36a) penetrating through the gate insulating film (14). Film (14) and passivation film (17); The 1st transparent conductive film (38), is electrically connected with wiring (34) with installation terminal; Insulation film (23), it is on the 1st transparent conductive film (38) The opening (36b) whose diameter is smaller than the contact hole (36a) is formed in the central part of the center; the installation terminal is composed of a second transparent conductive film (41) electrically connected to the first transparent conductive film (38); the first transparent conductive film (38) and the second transparent conductive film (41) are made of the same material as the lower electrode and the upper electrode of the FFS type liquid crystal display panel, and the insulating film (23) is made of the same material as the insulating film disposed between the lower electrode and the upper electrode .

Description

Liquid crystal display panel and manufacturing method thereof

technology area

The invention relates to a liquid crystal display panel and a manufacturing method thereof. In this liquid crystal display panel, problems such as increase in circuit impedance due to disconnection or corrosion will not occur when various components are mounted on the mounting terminal portion, and pixel electrodes (pixel electrodes) and common electrodes ( common electrode) FFS (Fringe Field Switching) type liquid crystal display panel.

Background technique

Most liquid crystal display panels use a pair of transparent substrates with electrodes formed on the surface and a liquid crystal layer sandwiched by the pair of substrates. By applying voltage to the electrodes on the two substrates, the liquid crystals are rearranged, and then Vertical field mode to display various information. TN (Twisted Nematic) type is more common among such longitudinal electric field liquid crystal display panels. However, due to the problem of narrow viewing angles, various improved vertical electric field liquid crystal display panels such as VA (Vertical Alignment) type and MVA (Multi-domain Vertical Alignment) type have been developed.

On the other hand, unlike the above-mentioned longitudinal electric field liquid crystal display panel, there is also an IPS (In- Plane Switching) type or FFS type liquid crystal display panel.

Among them, the IPS liquid crystal display panel arranges a pair of electrodes on the same layer, controls the direction of the electric field applied to the liquid crystal to be roughly parallel to the substrate, and rearranges the liquid crystal molecules in the direction parallel to the substrate. Therefore, the IPS liquid crystal display panel has the advantage of a very wide viewing angle compared with the above-mentioned longitudinal electric field liquid crystal display panel. However, in an IPS liquid crystal display panel, a pair of electrodes are provided on the same layer to apply an electric field to the liquid crystal, so the liquid crystal molecules on the upper side of the pixel electrodes cannot be sufficiently driven, resulting in a decrease in light transmittance and the like.

In order to solve such problems of the IPS type liquid crystal display panel, an FFS type liquid crystal display panel has been developed (see Patent Documents 1 and 2 below). In this FFS type liquid crystal display panel, the pixel electrode and the common electrode for applying an electric field to the liquid crystal are respectively arranged in different layers with an insulating film interposed therebetween. Compared with the IPS type liquid crystal display panel, the FFS type liquid crystal display panel is characterized in that it has a wider viewing angle and a higher contrast ratio, and can be driven at a low voltage while having high light transmittance, so that a bright display effect can be realized. Moreover, since the FFS-type liquid crystal display panel has a larger overlapping area between the pixel electrode and the common electrode when viewed from the top than the IPS-type liquid crystal display panel, a larger storage capacity will be generated accordingly, and there is no need to separately set up an auxiliary capacity line. The advantages.

Here, referring to FIG. 8 , the configuration of the mounting terminal portion formed at the edge portion of the conventional liquid crystal display panel will be described.

8(A) is a cross-sectional view showing a mounting terminal portion of a lower wiring (lower wiring) of an example of a conventional product, and FIG. Sectional view.

The fabrication of the mounting terminal portion is performed simultaneously with the fabrication of scanning lines or signal lines on an array substrate of a liquid crystal display panel. Therefore, the mounting terminal part includes, as shown in FIG. Two types of high-level wiring 54 are formed simultaneously with the signal lines on the gate insulating film 53 covering the surface of the transparent substrate 51 . The upper wiring 54 and the surface of the gate insulating film 53 are covered with a passivation film (also referred to as a protective insulating film) 55 .

And, as shown in FIG. 8(A), the mounting terminal 56 for the low-level wiring 52 is formed through the contact hole 57 penetrating the passivation film 55 and the gate insulating film 53 at the same time. made of conductive material. Similarly, as shown in FIG. 8(B), mounting terminals 58 for high-level wiring 54 are formed of a transparent conductive material simultaneously with the formation of pixel electrodes through contact holes 59 formed through passivation film 55 . Therefore, the lower wiring 52 and the upper wiring 54 are once exposed to an etching environment when the contact holes 57 and 59 are formed using the photolithography method. The mounting terminals 56 for the lower wiring 52 and the mounting terminals 58 for the upper wiring 54 formed in this way are respectively provided at positions higher than the lower wiring 52 and the upper wiring 54, and are higher than the lower wiring 52 and the upper wiring. The wires 54 are wider to allow for good electrical contact between the various connection components connected to these mounting terminals 56 and 58 .

