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CN101324756A - A method of increasing the thickness of prepared film in spin coating method - Google Patents

A method of increasing the thickness of prepared film in spin coating method Download PDF

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CN101324756A
CN101324756A CNA2008100455143A CN200810045514A CN101324756A CN 101324756 A CN101324756 A CN 101324756A CN A2008100455143 A CNA2008100455143 A CN A2008100455143A CN 200810045514 A CN200810045514 A CN 200810045514A CN 101324756 A CN101324756 A CN 101324756A
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thickness
spin coating
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CN101324756B (en
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杜晓松
蒋亚东
胡佳
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University of Electronic Science and Technology of China
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Abstract

本发明公开了一种在旋涂法中提高所制备薄膜厚度的方法,系在镀膜基板上利用旋涂光刻胶或粘贴胶带的方法设置凸起的台阶,台阶的高度为5-500μm,形成闭合的边框,在边框围成的区域内滴加溶液利用旋涂法制备薄膜。采用该方法可以大幅度地提高每次旋涂薄膜的厚度,适用于需要制备厚膜的诸多领域,可减少重复旋涂的次数。本方法工艺简单,操作性强,具有较强的应用价值。

Figure 200810045514

The invention discloses a method for increasing the thickness of the prepared film in the spin coating method, which is to set raised steps on the coating substrate by using the method of spin coating photoresist or sticking tape, and the height of the steps is 5-500 μm, forming In the closed frame, the solution is dropped into the area surrounded by the frame to prepare a thin film by spin coating. The method can greatly increase the thickness of each spin coating film, is suitable for many fields that need to prepare thick films, and can reduce the number of times of repeated spin coating. The method has the advantages of simple process, strong operability and strong application value.

Figure 200810045514

Description

一种在旋涂法中提高所制备薄膜厚度的方法 A method of increasing the thickness of prepared film in spin coating method

技术领域technical field

本发明涉及薄膜制备技术领域,具体涉及一种在旋涂法中提高所制备薄膜厚度的方法。The invention relates to the technical field of thin film preparation, in particular to a method for increasing the thickness of the prepared thin film in a spin coating method.

背景技术Background technique

旋涂法是一种常用的薄膜制备方法,它具有设备简单、生产能力强、制备的薄膜面积大、厚度均匀等特点,广泛用于光盘、半导体器件、电子元器件等领域。Spin coating method is a commonly used thin film preparation method. It has the characteristics of simple equipment, strong production capacity, large film area and uniform thickness. It is widely used in optical discs, semiconductor devices, electronic components and other fields.

旋涂薄膜的厚度可通过改变旋涂溶液的浓度、粘度、溶剂的种类、旋涂时的转速及时间等参数来调节,也可采用多次旋涂的方法来实现。其中最有效地增加薄膜厚度的方法是加大旋涂溶液的浓度、粘度以及采用多次旋涂法。但是随着溶液浓度及粘度的增大,旋涂薄膜的粗糙度增加,膜厚均匀性变差;而采用多次旋涂法会增加工序,降低生产效率。The thickness of the spin-coated film can be adjusted by changing the concentration and viscosity of the spin-coating solution, the type of solvent, the rotational speed and time of spin-coating, and other parameters, and it can also be achieved by multiple spin-coating methods. The most effective way to increase the thickness of the film is to increase the concentration and viscosity of the spin coating solution and to use multiple spin coating methods. However, as the concentration and viscosity of the solution increase, the roughness of the spin-coated film increases, and the uniformity of the film thickness becomes poor; and the use of multiple spin-coating methods will increase the process and reduce production efficiency.

