CN101336147A - Electroplated abrasive tool and method and mold - Google Patents
Electroplated abrasive tool and method and mold Download PDFInfo
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- CN101336147A CN101336147A CNA2006800521572A CN200680052157A CN101336147A CN 101336147 A CN101336147 A CN 101336147A CN A2006800521572 A CNA2006800521572 A CN A2006800521572A CN 200680052157 A CN200680052157 A CN 200680052157A CN 101336147 A CN101336147 A CN 101336147A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
技术领域 technical field
本发明是关于一种电镀研磨工具以及制造电镀研磨工具的方法与模具。因此,本发明涉及电化学、材料科学以及物理领域。The invention relates to an electroplating grinding tool, a method and a mold for manufacturing the electroplating grinding tool. Accordingly, the present invention relates to the fields of electrochemistry, materials science and physics.
背景技术 Background technique
研磨工具具有多种应用,包含材料的切割、钻孔、锯、研磨、精研(Lapping)以及抛光。其中一种常见的研磨工具形式是使用在一工具基材上的研磨颗粒来进行切割、研磨以及抛光等作业。Abrasive tools have a variety of applications, including cutting, drilling, sawing, grinding, lapping, and polishing of materials. One common form of abrasive tool is to use abrasive particles on a tool substrate for cutting, grinding and polishing operations.
超级研磨粒子,如钻石、聚晶钻石(Polycrystalline Diamond,PCD)、立方氮化硼(CBN)以及聚晶立方氮化硼(PCBN),由于具有极高的硬度、原子密度以及高热传传导性,因此被广泛使用于许多去除材料的应用上。举例而言,整修碟(Dressing Disk)、研磨碟、锯刀、线锯以及钻头均具有超级研磨颗粒附着于基材上。Super abrasive particles, such as diamond, polycrystalline diamond (Polycrystalline Diamond, PCD), cubic boron nitride (CBN) and polycrystalline cubic boron nitride (PCBN), due to their extremely high hardness, atomic density and high thermal conductivity, It is therefore widely used in many material removal applications. For example, dressing disks, grinding discs, saw blades, wire saws, and drills all have super abrasive particles attached to the substrate.
尽管超级研磨工具具有显著的优点,许多问题持续束缚许多现有超级研磨工具的效能与使用寿命。举例而言,超级研磨粒子的布置与固定仍然有着疑难。另一额外的问题是超级研磨粒子自基材上延伸的高度。在许多应用上,令一工具基材上的所有粒子延伸至大致上相同的均匀高度是有益的。在许多例子中,均匀粒子高度可有助于均匀分布粒子上的工作负载,且因而增进粒子的保留程度。在其它例子中,令粒子根据一预设的垂直图形而在工具上具有不同的高度是有益处的。Despite the significant advantages of superabrasive tools, a number of problems continue to limit the performance and useful life of many existing superabrasive tools. For example, the placement and fixation of superabrasive particles remains problematic. An additional issue is the height to which the superabrasive particles extend from the substrate. In many applications, it is beneficial to have all the particles on a tool substrate extend to approximately the same uniform height. In many instances, a uniform particle height can help to evenly distribute the workload on the particles and thus improve particle retention. In other instances, it may be beneficial to have particles having different heights on the tool according to a predetermined vertical pattern.
已有许多用于组装超级研磨工具的方法,例如硬焊、热压、渗透以及电镀等等。然而这些方法中的大多数无法制造出具有上述超级研磨粒子布置特性的工具。此外,通过已知方法制造的工具需要后组装制程以便获得一具有适当特性(例如适当的粒子外露程度)的工作表面。There are many methods for assembling superabrasive tools, such as brazing, hot pressing, infiltration, and electroplating, to name a few. However, most of these methods fail to produce tools with the above-described superabrasive particle placement characteristics. Furthermore, tools manufactured by known methods require post-assembly processes in order to obtain a working surface with suitable characteristics, such as suitable particle exposure.
因此,本领域持续寻求允许精确对研磨粒子进行水平与垂直布置并能达到仅需少许或无需后组装制程的适当工作表面的电镀研磨工具及方法和模具。Accordingly, the art continues to seek electroplated abrasive tools and methods and molds that allow precise horizontal and vertical placement of abrasive particles and achieve proper working surfaces with little or no post-assembly processing.
发明内容 Contents of the invention
因此,本发明提供电镀研磨工具,其具有多个同时根据水平与垂直图形而配置的粒子,且仅需少许或是无须后制程,本发明并且提供该电镀研磨工具的制造与使用方法。此外,本发明亦提供用于制造程序中一部分的装置。Accordingly, the present invention provides an electroplated abrasive tool having a plurality of particles arranged according to both horizontal and vertical patterns with little or no post-processing, and provides methods of making and using the electroplated abrasive tool. In addition, the present invention also provides a device used in a part of the manufacturing process.
在一方面,本发明提供一种定位与固定研磨粒子的模具,其在于一电解步骤中,以电解方式附加在一导电基板上。该模具可包含绝原材料或是由绝缘材料制造,该绝缘材料具有一模面(Molding Surface),该模面在一材料的电解沉淀物将研磨粒子附加到导电基板上时,可固定住研磨粒子。In one aspect, the present invention provides a mold for positioning and fixing abrasive particles, which is electrolytically attached to a conductive substrate during an electrolysis step. The mold may comprise or be fabricated from an insulating material having a molding surface that holds the abrasive particles as electrolytic deposits of a material attach the abrasive particles to the conductive substrate .
