CN101274742B - 一种抗水流冲击的体硅腐蚀配套设备 - Google Patents
一种抗水流冲击的体硅腐蚀配套设备 Download PDFInfo
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- CN101274742B CN101274742B CN2007100648616A CN200710064861A CN101274742B CN 101274742 B CN101274742 B CN 101274742B CN 2007100648616 A CN2007100648616 A CN 2007100648616A CN 200710064861 A CN200710064861 A CN 200710064861A CN 101274742 B CN101274742 B CN 101274742B
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- corrosion
- etching
- bulk silicon
- etching tank
- tank
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 72
- 239000010703 silicon Substances 0.000 title claims abstract description 72
- 238000005260 corrosion Methods 0.000 title abstract description 63
- 230000007797 corrosion Effects 0.000 title abstract description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract description 24
- 238000005530 etching Methods 0.000 claims abstract description 60
- 239000010453 quartz Substances 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims description 3
- 230000035939 shock Effects 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 29
- 238000010438 heat treatment Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2007100648616A CN101274742B (zh) | 2007-03-28 | 2007-03-28 | 一种抗水流冲击的体硅腐蚀配套设备 |
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CN2007100648616A CN101274742B (zh) | 2007-03-28 | 2007-03-28 | 一种抗水流冲击的体硅腐蚀配套设备 |
Publications (2)
Publication Number | Publication Date |
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CN101274742A CN101274742A (zh) | 2008-10-01 |
CN101274742B true CN101274742B (zh) | 2010-07-28 |
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CN2007100648616A Active CN101274742B (zh) | 2007-03-28 | 2007-03-28 | 一种抗水流冲击的体硅腐蚀配套设备 |
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CN (1) | CN101274742B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102074157B (zh) * | 2011-01-07 | 2012-01-11 | 华南理工大学 | 一种敷铜板腐蚀设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2220480Y (zh) * | 1995-03-06 | 1996-02-21 | 齐鲁乙烯塑料厂 | 一种石英晶体生产中用的籽晶固定架 |
US5677248A (en) * | 1994-03-30 | 1997-10-14 | Nippondenso Co., Ltd. | Method of etching semiconductor wafers |
CN2727191Y (zh) * | 2004-09-06 | 2005-09-21 | 中国科学院大连化学物理研究所 | 一种化学刻蚀机 |
CN1274582C (zh) * | 2004-05-12 | 2006-09-13 | 厦门大学 | 硅表面复杂三维微结构的加工方法及其装置 |
EP1745864A2 (en) * | 2005-07-18 | 2007-01-24 | DALSA Semiconductor Inc. | Method of removing residues formed during the manufacture of MEMS systems |
US20070042521A1 (en) * | 2005-08-16 | 2007-02-22 | Robert Bosch Gmbh | Microelectromechanical devices and fabrication methods |
-
2007
- 2007-03-28 CN CN2007100648616A patent/CN101274742B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5677248A (en) * | 1994-03-30 | 1997-10-14 | Nippondenso Co., Ltd. | Method of etching semiconductor wafers |
CN2220480Y (zh) * | 1995-03-06 | 1996-02-21 | 齐鲁乙烯塑料厂 | 一种石英晶体生产中用的籽晶固定架 |
CN1274582C (zh) * | 2004-05-12 | 2006-09-13 | 厦门大学 | 硅表面复杂三维微结构的加工方法及其装置 |
CN2727191Y (zh) * | 2004-09-06 | 2005-09-21 | 中国科学院大连化学物理研究所 | 一种化学刻蚀机 |
EP1745864A2 (en) * | 2005-07-18 | 2007-01-24 | DALSA Semiconductor Inc. | Method of removing residues formed during the manufacture of MEMS systems |
US20070042521A1 (en) * | 2005-08-16 | 2007-02-22 | Robert Bosch Gmbh | Microelectromechanical devices and fabrication methods |
Non-Patent Citations (2)
Title |
---|
石莎莉等.MEMS器件牺牲层腐蚀释放技术研究.微细加工技术 6.2006,(6),全文. |
石莎莉等.MEMS器件牺牲层腐蚀释放技术研究.微细加工技术 6.2006,(6),全文. * |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHA Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20130422 Owner name: INST OF MICROELECTRONICS, C. A. S Effective date: 20130422 |
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Effective date of registration: 20130422 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. Patentee after: Institute of Microelectronics of the Chinese Academy of Sciences Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee before: Institute of Microelectronics of the Chinese Academy of Sciences |