CN101272133B - band pass filter - Google Patents
band pass filter Download PDFInfo
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- CN101272133B CN101272133B CN2008101079212A CN200810107921A CN101272133B CN 101272133 B CN101272133 B CN 101272133B CN 2008101079212 A CN2008101079212 A CN 2008101079212A CN 200810107921 A CN200810107921 A CN 200810107921A CN 101272133 B CN101272133 B CN 101272133B
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Abstract
A band-pass filter is adapted to be disposed in a multilayer circuit board of a wireless communication module. The band-pass filter comprises an input end, a first inductor, a first capacitor, a first parasitic capacitor, a second inductor, a second parasitic capacitor, a third inductor, a third parasitic capacitor and an output end. The input end, the first inductor, the first capacitor, the second capacitor, the third inductor and the output end are electrically connected in series in sequence. The first parasitic capacitor is generated between the first inductor and the ground terminal. The second inductor is electrically connected with the first capacitor, the second capacitor and the grounding terminal. The second parasitic capacitance is generated between the second inductance, the first capacitance and the second capacitance and the grounding terminal. The second parasitic capacitor is electrically connected in parallel with the second inductor. The third parasitic capacitance is generated between the third inductance and the ground terminal and between the second capacitance and the ground terminal.
Description
Technical field
The invention relates to a kind of band pass filter, and particularly relevant for a kind of band pass filter that is made in the multilayer circuit board.
Background technology
Along with the progress of science and technology, (Wireless Local Area Network WLAN) waits wireless telecommunication system universal day by day for mobile phone, bluetooth (Bluetooth), household radio telephone (CordlessPhone), WLAN.Polygamy is equipped with band pass filter to reduce noise (noise) and to keep required signal in the wireless telecommunication system.In known technology, mostly band pass filter is to be arranged at the LTCC with sandwich construction, and (Low Temperature Co-fired Ceramic is LTCC) in the substrate.Yet the cost of manufacture of low-temperature co-fired ceramic substrate is higher.And, be arranged at band pass filter in the low-temperature co-fired ceramic substrate and need in addition that (Surface MountTechnology is SMT) then on circuit base plate and occupy the surface area of circuit base plate part by surface mount technology.
Summary of the invention
The present invention proposes a kind of band pass filter, its can be made in the multilayer circuit board and its cost of manufacture lower.
The present invention proposes a kind of band pass filter, and its wiring space is littler.
For specifically describing content of the present invention, propose a kind of band pass filter at this and be suitable for being produced in the multilayer circuit board of wireless communication module.Band pass filter comprises an input (input), one first inductance (inductor), one first electric capacity, one first parasitic capacitance (parasitic capacitor), one second electric capacity, one second inductance, one second parasitic capacitance, one the 3rd inductance, a trixenie electric capacity and an output (output).
First end of first inductance is electrically connected (series connected) in input.First end (terminal) of first electric capacity electrically is series at second end of first inductance.First parasitic capacitance results between first inductance and first electric capacity and the earth terminal (grounding).First end of second electric capacity electrically is connected in series in second end of first electric capacity.First end of first end of second inductance and second end of first electric capacity and second electric capacity electrically connects, and second end of second inductance and earth terminal electric connection.
Second parasitic capacitance results between second inductance, first electric capacity and second electric capacity and the earth terminal, and second parasitic capacitance (parallel connected) electrically in parallel is in second inductance.First end of the 3rd inductance electrically is series at second end of second electric capacity.Trixenie electric capacity results between the 3rd inductance and second electric capacity and the earth terminal.Output electrically is series at second end of the 3rd inductance.
For specifically describing content of the present invention, propose a kind of band pass filter at this and be suitable for being produced in the multilayer circuit board of wireless communication module.Band pass filter comprises a plurality of patterned conductive layers.Patterned conductive layer is the compartment of terrain overlay configuration in regular turn, and patterned conductive layer comprises one first patterned conductive layer, one second patterned conductive layer, one the 3rd patterned conductive layer, one the 4th patterned conductive layer, one the 5th patterned conductive layer and one the 6th patterned conductive layer.
First patterned conductive layer comprises an input.Second patterned conductive layer comprises one first planar coil (plane coil), one first internal electrode (inner electrode) and one first ground plane (ground plane).First ground plane has one first opening (opening), and first planar coil is in first opening and be series between the input and first internal electrode.First internal electrode is arranged in first opening and electrically connects with first planar coil, and forms one first parasitic capacitance between first planar coil and first internal electrode and first ground plane.The 3rd patterned conductive layer comprises one second internal electrode, and second internal electrode is positioned at first internal electrode top, to form one first electric capacity.