在另一方面,是提供一种电镀研磨工具的制造方法,该电镀研磨工具包含有多个通过电沉积材料而耦合到一基材上的研磨粒子。该方法可包含步骤:1)暂时性地将该多个研磨粒子固定到一模具的模面上,例如在此所说的模具;2)将该模具定位到一电沉积室,且模具的模面是面向一该多个研磨粒子所欲以电解方式附加的基材;3)通过一电沉积材料,以电解方式将该多个研磨粒子附加到该基材上;以及4)去除该模具。In another aspect, a method of making an electroplated abrasive tool comprising a plurality of abrasive particles coupled to a substrate by electrodepositing material is provided. The method may comprise the steps of: 1) temporarily affixing the plurality of abrasive particles to a mold face of a mold, such as the mold described herein; 2) positioning the mold in an electrodeposition chamber, and The face is facing a substrate to which the plurality of abrasive particles are to be electrolytically attached; 3) electrolytically attaching the plurality of abrasive particles to the substrate by an electrodeposition material; and 4) removing the mold.
在又另一方面,本发明包含研磨工具,在某方面,研磨工具可以在此所述的方法制造。此种工具一般包含一基板,该基板包含有多个研磨粒子,该多个研磨粒子通过一电沉积材料耦合到该基板上。该复数研磨粒子可具有依据一预设垂直图形而配置的尖端。In yet another aspect, the invention encompasses abrasive tools, which in certain aspects can be manufactured by the methods described herein. Such tools typically include a substrate containing a plurality of abrasive particles coupled to the substrate by an electrodeposited material. The plurality of abrasive particles can have tips arranged according to a predetermined vertical pattern.
上述本发明特征与优点在下列的详细说明与相关的图式之中会有进一步阐述。The aforementioned features and advantages of the present invention will be further elaborated in the following detailed description and related drawings.
附图说明 Description of drawings
图1a到图1h是显示本发明一实施例中用于制造一工具的一系列步骤的各图式。1a to 1h are diagrams showing a series of steps for manufacturing a tool in one embodiment of the present invention.
图1a是本发明一实施例中的底视图,其显示一模具的模面。Figure 1a is a bottom view showing the die face of a mold in one embodiment of the present invention.
图1b是本发明一实施例中沿图1aA-A线段的剖视图。Fig. 1b is a cross-sectional view along line A-A of Fig. 1a in an embodiment of the present invention.
图1c是本发明一实施例中根据图1b的剖视图,其显示一在模具模面上的黏着涂布层。Fig. 1c is a cross-sectional view according to Fig. 1b showing an adhesive coating layer on the die face of an embodiment of the present invention.
图1d是本发明一实施例中一模具的底视图,其显示研磨粒子在模面上的布置。Figure 1d is a bottom view of a mold showing the placement of abrasive particles on the mold surface in accordance with one embodiment of the present invention.
图1e是本发明一实施例中根据图1c的剖视图,其显示研磨粒子在模面上的布置。Fig. 1e is a cross-sectional view according to Fig. 1c in an embodiment of the present invention, which shows the arrangement of abrasive particles on the die surface.
图1f是本发明一实施例中电沉积室的部分剖视图,其显示一工具基材以及一模具的方向。Figure If is a partial cross-sectional view of an electrodeposition chamber showing the orientation of a tool substrate and a mold in accordance with one embodiment of the present invention.
图1g是本发明一实施例中根据图1f的部分剖视图,其显示研磨粒子通过一电沉积材料耦合到该工具基材。1g is a partial cross-sectional view according to FIG. 1f showing abrasive particles coupled to the tool substrate through an electrodeposited material, in accordance with one embodiment of the present invention.
图1h是本发明一实施例中一工具的剖视图。Figure 1h is a cross-sectional view of a tool in one embodiment of the present invention.
图2a到图2c是本发明另一实施例中用于制造一工具的一系列步骤的各图式。2a to 2c are diagrams of a series of steps for manufacturing a tool in another embodiment of the present invention.
图2a是本发明另一实施例中一模具的剖视图,其显示研磨粒子在模面上的布置。Fig. 2a is a cross-sectional view of a mold according to another embodiment of the present invention, which shows the arrangement of abrasive particles on the mold surface.
图2b是本发明另一实施例中根据图2a的剖视图,其显示一工具基材以及通过一电沉积材料而耦合到该工具基材上的研磨粒子。2b is a cross-sectional view according to FIG. 2a showing a tool substrate and abrasive particles coupled to the tool substrate by an electrodeposited material in accordance with another embodiment of the present invention.
图2c是本发明另一实施例中一工具的剖视图。Figure 2c is a cross-sectional view of a tool in another embodiment of the present invention.
上述图式仅作为进一步了解本发明的显示用途。应注意的是各层与各特征的实际尺寸可以与所显示的不同。The above drawings are only used for further understanding of the present invention. It should be noted that the actual dimensions of the layers and features may vary from what is shown.
元部件符号说明Description of component symbols
10模具 100电沉积室10
14绝缘材料 18模面14
22研磨粒子 26孔洞22
30电解液 34区域30
38黏着材料 42尖端38
49工作表面 50工具49
54基材 56表面54
58电沉积材料 62垂直图形58
具体实施方式 Detailed ways
在揭露与描述本发明之前,应了解到发明并非限制在文中所揭露的特定结构、制程步骤或是材料,而是可扩大到被那些相关领域中熟习技艺者所了解的均等物。也应了解的是,在此所使用的术语仅被用于叙述特定的实施例,而非意图造成限制。Before the present invention is disclosed and described, it is to be understood that the invention is not limited to the specific structures, process steps or materials disclosed herein, but extends to equivalents understood by those skilled in the relevant arts. It should also be understood that the terminology used herein is used to describe particular embodiments only and is not intended to be limiting.
说明书以及附加的申请专利范围中所使用的冠词“一”及“该”是包含了复数的用法,除非文章中特定指出其它涵义。举例而言,“一研磨粒子”包含了一个或更多这样的粒子。The articles "a" and "the" used in the specification and appended claims include plural usage unless otherwise specified in the text. By way of example, "an abrasive particle" includes one or more such particles.
