CN101269478B - Accurate milling buffing head mechanical device for attenuated polishing - Google Patents
Accurate milling buffing head mechanical device for attenuated polishing Download PDFInfo
- Publication number
- CN101269478B CN101269478B CN2007100646945A CN200710064694A CN101269478B CN 101269478 B CN101269478 B CN 101269478B CN 2007100646945 A CN2007100646945 A CN 2007100646945A CN 200710064694 A CN200710064694 A CN 200710064694A CN 101269478 B CN101269478 B CN 101269478B
- Authority
- CN
- China
- Prior art keywords
- overcoat
- base
- ring body
- mechanical device
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 40
- 230000002238 attenuated effect Effects 0.000 title claims description 18
- 238000003801 milling Methods 0.000 title claims description 16
- 238000000227 grinding Methods 0.000 abstract description 11
- 239000002585 base Substances 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009972 noncorrosive effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
一种减薄抛光用的精密磨抛头机械装置，其特征在于，包括：一外套，该外套包括：一上层环体；一下层环体，该上层环体和下层环体之间由多个连接杆固定连接；一中层，该中层为圆形片体，该中层位于上层环体的下方、固定在多个连接杆的内侧，该中层中间的位置安装有一限位器；一内套，该内套包括：一上连接件，该上连接件为一圆盘型；一底座，该底座为一圆盘型，该底座的中心处开有一孔，该底座和上连接件之间由多个连接柱固定连接；该内套位于外套的内部，并与外套联动；一载物片，该载物片为一片体，该载物片位于内套中的底座的下方，并与内套中的底座联动。
A precision grinding and polishing head mechanical device for thinning and polishing, characterized in that it includes: a jacket, the jacket includes: an upper ring body; a lower ring body, between the upper ring body and the lower ring body is a plurality of The connecting rods are fixedly connected; a middle layer, the middle layer is a circular piece, the middle layer is located below the upper ring body and fixed on the inner side of a plurality of connecting rods, and a stopper is installed in the middle of the middle layer; an inner sleeve, the The inner sleeve includes: an upper connector, the upper connector is a disc shape; a base, the base is a disc shape, a hole is opened in the center of the base, and a plurality of The connecting column is fixedly connected; the inner sleeve is located inside the outer sleeve and is linked with the outer sleeve; a loading piece, the loading piece is a piece, the loading piece is located under the base in the inner sleeve, and is connected to the inner sleeve. Base linkage.
Description
Technical field
The present invention relates to a kind of mechanical device to the accurate control plane attenuate of semi-conducting material and the polishing thickness and the uniformity.Design different sizes and change different counterweights and grinding and polishing material, can be used for metal, semiconductor and other materials of the needs accurate control plane attenuated polishing thickness and the uniformity.
Technical background
Along with the extensive use of semiconductor laser, more urgent to the making demand of high-quality semiconductor laser at Military Application and civil area.High-quality semiconductor laser is particularly strict to the requirement of heat radiation and electric conductivity and stress, except that the design to material itself improves, structural design has also been put on higher step like this.Especially array encapsulating structure device, because " smile effect " that the existence of stress causes is the key factor that the efficient of restriction optical fiber coupling can not get improving, so the control of the precision of attenuate in the noise spectra of semiconductor lasers manufacturing process and polishing is particularly important always.Though now homemade attenuated polishing machine is a lot, main equipment is applicable to that backing material or Si are the making of device, the making of inapplicable and laser instrument.Small-sized attenuated polishing equipment is also more, its basic rotation and revolution function also can compare favourably with external equipment, but because the too summary of grinding and polishing head, and most equipment are to control thickness thinning by experience auxiliary detection estimated time, make the attenuated polishing uniformity and precision not reach the demand of semiconductor laser far away like this.
Summary of the invention
The object of the invention is to provide a kind of mechanical device of the grinding and polishing head to the accurate control plane attenuated polishing thickness of semi-conducting material and the uniformity.This mechanical device is cheap, excellent performance, volume are little, in light weight, simple, convenient and practical.
The accurate milling throwing wheel mechanical device that a kind of attenuated polishing of the present invention is used is characterized in that, comprising:
One overcoat, this overcoat comprises:
One upper strata ring body;
One lower floor's ring body, fixedly connected between this upper strata ring body and the lower floor's ring body by a plurality of connecting rods;
One middle level, this middle level are circular lamellar body, this middle level be positioned at the upper strata ring body the below, be fixed on the inboard of a plurality of connecting rods, this middle level position intermediate is equipped with a stop;
Cover in one, cover comprises in this:
One upper connector, this upper connector are a collar plate shape;
One base, this base are a collar plate shape, and the center of this base has a hole, and be fixedly connected by a plurality of joint pins between this base and the upper connector;
Should interiorly overlap the inside that is positioned at overcoat, and link with overcoat;
One micro slide, this micro slide are a lamellar body, and this micro slide is arranged in the below of base of cover, and with interior cover in the base interlock.
