CN101262210A - Piezoelectric vibrator and its manufacturing method - Google Patents

Abstract

The present invention relates to a piezoelectric vibrator and its manufacturing method. The piezoelectric vibrator, such as a resonator, is used as a timing element, a discriminator, a filter, and the like. The piezoelectric vibrator of the present invention can be fabricated by forming a piezoelectric body of a piezoelectric sheet, controlling its thickness, and simultaneously sintering the cover layer along the sheet, on which grooves will be formed. In addition, the piezoelectric vibrator of the present invention can be fabricated using laminated piezoelectric sheets, controlling their thickness, providing internal electrodes between the sheets, and forming external electrodes insulated from the internal electrodes.

Description

Piezoelectric vibrator and its manufacturing method

This application is a divisional application whose original national application number is 038228580 (international application number is PCT/KR2003/001965), the national application date is September 26, 2003, and the original invention title is "Piezoelectric vibrator and its manufacturing method" .

technical field

The present invention relates to a piezoelectric vibrator, such as a resonator, used as a timing element, a discriminator, a filter, etc., and its manufacturing method, in particular to a compact laminated piezoelectric vibrator, And it has high and stable oscillation frequency, and its manufacturing method.

Background technique

In order to be able to use an integrated circuit (IC) which is the main component in various electronic components, a reference clock pulse for the IC is required, and according to the development of IC technology, various electronic components can be integrated into a single large-scale like a single-chip microprocessor Integrated (LSI) circuits to control alone, most microprocessors. Most microprocessors use ceramic resonators as timing components. Because ceramic resonators are stable, non-adjustable and compact, and have low manufacturing costs, their applications have become increasingly widespread.

Recently, when the performance and speed of electronic components are improved, it is necessary to increase the resonator oscillation frequency, so it is necessary to develop a resonator with a higher oscillation frequency to generate stable oscillation. As electronic components become more compact, compactness is also required. the resonator.

As shown in FIG. 1, a conventional ceramic resonator includes a single flat ceramic piezoelectric body 101, which is polished so that its thickness corresponds to the desired frequency after sintering; formed on the upper and lower surfaces of the piezoelectric body; the insulating cover layer 103 in which the vibration groove 104 is formed; and the external electrode 105 formed outside the piezoelectric main body and the cover layer. In this example, the electrodes 102 can be in various shapes, so energy traps will be formed. The manufacturing method of this conventional ceramic resonator is shown in FIG. The piezoelectric body 101 is pressed and cast into a square shape, and the piezoelectric greenbody is sintered, cut with a diamond saw, and polished until the thickness corresponds to the desired frequency. Sputtering is used to form electrodes 102 on the piezoelectric body 101 that has been processed to have a certain thickness; then the piezoelectric body is subjected to a polling process, which can make the ceramic piezoelectric body piezoelectric, by applying an electric field To the electrodes of the ceramic piezoelectric body, the electric dipoles are aligned in the same direction. As shown in Figure 2 (b), wherein the cover layer 103 with the vibration groove 104 is bonded to the upper and lower parts of the piezoelectric body by epoxy resin 110, and electrodes are formed thereon; the general powder casting method is used Piezoelectric or dielectric ceramic powders are sintered to a green body to create the cover. In this example, the cover layer is formed by casting, which is designed to have vibration grooves formed on the cover layer, as shown in the figure, after bonding the piezoelectric body and the upper and lower cover layers, cutting Fig. 2(c ) just can obtain a unit chip element 106, the external electrodes 105 are formed on the outside of the chip unit, and each is connected to each electrode 102 formed in the unit chip element 106, as shown in Fig. 2(d ) shown. FIG. 1 is a cross-sectional structure diagram along the cross-section I-I of a chip component. Next, the ceramic resonator is completed by epoxy resin casting or surface mount package chip components, because the oscillation frequency in a resonator with MHz band is inversely proportional to its thickness, in order to increase the oscillation frequency, the thickness of the piezoelectric body is It must be thin, so in order to make the single-plate piezoelectric resonator have a high oscillation frequency, the thickness of the piezoelectric body must be continuously reduced by grinding, but because there are many problems in the actual production process, such as it is difficult to grind A uniform flatness is obtained on the entire surface of the piezoelectric body, and it is broken during processing, so the conventional method faces the limitation of manufacturing high-frequency resonators, thus reducing the manufacturing speed and increasing the manufacturing cost.

For these reasons, a resonator of higher harmonic vibration utilizing high-order vibration of a single flat piezoelectric body has been developed.

Ordinary filters with MHz bands use energy traps because of thickness vibration or thickness shear vibration, and if the electrodes are formed on the entire surface of the piezoelectric substrate, it is difficult to obtain excellent performance by higher coordinated vibration of profile vibration. resonance characteristics. But if the electrodes are partially formed on the surface of the piezoelectric substrate, there will be an interface between the area where the electrode is present and the area where no electrode is present, because the standing wave of vibration will occur in the area of the electrode near the interface, capturing the vibration Power traps for energy are also generated. Although multiple electrodes will be formed on a substrate with predetermined intervals or the above space, energy traps will provide independent resonance characteristics. In this example, energy traps are used, and the thickness shear vibration frequency range used will be between 2-8Mz. , and the thickness vibration frequency range used will be between 8-16MHz. However, since practical applications such as mobile communication nodes, CD-ROM, HDD, etc. require high frequencies exceeding 20 MHz, a resonator vibrating in thickness using third and fifth pole vibrations can be used; that is, including wavelength The lowest vibrational frequency (fundamental) wave of 2L, the higher coordinated vibration of the wavelength 2L/n (n is an integer) will occur on the piezoelectric substrate with thickness L, because the vibrations with n being even will cancel each other, only n is odd Vibration will appear; that is to say, three, five, seven and other vibrations including the lowest vibration frequency will be produced. The resonant frequency of higher coordinated vibrations will generate waves at the integer lowest vibration frequency f ₁ , for example, the third-order vibration and fifth-order vibration are expressed as f ₃ =3f ₁ and f ₅ =5f ₁ , respectively.

That is to say, the piezoelectric body vibrates regularly at the vibration mode of the lowest vibration frequency, wherein the thickness of the piezoelectric body is half the wavelength, and the vibration will be an odd multiple of the lowest vibration frequency, such as three times, five times, seven times times, etc., using higher coordinated vibrations, resonators exceeding 16MHz will be obtained, but because the resonators using higher coordinated vibrations have small amplitudes, the driving voltage for periodic oscillations will become higher, and the frequency will be higher because of the lowest vibration frequency Oscillatory jumps of the vibration will occur.

In addition, even when higher coordinated vibrations of more than three levels are used, since the thickness of the piezoelectric body must be thin in order to obtain an oscillation frequency exceeding 50 MHz, operability or workability deteriorates, so it is difficult to manufacture piezoelectric elements.

Contents of the invention

The purpose of the present invention is to provide a new piezoelectric vibrator and its manufacturing method. The technical problem to be solved is to make it have an expected oscillation frequency and stable oscillation characteristics, and at the same time be thin and closely combined with workability, Therefore, it is more suitable for practical use.

Another object of the present invention is to provide a new manufacturing method of piezoelectric vibrator, the technical problem to be solved is to make it possible to increase the process speed and reduce the manufacturing cost, which is simpler and has excellent workability and Improved workability to make piezoelectric vibrators with various structures, making it more suitable for practical use.

Another object of the present invention is to provide a stable, complete and combined chip. The technical problem to be solved is to reduce the unit chip from a single chip by making capacitors and obtain expected oscillation characteristics, so that it is more suitable for practical use.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. As can be seen from above technical scheme, main technical content of the present invention is as follows:

In order to achieve the above object, the fabrication of the piezoelectric vibrator according to the present invention can be achieved by using a piezoelectric body forming piezoelectric sheets, wherein the thickness is controlled, and simultaneously sintering a cover layer along these sheets, on which grooves are formed. In addition, fabrication of the piezoelectric vibrator of the present invention can be achieved using laminated piezoelectric sheets in which the thickness is controlled, internal electrodes are provided between the sheets, and external electrodes are formed separately from the internal electrodes.

More specifically, the piezoelectric vibrator of the present invention for achieving the above object includes a piezoelectric sheet, internal electrodes formed on the upper and lower regions of the piezoelectric sheet, covering layers and external electrodes, wherein one of the covering layers is formed on On each of the upper and lower regions of the piezoelectric sheet formed with internal electrodes, each external electrode is connected to each internal electrode, the covering layer formed on the piezoelectric sheet has vibration grooves, and the piezoelectric sheet is made by The vibrator can be formed by sintering the piezoelectric sheet and the cover layer simultaneously, and in such an example, the vibration groove can be between the piezoelectric sheet and the cover layer.

The cover layer may include a first cover layer in which a through hole is formed and a second cover layer covering the through hole, and the vibrator may further include first and second surface external electrodes formed in a cover layer. surface, and each is connected to each external electrode, and a third surface external electrode, which is formed in the middle part of the surface of the cover layer, and will not be connected to the external electrode, wherein the farthest of the vibrator The outer cover layer is a dielectric. The vibrator may further comprise at least one dielectric sheet in which internal electrodes are formed, wherein the dielectric sheet is laminated and bonded to the upper and/or lower portion of the vibrator, in such instances the vibrator is In the form of three nodes, that is to say, the external electrodes are respectively connected to the internal electrodes of the piezoelectric part, and a capacitor part in the middle part at both ends of the vibrator.