定义definition
在描述与请求本发明时,会根据下列提出的定义来使用下列术语。In describing and claiming the present invention, the following terminology will be used in accordance with the definitions set forth below.
文中所使用的“绝缘材料”是指一个或多个材料,该材料以一方法形成一模具,该方法有效避免电沉积材料累积在该绝缘材料的模面上。如文中所解释的,该绝缘材料可包含非导电性及/或导电性材料。As used herein, "insulating material" refers to one or more materials that form a mold in a manner effective to avoid accumulation of electrodeposited material on the mold surface of the insulating material. As explained herein, the insulating material may comprise non-conductive and/or conductive materials.
文中所使用的“模面”是指该可固定有研磨粒子的绝缘材料上的一表面。As used herein, "mold face" refers to a surface on the insulating material to which abrasive particles can be fixed.
文中所使用的“预设图形”是指一种研磨粒子或是孔洞的非随机配置,该配置是在组装一包含此种粒子或是孔洞的工具或装置之前,已被先行决定。As used herein, "predetermined pattern" refers to a non-random configuration of abrasive particles or pores that is determined prior to assembly of a tool or device containing such particles or pores.
文中所使用的“水平图形”是指一种研磨粒子或是孔洞遍布于一表面上的配置,该表面是研磨粒子或是孔洞所欲附加到的表面。As used herein, "horizontal pattern" refers to an arrangement of abrasive particles or holes throughout a surface to which the abrasive particles or holes are intended to be attached.
文中所使用的“垂直图形”是指一种研磨粒子的尖端自一工具或工具基材的工作表面上所延伸的高度的配置。As used herein, "vertical pattern" refers to an arrangement of the heights at which the tips of abrasive particles extend from the working surface of a tool or tool substrate.
文中所使用的“工作表面”是指在操作时,面向或是欲与一被抛光、研磨或是磨砂的工件相接触的一种工具或工具基材的表面。As used herein, "working surface" means the surface of a tool or tool substrate that faces or is intended to come into contact with a workpiece being polished, ground or ground during operation.
文中所使用的“晶格”是指一水平图形,其相邻研磨粒子以等距离间隔,就孔洞而言,相邻孔洞以等距离相间隔。As used herein, "lattice" refers to a horizontal pattern in which adjacent abrasive particles are equally spaced, and in the case of holes, adjacent holes are equally spaced.
文中所使用的“后电沉积程序”是指某些传统方法的整修或研磨程序,该整修或研磨程序是用于使一工具露出其工作表面。As used herein, "post-electrodeposition procedure" refers to certain conventional methods of conditioning or grinding procedures used to expose a tool to its working surface.
文中所使用的“固持(holding)”“暂时固定(temporarily securing)”是指耦合或是支撑粒子以为了能避免粒子从耦合或支撑该粒子的表面脱落或是在该表面上移动。举例而言,在某些实施例中,重力足以将研磨粒子耦合或支撑于在该表面上。As used herein, "holding" and "temporarily securing" refer to coupling or supporting a particle so as to prevent the particle from falling off or moving on the surface to which the particle is coupled or supported. For example, in some embodiments, gravity is sufficient to couple or support abrasive particles on the surface.
文中所使用的“样板(Template)”是指一具有多个孔洞的装置,该多个孔洞被用于将研磨粒子依据一预设图形固定到一模具上。该样板上孔洞的配置可控制该预设图形。在使用时,样板一侧被定位抵靠一模具的模面,钻石粒子则散布于样板另一侧。该多个孔洞可被设计于让每个孔洞仅匹配单一个研磨粒子,且令研磨粒子掉落穿过孔洞而接触模面。该多个孔洞亦可被设计为其可仅容纳特定粒径尺寸的粒子。在孔洞内的粒子可接触模面以便令粒子可以被固定在模面上。剩余未被固定的研磨粒子可被去除。之后该样板则自模具上移除。"Template" as used herein refers to a device having a plurality of holes for fixing abrasive particles to a mold according to a predetermined pattern. The configuration of the holes on the template controls the default pattern. In use, one side of the template is positioned against the die face of a mold and diamond particles are spread on the other side of the template. The plurality of holes can be designed such that each hole matches only a single abrasive particle and the abrasive particle falls through the hole to contact the die surface. The plurality of holes can also be designed to accommodate only particles of a specific size. The particles within the holes can contact the mold surface so that the particles can be fixed on the mold surface. The remaining unfixed abrasive particles can be removed. The template is then removed from the mold.
文中所使用的“大致上”,关于确切的性质或事项时,是指一误差程度,该误差程度充分地微小以致于无法可测性地减损该确切的性质或事项。As used herein, "substantially" with respect to a definite property or matter means a degree of error that is sufficiently insignificant to detract from the definite property or matter measurably.
文中所使用的用词“大约”,与个别数字或数字范围相连时,是指一个稍微高于或低于所连结的实际数值的实际数字或范围。As used herein, the word "about" in connection with a particular number or range of numbers means an actual number or range that is slightly higher or lower than the actual value to which it is linked.
文中所使用的多个物品、结构组件、组成组件及/或材料等等,为方便起见可被列于一共同条列中。然而,这些列表应被解释为:条列中的每一组件皆是独立且独特的组件。因此,此等条列中任何的单独组件,不可仅仅因为没有指示说明该单独组件与在同条列中的任何其它组件有所不同,就被解释为与其它组件大致上均等。Multiple items, structural elements, constituent elements and/or materials, etc. used herein may be listed in a common column for convenience. However, these listings should be construed as if each component in the list is a separate and unique component. Thus, any individual component within such clause should not be construed as substantially equivalent to other components merely because there is no indication that that separate component is different from any other component in the same clause.