在乐甫波器件的制作中,需要在带有平面叉指电极的压电基片上制作波导薄膜,聚甲基丙烯酸甲酯(PMMA)是常用的波导薄膜材料,采用旋涂法制备。为保证波导薄膜结构致密、无孔洞气泡、表面平整、厚度均匀,以采用稀溶液旋涂波导薄膜的效果为佳。但PMMA波导薄膜的厚度需达到2μm左右,而以稀溶液旋涂每次薄膜的厚度在100nm以下,需重复10多次,工艺繁琐,工作量大,效率低下。In the manufacture of Love wave devices, waveguide films need to be fabricated on piezoelectric substrates with planar interdigitated electrodes. Polymethyl methacrylate (PMMA) is a commonly used waveguide film material, which is prepared by spin coating. In order to ensure that the waveguide film has a compact structure, no holes and bubbles, a smooth surface, and a uniform thickness, it is better to spin-coat the waveguide film with a dilute solution. However, the thickness of the PMMA waveguide film needs to reach about 2 μm, and the thickness of the thin film spin-coated with dilute solution is less than 100 nm each time, which needs to be repeated more than 10 times. The process is cumbersome, the workload is heavy, and the efficiency is low.

发明内容Contents of the invention

本发明所要解决的技术问题是如何提供一种在旋涂法中提高所制备薄膜厚度的方法,该方法能有效的提高每次旋涂后所得到薄膜的厚度。The technical problem to be solved by the present invention is how to provide a method for increasing the thickness of the prepared film in the spin coating method, which can effectively increase the thickness of the film obtained after each spin coating.

本发明所提出的技术问题是这样解决的:提供一种在旋涂法中提高所制备薄膜厚度的方法,其特征在于,对镀膜基板进行预处理,使基板四周边缘区域带有凸起的台阶,台阶形成闭合的边框,薄膜旋涂制备在边框形成的闭合区域内。The technical problem proposed by the present invention is solved in this way: provide a method for increasing the thickness of the prepared film in the spin coating method, which is characterized in that the coating substrate is pretreated so that the edge area around the substrate has raised steps , the steps form a closed frame, and the film is spin-coated in the closed area formed by the frame.

按照本发明所提供的在旋涂法中提高所制备薄膜厚度的方法,其特征在于,所述的台阶是通过旋涂光刻胶或粘贴胶带的方法形成,台阶的高度为5-500μm。According to the method for increasing the thickness of the prepared film in the spin coating method provided by the present invention, the step is formed by spin coating photoresist or sticking tape, and the height of the step is 5-500 μm.

按照本发明所提供的在旋涂法中提高所制备薄膜厚度的方法,其特征在于,旋涂薄膜的厚度和厚度均匀区域可通过调节台阶的高度、闭合区域面积及形状来调节。According to the method for increasing the thickness of the prepared film in the spin coating method provided by the present invention, it is characterized in that the thickness and uniform thickness area of the spin coating film can be adjusted by adjusting the height of the steps, the area and shape of the closed area.

按照本发明所提供的在旋涂法中提高所制备薄膜厚度的方法,其特征在于,所述的闭合区域的形状是圆环形或多边形。According to the method for increasing the thickness of the prepared film in the spin coating method provided by the present invention, it is characterized in that the shape of the closed area is circular or polygonal.

按照本发明所提供的在旋涂法中提高所制备薄膜厚度的方法,其特征在于,所述光刻胶台阶的制备步骤包括:①旋涂光刻胶;②在掩模下曝光;③显影形成台阶;④高温烘烤固化,使胶膜不被随后的旋涂液溶解。According to the method for increasing the thickness of the prepared film in the spin coating method provided by the present invention, it is characterized in that the preparation steps of the photoresist step include: ① spin coating photoresist; ② exposure under a mask; ③ developing Steps are formed; ④ high temperature baking and curing, so that the film will not be dissolved by the subsequent spin coating solution.

按照本发明所提供的在旋涂法中提高所制备薄膜厚度的方法,其特征在于,旋涂薄膜的厚度还可通过改变旋涂溶液的浓度、粘度、溶剂的种类、旋涂时的转速及时间来调节。另外,可通过多次旋涂来增加薄膜的厚度。According to the method for improving the prepared film thickness in the spin coating method provided by the present invention, it is characterized in that the thickness of the spin coating film can also be changed by changing the concentration of the spin coating solution, the viscosity, the type of solvent, the rotating speed and the speed of the spin coating. time to adjust. In addition, the thickness of the film can be increased by multiple spin coatings.