Also, in order to achieve the above object, the steps of the manufacturing method of the vibrator provided by the present invention include making a plurality of piezoelectric green sheets with a predetermined composition in the form of slurry; The first upper cover layer and the first lower cover layer are formed through the through hole of the groove; the second upper cover layer and the second lower cover layer are formed by forming the through hole as the combustion channel in the predetermined sheet of the piezoelectric green sheet. a cover layer; forming a vibrating active sheet using a predetermined sheet of said piezoelectric green sheet; forming an upper internal electrode between the vibrating active sheet and the first upper cover layer, and forming an active cover between the vibrating active sheet and the first lower cover layer A lower internal electrode is formed between the layers; a first upper cover layer and a first lower cover layer are respectively laminated on the upper and lower regions of the vibrating active sheet, and a first upper cover layer and a first lower cover layer are respectively laminated on the first upper cover layer and the first lower cover layer Laminating a second upper cladding layer and a second lower cladding layer respectively on the upper and lower regions of the laminate; simultaneously sintering the laminate; and forming external electrodes each connected to each internal electrode on the laminate.

The step of forming the first upper and lower cladding layers may include a step of filling at least one through hole of the first upper and lower cladding layers with an organic paste; and the step of simultaneously sintering the laminate includes a step of removing the organic matter by heat treatment A step of. The step of forming the inner electrodes includes a step of printing upper and lower inner electrodes on the upper and lower surfaces of the vibrating active sheet. In such an example, the step of forming the lower inner electrodes may include a step of printing a first lower inner electrode filled with an organic paste. cover layer of the lower internal electrode step.

Moreover, in order to achieve the above object, the steps of the method for manufacturing a vibrator provided by the present invention include making a plurality of piezoelectric green sheets in a slurry form with a predetermined composition; printing an organic pattern used as a vibration groove on the predetermined sheet to form a lower covering layer and forming a lower internal electrode thereon; and forming a through hole used as a combustion channel corresponding to the organic pattern of the vibration groove; Forming a vibrating active sheet by forming upper internal electrodes on a predetermined sheet of a piezoelectric green sheet, and forming an organic pattern thereon serving as a vibration groove; by forming an organic pattern on a predetermined sheet of a piezoelectric green sheet forming a combustion channel corresponding to the organic pattern used as the vibration groove to form the upper cladding layer; sequentially laminating the lower cladding layer, the vibrating active sheet and the upper cladding layer; removing the organic matter by heat-treating the laminate to form vibrating the groove, and simultaneously sintering the laminate; and forming external electrodes, each external electrode being connected to each internal electrode on the laminate.

The cover layer can include through-holes as combustion channels through which the organic material communicates with the environment. These internal and external electrodes can be deposited using thick thin films such as screen printing or thin film depositions such as It is formed by sputtering, evaporation, chemical vapor deposition or colloid coating.

In addition, in order to achieve the above object, the present invention provides a vibrator including internal electrodes, by controlling the pattern of the internal electrodes in the vibrator so that they are not connected to the external electrodes on the vibrator.

Furthermore, in order to achieve the above object, according to the present invention there is provided a vibrator comprising a laminated unit having at least two piezoelectric sheets; internal electrodes formed between the laminated piezoelectric sheets; and external electrodes formed in the laminated unit outside; wherein by controlling the pattern of the internal electrodes, the internal electrodes are not connected to the external electrodes.

Each external electrode may be formed on each of the upper, lower and side regions of the laminated unit, and the vibrator may further include an insulator on the upper and lower regions of the laminated unit, wherein a vibration groove is formed on the insulator; The vibrator may further include conductive channels passing through the laminated unit and not connected to internal elements, and each connected to each external electrode; the vibrator may further include three node electrodes formed in a vibrating groove of the insulator On the surface thereon; the vibrator may include at least one dielectric combined with a laminated piezoelectric element. In such cases where the dielectric is a build-up or a single plate, a dielectric substrate acting as a capacitor with nodes can be mounted on the lower portion of the build-up unit, and a The protective cover will be installed on the upper part of the laminated unit. Also, an insulating substrate formed with external electrodes may be provided on the lower part of the laminated unit, and a protective cover for protecting the unit may be provided on the upper part of the laminated unit, and the laminated unit and The insulator can be green with epoxy to protect the unit.

In addition, in order to achieve the above object, according to the present invention, there is provided a method for manufacturing a vibrator, the steps of which include making a plurality of piezoelectric green sheets in a slurry form with a predetermined composition; connecting internal electrodes; laminating at least two sheets on which the internal electrodes are formed; sintering the laminate; and forming external electrodes not connected to the internal electrodes outside the laminate.

In addition, in order to achieve the above object, according to the present invention, a method for manufacturing a vibrator is provided, the steps of which include making a plurality of piezoelectric green sheets in a slurry form with a predetermined composition; forming through holes at both ends of the green sheet; forming an internal electrode on the green sheet such that the internal electrode, when the through hole is filled with a conductive paste, does not contact the through hole and does not connect to the external electrode; layering at least two sheets; sintering the laminate; and External electrodes that are not connected to the internal electrodes but are connected to the conductive paste of the through-holes are formed on the outside of the laminate.

The internal electrodes can be formed on part of the surface of the sheet, so the internal electrodes will be at a distance from the edge of the sheet. The internal electrodes and the external electrodes are formed by thick film deposition such as glass printing, or thin film deposition such as sputtering, Evaporation, chemical vapor deposition or colloid coating.

It can be known from the above that the present invention relates to a piezoelectric vibrator and a manufacturing method thereof. The piezoelectric vibrator, such as a resonator, is used as a timing element, a discriminator, a filter, and the like. The piezoelectric vibrator of the present invention can be fabricated by forming a piezoelectric body of a piezoelectric sheet, controlling its thickness, and simultaneously sintering the cover layer along the sheet, on which grooves will be formed. In addition, the piezoelectric vibrator of the present invention can be fabricated using laminated piezoelectric sheets, controlling their thickness, providing internal electrodes between the sheets, and forming external electrodes insulated from the internal electrodes.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is the sectional view of a kind of common single planar resonator;

Fig. 2 is a kind of demonstrative drawing of making common single planar resonator;

Fig. 3 is an exemplary diagram of a manufacturing method according to the first embodiment of the present invention;

Fig. 4 is an exemplary diagram of a manufacturing method according to a second embodiment of the present invention;

Fig. 5 is an exemplary diagram of a manufacturing method according to a third embodiment of the present invention;

Fig. 6 is an exemplary diagram of a manufacturing method according to a fourth embodiment of the present invention;

FIG. 7 is a diagram of a resonator according to a fifth embodiment of the present invention;

FIG. 8 is an equivalent circuit diagram of a resonator with a built-in capacitor;

9a to 9e are diagrams illustrating the structure of a resonator and its manufacturing method according to a sixth embodiment of the present invention;

10a and 10b are diagrams illustrating the structure of a resonator and its manufacturing method according to a seventh embodiment of the present invention;

Fig. 11 is a vibration illustration of a single flat plate resonator;

Figures 12a and 12b are vibration diagrams of a resonator according to a wiring diagram;

13a and 13b are diagrams illustrating the structure of a resonator and its manufacturing method according to the eighth embodiment of the present invention;

14a to 14d are illustrations of the structure of a resonator and its manufacturing method according to the ninth embodiment of the present invention;

15a and 15b are diagrams illustrating the structure of a resonator and its manufacturing method according to the tenth embodiment of the present invention;

16a and 16b are diagrams illustrating the structure of a resonator and its manufacturing method according to an eleventh embodiment of the present invention;

Fig. 17 is a kind of resonator structure according to the twelfth embodiment of the present invention;

Fig. 18 is a kind of resonator structure according to the thirteenth embodiment of the present invention; And

Fig. 19 is a structure of a resonator according to a fourteenth embodiment of the present invention.

101, 311, 1301, 1401, 1501, 1601, 1701, 1801, 1901: piezoelectric body

102: electrode 104, 315, 412: vibration groove

1003, 1508, 1808: Vibrating grooves

105, 316, 317, 414, 415, 705, 706, 707, 708: External electrodes

908, 909, 1008, 1009, 1010, 1809, 1810, 1811, 1902: External electrodes

110: Epoxy resin 106: Chip components

103, 301, 302, 304, 305, 401, 403, 501, 502: overlay

504, 505, 601, 603, 703, 904, 906, 907: Overlay

306, 506, 604, 1412: through holes

307: Paste

308, 309, 405, 406, 702, 902, 1002, 1005: Internal electrodes

1006, 1007, 1302, 1402, 1502, 1602, 1702, 1802: internal electrodes

303, 312, 410, 701, 901, 913, 914, 915, 1001, 1004: Piezoelectric sheets

1014, 1015, 1311, 1411, 1509, 1510, 1511, 1615: Piezoelectric sheets

310, 408: green strips 402, 503, 602: vibrating active sheets

409: Unit chip (piezoelectric element) R: Piezoelectric resonator part

C, C1, C2, C _L , C _U : Capacitor part

905, 910, 911, 912, 1004, 1016, 1017: Dielectric sheets

1018, 1011, 1012, 1616, 1617: Dielectric sheets

1303, 1403, 1503, 1603, 1703, 1803: upper electrode

1304, 1404, 1504, 1604, 1704, 1804: lower electrode

1305, 1306, 1505, 1506, 1605, 1606: side electrodes

1705, 1706, 1805, 1806: side electrodes

1307, 1407, 1612, 1709, 1903: external nodes

1309, 1409: Protective cover 1507: Insulator

1310, 1410, 1613: insulating substrate 1308, 1611, 1707: conductive bonding agent

1406: Conductive channel 1413: Determining the space

1512: Upper insulating cover 1513: Lower insulating cover

1607, 1708, 1807: Dielectric body 1609: Capacitor side electrodes

1608: Internal electrode of capacitor 1610: External electrode under dielectric

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, The manufacturing method, steps, features and effects thereof are described in detail below.

A resonator such as an example of a vibrator according to the present invention, and its manufacturing method will be described in detail below.

(Example 1)

Referring to FIG. 3 , the manufacturing process of a through-hole resonator according to the present invention will be described in detail.

