[go: up one dir, main page]

CN101270492B - Stannum copper alloy coating, plating solution and electroplating method - Google Patents

Stannum copper alloy coating, plating solution and electroplating method Download PDF

Info

Publication number
CN101270492B
CN101270492B CN2007100087310A CN200710008731A CN101270492B CN 101270492 B CN101270492 B CN 101270492B CN 2007100087310 A CN2007100087310 A CN 2007100087310A CN 200710008731 A CN200710008731 A CN 200710008731A CN 101270492 B CN101270492 B CN 101270492B
Authority
CN
China
Prior art keywords
tin
coating
copper alloy
electroplate liquid
class additive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007100087310A
Other languages
Chinese (zh)
Other versions
CN101270492A (en
Inventor
吴进家
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Roring Industries Xiamen Ltd
Original Assignee
Roring Industries Xiamen Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roring Industries Xiamen Ltd filed Critical Roring Industries Xiamen Ltd
Priority to CN2007100087310A priority Critical patent/CN101270492B/en
Publication of CN101270492A publication Critical patent/CN101270492A/en
Application granted granted Critical
Publication of CN101270492B publication Critical patent/CN101270492B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a tin-copper alloy plating layer, a plating liquid prescription and a plating method. The plating layer calculated by weight comprises at least 55 to 60 percent of tin as well as 40 to 45 percent of copper; while the plating liquid prescription mainly includes stannous chloride of 20 to 40g/l and copper pyrophosphate of 10 to 30g/l that are respectively as the main salt oftin and copper. The prescription also includes potassium pyrophosphate of 250 to 350g/l used as a main complexing agent; potassium chloride of 30 to 40g/l used as an auxiliary complexing agent; stannic chloride pentahydrate of 10 to 30g/l to main the stability of the plating liquid; the pH value is controlled between 8.0 to 9.0; a class I additive of 0.5 to 5ml/l and a class II additive of 0.5 to3ml/l are also added. The scheme can be adopted to lead the plating layer to have the advantages of better heat stability, hard color changing, being more environment protective and being able to avoid the skin from nickel sensitivity.

Description

锡铜合金镀层的电镀液及电镀方法 Electroplating solution and electroplating method for tin-copper alloy coating

技术领域technical field

本发明涉及一种电镀的技术领域,尤指一种锡铜合金镀层的电镀液及电镀方法。 The invention relates to the technical field of electroplating, in particular to an electroplating solution and an electroplating method for a tin-copper alloy coating. the

背景技术Background technique

许多工件(例如饰品、手表或装饰配件、手机等)表面均电镀有一层装饰镀层,以形成光亮表面,从而起到装饰或防护作用。早期的装饰镀层通常为镍镀层或铬镀层,而此种镀层在有氧环镜中易变色发黄,影响外观;而且,形成上述镀层的电镀液中通常含有氰化物,而氰化物有毒,不利于制程作业员的健康,且不利于环保;再者,镍常会导致皮肤过敏,因此对于经常与人体皮肤接触的产品,例如眼镜镜脚、手表、耳环、戒指、项链等饰品、手机机壳、手机饰品等,则不适合使用镍镀层。 Many workpieces (such as ornaments, watches or decorative accessories, mobile phones, etc.) are electroplated with a layer of decorative coating to form a bright surface, thereby playing a decorative or protective role. The early decorative coatings are usually nickel or chromium coatings, and this coating is prone to discoloration and yellowing in the aerobic ring mirror, which affects the appearance; moreover, the electroplating solution that forms the above coatings usually contains cyanide, and cyanide is poisonous. It is beneficial to the health of process workers and not conducive to environmental protection; moreover, nickel often causes skin allergies, so for products that often come into contact with human skin, such as glasses temples, watches, earrings, rings, necklaces and other accessories, mobile phone cases, Mobile phone accessories, etc., are not suitable for nickel plating. the

为此,目前有业者以铜锡合金镀层作为装饰镀层。该铜锡合金镀层通常为白铜锡,其虽然不含有镍而不会导致皮肤过敏,但其电镀层液中同样含有氰化物或铅等重金属以帮助电镀,从而不利于环保。不但如此,此种镀层还存在下述缺点:首先,上述铜锡合金镀层的比例是铜的比例高于锡的比例,通常为铜≥70%,锡≤30%,其热稳定性差,高温后易变黄,影响外观美感,所以在铜锡合金镀层上需再电镀一层面色镀层,如锡钴镀层、三价铬或贵金属镀层(例如钯镀层、金镀层、铑镀层以及钯铜合金镀层),其作用在于增加其抗蚀性及美观性;其次,形成上述铜锡合金镀层的电镀液中,含有焦磷酸亚锡,其为二价锡,在电解过程中,因空气中O2的原因或电镀中阳极氧化的原因,使二价锡转变为四价锡,从而导致四价锡累积,使电镀层性能差,进而令使用寿命短,镀层表面光亮度亦会差,会发黑,产生雾面。 For this reason, at present, some operators use the copper-tin alloy coating as the decorative coating. The copper-tin alloy coating is usually cupronickel tin, although it does not contain nickel and will not cause skin allergies, but its electroplating solution also contains heavy metals such as cyanide or lead to help electroplating, which is not conducive to environmental protection. Not only that, but this kind of coating also has the following disadvantages: first, the ratio of the above-mentioned copper-tin alloy coating is that the ratio of copper is higher than that of tin, usually copper≥70%, tin≤30%, and its thermal stability is poor. It is easy to turn yellow and affect the aesthetic appearance, so it is necessary to electroplate a color coating on the copper-tin alloy coating, such as tin-cobalt coating, trivalent chromium or precious metal coating (such as palladium coating, gold coating, rhodium coating and palladium-copper alloy coating) , its role is to increase its corrosion resistance and aesthetics; secondly, the electroplating solution that forms the above-mentioned copper-tin alloy coating contains stannous pyrophosphate, which is divalent tin. During the electrolysis process, due to the O2 in the air Or the reason for anodic oxidation in electroplating is to convert divalent tin into tetravalent tin, which leads to the accumulation of tetravalent tin, which makes the performance of the electroplating layer poor, thereby shortening the service life, and the surface brightness of the coating layer will also be poor, blackening, and fogging noodle.