Patent Document 1 Japanese Patent Application Laid-Open No. 2001-235763

Patent Document 2 Japanese Patent Laid-Open No. 2002-182230

However, in the conventional FFS liquid crystal display panel, a step is formed on the surface of the pixel electrode where switching elements such as TFTs (thin film transistors) and common lines overlap. The orientation of the molecules is disturbed. Therefore, in the conventional FFS type liquid crystal display panel, the above-mentioned level difference is actually an area that does not contribute to the display, so the black matrix in the color filter substrate is shielded from light, resulting in a decrease in the aperture ratio corresponding to the level difference. .

In order to eliminate this level difference, it is conceivable to use the planar film used in the above-mentioned VA type or MVA type liquid crystal display panel, and arrange the pixel electrode and the common electrode on the planar film. However, if such a structure is adopted for the FFS type liquid crystal display panel, the pixel electrode and the common electrode are arranged on different layers via an insulating film on the flat film, so when forming the mounting terminal part on the edge part, there is a problem in the low-level wiring. Or the insulating film formed on the surface of the high-level wiring will have an extra layer. At this time, the process of forming a contact hole for exposing a lower wiring or an upper wiring of a mounting part at the same time as forming a contact hole of a pixel part by photolithography is as follows. That is, openings are formed on the gate insulating film (nitride film) and protective film (nitride film) laminated on the contact hole formation position of the mounting terminal portion, and the After the common electrodes are formed on some of the planar films, an insulating film is laminated on all the surfaces, and an opening is formed again at the contact hole formation position of the mounting terminal part to penetrate to the potential wiring. Also, at the same time as the pixel electrode is formed on the pixel portion, an electrode of the same material as the common electrode is formed at the contact hole of the mounting terminal portion. However, when this method is applied, the lower wiring or the upper wiring is exposed to the etching environment twice.

Since the low-level wiring and the high-level wiring are made of aluminum, aluminum alloy and other metals that have good conductivity and are easy to corrode, if they are exposed to the etching environment of the insulating film twice, the damage will increase. Problems such as increased wiring resistance due to disconnection or corrosion may occur.

Therefore, the following process is adopted: when opening the contact hole of the pixel electrode, no opening is provided on the gate insulating film (nitride film) and the protective film (nitride film) at the position where the contact hole of the mounting terminal portion is arranged, After the insulating film between the pixel electrode and the common electrode is formed, the entire contact hole of the mounting terminal portion is etched, so that each electrode wiring is not exposed to the etching environment. However, this process has the following problems: Since the gate insulating film, the protective film, and the insulating film are different in film quality, the etching rate is different, and the insulating film becomes an inverted tapered shape, resulting in a step difference between the nitride films. When the contact portion is covered with the upper electrode, a step disconnection occurs, thereby becoming a non-contact state.

Contents of the invention

The present invention has been made to solve at least a part of the problems described above, and it can be implemented in the following forms or application examples.

[Application example 1] The liquid crystal display panel of this application example is a liquid crystal display panel having an array substrate with mounting terminal portions formed on the edge of the display area, and is characterized in that the display area includes: a plurality of scanning lines and signal Lines, which are respectively formed in a matrix; a lower electrode and an upper electrode having a plurality of slits, which are formed on a planar film, and are disposed facing each other by the scanning line and the scanning line through an insulating film. The area surrounded by the signal line is formed of a transparent conductive material, and the mounting terminal part includes: a first insulating film covering the surface of the mounting terminal wiring; a contact hole formed to penetrate the mounting terminal The first insulating film on the wiring; the first conductive film covering at least a part of the bottom of the contact hole and electrically connected to the mounting terminal wiring; the second insulating film disposed on The surface of the first insulating film has an opening at least partially overlapping the contact hole in a plan view; the second conductive film covers the surface of the second insulating film around the contact hole, and the The first conductive film and the second conductive film are electrically connected at the opening.

According to the above structure, the display area includes: a plurality of scanning lines and signal lines each formed in a matrix; a lower electrode and an upper electrode having a plurality of grooves formed on the planar film and facing each other via the insulating film. The ground is arranged in each area surrounded by the scanning lines and the signal lines, and is respectively made of a transparent conductive material. With the above configuration, the liquid crystal display panel can be driven as an FFS type liquid crystal display panel.

Moreover, in the liquid crystal display panel, since the lower electrode made of a transparent conductive material and the upper electrode having a plurality of grooves are formed on the flat film, which are arranged in opposite directions through the insulating film, the lower electrode and the upper electrode There is no step difference caused by switching elements and general-purpose wiring. Therefore, through the liquid crystal display panel, the interval between the substrate on the other side and the upper electrode, that is, the cell gap (Cell gap) is equal, and, because in the display area, the area that needs to be shielded by the black matrix is reduced, Therefore, the aperture ratio becomes larger. Therefore, a bright display can be realized by the liquid crystal display panel, and an FFS type liquid crystal display panel with excellent display quality can be obtained. In the FFS type liquid crystal display panel, any one of the upper electrode and the lower electrode can function as a pixel electrode or a common electrode. That is, among the upper electrode and the lower electrode, the one connected to the switching element becomes the pixel electrode, and the one connected to the common wiring becomes the common electrode.