The present invention uses an unprocessed material powder that can be used for industrial production as a piezoelectric vibrator, or an unprocessed material powder of a desired piezoelectric composition such as PZT, PLZT, etc. can be used. To prepare green flakes, a slurry was made by stirring and mixing the above piezoelectric host ceramic powder with ethanol and PVB-based cement as an additional agent, and grinding it with a ball mill for 24 hours, The slurry is made into a plurality of piezoelectric green sheets (301 to 305) with a desired thickness using a strip casting, a scalpel, etc. In this example, it is possible to adjust the state of the slurry, such as viscosity, Various parameters in the scalpel etc. are used to control the thickness of the piezoelectric green sheet.

In the production process of the sheet, a plurality of through holes 306 are formed on the sheets 302, 304 with a punching machine, and these plurality of through holes 306 can be in various shapes, such as rectangle, circle or The holes 306 will be positioned so that they are all aligned with the internal electrodes of the vibrator. The first upper and lower cover layers are produced by filling the through holes 306 with a bakeable paste 307 such as carbon paste or PVB- or PVA-based organic paste by glass printing 302, 304, the filling of these through-holes is to prevent these through-holes from collapsing due to the pressing of the green sheets after lamination and before cutting. Forming the lower inner electrode 308 for the vibrator on the sheet 302 of these sheets can complete the first lower cover layer, in which the through-holes will be filled with paste, the through-holes in the sheet 302 will be aligned at the predetermined positions, wherein The lower internal electrode 308 may be a metal such as gold, platinum, etc., formed by thick film deposition such as screen printing, or thin film deposition such as sputtering, evaporation, chemical vapor deposition, or colloid coating. By forming the upper internal electrode 309 of the vibrator on the piezoelectric sheet 302 to form a vibrating active sheet, wherein no through hole is formed, and its thickness will be controlled at tens of microns, and the predetermined position of the piezoelectric sheet 303 will correspond to As for the lower internal electrode, the upper internal electrode 309 can be metal electrodes such as gold and platinum by sputtering, or conductive paste printed by glass printing. In addition to the above-mentioned method of making the first upper and lower covering layers 304, 302 filled with organic paste in the through holes, the first upper and lower covering layers 304, 302 can be easily manufactured without the need for organic paste, that is to say The first upper and lower covering layers may be formed by forming a plurality of through holes in the sheet, and the upper and lower internal electrodes are formed on the upper and lower surfaces of the piezoelectric sheet in which no through holes are formed and the thickness thereof is Controlled, the upper and lower internal electrodes are formed so that they are both aligned with the vias. However, the fabrication of the first upper and lower covering layers 304, 302 can be made by filling the through holes in one of the first upper and lower covering layers 304, 302 with organic paste. The covering layer can be made by only filling the through holes of the first lower covering layer 302 with organic paste and forming the lower internal electrodes 308 of the vibrator.

A green strip 310 containing multiple unit chips is produced by laminating the above-mentioned thin sheets, which are the second lower covering layer 301, the first lower covering layer 302, the vibrating active sheet 303, and the first upper covering layer. 304 and the second upper cover layer 305.

The green strip 310 will be pressed and cut into unit chips 311. In order to remove the bonding agent and various organic substances in the sheet and through-holes by firing the unit chip, the unit chip will be heated to 300 degrees Celsius The following is baking, followed by sintering the piezoelectric composition at a temperature by increasing the temperature, and the piezoelectric unit 311 is completed by simultaneously sintering the vibrating sheet and the cover layer, and the organic substances in the through holes of the upper and lower cover layers are followed in the sheet The same will be burnt and removed, so will form the vibration groove 315 for the vibrator to vibrate.

External electrodes 316, 317 are formed on both ends of the above-mentioned sintered and manufactured piezoelectric element 311 and adjustment steps are performed to complete the piezoelectric vibrator, so the external electrodes are respectively connected to the internal electrodes 308, 309, and in order to provide voltage Electricity uses an electric field to align electric dipoles in one direction. Figure 3(d) is a cross-sectional view of the completed piezoelectric vibrator, where the interlaced planes are similar to those shown in Figure 2(d).

Because the internal electrodes 308, 309 will be formed on the upper and lower surfaces of the thin piezoelectric sheet 312, the resonator fabricated in the above manner can have a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet, wherein the thickness will be controlled Therefore, the desired thickness can be achieved without additional process steps such as grinding when fabricating the thin piezoelectric body. In addition, since the obtained device is obtained by laminating the piezoelectric thin film and the cover layer and simultaneously sintering, the workability can be improved and the manufacturing process can be simplified, so that various configurations of devices can be easily fabricated.

(Example 2)

Referring to FIG. 4 , the process steps of a resonator with organic material application according to the present invention will be described in detail below.

In the same manner as in Example 1, a plurality of piezoelectric green sheets 401 having a predetermined thickness were fabricated.

On one sheet 401 of the sheets made above, use organic pastes such as carbon paste, PVB- or PVA- that can be baked at the bottom, and use glass printing to form organic patterns 404 as vibration grooves. These organic patterns can be It is a variety of shapes, such as rectangle, circle and ellipse, etc. These organic patterns can have a predetermined thickness, so after baking, vibration grooves with a predetermined depth can be formed, plus positioning so that the vibration grooves can be aligned with the vibration the internal electrodes of the device. The lower cover layer 401 is formed by forming a lower internal electrode 405 as a vibrator on a thin sheet with an organic pattern, wherein the lower internal electrode can use metal electrodes such as sputtered gold and platinum, or use conductive paste printed on glass. material. The active vibrating sheet 402 is fabricated by forming an upper internal electrode 406 for a vibrator on a piezoelectric sheet, controlling its thickness to tens of microns as described above, and then forming an organic pattern on the upper internal electrode in the above-mentioned manner 407, wherein the upper internal electrode 406 can be formed by sputtering metal electrodes such as gold and platinum, or by printing conductive paste on glass.

The green strip 408 containing a plurality of unit chips is made by laminating the above-mentioned sheets which are sequentially composed of the lower covering layer 401 , the vibrating active sheet 402 , and the upper covering layer 403 .

The green strip 408 will be pressed and cut into unit chips 409. In order to remove various bonding agents and organic substances between and in the thin slices after firing the unit chips, the chip units will be heated to below 300 degrees Celsius to bake, followed by simultaneous sintering of the vibrating foil and the cover piezoelectric element at a temperature of the sintered piezoelectric composition using increased temperatures to complete the piezoelectric element. Since the organic patterns 404, 407 for the vibration grooves between the upper and lower cover layers are also disposed of while burning and removing the organic matter in the sheet, the vibration grooves for the vibrator to vibrate are formed 412.

The external electrodes 414, 415 are formed on both ends of the piezoelectric element 409 manufactured and sintered in the above-mentioned manner, and the piezoelectric vibrator is completed by performing adjustment steps. The external electrodes will be connected to the internal electrodes 405, 406 respectively, and in order to provide piezoelectric Sex will apply an electric field to make the electric dipoles point in the same direction. Fig. 4(d) is a structural sectional view of the completed piezoelectric vibrator, where the sectional plane is similar to that shown in Fig. 2(d).

Since the internal electrodes 405, 406 are formed on the upper and lower surfaces of the thin piezoelectric sheet 410, the resonator fabricated in the above manner can have a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet. In addition, since the obtained device is obtained by laminating the piezoelectric thin film and the cover layer and simultaneously sintering, the workability can be improved and the manufacturing process can be simplified, so that various configurations of devices can be easily fabricated.

(Example 3)

Referring to FIG. 5 , the manufacturing steps of a through-hole resonator with a combustion channel according to the present invention will be described in detail below.

In the same manner as in Example 1, a plurality of piezoelectric green sheets having a predetermined thickness were fabricated. In addition, the first lower cover layer 502 , the vibrating active sheet 503 and the first upper cover layer 504 of the present embodiment are the same as the first lower cover layer 302 , the vibrating active sheet 303 and the first upper cover layer 304 of the first embodiment. Then use a drilling machine to drill holes in the two sheets of the fabricated sheet to form a second upper cover layer 505 and a second lower cover layer 501, which have a plurality of through holes 506 as combustion channels. In this example, the through-holes 506 serving as combustion channels would be positioned so as to align with the through-holes serving as vibration grooves in the first upper and first lower cladding layers 504 , 502 .

The green strip containing a plurality of unit chips is made by laminating the second lower covering layer 501, the first lower covering layer 502, the vibrating active sheet 503, the first upper covering layer 504 and the second upper covering layer in sequence. Layer 505 constitutes a sheet.

This green strip will be pressed and cut into unit chips. In order to remove various bonding agents and organic substances between the sheet and the through hole after firing the unit chip, the chip unit will be heated to below 300 degrees Celsius to bake Baking, followed by simultaneous sintering of the vibrating sheet and the covering piezoelectric element at a temperature of the sintered piezoelectric composition using increased temperatures to complete the piezoelectric element. In this case, since the organic matter in the through-hole is burned and easily removed through the combustion channel while burning and removing the organic matter in the sheet, a vibrating groove is formed for the vibrator to vibrate.

The upper and lower combustion channels of the piezoelectric element produced in the above manner are sealed with epoxy resin for sealing, and external electrodes are formed on both ends of the piezoelectric element so that the external electrodes are connected to the internal electrodes, that is, the piezoelectric element is completed. electric vibrator.

Since the internal electrodes are formed on the upper and lower surfaces of the thin piezoelectric sheet, the resonator fabricated in the above manner can have a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet. In addition, since various organic substances can be quickly removed through the combustion channel, and sintering is performed at the same time by laminating thin sheets and structural layers, workability can be improved and components of various configurations can be easily fabricated.

(Example 4)

Referring to FIG. 6 , the process steps of a resonator with organic material application according to the present invention will be described in detail below.

