CN101311868B - Tip-off thermostatic control device and its control method - Google Patents
Tip-off thermostatic control device and its control method Download PDFInfo
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- CN101311868B CN101311868B CN200710028192A CN200710028192A CN101311868B CN 101311868 B CN101311868 B CN 101311868B CN 200710028192 A CN200710028192 A CN 200710028192A CN 200710028192 A CN200710028192 A CN 200710028192A CN 101311868 B CN101311868 B CN 101311868B
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- electronic component
- unit
- temperature
- circuit board
- tip
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- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 238000006073 displacement reaction Methods 0.000 claims description 34
- 230000004308 accommodation Effects 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention discloses a tip-off constant temperature control apparatus and a control method thereof. The tip-off constant temperature control apparatus automatically adjusts the distance between a heating unit and an electronic element by measuring the heating temperature of the electronic element, so as to keep the temperature of the electronic element to be the fixed value; a removing device is used for removing the tip-off electronic element automatically, so as to prevent that the electronic element is burnt by over high temperature when being tipped off. The tip-off constant temperature control apparatus can avoid that the electronic element is burnt due to the over high temperature when being tipped off, and the apparatus of the present invention matched with a removing unit can be used for removing the tip-off electronic element from a circuit board automatically, so the electronic element can be removed automatically without wasting manpower waiting.
Description
Technical field
The present invention relates to a kind of heating unit and its control method, particularly relate to a kind of in order to measure the heating-up temperature of electronic component, and adjust the distance of heating unit and electronic component automatically, be the control device and the control method thereof of definite value with the temperature of keeping electronic component.
Background technology
The industry welding technology of separating commonly used is directly electronic component and tin ball pin to be blown weldering by the engineering staff to separate welding gun at present, WU ball with fusing electronic component pin position and circuit board connects face, and reach the purpose of tip-off, and this utilizes the manpower gripping to separate welding gun blows weldering facing to electronic component mode, usually because can't grasp the heating-up temperature of electronic component, and cause burning of electronic component, especially with the electronic component of BGA or FBGA packaged type, its tip-off temperature can reach the purpose of tip-off up to 300 degree Celsius to 1000 degree, if, very easily electronic component is burnt by artificially controlling the control that temperature also can't reach constant temperature.
Summary of the invention
In view of above problem, fundamental purpose of the present invention is to provide a kind of tip-off thermostatically-controlled equipment and control method thereof, using the heating-up temperature that measures electronic component, and adjust the distance of heating unit and electronic component automatically, is definite value and melting scolder with the temperature of keeping electronic component.
Therefore, for reaching above-mentioned purpose, a kind of tip-off thermostatically-controlled equipment that the present invention disclosed comprises:
Body provides accommodation space; Displacement unit is installed on body, and displacement unit moves relative to body, and the clamping circuit board, and this circuit board surface is welded with a plurality of electronic components, and thermal source is facing to the electronic component heating; Remove the unit, be installed on body, and remove the unit and move relative to body, this removes the unit and establishes sensor measuring the temperature of electronic component, and produces temperature signal, and removes the unit clamping and electronic component; And control module, be fixed in accommodation space, it is controlled displacement unit and removes cell moving, and control module is accepted temperature signal to control displacement unit and to remove moving of unit, make melt solder with the heating-up temperature of keeping electronic component, after treating the scolder fusion, control module is controlled displacement unit and is removed relatively moving of unit, to remove electronic component.
Wherein remove the unit, comprise: motor, it is for being fixed in body, and in the rotation axle head connection gear of motor; Tooth bar, it is meshed with gear, and drives tooth bar via swing pinion and slide on body to produce perpendicular displacement; Connecting link, it is connected and interlock with tooth bar; Clip, it is connected with connecting link, and clip clamping electronic component; And temperature sensor, it contacts electronic component by clip, measures temperature of electronic component with the conduction temperature, and produces temperature signal.
And wherein displacement unit comprises: motor, and it is for being fixed in body, and in the rotation axle head connection gear of motor; Tooth bar, it is meshed with gear, and drives tooth bar via swing pinion and slide on body to produce perpendicular displacement; Connecting link, it is connected and interlock with tooth bar; Platform, it is for being connected in connecting link, this platform bearer circuit board; And a plurality of grip blocks, it is pressed on platform for being bolted in platform so that circuit board is produced a pressure.
