CN101315489A - Side direction type light emitting module - Google Patents

Abstract

The invention relates to a lateral light-emitting module which comprises a heat conduction frame, a metal substrate circuit board, a light guide plate and a light-emitting diode. The metal substrate circuit board is arranged on the heat conduction frame, the light guide plate is provided with a light-emitting surface, the metal substrate circuit board is arranged adjacent to the light guide plate and is substantially parallel to the light-emitting surface of the light guide plate, the light-emitting diode is provided with a side light-emitting surface and a bottom surface, and the light-emitting diode is adhered to the metal substrate circuit board by the bottom surface. Compared with the prior art, the thickness of the lateral light-emitting module can be effectively reduced, and the area of the wiring on the surface of the metal substrate circuit board can be increased. In addition, the heat energy of the light emitting diode can be transferred to the heat conduction frame through the metal substrate circuit board to further assist heat dissipation.

Description

side light module

technical field

The invention relates to a light emitting module, in particular to a side light emitting module.

Background technique

A light-emitting diode is a light-emitting element made of semiconductor materials. The element has two electrode terminals, and a very small voltage is applied between the terminals. Through the combination of electrons and holes, energy can be excited and released in the form of light.

Different from ordinary incandescent light bulbs, light-emitting diodes are cold-emitting, which have the advantages of low power consumption, long life of components, no need for warm-up time, and fast response. Coupled with its small size, vibration resistance, suitable for mass production, it is easy to make extremely small or arrayed components according to application requirements. At present, light-emitting diodes have been widely used in indicators, advertising billboards, and display devices of information, communication, and consumer electronics products, and have become indispensable and important electronic components in daily life. Recently, light-emitting diodes have been used as light sources for backlight modules in liquid crystal displays (LCDs), and tend to gradually replace traditional cold-cathode fluorescent tubes as light sources.

Please refer to FIG. 1 , which is a schematic diagram of a side-to-side backlight module in a conventional liquid crystal display. The side-facing backlight module 1 includes a frame body 11 , a plurality of LEDs 12 , a flexible circuit board (FPC) 13 , a light source cover 14 , a light guide plate 15 and a reflector 16 . The frame body 11 is a hollow rectangular frame body, the LEDs 12 are arranged on the flexible circuit board 13, and a part of the flexible circuit board 13 passes through the frame body 11 and connects with the driving circuit board (not shown in the figure) are electrically connected, and the light source cover 14 is connected to one side of the frame body 11 .

Please refer to FIG. 2 , which is a schematic cross-sectional view of the assembled side-type backlight module 1 along the line D-D in FIG. 1 . The LED 12 has a chip 121 , a lead frame 122 and a plastic casing 123 . The chip 121 is disposed on the lead frame 122 , and the plastic shell 123 covers a part of the lead frame 122 to expose the wire (lead, L). The surface of the light emitting diode 12 is adhered to the flexible circuit board 13, and then the flexible circuit board 13 is flatly attached to the light source cover 14 by using colloid P, and the light emitted by the chip 121 is reflected by the reflective layer on the inner wall of the plastic housing 123 , and inject the plastic shell 123 .

These light emitting diodes 12 are arranged in a row facing a light incident surface 151 of the light guide plate 15 , when the light emitted by the light emitting diodes 12 enters the light guide plate 15 through the light incident surface 151 , the light will travel completely in the light guide plate 15 . Reflect and achieve the effect of light mixing, and when the light passes through the printed dots on the bottom surface of the light guide plate 15, it will scatter and destroy the total reflection phenomenon of the light, causing part of the light to refract out of the light-emitting surface 152 of the light guide plate 15 to form a side light source. In addition, the reflection sheet 16 disposed on the bottom surface of the light guide plate 15 can improve the light utilization efficiency of the side-facing backlight module 1 .

However, the thermal energy emitted by the light emitting diodes 12 is conducted by the flexible circuit board 13 with poor thermal conductivity to the metal light source cover 14 through the colloid P with high thermal resistivity, thereby assisting heat dissipation. It can be seen from this that the heat dissipation effect of the LED 12 is not good, and even the luminous efficacy of the LED 12 will be reduced.

Therefore, how to provide a light-emitting module that can solve the heat dissipation problem is one of the current important issues.

