CN101303885A - Multi-chip package memory module - Google Patents

Abstract

The invention discloses a multi-chip package (MCP) storage module. The MCP storage module in the present invention is not only packaged with several types of memory for storage, but also packaged with an interface conversion controller and a smart card chip, wherein the smart card chip can realize smart card security-related services, while the interface conversion controller can realize external Through the conversion of the interface specification when the external interface interacts with several types of memories and smart card chips, the MCP storage module is not limited to the storage function, and the function expansion is realized. Moreover, since the interface conversion controller can realize interface specification conversion, the external interface of the MCP storage module in the present invention can correspond to several types of memory and smart card chips one by one, and preferably only has fewer External interfaces, such as one or two, can reduce the number of external interface pins of the MCP memory module.

Description

Multi-chip package memory module

technical field

The invention relates to an interface access technology, in particular to a multi-chip package (Multi-Chip Package, MCP) storage module.

Background technique

MCP is an advanced integrated circuit packaging process, which uses MCP technology to package various types of memory dies (usually also called bare chips) together to form an MCP memory module. In addition, the MCP memory module has a one-to-one corresponding external interface corresponding to each type of memory die.

As shown in Figure 1, various types of memories packaged in existing MCP memory modules (for ease of expression, the word "die" is omitted in the subsequent expressions of this article, and "die" is used to represent the die in Figure 1) Can include: static memory (SRAM) and non-flash memory (NAND Flash), and this MCP storage module has the SRAM bus external interface corresponding to SRAM and being connected with it respectively, and the NAND Flash bus external interface corresponding to NAND Flash and being connected with it.

In this way, the external host can access the corresponding type of memory through different bus interfaces.

MCP memory modules are widely used in mobile devices such as mobile phones because they occupy a smaller area than individual memories packaged individually.

However, the existing MCP storage module is limited to the storage function and cannot realize function expansion.

Contents of the invention

In view of this, the present invention provides an MCP storage module, which can realize smart card security-related services.

An MCP storage module provided by the present invention is packaged with several types of memory and has an external interface for external host access,

An interface conversion controller and a smart card chip are also encapsulated in the MCP storage module, wherein,

Several types of memories are respectively connected to the interface conversion controller through respective corresponding buses;

The smart card chip is connected to the interface conversion controller through the smart card chip bus;

The interface conversion controller is connected to the external interface through the bus corresponding to the external interface, and is used to establish communication between the external host and the corresponding type of memory or smart card chip when the external host accesses the corresponding type of memory or smart card chip through the external interface.

The number of the external interfaces is less than or equal to the sum of the total number of several types of memories and the number of smart card chips.

The MCP storage module has only one external interface.

The one external interface is a static random access memory SRAM bus interface, or a dynamic random access memory DRAM, a synchronous dynamic random access memory SDRAM bus interface, or a non-flash NAND Flash bus interface.

The multiple external interfaces correspond to several types of memories and smart card chips respectively.

The several types of memory include: random access memory RAM, SRAM, DRAM, SDRAM, read-only memory ROM, non-volatile read-only memory E ² PROM, or non-flash NORFLASH, and non-flash NAND FLASH.

Before the interface conversion controller establishes the communication between the external host and the corresponding type of memory, it further establishes the communication between the external host and the smart card chip, so as to realize the authentication interaction between the external host and the smart card chip

It can be seen from the above technical solution that the MCP storage module in the present invention is not only packaged with several types of memory for storage, but also packaged with an interface conversion controller and a smart card chip, wherein the smart card chip can realize smart card security-related services, and the interface conversion The controller can realize the interface specification conversion when interacting with several types of memory and smart card chips through the external interface, so that the MCP storage module is not limited to the storage function, and realizes the function expansion.

And, because the interface conversion controller can realize the interface specification conversion, therefore, the external interface that the MCP storage module among the present invention has can not be one-to-one correspondence with several types of memory and smart card chip, preferably can only have one external interface , so that the number of external interface pins of the MCP memory module can be reduced.