In the same manner as in Example 1, a plurality of piezoelectric green sheets having a predetermined thickness were fabricated. In addition, except that the lower and upper covering layers 601, 603 in this embodiment are pierced, the lower covering layer 601, the vibrating active sheet 602 and the upper covering layer 603 of this embodiment will be the same as those in Embodiment 2. The lower covering layer 401, the vibrating active sheet 402 and the upper covering layer 403 are the same. That is to say, the lower covering layer 601 is formed by using a drill to form a plurality of through holes 604 as combustion channels before forming the organic patterns and the lower internal electrodes. As described in Example 2, the formation of a plurality of through holes 604 as combustion channels is formed by using a drill to punch through the upper covering layer 603 on the manufactured sheet. In this example, through-holes 604 serving as combustion channels would be positioned to align with the organic pattern of the vibrating active sheet.

The green strip containing a plurality of unit chips is made by laminating the above-mentioned sheets composed of the lower covering layer 601 , the vibrating active sheet 602 , and the upper covering layer 603 in sequence.

This green strip will be pressed and cut into unit chips. In order to remove the bonding agent and various organic substances in the sheet and between the lower and upper cover layers and the vibrating active sheet by burning the unit chip, the chip will be The element is baked by heating to below 300°C, and the increased temperature is used to simultaneously sinter the vibrating sheet and the cover piezoelectric element at a temperature of the sintered piezoelectric composition to complete the piezoelectric element. In this example, since the organic matter between the cover layer and the vibrating sheet is burned and easily removed through the combustion channel while burning and removing the organic matter in the sheet, there will be Space is created, so vibration grooves are formed for the vibrator to vibrate.

The upper and lower combustion channels of the piezoelectric element produced in the above manner are sealed with epoxy resin for sealing, and external electrodes are formed on both ends of the piezoelectric element so that the external electrodes are connected to the internal electrodes, that is, the piezoelectric element is completed. electric vibrator.

Since the internal electrodes are formed on the upper and lower surfaces of the thin piezoelectric sheet, the resonator fabricated in the above manner can have a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet. In addition, since various organic substances can be quickly removed through the combustion channel, and sintering is performed at the same time by laminating thin sheets and structural layers, workability can be improved and components of various configurations can be easily fabricated.

(Example 5)

In order for the piezoelectric element to oscillate, a capacitor is required. A resonator combined with a capacitor is used as a resonator with a built-in capacitor. The resonator with a built-in capacitor will be described in detail below.

FIG. 7 is a resonator with built-in capacitors according to Embodiment 5. FIG.

The resonator with built-in capacitor of Embodiment 5 includes a piezoelectric resonator section R and a capacitor section C. The piezoelectric resonator portion R includes a piezoelectric sheet 701 having piezoelectricity, internal electrodes 702 formed on the upper and lower surfaces of the piezoelectric sheet, and vibration recesses formed on the upper and lower surfaces of the piezoelectric sheet and formed therein. The cover layer 703 of the groove, and the external electrodes 705 formed on the opposite ends of the piezoelectric sheet and the cover layer, are each connected to each internal electrode; the capacitor part C includes a dielectric body, and the cover layer 703 Just as a function of the dielectric, the first and second surface external electrodes 706, 707 are formed on the surface of the dielectric body and are respectively connected to the external electrodes, and a third surface external electrode 708 is formed on the surface of the dielectric body in the middle and isolated from the outer electrodes 705 .

The piezoelectric resonator part has internal electrodes formed on the upper and lower surfaces of the piezoelectric sheet, wherein the thickness is controlled within tens of micrometers to obtain the desired high oscillation frequency, and a plate-type dielectric is formed on the piezoelectric sheet. There are vibration grooves on the upper and lower surfaces of the sheet, and the external electrodes are each connected to each internal electrode, and are formed on two opposite ends of the piezoelectric sheet and the cover layer; the structure of the capacitor part is three Surface external electrodes are formed on either surface of the upper and lower dielectrics, on which vibration grooves are formed.

The fabrication method of the resonator with built-in capacitor will be described in detail below.

Using the same method as in Embodiments 1 to 4 to fabricate the piezoelectric body, the uppermost and lower covering layers of the piezoelectric body are made of a dielectric having a predetermined composition, that is, using a dielectric raw material that can be used in industrial applications Powder, which has a predetermined dielectric composition. In order to prepare a dielectric green sheet, a slurry is produced by adding a bonding agent to dielectric ceramic powder and using a general slurry-making method, and the slurry is formed into a predetermined thickness with a scalpel or the like. Dielectric green sheets, using the same method as in Examples 1 to 4 to use the produced dielectric green sheets to make the uppermost and lower cover layers of the vibrator, while the main body of the element is laminated, cut and simultaneously sintered steps are made.

External electrodes 705 will be formed on both ends of the component body, each of which will be connected to each of the internal electrodes 702; first and second surface external electrodes 706, 707 will be formed on either of the upper and lower dielectric capping layers On the surface, each of them will be connected with each external electrode on the two ends of the dielectric; the third external electrode 708 separated from the external electrodes will be formed in the middle of the surface of the dielectric; after the adjustment step will be To complete a piezoelectric vibrator, an electric field is provided to make the electric dipoles face in the same direction in order to provide piezoelectricity.

It can be seen from the equivalent circuit in Figure 8 that the completed resonator with a built-in capacitor includes a resonator and a capacitor in a unit chip marked with a dotted line, wherein capacitors C1 and C2 are respectively connected to the two ends of the resonator .

Since a resonator with a built-in capacitor of such a structure has internal electrodes on the upper and lower surfaces of the thin piezoelectric sheet, a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; The cover layer is formed with a dielectric, and the cover layer can be used as a capacitor, so the capacitor will be included in the unit chip, so compact components can be made, so that it can be easily applied to compact electronic components.

(Example 6)

FIG. 9 is a resonator with built-in capacitors according to Embodiment 6. FIG. The resonator with built-in capacitor of Embodiment 6 includes a piezoelectric resonator section R and a capacitor section C. The piezoelectric resonator portion R includes a piezoelectric sheet 901 having piezoelectricity, internal electrodes 902 formed on the upper and lower surfaces of the piezoelectric sheet, and vibration recesses formed on the upper and lower surfaces of the piezoelectric sheet and formed therein. The cover layer 904 of the groove, and the side external electrodes 908 formed on the opposite ends of the piezoelectric sheet and the cover layer, are each connected to each internal electrode; the capacitor part C includes a dielectric sheet 905; formed on A first capacitor internal electrode 906 formed on the dielectric sheet and each connected to a side external electrode 908; and formed on the dielectric sheet, spaced from the side external electrode 908, and connected to a The second capacitor internal electrode 907 of the electric sheet and the middle external electrode 909 on the front side of the cover layer.

This piezoelectric resonator part has internal electrodes formed on the upper and lower surfaces of a thin piezoelectric sheet in which the thickness is controlled within tens of micrometers to obtain a desired high oscillation frequency, followed by vibration grooves formed thereon. Covering layers are formed on the upper and lower surfaces of the piezoelectric sheet, and the capacitor portion is integrated with the piezoelectric resonator portion, wherein the dielectric sheet on which the internal electrodes of the capacitor are formed is laminated, and by The capacitance is controlled by adjusting the internal electrode pattern on the dielectric sheet and the number of laminated dielectric sheets.

The capacitor part C is pasted on the lower part of the piezoelectric resonator part R as shown in FIG. 9a, the upper part as shown in FIG. 9b, or the upper and lower parts as shown in FIG. 9c.

Please refer to FIG. 9d, the fabrication method of the resonator with built-in capacitor will be described in detail below.

Use the same method as in Embodiments 1 to 4 to form piezoelectric sheets and form electrodes thereon to make piezoelectric sheets 913, 914, 915 as part of the piezoelectric resonator. The upper covering layer 915 can be made of piezoelectric material or dielectric materials.

For the production of the capacitor part, the dielectric raw material powder with a predetermined dielectric composition is used for industrial use; for the production of the dielectric green sheet, the dielectric ceramic powder is added with a bonding agent and a general slurry is used. method to produce a slurry, which is formed into a dielectric sheet 910, 911, 912 having a predetermined thickness using a scalpel or similar tool.

The first dielectric 911 is fabricated by forming the first capacitor internal electrodes 906 on the above-made dielectric sheets in the unit chips separated by dotted lines. The first capacitor internal electrodes will be separated from each other, each One will be connected to each external electrode 908 on each side of the unit chip; in addition, the second dielectric sheet 912 is made by forming the second capacitor internal electrode 907 on another dielectric sheet, Wherein the second capacitor internal electrode 907 is connected to the middle external electrode 909 on the front side of the unit chip, and is spaced from both ends of the unit chip. The capacitor internal electrode and external electrode structure on each unit chip is shown in FIG. 9e Show.

The dielectric sheets 910 to 912 and the piezoelectric sheets 913 to 915 will be laminated. The dielectric sheets can be laminated on the upper or lower part of the piezoelectric resonator or on the upper and lower parts. The laminated dielectric The number of electrolytic sheets can be controlled according to the predetermined capacitance.

The main body of the unit chip element was produced by cutting and simultaneously sintering the laminated dielectric sheet and the piezoelectric resonator portion by the same method as in Examples 1 to 4.

Side external electrodes 908 are formed on both ends of the unit chip element body, wherein each side external electrode 908 is connected to each internal electrode 902 of the piezoelectric resonator portion and each first capacitor internal electrode 906; The intermediate external electrode 909 to the second capacitor internal electrode 907 will be formed on the front side of the outer side of the unit chip element; then, the piezoelectric vibrator can be completed by performing an adjustment step, and an electric field can be applied in order to provide piezoelectricity so that the galvanic couple poles facing the same direction.

It can be seen from the equivalent circuit in Figure 8 that the completed resonator with a built-in capacitor includes a resonator and a capacitor in a unit chip marked with a dotted line, wherein capacitors C1 and C2 are respectively connected to the two ends of the resonator . In such an example, the resonator with built-in capacitors in Figure 9c can have the largest capacitance because there are two capacitors spaced apart and connected in parallel to individual nodes of the resonator.