The quantity of a plurality of connecting rods in the wherein said overcoat is 3-5, and this connecting rod is that even distributed weight is identical.
Wherein said overcoat is the one processing and fabricating.
The quantity of a plurality of joint pins in wherein said in the cover is 3-5, and this joint pin is that even distributed weight is identical.
The lower edge of the lower floor's ring body in the wherein said overcoat has the identical gap of a plurality of equally distributed shapes.
The invention has the beneficial effects as follows accurately control plane attenuated polishing thickness, the uniformity and precision, the uniformity and the Millstone of attenuated polishing sample had self-repair function, the present invention is simple in structure, handled easily.
Description of drawings
Below, further specify structure of the present invention, characteristics in conjunction with the drawings to having the detailed description of embodiment, wherein:
Fig. 1, Fig. 2, Fig. 3 are respectively the overcoat of accurate milling throwing wheel, interior cover and micro slide schematic diagram,
Fig. 4 is an assembling stereogram.
The specific embodiment
Below in conjunction with Fig. 1, Fig. 2, Fig. 3, Fig. 4 describe in detail according to the CONSTRUCTED SPECIFICATION of specific embodiment of the invention accurate milling throwing wheel and working condition.
See also shown in Figure 1ly, the accurate milling throwing wheel mechanical device that a kind of attenuated polishing of the present invention is used comprises: an overcoat 10, this overcoat 10 comprise a upper strata ring body 11, lower floor's ring body 12 and a plurality of connecting rod 13.Described overcoat 10 is the one processing and fabricating, or constitutes an integral body with other connected modes such as no seam welding;
Its at the middle and upper levels ring body 11 are concentric annulars of inner wall smooth with lower floor ring body 12, both connect by a plurality of connecting rods 13 of even distribution equivalent weight, play internal cover 20 vertical direction guiding and the spacing effect of horizontal direction; Connecting rod 13 generally selects for use 3-5 to get final product;
Lower edge at lower floor's ring body 12 has the identical gap 15 of a plurality of equally distributed shapes, the grinding and polishing feed liquid can evenly flow into loading by these gap and try to get to the heart of a matter and carry out grinding and polishing in the face of sample, lower floor's ring body 12 lower edge have these gap just can repair dish to the mill of employed grinding and polishing machine synchronously in process of lapping, so just can reduce because the grinding and polishing inhomogeneities that the out-of-flatness of grinding and polishing feed liquid uneven distribution and mill brings; The degree of depth of gap is exceeded with the thickness that is not higher than micro slide 30;
The middle level 14 of overcoat 10 is circular lamellar body, this middle level 14 be positioned at upper strata ring body 11 the below, be fixed on the inboard of a plurality of connecting rods 13, these middle level 14 position intermediate are equipped with a stop 141, the high-precision spiral positioning device that this stop 141 can use market to purchase, this stop 141 act as accurate location to the sample mill polishing thickness;
See also Fig. 1 and consult Fig. 4 simultaneously, for cover 20 in making and overcoat 10 synchronous rotations can be left the circular hole of slightly larger in diameter in joint pin 23 corresponding to the relevant position of 20 more than joint pins 23 of interior cover on the middle level 14 of overcoat 10, during assembling a plurality of joint pins 23 of interior cover 20 being passed these corresponding circular holes is connected with interior cover 20 upper connectors and gets final product, also can be by the word groove that goes into operation at the upper strata of overcoat 10 ring body 11 inwalls, the outer wall of interior cover 20 upper connectors 21 adds other modes such as T type post and plays the interlock effect.
For prevent use and assembling process in phenomenon such as distortion dislocation appears, the overcoat 10 of this accurate milling throwing wheel is except that stop 141, whole overcoat 10 is processed into non-removable integral body by technology such as no seam welding, with the precision of assurance overcoat 10.