浓度、数量及其它数字数据在文中可以范围形式来表达或呈现。阅读者应了解,使用范围形式仅是为了方便与简洁,故应被弹性地解释为不仅仅包含了被清楚叙述以限定范围的数值,亦包含了这些被揭露的单独数值或是子范围,犹如位于该范围之中的单独数值及子范围被清楚揭露一般。举例而言,一数字范围“大约1到大约5”应被解释为不仅是包含了清楚叙述的大约1到大约5,亦应包含在于该范围之中的单独数值及子范围。因此,该范围包含了诸如单独数值2、3及4与子范围1到3、2到4及3到5等等。Concentrations, amounts, and other numerical data may be expressed or presented herein in range format. The reader should understand that the range format is used for convenience and brevity only and should be construed flexibly to include not only the values expressly recited to define the range, but also those disclosed individual values or subranges, as if Individual values and subranges within such ranges are expressly disclosed. For example, a numerical range of "about 1 to about 5" should be interpreted to include not only the explicitly recited about 1 to about 5, but also include individual values and subranges within that range. Thus, such ranges include individual values such as 2, 3, and 4 and subranges 1 to 3, 2 to 4, and 3 to 5, and so on.
同样的法则适用于仅仅叙述单一数值。此外,此一解释应被应用而不论所叙述的范围或特性的广度。The same rule applies to stating only a single value. Moreover, such an interpretation should apply regardless of the breadth of scope or characteristics recited.
本发明this invention
本发明包含了多个(电镀)研磨工具的电沉积制造方法,该多个制造方法允许根据位于一垂直与水平图形来较佳地控制研磨粒子在一工具基材上的配置与固定状况,且该多个方法仅需极少或不需要该工具工作表面的后电沉积程序。换言之,工作表面是由电沉积程序本身所产生。申请人亦发展出一模具以使用于此制造方法,并发展出多个由该制造方法所生产的研磨工具。The present invention comprises a method of electrodeposition manufacturing of (electroplated) abrasive tools, which allows better control of the disposition and fixation of the abrasive particles on a tool substrate according to their location in a vertical and horizontal pattern, and The methods require little or no post-electrodeposition procedures of the tool working surface. In other words, the working surface is produced by the electrodeposition process itself. The applicant has also developed a mold for this manufacturing method, and developed a plurality of abrasive tools produced by this manufacturing method.
请参照图1a到图1e,其显示本发明一模具10。该模具10可被使用于一电解程序以将多个研磨粒子22定位并固定到该模具10的一模面18。请参照图1f到图1h,其显示在本发明一实施例中,一电沉积室100里使用的模具10所呈现的部分结构。同样地,图2a到图2c显示了在本发明一实施例中,被使用模具10所呈现结构的其它例子。Please refer to FIG. 1a to FIG. 1e , which show a
如上述图式所显示,该模具10包含了一绝缘材料14。此绝缘材料14可有效地避免电沉积材料(Electrodeposited Material)58累积在该模面18上。在图1f到图1h,以及图2a到图2c里所显示的例子中,该多个研磨粒子22的尖端42形成为一工具50的工作表面49的一部分,且,在电沉积期间,该多个尖端42被固定在该模面18上。可避免该电沉积材料58累积于该研磨粒子22尖端42及该工具50的工作表面49上。As shown in the above figures, the
在一实施例中,该绝缘材料14具有至少一贯穿该绝缘材料14的孔洞26。请参照图1a到图1e,在另一实施例中,该绝缘材料14具有多个贯穿该绝缘材料14的孔洞26。该多个孔洞26可供一电解液30自一位于模具10外侧的区域34循环地穿过该模具10到达该工具基材54的表面56(根据图1a到图1e,并没有34、54、56等图示),以便让该用以将研磨粒子22固定在工具基材54上的材料发生电沉积。由于此循环对于维持在电沉积处的电解液的离子(图中未示)浓度是必须的,故该循环是有益的。在图1g、图1h、图2b及图2c的例子中,电沉积处是在该工具基材54的表面56上。In one embodiment, the insulating
在一些实施例中,该多个孔洞26可依据一预设图形来配置。举例而言,该预设图形可为一晶格,如图1a与图1d所示。该晶格图形有助于均匀地分布电解液30的离子到基材54上。均匀的离子分布有助于将电沉积材料58均匀地建立遍布在该工具基材54的表面上,如此则有助于以均匀强度将研磨粒子22固定。In some embodiments, the plurality of
在其它实施例中,该多个孔洞26可被配置以让特定区域发生较多的电沉积。举例而言,图2b显示了该多个孔洞26位于该模具的多个凹部。靠近在孔洞26处有较多电解液30的离子,以导致有较多的电沉积材料58形成于该处。In other embodiments, the plurality of
该绝缘材料14可以多种方法形成。在一实施例中,该绝材料14可由一树脂所形成。举例而言,该树脂材料可为一人造树脂或一聚合材料,例如聚亚酰胺(Polyimide)。该树脂材料亦可包含环氧化物(Epoxies)、漆(Lacquers)、亮光漆(Vanishes)、丙烯酸聚合物(acrylic polymers)及其混合物。此外,该树脂材料可为一橡胶材料,并包含自然与人造橡胶,例如苯乙烯-丁二烯(Styrene-Butadiene)、聚氯丁烯橡胶(Polychloroprene Elastomers)、氟橡胶(Fluoroelastomers)、乙烯-丙烯-二烯三元共聚物(Ethylene PropyleneDiene)、亚硝酸盐橡胶(Nitrile Elastomers),如丁腈橡胶(Buna-N)及NBR橡胶、聚硅氧烷基(Polysiloxanes)、聚异丁烯(Polyisobutylenes)及氨基钾酸酯(Urethanes)。The insulating