The 4th patterned conductive layer comprises one second planar coil, one the 3rd internal electrode and one second ground plane.Second ground plane has one second opening, and the 3rd internal electrode is arranged in second opening and electrically connects with second internal electrode.Second planar coil is arranged in second opening and electrically connects with the 3rd internal electrode, wherein forms one second parasitic capacitance between second planar coil and the 3rd internal electrode and second ground plane.
The 5th patterned conductive layer comprises one the 3rd planar coil, one the 4th internal electrode and one the 3rd ground plane.The 3rd ground plane and second planar coil electrically connect and have the 3rd opening that is positioned at second opening top.The 4th internal electrode is arranged in the 3rd opening and is positioned at the 3rd internal electrode top, to form one second electric capacity.The 3rd planar coil is arranged in the 3rd opening and electrically connects with the 4th internal electrode, wherein forms a trixenie electric capacity between the 3rd planar coil and the 4th internal electrode and the 3rd ground plane.The 6th patterned conductive layer comprises an output, and output and the 3rd planar coil electrically connect.
In one embodiment of this invention, band pass filter also comprises a conduction duct, and the conduction duct is between the 3rd patterned conductive layer and the 4th patterned conductive layer, and the conduction duct electrically connects second internal electrode and the 3rd internal electrode.
In one embodiment of this invention, band pass filter also comprises a conduction duct, and the conduction duct is disposed between first planar coil and the input, and the conduction duct electrically connects first planar coil and input.
In one embodiment of this invention, band pass filter also comprises a conduction duct, and the conduction duct is disposed between the 3rd ground plane and second planar coil, and the conduction duct electrically connects the 3rd ground plane and second planar coil.
In one embodiment of this invention, band pass filter also comprises a conduction duct, and the conduction duct is disposed between output and the 3rd planar coil, and the conduction duct electrically connects output and the 3rd planar coil.
In one embodiment of this invention, the 3rd patterned conductive layer also comprises one the 4th ground plane, and the 4th ground plane has the 4th opening that is positioned at first opening top, and second internal electrode is arranged in the 4th opening.
In one embodiment of this invention, first patterned conductive layer also comprises one the 5th ground plane, and the 5th ground plane has one the 5th opening and one the 6th opening, and input is arranged in the 5th opening.
In one embodiment of this invention, the 6th opening is positioned at first internal electrode below.
In one embodiment of this invention, the 6th patterned conductive layer also comprises one the 6th ground plane, and the 6th ground plane has a minion mouth and an octavo mouth, and output is arranged in the minion mouth.
In one embodiment of this invention, the octavo mouth is positioned at the 4th internal electrode top.The present invention adopts the parasitic capacitance mode to produce direct-to-ground capacitance in the band pass filter prototype circuit and shunt capacitance, not only can save the space, more can avoid producing in the known technology problem of low-capacitance electric capacity.The present invention is made in band pass filter in the multilayer circuit board, and therefore the cost of manufacture of band pass filter of the present invention is low than the band pass filter in the known technology.
Description of drawings
For above and other objects of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below, wherein:
Fig. 1 is the circuit diagram of the band pass filter of one embodiment of the invention.
Fig. 2 is the schematic perspective view of the band pass filter of another embodiment of the present invention.
Embodiment
Fig. 1 is the circuit diagram of the band pass filter of one embodiment of the invention.Please refer to Fig. 1, the band pass filter 100 of present embodiment is suitable for being produced in the multilayer circuit board of wireless communication module.Band pass filter 100 comprises an input I, one first inductance L 1, one first capacitor C 1, one first parasitic capacitance P1, one second capacitor C 2, one second inductance L 2, one second parasitic capacitance P2, one the 3rd inductance L 3, a trixenie capacitor P 3 and an output O.
First end of first inductance L 1 electrically is series at input I.First end of first capacitor C 1 electrically is series at second end of first inductance L 1.The first parasitic capacitance P1 results between first inductance L 1 and first capacitor C 1 and the earth terminal.In other words, the first parasitic capacitance P1 is the parasitic capacitance over the ground of first inductance L 1 and first capacitor C 1.First end of second capacitor C 2 electrically is connected in series in second end of first capacitor C 1.First end of second end of first end of second inductance L 2 and first capacitor C 1 and second capacitor C 2 electrically connects, and second end of second inductance L 2 and earth terminal electric connection.
The second parasitic capacitance P2 results between second inductance L 2, first capacitor C 1 and second capacitor C 2 and the earth terminal, and the second parasitic capacitance P2 electrically is parallel to second inductance L 2.In other words, the second parasitic capacitance P2 is the parasitic capacitance over the ground of second inductance L 2, first capacitor C 1 and second capacitor C 2.