See also the interior cover 20 of Fig. 2 and comprise a upper connector 21, a base 22 and upper connector 21, interior cover 20;
Wherein upper connector 21 is a collar plate shape, and its external diameter is slightly less than the internal diameter of layer ring body 11 on the overcoat 10, and the flatness of the height of this difference and interior cover 20 and base 22 bottom surfaces plays a decisive role to the uniformity of the grinding and polishing of sample;
See also Fig. 2 and consult Fig. 4 simultaneously, during 10 assemblings of interior cover 20 and overcoat in the base 22 of cover 20 pass by a plurality of joint pins 23 that the corresponding aperture on the layer 14 is connected with the upper connector 21 of interior cover 20 among the overcoat 10; Joint pin 23 adopts 3-5 usually, and being evenly distributed on above the base 22 of weight such as must be; Be vertically welded on the base 22 for guaranteeing that this joint pin 23 of precision can adopt, also can weld together after assembling with overcoat 10, also can adopt the fastening alternate manner that waits of screw to fix with upper connector 21;
After interior cover 20 inside that are positioned at overcoat 10 assemble, interior cover 20 must link with overcoat 10, again the base 22 of interior cover 20 and lower floor's ring body 12 of overcoat 10 are carried out fine gtinding together after assembling, so that the bottom surface of the bottom surface of base 22 and lower floor's ring body 12 is in same plane, to improve the uniformity of print attenuated polishing.
Whole accessories of overcoat 10 and interior cover 20 should be non-corrosive, anti-slight acid and alkali corrosion, organic solvent-resistant, wear-resisting, hard not yielding, easy fracture, material that finished surface is smooth are not made.
If the upper connector 21 of mill head overcoat 10 upper strata ring bodies 11 and interior cover 20 is designed to oval then can reduces the restriction that is subjected to machining accuracy, further improve the uniformity, and need not to increase other interlock design.
Seeing also Fig. 3 micro slide 30 is a lamellar body, the size of this micro slide 30 should be less than the interior ring of overcoat 10 lower floor's ring bodies 12, this micro slide 30 is must thickness even, and the material that its material is non-corrosive, anti-slight acid and alkali corrosion, organic solvent-resistant, wear-resisting, hard not yielding, anti-100 degree high temperature, finished surface is smooth is made; This micro slide 30 is arranged in the below of cover 20 base 22 during use, and with interior cover 20 in base 22 interlocks, seeing also Fig. 2 linkage manner can be at interior cover 20 lower floor's ring bodies 12 bottom surface mounting screw, correspondingly opens shallow slot etc. on micro slide 30.
The course of work of the present invention is:
1, sample size should be less than micro slide 30;
2, sample is fixed on the center on the plane of micro slide 30,, after cooling the paraffin at sample surfaces and edge is wiped totally for the mode that semi-conducting material can adopt fusion paraffin to paste;
3, drip several dripping at the back side of micro slide 30, aim at the interlock position, utilize the surface tension effects of water micro slide 30 to be sticked on base 22 bottom surfaces of interior cover 20;
4, accurate milling throwing wheel is placed on the abrasive disk of grinder, stop 141 is set the attenuate parameter, start grinder and begin attenuate;
5, treat in cover upper connector 21 belows and after stop 141 contacts, can stop the rotation of grinder grinding and polishing dish;
6, take off accurate milling throwing wheel, will grind feed liquid with big water gaging and rinse well;
7, accurate milling throwing wheel is placed on the polishing disk of polishing machine, stop 141 is set burnishing parameters, start polishing machine and begin polishing;
8, treat in cover upper connector 21 belows and after stop 141 contacts, can stop the rotation of polishing machine polishing disk;
9, take off accurate milling throwing wheel, polishing fluid is rinsed well with big water gaging;
10, inwardly overlap in the centre bore 221 on 20 bases 22 and be blown into gas, micro slide 30 is separated with interior cover 20 bases 22;
11, take off print from micro slide 30, finish the whole courses of work of attenuated polishing.
Claims (5)
1. the accurate milling throwing wheel mechanical device that attenuated polishing is used is characterized in that, comprising:
One overcoat, this overcoat comprises:
One upper strata ring body;
One lower floor's ring body, fixedly connected between this upper strata ring body and the lower floor's ring body by a plurality of connecting rods;
One middle level, this middle level are circular lamellar body, this middle level be positioned at the upper strata ring body the below, be fixed on the inboard of a plurality of connecting rods, this middle level position intermediate is equipped with a stop;
Cover in one, cover comprises in this:
One upper connector, this upper connector are a collar plate shape;
One base, this base are a collar plate shape, and the center of this base has a hole, and be fixedly connected by a plurality of joint pins between this base and the upper connector;
Should interiorly overlap the inside that is positioned at overcoat, and link with overcoat;
One micro slide, this micro slide are a lamellar body, and this micro slide is arranged in the below of base of cover, and with interior cover in the base interlock.
2. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that the quantity of a plurality of connecting rods in the wherein said overcoat is 3-5, and this connecting rod is that even distributed weight is identical.
3. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that, wherein said overcoat is the one processing and fabricating.
4. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that, the quantity of a plurality of joint pins in the wherein said interior cover is 3-5, and this joint pin is that even distributed weight is identical.