发明内容Contents of the invention

本发明的目的在于提供一种锡铜合金镀层的电镀液及电镀方法,其可令镀层的热稳定性更好、不易变色,且更环保,还可避免皮肤镍过敏。 The object of the present invention is to provide an electroplating solution and an electroplating method for a tin-copper alloy coating, which can make the thermal stability of the coating better, less prone to discoloration, more environmentally friendly, and avoid skin nickel allergy. the

为实现上述目的,本发明的技术解决方案是: For realizing the above object, technical solution of the present invention is:

一种锡铜合金镀层,其以重量计包含至少55-60%的锡及40-45%的铜。 A tin-copper alloy coating comprising at least 55-60% tin and 40-45% copper by weight. the

一种形成所述锡铜合金镀层的电镀液配方,其包括20-40g/l的氯化亚锡和10-30g/l的焦磷酸铜分别做为锡和铜的主盐;还包括250-350g/l的焦磷酸钾做为主络合剂,30-40g/l的碱金属族氯盐或碱土族氯盐做为辅助络合剂,10-30g/l的五水合氯化锡做为镀液稳定剂,pH值控制在8.0~9.0;另外,该电镀液亦加入0.5~5ml/l的I类添加剂及0.5~3ml/l的II类添加剂;该I类添加剂为含有-(CH2OCH2)n-和-(C6H4)-(OC2H5)nOH结构的聚醚化合物;而II类添加剂为含有NH2-CH2-COOH,-CO-NH-结构的化合物。 An electroplating solution formula for forming the tin-copper alloy coating, which includes 20-40g/l stannous chloride and 10-30g/l copper pyrophosphate as the main salt of tin and copper respectively; also includes 250- 350g/l potassium pyrophosphate as the main complexing agent, 30-40g/l alkali metal chloride salt or alkaline earth chloride salt as auxiliary complexing agent, 10-30g/l tin chloride pentahydrate as Plating solution stabilizer, the pH value is controlled at 8.0-9.0; in addition, the electroplating solution is also added with 0.5-5ml/l type I additive and 0.5-3ml/l type II additive; the type I additive contains -(CH 2 OCH 2 ) n - and -(C 6 H 4 )-(OC 2 H 5 ) n OH structure polyether compounds; and class II additives are compounds containing NH 2 -CH 2 -COOH, -CO-NH- structures .

所述I类添加剂为聚乙二醇、聚乙二醇烷基醇醚或烷基酚聚氧乙烯醚。 The class I additive is polyethylene glycol, polyethylene glycol alkyl alcohol ether or alkylphenol polyoxyethylene ether. the

所述II类添加剂为氨基酸、明胶或多肽。 The class II additive is amino acid, gelatin or polypeptide. the

一种采用上述电镀液形成所述锡铜合金电镀层的电镀方法:首先,于一电镀槽中加入前述的锡铜合金镀层的电镀液;接着,将工件浸置于该电镀槽的电镀液中作为阴极,同时设置阳极;最后,在阳极与阴极之间通上直流电,而形成锡铜合金镀层的电流密度控制在0.5-2ASD,且电镀槽内温度控制在15-30℃。 An electroplating method for forming the tin-copper alloy electroplating layer by using the above electroplating solution: first, adding the aforementioned electroplating solution of the tin-copper alloy coating in an electroplating tank; then, immersing the workpiece in the electroplating solution of the electroplating tank As the cathode, an anode is set at the same time; finally, a direct current is passed between the anode and the cathode, and the current density for forming the tin-copper alloy coating is controlled at 0.5-2ASD, and the temperature in the electroplating tank is controlled at 15-30°C. the

所述阳极可为活性炭板、不锈钢板或DSA等。 The anode can be activated carbon plate, stainless steel plate or DSA etc. the