Since the resonator with built-in capacitor of such a structure has internal electrodes on the upper and lower surfaces of the thin piezoelectric sheet, a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; in addition, because the resonance of the built-in capacitor A device is a laminate of a piezoelectric resonator part and a dielectric sheet, in which internal electrodes are formed on the dielectric sheet as a capacitor, and the capacitor is included in a unit chip, so it is possible to make a compact element, which can be easily The application to compact electronic components.

(Example 7)

According to Embodiment 7, FIG. 10a illustrates a resonator with built-in capacitor. The resonator with built-in capacitor in Embodiment 7 includes a piezoelectric resonator part R, a lower capacitor part _CL , and an upper capacitor part C. _U.

The piezoelectric resonator portion R includes a piezoelectric sheet 1001 having piezoelectricity, internal electrodes 1002 formed on upper and lower portions of the piezoelectric sheet, and vibrations formed on the upper and lower portions of the piezoelectric sheet and formed therein. The cover layer of the groove 1003 and the side external electrodes 1008 , 1009 formed on opposite sides of the piezoelectric sheet and each connected to each internal electrode 1002 . The lower capacitor portion _CL includes a dielectric sheet 1004; a first capacitor internal electrode 1005 formed on the surface of the dielectric sheet and connected to a side external electrode 1008; and a first capacitor internal electrode 1005 formed on the dielectric sheet and connected to The side external electrodes 1008, 1009 are spaced apart and connected to a second capacitor internal electrode 1007 connected to a middle external electrode 1010 formed on the front side of the piezoelectric body. The upper capacitor portion _CU comprises another piezoelectric sheet 1004; a third capacitor internal electrode 1006 formed on the front side of the piezoelectric body; and formed on the dielectric sheet, separated from the side external electrodes 1008, 1009, and The second capacitor inner electrode 1007 connected to the middle outer electrode 1010 .

The piezoelectric resonator part will have internal electrodes on the upper and lower parts of the thin piezoelectric sheet, where the thickness is controlled within tens of microns to obtain the desired high oscillation frequency, and then on the upper and lower parts of the piezoelectric sheet A cover layer (that is, a dielectric layer) having vibration grooves is formed.

This capacitor part will be integrated with the piezoelectric resonator part in which the dielectric sheet on which the internal electrodes of the capacitor are formed will be laminated, and by adjusting the internal electrode pattern on the dielectric sheet and the laminated The number of dielectric sheets controls its capacitance. In particular, the capacitor portion includes a lower capacitor portion joined together with the lower portion of the piezoelectric resonator and connected to any node (i.e., an external electrode) of the piezoelectric resonator; and an upper capacitor portion connected to the piezoelectric resonator. The upper parts of the piezoelectric resonators are bonded together and connected together with the other nodes of the piezoelectric resonators (ie, the external electrodes).

Please refer to FIG. 10b, the manufacturing method of the resonator with built-in capacitor will be described in detail below.

Using the same method as in Embodiments 1 to 4 to form piezoelectric sheets and form electrodes thereon, in order to make dielectric sheets 1014, 1015 as part of the piezoelectric resonator, the upper and lower cover layers 1016, 1013 can be Dielectric material, and is used as part of the capacitor and as a cover layer.

For the production of the capacitor part, the dielectric raw material powder with a predetermined dielectric composition is used for industrial use; for the production of the dielectric green sheet, the dielectric ceramic powder is added with a bonding agent and a general slurry is used. method to produce a slurry, which is formed into dielectric green sheets 1011 to 1013, 1016 to 1018 having a predetermined thickness with a scalpel or the like.

The first dielectric sheet 1012 is made by forming the first capacitor internal electrodes 1005 on the above-made dielectric sheet in the unit chips separated by dotted lines, the first capacitor internal electrodes will be connected on each side of the unit chip The external electrode 1008 on the top; the second dielectric sheet 1013, 1016 is made by forming the second capacitor internal electrode 1007 on other dielectric sheets, wherein in the unit chip, the second capacitor internal electrode 1007 will be connected with The middle external electrode 1010 on the front side of the unit chip is connected and spaced from both ends of the unit chip; in addition, the third dielectric sheet 1017 is made by forming a third capacitor internal electrode on another dielectric sheet 1006, wherein in the unit chip, the third capacitor internal electrode 1006 is connected to the external electrode 1008 on the other side of the unit chip.

Dielectric sheets and piezoelectric sheets will be stacked, in order to form the dielectric sheet 1011 of the lower capacitor, the first dielectric sheet 1012, the second dielectric sheet 1013, the dielectric sheets 1014, 1015, the second The second dielectric sheet 1016, the third dielectric sheet 1017, and the dielectric sheet 1018 constituting the upper capacitor. In such an example, the number of stacked dielectric sheets can be controlled according to the predetermined capacitance. .

The main body of the unit chip element was produced by cutting and simultaneously sintering the laminated dielectric sheet and the piezoelectric resonator portion by the same method as in Examples 1 to 4.

Side external electrodes 1008 and side external electrodes 1009 are formed on both ends of the unit chip element body, wherein the side external electrodes 1008 are connected to the internal electrodes 1002 of the piezoelectric resonator part and the internal electrodes 1005 of the first capacitor, And wherein the side external electrode 1009 will be connected to the internal electrode 1002 of the piezoelectric resonator part and the third capacitor internal electrode 1006, and there will be a middle part connected to the second capacitor external electrode 1007 on the front and or near area of the element body External electrodes 1010 are formed. Next, the piezoelectric vibrator is completed by an adjustment step in which an electric field is applied so that the electric dipoles face in the same direction in order to provide piezoelectricity.

It can be seen from the equivalent circuit of FIG. 8 that the completed resonator with built-in capacitor includes the resonator and capacitor in a unit chip marked with a dotted line, wherein the capacitor is respectively connected to two ends of the resonator.

Since the resonator with built-in capacitor of such a structure has internal electrodes on the upper and lower surfaces of the thin piezoelectric sheet, a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; in addition, because the resonance of the built-in capacitor A device is a laminate of a piezoelectric resonator part and a dielectric sheet, in which internal electrodes are formed on the dielectric sheet as a capacitor, and the capacitor is included in a unit chip, so it is possible to make a compact element, which can be easily The application to compact electronic components.

(Embodiment 8)

The vibrator with high oscillation frequency is mentioned in the above several embodiments, wherein the manufacture of the vibrator is made by sintering the piezoelectric body at the same time. The cover layer of the groove is made, and in the next embodiment, including this embodiment, the vibrator with high oscillation frequency is made by laminating a plurality of piezoelectric sheets whose thickness is precisely controlled, and internal electrodes are formed between the piezoelectric sheets , as well as controlling the pattern of the internal electrodes comes.

First, referring to FIG. 11, FIG. 12a and FIG. 12b, the vibration principle of the vibrator or resonator manufactured by controlling the pattern of internal electrodes will be described. As shown in Figure 11, let the oscillation frequency of a single-plate resonator with thickness T be fa. In this example, the entire thickness of the resonator is 2T. Two resonators are stacked together, each with a thickness of T , as shown in Fig. 12a and Fig. 12b, the oscillation frequency of the resonator changes with twice the electrode wire in the two resonators laminated together. That is, if the polarity of the upper and lower electrodes is different from that of the middle electrode shown in Fig. 12a, the wavelength will increase twice, so the oscillation frequency of the fundamental harmonic vibration of the resonator will become 1/2 fa, So the frequency becomes half of that shown in Figure 11. However, if the polarity of the upper electrode is different from that of the lower electrode, as shown in Figure 12b, and if the middle electrode (or internal electrode) does not have a wire, because the upper and lower surfaces of the element will be charged to change the electrical properties respectively. For (+) and (-), just like applying an electric field on a capacitor, the wavelength will be halved, so the oscillation frequency of the resonator will become fa, which is the same frequency as mentioned in Figure 11. That is, the same oscillation frequency can be obtained even though the number of layers laminated together increases, so a resonator with a high oscillation frequency can be obtained by thinning the single-plate type piezoelectric body of the resonator. In addition, by laminating the single-plate piezoelectric main volumes with the same thickness, an element with a desired thickness and workability can be obtained, and by controlling the connection of electrodes, a vibrator with a predetermined frequency and thickness can be fabricated.

Referring to Fig. 13a, a resonator of this embodiment will be described.

The resonator includes a piezoelectric body 1301 with piezoelectricity; an internal electrode 1302 formed on the piezoelectric body; an upper electrode 1303 and a lower electrode 1304, which are respectively formed on the upper and lower parts of the piezoelectric body, and the upper and lower electrodes power is applied; side electrodes 1305, 1306, respectively connected to upper electrode 1303 and lower electrode 1304; external node 1307; and a protective cover 1309. The inner electrode 1302 is not connected with the upper electrode 1303, the lower electrode 1304 and the side electrodes 1305, 1306; the side electrodes 1305, 1306 are formed on two opposite sides of the piezoelectric body; the upper electrode 1303 and the lower electrode 1304 are respectively Connected to side electrode 1305 and side electrode 1306, each also connected to each external node 1307 on two opposite sides of the piezoelectric body; protective cover 1309 may cover the entire piezoelectric body for protection.

The piezoelectric body is a laminated piezoelectric sheet structure, the thickness of which will be controlled at tens of microns to obtain a high oscillation frequency, and the internal electrodes will be printed on part or almost the entire surface of the sheet, so the internal electrodes will be in contact with the The ends of the sheet are spaced apart so as not to be connected to the side, upper and lower external electrodes on the thin piezoelectric sheet, and the lower part of the piezoelectric body will be further combined with the insulating substrate 1310, by Through holes are formed on the side, and external nodes 1307 will be formed in the through holes. These external nodes will be on the conductive adhesive 1308 on both sides of the piezoelectric body, and connected with the side and the upper external electrode and the side and the lower external electrode. , the piezoelectric body formed with all the electrodes will be covered and protected by the protective metal cover 1309 .

