CN101296988B - Film substrate and pressure-sensitive adhesive tape - Google Patents

Abstract

The present invention provides a film substrate having properties such as flexibility, hand-tearability, heat resistance, and abrasion resistance in a well-balanced manner, and an adhesive tape using the film substrate. The film substrate is characterized in that it contains an aromatic vinyl-based elastomer, and contains 10 to 60 parts by mass of a styrene-based resin with respect to 100 parts by mass of the aromatic vinyl-based elastomer, and has a Vicat softening point of 100 to 130. 1 to 50 parts by mass of the styrene-based copolymer at °C. Also provided is an adhesive tape in which an adhesive layer is formed on one side of the film substrate.

Description

Film substrates and adhesive tapes

technical field

The present invention relates to a film substrate and an adhesive tape using the film substrate. the

Background technique

Various adhesive tapes such as insulating tapes used in various electrical equipment such as automobiles, railways, airplanes, ships, houses, factories, etc., have moderate flexibility and elongation, and flame retardancy, mechanical strength, resistance Films made of a resin composition containing a vinyl halide resin such as polyvinyl chloride as a raw material have been used in view of excellent performance such as heat deformability, electrical insulation, and moldability, and relatively low cost. the

However, when the halogenated vinyl resin film is incinerated, it will generate toxic gas. Therefore, recently, people have begun to use a non-halogen resin composition containing a large amount of inorganic flame retardant in the polyolefin resin as a raw material. thin film, and the inorganic flame retardant contains inorganic metal compounds such as metal hydroxides (for example, magnesium hydroxide, aluminum hydroxide, etc.) that have little environmental load. the

As an adhesive tape using a film made of such a non-halogen resin composition as a raw material, an adhesive tape using a composition containing an olefin polymer and an inorganic flame retardant as a film substrate is known (for example, Patent Document 1); and an adhesive tape using an olefinic film-forming material and a styrene block polymer such as styrene/ethylene-butylene copolymer/styrene as a film substrate (for example, Patent Document 2); furthermore, An adhesive tape using an olefin-based resin composition containing a vinyl aromatic elastomer component and a styrene-based polymer component as a film base material (for example, Patent Document 3). the

Patent Document 1 Japanese Unexamined Publication No. 2001-192629

Patent Document 2 JP-A-2000-038550 Gazette

Patent Document 3 JP-A-2002-105217 Gazette

Contents of the invention

However, conventional adhesive tapes made of films made of non-halogen resin compositions, for example, when used as adhesive tapes for wrapping complex wires and cables in the engine room of automobiles, have not been able to satisfy both requirements. Adhesive tapes with properties such as softness, hand-tearability, heat resistance, and abrasion resistance. the

The object of the present invention is to provide a film substrate that has characteristics such as flexibility, hand-tearability (ease of cutting the tape), heat resistance, and abrasion resistance in a well-balanced manner, and a product using the film substrate. sticky tape. the

That is, the present invention has the following gist:

(1) A film substrate characterized by containing an aromatic vinyl-based elastomer, and containing 10 to 60 parts by mass of a styrene-based resin, Vicat softening 1-50 mass parts of styrene-type copolymers whose temperature is 100-130 degreeC. the

(2) The film substrate described in (1) above, wherein the aromatic vinyl-based elastomer is selected from the group consisting of styrene-butadiene random copolymers, styrene-butadiene block copolymers, styrene - At least one of a hydrogenated product of a butadiene random copolymer and a hydrogenated product of a styrene-butadiene block copolymer. the

(3) The film substrate described in (1) or (2) above, wherein the styrene-based resin is polystyrene resin (GPPS) and/or rubber-reinforced polystyrene resin (HIPS). the

(4) The film substrate according to any one of the above (1) to (3), wherein the styrene-based copolymer having a Vicat softening point of 100 to 130° C. is composed of 80 to 99 parts by weight of an aromatic vinyl monomer % and 1 to 20 mass % of ethylenically unsaturated carboxylic acid monomers are polymerized. the

(5) The film substrate as described in (4) above, wherein the aromatic vinyl monomer is styrene, and the ethylenically unsaturated carboxylic acid is methacrylic acid. the

(6) The film substrate according to any one of (1) to (5) above, which contains 1 to 300 parts by mass of an inorganic filler based on 100 parts by mass of the aromatic vinyl-based elastomer. the

(7) The film substrate as described in (6) above, wherein the average particle diameter of the inorganic filler is 20 μm or less. the

(8) The film substrate as described in any one of (1) to (7) above, which is crosslinked by electron beam irradiation. the