First end of the 3rd inductance L 3 electrically is series at second end of second capacitor C 2.Trixenie capacitor P 3 results between the 3rd inductance L 3 and second capacitor C 2 and the earth terminal.In other words, trixenie capacitor P 3 is parasitic capacitances over the ground of the 3rd inductance L 3 and second capacitor C 2.Output O electrically is series at second end of the 3rd inductance L 3.
With next will the introduction band pass filter 100 will be applied to embodiment in the multilayer circuit board.
Fig. 2 is the schematic perspective view of the band pass filter of another embodiment of the present invention.Please refer to Fig. 2, band pass filter 200 comprises a plurality of patterned conductive layers, and these patterned conductive layers compartment of terrain overlay configuration in regular turn.In the present embodiment, band pass filter 200 is suitable for being produced in the multilayer circuit board (for example being printed circuit board (PCB)) of wireless communication module, and the configurable between any two at least one dielectric layers of these patterned conductive layers (not illustrating) are to separate these patterned conductive layers.The material of these patterned conductive layers for example is copper or other electric conducting material that is fit to.
These patterned conductive layers comprise one first patterned conductive layer 210, one second patterned conductive layer 220, one the 3rd patterned conductive layer 230, one the 4th patterned conductive layer 240, one the 5th patterned conductive layer 250 and one the 6th patterned conductive layer 260.
First patterned conductive layer 210 comprises an input I.In addition, in the present embodiment, first patterned conductive layer 210 comprises that also one the 5th ground plane, 212, the five ground planes 212 have one the 5th opening OP5 and one the 6th opening OP6, and input I is arranged in the 5th opening OP5.
Second patterned conductive layer 220 comprises one first planar coil 222, one first internal electrode 224 and one first ground plane 226.First ground plane 226 has one first opening OP1, and first planar coil 222 is in the first opening OP1 and be series between the input I and first internal electrode 224.First planar coil 222 for example is to be electrically connected by a conduction duct H1 who is disposed between the two with input I.In present embodiment, first planar coil 222 can be used as one first inductance, i.e. the label L1 of Fig. 1.The shape of first planar coil 222 for example be rectangular coil, round screw thread, octangle spiral or other be fit to spiral-shaped.
First internal electrode 224 is arranged in the first opening OP1 and electrically connects with first planar coil 222.In present embodiment, the 6th opening OP6 is positioned at first internal electrode, 224 belows, to avoid producing unnecessary parasitic capacitance between first internal electrode 224 and the 5th ground plane 212.In addition, because first planar coil 222 and first internal electrode 224 all are arranged in the first opening OP1, therefore will produce one first parasitic capacitance between first planar coil 222 and first internal electrode 224 and first ground plane 226, i.e. the label P1 of Fig. 1.That is to say that first parasitic capacitance is the parasitic capacitance over the ground of first planar coil 222 and first internal electrode 224.
The 3rd patterned conductive layer 230 comprises one second internal electrode 232.Second internal electrode 232 is positioned at first internal electrode, 224 tops, and therefore first internal electrode 224 and second internal electrode 232 can constitute one first electric capacity, i.e. the label C1 of Fig. 1.In addition, in the present embodiment, the 3rd patterned conductive layer 230 also comprises one the 4th ground plane 234.The 4th ground plane 234 has the 4th an opening OP4 who is positioned at first opening OP1 top, and second internal electrode 232 is arranged in the 4th opening OP4.
The 4th patterned conductive layer 240 comprises one second planar coil 242, one the 3rd internal electrode 244 and one second ground plane 246.Second ground plane 246 has one second opening OP2, and the 3rd internal electrode 244 is arranged in the second opening OP2 and electrically connects with second internal electrode 232.Second planar coil 242 is arranged in the second opening OP2 and electrically connects with the 3rd internal electrode 244.In present embodiment, second planar coil 242 for example is as one second inductance, i.e. the label L2 of Fig. 1.
In addition, in present embodiment, because second planar coil 242 and the 3rd internal electrode 244 all are arranged in the second opening OP2, therefore produce one second parasitic capacitance, i.e. the label P2 of Fig. 1 between second planar coil 242 and the 3rd internal electrode 244 and the ground plane 246.That is to say that second parasitic capacitance is the parasitic capacitance over the ground of second planar coil 242, second internal electrode 232 and the 3rd internal electrode 244.
In the present embodiment, band pass filter 200 also comprises a conduction duct 270, conduction duct 270 is disposed between the 3rd patterned conductive layer 230 and the 4th patterned conductive layer 240, and conduction duct 270 electrically connects second internal electrode 232 and the 3rd internal electrode 244.That is to say that the 3rd internal electrode 244 can be electrically connected to second internal electrode 232 by conduction duct 270.
