CN101346044A

CN101346044A - Method for forming circuit by printing means

Info

Publication number: CN101346044A
Application number: CNA2007101306601A
Authority: CN
Inventors: 何建汉; 何彦鋕
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-07-13
Filing date: 2007-07-13
Publication date: 2009-01-14
Anticipated expiration: 2027-07-13
Also published as: CN101346044B

Abstract

The invention discloses a circuit forming method by printing means, which mainly forms a circuit by adhering metal powder by an adhesive and solidifying the metal powder without etching a copper foil. Specifically, the invention provides a patterned screen plate (with a penetrating pattern corresponding to a predetermined circuit), transfers an adhesive to a substrate by using the patterned screen plate, forms a patterned adhesive layer on the substrate, places metal powder on the adhesive layer to adhere the metal powder on the adhesive layer, and finally solidifies the metal powder to form the circuit.

Description

Adopt the circuit formation method of printing means

Technical field

The present invention relates to a kind of circuit formation method, relate in particular to a kind of circuit formation method that adopts printing means.

Background technology

Printed circuit board (PCB) is according to circuit design, and the electric wiring of connecting circuit part is depicted as wiring figure, and then according to modes such as the machining of designing institute appointment, surface treatments, makes electric conductor reappear the circuit board that is constituted on insulator.In the way in the prior art, earlier copper foil layer is being sticked on the insulated baseboard on the printed circuit board (PCB), utilizing again, forming predetermined pattern (for example circuit, registration holes, mark etc.) as development etching supervisor.

But, along with environmental protection etc. require strict day by day, the sewage that can bring the chemical etching of high pollution, means such as the sewage disposal of must arranging in pairs or groups to handle in processing procedure to be produced, thus caused extra cost burden.

In addition, adopt the chemical etching processing procedure, pH-value, temperature and the etching period of also necessary strict control etching solution could be produced required scheduled circuit accurately.But, along with the requirement on fine rule road is more and more higher, be difficult to the accurately chemical etching of control if continue to adopt, will be difficult to satisfy the demand on fine rule road.Simultaneously, also because chemical etching is difficult to accurate control, make when the etching scheduled circuit, be easy to cause a little deviation (for example aspect is in uneven thickness), and along with the number of plies is more and more, whole deviation is with increasing, and this has caused the effect that does not have accurate contraposition, for example registration holes.

For problems such as the thin more difficulties more of contaminated solution, circuit, existing manufacturer wishes to utilize the conducting resinl that can print, be coated with to make circuit.Thereby, need not to use etching, and do not have pollution problems.But conducting resinl is the colloid of doping metals grain in colloid, but not is made of conductive materials, makes that its conductivity is difficult to improve all the time, can only be used for electrically connecting circuit, electronic building brick etc. mostly.

Summary of the invention

Main purpose of the present invention is to provide a kind of circuit formation method that adopts printing means, and it mainly utilizes sticker sticky metals powder, and the curing metal powder, and then forms circuit.

The circuit formation method of employing printing means of the present invention, it does not adopt etching to form circuit, adopts sticker sticky metals powder and solidifies this metal dust but change.

Specifically, the method for the invention comprises: a patterning web plate is provided, and this patterning web plate has with respect to one of this circuit of institute desire definition and passes through pattern;

One base material is provided;

Utilize described patterning web plate that one sticker is transferred on the described base material, and on this base material, form with respect to a described adhesion coating that has been patterned that passes through pattern;

Discharge a metal dust at this adhesion coating, make this metal dust be adhered on this adhesion coating; And solidify this metal dust that adheres on this adhesion coating, and form this circuit.

Wherein, when discharging this metal dust, can adopt spraying or cover this metal dust at described adhesion coating.

And, when solidifying the described metal dust adhere on the described adhesion coating, can adopt heating, this metal dust pressurizes.Heating, when pressurizeing this metal dust, the temperature that is applied is unlikely to make described base material to have tackability, firmly drops on outside or on every side the described metal dust of described adhesion coating to avoid the adhesion of this base material.The temperature that this applied can be 130 ℃ to 160 ℃.

In addition, after solidifying this metal dust, remove and drop on outside or this unnecessary metal dust on every side of this adhesion coating.

Main effect of the present invention is by a kind of circuit formation method that adopts printing means is provided, it mainly utilizes sticker sticky metals powder, and curing metal powder, and then formation circuit, need not to use etching thereby reach, thereby do not have the beneficial effect of pollution, and the coating convenience as conducting resinl is provided, but be better than the conductive effect of conducting resinl.At last, effectively and accurately produce required scheduled circuit.

Description of drawings

Figure 1A～1D is the schematic diagram that adopts the circuit formation method of printing means in the embodiment of the invention.