Please refer to Fig. 13b, which illustrates the fabrication process of such a resonator.

Using the same method as in Example 1, a piezoelectric green sheet 1311 having a predetermined thickness is produced by thick film deposition such as glass printing or thin film deposition such as sputtering, evaporation, chemical vapor deposition, or colloid coating. , the internal electrode 1302 is formed within the sheet so as to be spaced from the end of the sheet so as not to be connected to the edge of the sheet. In such instances, the separation distance between the internal electrode 1302 and the edge of the wafer would be different than the distance between the internal electrode 1302 and the other opposing side of the wafer.

After the sheets on which the internal electrodes are formed are laminated together in a predetermined number so that the space interval between the internal electrodes 1302 and the side electrodes 1305 will be different from that between the internal electrodes 1302 and the side electrodes 1306, by Cut the laminate into unit elements (as indicated by dotted lines) to make the laminated piezoelectric body 1301 of the unit element. After heating to remove various bonding components in the laminate and baking the laminate, add The laminate is sintered at the sintering temperature of the piezoelectric composition.

The upper electrode 1303 and the lower electrode 1304 formed on the outside of the piezoelectric body 1301 produced above will not be connected with the internal electrode 1302 of the laminate, and the side electrodes 1305 and 1306 will be formed on both sides of the piezoelectric body. and connected to the upper and lower electrodes respectively, in such cases, the upper, lower and side external electrodes are formed by thick film deposition such as glass printing or such as sputtering, evaporation, chemical vapor deposition, or It is thin film deposition such as colloid coating. Fig. 13b(c) is a cross-sectional view of a complete element formed with external electrodes, and its cross-section is similar to that in Fig. 2(d).

The cutting step is carried out by supplying power to the two external electrodes of the piezoelectric body formed with electrodes, so that the piezoelectric dipoles will be in the same direction. After the cut piezoelectric body is installed on the insulating substrate, the piezoelectric Each external electrode at both ends of the body will be glued to each external node with a conductive adhesive, wherein the external node will be formed in a through-hole in both ends of the insulating substrate; usually a protective metal cover will be used to cover the device on the insulating The piezoelectric body on the substrate then completes the resonator element.

A resonator with such a structure will form internal electrodes on a thin piezoelectric sheet, and a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; in addition, an element with a predetermined thickness can be obtained by laminating piezoelectric sheets, which can improve reliability. Workability, so that it can be easily applied to compact electronic components.

(Example 9)

Referring to Fig. 14a to Fig. 14d, the resonator in Embodiment 9 of the present invention will be described below.

Please refer to FIG. 14a, the resonator of this embodiment includes a piezoelectric body 1401 with piezoelectricity; an internal electrode 1402; an upper electrode 1403 and a lower electrode 1404, which are respectively formed on the upper and lower surfaces of the piezoelectric body, And will apply power on it; external node 1407; and a protective cover 1409 covering the whole piezoelectric body. The internal electrode 1402 will be formed in the component body and will not be connected to the upper electrode 1403 and the lower electrode 1404; the outer node 1407 will be connected to the upper and lower electrodes respectively through the conductive channel 1406, wherein the conductive channel will pass through the piezoelectric body and is isolated from the internal electrodes.

The piezoelectric body is a laminate of piezoelectric sheets, the thickness of which will be controlled at tens of microns to obtain a high oscillation frequency, and the internal electrodes will be printed on part of the sheet or nearly the entire surface, so the internal electrodes will not communicate with the The upper and lower external electrodes on the thin piezoelectric sheet are adjacent to each other and will be isolated from the conductive channel as a through hole; the lower part of the piezoelectric body will be further bonded to the insulating substrate 1410, using the formed on both sides of the insulating substrate Through holes, external nodes 1407 will be formed in the through holes, and each external node will be pasted to each of the upper and lower external electrodes on the lower sides of the piezoelectric body by conductive adhesive, and the piezoelectric body forming all electrodes will be The protective layer 1409 covers and protects.

The fabrication process of such a resonator will be described in detail below.

Using the same method as in Example 1, a piezoelectric green sheet 1411 with a predetermined thickness is produced, and a punching machine is used to form through holes 1412 as conductive channels on both sides of the plurality of green sheets produced in the previous arrangement. The internal electrodes and The conductive paste will be formed on the sheet with the through hole, so the internal electrode will not be in contact with the conductive channel, and the internal electrode and the inside of the through hole will be printed at the same time. In such an example, the internal electrodes will be printed on a defined space 1413 on almost the entire surface of the sheet from the conductive path of the through hole, as shown in FIG. 14c; on the surface of the sheet part, as shown in Figure 14d.

After laminating a predetermined number of sheets with internal electrodes formed thereon, they are cut into unit elements (as shown by dotted lines) to produce a laminated piezoelectric body as a unit element line. After baking the laminate by heating the various joint components in the laminate, the temperature is increased to sinter the laminate at a precise temperature. The upper and lower electrodes are formed on the outside of the sintered laminates, which are not connected to the internal electrodes of each laminate. In this example, each upper and lower electrode is isolated from the inner electrode and connected to the conductive paste of each through-hole, and the adjustment step is performed by applying power to the outer electrode of the piezoelectric body, so that the piezoelectric couple Pole can go in the same direction. After the above-mentioned piezoelectric body is installed on the insulating substrate, each external electrode of the piezoelectric body is pasted to an external node of the insulating substrate through a conductive channel using a conductive adhesive, wherein the nodes are formed at both ends of the insulating substrate in the through hole. Next, to cover the piezoelectric body with a protective cover, a protective metal cover is usually used to cover the piezoelectric body to complete the resonator element.

A resonator with such a structure will form internal electrodes on a thin piezoelectric sheet, and a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; in addition, an element with a predetermined thickness can be obtained by laminating piezoelectric sheets, which can improve reliability. Workability, so that it can be easily applied to compact electronic components.

(Example 10)

Referring to FIG. 15a, the resonator in Embodiment 9 of the present invention will be described below.

The resonator of Embodiment 10 includes a piezoelectric body 1501 having piezoelectricity; an internal electrode 1502 formed on the piezoelectric body; an upper electrode 1503 and a lower electrode 1504 formed on the upper and lower surfaces of the piezoelectric body, respectively, And power is applied thereon; the side electrodes 1505, 1506 are connected to the upper electrode 1503 and the lower electrode 1504 respectively; and the insulator 1507 has vibration grooves formed thereon. The internal electrode 1502 will not be connected with the upper electrode 1503, the lower electrode 1504 and the side electrodes 1505, 1506, each side electrode 1505, 1506 will be formed on each opposite side of the piezoelectric body, and the insulator 1507 will be formed on the piezoelectric body. The upper and lower parts of the electrical main body.

The piezoelectric body is a laminate of piezoelectric sheets, the thickness of which will be controlled at tens of microns to obtain a high oscillation frequency, and the internal electrodes will be printed on part of the sheet or nearly the entire surface, so in order not to interfere with the piezoelectric The side, upper and lower electrodes on the sheet are connected, and the internal electrodes are separated from the end of the sheet; the insulator 1507 formed on the upper and lower parts of the piezoelectric body is just a general insulating plate in which vibration grooves 1508 are formed. Let the vibrator vibrate.

The fabrication process of such a resonator will be described in detail below.

Using the same method as in Example 1, a piezoelectric green sheet 1509 with a predetermined thickness is produced, and internal electrodes 1502 are printed on the above-mentioned sheet by glass printing to produce a plurality of first piezoelectric sheets 1509, so that the internal electrodes will not connect to the edge of the sheet; the upper electrode 1503 is printed on the upper surface of one piezoelectric sheet to make the second piezoelectric sheet 1510, so the upper electrode will only connect to the outer electrode on one edge of the sheet and the lower electrode 1504 is printed on the lower surface of another piezoelectric sheet to make a third piezoelectric sheet 1511, so the lower electrode will be connected to the external electrode on the other opposite edge of the sheet, with general insulation Vibration grooves are formed on characteristic insulating plates to form upper and lower insulating covers 1512, 1513.

The above-mentioned piezoelectric sheets and insulating covers will be stacked, which are the lower insulating cover 1513, the third piezoelectric sheet 1511, a plurality of first piezoelectric sheets 1509, the second piezoelectric sheets 1510, and the upper insulating cover 1512, As shown in Figure 15b. The main body of the laminated element as a unit element is cut into unit element lines (as shown by the dotted line), and the laminate is baked by heating in order to remove various bonding components in the laminate Later, the temperature is increased to sinter the laminate at a precise temperature. The element is fabricated by forming side external electrodes, each of which is connected to each of the upper and lower electrodes of the piezoelectric body, and vibration grooves are formed on both surfaces of the laminate including the insulator.

The production of the element is to layer the insulating cover and the piezoelectric main body together and sinter at the same time, but the element can be made into a vibrator with a vibrated insulator that uses the insulating cover and the piezoelectric body bonded together. The insulating cover It is manufactured separately from the piezoelectric body, that is to say, the manufacturing method of the piezoelectric body is the same as that of Embodiment 8. Next, upper and lower electrodes are formed on the upper and lower surfaces of the sintered piezoelectric body, wherein the upper and lower electrodes are not connected to internal electrodes inside the piezoelectric body; vibration grooves are formed on an insulating plate having general insulating properties Make an insulating cover, put the insulating cover on the upper and lower parts of the piezoelectric body with upper and lower electrodes, and form side external electrodes on both sides of the piezoelectric body including the insulator to make an element, each of which Side electrodes are connected to each of the upper and lower electrodes.

A resonator with such a structure will form internal electrodes on a thin piezoelectric sheet, and a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; in addition, an element with a predetermined thickness can be obtained by laminating piezoelectric sheets, which can improve reliability. Workability, so that it can be easily applied to compact electronic components.