Furthermore, if the MCP storage module has only one external interface, an interface with a faster transmission speed such as a SRAM or SDRAM bus interface can be used to improve the efficiency of external access to the MCP storage module.

Still further, in order to improve the security of access to the MCP storage module, all external access can also be authenticated by the smart card chip.

Description of drawings

FIG. 1 is a schematic structural diagram of an existing MCP storage module.

Fig. 2 is an exemplary structure diagram of the MCP storage module in the present invention.

FIG. 3 is a schematic structural diagram of an MCP storage module in Embodiment 1 of the present invention.

FIG. 4 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 1 of the present invention.

FIG. 5 is a schematic flowchart of the access method 2 of the MCP storage module in Embodiment 1 of the present invention.

FIG. 6 is a schematic structural diagram of an MCP storage module in Embodiment 2 of the present invention.

FIG. 7 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 2 of the present invention.

FIG. 8 is a schematic flowchart of access mode 2 of the MCP storage module in Embodiment 2 of the present invention.

FIG. 9 is a schematic structural diagram of an MCP storage module in Embodiment 3 of the present invention.

FIG. 10 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 3 of the present invention.

FIG. 11 is a schematic flowchart of access mode 2 of the MCP storage module in Embodiment 3 of the present invention.

FIG. 12 is a schematic structural diagram of an MCP storage module in Embodiment 4 of the present invention.

FIG. 13 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 4 of the present invention.

FIG. 14 is a schematic flowchart of access mode 2 of the MCP storage module in Embodiment 4 of the present invention.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

Fig. 2 is an exemplary structure diagram of the MCP storage module in the present invention. As shown in Figure 2 ("die" in Figure 2 represents the die), the MCP memory module in the present invention is packaged with n types of memory (n is a natural number), and has an external interface for external host access.

Compared with the existing MCP storage module, the MCP storage module shown in FIG. 2 is further packaged with an interface conversion controller and a smart card chip. It should be noted that since the various components packaged inside the MCP are dies, the interface conversion controller and the smart card chip described here and below refer to the interface conversion controller die and the smart card chip respectively. core.

The n types of memories are respectively connected to the interface conversion controller through their corresponding buses. For example, assuming that the memory 1 in FIG. 2 is a synchronous dynamic random access memory (SDRAM), the memory 1 is connected to the interface conversion controller through the SDRAM bus.

The smart card chip is connected to the interface conversion controller through the smart card chip bus to realize smart card security-related services.

The interface conversion controller is connected to the external interface through the bus corresponding to the external interface, and is used to establish communication between the external host and the corresponding type of memory or smart card chip when the external host accesses the corresponding type of memory or smart card chip through the external interface, and This communication performs conversion of the interface specification.

Wherein, establishing the communication as mentioned above is to guide the logical connection between the external host and the corresponding type of memory or smart card chip, and this process can be realized by existing methods, and will not be repeated here.

It can be seen that the MCP storage module shown in Figure 2 is not only packaged with several types of memory for storage, but also packaged with an interface conversion controller and a smart card chip, wherein the smart card chip can realize smart card security-related services, and the interface conversion The controller can realize the interface specification conversion when interacting with several types of memory and smart card chips through the external interface, so that the MCP storage module is not limited to the storage function, and realizes the function expansion.

In the MCP storage module as shown in Figure 2, there can be multiple external interfaces, and one-to-one correspondence with n types of memory and smart card chips, and the external interface may not be one-to-one corresponding with n types of memory and smart card chips , or even only one.

For different numbers of external interfaces, the interface conversion controller in the MCP storage module works differently. For the situation that the external interface and the memory and smart card chip in the MCP are not in one-to-one correspondence, when establishing the external host and memory or smart card After the communication of the chip, it is also necessary to convert the interface specification for the established communication.

Among them, the interface specification conversion refers to the conversion of the bit width of different interfaces for each read/write data and the conversion of the read/write control mode. This process can be realized by existing methods, and will not be repeated here.