(9) An adhesive tape having an adhesive layer formed on one side of the film substrate according to any one of (1) to (8) above. the

(10) An adhesive tape for wrapping using the adhesive tape described in (9) above. the

By using the film base material of this invention, the adhesive tape which has the characteristics of flexibility, hand-tearability, heat resistance, and abrasion resistance well-balanced can be obtained. the

Detailed ways

The aromatic vinyl-based elastomer that can be used in the film base material of the present invention is composed of a polymer block of an aromatic vinyl hydrocarbon and an elastomeric polymer block. Preferably, the aromatic vinyl hydrocarbon The polymer blocks of the polymer are composed of rigid segments, and the elastomeric polymer blocks are composed of soft segments. the

The aromatic vinyl-based elastomer typically preferably has an aromatic vinyl hydrocarbon polymer block-elastomeric polymer block, or an aromatic vinyl hydrocarbon polymer block-elastomeric polymer block- A copolymerized structure represented by an aromatic vinyl hydrocarbon polymer block. The aforementioned elastomeric polymer block is a block copolymer or a random copolymer in which double bonds can be partially or completely hydrogenated, and is generally known as a styrene-based elastomer. the

Examples of the aromatic vinyl hydrocarbon constituting the aromatic vinyl hydrocarbon block include styrene, α-methylstyrene, o-, m-, and p-methylstyrene, 1,3-dimethyl Styrene, vinylnaphthalene, vinylanthracene, etc., among them, styrene is preferable. the

In addition, the elastomeric polymer block may be conjugated dienes or other than conjugated dienes as long as it exhibits elastomeric properties, but conjugated dienes are generally preferred. Examples of the conjugated diene in this case include butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene and the like. the

Examples of aromatic vinyl-based elastomers include styrene-ethylene-butylene copolymer-styrene (SEBS), styrene-ethylene-propylene copolymer-styrene (SEPS) or styrene-butadiene- A-B-A type block copolymers or random copolymers such as styrene (SBS), styrene-isoprene-styrene (SIS), or their A-B-A type block copolymers or random copolymers Hydrogen products; A-B block or random copolymers such as styrene-butadiene copolymers, styrene-isoprene copolymers, or A-B block or random copolymers thereof hydrogenation products, etc. the

Among aromatic vinyl-based elastomers, styrene-butadiene random copolymers, styrene-butadiene block copolymers, hydrogenated products of styrene-butadiene random copolymers, or styrene - Hydrogenation products of butadiene block copolymers. In particular, fully hydrogenated products of styrene-butadiene random copolymers are more preferred because of their low elongation at break. the

The styrene-based resin that can be used for the film substrate of the present invention is preferably a homopolymer of styrene, a copolymer of styrene and a monomer copolymerizable with the styrene, or a styrene-based resin formed in the presence of a rubbery polymer. The polymerization of ethylene or the copolymerization of styrene with more than one monomer that can be copolymerized with the styrene. the

Examples of monomers copolymerizable with styrene include α-substituted styrenes such as α-methylstyrene; aromatic ring-substituted styrenes such as vinyltoluene and tert-butylstyrene; acrylonitrile, methacrylonitrile, etc. Vinyl cyanide monomer; acrylates such as methyl acrylate and ethyl acrylate; methacrylates such as methyl methacrylate and ethyl methacrylate; vinyl carboxylic acids such as acrylic acid and methacrylic acid; unsaturated carboxylic acid amides such as acrylamide; unsaturated dibasic carboxylic imide derivatives such as maleimide, N-phenylmaleimide and N-cyclohexylmaleimide; maleimide unsaturated dibasic carboxylic acid anhydrides such as acid, itaconic acid, citraconic acid, etc. However, it is not limited to this. the

The styrene-based resin is not particularly limited, and commonly used known resins can be used. Specifically, a polystyrene resin called GPPS and/or a rubber-reinforced polystyrene resin called HIPS are mentioned. Among them, a polystyrene resin, which is easy to adjust the film strength by controlling the molecular weight, or a mixture of a polystyrene resin and a rubber-reinforced polystyrene resin is preferable. the

The compounding quantity of the styrene-type resin in the film base material of this invention is 10-60 mass parts with respect to 100 mass parts of aromatic vinyl-type elastomers, Preferably it is the range of 10-40 mass parts. If the styrene-based resin is less than 10 parts by mass, the strength of the film base material will be low, and it will be easy to elongate. On the other hand, if the styrene-based resin exceeds 60 parts by mass, the processability of the film base material will be impaired, and the film base material will become rigid, thereby reducing pinhole resistance. the