In addition, in the liquid crystal display panel, the surface of the mounting terminal wiring in the mounting terminal portion is covered with the first conductive film. Therefore, when the opening is formed in the vicinity of the center of the second insulating film by photolithography, the surface of the wiring for mounting terminals is not exposed, so that the wiring for mounting terminals is less damaged. Therefore, with this liquid crystal display panel, when a predetermined component is mounted on the mounting terminal portion, there will be no problems such as an increase in wiring resistance due to disconnection or corrosion, and the FFS type with high reliability of the mounting portion can be obtained. LCD panel.

[Application example 2] In the liquid crystal display panel of the above application example, it is preferable that the second insulating film covers the inner peripheral surface and the edge surface of the contact hole, and has a An opening whose diameter is smaller than that of the contact hole.

According to this configuration, the second insulating film is formed up to the inner periphery of the contact hole. Therefore, even if the second insulating film is rapidly etched in the etching environment and is eroded to the wall of the contact hole, since the surface area covered by the second insulating film is relatively large, it will not be eroded to become the mounting terminal portion. The mounting portion contacts the edge portion of the hole so that the height of the mounting portion can be maintained. Thereby, height unevenness hardly occurs in each mounting terminal portion, and it is possible to suppress occurrence of a non-contact portion.

[Application Example 3] In the liquid crystal display panel of the above application example, it is preferable that the second insulating film is formed on an edge portion of the contact hole.

According to this structure, the second insulating film is not formed to the bottom of the contact hole, but is provided on the edge of the contact hole, so the contact area between the first conductive film and the second conductive film becomes wider. . Thereby, each mounting terminal part becomes low resistance, and a stable voltage can be supplied.

[Application Example 4] In the liquid crystal display panel of the above application example, it is preferable that the first conductive film is electrically connected to wiring for mounting terminals, and is formed to cover the bottom of the contact hole.

According to this structure, since the first conductive film is formed to cover the bottom of the contact hole (bottom: the surface of the mounting terminal wiring), it is possible to prevent the mounting terminal wiring from being exposed to an etching environment. Therefore, the wiring for mounting terminals can be protected more effectively.

[Application Example 5] In the liquid crystal display panel of the above application example, the first conductive film is preferably a part that is electrically connected to the wiring for actual mounting terminals and formed on the surface of the wiring for mounting terminals area.

According to this structure, since the first conductive film is electrically connected to the wiring for mounting terminals, it is formed on a partial region of the surface of the wiring for mounting terminals. Even if the surface is damaged to a certain extent, it can also protect the wiring for mounting terminals.

[Application Example 6] In the liquid crystal display panel of the above application example, the first conductive film and the second conductive film are preferably made of the same material as the lower electrode and the upper electrode respectively, and the first conductive film 2. The insulating film is made of the same material as the insulating film arranged between the lower electrode and the upper electrode.

According to this configuration, since the mounting terminal portion can be formed simultaneously with the display region, the display region and the mounting terminal portion can be formed without increasing the number of steps. Here, "the same material" means that, for example, when one has a multilayer structure, the other also has the same multilayer structure, in addition to the case where each is formed of the same material.

In addition, transparent conductive materials such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) can be used as the lower electrode and upper electrode. At this time, the lower electrode and the upper electrode may have the same composition or different compositions. In addition, as the planar film, any transparent organic insulating film having at least a flat surface can be used, for example, transparent resins such as acrylic resins and polyimide resins can be used. In addition, inorganic insulating films such as silicon oxide and silicon nitride can be used as various insulating films.

[Application example 7] In the liquid crystal display panel of the above application example, it is preferable that the wiring for mounting terminals is formed of the same metal material as that of the scanning lines in the display area, and the first insulating film Preferably, it is formed of a multilayer film, and the multilayer film is made of the same material as the gate insulating film covering the scanning line in the display area and the passivation film covering the signal line.

According to this structure, the scanning lines in the display area are generally formed directly on the transparent substrate as low-level wiring, so the surface of the wiring for mounting terminals formed simultaneously with the scanning lines is covered with both the gate insulating film and the passivation film, so , both of the gate insulating film and the passivation film become the first insulating film. According to the liquid crystal display panel of this aspect, even if the wiring for mounting terminals is a low-level wiring formed directly on the substrate, it is possible to obtain a liquid crystal display panel having the effects of the invention described above. However, although in the above-mentioned structure, both the gate insulating film and the passivation film are used as the first insulating film, the insulating film formed on the wiring for mounting terminals does not matter whether it is one layer or two layers. on the first insulating film.

[Application example 8] In the liquid crystal display panel of the above application example, the wiring for mounting terminals is preferably formed of the same metal material as the signal line in the display area, and the first insulating film is preferably , formed of a film of the same material as the passivation film covering the signal line in the display area.

