CN101315497B - Display panel and method for manufacturing the same - Google Patents

Abstract

The invention provides a display panel and a manufacturing method thereof. The display panel comprises a first substrate, a second substrate, a liquid crystal layer, a plurality of positioning structures and a plurality of spacing balls. The second substrate is arranged in parallel with the first substrate. The liquid crystal layer is arranged between the first substrate and the second substrate. The plurality of positioning structures are arranged on the first substrate in an array manner. The spacing balls are distributed between the first substrate and the second substrate, are adjacent to the positioning structures, and are contacted with the first substrate and the second substrate so as to space the first substrate and the second substrate at a preset gap. Wherein the spacing between adjacent locating structures is less than the diameter of each spacer ball. According to the display panel and the manufacturing method thereof, the positioning structure is arranged, so that in the drying process of the liquid and the spacing balls, the liquid drives the spacing balls to gather towards the positioning structure through surface tension. The spacer balls can be accurately arranged in the shading area, and the production yield of the display panel is greatly increased.

Description

Display panel and manufacturing method thereof

technical field

The present invention relates to a display panel and its manufacturing method, and in particular to a liquid crystal display panel and its manufacturing method.

Background technique

With the development of flat panel display technology, liquid crystal display panels are more and more widely used in various electronic products. Please refer to FIG. 1 , which shows a schematic diagram of a conventional liquid crystal display panel 900 . The liquid crystal display panel 900 includes a thin film transistor substrate 910 , a color filter substrate 920 , a liquid crystal layer 930 and several spacer balls 950 . The liquid crystal layer 930 and the spacer balls 950 are disposed between the TFT substrate 910 and the color filter substrate 920 . Since the liquid crystal layer 930 is made of a soft material, the spacer ball 950 can be made of a hard material or other slightly soft material. With the support of the spacer ball 950, the thin film transistor substrate 910 and the color filter substrate 920 can be positioned at various positions. are maintained at a predetermined interval.

Since the spacer balls 950 will affect the direction of light refraction, the spacer balls 950 are preferably disposed in the light-shielding area A91 of the liquid crystal display panel 900 , and may also be disposed in an area that does not affect the display in the display area A92 . Taking FIG. 1 as an example, part of the spacer balls 950 have exceeded the light-shielding area A91 , changing the predetermined gap will affect the display quality of the liquid crystal display panel 900 . Therefore, how to precisely place the spacer balls 950 in the light-shielding area A91 has become a long-standing severe challenge.

Contents of the invention

The invention relates to a display panel and a manufacturing method thereof. Through the setting of the positioning structure, the liquid will drive the spacer balls to gather towards the positioning structure during the drying process of the liquid and the spacer balls. Not only can the spacer balls be accurately placed in the light-shielding area, but also the production yield of the display panel can be greatly increased.

According to the object of the present invention, a display panel is proposed. The display panel includes a first substrate, a second substrate, a liquid crystal layer, several positioning structures and several spacer balls. The second substrate is arranged parallel to the first substrate. The liquid crystal layer is arranged between the first substrate and the second substrate. The plurality of positioning structures are arranged in an array on the first substrate. The plurality of spacer balls are distributed between the first substrate and the second substrate and are adjacent to the plurality of positioning structures, and are in contact with the first substrate and the second substrate, so as to space the first substrate and the second substrate in one Book a gap. Wherein, the width of each positioning structure is smaller than the diameter of each spacer ball, and the distance between adjacent positioning structures is smaller than the diameter of each spacer ball.

According to the purpose of the present invention, another method for manufacturing a display panel is provided. The manufacturing method of the display panel includes the following steps: providing a first substrate; forming several positioning structures, and the plurality of positioning structures are arranged in an array on the first substrate; spraying a liquid and several spacer balls on the first substrate above, wherein the width of each of the positioning structures is smaller than the diameter of each of the spacer balls, and the distance between the adjacent positioning structures is smaller than the diameter of each of the spacer balls; dry the first substrate to volatilize the liquid, and make the A plurality of spacer balls are gathered near the plurality of positioning structures. Combining the first substrate and a second substrate in pairs, wherein the plurality of spacer balls are in contact with the first substrate and the second substrate to separate the first substrate and the second substrate at a predetermined gap.

In the display panel and its manufacturing method of the present invention, through the arrangement of the positioning structure, during the drying process of the liquid and the spacer balls, the liquid will drive the spacer balls to accumulate toward the positioning structure through surface tension. Not only can the spacer balls be accurately placed in the light-shielding area, but also the production yield of the display panel can be greatly increased.