本发明的实质是在镀膜基片的四周布置一个凸起的边框,以限制液体的流动,从而大大增加每次旋涂薄膜的厚度。这样无需多次旋涂或减少旋涂的次数,就能达到预定的薄膜厚度,简化了工艺,提高了效率。采用本发明的旋涂技术,可以优先选用低浓度及粘度的旋涂液体,从而保证所得到的旋涂薄膜厚度均匀、表面平整。The essence of the invention is to arrange a raised frame around the coating substrate to limit the flow of liquid, thereby greatly increasing the thickness of each spin-coated film. In this way, a predetermined film thickness can be achieved without multiple times of spin coating or reducing the number of times of spin coating, which simplifies the process and improves the efficiency. By adopting the spin-coating technology of the present invention, the spin-coating liquid with low concentration and viscosity can be preferably selected, thereby ensuring uniform thickness and smooth surface of the obtained spin-coating film.

附图说明Description of drawings

图1为旋涂法制备薄膜的器件结构示意图;Fig. 1 is the schematic diagram of the device structure of spin-coating method to prepare thin film;

图2为本发明的台阶图案的俯视图;Fig. 2 is the top view of the step pattern of the present invention;

图3为本发明的旋涂工艺的流程示意图;Fig. 3 is the schematic flow sheet of spin-coating process of the present invention;

图4为采用本发明的台阶旋涂工艺后薄膜厚度与台阶高度的关系。Fig. 4 is the relationship between the film thickness and the step height after adopting the step spin coating process of the present invention.

其中:1是压电晶片、2是电极、3是焊盘、4是导线、5是台阶、6是波导薄膜。Among them: 1 is a piezoelectric chip, 2 is an electrode, 3 is a welding pad, 4 is a wire, 5 is a step, and 6 is a waveguide film.

具体实施方式Detailed ways

下面结合附图以及实施例对本发明作进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

以制备乐甫波波导薄膜为例对本文提出的一种旋涂法制备薄膜的方法进行说明。乐甫波器件在结构上分为上下三层:底层是压电晶片,中间层是电极,最上层是波导薄膜。电极通常由一对叉指换能器(IDT)组成,也可包含反射栅。如图1所示,PMMA波导薄膜将制备在电极2之上,并且PMMA波导薄膜的厚度需达到2μm左右,为此采用了本发明的边框旋涂工艺。Taking the preparation of Love wave waveguide thin film as an example, a method of preparing thin film by spin coating method proposed in this paper is described. The Love wave device is divided into upper and lower layers in structure: the bottom layer is a piezoelectric wafer, the middle layer is an electrode, and the top layer is a waveguide film. The electrodes usually consist of a pair of interdigital transducers (IDTs), which may also contain reflective grids. As shown in Fig. 1, the PMMA waveguide film will be prepared on the electrode 2, and the thickness of the PMMA waveguide film needs to reach about 2 μm, for which the frame spin-coating process of the present invention is adopted.

本发明所提供的一种旋涂法制备薄膜的方法如下(实例):A kind of spin coating method provided by the present invention prepares the method for thin film as follows (example):

根据乐甫波器件的外形,在压电晶片1的外沿制作长方形的边框,如图2所示。边框是通过粘贴胶带纸而形成的。边框将电极2围在中央,构成镀膜区域;而焊盘3被边框覆盖,不会镀上薄膜。电极2的尺寸为13mm×1.5mm,边框设置在电极外沿1-1.5mm处。According to the shape of the Love wave device, a rectangular frame is made on the outer edge of the piezoelectric wafer 1, as shown in FIG. 2 . The frame is formed by sticking tape paper. The frame surrounds the electrode 2 in the center to form a coating area; while the pad 3 is covered by the frame and will not be coated with a film. The size of the electrode 2 is 13mm×1.5mm, and the frame is set at 1-1.5mm from the outer edge of the electrode.