在其它实施例中,只要该绝缘材料14有效地或大致上避免该电沉积材料58形成于该模面18,该绝缘材料14可包含导电组件。举例而言,该绝缘材料14可为一包覆有绝缘漆(图中未示)的不锈钢基材(图中未示)。In other embodiments, as long as the insulating
该绝缘材料14亦可包含一模面18,该模面18,是在一电沉积材料58进行电解沉积而将研磨粒子22固定到一导电基材54(例如工具基材54)表面56上时,用于固定该研磨粒子22。该模具10可以多种方式固定该如钻石粒子等等的研磨粒子22。举例而言,在模面18上可黏着一黏着材料38以固定该研磨粒子22。该黏着材料38可用于独立配置各个研磨粒子22。其它固定研磨粒子22的方法可包含磁力、摩擦力及重力等等。举例而言,在一实施例中,该模面可包含有多个沟槽以供该多个研磨粒子摩擦固定于沟槽之中。The insulating
请参照图1e,在一实施例中,该多个研磨粒子22被固定以致于直接接触模面18。有益地,通过配置模面的形状可控制一对应到一工具50的垂直图形62。请参照图2a到图2c,举例而言,该模面可被配置为具有一与一垂直图形颠倒的形状以便对应一工具基材54上的研磨粒子。Referring to FIG. 1 e , in one embodiment, the plurality of
该模面18形状本身可适用于研磨工具50的许多应用。举例而言,该模面可大致上呈平坦(如图1a到图1g所示)、凹状或凸状,或该模面可同时包含多个凹部与凸部(如图2a与图2b)。在另一个对化学机械抛光(ChemicalMechanical Polishing,CMP)特别有用的例子中,该模面的凹部可具有大约1/1000的斜率或是大约1/1000的凹度。在此最后一个例子中,可令一抛光工具的垂直图形62具有一凸出外形,该凸出外形具有约1/1000的斜率,此乃CMP应用所通常要求的条件。The
此外,在某些以研磨粒子22直接接触模面18的实施例中,可依据一预设的垂直图形而设置该多个作为工具工作表面49一部分的研磨粒子尖端42。此可有助于被抛光物的均匀整修及良好完工质量(图中未示)。此外,此可允许被抛光物具有特殊的整修图形。In addition, in some embodiments where the
在某些实施例之中,该多个研磨粒子22可依据一预设的水平图形而固定在该模面18上。因此,该工具基材54表面56上的研磨粒子间的间距得以被控制。这样的控制可具有一些益处。举例而言,被控制的研磨粒子间距,在抛光过程中可通过减少过度的摩擦力(或拖曳力)以及减少所产生的热能来增加效能。在某些实施例中,须在工具表面上规则地分布该多个研磨粒子。为达成此等应用,该多个研磨粒子可依据一晶格图形而固定在该模面上。In some embodiments, the plurality of
该多个研磨粒子可通过各种技术,依据一预设的水平图形来定位于该模面上。举例而言,该复数研磨粒子可个别设置在模面上。或者,可使用一样板(如上述所定义的)来更有效率地将研磨粒子设置在该模面上。其它的方法可使用转印带或其它转印媒介,研磨粒子依据一预设的水平图形而暂时地设置在该转印带上,而后转印到该模面上。The plurality of abrasive particles can be positioned on the mold surface according to a predetermined horizontal pattern by various techniques. For example, the plurality of abrasive particles can be individually disposed on the mold surface. Alternatively, a plate (as defined above) may be used to more efficiently place abrasive particles on the die face. Other methods can use a transfer belt or other transfer media, on which the abrasive particles are temporarily arranged according to a predetermined horizontal pattern, and then transferred to the mold surface.
在本发明一实施例中,该多个研磨粒子22可依据一与孔洞26图形互补的预设图形来固定在该模面18上。举例而言,该多个研磨粒子与孔洞可分别依据如图1d分别所示的晶格图形而配置。有益地,此等相互补的图形可令电解液30以大致上相等的离子浓度电沉积在各研磨粒子周围。因此,分别固定各研磨粒子的电沉积材料58的量大致上相等。此有助于通过分配大致上相等的工作负载到各研磨粒子上来给研磨粒子最大的保留度。In an embodiment of the present invention, the plurality of
在其它实施例中,该多个研磨粒子22可依据一图形来固定在该模面18上,该图形是令该模面的至少一特定区域上的研磨粒子分布密度较高,且高于模面其余区域的研磨粒子分布密度。此图形在CMP的应用中特别有用。举例而言,可令一盘状研磨工具的周缘上具有一较高的研磨粒子分布密度。盘状研磨工具的周缘旋转速度高于中心,且在该盘状工具主要的边缘处有较大的压力。申请人于2002年3月27日申请的美国第10/109,531号专利申请案以及于2004年9月29日申请的美国第10/954,956号专利申请案揭示了其它的研磨粒子图形与配置,该多个研磨粒子与配置整合在本文中而作为参考案。In other embodiments, the plurality of
在本发明的另一方面,是提供一用以制造研磨工具50的制造方法,其中该研磨工具是通过一电沉积材料58来将多个研磨粒子22结合到一基材54上。在一初始步骤中,多个研磨粒子可暂时地固定在一模具10的模面18上,如文中所述,接着,该模具与被固定的研磨粒子可被设置于一电沉积室100中,且以模面面向基材。接下来,将一材料电沉积于基材54的表面56上,且该多个研磨粒子通过电沉积材料以电解方式附加于该基材上。该模具可被移除,以露出一整个或部分的研磨工具,该研磨工具则包含了基材以及附加在基材表面的研磨粒子。In another aspect of the present invention, a method of manufacturing an
在一例子中,该多个研磨粒子22可通过一上述的黏着材料38来固定在模具10的模面18上。通过该面向基材54的模面,电沉积材料58能够开始形成于该基材上,直到研磨粒子的一部分被覆盖为止。该电沉积材料能够将研磨粒子更坚固地附加在该黏着材料上,且因此,可轻易地移除该模具以露出研磨粒子的尖端。In one example, the plurality of
在一实施例中,该基材54可为一导电性材料,如不锈钢。该基材在电解过程中本身可作为一电极,该基材本身亦可作为一工具本体(图中未示)。或者,该基材可经由一方法而稍后才固定在一工具本体上。In one embodiment, the
在本发明另一实施例中,该电沉积材料58可为一金属材料,例如一金属或一金属组成材料。举例而言,该电沉积材料可为金属,如镍、铬、铜、钛、钨、锡、铁、银、金、锰、镁、锌、铝、钽、其合金或是其混合物。该金属组成材料可为一包含有至少一种上述金属的组成物。In another embodiment of the present invention, the