Description of drawings

FIG. 1 shows a schematic diagram of a conventional liquid crystal display panel;

FIG. 2 shows a side view of a display panel according to a first embodiment of the present invention;

FIG. 3 shows a schematic diagram of the first substrate and the positioning structure of FIG. 2;

FIG. 4 shows a schematic diagram of spraying liquid and spacer balls on the first substrate and positioning structure of FIG. 3;

FIG. 5 shows a schematic diagram of the dried liquid in FIG. 4;

FIG. 6 shows an enlarged schematic diagram of the positioning structure and spacer balls in FIG. 4;

Fig. 7 depicts a flowchart of a manufacturing method of the positioning structure of Fig. 3;

8A to 8F are schematic diagrams illustrating the steps in FIG. 7;

9 shows a schematic diagram of a first substrate and a positioning structure of a second embodiment;

FIG. 10 shows a schematic diagram of a first substrate and a positioning structure of a third embodiment;

FIG. 11 shows a schematic diagram of a first substrate and a positioning structure of a fourth embodiment;

Fig. 12 depicts an enlarged view of the positioning structure of Fig. 11;

FIG. 13 shows a flowchart of a method for forming a positioning structure of a fifth embodiment;

14A to 14G are schematic diagrams illustrating the steps in FIG. 13;

FIG. 15 shows a flow chart of a method for forming a positioning structure of the sixth embodiment;

16A to 16G are schematic diagrams illustrating the steps in FIG. 15;

FIG. 17 shows a flow chart of the method for forming the positioning structure of the seventh embodiment; and

18A to 18E are schematic diagrams of the steps in FIG. 17 .

Figure number:

100: display panel

110, 210, 310, 410, 510, 610, 710: first substrate

110a, 210a, 310a, 410a: surface of the first substrate

120: second substrate

130, 930: liquid crystal layer

140, 240, 340, 440, 540, 640, 740: positioning structure

150: spacer ball

160: Liquid

171, 571, 671: first metal line

172, 572, 672: second metal line

172': Stud bump

173, 573, 673: insulating layer

174, 574, 674, 774: protective layer

175, 575, 675, 775: transparent electrode layer

210b: Groove

574', 674': pits

780: black shading matrix

791: Red photoresist material

792: Green photoresist material

793: blue photoresist material

790: Color photoresist material

900: Liquid crystal display panel

910: thin film transistor substrate

920: Color filter substrate

950: spacer ball

A11, A91: shading area

A12, A92: display area

B11: Diameter of spacer ball

B12: Radius of spacer ball

D11: Distance between two adjacent positioning structures

D41: Width of positioning structure

H11: Height of the positioning structure

H41: Depth of positioning structure

L11, L31, L41: first straight line

L12, L32, L42: second straight line

W11: Width of the positioning structure

W41: Distance between two adjacent positioning structures

Detailed ways

In order to make the above content of the present invention more obvious and understandable, the following preferred embodiments are specifically cited below, and in conjunction with the accompanying drawings, the detailed description is as follows:

first embodiment

Please refer to FIG. 2 , which shows a side view of the display panel 100 according to the first embodiment of the present invention. The display panel 100 includes a first substrate 110 , a second substrate 120 , a liquid crystal layer 130 , several positioning structures 140 and several spacer balls 150 . The first substrate 110 is, for example, a thin film transistor substrate (Thin Film Transistor Substrate, TFT Substrate), and the second substrate 120 is, for example, a color filter substrate (Color Filter Substrate). The first substrate 110 and the second substrate 120 are arranged in parallel, and the liquid crystal layer 130 is arranged between the first substrate 110 and the second substrate 120 . The plurality of spacer balls 150 are distributed between the first substrate 110 and the second substrate 120, and are adjacent to the plurality of positioning structures 140, and are in contact with the first substrate 110 and the second substrate 120 to space the first substrate 110 and the second substrate 120. The substrate 110 and the second substrate 120 are at a predetermined gap. The plurality of positioning structures 140 are preferably disposed in the light-shielding area A11 of the display panel 100 , so that the spacer balls 150 gather in the light-shielding area A11 and do not shift into the display area A12 .