所述阳极外部以PP编织带套住。 The outside of the anode is covered with a PP braid. the

所述电镀液当焦磷酸钾为250、300、350g/l时,焦磷酸铜为17g/l,氯化亚锡为25g/l,五水合氯化锡为25g/l,氯化钾为30g/l,I类添加剂为0.5ml/l,而II类添加剂为1ml/l;此时,所述电镀槽内温度为20℃;电流密度为0.8ASD。 When potassium pyrophosphate is 250,300,350g/l in described electroplating solution, copper pyrophosphate is 17g/l, stannous chloride is 25g/l, tin chloride pentahydrate is 25g/l, and potassium chloride is 30g /l, Type I additive is 0.5ml/l, and Type II additive is 1ml/l; at this time, the temperature in the electroplating bath is 20°C; the current density is 0.8ASD. the

所述电镀液当焦磷酸钾为250、300、350g/l时,焦磷酸铜为17g/l,氯化亚锡为30g/l,五水合氯化锡为20g/l,氯化钾为35g/l,I类添加剂为1ml/l,而II类添加剂为1ml/l;此时,所述电镀槽内温度为25℃;电流密度为1.2ASD。 When potassium pyrophosphate is 250,300,350g/l in described electroplating solution, copper pyrophosphate is 17g/l, stannous chloride is 30g/l, tin chloride pentahydrate is 20g/l, and potassium chloride is 35g /l, type I additive is 1ml/l, and type II additive is 1ml/l; at this time, the temperature in the electroplating tank is 25°C; the current density is 1.2ASD. the

所述电镀液当焦磷酸钾为250、300、350g/l时,焦磷酸铜为17g/l,氯化亚锡为35g/l,五水合氯化锡为15g/l,氯化钾为40g/l,I类添加剂为1.5ml/l,而II类添加剂为1.5ml/l;此时,所述电镀槽内温度为30℃;电流密度为1.6ASD。 When potassium pyrophosphate is 250,300,350g/l in described electroplating solution, copper pyrophosphate is 17g/l, stannous chloride is 35g/l, tin chloride pentahydrate is 15g/l, and potassium chloride is 40g /l, type I additive is 1.5ml/l, and type II additive is 1.5ml/l; at this time, the temperature in the electroplating tank is 30°C; the current density is 1.6ASD. the

采用上述方案后,本发明具有下述优点: After adopting the above scheme, the present invention has the following advantages:

1、由于本发明的锡铜合金镀层的电镀液不含氰化物,不仅污水处理成本较低廉,且可有效保障电镀制程作业员的健康。因此,根据本发明的装饰镀层不仅性能可满足消费者需求,并无任何重金属添加、符合ROHS-WEEE的一切标准,且其制程符合环保环保意识。 1. Since the electroplating solution of the tin-copper alloy coating of the present invention does not contain cyanide, not only the cost of sewage treatment is relatively low, but also the health of the electroplating process operators can be effectively guaranteed. Therefore, the performance of the decorative coating according to the present invention can not only meet the needs of consumers, but also does not contain any heavy metals, complies with all standards of ROHS-WEEE, and its manufacturing process conforms to environmental awareness. the

2、由于本发明所述装饰镀层的镍释放量小于0.05ppm,因此制成的产品可供给特殊体质对镍过敏的消费者使用,不会有过敏之虞。 2. Since the nickel release amount of the decorative coating of the present invention is less than 0.05ppm, the finished product can be used by consumers who are allergic to nickel with special constitutions, without any risk of allergies. the

3、本发明锡铜合金镀层的抗变色能力最佳,可克服习知钴镀层或镍镀层于氧气中易变色的缺点,因此在锡铜合金镀层上可不必再镀上一层色面镀层就可达到耐久不变色的目的。 3. The anti-tarnish ability of the tin-copper alloy coating of the present invention is the best, which can overcome the shortcoming that the conventional cobalt coating or nickel coating is easy to change color in oxygen, so it is not necessary to coat the tin-copper alloy coating with a layer of colored surface It can achieve the purpose of durability and no discoloration. the

4、本发明的锡铜合金镀层抗蚀能力与韧性皆高于习知的光亮镍镀层,且硬度与镍镀层相当,因此可替代光亮镍镀层做为装饰性镀层。 4. The corrosion resistance and toughness of the tin-copper alloy coating of the present invention are higher than that of the conventional bright nickel coating, and the hardness is equivalent to that of the nickel coating, so it can replace the bright nickel coating as a decorative coating. the

具体实施方式Detailed ways

本发明所述的镀层为锡铜合金镀层用以形成在工件表面,该锡铜合金镀层以重量计包含至少55-60%的锡,40-45%的铜,及1%的不可避免的杂质。 The coating of the present invention is a tin-copper alloy coating for forming on the surface of a workpiece, and the tin-copper alloy coating comprises at least 55-60% tin by weight, 40-45% copper, and 1% unavoidable impurities . the