在本发明另一方面,是提供一通过上述方法所制造的研磨工具50。该研磨工具包含有一基材54,多个研磨粒子22通过电沉积材料58而结合到该基材54上。该多个研磨粒子的尖端42可依据一预设垂直图形而配置。此外,该多个研磨粒子的一部分可外露于电沉积材料之外而不被电沉积材料所覆盖。In another aspect of the present invention, an
举例而言,该多个研磨粒子22可被设定于在该基材上具有一均等高度或具有一大致上均等的高度。该垂直图形亦可为凸状、凹状、或同时具有多个凸状区域与凹状区域。For example, the plurality of
此外,该多个研磨粒子22可根据一预设水平图形而配置于该基材上。举例而言,该多个研磨粒子可依据一上述的晶格而配置。该复数研磨粒子可经由配置以令基材上一特定区域的研磨粒子分布密度较高,且高于该基材上其余区域的研磨粒子分布密度。此等垂直与水平图形具有许多如上所述的优点。In addition, the plurality of
在本发明其它实施例中,一研磨工具50可仅需极少或不需要该工具的工作表面的后电沉积程序。在此实施例中,电沉积材料58形成在该工具的基材54上,且不会在该工具完成的工作表面49形成。因此,该已完成的工作表面并不需如其它传统方法般还需要加工以令研磨粒子的尖端42外露。此有助于避免因整修该研磨工具工作表面的冲击而对研磨粒子造成伤害。In other embodiments of the invention, an
范例example
为了让本发明能够被更加了解,以下将提供数个范例。惟该多种范例并非对本发明的范畴加以限制。In order to better understand the present invention, several examples are provided below. However, the various examples do not limit the scope of the present invention.
范例1:CMP整修器(CMP Pad Dresser)Example 1: CMP Pad Dresser
一为聚亚酰胺层(1mm厚度)的模具是被压印以具有多个依据一晶格图形配置的孔洞。各孔洞中心与其它相邻孔洞中心具有一0.7mm的间距,且每个孔洞具有0.5mm的直径。该聚亚酰胺层的一表面上(例如模面)涂布有一丙烯酸(压克力)(聚合物)黏着剂(50micron厚度)。在面上附加有多个具备100/120粒度(mesh)的钻石磨粒,各钻石磨粒分别位于周围四个相邻孔洞的中心处。该被钻石所覆盖的模面邻接设置在一盘状的不锈钢基材(具有108mm直径及6.5mm厚度)上。该多个钻石磨粒位于模面不锈钢与基材之间。该模具及基材位于一塑料(PVC)环48之中以便能在电解程序之中将模具及基材固定在一起。该基材接触一阴极。电解液为硫化镍溶液。该塑料环、模具及基材浸入位于一PVC层之中的电解液,该PVC层用于封闭该电解液。电解作用进行以令镍电沉积在该基材上。电解作用持续直到镍覆盖了将近大约平均2/3的钻石磨粒尺寸。该聚亚酰胺模具接着被移除以便得到该通过电沉积镍而附加有钻石磨粒的基材。A mold of polyimide layer (1 mm thickness) was embossed with holes arranged according to a lattice pattern. The center of each hole has a distance of 0.7 mm from the center of other adjacent holes, and each hole has a diameter of 0.5 mm. An acrylic (acrylic) (polymer) adhesive (50 micron thickness) is coated on one surface of the polyimide layer (eg, the die surface). A plurality of diamond abrasive grains with a grain size (mesh) of 100/120 are added on the surface, and each diamond abrasive grain is respectively located at the center of four adjacent holes around it. The diamond-covered die face was positioned adjacent to a disk-shaped stainless steel substrate (having a diameter of 108 mm and a thickness of 6.5 mm). The plurality of diamond abrasive grains are located between the mold surface stainless steel and the base material. The mold and substrate are located within a plastic (PVC)
范例2Example 2
如下所述而制造三十个模具:Thirty molds were made as follows:
每一模具是分别由一具有大约120mm直径与大约120micron厚度的不锈钢盘体所形成。各盘体是以平版印刷方式被蚀刻而形成有多个孔洞,该多个孔洞依据如下所述的晶格图形而配置。该多个孔洞分布于一位在各盘体中心处上而具有约100mm直径的圆型区域之中,其余在各盘体上邻接盘体周缘而具有大约20mm宽度的区域则不具有孔洞。测量相邻孔洞间的近似中心点的间距(即孔洞间距),一些盘体具有如下的孔洞间距:Each mold was formed from a stainless steel disc with a diameter of approximately 120 mm and a thickness of approximately 120 microns. Each disc is etched by lithography to form a plurality of holes configured according to a lattice pattern as described below. The plurality of holes are distributed in a circular region having a diameter of about 100 mm at the center of each disk, and the remaining regions on each disk having a width of about 20 mm adjacent to the periphery of the disk have no holes. Measure the distance between the approximate center points of adjacent holes (that is, the hole spacing), some discs have the following hole spacing:
1.十个盘体具有大约800micron的孔洞间距,每个孔洞直径大约400mircon。1. The ten discs have a hole pitch of about 800micron, and each hole has a diameter of about 400mircon.
