CN101255859B - Subtense wimble structure micro-driver driven by titanium adnic alloy membrana as well as preparing method - Google Patents
Subtense wimble structure micro-driver driven by titanium adnic alloy membrana as well as preparing method Download PDFInfo
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Abstract
采用三元钛镍铜形状记忆合金膜驱动的弦锥结构微驱动器及其制备方法,形状记忆合金驱动薄膜采用溅射方式沉积,并应用MEMS工艺完成条形化电阻设计。微驱动器的上、下体结构采用Si刻蚀工艺制备,并实现键合焊接,其组成包括:能起到压力泵作用的上体(2)及阀体作用的下体(3),所述的上体(2)及下体(3)加工成具有压力泵作用的驱动腔(4);所述的下体(3)在加工驱动腔(4)的同时,制成具有单流向阀的阀体扩张管(5)和收缩管(6);所述的阀体扩张管和收缩管分别与进水管道(7)和出水管道(8)相对准连接,所述的弦锥结构微驱动器上装有三元TiNiCu/Si形状记忆合金驱动薄膜(1)。本发明可广泛应用于流体微量传送、集成系统冷却及微量化学分析等领域。
A chord-cone structure micro-actuator driven by a ternary titanium-nickel-copper shape memory alloy film and its preparation method. The shape memory alloy drive film is deposited by sputtering, and the MEMS process is used to complete the strip resistance design. The upper and lower body structures of the micro-driver are prepared by Si etching process, and realize bonding welding. The body (2) and the lower body (3) are processed into a drive cavity (4) with a pressure pump function; the lower body (3) is made into a valve body expansion tube with a one-way valve while processing the drive cavity (4) (5) and shrinkage tube (6); described valve body expansion tube and shrinkage tube are respectively aligned with water inlet pipe (7) and water outlet pipe (8) and connected, and ternary TiNiCu is housed on the described chord-cone structure micro-actuator /Si shape memory alloy driving thin film (1). The invention can be widely used in the fields of fluid microtransmission, integrated system cooling, microchemical analysis and the like.
Description
技术领域: Technical field:
本发明涉及一种MEMS微流体系统的执行器件,具体涉及一种采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器及其制备方法。 The invention relates to an executive device of a MEMS microfluidic system, in particular to a string-cone structure micro-drive driven by a ternary TiNiCu shape-memory alloy film and a preparation method thereof. the
背景技术: Background technique:
微驱动器作为MEMS微流体系统的执行器件,是微流体系统发展水平的重要标志。它被广泛应用在药物微量传送、燃料微量喷射、细胞分离、集成电子冷却以及微量化学分析等方面。因此微驱动器的研究一直是微机械加工系统的一个重点,同时也是微流体系统实际应用的主要限制瓶颈。由于微驱动器的流量输出是通过驱动膜的往复运动,引起微系统中泵腔的体积和压力变化而实现的,所以驱动膜的驱动力直接决定了微驱动器性能指标,即驱动膜的形变程度、响应频率对微驱动器的工作有着至关重要的影响。目前,驱动膜的驱动形式有形状记忆效应驱动、压电、静电、电磁、热气动、热流动和双金属效应等。其中,热气动、双金属效应属于低频驱动,其缺点是驱动流量较小;压电陶瓷、静电、电磁属于高频驱动,尽管产生流量较大,但是其缺点是所需工作电压相应较高,应用匹配困难,例如,在“仪器仪表学报”清华大学的杨岳、周兆英和叶雄英等1996年发表的论文“双金属热致动微型泵”,他们研制的双金属驱动微型泵驱动电压为20V,驱动频率仅为5Hz,输出流量为36μl/min。而在“Micro ElectroMechanical Systems”上Fraunhofer Institute for Solid Technology(IFT)的R.Zengerle和A.Richter等人于1992年发表论文“A micro membrane pumpwith electrostatic actuation”,报道的静电驱动微型泵,工作电压高为170V,不利于应用。形状记忆合金因其具有良好的驱动特性,近年来成为微驱动器件首选的驱动材料。例如在“Sensors and Actuators”刊物上,上海交通大学徐东等人于2001年发表的论文“Characteristics and fabrication of NiTi/Sidiaphragm micropump”,报道的二元TiNi形状记忆合金驱动微泵,输出流量为340ml/min。但二元TiNi合金相变点受成分影响极大,制备过程中成品率低;同时,马氏体与奥氏体的相变温度分别在25°、75°左右,相变迟滞较大(ΔT≤50℃),致使驱动频率较低,使应用受到限制。 As the executive device of MEMS microfluidic system, micro-actuator is an important symbol of the development level of microfluidic system. It is widely used in drug micro-delivery, fuel micro-injection, cell separation, integrated electronic cooling, and micro-chemical analysis. Therefore, the research on micro-actuators has always been a focus of micro-machining systems, and it is also the main bottleneck of the practical application of micro-fluidic systems. Since the flow output of the micro-actuator is realized by the reciprocating motion of the driving membrane, which causes the volume and pressure of the pump chamber in the microsystem to change, the driving force of the driving membrane directly determines the performance index of the micro-actuator, that is, the degree of deformation of the driving membrane, Response frequency has a crucial influence on the operation of micro-drives. At present, the driving forms of the driving membrane include shape memory effect driving, piezoelectric, electrostatic, electromagnetic, thermopneumatic, thermal