According to this structure, the signal line in the display area is usually formed on the surface of the gate insulating film as a high-level line, so the surface of the wiring for mounting terminals formed at the same time as the signal line is covered with the passivation film. The chemical film becomes the first insulating film. According to the liquid crystal display panel of the above aspect, even when the wiring for mounting terminals is a high-level wiring on the surface of the gate insulating film, a liquid crystal display panel having the above-mentioned effects of the invention can be obtained.

[Application Example 9] In the liquid crystal display panel of the above application example, a reflection plate may be partially formed between the planar film and the lower electrode in the display region.

According to the liquid crystal display panel of this form, the portion formed as a reflection plate between the flat film and the lower electrode functions as a reflection portion, and the rest functions as a light transmission portion, so an FFS-type semi-transparent portion can be obtained. Light type liquid crystal display panel.

[Application Example 10] The liquid crystal display panel manufacturing method in this application example is a method of manufacturing a liquid crystal display panel having a display area and a mounting terminal portion, the display area includes: a plurality of scanning lines and signal lines, which are respectively Formed in a matrix; the display area, including a lower electrode and an upper electrode with a plurality of slits, is formed on a planar film, and is arranged opposite to each other by the scanning line and the signal through an insulating film. The areas surrounded by lines are respectively made of transparent conductive material; and the actual mounting terminal part is formed around the display area. The manufacturing method of this liquid crystal display panel is characterized in that the mounting terminal portion is manufactured through the following steps (1) to (7). (1) A step of forming wiring for mounting terminals having a predetermined pattern made of the same material as the scanning line or the signal line at the mounting terminal forming position on the surface of the substrate; (2) covering the mounting terminal with a first insulating film. A step of mounting terminal wiring; (3) a step of forming a contact hole penetrating through the first insulating film on the terminal mounting wiring; (4) covering at least a part of the bottom of the contact hole , and the process of forming a first conductive film of the same material as that of the lower electrode in such a way that it can be electrically connected with the wiring for the mounting terminal; (5) forming and disposing on the surface of the first insulating film The process of forming a second insulating film having the same composition as the insulating film between the lower electrode and the upper electrode in the display region; (6) on the second insulating film, forming an insulating layer at least partially in contact with the contact hole in plan view; A step of overlapping openings; (7) a step of forming a mounting terminal electrically connected to the first conductive film at the opening by covering the surface of the second insulating film around the contact hole The second conductive film made of the same material as the upper electrode is used.

According to the method of manufacturing a liquid crystal display panel of this aspect, it is possible to manufacture a liquid crystal display panel that can easily achieve the effects of the invention described above.

Description of drawings

1 is a schematic plan view of one pixel of the array substrate when the color filter substrate of the FFS type liquid crystal display panel of the first embodiment is seen through.

Fig. 2 is a sectional view along line II-II in Fig. 1 .

3 is a schematic cross-sectional view of a terminal portion of a lower wiring of a liquid crystal display panel in Embodiment 1. FIG.

4 is a schematic cross-sectional view of a terminal portion of a high-level wiring of a liquid crystal display panel according to Embodiment 1. FIG.

5 is a schematic plan view of one pixel of the array substrate when the color filter substrate of the FFS type translucent liquid crystal display panel of the second embodiment is seen through.

FIG. 6 is a sectional view along line VI-VI in FIG. 5 .

Fig. 7 is a schematic cross-sectional view of a modified example of a terminal portion.

FIG. 8(A) is a schematic cross-sectional view of a low-position wiring mounting terminal portion in the prior art, and FIG. 8(B) is a schematic cross-sectional view of a high-position wiring mounting terminal portion in the prior art.

【Symbol Description】

10A, 10B: Liquid crystal display panel 11: Transparent substrate

12: Scanning line 13: Universal wiring 14: Gate insulating film

15: Semiconductor layer 16: Signal line 17: Passivation film

18: Flat film 19: Reflective plate 20: Reflective part

21, 24: Contact hole 22: Bottom electrode 23: Insulation film

25: slot 26: upper electrode 27: second transparent substrate

28: Black matrix 29: Color filter layer 30: Protective layer

31: LCD 33A: Mounting terminal part for low wiring

33B: Installation terminal part for high-level wiring 34, 35: Wiring for installation terminal

36a, 37a: Contact hole 36b, 37b: Opening

38, 39: The first transparent conductive film 41, 42: The second transparent conductive film

Detailed ways

Hereinafter, the most preferred embodiment of the present invention will be described by taking various embodiments as examples with reference to the drawings. In the embodiments shown below, an FFS type liquid crystal display panel is illustrated as a liquid crystal display panel embodying the technical idea of the present invention, but it does not mean that the present invention is only specific to this FFS type liquid crystal display panel. It also applies to all other embodiments included in the protection scope of the claims.

1 is a schematic plan view of one pixel of the array substrate when the color filter substrate of the FFS type liquid crystal display panel 10A of the first embodiment is seen through. Fig. 2 is a sectional view along line II-II in Fig. 1 . 3 is a schematic cross-sectional view of a terminal portion of a lower wiring of a liquid crystal display panel in Embodiment 1. FIG. 4 is a schematic cross-sectional view of a terminal portion of a high-level wiring of a liquid crystal display panel according to Embodiment 1. FIG. 5 is a schematic plan view of one pixel of the array substrate when the color filter substrate of the FFS type translucent liquid crystal display panel of the second embodiment is seen through. FIG. 6 is a sectional view along line VI-VI in FIG. 5 .