2.十个盘体具有大约600micron的孔洞间距,每个孔洞直径大约300mircon。2. The ten disks have a hole pitch of about 600micron, and each hole has a diameter of about 300mircon.
3.十个盘体具有大约400micron的孔洞间距,每个孔洞直径大约200mircon。3. The ten disks have a hole pitch of about 400micron, and each hole has a diameter of about 200mircon.
每个盘体上涂布有亮光漆、橡胶或是涂布有惰性材料或是绝缘材料以便增进其电绝缘性质。然而,在某些应用中模具本身为低导电性或是非导电性材料,故上述的涂布步骤则可作为非必要的选用性步骤。在某些例子中,当研磨粒子为绝缘时(如钻石粒子),该不锈钢盘体或是其它导电性盘体与一阴极基板可被中介的研磨粒子所隔离而藉此将该盘体绝缘。Each disc is coated with varnish, rubber or coated with an inert or insulating material to improve its electrical insulating properties. However, in some applications, the mold itself is a low-conductivity or non-conductive material, so the above-mentioned coating step can be used as an optional step. In some instances, when the abrasive particles are insulating (eg, diamond particles), the stainless steel disc or other conductive disc and a cathode substrate can be separated by intervening abrasive particles thereby insulating the disc.
藉由使用上述的模具,下列的程序可用以制造一钻石整修器(Diamond PadConditioner):By using the above mold, the following procedure can be used to manufacture a Diamond Pad Conditioner:
1.在各模具的两侧上涂布有一黏着层,且每一侧皆组装有一研磨粒子样板。该多个研磨粒子样板受到配置及选择以适当地容纳具备预定尺寸的研磨粒子,并允许该多个研磨粒子黏着在该对应样板的模具的孔洞之间(换言之,各样板中的各孔洞被配置而与模具中的孔洞呈互补配置,以确保研磨粒子将会黏着于模具表面上而不是落入穿过模具的孔洞。)1. An adhesive layer is coated on both sides of each mold, and an abrasive particle template is assembled on each side. The plurality of abrasive particle templates are configured and selected to properly accommodate abrasive particles of a predetermined size and to allow the plurality of abrasive particles to adhere between the holes of the corresponding template's mold (in other words, each hole in each template is configured and are complementary to the holes in the mold to ensure that the abrasive particles will stick to the mold surface rather than fall through the holes in the mold.)
2.该模具与样板组件是以至少一个结合榫来穿设该组件中各组件上所贯穿形成的相对应结合孔,以固定该组件。然而,应注意的是,其它的机构,如夹钳、黏着剂等等亦可用于结合该组件中的模具与样板。2. The mold and template assembly uses at least one joint tenon to pass through the corresponding joint holes formed through each component in the assembly to fix the assembly. However, it should be noted that other mechanisms such as clamps, adhesives, etc. may also be used to join the mold and template in the assembly.
3.将具适当尺寸的钻石粒子(Diamond Innovation公司所制造的MBG-660)分别设置在样板的孔洞中以令每个样板孔洞容纳接收单一个即将黏着到模具表面的研磨粒子。3. Set diamond particles (MBG-660 manufactured by Diamond Innovation) of appropriate size in the holes of the sample plate so that each hole of the sample plate can receive a single abrasive particle that will be adhered to the surface of the mold.
4.通过翻转、振动、摇晃各模具/样板组件等方式来移除多余的钻石粒子。4. Remove excess diamond particles by turning, vibrating, shaking each mold/sample assembly, etc.
5.移除各模具上的样板以将该多个钻石粒子依据样板图形而黏着在该模具的各表面上。在某些例子中,样板图形可令各钻石粒子分别位于模具上相对应四个相邻穿孔的中心。5. Remove the template on each mold so that the plurality of diamond particles are adhered on each surface of the mold according to the pattern of the template. In some examples, the template pattern can have each diamond particle located at the center of the corresponding four adjacent perforations on the mold.
6.将各模具置中设置于二具备大约100mm直径与大约6.5mm厚度的不锈钢基材之间,以令钻石粒子夹设于模具与基材之间。由于研磨粒子的尺寸变动幅度微小,可能的话只有某些大尺寸的研磨粒子会接触该基材。6. Center each mold between two stainless steel substrates with a diameter of about 100 mm and a thickness of about 6.5 mm, so that the diamond particles are sandwiched between the mold and the substrate. Due to the small size variation of the abrasive particles, only some of the larger abrasive particles contact the substrate if possible.
7.在各模具的外周缘分别压设有一重钢环以确保在电沉积程序期间模具不会发生移动、平移或是变形等等。在某些方面,该重钢环实际上可些微地弯曲模具的周缘以在模具的各侧上形成有凹部。该凹部的斜边可以此机构稍作控制,在某些方面,该斜率可为大约1/1000。如此可令该基材工作表面周缘上的钻石粒子略低于(大约50micron)工具成品中基材的中心。7. A heavy steel ring is pressed on the outer periphery of each mold to ensure that the mold will not move, translate or deform during the electrodeposition process. In some aspects, the heavy steel ring may actually bend the perimeter of the mold slightly to form recesses on each side of the mold. The slope of the recess can be somewhat controlled by this mechanism, in some aspects the slope can be about 1/1000. This allows the diamond particles on the periphery of the working surface of the substrate to be slightly lower (approximately 50 microns) than the center of the substrate in the finished tool.