A kind of control method of tip-off thermostatically-controlled equipment comprises the following step:
Fixing circuit board, and this circuit board is welded with electronic component; Adding the distance of thermoelectric elements and adjustment heating unit and electronic component, is definite value with the heating-up temperature that keeps electronic component; Continue the melt solder of heating until electronic component; And from the circuit board separating electronic components.
Wherein adding the distance of thermoelectric elements and adjustment heating unit and electronic component, is the step of certain value with the heating-up temperature that keeps electronic component, comprises the following step:
Heating unit produces hot blast and electronic component is heated; Then monitor temperature of electronic component; Relatively temperature of electronic component therewith definite value to produce a difference value; And difference value and adjust the distance of heating unit and electronic component according to this, be definite value to keep temperature of electronic component.
Wherein monitor the step of temperature of electronic component, comprise the following step:
Measure temperature of electronic component, and produce temperature signal, the then temperature of recorded electronic element.
Wherein from the step of circuit board separating electronic components be with displacement unit with remove relatively moving of unit, and remove unit clamping electronic component, displacement unit fixing circuit board, and remove the step of electronic component from circuit board.
Than prior art, can avoid electronic component to burn during because of temperature is too high when the high temperature by the present invention in tip-off, and utilize the present invention to arrange in pairs or groups to remove the unit can be automatically the electronic component of tip-off to be removed from circuit board, wait for without waste of manpower removing electronic component automatically.
Description of drawings
Figure 1A is one of structural drawing of the present invention;
Figure 1B is two of a structural drawing of the present invention;
Fig. 2 is the structural drawing of another embodiment of the present invention;
Fig. 3 is a control flow chart of the present invention;
Fig. 4 adds thermoelectric elements for the present invention and adjusts the distance of heating unit and electronic component, is the control flow chart of definite value with the heating-up temperature that keeps electronic component.
Embodiment
See also Figure 1A, be depicted as structural drawing of the present invention, a kind of tip-off thermostatically-controlled equipment, comprise: body 110, accommodation space is provided, and in this body 110, displacement unit 120 is set, comprise motor 121, it is the accommodation space that is fixed in body 110, and in the rotation axle head connection gear 122 of motor 121 to drive other assembly; Tooth bar 123, it is meshed with said gear 122, and drives tooth bar 123 via swing pinion 122 and slide on body 110 to produce the vertical direction displacement; Connecting link 124, it is connected with tooth bar 123, and interlock, so that the vertical direction displacement to be provided, and for preventing the mobile difficulty that cause control temperature of circuit board 130 when heating, usually must be fixed circuit board 130, therefore utilize platform 125, but these platform 125 bearer circuit plates 130, and a plurality of grip block 126 utilize hand-holdable bolt that grip block 126 is locked on the platform 125, if when desiring clamping circuit board 130, make 126 pairs of circuit boards of grip block 130 produce pressure and be pressed on platform 125 and fix to screw bolt, when desiring to remove this circuit board 130, promptly loosen this bolt and can take away circuit board 130.
Foregoing circuit plate 130 its surfaces are welded with a plurality of electronic components 131, and general circuit plate surface is welded with a plurality of electronic components, and as detecting the circuit board of usefulness, the electronic component on surface needs usually to change.Cause electronic component to burn because of temperature controlling is bad when in addition, being easier to tip-off as electronic component with BGA or FBGA encapsulation.
Remove unit 200, be installed on body 110, and remove unit 200 and move, comprise relative to body 110:
See also Fig. 2, be depicted as the structural drawing of another embodiment of the present invention, its structure is identical with structure shown in Figure 1, the difference person of institute is that the heating unit 140 of last embodiment is held by the user, and towards electronic component 131 heating, and this embodiment is fixed in body 110 with this heating unit 140, and equally towards electronic component 131 heating, to reach the purpose of robotization.
See also Fig. 3, be depicted as control flow chart of the present invention, a kind of control method of tip-off thermostatically-controlled equipment comprises:
Utilize grip unit fixedly to comprise the circuit board (step 300) of a plurality of electronic components earlier, then provide heat with the hot blast of heating unit, with to electronic component heating (step 301) facing to the electronic component of circuit board; Next control module receives temperature signal and the distance signal that is transmitted by sensing cell and distance sensing unit, with monitoring temperature of electronic component (step 302); Control module is to utilize temperature signal and distance signal to adjust the distance of heating unit and electronic component to calculate temperature of electronic component, to keep temperature of electronic component (step 303); Control module can write down keep temperature of electronic component sometime after, can utilize to remove the unit electronic component is located away from circuit board (step 304).