Hereinafter, it will be described in detail in conjunction with several embodiments.

Embodiment one

FIG. 3 is a schematic structural diagram of an MCP storage module in Embodiment 1 of the present invention. As shown in Figure 3, taking SDRAM and NAND Flash as an example, in Figure 3 ("die" in Figure 3 indicates the die), SDRAM and NAND Flash in the MCP memory module pass through the SDRAM bus and The NAND Flash bus is connected to the interface conversion controller, and the smart card chip is connected to the interface conversion controller through the smart card chip bus.

The MCP storage module shown in Figure 3 has three external interfaces corresponding to SDRAM, NAND Flash, and smart card chips one by one, namely the SDRAM bus external interface corresponding to SDRAM, the NAND Flash bus external interface corresponding to NAND Flash, and The smart card chip bus external interface corresponding to the smart card chip.

In this way, the interface conversion controller is connected to the external interface of the SDRAM bus, the external interface of the NAND Flash bus, and the external interface of the smart card chip bus through the SDRAM bus, the NAND Flash bus, and the smart card chip bus, and is used for accessing the corresponding type through the external interface on the external host. When the memory or smart card chip of the corresponding type is established, the communication between the external host and the corresponding type of memory or smart card chip is established.

In this embodiment, the interface conversion controller can determine which type of memory or smart card chip the host accesses according to which external interface the external host sends the access command. The interface conversion controller can directly judge after receiving the access instruction, and then establish communication between the external host and the memory or smart card chip accessed by it. This method is called access mode 1; the interface conversion controller can also receive the access instruction Afterwards, it first interacts with the smart card chip to determine whether the host that sends the access command has the right to access the NAND Flash in the MCP storage module, and then judges after the authentication is passed, and then establishes the relationship between the external host and the memory or smart card chip it accesses. Communication, this way is called access mode 2.

It should be noted that, since SDRAM and other random access memories usually only store some intermediate data and are often accessed, the authentication interaction involved in access mode 2 is usually not for SDRAM, static random access memory (SRAM) , RAM.

FIG. 4 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 1 of the present invention. As shown in Figure 4, the specific processing flow of access mode 1 in this embodiment includes the following steps:

In step 401, the interface conversion controller receives an access instruction sent by an external host. If the MCP storage module in this embodiment is applied to a mobile device such as a terminal, the host mentioned here may be the CPU of the mobile device.

Step 402 , the interface conversion controller judges whether the received access instruction comes from the external interface of the SDRAM bus, if yes, execute step 403 , otherwise, execute step 404 .

In step 403, the interface conversion controller establishes communication between the external host and the SDRAM to ensure the read/write operation of the external host to the SDRAM, and ends the process.

Step 404, the interface conversion controller judges whether the access instruction received is from the external interface of the NAND Flash bus, if yes, then execute step 405, otherwise, execute step 406.

Step 405, the interface conversion controller establishes the communication between the external host and the NAND Flash, so as to ensure the read/write operation of the NAND Flash by the external host, and end this process.

Step 406, the interface conversion controller judges whether the received access command comes from the external interface of the smart card chip bus, if so, executes step 407, otherwise, returns to step 401 to continue receiving the access command sent by the external host or ends the process.

In step 407, the interface conversion controller establishes communication between the external host and the smart card chip to ensure that the external host implements smart card security-related services based on the smart card chip, and ends the process.

In the above process, the order of judging the external interfaces is the SDRAM bus external interface, the NAND Flash bus external interface, and the smart card chip bus external interface. In practical applications, the above judgment order can also be adjusted arbitrarily as required.

FIG. 5 is a schematic flowchart of the access method 2 of the MCP storage module in Embodiment 1 of the present invention. As shown in Figure 5, the specific processing flow of access mode 2 in this embodiment includes the following steps:

Step 501, the interface conversion controller receives an access instruction sent by an external host. If the MCP storage module in this embodiment is applied to a mobile device such as a terminal, the host mentioned here may be the CPU of the mobile device.