而形成前述锡铜合金镀层的电镀液系使用氯化亚锡(20-40g/l)和焦磷酸铜(10-30g/l)分别做为锡和铜的主盐,焦磷酸钾(250-350g/l)做为主络合剂,碱金属族氯盐(如氯化钾、氯化锂、氯化钠等)或碱土族氯盐(如氯化铍、氯化镁、氯化钙等)(30-40g/l)做为辅助络合剂,五水合氯化锡(10-30g/l)做为镀液稳定剂,pH值控制在8.0~9.0。另外,锡铜合金电镀液亦加入I类添加剂(0.5~5ml/l)及II类添加剂(0.5~3ml/l)以得到全光亮整平性良好的镀层,其应力及镀层延展性亦能控制良好。I类添加剂为含有-(CH2OCH2)n-或-(C6H4)-(OC2H5)nOH等结构聚醚化合物(例如:聚乙二醇、聚乙二醇烷基醇醚或烷基酚聚氧乙烯醚);而II类添加剂为含有NH2-CH2-COOH或-CO-NH-结构的化合物(例如:氨基酸,明胶,多肽等)。该锡铜合金电镀液的最大特色是其电镀效率高于目前许多无氰锡铜合金电镀液。 The electroplating solution system that forms the aforementioned tin-copper alloy coating uses stannous chloride (20-40g/l) and copper pyrophosphate (10-30g/l) as the main salt of tin and copper respectively, and potassium pyrophosphate (250- 350g/l) as the main complexing agent, alkali metal chloride salts (such as potassium chloride, lithium chloride, sodium chloride, etc.) or alkaline earth chloride salts (such as beryllium chloride, magnesium chloride, calcium chloride, etc.) ( 30-40g/l) as an auxiliary complexing agent, tin chloride pentahydrate (10-30g/l) as a plating solution stabilizer, and the pH value is controlled at 8.0-9.0. In addition, the tin-copper alloy electroplating solution is also added with type I additives (0.5-5ml/l) and type II additives (0.5-3ml/l) to obtain a fully bright coating with good leveling properties, and its stress and coating ductility can also be controlled good. Type I additives are polyether compounds containing structures such as -(CH 2 OCH 2 ) n - or -(C 6 H 4 )-(OC 2 H 5 ) n OH (for example: polyethylene glycol, polyethylene glycol alkyl Alcohol ethers or alkylphenol polyoxyethylene ethers); and Class II additives are compounds containing NH 2 -CH 2 -COOH or -CO-NH- structures (for example: amino acids, gelatin, polypeptides, etc.). The biggest feature of the tin-copper alloy electroplating solution is that its electroplating efficiency is higher than many current cyanide-free tin-copper alloy electroplating solutions.

此外,本发明形成前述锡铜合金镀层的电镀方法为:首先,于一电镀槽中加入前述的锡铜合金电镀液,该电镀液的成分及浓度见下表一至表三,其中辅助络合剂以氯化钾为佳;接着,将工件浸置于该电镀槽的电镀液中作为阴极,以活性炭板作为阳极,也可以不锈钢板或DSA(Dimensonally Stable Anade氧化物涂层阳极的商业名称)作为阳极;最后,在阳极与阴极之间通上直流电,而工件与阳极最好在距离7厘米以上以确保镀层均匀性,所使用的电源供应器系依据工件表面积而选择合适规格的直流电整流器,另形成锡铜合金镀层的电流密度控制在0.5-2ASD,且电镀槽内温度控制在15-30℃,具体见下表一至表三,此外阳极外部必须以PP编织带套住,以防止电粗等缺陷产生。 In addition, the electroplating method for forming the aforementioned tin-copper alloy coating in the present invention is as follows: first, add the aforementioned tin-copper alloy electroplating solution into an electroplating tank, the composition and concentration of the electroplating solution are shown in Tables 1 to 3 below, wherein the auxiliary complexing agent Potassium chloride is preferably used; then, the workpiece is immersed in the electroplating bath of the electroplating tank as the cathode, and the activated carbon plate is used as the anode, or a stainless steel plate or DSA (the commercial name of the Dimensonally Stable Anade oxide coating anode) can be used as the anode. Anode; Finally, direct current is passed between the anode and the cathode, and the distance between the workpiece and the anode is preferably more than 7 cm to ensure the uniformity of the coating. The power supply used is based on the surface area of the workpiece. The current density for forming the tin-copper alloy coating is controlled at 0.5-2ASD, and the temperature in the electroplating tank is controlled at 15-30°C. See Table 1 to Table 3 for details. In addition, the outside of the anode must be covered with a PP braid to prevent electrolytic roughness, etc. Defects occur. the

表一 铜锡合金镀层 Table 1 Copper-tin alloy coating

  成份/操作条件Components/Operating Conditions   实施例1Example 1   实施例2Example 2   实施例3Example 3   K<sub>4</sub>P<sub>2</sub>O<sub>7</sub>(g/L)K<sub>4</sub>P<sub>2</sub>O<sub>7</sub>(g/L)   250250   250250   250250

  CuP<sub>2</sub>O<sub>7</sub>·3H<sub>2</sub>O(g/L)CuP<sub>2</sub>O<sub>7</sub> 3H<sub>2</sub>O(g/L)   1717   1717   1717   SnCl<sub>2</sub>·2H<sub>2</sub>O(g/L)SnCl<sub>2</sub> 2H<sub>2</sub>O(g/L)   2525   3030   3535   SnCl<sub>4</sub>·5H<sub>2</sub>O(g/L)SnCl<sub>4</sub>·5H<sub>2</sub>O(g/L)   2525   2020   1515   KCl(g/L)KCl(g/L)   3030   3535   4040   I类添加剂(ml/L)Class I additives (ml/L)   0.50.5   1 1   1.51.5   II类添加剂(ml/L)Type II additives (ml/L)   1 1   1 1   1.51.5   温度(℃)Temperature (°C)   2020   2525   3030   电流密度(ASD)Current Density (ASD)   0.80.8   1.21.2   1.61.6   阳极anode   炭板Charcoal plate   炭板Charcoal plate   炭板Charcoal plate