(Example 11)

The capacitor-built-in resonator shown in FIGS. 16a and 16b according to the present embodiment includes a piezoelectric resonator portion and a capacitor portion. The piezoelectric resonator part includes a piezoelectric body 1601 having piezoelectricity; internal electrodes 1602 formed in the piezoelectric body; an upper electrode 1603 and a lower electrode 1604 respectively formed on the upper and lower surfaces of the piezoelectric body, and and the first and second side electrodes 1605, 1606 are connected to the upper electrode 1603 and the lower electrode 1604 respectively. The inner electrode 1602 is not connected with the upper electrode 1603, the lower electrode 1604 and the side electrodes 1605, 1606, and the first and second side electrodes 1605, 1606 are respectively formed on two opposite sides of the piezoelectric body.

The capacitor portion includes a dielectric body 1607 , a capacitor side external electrode 1609 , a capacitor internal electrode 1608 , and a dielectric lower external electrode 1610 . The capacitor internal electrode 1608 will be formed in the dielectric body and connected to the capacitor side external electrode 1609 through the laminated body on the front side surface; the dielectric lower external electrode 1610 will be formed in the lower portion of the dielectric body on, and separated from the external electrode on the side of the capacitor; the upper electrode of the resonator part and a lower electrode of the capacitor part will be connected to one of the external nodes 1612 through one of the side electrodes of the laminated main body; the part of the resonator The lower electrode 1604 (that is, the upper electrode of the capacitor part) and the other lower external electrodes of the capacitor part will be connected to another external node through the other side electrodes of the main body of the laminate; Electrodes 1609 are connected to other external nodes 1612 .

The piezoelectric resonator part is a laminate of thin piezoelectric sheets, wherein the piezoelectric resonator part has internal electrodes on the upper and lower parts of the thin piezoelectric sheets, wherein the thickness is controlled within tens of micrometers to obtain expected high oscillation frequency. The internal electrodes of the piezoelectric resonator part will be printed on part of the sheet or nearly the entire surface. In order not to be connected with the side, upper and lower external electrodes on the thin piezoelectric sheet, the internal electrodes will be connected to the sheet. The edges are spaced apart; the capacitor part is a laminate of dielectric sheets, which will control the laminated thin dielectric sheets to control the capacitance in order to achieve a predetermined capacitance; in order to connect to the external node through the external electrode on the side of the capacitor, The internal electrodes of the capacitor part are printed on an insulating sheet with a conductive paste.

The piezoelectric resonator part and the capacitor part are laminated together and then processed in the same steps. In addition, they can also be made separately and then combined together, that is to say, the piezoelectric resonator and capacitor can be glued together after they are made separately.

An insulating substrate 1613 is placed on the lower part of the resonator with built-in capacitor, forming through-holes, which are positioned so that each through-hole is in contact with an external electrode of the resonator with built-in capacitor to form three external nodes 1612, insulating The substrate 1613 will have external nodes formed in the through-holes, these three external nodes will be connected to the respective external electrodes by conductive adhesive 1611, wherein the resonators forming the built-in capacitors of all electrodes will be used to protect the metal of the device Cover to protect.

The fabrication process of such a resonator with built-in capacitors will be described below.

In the same manner as in Example 1, a piezoelectric green sheet 1615 with a predetermined thickness is produced, and internal electrodes 1602 are printed on the above-mentioned sheet by glass printing, so that the internal electrodes will not be connected to the edge of the sheet. In an example, the separation distance between the internal electrode 1602 and the edge of the wafer may be different than the distance between the internal electrode 1602 and other opposing edges of the wafer.

For the production of the capacitor part, the dielectric raw material powder with a predetermined dielectric composition is used for industrial use; for the production of the dielectric green sheet, the dielectric ceramic powder is added with a bonding agent and a general slurry is used. method to create a slurry, using a scalpel or similar tool to form the slurry into dielectric sheets 1616, 1617 of predetermined thickness.

The making of the first dielectric 1616 is to print the internal electrodes 1608 with conductive paste on the dielectric sheet made above, so the internal electrodes will be connected with the external electrodes on the front side of the element main body; the second sheet 1617 The fabrication is to print the upper electrode 1604 (that is, the lower electrode of the resonator part) on the insulating sheet made above, so the upper electrode will be connected with the external electrode on one of the two sides of the element body.

After laminating a predetermined number of first dielectric sheets 1616 and second dielectric sheets 1617, a predetermined number of piezoelectric sheets 1615 are laminated, on which the internal electrodes of the resonator are printed, so that the internal electrodes and the first side The separation distance between the electrodes 1605 may be different from that between the internal electrodes and the second side electrodes 1606 . Afterwards, the production of the laminated element of the unit element is to cut it into unit elements (as shown by the dotted line), and after heating the laminated element to bake it to remove various bonding components in the laminated element, increase the temperature Sinter laminated components to precise sintering temperatures.

In addition to the method of simultaneously sintering laminates, resonators with built-in capacitors can also be formed by bonding the resonator part and the capacitor part together. The resonator part and the capacitor part are fabricated separately and laminated and sintered together.

The upper electrode 1603 and the lower electrode 1610 are formed on the outside of the multilayer component, that is, the built-in capacitor resonator fabricated by different methods, and are not connected to the internal electrodes of the multilayer. The upper electrode 1603 is formed to be connected to both sides of the laminate, while the lower electrode 1610 is formed to be connected to one of the two sides of the laminate and is isolated in the middle; the first side electrode 1605 is formed to have the upper and On one side of the multilayer component of the lower electrode, it will be connected to one of the upper electrode 1603 of the resonator part and the lower electrode of the capacitor part; the second side electrode 1606 will be formed on the other side of the multilayer component, and it will be connected to The lower electrode 1604 of the resonator part (that is, the upper electrode of the capacitor part) and the other of the lower electrode of the capacitor part; the capacitor side external electrode 1609 (that is, the third side external electrode) will be formed in front of the laminated element side, which will be connected together with the internal electrodes of the capacitor section. The adjustment step is performed by applying power to the two external electrodes of the bonded and laminated element formed with electrodes, so that the piezoelectric dipoles can be directed in the same direction. In this example the individual components fabricated separately will be bonded to make a bonded and laminated component. After adjusting the resonator section, the resonator section and capacitor section will be bonded together.

The laminated components manufactured above will be placed on the insulating substrate, wherein the external nodes 1612 will be formed in the through holes in the insulating substrate to form three nodes in the insulating substrate, two nodes will be connected with the conductive adhesive 1611 and The individual first and second side external electrodes at both ends of the multilayer component are connected together, the middle external node will be connected to the third side external electrode on the front side of the multilayer component, and finally in order to cover with a protective cover A resonator with a built-in capacitor is usually used, and a resonator with a built-in capacitor is completed by covering the multilayer element with a protective metal cover.

It can be seen from the equivalent circuit of FIG. 8 that the completed resonator with built-in capacitor includes the resonator and capacitor in a unit chip marked with a dotted line, wherein the capacitor is respectively connected to two ends of the resonator.

Since a resonator with a built-in capacitor of such a structure has internal electrodes on the thin piezoelectric sheet, a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; Components with a predetermined thickness can improve workability, so components with various structures can be easily fabricated. In addition, since the resonator with a built-in capacitor is a type of unit chip including a capacitor, which can operate stably, simple and smallest single-chip components can be fabricated with a simple manufacturing method, and can be easily applied to compact of electronic components.

(Example 12)

Please refer to FIG. 17 , the resonator with built-in capacitor of Embodiment 12 will be described below.

The capacitor-built-in resonator of this embodiment in FIG. 17 includes a piezoelectric resonator portion and a capacitor portion. The piezoelectric resonator portion includes a piezoelectric body 1701 having piezoelectricity; internal electrodes 1702 formed in the piezoelectric body; an upper electrode formed on upper and lower portions of the piezoelectric body respectively and to which power is applied. 1703 and a lower electrode 1704; and side electrodes 1705, 1706, which are connected to the upper electrode 1703 and the lower electrode 1704 respectively. The inner electrode 1702 is not connected with the upper electrode 1703, the lower electrode 1704 and the side electrodes 1705, 1706, and the side electrodes 1705, 1706 are respectively formed on two opposite sides of the piezoelectric body.

The capacitor portion includes a dielectric body 1708 and capacitor node electrodes 1709 (ie, external nodes) within the through holes of the dielectric body. The node electrodes (ie external nodes) are connected to the top, bottom and side electrodes of the piezoelectric resonator body with conductive adhesive 1707 .

The piezoelectric resonator part is a laminate of thin piezoelectric sheets. The thickness is controlled within tens of microns to obtain the expected high oscillation frequency. The internal electrodes of the piezoelectric resonator part will be printed on the thin part Or nearly all over the surface, so that there is a space from the edge of the thin piezoelectric sheet in order not to connect to the side, upper and lower external electrodes on the thin piezoelectric sheet. Since the part of the capacitor is a dielectric substrate with three through-holes through the substrate, and the node electrodes will be formed in it, the two capacitors will be connected separately to the individual nodes of the resonator, covered and protected by a protective metal cap that forms the A resonator with built-in capacitors for all electrodes.

The fabrication method of the resonator with built-in capacitor will be described in detail below.

Use the same method as in Example 1 to form a laminated piezoelectric body, form an upper electrode and a lower electrode that are not connected to the internal electrodes of the laminate on the outside of the laminate, and form electrodes on both sides of the piezoelectric body that are respectively connected to The side electrodes of the upper and lower electrodes apply power to the two outer electrodes of the piezoelectric body formed with electrodes to perform the adjustment step, so that the piezoelectric dipoles will be in the same direction. The piezoelectric cooker fabricated above will be placed on a dielectric substrate, wherein capacitor node electrodes (that is, external nodes) will be formed in the through holes in the dielectric substrate as three nodes, and the dielectric substrate will be bonded with bonding agent 1611. The two node electrodes of the electro-substrate are connected to individual side external electrodes within the two ends of the laminate element, and the resonator element is typically completed by covering the piezoelectric body with a conductive metal cap to be covered with a protective cap piezoelectric body.