5. the accurate milling throwing wheel mechanical device that attenuated polishing according to claim 1 is used is characterized in that, the lower edge of the lower floor's ring body in the wherein said overcoat has the identical gap of a plurality of equally distributed shapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100646945A CN101269478B (en) | 2007-03-23 | 2007-03-23 | Accurate milling buffing head mechanical device for attenuated polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100646945A CN101269478B (en) | 2007-03-23 | 2007-03-23 | Accurate milling buffing head mechanical device for attenuated polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101269478A CN101269478A (en) | 2008-09-24 |
| CN101269478B true CN101269478B (en) | 2010-06-23 |
Family
ID=40003835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100646945A Expired - Fee Related CN101269478B (en) | 2007-03-23 | 2007-03-23 | Accurate milling buffing head mechanical device for attenuated polishing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101269478B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0534108A1 (en) * | 1991-09-24 | 1993-03-31 | Peter Wolters Ag | Method for one-sided surface making of workpieces |
| US6176767B1 (en) * | 1997-07-04 | 2001-01-23 | Lidkoping Machine Tools Ab | Double face abrading machine |
| CN2424875Y (en) * | 2000-04-21 | 2001-03-28 | 黄威丰 | grinder grinding mechanism |
| US7022001B2 (en) * | 2004-01-15 | 2006-04-04 | Fujikoshi Machinery Corp. | Polishing apparatus |
| CN201009162Y (en) * | 2007-03-23 | 2008-01-23 | 中国科学院半导体研究所 | Precision Grinding and Polishing Head Mechanism for Thinning and Polishing |
-
2007
- 2007-03-23 CN CN2007100646945A patent/CN101269478B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0534108A1 (en) * | 1991-09-24 | 1993-03-31 | Peter Wolters Ag | Method for one-sided surface making of workpieces |
| US6176767B1 (en) * | 1997-07-04 | 2001-01-23 | Lidkoping Machine Tools Ab | Double face abrading machine |
| CN2424875Y (en) * | 2000-04-21 | 2001-03-28 | 黄威丰 | grinder grinding mechanism |
| US7022001B2 (en) * | 2004-01-15 | 2006-04-04 | Fujikoshi Machinery Corp. | Polishing apparatus |
| CN201009162Y (en) * | 2007-03-23 | 2008-01-23 | 中国科学院半导体研究所 | Precision Grinding and Polishing Head Mechanism for Thinning and Polishing |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2001-293656A 2001.10.23 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101269478A (en) | 2008-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101579840B (en) | A high-efficiency grinding/polishing method for high-precision balls | |
| CN101186020B (en) | Polishing apparatus and manufacturing method of disk-shaped substrate | |
| CN101875181A (en) | Grinding machine tools for brittle and hard materials | |
| CN102229087A (en) | Device and method for regulating dip angle of wafer grinder | |
| CN110177647A (en) | Method and apparatus for carrying out finishing to sheet glass | |
| CN108247302A (en) | A kind of control rod drive mechanism blind hole stick stroke casing processing method and device | |
| CN212145960U (en) | Quartz glass wafer precision finishing device | |
| CN101259594B (en) | Large-scale flat plate milling equipment | |
| CN110126106B (en) | Wafer processing method | |
| CN201009162Y (en) | Precision Grinding and Polishing Head Mechanism for Thinning and Polishing | |
| CN107598715A (en) | Large-caliber special-shaped plane machining method | |
| CN109333359A (en) | A kind of device that control grinding machine is fixed a cutting tool | |
| CN101269478B (en) | Accurate milling buffing head mechanical device for attenuated polishing | |
| US20180222000A1 (en) | Friction spot sealing of a defect area in a workpiece | |
| US20110281504A1 (en) | Grinding method for workpiece having a plurality of bumps | |
| Walker et al. | A quantitative comparison of three grolishing techniques for the Precessions process | |
| CN106078519B (en) | A kind of method that emery wheel appearance reconstruct is carried out using diamond fiber micro-cutting | |
| CN112881532B (en) | Ultrasonic detection test block for diffusion welding lamination defects, its preparation method and application | |
| JP4351697B2 (en) | Manufacturing method of disk-shaped substrate | |
| CN108227104A (en) | Optical element flexible support structure height conditioning system and method | |
| JP5399115B2 (en) | Polishing apparatus, glass substrate polishing method and glass substrate manufacturing method | |
| US20090269154A1 (en) | Sheet-stack coring | |
| JP2018176374A (en) | Honing processing device | |
| JP5041030B2 (en) | Work holder for glass substrate laminate, method for producing glass substrate using this work holder, glass substrate produced by this production method, method for producing glass substrate for magnetic recording medium using this work holder, and magnetic recording medium Glass substrate | |
| CN109986283B (en) | Method for forming integral hanging basket barrel structure of reactor internals |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100623 Termination date: 20120323 |