表二 铜锡合金镀层 Table 2 Copper-tin alloy coating

  成份/操作条件Components/Operating Conditions   实施例1Example 1   实施例2Example 2   实施例3Example 3   K<sub>4</sub>P<sub>2</sub>O<sub>7</sub>(g/L)K<sub>4</sub>P<sub>2</sub>O<sub>7</sub>(g/L)   300300   300300   300300   CuP<sub>2</sub>O<sub>7</sub>·3H<sub>2</sub>O(g/L)CuP<sub>2</sub>O<sub>7</sub> 3H<sub>2</sub>O(g/L)   1717   1717   1717   SnCl<sub>2</sub>·2H<sub>2</sub>O(g/L)SnCl<sub>2</sub> 2H<sub>2</sub>O(g/L)   2525   3030   3535   SnCl<sub>4</sub>·5H<sub>2</sub>O(g/L)SnCl<sub>4</sub>·5H<sub>2</sub>O(g/L)   2525   2020   1515   KCl(g/L)KCl(g/L)   3030   3535   4040   I类添加剂(ml/L)Class I additives (ml/L)   0.50.5   1 1   1.51.5   II类添加剂(ml/L)Type II additives (ml/L)   1 1   1 1   1.51.5   温度(℃)Temperature (°C)   2020   2525   3030   电流密度(ASD)Current Density (ASD)   0.80.8   1.21.2   1.61.6   阳极anode   炭板Charcoal plate   炭板Charcoal plate   炭板Charcoal plate

表三 铜锡合金镀层 Table 3 Copper-tin alloy coating

  成份/操作条件Components/Operating Conditions   实施例1Example 1   实施例2Example 2   实施例3Example 3   K<sub>4</sub>P<sub>2</sub>O<sub>7</sub>(g/L)K<sub>4</sub>P<sub>2</sub>O<sub>7</sub>(g/L)   350350   350350   350350   CuP<sub>2</sub>O<sub>7</sub>·3H<sub>2</sub>O(g/L)CuP<sub>2</sub>O<sub>7</sub> 3H<sub>2</sub>O(g/L)   1717   1717   1717   SnCl<sub>2</sub>·2H<sub>2</sub>O(g/L)SnCl<sub>2</sub> 2H<sub>2</sub>O(g/L)   2525   3030   3535   SnCl<sub>4</sub>·5H<sub>2</sub>O(g/L)SnCl<sub>4</sub>·5H<sub>2</sub>O(g/L)   2525   2020   1515   KCl(g/L)KCl(g/L)   3030   3535   4040   I类添加剂(ml/L)Class I additives (ml/L)   0.50.5   1 1   1.51.5   II类添加剂(ml/L)Type II additives (ml/L)   1 1   1 1   1.51.5   温度(℃)Temperature (°C)   2020   2525   3030   电流密度(ASD)Current Density (ASD)   0.80.8   1.21.2   1.61.6   阳极anode   炭板Charcoal plate   炭板Charcoal plate   炭板Charcoal plate

再者,电镀有上述锡铜合金镀层的产品,其表面除电镀有该镀层外,还可包含一底镀层设于工件与前述锡铜合金镀层之间,用以增加工件与锡铜合金镀层的附着力,并且增加镀层表面光泽度。而且根据 工件表面材质不同,所述的底镀层也不同。当工件表面材质为铜合金时,则该底镀层包含一预镀铜以及一硫酸铜层;当工件表面材质为白铁或不锈钢时,则该底镀层为一预镀镍层;当工件表面为锌或锌合金时,则该底镀层包含碱性镀铜层及焦磷酸镀铜层;当工件为铝、铝合金或镁合金时,必须对工件先施以浸锌及化学镍等处理;当工件为β-钛、纯钛或钛合金时,则该底镀层为一预镀镍层或预镀金层;当工件表面材质为非金属,如ABS等塑料材质时,则需先形成一化学镍层于工件表面,然后镀上前述的锡铜合金镀层,再电镀颜色或烤漆。 Furthermore, the product electroplated with the above-mentioned tin-copper alloy coating, in addition to the electroplating of the coating, may also include an undercoating layer between the workpiece and the aforementioned tin-copper alloy coating to increase the distance between the workpiece and the tin-copper alloy coating. Adhesion, and increase the gloss of the coating surface. And according to workpiece surface material is different, described bottom coating is also different. When the surface material of the workpiece is copper alloy, the undercoating layer includes a pre-plated copper and a copper sulfate layer; when the surface material of the workpiece is white iron or stainless steel, the undercoating layer is a pre-plated nickel layer; when the surface of the workpiece is zinc or zinc alloy, the bottom coating includes alkaline copper plating layer and pyrophosphate copper plating layer; when the workpiece is aluminum, aluminum alloy or magnesium alloy, the workpiece must be treated with zinc and chemical nickel; when the workpiece When it is β-titanium, pure titanium or titanium alloy, the bottom coating is a pre-nickel layer or pre-gold layer; when the surface material of the workpiece is non-metallic, such as ABS and other plastic materials, it is necessary to form an chemical nickel layer first. On the surface of the workpiece, then plate the aforementioned tin-copper alloy coating, and then electroplate color or paint. the