Contents of the invention

The purpose of the present invention is to overcome the defects existing in the existing light-emitting modules, and provide a lateral light-emitting module with a new structure that can improve heat dissipation efficiency, which is very suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A side light-emitting module proposed according to the present invention includes: a heat conduction frame; a metal substrate circuit board arranged on the heat conduction frame; a light guide plate having a light emitting surface, and the metal substrate circuit board is arranged adjacent to the light guide plate and is substantially parallel to the light emitting surface of the light guide plate; and a light emitting diode has one side light emitting surface and a bottom surface, and the light emitting diode is adhered to the metal substrate on the bottom surface circuit board.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

The aforesaid lateral light-emitting module further includes: a reflector connected to the heat conducting frame.

The aforesaid lateral light-emitting module further includes: a frame combined with the heat conduction frame, and the heat conduction frame is a heat conduction side frame.

In the aforementioned lateral light-emitting module, the metal substrate circuit board is a circuit board with a metal core.

In the aforementioned lateral light-emitting module, the metal core is made of aluminum or aluminum alloy.

The aforesaid lateral light-emitting module further includes: a reflective sheet disposed on a bottom surface of the light guide plate, and the bottom surface is disposed opposite to the light-emitting surface of the light guide plate.

In the aforementioned lateral light-emitting module, the light-emitting diode is a light-emitting diode element or a bare crystal.

In the aforementioned lateral light-emitting module, the light-emitting diode further has a bare crystal, a substrate and a packaging body, the bare crystal is electrically connected to the substrate, and the packaging body covers the bare crystal.

In the aforementioned lateral light-emitting module, the substrate is a printed circuit board or a lead frame.

In the aforementioned lateral light-emitting module, the light-emitting diode further has a plastic reflector, and the plastic reflector has an accommodating space, and the die is located in the accommodating space.

In the above-mentioned side light emitting module, wherein the lead frame extends to the bottom surface of the light emitting diode.

In the aforementioned lateral light-emitting module, the package body fills the accommodating space.

In the aforementioned side-light emitting module, the side light-emitting surface is substantially parallel to a light-incident surface of the light guide plate.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. As can be seen from the above, in order to achieve the above purpose, the present invention provides a lateral light emitting module comprising a heat conducting frame, a metal substrate circuit board, a light guide plate and a light emitting diode. The metal substrate circuit board is arranged on the heat conduction frame, the light guide plate has a light emitting surface, and the metal substrate circuit board is arranged adjacent to the light guide plate and substantially parallel to the light emitting surface of the light guide plate. The light-emitting diode has one side light-emitting surface and a bottom surface, and the light-emitting diode is adhered to the metal substrate circuit board on the surface of the bottom surface.

With the above-mentioned technical solution, the lateral light-emitting module of the present invention has at least the following advantages and beneficial effects:

In the lateral light-emitting module of the present invention, the surface of the light-emitting diode is adhered to the metal substrate circuit board. Compared with the existing conventional technology, since the surface of the light-emitting diode is adhered to the metal-based circuit board, and the heat-conducting effect of the metal-based circuit board is better, the light-emitting diode can have better heat dissipation efficiency, thereby improving the light-emitting mode. Group product quality. Furthermore, the metal base circuit board is laid flat in the side light-emitting module, so the area of wiring on the surface of the metal base circuit board can be increased.

To sum up, a lateral light emitting module of the present invention includes a heat conducting frame, a metal substrate circuit board, a light guide plate and a light emitting diode. The metal substrate circuit board is arranged on the heat conducting frame, the light guide plate has a light-emitting surface, the metal substrate circuit board is adjacent to the light guide plate and is substantially parallel to the light-emitting surface of the light guide plate, and the light-emitting diode has a light-emitting surface on one side. and a bottom surface, the light-emitting diode is adhered to the metal substrate circuit board on the surface of the bottom surface. Compared with the prior art, the thickness of the lateral light-emitting module can be effectively reduced, and the wiring area on the surface of the metal substrate circuit board can be increased. In addition, the heat energy of the light-emitting diodes can be transferred to the heat-conducting frame through the metal substrate circuit board to further assist in heat dissipation. The present invention has the above-mentioned many advantages and practical value, and it has great improvement in both device structure and function, and has made remarkable progress in technology, and has produced easy-to-use and practical effects, and is superior to the existing light-emitting modules. The utility model has enhanced outstanding functions, is more suitable for practical use, and has extensive industrial application value. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram showing a side-to-side backlight module in a conventional liquid crystal display.

FIG. 2 is a schematic cross-sectional view of the assembled side-type backlight module in FIG. 1 along the line D-D.

FIG. 3 is a schematic diagram showing the side-light emitting module according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view showing a part of the assembled light-emitting module of FIG. 3 along the line A-A.

FIG. 5A is an enlarged schematic view showing the light emitting diode in the first embodiment.