The film substrate of the present invention contains a styrene copolymer having a Vicat softening point of 100-130°C. This is because, if it is a styrenic copolymer having a Vicat softening point of less than 100° C., the film substrate will be thermally shrunk and heat resistance will be deteriorated. In the case of a styrene-based copolymer having a Vicat softening point exceeding 130° C., fish eye phenomenon occurs due to poor kneading, and the appearance of the film substrate is poor due to the occurrence of pinholes. Particularly preferred are styrene-based copolymers having a Vicat softening point of 110 to 120°C. the

The amount of the styrene-based copolymer having a Vicat softening point of 100 to 130° C. is 1 to 50 parts by mass, preferably 10 to 35 parts by mass, per 100 parts by mass of the aromatic vinyl-based elastomer. If the Vicat softening point is less than 1 part by mass of the styrene-based copolymer having a Vicat softening point of 100 to 130° C., thermal shrinkage of the film substrate will be deteriorated. On the other hand, if the styrene-based copolymer having a Vicat softening point of 100 to 130° C. exceeds 50 parts by mass, the processability of the film will deteriorate. the

The styrene-based copolymer having a Vicat softening point of 100 to 130°C is preferably a copolymer obtained by polymerizing 80 to 99% by mass of an aromatic vinyl monomer and 1 to 20% by mass of an ethylenically unsaturated carboxylic acid monomer. things. More preferably, it is a copolymer obtained by polymerizing 85 to 98% by mass of aromatic vinyl monomers, 2 to 15% by mass of ethylenically unsaturated carboxylic acid monomers, and 0.1 to 10% by mass of vinyl monomers copolymerizable with them. things. the

If the aromatic vinyl monomer is less than 80% by mass or the ethylenically unsaturated carboxylic acid monomer exceeds 20% by mass, the heat resistance will be too high, the fluidity of the resin will be reduced, and it will be mixed with aromatic vinyl. The difference in melt viscosity of the base elastomer increases and melt-mixability deteriorates, which may lower the formability of the film base material. In addition, if the aromatic vinyl monomer exceeds 99% by mass or the ethylenically unsaturated carboxylic acid monomer is less than 1% by mass, the effect of imparting heat resistance as a film substrate tends to deteriorate. the

Styrene, α-methylstyrene, vinyltoluene, ethylstyrene, and t-butylbenzene are examples of the aromatic vinyl monomer of a styrene-based copolymer having a Vicat softening point of 100 to 130°C. Styrenes such as ethylene and their substitutes. Styrene is preferred because the molecular weight increase by the reaction can be easily controlled. the

Examples of ethylenically unsaturated carboxylic acid monomers for styrene-based copolymers having a Vicat softening point of 100 to 130°C include acrylic acid or its esters, methacrylic acid or its esters, fumaric acid, and maleic acid. , itaconic acid and other α, β-unsaturated dicarboxylic acids or their monoesters, diesters, anhydrides or their imides, acrylonitrile, or adjacent acrylic acid, methacrylic acid or their Six-membered cyclic anhydrides or their imides derived twice through intramolecular dehydration (or dealcoholization) reaction of monomer units such as esters. Among these, methacrylic acid, maleic acid, and imides are preferable. the

Vinyl monomers that can be copolymerized with aromatic vinyl monomers and ethylenically unsaturated carboxylic acid monomers as styrene-based copolymers having a Vicat softening point of 100 to 130°C include methyl methacrylate, (meth)acrylic ester monomers such as n-butyl acrylate; vinyl cyanide monomers such as acrylonitrile and methacrylonitrile; maleic anhydride, maleic acid, itaconic acid, itaconic anhydride, etc. Other unsaturated carboxylic acid monomers; maleimide monomers such as maleimide, N-methylmaleimide, N-phenylmaleimide, etc. These can be used individually or in combination of 2 or more types. the

The method for producing the styrene-based copolymer having a Vicat softening point of 100-130° C. is not particularly limited, and bulk polymerization, suspension polymerization, solution polymerization, and emulsion polymerization can be suitably used. the

The Vicat softening point in the present invention can be measured by the following method. the

Device name: Vicat softening point tester (for example, manufactured by Toyo Seiki Co., trade name: VSPTester)

Test piece: molded into a plate-like test piece with a length of 30mm x width of 19mm x thickness of 3.2mm by injection molding, and then placed in a constant temperature and humidity chamber with a temperature of 23°C and a relative humidity of 50% for 24 hours to adjust the state. the