Example 1

As the FFS type liquid crystal display panel of Example 1, taking the FFS type liquid crystal display panel 10A having a planar film as an example, it will be described in the order of its manufacturing process using FIGS. 1 to 4 . When manufacturing the array substrate AR of the liquid crystal display panel 10A, first, a conductive layer made of, for example, aluminum or an aluminum alloy is formed on the entire surface of the transparent substrate 11 such as a glass substrate. Thereafter, a plurality of scanning lines 12 and a plurality of common wirings 13 are formed parallel to each other on the display area by using a known photolithography method and etching method. (Refer to FIG. 3 ), wiring 34 for mounting terminals constituted by gate lines is formed. The gate line is not necessarily used as a wiring for the scanning line 12, but is called a "gate line" because it is made of the same material as the scanning line 12. An appropriate wiring is used. In addition, although the example in which the common wiring 13 is formed along the scanning line 12 of the pixel is exemplified here, it may be formed along the scanning line 12 side of the adjacent pixel, or may be formed on two sides. Between scan lines 12.

Next, the entire surface is covered with a gate insulating film 14 made of a silicon nitride layer or a silicon oxide layer. Thereafter, the entire surface of the gate insulating film 14 is covered with, for example, an amorphous silicon (hereinafter referred to as “a-Si”) layer by a CVD (Chemical Vapor Deposition) method. Thereafter, similarly, a semiconductor layer 15 made of an a-Si layer is formed on the TFT formation region by the photolithography method and the etching method. The region of the scanning line 12 where the semiconductor layer 15 is formed forms the gate G of the TFT.

Next, a conductive layer made of, for example, aluminum or an aluminum alloy is formed on the surfaces of the gate insulating film 14 and the semiconductor layer 15 . Then, on the conductive layer, a signal line 16 including a source S is formed to cross the scanning line 12 in the display region by a photolithography method and an etching method, and a drain electrode D is formed on the TFT formation region, and, On the mounting terminal portion 33B (see FIG. 4 ) for high-level wiring, the wiring 35 for mounting terminal constituted by a source line is formed. The source line is the same as the gate line, and is not necessarily used as the wiring of the signal line 16, but is called a "source line" because it is made of the same material as the signal line 16, although it is omitted. not shown, but it can be used as various appropriate wiring.

Thereafter, the entire surface of the transparent substrate 11 obtained in the above steps is covered with the passivation film 17 . As the passivation film 17, a film made of silicon nitride or silicon oxide can be used, but a silicon nitride layer is preferable from the viewpoint of insulation. Among them, the gate insulating film 14 and the passivation film 17 present on the surface of the mounting terminal wiring 34 of the lower wiring mounting terminal portion 33A correspond to the first insulating film of the invention. Similarly, the passivation film 17 present on the surface of the mounting terminal wiring 35 of the high-level wiring mounting terminal portion 33B also corresponds to the first insulating film.

Next, on the gate insulating film 14 and the passivation film 17 on the surface of the general wiring 13 and the wiring 34 for the mounting terminal of the actual mounting terminal portion 33A for lower wiring by the photolithography method and the etching method, respectively, Contact holes 21 and 36a are formed. At the same time, a contact hole 37 a is formed in the passivation film 17 on the mounting terminal wiring 35 of the high-level wiring mounting terminal portion 33B. The contact holes 21, 36a, and 37a can be formed by plasma etching, which is one of dry etching methods, or wet etching using buffered hydrofluoric acid. Thereby, the surfaces of the common wiring 13 and the wirings 34 and 35 for mounting terminals are exposed. On the passivation film 17 on the drain D at this time, no contact hole has been formed yet. In addition, on the surface of the passivation film 17 in the display region, except for the portion where the contact hole 21 and the portion where the contact hole is planned to be formed on the drain D, a layer made of, for example, acrylic resin or polyimide is laminated by the photolithography method. A planar film (also called an interlayer film) 18 made of resin.

Next, the entire surface of the transparent substrate 11 on which the planar film 18 is formed is covered with a transparent conductive layer made of, for example, ITO or IZO. Thereafter, the lower electrode 22 is formed on the surface of the planar film 18 for each pixel by the photolithography method and the etching method, and the passivation film 17 covering the surface of the mounting terminal wiring 34, 35 and its surroundings is formed. form, the first transparent conductive films 38 and 39 are formed respectively. At this time, the lower electrode 22 of each pixel is electrically connected to the common wiring 13 through the contact hole 21 .