FIG. 5B is another enlarged schematic view of the LED shown in the first embodiment.

FIG. 6 is a schematic diagram showing a side light emitting module according to a second embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view showing a part of the assembled light-emitting module of FIG. 6 along the line B-B.

FIG. 8 is a schematic diagram showing a side light emitting module according to a third embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view showing a part of the line C-C after the light-emitting module of FIG. 8 is assembled.

1: Side-facing backlight module 2, 3, 3’: Side-facing lighting module

11: Frame 12, 24, 24’, 34: Light-emitting diodes

121: chip 122: lead frame

123: Plastic shell 13: Flexible circuit board

14: Light source cover 15, 23, 33: Light guide plate

151, 233: light incident surface 152, 232: light exit surface

16, 25, 35: Reflector 21, 31: Thermal rack

22, 32: metal substrate circuit board 231, 246: bottom surface

241: bare crystal 242: substrate

243: Package body 244, 244': Plastic reflector

245: Side light emitting surface 26: Thermally conductive material

27: Reflector 37, 37’: Frame

371': Bottom 372: Bearing part

A-A, B-B, C-C, D-D: straight line H: heat sink

L, L': pins L1: connection surface

P: Colloid P1: Perforated

S: storage space

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of the lateral light-emitting module proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its effect is described in detail below.

Please refer to FIG. 3 to FIG. 5 to illustrate the side light emitting module according to the first embodiment of the present invention.

Please refer to FIG. 3 , the side-light emitting module 2 of the preferred embodiment of the present invention includes a heat conducting frame 21 , a metal substrate circuit board 22 , a light guide plate 23 and a light emitting diode 24 . Wherein, the side light emitting module 2 can be a lighting module for daily lighting, a light source module of a scanner, a light source of an outdoor display or a backlight module of a liquid crystal display device. In this embodiment, the light emitting module 2 is an example of a backlight module of a liquid crystal display device.

Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 4 is a schematic cross-sectional view of a part of the assembled light emitting module 2 along the line A-A in FIG. 3 .

In this embodiment, the side light emitting module 2 may further include a reflective sheet 25 , the reflective sheet 25 is disposed on a bottom surface 231 of the light guide plate 23 , and the bottom surface 231 is disposed opposite to a light emitting surface 232 of the light guide plate 23 . The heat conducting frame 21 is a rectangular frame as an example. The heat conducting frame 21 supports the light guide plate 23 and the reflector 25 .

A Metal Core Printed Circuit Board (MCPCB) 22 is disposed on the heat conducting frame 21 . Here, the metal base circuit board 22 refers to a circuit board or a printed circuit board having a metal core (such as aluminum or aluminum alloy), and the metal base circuit board 22 has a relatively high conductivity. On the surface of the metal substrate circuit board 22 , there may be a metal wire pattern, which is electrically connected to the LED 24 . In addition, since the metal substrate circuit board 22 is laid flat and adjacent to the light emitting diode 24, it is compared with the conventional practice of standing upright on the side of the light emitting diode 24, which reduces the cost of the side light emitting module 2. The advantage of thickness, coupled with the way of laying flat, so the area of the metal substrate circuit board 22 can be made larger, and its surface can have more metal wire patterns, which is beneficial to the design and layout of the wiring.

In addition, the side-light emitting module 2 may further include a heat-conducting material 26 located between the metal substrate circuit board 22 and the heat-conducting frame 21 . The heat conduction material 26 is, for example, heat conduction paste, heat conduction silica gel, heat conduction glue or heat conduction pad, which can improve the bonding reliability and the bonding flatness of the metal substrate circuit board 22 and the heat conducting frame 21 .

The light guide plate 23 is usually made of polycarbonate (PC), polymethyl methacrylate (PMMA) or acrylic resin, the light guide plate 23 has a light emitting surface 232, and the metal substrate circuit board 22 is adjacent to the The light guide plate 23 is substantially parallel to the light emitting surface 232 of the light guide plate 23 , that is to say, the metal substrate circuit board 22 is lying flat and adjacent to the light guide plate 23 .

The LED 24 can be an LED device or a die. In this embodiment, the lateral light-emitting module 2 is taken as an example with a plurality of LED elements, and the light emitted by each LED element can be the same or different (for example, it can be mixed into white light).