Test method: Use a 5kg weight to raise the temperature at a rate of 50°C/hr., and measure the temperature when the indenter enters the test piece by 1mm. The test was carried out three times in this way, and the average value thereof was used as the Vicat softening point. the

The film substrate of the present invention preferably contains an inorganic filler. The reason for adding inorganic fillers is that, on the one hand, it can improve the hand-tearability of the film base material, and on the other hand, it can increase the heat conduction during the molding process of the film base material, so that the cooling effect of the film base material can be improved, and the Deformation generated in the film substrate is suppressed to a small degree. The average particle diameter of the inorganic filler is, for example, 20 μm or less, preferably 10 μm or less. When the average particle size exceeds 20 μm, the tensile strength and elongation at break of the film base material decrease, and at the same time, the decrease in flexibility or the occurrence of pinholes tends to occur. the

The average particle diameter is a numerical value based on particle distribution measured by a laser diffraction method. As a particle distribution measuring machine, the brand name "Model LS-230" by the Beckmancoulter company is mentioned, for example. In addition, when an inorganic filler is blended as a non-halogen flame retardant, it is possible to form a char layer and improve the flame retardancy of the film substrate. the

Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, triphenyl phosphite, ammonium polyphosphate, polyphosphoric acid amide, oxide Zirconium, magnesium oxide, zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, hydrotalcite, montmorillonite, zinc borate, anhydrous zinc borate, zinc metaborate, barium metaborate, antimony oxide, antimony trioxide, antimony pentoxide , red phosphorus, talc, alumina, silica, boehmite, bentonite, sodium silicate, calcium silicate, calcium sulfate, calcium carbonate, magnesium carbonate, one or more selected from these can be used compound. In particular, the use of at least one selected from aluminum hydroxide, magnesium hydroxide, hydrotalcite, and magnesium carbonate is excellent in the effect of imparting flame retardancy, and is economically advantageous. the

The compounding quantity of an inorganic filler is preferably 1-300 mass parts with respect to 100 mass parts of aromatic vinyl-type elastomers, Especially preferably, it is 5-100 mass parts. When the inorganic filler exceeds 300 parts by mass, mechanical properties such as moldability and strength of the film substrate may deteriorate. the

In addition, the film base material may contain stabilizers such as coloring agents, antioxidants, ultraviolet absorbers, lubricants, light stabilizers, and other additives as necessary within the range that does not impair the effects of the present invention. the

As the photostabilizer, low-basic or neutral high-molecular-weight photostabilizers capable of reducing and suppressing products of acid-base reactions with ethylenically unsaturated carboxylic acids (acidic substances) are preferred. the

As the lubricant, commonly used known lubricants can be used, and it is preferable to use fatty acid amides such as erucamide, oleamide, stearamide, etc. in combination, which can suppress the sticking phenomenon of the base material when used in combination. the

The method for forming the film substrate is not particularly limited, and conventional melt kneading etc. and various mixing devices (for example, single-screw or twin-screw extruders, pressure rolls, Banbury mixers, various kneading machines, etc.) can be used. machine, etc.) to mix the above-mentioned various components so that they are uniformly dispersed, and the obtained mixture is molded into a film by a usual molding method (for example, T-die method, blow molding method, calender method). Among the molding machines, a calender molding machine is preferably used. The arrangement of the press rolls in calendering can be known, such as L-shape, inverted L-shape, Z-shape, etc., and the temperature of the press rolls is usually set at 150-200°C, preferably at 160-190°C. Cut the formed film into the desired width. the

The thickness of the film substrate is not particularly limited, and may be, for example, 40-500 μm, preferably 60-300 μm, more preferably 80-160 μm. In addition, the film base material may have a single-layer form, and may also have a multilayer form. For example, when the adhesive tape is adapted to work of being wound on electric wires in various forms, if the thickness of the film base becomes too thick, the winding workability may decrease. the

By irradiating electron beams to the film substrate to cross-link it, it is possible to prevent the film substrate from being deformed or shrunk when exposed to high temperature, so that the dependence on temperature can be reduced. The irradiation dose of the electron beam at this time is preferably 10 to 150 Mrad, particularly preferably 15 to 25 Mrad. If the irradiation amount is less than 10 Mrad, the temperature dependence often cannot be improved. On the other hand, if the irradiation dose exceeds 150 Mrad, the electron beam may degrade the film substrate, which may cause problems in processability during post-processing. the

A crosslinking agent for promoting electron beam crosslinking may also be added. As a specific crosslinking agent, it can be a low molecular weight compound or oligomer having at least two or more carbon-carbon double bonds in the molecule, such as acrylate compounds, urethane acrylate oligomers , Epoxy acrylate oligomers. the