Step 502 , the interface conversion controller judges whether the received access command comes from the SDRAM bus external interface, if yes, execute step 503 , otherwise, execute step 504 .

Step 503, the interface conversion controller establishes the communication between the external host and the SDRAM to ensure the read/write operation of the external host to the SDRAM, and ends the process.

Step 504, the interface conversion controller judges whether the access instruction received is from the external interface of the NAND Flash bus, if yes, then execute step 505, otherwise, execute step 508.

Step 505, the interface conversion controller establishes communication between the external device and the smart card chip, and executes step 506.

In step 506, the smart card chip interacts with the external host to determine the identity of the external host. If the authentication is passed, it means that the external host has the authority to access the MCP storage module, and step 507 is executed. If the authentication fails, it means The external host does not have permission to access the NAND Flash in the MCP storage module, end this process or return to step 501 to continue receiving the access command sent by the external host.

In this step, the authentication interaction process between the smart card chip and the external host can be realized by using any existing authentication method, which will not be repeated here.

Step 507, the interface conversion controller establishes the communication between the external host and the NAND Flash, so as to ensure the read/write operation of the NAND Flash by the external host, and end this process.

Step 508, the interface conversion controller judges whether the received access command is from the external interface of the smart card chip bus, if yes, then execute step 509, otherwise, return to step 501 to continue receiving the access command sent by the external host or end the process.

Step 509, the interface conversion controller establishes the communication between the external host and the smart card chip, and converts the interface specifications for the established communication to ensure that the external host implements smart card security-related services based on the smart card chip, and ends this process.

In the above process, the order of judging the external interface is first the external interface of the SDRAM bus, and then the external interface of the NAND Flash bus. In practical applications, the above judgment order can also be adjusted arbitrarily as needed, but the access of the external host to the NAND Flash still needs to pass the authentication. .

Embodiment two

FIG. 6 is a schematic structural diagram of an MCP storage module in Embodiment 2 of the present invention. As shown in Figure 6, still taking SDRAM and NAND Flash as an example, in Figure 6 ("die" in Figure 6 indicates the die), SDRAM and NAND Flash in the MCP storage module pass through the SDRAM bus The NAND Flash bus is connected to the interface conversion controller, and the smart card chip is connected to the interface conversion controller through the smart card chip bus.

The MCP storage module shown in Figure 6 has only one external interface. Of course, the MCP storage module can also have more than one external interface, but it does not correspond to SDRAM, NAND Flash, and smart card chips one by one. Preferably, since the transmission rate of the SDRAM bus is relatively fast, in order to improve the access efficiency of the external host to the MCP storage module, one external interface in this embodiment adopts the SDRAM bus external interface.

In this way, the interface conversion controller is connected to the external interface of the SDRAM bus through the SDRAM bus, and is used to establish the communication between the external host and the corresponding type of memory or smart card chip when the external host accesses the corresponding type of memory or smart card chip through the external interface, and This communication performs conversion of the interface specification.

In this embodiment, the access instruction sent by the host may carry an access object identifier, for example, "1" indicates SDRAM, "2" indicates NAND Flash, and "3" indicates a smart card chip. In practical applications, the access object identifier can be sent by the upper layer application program of the external host, or can be represented by the high and low level signals sent by the external host through the control signal line corresponding to the external interface. Of course, there are many other ways, here I won't repeat them one by one.

In this way, the interface conversion controller can determine which type of memory or smart card chip the host is accessing according to the access object identifier in the access command sent by the external host. The interface conversion controller can directly judge after receiving the access instruction, and then establish communication between the external host and the memory or smart card chip accessed by it. This method is called access mode 1; the interface conversion controller can also receive the access instruction Afterwards, it first interacts with the smart card chip to determine whether the host that sends the access command has the right to access the NAND Flash in the MCP storage module, and then judges after the authentication is passed, and then establishes the relationship between the external host and the memory or smart card chip it accesses. Communication, this way is called access mode 2.