Please refer to FIG. 3 , which shows a schematic diagram of the first substrate 110 and the positioning structure 140 in FIG. 2 . As shown in FIG. 3 , the positioning structures 140 are arranged in an array on the first substrate 110 . The positioning structure 140 is, for example, a protrusion, which may be an upright columnar protrusion, a flat elongated protrusion, a semicircular protrusion or a tapered protrusion. In this embodiment, the positioning structure 140 is illustrated by taking an upright columnar bump as an example.

As shown in FIG. 3 , each positioning structure 140 protrudes from the surface 110 a of the first substrate 110 . Part of the positioning structures 140 are arranged along several first straight lines L11 parallel to each other, and part of the positioning structures 140 are arranged along several second straight lines L12 parallel to each other. Wherein, each first straight line L11 is substantially perpendicular to each second straight line L12, and the first straight line L11 and the second straight line L12 are interlaced to form a right-angle array structure. The plurality of positioning structures 140 are substantially located at intersections of the first straight line L11 and the second straight line L12 , forming a dotted array.

Please refer to FIG. 4 , which shows a schematic diagram of spraying the liquid 160 and the spacer balls 150 on the first substrate 110 and the positioning structure 140 in FIG. 3 . When the liquid 160 and the spacer balls 150 are sprayed together on the first substrate 110 and the positioning structure 140, since the liquid 160 easily forms a surface tension difference with the positioning structure 140, the liquid 160 will drive the spacer balls 150 toward The positioning structures 140 are clustered.

Please refer to FIG. 5 , which shows a schematic view of the dried liquid 160 in FIG. 4 . When the liquid 160 is completely dry, the spacer balls 150 gather near the positioning structure 140 .

Please refer to FIG. 6 , which shows an enlarged schematic view of the positioning structure 140 and the spacer ball 150 in FIG. 4 . The spacing D11 of the positioning structures 140 satisfies the following relationship (1), and the spacing D11 of two adjacent positioning structures 140 is smaller than the diameter B11 of each spacer ball 150 . The distance D11 between two adjacent positioning structures 150 can just accommodate one spacer ball 150 , so that the spacer ball 150 will not move back and forth between the two positioning structures 140 . Therefore, during the drying process of the liquid 160 , the unpositioned spacer balls 150 can be gathered toward the positioned spacer balls 150 due to the surface tension difference of the liquid 160 .

D11<B11…………………………………(1)

In addition, when the height H11 of the positioning structure 140 satisfies the following relational expressions (2) and (3), the height H11 of the positioning structure takes one-twentieth of the diameter B11 of the spacer ball 150 as the lower limit, so that the positioned space The ball 150 does not easily span the locating structure 140 . Furthermore, the height H11 of the positioning structure 140 takes the diameter B11 of the spacer ball 150 as the upper limit, and the width W11 of the positioning structure 140 takes the diameter B11 of the spacer ball 150 as the upper limit, and is preferably smaller than the radius B12 of the spacer ball 150, so that The positioned spacer balls 150 are in direct contact with the unpositioned spacer balls 150 to maintain a good aggregation effect.

B11×1/20<H11<B11………………………(2)

W11＜B12…………………………………(3)

According to the experimental results, when the height H11 of the positioning structure 140 satisfies the following relationship (4), the positioned spacer balls 150 are less likely to cross the positioning structure 140 . Moreover, when the height H11 of the positioning structure 140 is smaller than the radius B12 of each spacer ball 150 , the experimental results also show that the positioned spacer balls 150 can be directly contacted with the unpositioned spacer balls 150 to maintain a good aggregation effect.

B11×1/10<H11<B12……………………(4)

Wherein, as shown in FIG. 2 , the positioning structure 140 is arranged in the light-shielding area A11 of the display panel 100, and the light-shielding area A11 of the display panel 110 is, for example, an area where metal lines are arranged or a black matrix (Black Matrix) is arranged. In this embodiment, the positioning structure 140 is disposed in the area of the common electrode line (Common Line). In order to clearly illustrate the manufacturing method of the positioning structure 140 of this embodiment, a flow chart and several schematic diagrams are used below to illustrate.

Please refer to FIG. 7 and FIGS. 8A-8F at the same time. FIG. 7 shows a flow chart of the manufacturing method of the positioning structure 140 in FIG. 3 , and FIGS. 8A-8F show schematic diagrams of each step in FIG. 7 .

First, as shown in FIG. 8A , in step S11 , a first substrate 110 is provided.