An adhesive layer may be formed on one side of the film substrate. Generally used adhesives can be used suitably as an adhesive used for constituting an adhesive layer, For example, a rubber adhesive, an acrylic adhesive, etc. can be used. In addition, in order to impart desired performance to these adhesives, a tackifier, an anti-aging agent, and furthermore a curing agent for the adhesive may be added. the

As the basic polymer of the rubber-based adhesive, natural rubber, recycled rubber, silicone rubber, isoprene rubber, styrene butadiene rubber (SBR), acrylic rubber, polyisoprene, nitrile rubber ( NBR), styrene-isoprene copolymer, styrene-isoprene-butadiene copolymer, etc. the

A crosslinking agent, a softener, a filler, a flame retardant, etc. can be added to a rubber adhesive as needed. As a specific example, as a crosslinking agent, an isocyanate crosslinking agent can be mentioned; as a softener, liquid rubber can be mentioned; as a filler, calcium carbonate can be mentioned; as a flame retardant, magnesium hydroxide can be mentioned Or red phosphorus and other inorganic flame retardants. the

Examples of the acrylic adhesive include a homopolymer of (meth)acrylate or a copolymer with a copolymerizable monomer. Examples of (meth)acrylates or copolymerizable monomers include alkyl (meth)acrylates (for example, methyl, ethyl, butyl, 2-ethylhexyl, octyl, etc.), (methyl base) glycidyl acrylate, (meth)acrylic acid, itaconic acid, maleic anhydride, (meth)acrylamide, N-hydroxylamide (meth)acrylate, alkylaminoalkyl (meth)acrylate (e.g. , dimethylaminoethyl methacrylate, tert-butylaminoethyl methacrylate, etc.), vinyl acetate, styrene, acrylonitrile, etc. Among these, alkyl acrylates whose homopolymers (homopolymers) have a glass transition temperature of -50° C. or lower are generally preferred as the main monomer. the

As a tackifier resin used for a tackifier, it can select considering softening point, compatibility with each component, etc. Examples include terpene resins, rosin resins, hydrogenated rosin resins, coumarone-indene resins, styrene-based resins, petroleum resins such as aliphatic and alicyclic resins, terpene-phenolic resins, xylene Resins, other aliphatic hydrocarbon resins or aromatic hydrocarbon resins, etc. The softening point of the tackifying resin is preferably 65 to 170°C, particularly preferably 80 to 150°C. the

Furthermore, alicyclic saturated hydrocarbon resins such as petroleum resins with a softening point of 65 to 130°C, polyterpene resins with a softening point of 80 to 130°C, glycerides of hydrogenated rosin with a softening point of 80 to 130°C, and the like are more preferable. These can be used alone or in any combination. the

Rubber-based adhesives are easily degraded in the presence of oxygen and light due to the unsaturated double bonds in the rubber molecules, so anti-aging agents are used to improve their performance. the

Examples of anti-aging agents include phenolic anti-aging agents, amine-based anti-aging agents, benzimidazole-based anti-aging agents, dithiocarbamate-based anti-aging agents, and phosphorus-based anti-aging agents. Or a mixture. the

Among the curing agents for adhesives, examples of curing agents for acrylic adhesives include isocyanates, epoxies, amines, oxazolines, and aziridines. Alone or a mixture. the

As the isocyanate curing agent, specifically polyvalent isocyanate compounds such as 2,4-benzylidene diisocyanate, 2,6-benzylidene diisocyanate, 1,3-xylylene diisocyanate, 1, 4-Xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isofor Alone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate, etc. the

The method of coating the adhesive, tackifier and anti-aging agent etc. of the adhesive layer of the adhesive tape on the film substrate is not particularly limited, for example, the following method is used: the adhesive is made of the adhesive by the transfer printing method. The adhesive solution formed by the adhesive agent, tackifier and anti-aging agent etc. is coated on one side of the film substrate and dried. The thickness of the adhesive layer after drying can be appropriately selected within the range that does not impair the adhesiveness and handleability, and the thickness of the adhesive layer is, for example, 5 to 100 μm, preferably 10 to 50 μm. If it is thinner than 5 μm, adhesive force and unwinding force may be reduced. On the other hand, if it is thicker than 100 μm, coating performance may be deteriorated. the

Example

Hereinafter, the present invention will be described in more detail based on examples, but the interpretation of the present invention is not limited to these examples. the

(Example 1)