See also Fig. 4, be depicted as the distance that adds thermoelectric elements and adjust heating unit and electronic component, heating-up temperature with the maintenance electronic component is the control flow chart of definite value, the distance that wherein adds thermoelectric elements and adjustment heating unit and electronic component, heating-up temperature with the maintenance electronic component is a definite value, and comprises the following step:
Utilize heating unit generation hot blast and electronic component is heated (step 400); Next monitor temperature of electronic component (step 401); Then compare temperature of electronic component and definite value to produce a difference value (step 402); Last difference value according to this and adjust the distance of heating unit and electronic component is a definite value (step 403) with the heating-up temperature of keeping electronic component.
In this invention, according to the advantage that previous described different embodiment had, comprise:
1. when tip-off, prevent burning of electronic component;
Utilize the present invention's the distance of adjusting heating unit and electronic component automatically, calorify temperature of electronic component with control, so that electronic component can be kept a specified temp, the scolding tin of electronic component and circuit board is melted, but electronic component can not burnt again, the electronic component that is particularly useful for BGA and FBGA encapsulation, because the electronic component of BGA and FBGA encapsulation is to utilize the tin ball and be welded on the circuit board, desire often may be from Celsius 300 scopes of spending to 1000 degree with its temperature of its tip-off, high temperature like this, careless slightly, electronic component just Yin Wendu is too high and burn, if utilize thermostatically-controlled equipment of the present invention can avoid the generation of this situation.
2. remove electronic component automatically to reach the robotization purpose.
The present invention can arrange in pairs or groups remove the unit with automatically will be the electronic component of tip-off remove from circuit board, after electronic component is heated to a certain temperature and keeps a period of time, scolding tin melts fully and is removable, so, the present invention arranges in pairs or groups and removes the unit and can automatically removable electronic component be removed from circuit board, can wait for without waste of manpower removing electronic component automatically.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of alike skill person; without departing from the spirit and scope of the invention; when can doing a little change and retouching, so the present invention's scope of patent protection must be looked the appended claim person of defining of this instructions and is as the criterion.
Claims (7)
1. a tip-off thermostatically-controlled equipment is characterized in that, comprises:
One body, it provides an accommodation space;
One displacement unit, it is installed on described body, and this displacement unit moves relative to described body, and clamping one circuit board, and this circuit board surface is welded with a plurality of electronic components, and by a thermal source described electronic component is heated;
One removes the unit, and it is installed on this body, and this removes the unit and move relative to described body, and this removes the unit and establishes a sensor measuring described temperature of electronic component, and producing a temperature signal, and this removes this electronic component of unit clamping; And
One control module, it is fixed in described accommodation space, and be described displacement unit of control and the described cell moving that removes, and this control module is for accepting described temperature signal to control displacement unit and to remove moving of unit, make melt solder with the heating-up temperature of keeping this electronic component, after treating the scolder fusion, this control module controls this displacement unit and this removes relatively moving of unit, to remove described electronic component;
Wherein, the described unit that removes comprises:
One motor, it is fixed in described body, and connects a gear in the rotation axle head of this motor;
One tooth bar, it is meshed with described gear, and drives this tooth bar via this gear of rotation and slide on described body to produce perpendicular displacement;
One connecting link, it is connected and interlock with described tooth bar;
One clip, it is connected with described connecting link, and the described electronic component of this clip clamping; And
One temperature sensor, it contacts this electronic component by described clip, measures this temperature of electronic component with the conduction temperature, and produces this temperature signal;
Wherein, described displacement unit comprises:
One motor, it is fixed in described body, and the rotation axle head of this motor connects a gear;
One tooth bar, it is meshed with this gear, and drives this tooth bar via this gear of rotation and slide on this body to produce perpendicular displacement;
One connecting link, it is connected and interlock with described tooth bar;
One platform, it is connected in described connecting link, the described circuit board of this platform bearer; And
A plurality of grip blocks, it is for being bolted in described platform, described circuit board is produced a pressure and press solidly in this platform.
2. tip-off thermostatically-controlled equipment as claimed in claim 1 is characterized in that, on behalf of this displacement unit and this, described relatively moving remove the unit oppositely to relatively move.
3. tip-off thermostatically-controlled equipment as claimed in claim 1 is characterized in that described thermal source is a hot wind generating device, utilizes hot blast to heat this electronic component.