波导薄膜的旋涂过程如下:使用1,2-二氯乙烷为溶剂配制质量分数5%的PMMA溶液,用滴管将溶液滴满整个边框围住的区域,以2500rpm的转速旋转2min之后,除去胶带纸,将薄膜放入180℃的烘箱烘烤2h进行交联固化。所得到的薄膜截面示意图如图3(d)所示,中心部分为平坦区域,而在边缘部分薄膜厚度会逐步增加而发生隆起。由于边框的尺寸远远大于电极的尺寸,使得位于电极2正上方的波导薄膜具有良好的平整度及均匀性,满足器件性能的要求。The spin-coating process of the waveguide film is as follows: use 1,2-dichloroethane as a solvent to prepare a 5% PMMA solution with a mass fraction, use a dropper to drip the solution over the area surrounded by the entire frame, and rotate at a speed of 2500rpm for 2min. The adhesive tape was removed, and the film was baked in an oven at 180°C for 2 hours for cross-linking and curing. The cross-sectional schematic diagram of the obtained film is shown in Fig. 3(d), the central part is a flat area, and the film thickness gradually increases at the edge part to bulge. Since the size of the frame is much larger than that of the electrodes, the waveguide film directly above the electrodes 2 has good flatness and uniformity, meeting the requirements of device performance.

在本实施例中,分别采用了50μm、100μm、150μm和200μm高度的台阶,所得薄膜的厚度分别为0.5μm、1μm、1.6μm和2.3μm,如图4所示,而不采用台阶,每次旋涂的厚度在0.1μm以下,可见采用台阶旋涂工艺,特别是采用较高的台阶可有效地增加每次旋涂所得薄膜的厚度。In this example, steps with heights of 50 μm, 100 μm, 150 μm and 200 μm were used respectively, and the thicknesses of the resulting films were 0.5 μm, 1 μm, 1.6 μm and 2.3 μm, respectively, as shown in Figure 4, without using steps, each time The thickness of the spin coating is below 0.1 μm. It can be seen that the step spin coating process, especially the higher step, can effectively increase the thickness of the film obtained by each spin coating.

尽管本发明的初衷是提高PMMA波导薄膜的厚度,但本发明的应用并不限于此,可应用于采用旋涂法制备较厚的薄膜的任何领域。Although the original intention of the present invention is to increase the thickness of the PMMA waveguide film, the application of the present invention is not limited thereto, and can be applied to any field where a thicker film is prepared by a spin coating method.

Claims (5)

1, a kind of method that in spin-coating method, improves prepared film thickness, it is characterized in that, coated basal plate is carried out pre-service, make zone, substrate edge have the step of projection, step forms closed frame, and film spin coating preparation is in the enclosed region that frame forms.
2, the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that, described step is the method formation by spin coating photoresist or Continuous pressing device for stereo-pattern, and the height of step is 5-500 μ m.
3, the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that, the thickness of spin-coated thin film and thickness homogeneous area can be regulated by height, enclosed region area and the shape of regulating step.
4, the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that the shape of described enclosed region is annular or polygon.
5, the method that improves prepared film thickness in spin-coating method according to claim 1 is characterized in that the preparation process of described photoresist step comprises: 1. spin coating photoresist; 2. under mask, expose; 3. develop and form step; 4. high-temperature baking solidifies.
CN2008100455143A 2008-07-10 2008-07-10 Method for improving prepared thin film thickness in rotary coating method Expired - Fee Related CN101324756B (en)

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CN105895809A (en) * 2016-05-09 2016-08-24 浙江海洋大学 Preparation method of ZnO film for inverted polymer solar cell

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EP1721657A1 (en) * 2005-05-13 2006-11-15 SONY DEUTSCHLAND GmbH A method of fabricating a polymeric membrane having at least one pore
JP4884249B2 (en) * 2006-02-28 2012-02-29 日東電工株式会社 Masking tape for substrates
CN100495640C (en) * 2007-01-18 2009-06-03 复旦大学 Thin film pattern preparation method with self-defining boundary

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* Cited by examiner, † Cited by third party
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CN105895809A (en) * 2016-05-09 2016-08-24 浙江海洋大学 Preparation method of ZnO film for inverted polymer solar cell

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