Of course, different addresses can also be allocated for SDRAM, NAND Flash and smart card chips in the present embodiment, and like this, the interface conversion controller can judge which type of memory the host accesses according to the access address of the access command sent by the external host or smart card chips.

FIG. 7 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 2 of the present invention. As shown in FIG. 7 , taking judging which type of memory or smart card chip the host accesses based on the access object identifier as an example, the specific processing flow of access mode 1 in this embodiment includes the following steps:

Step 701, the interface conversion controller receives an access instruction sent by an external host. If the MCP storage module in this embodiment is applied to a mobile device such as a terminal, the host mentioned here may be the CPU of the mobile device.

Step 702 , the interface conversion controller judges whether the access object identifier in the received access command indicates SDRAM, if yes, execute step 703 , otherwise, execute step 704 .

Step 703, the interface conversion controller establishes the communication between the external host and the SDRAM to ensure the read/write operation of the SDRAM by the external host, and ends the process.

Step 704, the interface conversion controller judges whether the access object identifier in the received access instruction indicates NAND Flash, if yes, execute step 705, otherwise, execute step 706.

Step 705, the interface conversion controller establishes the communication between the external host and the NAND Flash, and performs interface specification conversion on the established communication to ensure the read/write operation of the external host to the NAND Flash, and ends the process.

Step 706, the interface conversion controller judges whether the access object identifier in the received access instruction indicates a smart card chip, if yes, execute step 707, otherwise, return to step 701 to continue receiving the access instruction sent by the external host or end the process.

Step 707: The interface conversion controller establishes communication between the external host and the smart card chip, and converts the interface specifications for the established communication to ensure that the external host implements smart card security-related services based on the smart card chip, and ends the process.

In the above process, the order of judging the external interfaces is the SDRAM bus external interface, the NAND Flash bus external interface, and the smart card chip bus external interface. In practical applications, the above judgment order can also be adjusted arbitrarily as required.

FIG. 8 is a schematic flowchart of access mode 2 of the MCP storage module in Embodiment 2 of the present invention. As shown in FIG. 8 , taking judging which type of memory or smart card chip the host accesses based on the access object identifier as an example, the specific processing flow of access mode 2 in this embodiment includes the following steps:

Step 801, the interface conversion controller receives an access instruction sent by an external host. If the MCP storage module in this embodiment is applied to a mobile device such as a terminal, the host mentioned here may be the CPU of the mobile device.

In this step, the authentication interaction process between the smart card chip and the external host can be realized by using any existing authentication method, which will not be repeated here.

Step 802 , the interface conversion controller judges whether the access object identifier in the received access instruction indicates SDRAM, if yes, execute step 803 , otherwise, execute step 804 .

In step 803, the interface conversion controller establishes the communication between the external host and the SDRAM to ensure the read/write operation of the external host to the SDRAM, and ends the process.

Step 804, the interface conversion controller judges whether the access object identifier in the received access instruction indicates NAND Flash, if yes, execute step 805, otherwise, execute step 808.

In step 805, the interface conversion controller establishes communication between the external device and the smart card chip, performs interface standard conversion on the established communication, and executes step 806.

Step 806, the smart card chip interacts with the external host for authentication, and judges that the external host is authenticated. If the authentication is passed, it means that the external host has the authority to access the NAND Flash in the MCP storage module, and step 807 is executed. If the authentication is not If passed, it means that the external host does not have permission to access the NAND Flash in the MCP storage module, end this process or return to step 801 to continue receiving the access command sent by the external host.

Step 807, the interface conversion controller establishes the communication between the external host and the NAND Flash, and performs interface specification conversion on the established communication to ensure the read/write operation of the external host to the NAND Flash, and ends this process.

Step 808, the interface conversion controller judges whether the access object identifier in the received access instruction indicates a smart card chip, if yes, execute step 809, otherwise, return to step 501 to continue receiving the access instruction sent by the external host or end the process.