Next, as shown in FIG. 8B , in step S12 , a first metal circuit 171 is formed on the first substrate 110 . In this embodiment, the first metal line 171 is a common electrode line (Common Line).

Then, as shown in FIG. 8C , in step S13 , an insulating layer 173 is formed on the first metal line 171 .

Next, as shown in FIG. 8D , in step S14 , a second metal line 172 is formed on the first metal line. At the same time as this step, several stud bumps 172' of the same material as the second metal line 172 are formed on the first metal line 171, wherein the plurality of stud bumps 172' are arranged in an array as shown in FIG. 3 disposed on the first substrate 110 .

Then, as shown in FIG. 8E , in step S15, a protection layer 174 is formed on the second metal line 172 and the stud bump 172'.

Next, as shown in FIG. 8F , in step S16 , a transparent electrode layer 175 is formed on the passivation layer 174 . So far, the stud bumps 172', the protective layer 174 and the transparent conductive layer 175 are stacked to form several positioning structures 140.

Although the structure and forming method of the positioning structure 140 in the first embodiment are described by taking the above-mentioned embodiment as an example, the structure and forming method of the positioning structure 140 are not limited to the above content, for example, the following second to seventh embodiments said content. The contents described in the following examples are hereby briefly organized as follows:

In addition to the positioning structure 140 protruding from the surface 110 a of the first substrate 110 , the positioning structure 140 can also be disposed in a groove of the first substrate 110 , please refer to the content described in the second embodiment below.

In addition, the positioning structure 140 may not only be an upright columnar protrusion, but also a flat elongated protrusion, please refer to the content described in the third embodiment below.

Furthermore, the positioning structure 140 can be not only a bump, but also a concave hole, please refer to the content described in the fourth embodiment below.

In addition, the material of the positioning structure 140 can be formed not only by the stud bumps 172' containing metal materials, but also by the recesses of the protection layer 174. Please refer to the content described in the fifth and sixth embodiments below. .

Furthermore, the positioning structure 140 can be formed not only on the common electrode line, but also on the gate line (Gate Line), please refer to the content described in the sixth embodiment below.

Moreover, in addition to the thin film transistor substrate, the first substrate 110 used for disposing the positioning structure 140 may also be a color filter substrate. Correspondingly, the positioning structure 140 is formed by bumps containing a colored photoresist material, please refer to the content described in the seventh embodiment below.

second embodiment

Please refer to FIG. 9 , which shows a schematic diagram of the first substrate 210 and the positioning structure 240 of the second embodiment. The difference between this embodiment and the first embodiment lies in that the first substrate 210 of this embodiment has a groove 210b, and each positioning structure 240 is disposed in the groove 210b, and the rest of the similarities will not be repeated.

As shown in FIG. 9 , the positioning structure 210 does not have to be disposed on the surface 210 a of the first substrate 210 , and the designer can also arrange the positioning structures 240 in an array in the groove 210 b according to product requirements. When the liquid 160 and the spacer ball 150 are sprayed on the first substrate 210 and the positioning structure 240 (the liquid 160 and the spacer ball 150 are shown in FIG. 4 ), since the liquid 160 easily forms surface tension with the positioning structure 240 and the groove 210b , therefore, during the drying process of the liquid 160, the liquid 160 will drive the spacer balls 150 to accumulate towards the positioning structure 240 and the groove 210b.

third embodiment

Please refer to FIG. 10 , which shows a schematic diagram of the first substrate 310 and the positioning structure 340 of the third embodiment. The difference between this embodiment and the first embodiment lies in that each positioning structure 340 is a strip-shaped protrusion, and the rest of the similarities will not be repeated.

As shown in FIG. 10 , each positioning structure 340 protrudes from the surface 310 a of the first substrate 310 . And part of the positioning structures 340 are arranged along several first straight lines L31 parallel to each other, and part of the positioning structures 340 are arranged along several second straight lines L32 parallel to each other. The plurality of positioning structures 340 are substantially interwoven along the first straight line L31 and the second straight line L32 to form a mesh array. When the liquid 160 and the spacer balls 150 are sprayed on the first substrate 310 and the positioning structure 340 (the liquid 160 and the spacer balls 150 are shown in FIG. 4 ), since the liquid 160 is easily interwoven with the positioning structure 340 into a network array Surface tension is formed, so during the drying process of the liquid 160 , the liquid 160 will drive the spacer balls 150 to gather towards the network array formed by the positioning structures 340 .