The 5th patterned conductive layer 250 comprises one the 3rd planar coil 252, one the 4th internal electrode 254 and one the 3rd ground plane 256.The 3rd ground plane 256 and second planar coil 242 electrically connect and have the 3rd an opening OP3 who is positioned at second opening OP2 top.The 3rd planar coil 252 can be used as one the 3rd inductance, i.e. the label L3 of Fig. 1.In the present embodiment, the 3rd ground plane 256 and second planar coil 242 for example are to electrically connect by a conduction duct H2 who is disposed between the two.
The 4th internal electrode 254 is arranged in the 3rd opening OP3 and is positioned at the 3rd internal electrode 244 tops, and the 3rd internal electrode 244 and the 4th internal electrode 254 for example constitute one second electric capacity, i.e. the label C2 of Fig. 1.The 3rd planar coil 252 is arranged in the 3rd opening OP3 and electrically connects with the 4th internal electrode 254.
In present embodiment, because the 3rd planar coil 252 and the 4th internal electrode 254 all are arranged in the 3rd opening OP3, therefore produce a trixenie electric capacity, i.e. the label P3 of Fig. 1 between the 3rd planar coil 252 and the 4th internal electrode 254 and the 3rd ground plane 256.That is to say that trixenie electric capacity is the parasitic capacitance over the ground of the 3rd planar coil 252 and the 4th internal electrode 254.
In addition, in present embodiment, second opening OP2 of part and the 4th opening OP4 are between the 3rd planar coil 252 and first planar coil 222, with the quality factor (Q value) that promotes first inductance and the 3rd inductance and reduce the wastage.
The 6th patterned conductive layer 260 comprises an output O, and output O and the 3rd planar coil 252 electrically connect.In the present embodiment, output O and the 3rd planar coil 252 for example are to be electrically connected by a conduction duct H3 who is disposed between the two.In addition, the 6th patterned conductive layer 260 also comprises one the 6th ground plane 262.The 6th ground plane 262 has a minion mouth OP7 and an octavo mouth OP8, and output O is arranged in minion mouth OP7.Octavo mouth OP8 is positioned at the top of the 4th internal electrode 254, to avoid producing unnecessary parasitic capacitance between the 4th internal electrode 254 and the 6th ground plane 262.
In sum, the present invention adopts the parasitic capacitance mode to produce direct-to-ground capacitance in the band pass filter prototype circuit and shunt capacitance, not only can save the space, more can avoid producing in the known technology problem of low-capacitance electric capacity.
In addition, be mounted to the band pass filter of circuit board after known independent the making, the present invention is by producing band pass filter in circuit board when making multilayer circuit board, therefore the more known band pass filter person of the cost of manufacture of band pass filter of the present invention is low.And, must be mounted to the surface of circuit board compared to known band pass filter, because band pass filter of the present invention is directly to be made in the circuit board, therefore can not occupy the surface area of circuit board.
In addition, all component of band pass filter of the present invention (as electric capacity and inductance etc.) is formed by the processing procedure of general circuit plate, so the design freedom of each assembly big (as the shape of capacitance, inductance value and inductance coil etc.).Moreover band pass filter of the present invention produces first, second and trixenie electric capacity by specific configuration and additional designs again, and therefore the processing procedure of band pass filter of the present invention is comparatively simplified.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; any person with usual knowledge in their respective areas; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that claim scope of the present invention defined.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101079212A CN101272133B (en) | 2008-05-21 | 2008-05-21 | band pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101079212A CN101272133B (en) | 2008-05-21 | 2008-05-21 | band pass filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101272133A CN101272133A (en) | 2008-09-24 |
| CN101272133B true CN101272133B (en) | 2011-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101079212A Expired - Fee Related CN101272133B (en) | 2008-05-21 | 2008-05-21 | band pass filter |
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| CN (1) | CN101272133B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152002A (en) * | 2011-12-07 | 2013-06-12 | 天津海泰超导电子有限公司 | Conode series resonance structure inductance-capacitance filter |
| CN108964626B (en) * | 2018-07-06 | 2022-04-19 | 成都仕芯半导体有限公司 | Analog band-pass filter |
| CN110474618B (en) * | 2019-08-29 | 2022-07-08 | 江苏飞特尔通信有限公司 | Ultra-small high-Q-value band-pass filter based on LTCC process |
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2008
- 2008-05-21 CN CN2008101079212A patent/CN101272133B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN101272133A (en) | 2008-09-24 |
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Granted publication date: 20110420 |
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