CN101295720A - Active element array substrate - Google Patents

Abstract

The invention discloses an active element array substrate, which comprises a substrate, an active element array, a detection circuit, a plurality of driving chip connecting pads, a plurality of flexible circuit board connecting pads, a plurality of connecting wires and an internal static protection ring, wherein the active element array and the detection circuit are arranged on the substrate, and the detection circuit is electrically connected to the active element array. The driving chip connecting pad and the flexible circuit board connecting pad are arranged on the substrate, wherein the driving chip connecting pad is electrically connected to the active element array. The connecting wires are arranged on the substrate, and each connecting wire is respectively connected to any flexible circuit board connecting pad and the detection circuit. The internal static protection ring is arranged on the substrate and is respectively and electrically connected to the active element array and any flexible circuit board connecting pad. Therefore, the detection circuit can be used as an external static protection ring to reduce the possibility of damage to the circuit caused by static discharge.

Description

Active element array substrate

technical field

The present invention relates to an element array substrate, and in particular relates to an active element array substrate for a liquid crystal display.

Background technique

The multimedia technology in today's society is quite developed, mostly benefiting from the progress of semiconductor components and display devices. As far as displays are concerned, liquid crystal displays with superior characteristics such as high image quality, good space utilization efficiency, low power consumption, and no radiation have gradually become the mainstream of the market.

For a TFT-LCD module, it is mainly composed of a liquid crystal display panel and a backlight module. Among them, the liquid crystal display panel is usually composed of a thin film transistor array substrate (thin film transistor array substrate), a color filter substrate (color filter substrate) and a liquid crystal layer arranged between the two substrates, and the backlight module is used for Provide the surface light source required by the liquid crystal display panel, so that the liquid crystal display module can achieve the display effect.

The thin film transistor array substrate can be divided into a display region and a peripheral circuit region, where a plurality of pixel units arranged in an array are arranged on the display region, and each pixel unit includes a thin film transistor and a thin film The transistor is electrically connected to the pixel electrode (pixel electrode). In addition, a plurality of scan lines and data lines are disposed on the peripheral circuit area and the display area, wherein the thin film transistor of each pixel unit is controlled by the corresponding scan lines and data lines.

After the manufacturing process of the thin film transistor array substrate is completed, the pixel units on the thin film transistor array substrate are usually electrically tested to determine whether the pixel units can operate normally. When the pixel unit fails to operate normally, defective elements (such as thin film transistors or pixel electrodes, etc.) or circuits can be repaired.

The way of electrical testing is usually to test the peripheral circuit with probes. Specifically, the peripheral circuit has a plurality of test pads electrically connected to the scan wiring and the data wiring, and the probes touch each test pad and send a test signal to test whether each pixel unit can operate normally. Due to the consideration of the detection efficiency of the probe detection device, the current detection technology adopts the six-probe structure detection technology developed by PHOTON DYNAMICS INC. (PDI). When the panel adopts a chip on glass (COG) chip design, the TFT array is only connected to the detection circuit through six detection lines. Therefore, when electrostatic discharge occurs, there is no other conduction path except the inner shorter ring, and it is easy to cause electrostatic damage to the circuit.

Contents of the invention

The invention provides an active element array substrate to reduce the possibility of damage to circuits by electrostatic discharge.

In order to solve the above problems, the present invention proposes an active element array substrate, which includes a substrate, an active element array, a detection circuit, a plurality of driver chip pads, a plurality of flexible circuit board pads, a plurality of connection lines and An internal electrostatic protection ring, wherein the active element array and the detection circuit are arranged on the substrate, and the detection circuit is electrically connected to the active element array. The driving chip pads and the flexible circuit board pads are disposed on the substrate, wherein the driving chip pads are electrically connected to the active element array. These connection lines are arranged on the substrate, and each connection line is respectively connected to any flexible circuit board pad and detection circuit. The internal static protection ring is configured on the substrate, and the internal static protection ring is respectively electrically connected to the active element array and any pad of the flexible circuit board.