8.将各模具/基材组件置于一塑料架的固定孔中。该多个基材的基部连接到一电镀槽的阴极上。该多个模具/基材组件被硫化镍电解溶液(即设置于电解液槽或缸中)所覆盖,且当该基材通电时,镍离子减少而镍金属沉积于该基材上。当在基材上形成一镍层时,镍层向该模具增长,且附加于该模具的钻石粒子最终会被镍层所包覆且以一选定程度而嵌入该镍层中。研磨粒子所埋入的深度可由该程序的操作者所控制。在一方面,该镍层的深度可为模具与基板之间距离的大约1/3到2/3。由于该电解溶液可循环地流过该模具的穿孔,因此可令该镍层均匀且快速地形成完毕。8. Place each mold/substrate assembly in the mounting holes of a plastic frame. The bases of the plurality of substrates are connected to the cathode of an electroplating cell. The plurality of mold/substrate assemblies are covered with a nickel sulfide electrolytic solution (ie, disposed in an electrolyte tank or vat), and when the substrate is energized, nickel ions are reduced and nickel metal is deposited on the substrate. When a nickel layer is formed on the substrate, the nickel layer grows toward the mold, and diamond particles attached to the mold are eventually coated by the nickel layer and embedded in the nickel layer to a selected extent. The depth to which the abrasive particles are embedded can be controlled by the operator of the procedure. In one aspect, the depth of the nickel layer can be about 1/3 to 2/3 of the distance between the mold and the substrate. Since the electrolytic solution can circulate through the perforations of the mold, the nickel layer can be formed uniformly and rapidly.
9.该模具因中介的绝缘钻石粒子与选用的亮光漆涂层或其它绝缘材料而无法过电,故镍不会沉积在该模具或是靠近模面的钻石粒子部位上。9. The mold cannot be electrified due to the intermediary insulating diamond particles and the selected varnish coating or other insulating materials, so nickel will not be deposited on the mold or the diamond particles near the mold surface.
10.一旦镍层形成完毕,将该研磨工具与模具自电镀溶液移出,且相互分离以便露出该研磨工具的模面。该模具则可重复使用。10. Once the nickel layer is formed, the abrasive tool and mold are removed from the plating solution and separated from each other to expose the mold face of the abrasive tool. The mold is then reusable.
由于该镍层自基材向模具增长,且由于该增长程序造成研磨粒子附加到该基材上,故最后研磨工具成品上外露钻石粒子尖端的纵断面外观会受到该模具模面的外形所影响。以此方式,该多个钻石粒子尖端可根据该最后研磨工具成品的工作表面上的一预设垂直图形而配置。此外,由于本程序的性质,研磨工具成品不需要通过后组装完结程序或工作来完成。换言之,在某些方面,一旦镍层形成完毕且该研磨工具自电镀槽移出,即已同时完成了一个可供使用的研磨工具成品。As the nickel layer grows from the substrate to the mold, and as the growth process causes the abrasive particles to attach to the substrate, the profile appearance of the exposed diamond particle tips on the final finished abrasive tool is affected by the shape of the die face of the mold . In this way, the plurality of diamond particle tips can be configured according to a predetermined vertical pattern on the working surface of the finished abrasive tool. Additionally, due to the nature of this process, the finished abrasive tool does not need to go through a post-assembly finishing process or work to complete. In other words, in some aspects, once the nickel layer is formed and the abrasive tool is removed from the plating bath, a finished abrasive tool that is ready for use is simultaneously completed.
当然,阅读者应了解的是上述范例仅供说明本发明原理的应用。在不违背本发明范畴及精神的前提下,本案所属技术领域熟习该项技艺者可做出多种修改及不同的配置,且依附在后的申请专利范围则欲涵盖这些修改与不同的配置。因此,当本发明之中目前被视为是最实用且较佳的实施例的细节已被如上揭露时,对于熟悉该项技术的工作人员来说,可依据本文中所提出的概念与原则来作出多种包含了尺寸、材料、外形、形态、功能、操作方法、组装及使用上的改变而不受限制。Of course, the reader should understand that the above examples are only for illustrating the application of the principles of the present invention. On the premise of not violating the scope and spirit of the present invention, those skilled in the art to which this case belongs can make various modifications and different configurations, and the appended patent scope intends to cover these modifications and different configurations. Therefore, when the details of the present invention that are considered to be the most practical and preferred embodiments have been disclosed above, for those skilled in the art, the concepts and principles proposed herein can be used to understand Various changes including size, material, shape, form, function, method of operation, assembly and use are made without limitation.
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US6524357B2 (en) * | 2000-06-30 | 2003-02-25 | Saint-Gobain Abrasives Technology Company | Process for coating superabrasive with metal |
US7520800B2 (en) * | 2003-04-16 | 2009-04-21 | Duescher Wayne O | Raised island abrasive, lapping apparatus and method of use |
US8545583B2 (en) * | 2000-11-17 | 2013-10-01 | Wayne O. Duescher | Method of forming a flexible abrasive sheet article |
-
2005
- 2005-12-02 US US11/292,938 patent/US20070128994A1/en not_active Abandoned
-
2006
- 2006-11-30 CN CNA2006800521572A patent/CN101336147A/en active Pending
- 2006-11-30 WO PCT/US2006/046029 patent/WO2007120224A2/en active Application Filing
- 2006-12-01 TW TW095144571A patent/TW200800504A/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102152250A (en) * | 2010-12-29 | 2011-08-17 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
CN102152250B (en) * | 2010-12-29 | 2015-01-21 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
CN107471126A (en) * | 2016-06-08 | 2017-12-15 | Kapp 机床有限责任公司 | Manufacture method for the dressing tool of grinding tool |
CN107471126B (en) * | 2016-06-08 | 2020-09-22 | Kapp 机床有限责任公司 | Method for producing dressing tool for grinding tool |
TWI644747B (en) * | 2016-09-29 | 2018-12-21 | 逢甲大學 | Electrochemical discharge machining device |
Also Published As
Publication number | Publication date |
---|---|
WO2007120224A2 (en) | 2007-10-25 |
TW200800504A (en) | 2008-01-01 |
WO2007120224A3 (en) | 2007-12-27 |
US20070128994A1 (en) | 2007-06-07 |
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