The compounding of the film substrate in this example is: 100 parts by mass of a completely hydrogenated product of styrene-butadiene random copolymer as an aromatic vinyl-based elastomer (S.O.E.SS9000 manufactured by Asahi Kasei Chemical Co., Ltd.); 30 parts by mass of polystyrene (TOYO STYRENE Co., GPPS G-14L) of vinyl resin, and T-080 (Vitamin G-14L) manufactured by TOYO STYRENE Co. Card softening point 115°C: 92% by mass of aromatic vinyl monomer, 8% by mass of ethylenically unsaturated carboxylic acid) 30 parts by mass, and magnesium hydroxide with an average particle diameter of 5.0 μm (Magseeds N- 1) 30 parts by mass, 0.1 parts by mass of hindered phenolic antioxidant (AO-60, manufactured by ADEKA Corporation), 0.5 parts by mass of phosphate ester lubricant (H-933D-3, manufactured by Sakai Chemical Industry Company), black colorant (F -30940MM, manufactured by Dainippon Ink Chemical Industry Co., Ltd.) 3 parts by mass. the

These materials were mixed with a Banbury mixer to uniformly disperse the components, and molded to a thickness of about 0.1 mm (100 μm) using a calender molding machine at a roll temperature of 160° C. to obtain a film substrate. the

Next, the rubber-based adhesive containing a mixture of natural rubber and SBR is coated on the film substrate in a comma roll manner, and after a drying process, a 20 μm thick adhesive layer is formed on one side of the film substrate. Cut into a 25 mm wide strip to obtain an adhesive tape. The back adhesive force of the obtained adhesive tape was 3.0 N/10 mm. the

(Example 2)

The aromatic vinyl-based elastomer was changed to 100 parts by mass of a completely hydrogenated styrene-butadiene block copolymer (SEPTON 8007 manufactured by KURARAY Co., Ltd.), and the styrene-based resin was changed to (HIPS manufactured by TOYO STYRENE Co., Ltd.) E640N) except 30 mass parts, it carried out similarly to Example 1, and obtained the adhesive tape. the

(Example 3)

30 parts by mass of the styrene-based resin (GPPS G-14L) of Example 1 was changed to 15 parts by mass, and 30 parts by mass of the styrene-based copolymer (T-080) whose Vicat softening point was 100 to 130° C. was changed to 5 mass parts, except that, it carried out similarly to Example 1, and obtained the adhesive tape. the

(Example 4)

The aromatic vinyl-based elastomer was changed to 100 parts by mass of styrene-butadiene random copolymer (STR1250 manufactured by Denki Kagaku Kogyo Co., Ltd.), and the styrene-based resin was changed to (GPPS G-14L) 15 parts by mass and ( HIPS E640N) 15 parts by mass of the mixture, changing the styrene-based copolymer with a Vicat softening point of 100 to 130°C to (TOYO STYRENE Co., Ltd. T-040, Vicat softening point 107°C: aromatic vinyl monomer 96 An adhesive tape was obtained in the same manner as in Example 1 except that mass % and ethylenically unsaturated carboxylic acid (4 mass %) were 5 mass parts. the

(Example 5)

Change the aromatic vinyl-based elastomer to 100 parts by mass of styrene-butadiene block copolymer (STR1602 manufactured by Denki Kagaku Kogyo Co., Ltd.), change the styrene-based resin to 60 parts by mass (HIPSE640N), and soften Vicat The styrene-based copolymer with a temperature of 100-130°C was changed to (AX-053 manufactured by Denki Kagaku Kogyo Co., Ltd., Vicat softening point 127°C: copolymerization of 82.5% by mass of aromatic vinyl monomer and 17.5% by mass of acrylonitrile and, 50 parts by mass of a melt kneaded product formed by a copolymer of 64 mass % of aromatic vinyl monomer, 1 mass % of ethylenically unsaturated carboxylic acid and 35 mass % of maleimide monomer), except Otherwise, an adhesive tape was obtained in the same manner as in Example 1. the

(Comparative example 1)

An adhesive tape was obtained in the same manner as in Example 1 except that the compounding amount of the styrene-based resin in Example 1 was changed to 5 parts by mass. the

(Comparative example 2)

An adhesive tape was obtained in the same manner as in Example 1 except that the compounding amount of the styrene-based resin in Example 1 was changed to 100 parts by mass. the

(Comparative example 3)

An adhesive tape was obtained in the same manner as in Example 1 except that the compounding amount of the styrene-based copolymer having a Vicat softening point of 100 to 130° C. in Example 1 was changed to 0.5 parts by mass. the