Step 809, the interface conversion controller establishes the communication between the external host and the smart card chip, and converts the interface specification for the established communication to ensure that the external host realizes smart card security-related services based on the smart card chip, and ends the process.

In the above process, the order of judging the external interface is first the external interface of the SDRAM bus, and then the external interface of the NAND Flash bus. In practical applications, the above judgment order can also be adjusted arbitrarily as needed, but the access of the external host to the NAND Flash still needs to pass the authentication. .

Embodiment Three

FIG. 9 is a schematic structural diagram of an MCP storage module in Embodiment 3 of the present invention. As shown in Figure 9, still taking SDRAM and NAND Flash as an example, in Figure 9 ("die" in Figure 3 indicates the die), SDRAM and NAND Flash in the MCP memory module pass through the SDRAM bus The NAND Flash bus is connected to the interface conversion controller, and the smart card chip is connected to the interface conversion controller through the smart card chip bus.

The MCP storage module shown in Figure 9 has two external interfaces, namely SDRAM bus interface and NAND Flash bus interface. The interface conversion controller is connected to the external interface of the SDRAM bus through the SDRAM bus, and is used to establish the communication between the external host and the corresponding type of memory or smart card chip when the external host accesses the corresponding type of memory or smart card chip through the external interface, and communicate with the corresponding type of memory or smart card chip. Convert the interface specification.

Since the MCP storage module shown in Figure 9 is also packaged with a smart card chip, the two external interfaces cannot correspond to SDRAM, NAND Flash, and the smart card chip one by one.

In this embodiment, the access instruction sent by the host may carry an access object identifier, for example, "1" indicates SDRAM, "2" indicates NAND Flash, and "3" indicates a smart card chip. In practical applications, the access object identifier can be sent by the upper layer application program of the external host, or can be represented by the high and low level signals sent by the external host through the control signal line corresponding to the external interface. Of course, there are many other ways, here I won't repeat them one by one.

In this way, although the two external interfaces cannot correspond to SDRAM, NAND Flash, and smart card chips one by one, the interface conversion controller can determine which type the host is accessing based on the access object identifier in the access command sent by the external host memory or smart card chip. The interface conversion controller can directly judge after receiving the access instruction, and then establish communication between the external host and the memory or smart card chip accessed by it. This method is called access mode 1; the interface conversion controller can also receive the access instruction After the command, it first interacts with the smart card chip to determine whether the host that sends the access command has the right to access the NAND Flash in the MCP storage module, and then judges after the authentication is passed, and then establishes the memory or smart card chip that the external host and its access communication, this method is called access mode 2.

Of course, different addresses can also be allocated for SDRAM, NAND Flash and smart card chips in the present embodiment, and like this, the interface conversion controller can judge which type of memory the host accesses according to the access address of the access command sent by the external host or smart card chips.

FIG. 10 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 3 of the present invention. The process shown in FIG. 10 is the same as the process shown in FIG. 7 in the second embodiment, and will not be repeated here.

FIG. 11 is a schematic flowchart of access mode 2 of the MCP storage module in Embodiment 3 of the present invention. The process shown in FIG. 11 is the same as the process shown in FIG. 8 in the second embodiment, and will not be repeated here.

In the above-mentioned three embodiments, only SDRAM and NAND Flash two types of memory are used as examples. In practical applications, the memory packaged in the MCP storage module can at least include one of the following or any combination: random access memory (RAM), SRAM, dynamic random access memory (DRAM) SDRAM, read-only memory (ROM), non-volatile read-only memory (E ² PROM), NORFLASH, NAND FLASH.

Embodiment four

FIG. 12 is a schematic structural diagram of an MCP storage module in Embodiment 4 of the present invention. As shown in Figure 12, taking SRAM and NOR Flash as examples, in Figure 12, the SRAM and NOR Flash in the MCP storage module are connected to the interface conversion controller through the SRAM bus and the NOR Flash bus respectively, and the smart card chip Then connect to the interface conversion controller through the smart card chip bus.