4. tip-off thermostatically-controlled equipment as claimed in claim 1 is characterized in that described thermal source is fixed in body, and electronic component is heated.
5. the control method of a tip-off thermostatically-controlled equipment is characterized in that, comprises the following step:
Fix a circuit board, this circuit board is welded with an electronic component;
Heating this electronic component and adjust the distance of a heating unit and this electronic component, is certain value with the heating-up temperature that keeps this electronic component, and it specifically comprises: this heating unit produces hot blast and to this electronic component heating; Monitor this temperature of electronic component; Relatively this temperature of electronic component and this definite value are to produce a difference value; Reaching the distance of adjusting this heating unit and this electronic component according to this difference value, is this definite value to keep this temperature of electronic component;
Continue the melt solder of heating until this electronic component; And
Separate this electronic component from this circuit board.
6. the control method of tip-off thermostatically-controlled equipment as claimed in claim 5 is characterized in that, the described step that should monitor this temperature of electronic component comprises the following step:
Measure this temperature of electronic component, and produce a temperature signal; And
Write down this temperature of electronic component.
7. the control method of tip-off thermostatically-controlled equipment as claimed in claim 5, it is characterized in that, described step of separating this electronic component from this circuit board is to remove relatively moving of unit with this displacement unit and this, and the described unit clamping electronic component that removes, this displacement unit is fixed this circuit board, and removes the step of this electronic component from this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710028192A CN101311868B (en) | 2007-05-25 | 2007-05-25 | Tip-off thermostatic control device and its control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710028192A CN101311868B (en) | 2007-05-25 | 2007-05-25 | Tip-off thermostatic control device and its control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101311868A CN101311868A (en) | 2008-11-26 |
| CN101311868B true CN101311868B (en) | 2010-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710028192A Expired - Fee Related CN101311868B (en) | 2007-05-25 | 2007-05-25 | Tip-off thermostatic control device and its control method |
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| CN (1) | CN101311868B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103744455B (en) * | 2014-01-14 | 2016-08-17 | 杭州科爵智能设备有限公司 | Intelligent temperature control system for welding machine and welding method thereof |
| CN105834542B (en) * | 2015-01-13 | 2019-05-07 | 中国人民解放军陆军工程大学 | Biserial in-line package chip dismounting device |
| CN106793543A (en) * | 2016-12-14 | 2017-05-31 | 利亚德电视技术有限公司 | Rework equipments |
| CN110497054B (en) * | 2019-08-31 | 2021-06-11 | 深圳市华宸芯科技有限公司 | Tin melting treatment device for repairing and desoldering integrated circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2452667Y (en) * | 2000-11-10 | 2001-10-10 | 萧玉如 | Photothermal Desoldering Machine |
| DE10054467A1 (en) * | 2000-11-03 | 2002-05-16 | Rewatronik | Method for temperature monitoring during unsoldering of components from a circuit board in which the melting temperature is determined using simple mechanical and electrical means |
| JP2006202858A (en) * | 2005-01-18 | 2006-08-03 | Taiyo Denki Sangyo Kk | Rework method and rework apparatus |
| CN2902550Y (en) * | 2005-11-17 | 2007-05-23 | 深圳市格林美高新技术有限公司 | Dewelding equipment of automobile and electron waste circuitboard |
-
2007
- 2007-05-25 CN CN200710028192A patent/CN101311868B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10054467A1 (en) * | 2000-11-03 | 2002-05-16 | Rewatronik | Method for temperature monitoring during unsoldering of components from a circuit board in which the melting temperature is determined using simple mechanical and electrical means |
| CN2452667Y (en) * | 2000-11-10 | 2001-10-10 | 萧玉如 | Photothermal Desoldering Machine |
| JP2006202858A (en) * | 2005-01-18 | 2006-08-03 | Taiyo Denki Sangyo Kk | Rework method and rework apparatus |
| CN2902550Y (en) * | 2005-11-17 | 2007-05-23 | 深圳市格林美高新技术有限公司 | Dewelding equipment of automobile and electron waste circuitboard |
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| Publication number | Publication date |
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| CN101311868A (en) | 2008-11-26 |
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Addressee: Foshan Shunde District Mitac Precision Technology Co., Ltd. Document name: Notification of Termination of Patent Right |
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Granted publication date: 20100526 Termination date: 20130525 |