Next, an insulating film 23 made of a silicon nitride layer or a silicon oxide layer is formed on the entire surface of the transparent substrate 11 on which the lower electrode 22 and the first transparent conductive films 38 and 39 are formed. At this time, the surface of the passivation film 17 and the surfaces of the first transparent conductive films 38 and 39 on the drain D where the contact hole is to be formed are also covered with the insulating film 23 . Next, by photolithography and etching, the contact hole 24 is formed on the passivation film 17 and the insulating film 23 on the part where the contact hole is planned to be formed on the drain D; The membrane 23 forms openings 36b and 37b, respectively. The contact hole 24 and the openings 36b and 37b can be formed by plasma etching, which is one of dry etching methods, or wet etching using buffered hydrofluoric acid. In addition, in FIG. 1 , although the insulating film 23 should appear on the entire surface except for the portion of the upper electrode 26 described in detail below, its illustration is omitted in order to make the liquid crystal display panel 10A easier to understand.

Therefore, although the drain electrode D is exposed to the etching environment for the first time here, since the first transparent conductive films 38 and 39 exist on the surfaces of the mounting terminal wirings 34 and 35, when the openings 36b and 37b are formed, the mounting terminal wirings 34 and 35 are formed. Lines 34 and 35 are not directly exposed to the etching environment. Therefore, when the openings 36b and 37b are formed, the mounting terminal wirings 34 and 35 are not damaged or corroded again.

Furthermore, the diameters of the openings 36b and 37b are smaller than the diameter of the contact hole 36a formed on the gate insulating film 14 and the passivation film 17 formed on the wiring 34 for mounting terminals and the diameter of the passivation hole 36a formed on the wiring 35 for mounting terminals. The diameter of the contact hole 37a on the chemical film 17. Therefore, the insulating film 23 on the first transparent conductive films 38 and 39 partially covers the first transparent conductive films 38 and 39 on the edge sides of the openings 36b and 37b. By adopting this structure, the insulating film 23 is formed to the inner periphery of the contact holes 36a, 37a, so even if, for example, the insulating film 23 is subjected to intense etching in an etching environment and is eroded to the walls of the contact holes 36a, 37a, due to the insulating Since the film 23 covers a large surface area, the height of the mounting portion can be maintained without being corroded to the edges of the contact holes 36a, 37a which are the mounting portions of the mounting terminal portions 33A, 33B. Therefore, a difference in height is less likely to occur in each of the mounting terminal portions 33A, 33B, and it is possible to suppress the occurrence of a non-contact portion. In this insulating film 23 , portions formed on the surfaces of the first transparent conductive films 38 and 39 present on the mounting terminal wirings 34 and 35 correspond to the second insulating film.

Furthermore, the entire surface of the transparent substrate 11 on which the insulating film 23 is formed is covered with a transparent conductive layer made of, for example, ITO or IZO. Thereafter, by photolithography and etching, while forming the upper electrode 26 in which a plurality of grooves 25 are formed on the surface of the insulating film 23 for each pixel, the edges of the first transparent conductive films 38 and 39 are covered. In the form of the insulating film 23 on the surface and its periphery, second transparent conductive films 41 and 42 are formed, respectively. The second transparent conductive films 41 and 42 are in contact with the surfaces of the first transparent conductive films 38 and 39 respectively through the openings 36b and 37b formed in the insulating film 23, and each corresponds to a mounting terminal. Thereafter, an alignment film (not shown) is provided on the entire surface including the upper electrode 26 of the display portion, thereby completing the array substrate AR of the liquid crystal display panel 10A of the first embodiment.

In this embodiment, although the following electrodes are used as common electrodes, and the upper electrode is a pixel electrode structure, it is also possible to use, for example, the following electrodes as pixel electrodes connected to the drain D, and the above electrodes as common electrodes and arranged in pixels or display The common wiring 13 on the peripheral part of the area is electrically connected to the structure.

In addition, as for the conductive material disposed on the mounting terminal portion outside the display area, the first transparent conductive films 38 and 39 and the second transparent conductive films 41 and 42 may be formed not only of transparent electrodes such as ITO or IZO, but also of transparent electrodes such as ITO or IZO. For example, conductive light-shielding films such as aluminum, molybdenum, titanium, and chromium are formed.

For the color filter substrate CF, as shown in FIG. 2, on the surface of the second transparent substrate 27, a black matrix 28 is formed to cover the scanning lines 12, the signal lines 16 and the positions corresponding to the TFTs of the array substrate AR. . Also, on the surface of the second transparent substrate 27 surrounded by the black matrix 28, a color filter layer 29 of a predetermined color is formed, and in addition, a color filter layer 29 is formed to cover the black matrix 28 and the surface of the color filter layer 29. protective layer 30 . Furthermore, an alignment film (not shown) is formed on the surface of the protective layer 30 to complete the color filter substrate CF.

In addition, the upper electrode 26 of the array substrate AR and the color filter layer 29 of the color filter substrate CF face each other, so that the array substrate AR and the color filter substrate CF face each other, and by enclosing the liquid crystal 31 Meanwhile, the FFS type liquid crystal display panel 10A of Example 1 was thus obtained.