In the active element array substrate of the present invention, the active element array substrate further includes a plurality of one-way switch elements, which are arranged between some flexible circuit board pads and connecting wires, and each one-way switch element is connected to any flexible circuit board. permanent circuit board pads with either connecting wire. Each one-way switch element includes a gate, a source and a drain, wherein the gate is electrically connected to any flexible printed circuit pad. The source is electrically connected to the gate, and the drain is electrically connected to the connection line.

In the active device array substrate of the present invention, the detection circuit includes a plurality of test pads and a plurality of test lines electrically connected to these test pads, wherein these test pads include even-numbered scan line test pads, odd-numbered scan-line test pads, even-numbered data line test pads, odd data line test pads and switch test pads.

In order to solve the above problems, the present invention proposes an active element array substrate, which includes a substrate, an active element array, a plurality of driver chip pads, a plurality of flexible circuit board pads, a plurality of connection lines and an internal static The protection ring, wherein the active element array is configured on the substrate. The pads of the driver chip, the pads of the flexible circuit board and the connecting wires are arranged on the substrate, wherein the pads of the driver chip are electrically connected to the active element array. Each connecting wire is respectively connected to the pad of the flexible circuit board, and the connecting wire extends to the edge of the substrate. The internal static protection ring is configured on the substrate, and the internal static protection ring is respectively electrically connected to at least one of the active element array and the flexible circuit board pad.

In the active device array substrate of the present invention, the active device array substrate further includes a plurality of one-way switch elements, which are respectively electrically connected to some of the flexible circuit board pads and the edge of the substrate. Each unidirectional switch element includes a gate, a source and a drain, wherein the gate is electrically connected to any connection line. The source is electrically connected to the gate, and the drain is electrically connected to the connection line.

In order to solve the above problems, the present invention further proposes an active element array substrate, which includes a substrate, a plurality of active element arrays, a detection circuit, a plurality of drive chip pads, a plurality of flexible circuit board pads, and a plurality of connection lines. wires and multiple internal ESD shielding rings, where the substrate divides multiple panel areas. The active element arrays are respectively configured on the panel areas, and the detection lines are electrically connected to the active element arrays. The driving chip pads are respectively arranged on these panel areas, and are respectively electrically connected to any active device array. The flexible circuit board pads are respectively arranged on these panel areas. These connection lines are arranged on the panel areas respectively, and each connection line is respectively connected to any flexible circuit board pad and detection line on each panel area. The internal static protection rings are respectively arranged on the panel area, and each internal static protection ring is electrically connected to at least one of the active device array on the same panel area and the flexible circuit board pad on the same panel area.

In the active element array substrate of the present invention, the active element array substrate further includes a plurality of one-way switch elements, which are arranged between some flexible circuit board pads and connection lines on each panel area, and each one-way switch element Connect to any flex pad and any connection wire. Each one-way switch element includes a gate, a source and a drain, wherein the gate is electrically connected to any flexible printed circuit pad. The source is electrically connected to the gate, and the drain is electrically connected to the connection line.

In the active device array substrate of the present invention, the detection circuit includes a plurality of test pads and a plurality of test lines electrically connected to these test pads, wherein these test pads include even-numbered scan line test pads, odd-numbered scan-line test pads, even-numbered data line test pads, odd data line test pads and switch test pads.

Based on the above, the present invention electrically connects the active element array to the detection circuit through the internal electrostatic protection ring, the flexible circuit board pad and the connecting wire, so the detection circuit can be used as an external static protection ring to reduce the impact of electrostatic discharge on the circuit possibility of destruction.

Description of drawings

In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic diagram of an active device array substrate before dicing according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram of the active device array substrate after cutting according to the first embodiment of the present invention.

3 is a partially enlarged view of the active device array substrate before cutting according to the second embodiment of the present invention.

4 is a partially enlarged view of the active device array substrate after cutting according to the second embodiment of the present invention.