(Comparative example 4)

An adhesive tape was obtained in the same manner as in Example 1, except that the blending amount of the styrene-based copolymer having a Vicat softening point of 100 to 130° C. in Example 1 was changed to 100 parts by mass. the

(Comparative Example 5)

An adhesive tape was obtained in the same manner as in Example 1 except that the styrene-based resin in Example 1 was not blended. the

(Comparative example 6)

An adhesive tape was obtained in the same manner as in Example 1, except that the styrene-based copolymer having a Vicat softening point of 100 to 130° C. in Example 1 was not blended. the

(Comparative Example 7)

In Example 1, 30 parts by mass of a styrene-based copolymer having a Vicat softening point of 100 to 130° C. was changed to a styrene-based copolymer having a Vicat softening point of 95° C. (GR-AT-R manufactured by Denki Kagaku Kogyo Co., Ltd.: An adhesive tape was obtained in the same manner as in Example 1, except that 69 mass % of an aromatic vinyl monomer and 31 mass % of acrylonitrile were used. the

(Comparative example 8)

In Example 1, 30 parts by mass of a styrene-based copolymer having a Vicat softening point of 100 to 130° C. was changed to a styrene-based copolymer having a Vicat softening point of 145° C. (MS-25NF manufactured by Denki Kagaku Kogyo Co., Ltd., Vicat Softening point 145°C: 64% by mass of aromatic vinyl monomer, 1% by mass of ethylenically unsaturated carboxylic acid, 35% by mass of maleimide monomer) 30 parts by mass, except that it is the same as Example 1 to get the tape. the

(Comparative Example 9)

The adhesive tape was obtained in the same manner as in Example 1, except that the compounding for the film substrate of Example 1 was changed to 100 parts by mass of LDPE (manufactured by TOSOH, PETROSEN 226), and a polyolefin substrate was used. the

Table 1 shows the evaluation results of the film substrates and adhesive tapes obtained in the above Examples and Comparative Examples. the

Table 1

[Table 2]

In Table 1, "softness" refers to the tensile strength at 25% modulus measured in accordance with JIS C 2107. For the adhesive tape tested in the evaluation laboratory with the temperature set at 23±2°C and the humidity set at 50±5%RH, the average value of the measured values of n=3 or more is shown, and the evaluation is performed as follows benchmarks for evaluation. the

Good: The modulus has a tensile strength of 5.0 to 15.0 N/mm ² .

Unfavorable: The tensile strength of the modulus is less than 5.0 N/mm ² and higher than 15.0 N/mm ² .

In Table 1, "elongation" refers to the tensile elongation at break measured in accordance with JIS C 2107. For adhesive tapes tested in an evaluation laboratory with a temperature set at 23±2°C and a humidity set at 50±5%RH, the average value of measured values with n=3 or more is shown, and the following evaluation criteria are followed Make an evaluation. the

Good: Tensile elongation at break is 100 to 400%. the

Defective: Tensile elongation at break is less than 100% and exceeds 400%. the

In Table 1, "hand-tearability" means that the adhesive tape with a length of 100 mm is cut in the transverse direction by a human hand, and then the cut state of the cut surface of the adhesive tape is visually judged, and the following evaluation criteria are used. evaluate. the

Excellent: The notch on the cut surface of the adhesive tape was neatly cut. the

Good: The incision of the cut surface of the adhesive tape was slightly elongated, but it was cut neatly. the

Defective: The notch of the cut surface of the adhesive tape was elongated, and it was broken in the moving direction of the adhesive tape. the

In Table 1, "heat shrinkage rate" means that a square film with a length of 100mm on each side is left to stand at 100°C for 10 minutes, and then the temperature is set at 23±2°C and the humidity is set at 50±5%RH The shrinkage rate in the transport direction (MD) and width direction (TD) after standing in the test chamber for more than 20 minutes. The average value of the measured values of n=3 or more is shown, and it evaluated according to the following evaluation criteria. the

Good: The shrinkage rate is less than 10%. the

Bad: The shrinkage rate is more than 10%. the

In Table 1, "abrasion resistance" refers to placing muslin No. 3 cotton cloth as an abrasive material on a film base material with a length of 100mm and a width of 50mm, and placing a weight of 500g on it, and the rate is 80 per minute. After rubbing the film base material and the abrasive material against each other at a reciprocating speed for 60 minutes, visually judge the abrasion condition of the film base material at this time, and evaluate according to the following evaluation criteria. the