Fourth embodiment

Please refer to FIG. 11 , which shows a schematic diagram of the first substrate 410 and the positioning structure 440 of the fourth embodiment. The difference between this embodiment and the first embodiment lies in that each positioning structure 440 is a concave hole, and the rest of the similarities will not be repeated.

As shown in FIG. 11 , each positioning structure 440 is formed by a downwardly recessed rectangular cavity on the surface 410a of the first substrate 410, and part of the positioning structures 440 are arranged along several first straight lines L41 parallel to each other. Part of the positioning structures 440 are arranged along several second straight lines L42 parallel to each other. The plurality of positioning structures 440 are substantially interwoven into an array along the first straight line L41 and the second straight line L42 .

Please refer to FIG. 12 , which shows an enlarged view of the positioning structure 440 in FIG. 11 . Wherein, when the width D41 of positioning structure 440 satisfies the following relationship (5), the width D41 of each positioning structure 440 is less than the diameter B11 of each spacer ball 150, so that each positioning structure 440 can only accommodate one spacer ball 150, so that the spacer Ball 150 will not move within positioning structure 440 . Therefore, during the drying process of the liquid 160 , the unpositioned spacer balls 150 can be gathered toward the positioned spacer balls 150 due to the surface tension difference of the liquid 160 .

D41＜B11…………………………………(5)

In addition, when the depth H41 of the positioning structure 440 satisfies the following relational expressions (6) and (7), the depth H41 of the positioning structure takes one-twentieth of the diameter B11 of the spacer ball 150 as the lower limit, so that the positioned space The ball 150 does not easily cross the inner wall of the positioning structure 440 . Furthermore, the depth H41 of the positioning structure 440 takes the diameter B11 of the spacer ball 150 as the upper limit, and the distance W41 between two adjacent positioning structures 440 takes the diameter B11 of the spacer ball 150 as the upper limit, and is preferably smaller than the radius of the spacer ball 150 B12, the positioned spacer balls 150 can be directly contacted with the unpositioned spacer balls 150 to maintain a good aggregation effect.

B11×1/20<H41<B11………………………(6)

W41＜B12…………………………………(7)

According to the experimental results, when the depth H41 of the positioning structure 440 satisfies the following relationship (8), it is less likely for the positioned spacer balls 150 to cross the inner wall of the positioning structure 440 . Moreover, when the depth H41 of the positioning structure 440 is smaller than the radius B12 of each spacer ball 150 , the experimental results also show that the positioned spacer balls 150 can be directly contacted with the unpositioned spacer balls 150 to maintain a good aggregation effect.

B11×1/10<H41<B12……………………(8)

fifth embodiment

Please refer to FIG. 13 and FIGS. 14A to 14G at the same time. FIG. 13 is a flow chart of the method for forming the positioning structure 540 of the fifth embodiment, and FIGS. 14A to 14G are schematic diagrams of each step in FIG. 13 . The difference between this embodiment and the first embodiment is that the positioning structure 540 is formed by etching the protection layer 574, and the positioning structure 540 adopts the structure of the fourth embodiment, and the rest of the similarities will not be repeated. .

First, as shown in FIG. 14A, in step S51, a first substrate 510 is provided.

Next, as shown in FIG. 14B , in step S52 , a first metal circuit 571 is formed on the first substrate 510 . In this embodiment, the first metal line 571 is a common electrode line.

Then, as shown in FIG. 14C , in step S53 , an insulating layer 573 is formed on the first metal line 571 .

Next, as shown in FIG. 14D , in step S54 , a second metal line 572 is formed on the first metal line 571 .

Then, as shown in FIG. 14E , in step S55 , a protection layer 574 is formed on the second metal line 572 .

Next, as shown in FIG. 14F , in step S56, the protection layer 574 is etched to form several rectangular cavities 574'. The plurality of rectangular cavities 574', for example, adopts the arrangement of the fourth embodiment.

Then, as shown in FIG. 14G , in step S57, a transparent electrode layer 575 is formed on the protective layer 574 and its rectangular cavity 574'. So far, the positioning structure 540 is formed at the depression corresponding to the rectangular cavity 574'.

Sixth embodiment

Please refer to FIG. 15 and FIGS. 16A-16G at the same time. FIG. 15 shows a flow chart of the method for forming the positioning structure 640 of the sixth embodiment, and FIGS. 16A-16G show schematic diagrams of the steps in FIG. 15 . The difference between this embodiment and the first embodiment is that the first metal line 671 is used as a gate line and the positioning structure 640 is formed on the first metal line 671 as a gate line, and the rest of the same points are not repeated. stated.