FIG. 5 is a schematic diagram of the active device array substrate before cutting according to the third embodiment of the present invention.

Detailed ways

first embodiment

FIG. 1 is a schematic diagram of an active device array substrate before dicing according to a first embodiment of the present invention. Please refer to FIG. 1, the active element array substrate 10 of this embodiment includes a substrate 110, an active element array 120, a detection circuit 130, a plurality of driver chip pads 140, a plurality of flexible circuit board pads 150, a plurality of The connection wire 160 is connected to an internal electrostatic protection ring 170 , wherein the material of the substrate 110 can be glass, quartz or other transparent materials. The active device array 120 is disposed on the substrate 110, and the active device array 120 includes a plurality of scan lines 122, a plurality of data lines 124 and a plurality of pixel structures 126, wherein each pixel structure 126 uses any scan line 122 and any data Controlled by line 124. In addition, each pixel structure 126 includes an active device 126a and a pixel electrode 126b, wherein the active device 126a is electrically connected to the scan line 122 and the data line 124, and the pixel electrode 126b is electrically connected to the active device 126a. In this embodiment, the active device 126a is a thin film transistor, but the active device 126a may also be a bipolar junction transistor (BipolarJunction Transistor, BJT) or other active devices with three terminals.

The detection circuit 130 is disposed on the substrate 110 and electrically connected to the active device array 120 . In more detail, the detection circuit 130 includes a plurality of test pads 132a, 132b, 132c, 132d, 132e and a plurality of test lines 134a, 134b, 134c, 134c, 134c, 134d, 134e. Wherein, the test line 134 a is electrically connected to the test pad 132 a, and the test line 134 a is connected to an odd number of data lines 124 . The test line 134 b is electrically connected to the test pad 132 b, and the test line 134 b is connected to an even number of data lines 124 . The test line 134c is electrically connected to the test pad 132c, and the test line 134c is connected to an odd number of scan lines 122 . The test line 134d is electrically connected to the test pad 132d, and the test line 134d is connected to an even number of scan lines 122 . The test line 134e is electrically connected to the test pad 132e. In other words, the test pads 132a, 132b, 132c, 132d, 132e include even scan line test pads, odd scan line test pads, even data line test pads, odd data line test pads and switch test pads.

In more detail, the detection circuit 130 further includes a plurality of switch elements 136 controlled by the test line 134e. In addition, the switch elements 136 are respectively connected between the test lines 134 a , 134 b , 134 c , 134 d and the active device array 120 . Each switch element 136 includes a gate 136g, a source 136s and a drain 136d, wherein the gate 136g is electrically connected to the testing line 134e. The source 136 s is electrically connected to any one of the test lines 134 a , 134 b , 134 c and 134 d , and the drain 136 d is connected to the scan line 122 or the data line 124 of the active device array 120 .

The driving chip pad 140 is disposed on the substrate 110 , and the driving chip pad 140 is electrically connected to the active device array 120 . More specifically, a driver chip (not shown) is disposed on the driver chip pad 140 to control the operation of the active device array 120 . In addition, the driver chip is bonded to the driver chip pad 140 by chip-on-glass (COG) bonding technology. It is worth mentioning that the active device array substrate 10 usually has multiple sets of driving chip pads 140 , but for simplicity of description, this embodiment only shows one set of driving chip pads 140 .

The FPC pads 150 are disposed on the substrate 110 , and a FPC (not shown) is suitable for electrical connection with the FPC pads 150 . In addition, the flexible circuit board is also connected to a control circuit board (not shown), and the control circuit board is used to control the operation of the driver chip disposed on the driver chip pad 140, and the driver chip is used to control the active element array 120 operation. These connecting wires 160 are disposed on the substrate 110 , and each connecting wire 160 is respectively connected to any flexible circuit board pad 150 and the detection circuit 130 . In more detail, each connection line 160 may be connected to the test line 134a. The inner ESD protection ring 170 is disposed on the substrate 110 , and the inner ESD protection ring 170 is electrically connected to the active device array 120 and any one of the FPC pads 150 respectively.