The MCP storage module shown in Figure 12 has only one external interface. Of course, the MCP storage module can also have more than one external interface, but it does not correspond to SRAM, NOR Flash, and smart card chips one by one. Preferably, since the transmission rate of the SRAM bus is relatively fast, in order to improve the access efficiency of the external host to the MCP storage module, one external interface in this embodiment adopts the SRAM bus external interface.

In this way, the interface conversion controller is connected to the external interface of the SRAM bus through the SRAM bus, and is used to establish the communication between the external host and the corresponding type of memory or smart card chip when the external host accesses the corresponding type of memory or smart card chip through the external interface, and This communication performs conversion of the interface specification.

In this embodiment, the access instruction sent by the host may carry the access object identifier, for example, "4" indicates SRAM, "5" indicates NOR Flash, and "3" indicates a smart card chip. In practical applications, the access object identifier can be sent by the upper layer application program of the external host, or can be represented by the high and low level signals sent by the external host through the control signal line corresponding to the external interface. Of course, there are many other ways, here I won't repeat them one by one.

In this way, the interface conversion controller can determine which type of memory or smart card chip the host is accessing according to the access object identifier in the access command sent by the external host. The interface conversion controller can directly judge after receiving the access instruction, and then establish communication between the external host and the memory or smart card chip accessed by it. This method is called access mode 1; the interface conversion controller can also receive the access instruction After the command, it first interacts with the smart card chip to determine whether the host that sends the access command has the right to access the NOR Flash in the MCP storage module, and then judges after the authentication is passed, and then establishes the memory or smart card chip that the external host and its access communication, this method is called access mode 2.

Certainly, different addresses can also be allocated for SRAM, NOR Flash and the smart card chip in the present embodiment, like this, the interface conversion controller can judge which type of memory that the host accesses according to the access address of the access instruction sent by the external host or smart card chips.

FIG. 13 is a schematic flowchart of access mode 1 of the MCP storage module in Embodiment 4 of the present invention. As shown in FIG. 13 , taking judging which type of memory or smart card chip the host accesses based on the access object identifier as an example, the specific processing flow of access mode 1 in this embodiment includes the following steps:

Step 1301, the interface conversion controller receives an access instruction sent by an external host. If the MCP storage module in this embodiment is applied to a mobile device such as a terminal, the host mentioned here may be the CPU of the mobile device.

Step 1302 , the interface conversion controller judges whether the access object identifier in the received access instruction indicates SRAM, if yes, execute step 1303 , otherwise, execute step 1304 .

Step 1303, the interface conversion controller establishes the communication between the external host and the SRAM to ensure the read/write operation of the SRAM by the external host, and ends the process.

Step 1304, the interface conversion controller judges whether the access object identifier in the received access instruction indicates NOR Flash, if yes, execute step 1305, otherwise, execute step 1306.

Step 1305, the interface conversion controller establishes the communication between the external host and the NOR Flash, and performs interface specification conversion on the established communication to ensure the read/write operation of the external host to the NOR Flash, and ends this process.

Step 1306, the interface conversion controller judges whether the access object identifier in the received access instruction indicates a smart card chip, if yes, execute step 1307, otherwise, return to step 1301 to continue receiving the access instruction sent by the external host or end the process.

Step 1307, the interface conversion controller establishes the communication between the external host and the smart card chip, and converts the interface specification for the established communication, so as to ensure that the external host realizes smart card security-related services based on the smart card chip, and ends this process.

In the above process, the order of judging the external interfaces is the external interface of the SRAM bus, the external interface of the NORFlash bus, and the external interface of the smart card chip bus.

FIG. 14 is a schematic flowchart of the access mode 2 of the MCP storage module in Embodiment 4 of the present invention. As shown in Figure 14, taking the example of judging which type of memory or smart card chip the host accesses based on the access object identifier, the specific processing flow of access mode 2 in this embodiment includes the following steps:

Step 1401, the interface conversion controller receives an access instruction sent by an external host. If the MCP storage module in this embodiment is applied to a mobile device such as a terminal, the host mentioned here may be the CPU of the mobile device.