First, as shown in FIG. 16A, in step S61, a first substrate 610 is provided.

First, as shown in FIG. 16B , in step S62 , a first metal circuit 671 is formed on the first substrate 610 . In this embodiment, the first metal line 671 is a gate line.

Then, as shown in FIG. 16C , in step S63 , an insulating layer 673 is formed on the first metal line 671 .

Next, as shown in FIG. 16D , in step S64 , a second metal line 672 is formed on the first metal line 673 .

Then, as shown in FIG. 16E , in step S65 , a protection layer 674 is formed on the second metal line 672 .

Next, as shown in FIG. 16F , in step S66, the protective layer 674 is etched to form several rectangular cavities 674'. The arrangement of the plurality of rectangular cavities 674' can adopt the arrangement of the fourth embodiment.

Then, as shown in FIG. 16G , in step S67, a transparent electrode layer 675 is formed on the protective layer 674 and its rectangular cavity 674'.

So far, the positioning structure 640 is formed at the depression corresponding to the rectangular cavity 674'.

Seventh embodiment

Please refer to FIG. 17 and FIGS. 18A-18E at the same time. FIG. 17 shows a flow chart of the method for forming the positioning structure 740 of the seventh embodiment, and FIGS. 18A-18E show schematic diagrams of each step in FIG. 17 . The difference between this embodiment and the first embodiment is that the first substrate 710 is a color filter substrate, the material of the positioning structure 740 is a color photoresist material 790 and the positioning structure 740 is arranged on the black light-shielding matrix 780 above, the rest of the similarities will not be repeated.

First, as shown in FIG. 18A, in step S71, a first substrate 710 is provided.

Next, as shown in FIG. 18B , in step S72 , a black light-shielding matrix (Black Matrix) 780 is formed on the first substrate 710 .

Then, as shown in FIG. 18C , in step S73 , a plurality of colored photoresist materials 790 are formed on the first substrate 710 . In this embodiment, three primary color photoresist materials (or called filter materials) 790 (such as red photoresist material 791, green photoresist material 792 and blue photoresist material) are formed in three steps. 793). At the same time of this step, the red photoresist material 791 , the green photoresist material 792 and the blue photoresist material 793 are stacked on the black light-shielding matrix 780 .

Then, as shown in FIG. 18D , in step S74 , a protection layer 774 is formed on the color photoresist material 790 .

Next, as shown in FIG. 18E , in step S75 , a transparent electrode layer 775 is formed on the protective layer 774 . So far, corresponding to the stacked red photoresist material 791 , green photoresist material 792 and blue photoresist material 793 , the positioning structure 740 is formed.

In the display panel and its manufacturing method disclosed in the above-mentioned embodiments of the present invention, through the arrangement of the positioning structure, during the drying process of the liquid and the spacer balls, the liquid will drive the spacer balls to accumulate towards the positioning structure through surface tension. Not only can the spacer balls be accurately placed in the light-shielding area, but also the production yield of the display panel can be greatly increased.

To sum up, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Relevant persons in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims (25)

1. a display panel is characterized in that, described display panel comprises:

One first substrate;

One second substrate be arranged in parallel with described first substrate;

One liquid crystal layer is to be arranged between described first substrate and described second substrate;

A plurality of location structures are that the array arrangement is arranged on described first substrate; And

A plurality of separating balls are to be distributed between described first substrate and described second substrate and to be adjacent to described a plurality of location structure, and are contacted with described first substrate and described second substrate, with described first substrate and described second substrate at interval in a predetermined gap;

Wherein, the width of each described location structure is less than the diameter of each described separating ball, and the spacing of adjacent described a plurality of location structures is less than the diameter of each described separating ball.

2. display panel as claimed in claim 1 is characterized in that, described a plurality of location structures comprise three at least.

3. display panel as claimed in claim 1 is characterized in that, described a plurality of separating balls are to be distributed in the shading region.

4. display panel as claimed in claim 1 is characterized in that, the height of each described location structure is greater than 1/20th of the diameter of each described separating ball.

5. display panel as claimed in claim 1 is characterized in that the height of each described location structure is less than the diameter of each described separating ball.

6. display panel as claimed in claim 1 is characterized in that, described a plurality of location structures comprise a plurality of projections.