需要说明的是,当本发明锡铜合金镀层的厚度达到2μm以上时,虽然工件材质为含镍量高达30-40%的铜镍或铜铁合金或工件表面具有化学镍层,但由于本发明的锡铜合金镀层有良好覆盖能力及孔隙率,以EN1811-EN12412标准测定镍释放量仍可小于百万分之0.05而可达到无镍产品的界定标准,此种产品可供给特殊体质对镍过敏的消费者使用,不会有过敏之虞。因此本发明极适合使用于防护装饰性电镀,如应用于眼镜镜框、手表、耳环、戒指、项链等饰品、手机机壳、手机饰品或其它与脸部皮肤接触较多的产品,以确保消费者健康。 It should be noted that when the thickness of the tin-copper alloy coating of the present invention reaches more than 2 μm, although the material of the workpiece is copper-nickel or copper-iron alloy with a nickel content of 30-40% or the surface of the workpiece has an chemical nickel layer, but due to the present invention The tin-copper alloy coating has good coverage and porosity, and the nickel release measured by the EN1811-EN12412 standard can still be less than 0.05 ppm, which can meet the definition standard of nickel-free products. This kind of product can be supplied to those who are allergic to nickel. There is no risk of allergies when used by consumers. Therefore, the present invention is very suitable for protective decorative electroplating, such as glasses frames, watches, earrings, rings, necklaces and other accessories, mobile phone casings, mobile phone accessories or other products that have more contact with the face skin, so as to ensure that consumers healthy. the

根据本发明的锡铜合金镀层,其厚度、硬度、镍释放量、抗变色能力、盐雾测试及人工汗液测试与习知镍镀层及铜锡合金镀层比较结果如下表四。 According to the tin-copper alloy coating of the present invention, its thickness, hardness, nickel release, discoloration resistance, salt spray test and artificial sweat test are compared with the conventional nickel coating and copper-tin alloy coating. The results are shown in Table 4 below. the

表四(此表资料来源工件底材为铜合金) Table 4 (The source of this table is that the workpiece substrate is copper alloy)

  镀层Plating   厚度   μmThickness μm   硬度   HVHardness HV   镍释放量  EN1811-EN   12412ppmNickel release EN1811-EN 12412ppm   抗变  色能   力Anti-tarnish ability   盐雾  测试  ASTM      B117Salt spray test ASTM B117   人工汗  液测试  ISO      12870Artificial sweat test ISO 12870   镍镀层Nickel plating   >2>2   500-550500-550   >>0.05>>0.05   差 Difference   48hr48hr   >24hr>24hr   钴镀层Cobalt coating   >2>2   450-500450-500   <0.05<0.05   差 Difference   <16hr<16hr   16hr16hr   铜锡合金镀层Copper-tin alloy coating   >2>2   500-600500-600   >0.05>0.05   佳 good   48hr48hr   >24hr>24hr   锡铜合金镀层Tin-copper alloy plating   >2>2   550-650550-650   <0.05<0.05   佳 good   48hr48hr   >24hr>24hr

由表四可知,镍镀层、钴镀层、锡铜合金镀层的厚度皆可大于2μm;镍镀层硬度为500-550HV,钴镀层的硬度为450-500HV,锡铜合金镀层的硬度最大,为550-650HV;以EN1811-EN12412标准测定镍释放量,结果显示,镍镀层的镍释放量远大于0.05ppm,钴镀层与锡铜合金镀层的镍释放量小于0.05ppm,铜锡合金镀层的镍释放量大于0.05ppm;在抗变色能力方面,以镍镀层及钴镀层最差,锡铜合金镀层抗变色能力最佳。 It can be seen from Table 4 that the thickness of nickel coating, cobalt coating and tin-copper alloy coating can be greater than 2 μm; the hardness of nickel coating is 500-550HV, the hardness of cobalt coating is 450-500HV, and the hardness of tin-copper alloy coating is the largest, which is 550- 650HV; according to EN1811-EN12412 standards to measure the nickel release, the results show that the nickel release of the nickel coating is much greater than 0.05ppm, the nickel release of the cobalt coating and the tin-copper alloy coating is less than 0.05ppm, and the nickel release of the copper-tin alloy coating is greater than 0.05ppm; In terms of anti-tarnish ability, the nickel coating and cobalt coating are the worst, and the tin-copper alloy coating has the best anti-tarnish ability. the