Step 1402 , the interface conversion controller judges whether the access object identifier in the received access instruction indicates SRAM, if yes, execute step 1403 , otherwise, execute step 1404 .

Step 1403, the interface conversion controller establishes the communication between the external host and the SRAM to ensure the read/write operation of the SRAM by the external host, and ends the process.

Step 1404, the interface conversion controller judges whether the access object identifier in the received access instruction indicates NOR Flash, if yes, execute step 1405, otherwise, execute step 1408.

In step 1405, the interface conversion controller establishes communication between the external device and the smart card chip, converts the interface specification for the established communication, and executes step 1406.

Step 1406, the smart card chip and the external host carry out authentication interaction, and judge that the external host is authenticated, if the authentication is passed, it means that the external host has the authority to access the NOR Flash in the MCP storage module, and step 1407 is executed, if the authentication is not By passing, it means that the external host does not have permission to access the NOR Flash in the MCP storage module, and ends this process or returns to step 1401 to continue receiving the access instruction sent by the external host.

In this step, the authentication interaction process between the smart card chip and the external host can be realized by using any existing authentication method, which will not be repeated here.

Step 1407, the interface conversion controller establishes the communication between the external host and the NOR Flash, and performs interface specification conversion on the established communication to ensure the read/write operation of the external host to the NOR Flash, and ends this process.

Step 1408, the interface conversion controller judges whether the access object identifier in the received access instruction indicates a smart card chip, if yes, execute step 809, otherwise, return to step 501 to continue receiving the access instruction sent by the external host or end the process.

Step 1409, the interface conversion controller establishes the communication between the external host and the smart card chip, and converts the interface specification for the established communication to ensure that the external host implements smart card security-related services based on the smart card chip, and ends this process.

In the above process, the order of judging the external interface is first the external interface of the SRAM bus, and then the external interface of the NOR Flash bus. In practical applications, the above judgment order can also be adjusted arbitrarily as needed, but the access of the external host to the NOR Flash still needs to pass the authentication .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (7)

1. A multi-chip package MCP storage module, which is packaged with several types of memory and has an external interface for external host access, It is characterized in that, An interface conversion controller and a smart card chip are also encapsulated in the MCP storage module, wherein, Several types of memories are respectively connected to the interface conversion controller through respective corresponding buses; The smart card chip is connected to the interface conversion controller through the smart card chip bus; The interface conversion controller is connected to the external interface through the bus corresponding to the external interface, and is used to establish communication between the external host and the corresponding type of memory or smart card chip when the external host accesses the corresponding type of memory or smart card chip through the external interface. 2. The MCP storage module according to claim 1, characterized in that, The number of the external interfaces is less than or equal to the sum of the total number of several types of memories and the number of smart card chips. 3. The MCP storage module according to claim 2, characterized in that, The MCP storage module has only one external interface. 4. The MCP storage module according to claim 3, characterized in that, The one external interface is a static random access memory SRAM bus interface, or a dynamic random access memory DRAM, a synchronous dynamic random access memory SDRAM bus interface, or a non-flash NAND Flash bus interface. 5. The MCP storage module according to claim 2, wherein the plurality of external interfaces correspond to several types of memories and smart card chips respectively. 6. The MCP storage module according to any one of claims 1 to 5, characterized in that, The several types of memory include: random access memory RAM, SRAM, DRAM, SDRAM, read-only memory ROM, non-volatile read-only memory E ² PROM, or non-flash NORFLASH, and non-flash NAND FLASH. 7. The MCP storage module according to any one of claims 1 to 5, characterized in that, Before the interface conversion controller establishes the communication between the external host and the corresponding type of memory, it further establishes the communication between the external host and the smart card chip, so as to realize the authentication interaction between the external host and the smart card chip.

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