According to the liquid crystal display panel 10A of Example 1 manufactured in this way, the mounting terminal portions 33A and 33B formed on the edge of the display area can be manufactured at the same time as the display portion, and the actual mounting terminal wiring 34 and 35 are exposed to the etching environment only once when contact holes or openings are formed on the various insulating layers formed on their surfaces. Therefore, according to the liquid crystal display panel 10A of the first embodiment, since the mounting terminal wirings 34 and 35 are less likely to be damaged by the etching environment, various When the components are connected, the occurrence of problems such as increased wiring resistance due to disconnection or corrosion is reduced, and the FFS type liquid crystal display panel 10A with improved reliability of mounting terminal portions 33A and 33B can be obtained.

Example 2

As the liquid crystal display panel 10A of the first embodiment, a fully transmissive FFS liquid crystal display panel is exemplified, but a semi-transmissive FFS liquid crystal display panel may also be used. Here, as a second embodiment, the configuration of a translucent FFS liquid crystal display panel 10B will be described with reference to FIGS. 5 and 6 . In addition, in the liquid crystal display panel 10B of the second embodiment, the same reference numerals are used for the same components as those of the liquid crystal display panel 10A of the first embodiment, and detailed description thereof will be omitted.

The semi-transmissive FFS liquid crystal display panel 10B of Embodiment 2 is different in structure from the fully transparent FFS liquid crystal display panel 10A of Embodiment 1 in that unevenness is formed on a part of the surface of the plane film 18. (Illustration omitted), a reflection plate 19 made of a light-reflective metal is formed on the surface of the planar film 18 formed with unevenness. The reflection plate 19 is disposed between the surface of the planar film 18 and the lower electrode 22 . Therefore, in the liquid crystal display panel 10B of the second embodiment, among the portions where the respective upper electrodes 26 are formed, the portion where the reflective plate 19 is formed forms the reflective portion 20 , and the remaining portion forms the light-transmitting portion. In addition, as the light reflective metal, aluminum, aluminum alloy, or silver, which is widely used as a material for forming a reflector of a translucent liquid crystal display panel, can be appropriately selected.

In the liquid crystal display panel 10B of the second embodiment, after the planar film 18 is formed, a light-reflective metal film is formed on the entire surface, and thereafter, the reflection plate 19 is formed by the photolithography method and the etching method. Then, through the photolithography method and etching method, the reflective plate 19 part of each pixel is reserved at first, and the light reflective metal film of the remaining part is removed. Then, by further etching, contact holes are formed on the gate insulating film 14 and the passivation film 17 on the surface of the common wiring 13 and the wiring 34 for the mounting terminal of the low-level wiring mounting terminal portion 33A. 21 and 36a, at the same time, a contact hole 37a is formed on the passivation film 17 on the mounting terminal wiring 35 of the high-level wiring mounting terminal portion 33B. Subsequent manufacturing steps are the same as those of the liquid crystal display panel 10A of the first embodiment.

Furthermore, the structure of the mounting terminal portions 33A and 33B formed on the edge of the display area in the liquid crystal display panel 10B of the second embodiment is the same as the corresponding structure of the liquid crystal display panel 10A of the first embodiment. Therefore, also with the liquid crystal display panel 10B of the second embodiment, a translucent FFS liquid crystal display panel having the same effect as the liquid crystal display panel 10A of the first embodiment can be obtained.

Next, a modified example of the first embodiment, that is, the mounting terminal portions 33C to 33E in FIG. 7 will be described. Here, the same reference numerals are used for the same components as those of the liquid crystal display panel 10A of the first embodiment, and detailed description thereof will be omitted. In addition, although the following modified examples are described based on the low-level wiring, the same applies to the high-level wiring.

(Change example 1)

The configuration of the mounting terminal portion 33C in FIG. 7 is such that the insulating film 23 is not formed to the bottom of the contact hole 36a, but is provided on both ends of the first transparent conductive film 38 (edges of the contact hole 36a), and the first transparent The contact area between the conductive film 38 and the second transparent conductive film 41 is larger than that of the first embodiment. Therefore, the resistance of each mounting terminal portion can be reduced, and a stable voltage can be supplied.

(Modification 2)

The mounting terminal portion 33D in FIG. 7 is formed such that the first transparent conductive film 38 covers at least the bottom of the contact hole 36 a electrically connected to the mounting terminal wiring 34 . In detail, the first transparent conductive film 38 covers the bottom of the contact hole 36a (bottom: the upper part of the wiring 34 for mounting terminals), so that the contact between the first transparent conductive film 38 and the wiring 34 for mounting terminals can be exposed from above. The insulating film 23 is formed in the form of a portion, and the second transparent conductive film 41 is provided on the outermost surface. This is a structure in which at least the surface of the wiring 34 for mounting terminals is covered with the first transparent conductive film 38 , thereby preventing the wiring 34 for mounting terminals from being exposed to an etching environment. Therefore, the wiring 34 for mounting terminals can be protected more effectively.