As shown in FIG. 4 , the LED 24 has a bare die 241 , a substrate 242 , a package 243 and a plastic reflector 244 . Wherein, the die 241 is electrically connected to the substrate 242, and the substrate 242 can be a printed circuit board or a lead frame. In this embodiment, the substrate 242 is used as a lead frame as an example. The plastic reflector 244 can be injection molded, using plastic to cover at least a part of the lead frame. The plastic reflector 244 has an accommodating space S, the die 241 is located in the accommodating space S, and the package body (its material is, for example, silica gel or epoxy resin) 243 covers the die 241 and is filled in the accommodating space S . In addition, the inner wall of the plastic reflector 244 has a reflective layer to reflect the light emitted by the die 241 out of the plastic reflector 244 .

Of course, if the light emitting diode 24 is a bare chip, the bare chip can also be bonded to the substrate 242 by means of wire bonding, flip chip bonding, or surface adhesion.

As shown in FIG. 4 , the side light-emitting surface 245 of the LED 24 is substantially perpendicular to the metal base circuit board 22 . The light emitted by the side light-emitting surface 245 is directly incident on a light incident surface 233 adjacent to the light guide plate 23, and the light will be totally reflected in the light guide plate 23 to achieve the effect of light mixing, and when the light passes through the bottom surface 231 of the light guide plate When the dots are printed, it will scatter and destroy the total reflection phenomenon of the light, causing part of the light to be refracted out of the light-emitting surface 232 of the light guide plate 23 to form a one-sided light source.

In this embodiment, the side light emitting module 2 can further include a reflector 27, which is connected to the heat conducting frame 21, so that the light emitted by the light emitting diode 24 can be directed to the light guide plate 23, and the utilization rate of light can be improved. . Wherein, the way of combining the reflection cover 27 and the heat conducting frame 21 can be, for example, locking, adhering, engaging, welding and so on.

Next, please refer to FIG. 5A , which is an enlarged schematic view of the light emitting diode 24 in the first embodiment. The light emitting diode 24 has a side light emitting surface 245 and a bottom surface 246 , wherein the side light emitting surface 245 is the light emitting surface of the light emitting diode 24 . In this embodiment, the pin L of the LED 24 is bent on both sides of the plastic reflector 244, and the LED 24 is a Side Emitting Type LED element, that is, the side of the LED 24 emits light. The surface 245 is substantially 90 degrees from the portion of the connection surface L1 of the lead L of the lead frame.

Please refer to FIG. 4 and FIG. 5A at the same time. The part of the pin L is surface mounted on the metal substrate circuit board 22 by means of solder or the like. In this way, the heat dissipation path is the same as the electrical conduction path, which is conducted from the bare die 241 of the LED 24 to the pin L of the lead frame. Then, the heat energy is transferred to the heat-conducting frame 21 through the metal-based circuit board 22 and the heat-conducting material 26 to assist heat dissipation.

Please refer to FIG. 4 and FIG. 5B at the same time, which is another form of the light emitting diode 24' of the first embodiment, wherein the heat dissipation and electrical conduction paths of the light emitting diode 24' are different. The light emitting diode 24' has a heat sink H. The heat sink H is in contact with the bare crystal 241, and the plastic reflector 244' protrudes from the rear and is bent to its bottom surface 246. The light emitting diode 24' is mounted on the surface of the heat sink H Adhesive to the metal substrate circuit board 22 so that the heat energy of the light emitting diode 24 ′ can be conducted to the heat conducting frame 21 . When energized, the bare crystal 241 of the LED 24' is electrically connected to the metal substrate circuit board 22 through the lead L' of the lead frame. In this way, the heat dissipation and electrical conduction paths of the LEDs 24 are not the same, which not only reduces the luminous efficiency of the LEDs 24 and is affected by the heat dissipation efficiency, but also can be assisted by the thermally conductive frame 21 with a higher heat transfer coefficient. Heat dissipation.

Next, please refer to FIG. 6 and FIG. 7 to illustrate the side light-emitting module according to the second embodiment of the present invention, wherein FIG. 7 is a partial cross-sectional schematic diagram along the line B-B in FIG. 6 .

The side light emitting module 3 includes a heat conducting frame 31 , a metal substrate circuit board 32 , a light guide plate 33 and a light emitting diode 34 . Wherein, the metal base circuit board 32, the light guide plate 33, and the light emitting diode 34 have the same technical characteristics and functions as the metal base circuit board 22, the light guide plate 23, and the light emitting diode 24 in the first embodiment, and are not repeated here. repeat.