Since the internal ESD protection ring 170 is electrically connected to the FPC pad 150, and the FPC pad 150 is electrically connected to the detection circuit 130 via the connection wire 160, when an electrostatic discharge occurs in the active device array 120, The current can then flow into the detection circuit 130 through the internal ESD protection ring 170 , the flexible circuit board pad 150 and the connecting wire 160 , so as to reduce the possibility of damage to the circuit caused by electrostatic discharge. In other words, the detection line 130 can be used as an external electrostatic protection ring.

FIG. 2 is a schematic diagram of the active device array substrate after cutting according to the first embodiment of the present invention. Please refer to FIG. 1 and FIG. 2 at the same time. After the detection is completed, the connecting wire 160 is cut off to form the active device array substrate 10 . At this time, the connecting wire 160 extends to the edge of the substrate 110 .

second embodiment

3 is a partially enlarged view of the active device array substrate before cutting according to the second embodiment of the present invention. Please refer to FIG. 3 , this embodiment is similar to the first embodiment, the difference is that: in order to prevent the detection signal from interfering with the operation of the active device array 120, the active device array substrate of this embodiment further includes a plurality of unidirectional switch elements 180 , which are disposed between some of the flexible circuit board pads 150 and the connecting wires 160 , and each one-way switch element 180 is connected to the flexible printed circuit board pads 150 and the connecting wires 160 .

Each one-way switch element 180 includes a gate 180g, a source 180s and a drain 180d, wherein the gate 180g is electrically connected to any flexible printed circuit pad 150 . The source 180s is electrically connected to the gate 180g, and the drain 180d is electrically connected to the connection line 160 . In this embodiment, some of the flexible circuit board pads 150 are electrically connected to the connecting wire 160 via two one-way switch elements 180 . However, only one unidirectional switch element 180 may be used in this embodiment. In more detail, each unidirectional switch element 180 further includes a semiconductor layer 182 and a transparent conductive layer 184, wherein the semiconductor layer 182 is disposed above the gate 180g. In addition, the source 180s is electrically connected to the gate 180g via the contact windows 186a, 186b and the transparent conductive layer 184 .

Since the one-way switch element 180 is disposed between some of the flexible circuit board pads 150 and the connecting wire 160 , the detection signal is less likely to interfere with the operation of the active device array 120 during the detection process. In addition, when the electrostatic discharge occurs, the current can directly flow into the detection circuit 130 through the one-way switch element 180 to achieve the function of electrostatic discharge protection.

4 is a partially enlarged view of the active device array substrate after cutting according to the second embodiment of the present invention. Please refer to FIG. 3 and FIG. 4 at the same time. Like the first embodiment, after the detection is completed, the connecting wire 160 is cut off. At this time, the connecting wire 160 extends to the edge of the substrate 110 .

third embodiment

FIG. 5 is a schematic diagram of the active device array substrate before cutting according to the third embodiment of the present invention. Please refer to FIG. 5 , this embodiment is similar to the first embodiment, the difference is that: in the active element array substrate 10' of this embodiment, the substrate 110 is divided into a plurality of panel areas 110a, and the plurality of active elements The arrays 120 are respectively disposed on the panel areas 110a. In addition, some of the FPC pads 150 on each panel area 110 a are electrically connected to the detection circuit 130 via the connecting wire 160 .

To put it simply, each active device array 120 is electrically connected to the detection circuit 130 via the internal ESD protection ring 170 , the flexible circuit board pad 150 and the connecting wire 160 . Therefore, when the electrostatic discharge occurs, the current can flow into the detection circuit 130 to reduce the possibility of damage to the circuit caused by the electrostatic discharge. Likewise, the one-way switch element 180 of the second embodiment can also be applied in this embodiment.