Good: The film substrate is not scratched. the

Defective: The film substrate is scratched. the

In Table 1, "workability" is the ease of use when the adhesive tape is wound around a wire and cable with a diameter of 1 mm according to the following evaluation criteria. the

Good: The adhesive tape did not elongate or break during winding. the

Defective: During winding, the adhesive tape was elongated or broken. the

In Table 1, "resistance to pinholes" refers to stretching an adhesive tape with a length of 100 mm to a length of 200 mm at a tensile speed of 300 mm/min, and visually judging whether there are pinholes in the adhesive tape, according to the following evaluation criteria. the

Good: There are no pinholes in the adhesive tape. the

Defective: One or more pinholes in the adhesive tape. the

In Table 1, "blocking resistance" means that in a 50°C environment, two ^50cm2 film substrates are overlapped, a 15kg load is applied, and after 24 hours of standing, the 15kg load is removed, and the temperature is set at 23± After standing in an evaluation laboratory at 2°C and humidity set at 50±5%RH for more than 20 minutes, the laminated film substrates were peeled off by hand, and the peeling was evaluated according to the following evaluation criteria.

Good: The film substrates could be peeled off from each other. the

Defective: The film substrates could not be peeled off from each other. the

Although not shown in Table 1, Example 1 had a heating deformation rate of -43%. The heat deformation rate is the deformation rate of the length of the adhesive tape after treatment in the longitudinal direction compared with the adhesive tape before treatment, and represents the dependence of the adhesive tape on temperature. The treatment is at 140° C. After heat treatment for 5 minutes, it was left to stand at 23° C. for 30 minutes or more. As another example, when the film base material of Example 1 was irradiated with 20 Mrad of electron beams to make it cross-linked, the heat deformation rate became -6%, and the dependence on temperature was reduced. In addition, Examples 1 and 2 have the same tensile strength, elongation at break, electrical insulation (volume resistivity of 1×1012 Ω·cm or more), electrical resistance and shock resistance as conventional polyvinyl chloride adhesive tapes. wear voltage. the

As can be seen from Table 1, according to the present invention, a well-balanced combination of softness, hand-tearability, heat resistance, wear resistance, workability, pinhole resistance, and blocking resistance can be easily obtained. film substrates, and adhesive tapes using the film substrates. the

The adhesive tape produced using the film base material of the present invention can be suitably used as an adhesive tape for wrapping electric wires and cables such as wire harnesses of automobiles, for example. the

It should be noted that all contents of Japanese Patent Application No. 2005-313824, claims, drawings, and abstract filed on October 28, 2005 are cited here as the contents of the description of the present invention. the

Claims (5)

1. film substrate, it is characterized in that, contain aromatic vinyl base class elastomerics, and to contain styrene resin 10～60 mass parts, Vicat softening point with respect to these aromatic vinyl base class elastomerics 100 mass parts be 100～130 ℃ styrene copolymer 1～50 mass parts, wherein

Described aromatic vinyl base class elastomerics is selected from least a kind in the hydrogenation products of the hydrogenation products of styrene butadiene random copolymer, styrene-butadiene block copolymer, styrene butadiene random copolymer and styrene-butadiene block copolymer;

Described styrene resin is that polystyrene resin is that GPPS and/or rubber-reinforced polystyrene resin are HIPS;

Described Vicat softening point is that 100～130 ℃ styrene copolymer is polymerized by aromatic vinyl monomer 80～99 quality % and ethene unsaturated carboxylic acid monomer 1～20 quality %,

Described Vicat softening point is to use the Vicat softening point test machine, the value that records by the following method, promptly, adopt injection moulding to be shaped to the tabular test film of long 30mm * wide 19mm * thick 3.2mm, then, in the thermostatic constant wet chamber of 23 ℃ of temperature, relative humidity 50%, placed 24 hours, carry out the state adjustment, use the weight of 5kg, heat-up rate according to 50 ℃/hr. heats up, measure the temperature when pressure head enters the test film 1mm that adjusts through state, so carry out 3 times and test, with its mean value as Vicat softening point.

2. film substrate according to claim 1, wherein, described aromatic vinyl monomer is a vinylbenzene, described ethene unsaturated carboxylic acid is a methacrylic acid.

3. film substrate according to claim 1 and 2 wherein, with respect to aromatic vinyl base class elastomerics 100 mass parts, contain inanimate matter weighting agent 1～300 mass parts, and the median size of described inanimate matter weighting agent is below the 20 μ m.

4. film substrate according to claim 1 and 2, it is by electron beam irradiation and crosslinked.

5. adhesive tape, its single face of each described film substrate in claim 1～4 is formed with binder layer.