It can be seen from the equivalent circuit of FIG. 8 that the completed resonator with built-in capacitor includes the resonator and capacitor in a unit chip marked with a dotted line, wherein the capacitor is respectively connected to two ends of the resonator.

Since a resonator with a built-in capacitor of such a structure has internal electrodes on the thin piezoelectric sheet, a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; Thickness of the element can improve workability. In addition, because the dielectric on the lower part of the piezoelectric body is used as a capacitor and a substrate, the capacitor can be easily included in the unit element, so that a simple and smallest single-chip element can be fabricated, and it can be easily applied to compact electronic components .

(Example 13)

Please refer to FIG. 18 , the resonator with built-in capacitor of Embodiment 13 will be described below.

The capacitor-built-in resonator of this embodiment in FIG. 18 includes a piezoelectric resonator portion and a capacitor portion. The piezoelectric resonator portion includes a piezoelectric body 1801 having piezoelectricity; internal electrodes 1802 formed in the piezoelectric body; an upper electrode formed on upper and lower portions of the piezoelectric body respectively and to which power is applied. 1803 and a lower electrode 1804; and side electrodes 1805, 1806, which are connected to the upper electrode 1803 and the lower electrode 1804 respectively. The inner electrode 1802 is not connected with the upper electrode 1803, the lower electrode 1804 and the side electrodes 1805, 1806, which are respectively formed on two opposite sides of the piezoelectric body. The capacitor portion includes a dielectric body 1807; first and second surface external electrodes 1809, 1810 formed on one surface of the dielectric body and connected to the side external electrodes; and a third surface external electrode 1811, Formed on the surface of the dielectric body and isolated from the side external electrodes.

The piezoelectric resonator portion is a flat plate dielectric, each having vibration grooves 1808 formed in the upper and lower portions of the piezoelectric resonance portion, a dielectric of the upper and lower dielectrics (that is, the capacitor portion ) will have surface external electrodes, as described above. The piezoelectric resonator part is a laminate of thin piezoelectric sheets. The thickness is controlled within tens of microns to obtain the expected high oscillation frequency. The internal electrodes of the piezoelectric resonator part will be printed on the thin part or Near the entire surface, there will be spacing from the edge of the sheet in order not to connect to the side, upper and lower external electrodes on the thin piezoelectric sheet. The structure of the capacitor part is printed with three surface external electrodes on the surface of the dielectric with vibration grooves 1808 formed therein and conductive paste to connect to individual external nodes.

The fabrication method of the resonator with built-in capacitor will be described in detail below.

A laminated piezoelectric body was formed by the same method as in Example 10, and upper and lower electrodes not connected to the internal electrodes of the laminate were formed on the outside of the laminate, and then vibration grooves 1808 were formed thereon. A planar dielectric cover is mounted on the upper and lower portions of the laminated piezoelectric body, and the first and second surface external electrodes 1809, 1810 are each connected to one of the ends of the upper and lower dielectrics. Each side electrode, the third surface external electrode 1811 will be separated from the side electrode in the middle, the side electrode 1806 will be connected to the upper electrode 1803 of the dielectric body and the first surface external electrode 1809, and the side Electrodes 1805 are formed on each opposite side of the electrode-formed laminate, and are connected together with the lower electrode 1804 and the second surface external electrode 1810 of the piezoelectric body.

It can be seen from the equivalent circuit of FIG. 8 that the completed resonator with built-in capacitor includes the resonator and capacitor in a unit chip marked with a dotted line, wherein the capacitor is respectively connected to two ends of the resonator.

Since a resonator with a built-in capacitor of such a structure has internal electrodes on the thin piezoelectric sheet, a high oscillation frequency corresponding to the thickness of the thin piezoelectric sheet can be obtained; Thickness components can improve workability, so components of various structures can be easily fabricated. In addition, since the resonator with built-in capacitor includes a dielectric cover, in which a vibration groove is formed, and can be used as a capacitor, the capacitor will be included in the unit element, so it is possible to make a simple and smallest single-chip element, and easily use to compact electronic components.

(Example 14)

Unit components made according to individual embodiments may be covered with an insulating epoxy other than a protective cover to protect the component. Please refer to FIG. 19 , a three-node element of this embodiment will be described in detail below, wherein the entire element will be covered and encapsulated by insulating epoxy resin.

Using the same method as in Embodiment 13 to form a unit element body 1901 with external electrodes, an external node 1903 will be connected to a surface external electrode 1902 formed on one end of the surface of the body, using elastic insulating epoxy to form a layer of protection. film, casting the body with the external electrodes to complete the element, this protective epoxy resin film can be used to coat two-node elements other than the three-node elements described above.

On the other hand, the above-mentioned method of fabricating a vibrator can fabricate high-frequency chip components by designing isolated internal electrodes in various components requiring high vibration frequencies in addition to the above-mentioned resonators.

Because the workability of the above-mentioned vibrator can be improved, the vibrator can be made into various structures other than those mentioned above, and the above-mentioned vibrator can be easily fabricated by combining two or more elements having desired characteristics. combo chip.

The present invention provides the above-mentioned method for producing a vibrator on various components that require high oscillation frequencies other than the above-mentioned resonators, and high-frequency chip components can be produced. Since the workability of the vibrator of the present invention can be improved, vibrators of various structures other than those mentioned above can be fabricated. In addition, the above-mentioned vibrator can be easily fabricated into a combined chip by combining two or more elements with desired characteristics.

As described above, the simultaneous sintering of the laminated element body, which is fabricated by laminating the cover laminate in which the vibration grooves are formed in a thin laminate of controlled thickness, enables the vibrator to obtain a stable high oscillation frequency. On the electric sheet, because simultaneous sintering can reduce the number of process steps, a light and compact chip vibrator with predetermined electrical characteristics can be produced in simple steps, and because the vibrator is made of a thin piezoelectric sheet that controls the thickness by lamination And by forming internal electrodes not in contact with the external electrodes of the element between the sheets, a resonator with a desired thickness can have a high oscillation frequency that is expected to be stable.

In addition, since workability can be improved in fabricating empirical elements by simply controlling the element thickness, resonators of various structures can be fabricated, as described above, using the present invention to fabricate compact chip resonators with predetermined power characteristics can be made with less process steps and can be manufactured with a simplified process, so the productivity can be improved and the cost can be reduced.

The resonator with built-in capacitor according to the present invention can have stable oscillation characteristics, and the frequency can be easily controlled by making a single chip, wherein the capacitor is bonded with the resonator. The resonator with a built-in capacitor according to the present invention can be easily manufactured by controlling the thickness of the piezoelectric sheet formed with the internal electrodes to obtain a predetermined oscillation frequency, and by controlling the number of laminated dielectric sheets and the thickness of the dielectric sheet , and the combination of capacitors and resonators of various structures can easily control the capacitance and have stable oscillation characteristics.

In addition, the capacitor-built-in resonator according to the present invention can be fabricated as a compact single chip with various structures without additional steps.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the method and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solutions of the present invention.

Claims (11)

1, a kind of vibrator is characterized in that it comprises:

The element of one lamination has two piezoelectric sheets at least;

Internal electrode is formed between the described piezoelectric sheet of lamination; And

Outer electrode relatively is formed on the upper area and lower zone of element of this lamination;

Wherein, described internal electrode can be connected with described outer electrode by the pattern of the described internal electrode of control.

2, vibrator according to claim 1 is characterized in that each described outer electrode wherein also is formed on the side regions of element of this lamination.

3, vibrator according to claim 1 is characterized in that further comprising insulator, be arranged on the zone, up and down of element of this lamination, and vibration groove is formed between the element and this insulator of this lamination.

4, vibrator according to claim 1 is characterized in that further comprising conductive channel, passes the element of this lamination, and can not be connected with described internal electrode, and each conductive channel all is connected with each described outer electrode.

5, vibrator according to claim 3 is characterized in that further comprising three node electrodes, is arranged at not this vibration groove and forms on another table sheet of this insulator thereon, wherein has this insulator of dielectric medium function to can be used as capacitor.

6, vibrator according to claim 1 is characterized in that comprising dielectric medium at least one lamination or single dull and stereotyped pattern, and described dielectric medium engages with this piezoelectric element of lamination.

7, vibrator according to claim 3 is characterized in that wherein said insulator is formed with a burning gallery, and described burning gallery is linked up mutually with described vibration groove.

8, vibrator according to claim 1; it is characterized in that wherein a dielectric medium substrate meeting as the capacitor that node is arranged by device on the lower zone of the element of this lamination, and be used for an over cap of protection component can be on the upper area of the element of this lamination by device.

9, vibrator according to claim 3 is characterized in that the element of wherein said lamination and this insulator are coated by epoxy, with protection component.

10, a kind of manufacture method of vibrator is characterized in that it may further comprise the steps:

To have the slurry of predetermined composition, make a plurality of piezoelectricity and give birth to the embryo thin slice;

Give birth to a plurality of internal electrodes of formation on the embryo thin slice at described piezoelectricity;

Lamination is formed with at least two thin slices of described internal electrode on it;

This laminate of sintering; And

Each upper area and lower zone in this laminate form at least one outer electrode, make described outer electrode not be connected with described internal electrode.

11, a kind of manufacture method of vibrator is characterized in that it may further comprise the steps:

To have the slurry of predetermined composition, make a plurality of piezoelectricity and give birth to the embryo thin slice;

The two ends of giving birth to the embryo thin slice at described piezoelectricity form through hole;

On the living embryo thin slice of described piezoelectricity, form internal electrode, when through hole is filled with the thickener of conduction, to allow described internal electrode can not contact described through hole;

Lamination at least two described thin slices;

This laminate of sintering; And

Each upper area and lower zone in this laminate form at least one outer electrode, allowing described outer electrode not be connected with described internal electrode, and are connected with conducting paste in the described through hole.

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