In summary, compared with the prior art, the present invention has at least the following advantages:

1. In the present invention, the internal static protection ring is electrically connected to the pad of the flexible circuit board, and the pad of the flexible circuit board is then electrically connected to the detection circuit through the connection wire, so the detection circuit can be used as an external static protection ring to Reduce the possibility of electrostatic discharge damage to the circuit.

2. In the present invention, the one-way switching element is arranged between some of the flexible circuit board pads and the connecting wires. Therefore, during the detection process, the detection signal is less likely to interfere with the operation of the active element array.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.

Claims (8)

1. An active element array substrate, comprising: a substrate; an active element array configured on the substrate; a detection circuit configured on the substrate and electrically connected to the active element array; A plurality of driver chip pads are arranged on the substrate and electrically connected to the active element array; A plurality of flexible circuit board pads are arranged on the substrate; A plurality of connection lines are arranged on the substrate, and each connection line is respectively connected to any one of the flexible circuit board pads and the detection line; and An internal static protection ring is configured on the substrate, and the internal static protection ring is electrically connected to the active element array and any one of the flexible circuit board pads respectively. 2. The active device array substrate according to claim 1, further comprising a plurality of unidirectional switch elements disposed between some of the flexible circuit board pads and the connecting lines, and each unidirectional switch element The switching element is connected to any of the flexible printed circuit board pads and any of the connecting lines, and each unidirectional switching element includes: a gate electrically connected to any one of the flexible circuit board pads; a source electrically connected to the gate; and A drain electrically connected to the connection line. 3. The active device array substrate according to claim 1, wherein the detection circuit includes a plurality of test pads and a plurality of test lines electrically connected to the test pads, and the test pads include even-numbered scan lines for testing pad, odd scan line test pad, even data line test pad, odd data line test pad and switch test pad. 4. An active element array substrate, comprising: a substrate; an active element array configured on the substrate; A plurality of driver chip pads are arranged on the substrate and electrically connected to the active element array; A plurality of flexible circuit board pads are arranged on the substrate; A plurality of connection lines are arranged on the substrate, and each connection line is respectively connected to the pads of the flexible circuit board, and the connection lines extend to the edge of the substrate; and An internal static protection ring is configured on the substrate, and the internal static protection ring is electrically connected to the active element array and any one of the flexible circuit board pads respectively. 5. The active device array substrate according to claim 4, further comprising a plurality of one-way switch elements electrically connected to some of the flexible circuit board pads and any of the connecting lines, and Each unidirectional switching element consists of: a grid electrically connected to any pad of the flexible printed circuit; a source electrically connected to the gate; and A drain electrically connected to the connection line. 6. An active element array substrate, comprising: a substrate, divided into multiple panel areas; A plurality of active element arrays are respectively arranged on the panel areas; A detection circuit is configured on the substrate and electrically connected to the active element arrays; A plurality of driving chip pads are respectively arranged on the panel areas, and are respectively electrically connected to any active element array; A plurality of flexible circuit board pads are respectively arranged on the panel areas; A plurality of connection lines are respectively arranged on the panel areas, and each connection line is respectively connected to any one of the flexible circuit board pads on each panel area and the detection line; and A plurality of internal electrostatic protection rings are respectively arranged on the panel areas, and each internal electrostatic protection ring is electrically connected to the active element array on the same panel area and any of the flexible circuit boards on the same panel area. pad. 7. The active device array substrate according to claim 6, further comprising a plurality of unidirectional switch elements disposed between some of the flexible circuit board pads and the connection lines on each panel area Between, and each unidirectional switch element is connected to any one of these flexible circuit board pads and any connection line, and each of the unidirectional switch elements includes: a gate electrically connected to any one of the flexible circuit board pads; a source electrically connected to the gate; and A drain electrically connected to the connection line. 8. The active device array substrate according to claim 6, wherein the detection circuit includes a plurality of test pads and a plurality of test lines electrically connected to the test pads, and the test pads include even-numbered scan line test pad, odd scan line test pad, even data line test pad, odd data line test pad and switch test pad.

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