Wherein, description of reference numerals is as follows:

10 patterning web plates

12 pass through pattern

14 base materials

16 adhesion coatings

18 circuits

Embodiment

See also Figure 1A～1D, Figure 1A～1D adopts the schematic diagram of the circuit formation method of printing means for the present invention.Shown in Figure 1A～1D, the present invention does not mainly adopt the etching Copper Foil to form circuit, but adopts the adhesion coating 16 sticky metals powder shown in Fig. 1 D, and solidifies this metal dust and form circuit 18, so that the coating convenience as conducting resinl to be provided, but be better than the conductive effect of conducting resinl.

In simple terms, the present invention provides earlier patterning web plate 10 (have with respect to scheduled circuit pass through pattern 12), base material 14 shown in Figure 1A, and shown in Figure 1B, utilize patterning web plate 10 that sticker is transferred on the base material 14, and on base material 14, form the adhesion coating 16 that has been patterned, shown in Fig. 1 C.Then, at adhesion coating 16 dispensing metal dusts, make metal dust be adhered on the adhesion coating 16, final curing adheres to the metal dust on the adhesion coating 16, and forms circuit, shown in Fig. 1 D.Below, with more specifically at the making of patterning web plate 10, dispensing metal dust, solidify described metal dust and do further explanation.

When pattern-making web plate 10, can adopt modes such as punching press at complete insulation or metallic plate, according to the circuit 18 of institute's desire definition, on this web plate, produce the relative pattern 12 that passes through.

Then, utilize described patterning web plate 10 that sticker is applied on the base material 14, and form the adhesion coating 16 shown in Fig. 1 C.At adhesion coating 16 dispensing metal dusts the time, can adopt spraying or cover metal dust.In this process, perhaps have a little metal dust and drop on outside the adhesion coating 16, handle but these parts can see through the removing means, so when spraying or cover metal dust to adhesion coating 16, do not need pinpoint accuracy, as long as abundant sticky metals powder on the adhesion coating 16.

Metal dust is adhered to after the adhesion coating 16, owing to have a little spacing between the metal dust, or the metal dust ground still inadequately evenly (being concavo-concave convexo-convex) that distributes, can further solidify the metal dust that adheres on the adhesion coating 16.In the curing means here, can adopt heating (temperature that applies can be 130 ℃ to 160 ℃), pressurized metal powder, and make the powder that spacing is originally arranged form the circuit 18 of bulk or strip, shown in Fig. 1 D.

What need pay special attention to is, can be in processing procedure softening a little and have an adherence for fear of base material 14, and adhesion unexpectedly firmly drops on adhesion coating 16 outside or metal dusts on every side, so in heating, when pressurizeing this metal dust, the temperature that it applied should be unlikely to make base material 14 to have tackability, with the metal dust of avoiding adhering and should not sticking.At last, after the curing metal powder,, also to remove these metal dusts on every side if outside or when unnecessary metal dust is arranged at adhesion coating 16.

In sum, problems such as the thin more difficulty more of circuit because do not use etch process fully, so there is not relevant pollution problem, can not take place because of the etching Copper Foil in the circuit formation method of printing means that the present invention adopts yet.With respect to conducting resinl, the final circuit 18 that forms of the present invention also has preferable conductivity, but but possesses the coating of conducting resinl.

The above only is to be used for explaining preferred embodiment of the present invention; the present invention is not done any pro forma restriction; therefore, all under identical invention spirit, made about any modification of the present invention or improvement, all must be included in the protection range of the present invention.

Claims

1. A circuit forming method using printing means, characterized in that the circuit forming method comprises:

providing a patterned screen having a traversing pattern relative to the line to be defined;

providing a substrate;

using the patterned screen to transfer an adhesive onto the substrate to form an adhesive layer patterned relative to the passing pattern on the substrate;

applying a metal powder against the adhesive layer such that the metal powder is adhered to the adhesive layer; and

The metal powder adhered to the adhesive layer is solidified to form the circuit.

2. The circuit forming method using printing means as claimed in claim 1, wherein when the metal powder is applied to the adhesive layer, the metal powder can be sprayed or covered.

3. The circuit forming method using printing means according to claim 1, wherein the metal powder adhered to the adhesive layer is cured by heating and pressurizing the metal powder.

4. The circuit forming method using printing means according to claim 3, characterized in that when the metal powder is heated and pressed, the temperature applied will not make the base material have adhesive ability, so as to avoid the base material The material adheres to the metal powder that falls outside or around the adhesive layer.

5. The circuit forming method using printing means as claimed in claim 3, characterized in that when heating and pressing the metal powder, the applied temperature can be 130°C to 160°C.

6. The circuit forming method using printing means as claimed in claim 1, wherein after the metal powder is solidified, the excess metal powder falling outside or around the adhesive layer is removed.