上述锡铜合金镀层由于可克服前述钴镀层或镍镀层于氧气中易变色的缺点,因此在锡铜合金镀层上可不必再镀上一层色面镀层就可 达到耐久不变色的目的。但要做为面层且在氧气下维持银白色泽不氧化变色则需要涂布有机薄膜(Varnish)。此外,锡铜合金镀层抗蚀能力与韧性皆高于习用的光亮镍镀层,且硬度与镍镀层相当,因此可替代光亮镍镀层做为装饰性镀层。 The above-mentioned tin-copper alloy coating can overcome the shortcoming that the aforementioned cobalt coating or nickel coating is easy to change color in oxygen, so the tin-copper alloy coating does not need to be plated with a layer of colored surface coating to achieve the purpose of durability and no discoloration. However, if it is used as a surface layer and maintains a silvery white luster without oxidation and discoloration under oxygen, it needs to be coated with an organic film (Varnish). In addition, the corrosion resistance and toughness of the tin-copper alloy coating are higher than that of the conventional bright nickel coating, and the hardness is equivalent to that of the nickel coating, so it can replace the bright nickel coating as a decorative coating. the

虽然本发明以前述较佳实施例揭示,然其并非用以限定本发明,任何熟习此技艺者,在不脱离本发明的精神和范围内,当可作各种更动与修改,因此本发明的保护范围当以权利要求所界定的为准。 Although the present invention is disclosed with the aforementioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims. the

Claims (9)

1. the electroplate liquid of a stannum copper alloy coating, described stannum copper alloy coating comprises the tin of 55-60% and the copper of 40-45% by weight; It is characterized in that: the cupric pyrophosphate that this electroplate liquid comprises the tin protochloride of 20-40g/l and 10-30g/l is respectively as the main salt of tin and copper; The potassium pyrophosphate that also comprises 250-350g/l is as main complexing agent, and the basic metal family villaumite of 30-40g/l or alkaline earths villaumite are as auxiliary complex-former, and the five hydration tin chlorides of 10-30g/l are as the bath stability agent, and the pH value is controlled at 8.0~9.0; In addition, this electroplate liquid also adds the I class additive of 0.5~5ml/l and the II class additive of 0.5~3ml/l; This I class additive is for containing-(CH 2OCH 2) n-or-(C 6H 4)-(OC 2H 5) nThe polyether compound of OH structure; And II class additive is for containing NH 2-CH 2-COOH or-compound of CO-NH-structure.
2. the electroplate liquid of stannum copper alloy coating as claimed in claim 1, it is characterized in that: described I class additive is polyoxyethylene glycol, polyalkylene glycol alkyl alcohol ether or alkylphenol polyoxyethylene.
3. the electroplate liquid of stannum copper alloy coating as claimed in claim 1, it is characterized in that: described II class additive is amino acid, gelatin or polypeptide.
4. adopt the described electroplate liquid of claim 1 to form the electro-plating method of gun-metal electrolytic coating, it is characterized in that this method is: at first, in a plating tank, add the electroplate liquid of the described stannum copper alloy coating of claim 1; Then, with workpiece soak place this plating tank electroplate liquid as negative electrode, anode is set simultaneously; At last, leading to direct current between anode and the negative electrode, and the current density of formation stannum copper alloy coating is controlled at 0.5-2ASD, and temperature is controlled at 15-30 ℃ in the plating tank.
5. as the electro-plating method of gun-metal electrolytic coating as described in the claim 4, it is characterized in that: described anode is active carbon slab, stainless steel plate or DSA.
6. as the electro-plating method of gun-metal electrolytic coating as described in the claim 4, it is characterized in that: described anode external is entangled with the PP braid.
7. as the electro-plating method of gun-metal electrolytic coating as described in the claim 4, it is characterized in that: described electroplate liquid when potassium pyrophosphate is 250,300, during 350g/l, cupric pyrophosphate is 17g/l, tin protochloride is 25g/l, five hydration tin chlorides are 25g/l, Repone K is 30g/l, and I class additive is 0.5ml/l, and II class additive is 1ml/l; At this moment, temperature is 20 ℃ in the described plating tank; Current density is 0.8ASD.
8. as the electro-plating method of gun-metal electrolytic coating as described in the claim 4, it is characterized in that: described electroplate liquid when potassium pyrophosphate is 250,300, during 350g/l, cupric pyrophosphate is 17g/l, tin protochloride is 30g/l, five hydration tin chlorides are 20g/l, Repone K is 35g/l, and I class additive is 1ml/l, and II class additive is 1ml/l; At this moment, temperature is 25 ℃ in the described plating tank; Current density is 1.2ASD.
9. as the electro-plating method of gun-metal electrolytic coating as described in the claim 4, it is characterized in that: described electroplate liquid when potassium pyrophosphate is 250,300, during 350g/l, cupric pyrophosphate is 17g/l, tin protochloride is 35g/l, five hydration tin chlorides are 15g/l, Repone K is 40g/l, and I class additive is 1.5ml/l, and II class additive is 1.5ml/l; At this moment, temperature is 30 ℃ in the described plating tank; Current density is 1.6ASD.
CN2007100087310A 2007-03-21 2007-03-21 Stannum copper alloy coating, plating solution and electroplating method Expired - Fee Related CN101270492B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007100087310A CN101270492B (en) 2007-03-21 2007-03-21 Stannum copper alloy coating, plating solution and electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007100087310A CN101270492B (en) 2007-03-21 2007-03-21 Stannum copper alloy coating, plating solution and electroplating method