(Modification 3)

The configuration of the mounting terminal portion 33E in FIG. 7 is such that the first transparent conductive film 38 is formed on a partial area (for example, the central portion excluding both ends) of the contact hole 36a bottom (bottom portion), and covers the mounting terminal wiring. On the upper portion of the line 34, the insulating film 23 is formed on the edge portion of the contact hole 36a, and the second transparent conductive film 41 is provided to cover them. In this structure, in order to prevent the mounting terminal wiring 34 from being exposed to the etching environment, for example, both ends of the mounting terminal wiring 34 are slightly exposed, and only the surface of the central part is covered with the first transparent conductive film 38. Overlay structure. When this structure is used, in the formation region, even if the exposed surface is damaged to some extent by the etching environment, the wiring 34 for mounting terminals can be protected.

Claims (10)

1. a display panels has, and the edge part in the viewing area is formed with the array base palte of mounting terminal portion, it is characterized in that,

Described viewing area comprises: a plurality of sweep traces and signal wire, and it forms rectangular respectively; Bottom electrode and top electrode with a plurality of grooves, it is formed on the planar film, is configured in each by described sweep trace and described signal wire institute area surrounded mutually across dielectric film with facing, and is made of transparent conductive material respectively;

And described mounting terminal portion comprises:

The 1st dielectric film, it covers the surface of mounting terminal with distribution;

Contact hole, it is formed and runs through described mounting terminal with described the 1st dielectric film on the distribution;

The 1st conducting film, it covers the part of described contact hole bottom at least, and covers described the 1st dielectric film surface around the described contact hole, and electrically connects with distribution with described mounting terminal;

The 2nd dielectric film, it is set at described the 1st dielectric film surface, and has at least and the local overlapping opening of described contact hole;

The 2nd conducting film, it covers described the 2nd dielectric film surface around the described contact hole;

And described the 1st conducting film and described the 2nd conducting film form at described opening part and electrically connect.

2. display panels as claimed in claim 1 is characterized in that, described the 2nd dielectric film covers the inner peripheral surface and the edge part surface of described contact hole, and has the opening of its diameter less than described contact hole diameter near described contact hole central portion.

3. display panels as claimed in claim 1 is characterized in that described the 2nd dielectric film is formed on the edge part of described contact hole.

4. display panels as claimed in claim 1 is characterized in that, described the 1st conducting film is electrically connected at described mounting terminal distribution, and covers the bottom of described contact hole.

5. display panels as claimed in claim 1 is characterized in that, described the 1st conducting film is electrically connected at described mounting terminal distribution, and is formed on the subregion of described mounting terminal with the distribution surface.

6. display panels as claimed in claim 1, it is characterized in that, described the 1st conducting film and described the 2nd conducting film respectively with described bottom electrode and the described very identical material that powers on, and described the 2nd dielectric film is identical material with the described dielectric film that is disposed between described bottom electrode and the described top electrode.

7. display panels as claimed in claim 1, it is characterized in that, described mounting terminal forms with the metal material of the identical material of described sweep trace of described viewing area with the distribution employing, described the 1st dielectric film is to be formed by multicoat membrane, and the gate insulating film on this multicoat membrane and the described sweep trace that covers described viewing area and the passivating film that covers on the described signal wire are identical material.

8. display panels as claimed in claim 1, it is characterized in that, described mounting terminal adopts with the metal material of the identical material of described signal wire of described viewing area with distribution and forms, described the 1st dielectric film adopt with the described signal wire that covers described viewing area on the film formation of the identical material of passivating film.

9. as any described display panels of claim 1 to 4, it is characterized in that between the described planar film and described bottom electrode of described viewing area, the part is formed with reflecting plate.

10. the manufacture method of a display panels, it is the manufacture method that has the viewing area and be formed at the display panels of described viewing area mounting terminal portion on every side, described viewing area comprises: a plurality of sweep traces and signal wire, and it forms rectangular respectively; Bottom electrode and top electrode with a plurality of grooves, it is formed on the planar film, and practising physiognomy across dielectric film is configured in each over the ground by described sweep trace and described signal wire institute area surrounded, and is made of transparent conductive material respectively;

The manufacture method of described display panels is characterised in that, described mounting terminal portion makes by the operation of following (1)～(7):

(1) forms on the position in the mounting terminal of substrate surface, form with described sweep trace or the identical material of described signal wire, have the operation of the mounting terminal usefulness distribution of compulsory figure;

(2) cover the operation of described mounting terminal with the 1st dielectric film with distribution;

(3) formation runs through the operation of described mounting terminal with the contact hole of described the 1st dielectric film on the distribution;

(4) with the part that covers described contact hole bottom at least and with described mounting terminal with the electrical ways of connecting of distribution, form operation with the 1st conducting film of the identical material of described bottom electrode;

(5), form and be disposed at the operation of the 2nd dielectric film of the described bottom electrode of described viewing area and the dielectric film same composition between the described top electrode on the surface of described the 1st dielectric film;

(6) on described the 2nd dielectric film, form at least operation with the local overlapping opening of described contact hole;

(7) form the operation of mounting terminal, this mounting terminal by cover around the described contact hole described the 2nd dielectric film surface and in described opening part and the electric connection of described the 1st conducting film, constitute with the 2nd conducting film of the identical material of described top electrode.

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