7. display panel as claimed in claim 6 is characterized in that, each described location structure comprises a column-like projection block.

8. display panel as claimed in claim 6 is characterized in that, each described location structure comprises a strip projection.

9. display panel as claimed in claim 6 is characterized in that, each described location structure is the surface that protrudes from described first substrate.

10. display panel as claimed in claim 6 is characterized in that, described first substrate has at least one groove, and each described location structure is to be arranged in the described groove.

11. display panel as claimed in claim 1 is characterized in that, described a plurality of location structures comprise a plurality of potholes.

12. display panel as claimed in claim 1 is characterized in that, described a plurality of location structures of part are along a plurality of first line spread that are parallel to each other, and described a plurality of location structures of part are along a plurality of second line spread that are parallel to each other.

13. display panel as claimed in claim 12 is characterized in that, described a plurality of first straight lines are in fact perpendicular to described a plurality of second straight lines.

14. display panel as claimed in claim 12 is characterized in that, described a plurality of location structures are to be column-like projection block, and described a plurality of location structure is positioned at the intersection point of described a plurality of first straight line and described a plurality of second straight lines in fact.

15. display panel as claimed in claim 12 is characterized in that, described a plurality of location structures are to be the strip projection, and described a plurality of location structure is woven into a mesh array along described a plurality of first straight lines and described a plurality of second straight line in fact.

16. display panel as claimed in claim 1 is characterized in that, described first substrate is to be thin film transistor base plate, and described display panel comprises many grid circuits, and described a plurality of location structures are to be arranged on described a plurality of grid circuit.

17. display panel as claimed in claim 1 is characterized in that, described first substrate is to be thin film transistor base plate, and described display panel comprises many common electrode circuits, and described a plurality of location structures are to be arranged on described many common electrode circuits.

18. display panel as claimed in claim 1 is characterized in that, described first substrate is to be colored filter substrate, and described display panel comprises a plurality of black shading matrixs, and each described location structure is to be arranged on described a plurality of black shading matrix.

19. display panel as claimed in claim 1 is characterized in that, the material of described a plurality of location structures comprises metal material.

20. display panel as claimed in claim 1 is characterized in that, the material of described a plurality of location structures comprises colored photoetching glue material.

21. display panel as claimed in claim 1 is characterized in that, the material of described a plurality of location structures comprises insulating material.

22. the manufacture method of a display panel is characterized in that, described method comprises:

One first substrate is provided;

Form a plurality of location structures, described a plurality of location structures are that the array arrangement is arranged on described first substrate;

Spray a liquid and a plurality of separating ball on described location structure, wherein the width of each described location structure is less than the diameter of each described separating ball, and the spacing of adjacent described a plurality of location structures is less than the diameter of each described separating ball;

Dry described first substrate, with the described liquid that volatilizees, and make described a plurality of separating ball be gathered in described a plurality of location structures near; And

In pairs described first substrate of combination and one second substrate, wherein said a plurality of separating balls are contacted with described first substrate and described second substrate, with described first substrate and described second substrate at interval in a predetermined gap.

23. the manufacture method of display panel as claimed in claim 22 is characterized in that, described first substrate is to be a thin film transistor base plate, and the step that forms described location structure comprises:

Form one first metallic circuit on described first substrate;

Form one second metallic circuit and several projections on described first metallic circuit, the material of wherein said second metallic circuit is identical with the material of described a plurality of projections;

Form a protective seam on described second metallic circuit and described a plurality of projection; And

Form a transparent electrode layer on described protective seam.

24. the manufacture method of display panel as claimed in claim 22 is characterized in that, described first substrate is to be a thin film transistor base plate, and the step that forms described location structure comprises:

Form one first metallic circuit on described first substrate;

Form one second metallic circuit on described first substrate;

Form a protective seam on described second metallic circuit and described first metallic circuit;

The described protective seam of etching is to form several potholes; And

Form a transparent electrode layer on described protective seam and pothole thereof.

25. the manufacture method of display panel as claimed in claim 22 is characterized in that, described first substrate is to be a colored filter substrate, and the step that forms described location structure comprises:

Form a black shading matrix on described first substrate;

Form a plurality of colored photoetching glue materials on described first substrate, some of described a plurality of colored photoetching glue materials are to be stacked on the described black shading matrix and to form several projections; And

Form a transparent electrode layer on described a plurality of colored photoetching glue materials and described a plurality of projection.

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