Publications (2)

Publication Number Publication Date
CN101270492A CN101270492A (en) 2008-09-24
CN101270492B true CN101270492B (en) 2010-12-29

Family

ID=40004706

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007100087310A Expired - Fee Related CN101270492B (en) 2007-03-21 2007-03-21 Stannum copper alloy coating, plating solution and electroplating method

Country Status (1)

Country Link
CN (1) CN101270492B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102260892B (en) * 2010-05-31 2014-10-08 比亚迪股份有限公司 Titanium and titanium alloy pre-plating solution and electroplating method
CN102487136A (en) * 2010-12-03 2012-06-06 比亚迪股份有限公司 Lithium ion battery cathode and its preparation method and battery
CN103668359B (en) * 2012-09-06 2016-03-02 上海造币有限公司 A kind of electroplate liquid of multilayer non-cyanide copper electroplating-tin alloy coat, electroplating technology and coin thereof
CN102899695B (en) * 2012-10-17 2015-10-28 东莞诚兴五金制品有限公司 Electroplating method of nickel-free alloy coating
CN104152955A (en) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution
CN105297091A (en) * 2015-12-01 2016-02-03 张颖 Electroplating method for watch shell
CN105297093A (en) * 2015-12-01 2016-02-03 张颖 Electroplating liquid for watch shell
CN109487308A (en) * 2018-12-11 2019-03-19 湖北工程学院 The method of neutral tin plating electrolyte and preparation method thereof and copper-based material surface tinning
CN110592626A (en) * 2019-10-21 2019-12-20 广州三孚新材料科技股份有限公司 Cyanide-free electroplating brass liquid and use method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300881A (en) * 1999-10-07 2001-06-27 荏原优莱特科技股份有限公司 Sn-Cu alloy electroplating bath
CN1302921A (en) * 1999-12-22 2001-07-11 日本麦克德米德株式会社 Bright tin-copper alloy electroplating liquid and its preparation method
EP1146148A2 (en) * 2000-04-14 2001-10-17 Nihon New Chrome Co. Ltd. Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300881A (en) * 1999-10-07 2001-06-27 荏原优莱特科技股份有限公司 Sn-Cu alloy electroplating bath
CN1302921A (en) * 1999-12-22 2001-07-11 日本麦克德米德株式会社 Bright tin-copper alloy electroplating liquid and its preparation method
EP1146148A2 (en) * 2000-04-14 2001-10-17 Nihon New Chrome Co. Ltd. Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
杜强.电镀白铜锡代镍工艺.电镀与环保23 5.2003,23(5),16-18.
杜强.电镀白铜锡代镍工艺.电镀与环保23 5.2003,23(5),16-18. *
王丽丽.Cu-Sn合金电镀.电镀与精饰22 5.2000,22(5),42-45.
王丽丽.Cu-Sn合金电镀.电镀与精饰22 5.2000,22(5),42-45. *

Also Published As

Publication number Publication date
CN101270492A (en) 2008-09-24

Similar Documents

Publication Publication Date Title
CN101270492B (en) Stannum copper alloy coating, plating solution and electroplating method
CN102268701B (en) A bright cyanide-free silver plating solution and preparation method thereof
EP3150744B1 (en) Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate
CN102691081B (en) A kind of electroplating silver solution and electroplating method
CN108456898B (en) A kind of low-concentration sulfate trivalent chromium rapid chrome plating solution and preparation method thereof
EP3159436B1 (en) Article having multilayer plating film
CN101260549B (en) Non-preplating type non-cyanide silver-plating electroplate liquid
JP3674887B2 (en) Pyrophosphate bath for copper-tin alloy plating
JP5336762B2 (en) Copper-zinc alloy electroplating bath and plating method using the same
KR101046301B1 (en) Nickel flash plating solution, electric zinc steel sheet and manufacturing method thereof
EP2757180B1 (en) A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process
CN102127758A (en) Silver plating process on workpiece surface
CN101928968B (en) Boron-tungsten-iron-nickel alloy electroplating liquid
JP2009149965A (en) Silver plating method
KR20100121399A (en) Nickel flash plating solution, zinc-electroplated steel sheet and manufacturing method thereof
WO2006079278A1 (en) Decorative laminate, plating solution and plating method for forming the decorative layer, and products use this decorative layer
CN104233401A (en) Electroplating preparation method for Cu-Co alloy
CN102899695B (en) Electroplating method of nickel-free alloy coating
JP7350965B1 (en) Chrome plated parts and their manufacturing method
JP4740528B2 (en) Nickel-molybdenum alloy plating solution, plating film and plated article
KR100793840B1 (en) Cobalt mixed electroplating solution and cobalt mixed plating solution coating product
WO2024100998A1 (en) Chromium plated component and method for producing same
JPH06293990A (en) Sn-cu-pd alloy plated member and plating bath for producing the same
JPH0394092A (en) Electroplated product and production thereof
CN109440149B (en) Composition and process of electroplating solution for electroplating high iron-low tin alloy

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101229