The difference from the first embodiment is that in this embodiment, the lateral light-emitting module 3 further includes a frame body 37, which is combined with the heat conducting frame 31, wherein the frame body 37 supports the light guide plate 33 and the reflection sheet 35, and the frame body 37 can be made of metal, alloy or plastic. It should be noted that the heat conducting frame 31 is a heat conducting side frame and is disposed on one side of the frame body 37 , and the cross section of the heat conducting frame 31 is substantially L-shaped. The light-emitting diodes 34 are arranged on the heat-conducting frame 31 , and the heat emitted by the light-emitting diodes 34 can be transferred from the metal substrate circuit board 32 to the heat-conducting frame 31 , and then transferred from the heat-conducting frame 31 to the frame body 37 to assist heat dissipation. Of course, the shape of the heat conducting frame 31 can be designed according to actual product requirements, and will not be repeated here.

Finally, please refer to FIG. 8 and FIG. 9 to illustrate the lateral light-emitting module according to the third embodiment of the present invention, wherein FIG. 9 is a partial cross-sectional schematic diagram along the line C-C in FIG. 8 .

The difference from the second embodiment is that in this embodiment, the frame body 37' of the lateral light-emitting module 3' is a lower cover body, that is, the frame body 37' has a bottom 371', and the frame body 37' and The corresponding junction of the heat conducting frame 31 is a hole P1 , and a plurality of supporting parts 372 are arranged at intervals in the hole to carry the heat conducting frame 31 . Therefore, the frame body 37' and the heat conducting frame 31 can be more closely combined.

To sum up, according to a lateral light-emitting module of the present invention, the light-emitting diodes are surface-attached to the metal substrate circuit board. Compared with the existing conventional technology, since the surface of the light-emitting diode is adhered to the metal-based circuit board, and the heat-conducting effect of the metal-based circuit board is better, the light-emitting diode can have better heat dissipation efficiency, thereby improving the light-emitting module. product quality. Furthermore, the metal substrate circuit board is laid flat in the side-type light-emitting module, so compared with the prior art, the thickness of the side-type light-emitting module can be effectively reduced, and the surface of the metal substrate circuit board can be increased. The area of the trace. In addition, the heat energy of the light-emitting diodes can be transferred to the heat-conducting frame through the metal substrate circuit board to further assist in heat dissipation.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (13)

1, a kind of side direction type illuminating module is characterized in that it comprises:

One heat conduction frame;

One metal base circuit board is to be arranged at this heat conduction frame;

One light guide plate is to have an exiting surface, and this metal base circuit board is to be adjacent to this light guide plate and to be arranged in parallel with this exiting surface of this light guide plate in fact; And

One light emitting diode is to have a side light-emitting area and a bottom surface, and this light emitting diode is to be adhered to this metal base circuit board with this bottom surface.

2, side direction type illuminating module according to claim 1 is characterized in that it more comprises:

One reflex housing is to be linked to this heat conduction frame.

3, side direction type illuminating module according to claim 2 is characterized in that it more comprises:

One framework be to combine with this heat conduction frame, and this heat conduction frame is a heat conduction bogie side frame.

4, side direction type illuminating module according to claim 1 is characterized in that wherein this metal base circuit board is one to have the circuit board of metallic core.

5, side direction type illuminating module according to claim 4 is characterized in that wherein the material of this metallic core is an aluminum or aluminum alloy.

6, side direction type illuminating module according to claim 1 is characterized in that it more comprises:

One reflector plate is a bottom surface that is arranged at this light guide plate, and this bottom surface is that this exiting surface with light guide plate is oppositely arranged.

7, side direction type illuminating module according to claim 1 is characterized in that wherein this light emitting diode is a light-emitting diode or is a naked crystalline substance.

8, side direction type illuminating module according to claim 1 is characterized in that wherein this light emitting diode has more a naked crystalline substance, a substrate and a packaging body, and this naked crystalline substance is to be electrically connected at this substrate, and this packaging body is to coat this naked crystalline substance.

9, side direction type illuminating module according to claim 8 is characterized in that wherein this substrate is a printed circuit board (PCB) or a lead frame.

10, side direction type illuminating module according to claim 8 is characterized in that wherein this light emitting diode has more a plastic cement reflecting element, and this plastic cement reflecting element has an accommodation space, and this naked crystalline substance is to be positioned at this accommodation space.

11, side direction type illuminating module according to claim 9 is characterized in that wherein this lead frame is this bottom surface that extends to this light emitting diode.

12, side direction type illuminating module according to claim 10 is characterized in that wherein this packaging body is to fill this accommodation space.

13, side direction type illuminating module according to claim 1 is characterized in that wherein this side light-emitting area is parallel with an incidence surface of this light guide plate in fact.

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