flow and bimetallic effect, etc. Among them, thermopneumatic and bimetallic effects belong to low-frequency drives, and their disadvantage is that the driving flow is small; piezoelectric ceramics, electrostatics, and electromagnetics belong to high-frequency drives. Although the flow is relatively large, the disadvantage is that the required operating voltage is correspondingly high. It is difficult to apply matching. For example, in the paper "Bimetal Thermally Actuated Micropump" published by Yang Yue, Zhou Zhaoying and Ye Xiongying of Tsinghua University in "Journal of Instrument and Apparatus" in 1996, the bimetallic drive micropump they developed has a driving voltage of 20V, the driving frequency is only 5Hz, and the output flow rate is 36μl/min. In "Micro ElectroMechanical Systems", R.Zengerle and A.Richter of Fraunhofer Institute for Solid Technology (IFT) published the paper "A micro membrane pump with electrostatic actuation" in 1992. The reported electrostatically driven micropump has a high operating voltage. It is 170V, which is not conducive to the application. Shape memory alloys have become the preferred driving materials for micro-actuating devices in recent years because of their good driving characteristics. For example, in the journal "Sensors and Actuators", the paper "Characteristics and fabrication of NiTi/Sidiaphragm micropump" published by Xu Dong of Shanghai Jiaotong University and others in 2001 reported a binary TiNi shape memory alloy driven micropump with an output flow of 340ml /min. However, the phase transition point of the binary TiNi alloy is greatly affected by the composition, and the yield in the preparation process is low; at the same time, the phase transition temperatures of martensite and austenite are about 25° and 75°, respectively, and the phase transition hysteresis is relatively large (ΔT ≤50℃), resulting in a lower driving frequency, which limits the application. the
发明内容: Invention content:
本发明的目的是提供一种TiNiCu/Si形状记忆合金驱动薄膜的制备法、弦锥结构微泵的设计、制作并实现形状记忆合金薄膜对微泵的良好驱动的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器。形状记忆合金驱动薄膜采用溅射方式沉积于为驱动器的上体上,并完成条形化电阻设计以利于驱动。微驱动器的上、下体结构采用Si刻蚀工艺制备,并实现键合焊接。起到压力泵作用的上体2及阀体作用的下体3加工成具有压力泵作用的驱动腔4;下体3在加工驱动腔4的同时,制成具有单流向阀的阀体扩张管5和收缩管6;阀体扩张管和收缩管分别与进水管道7和出水管道8相对准连接,装有三元TiNiCu/Si形状记忆合金驱动薄膜1的弦锥结构微驱动器在电流的作用下即可完成流体的驱动功能。
The purpose of the present invention is to provide a preparation method of a TiNiCu/Si shape memory alloy driving film, the design and manufacture of a chordal-cone structure micropump, and the use of a ternary TiNiCu shape memory alloy film for good driving of the micropump by the shape memory alloy film Actuated chord-cone microactuators. The shape memory alloy driving thin film is deposited on the upper body of the driver by sputtering, and the strip resistance design is completed to facilitate driving. The upper and lower body structures of the micro-driver are prepared by Si etching process and bonded and welded. The upper body 2, which acts as a pressure pump, and the
上述的目的通过以下的技术方案实现: Above-mentioned purpose realizes by following technical scheme:
一种采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,其组成包括:能起到压力泵作用的上体及阀体作用的下体,所述的上体及下体加工成具有压力泵作用的驱动腔;所述的下体在加工驱动腔的同时,制成具有单流向阀的阀体扩张管和收缩管;所述的阀体扩张管和收缩管分别与进水管道和出水管道相对准连接,所述的弦锥结构微驱动器上装有三元TiNiCu/Si形状记忆合金驱动薄膜。上述的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,其还包括用来接通外部驱动电源的电极及用来产生驱动压力的TiNiCu合金薄膜电阻条。 A chord-cone structure micro-actuator driven by a ternary TiNiCu shape memory alloy film. Its composition includes: an upper body that can function as a pressure pump and a lower body that can function as a valve body. The upper body and the lower body are processed to have a pressure pump Functional drive cavity; while the lower body is processing the drive cavity, it is made into a valve body expansion tube and a contraction tube with a one-way valve; the valve body expansion tube and contraction tube are opposite to the water inlet pipe and the water outlet pipe respectively quasi-connection, the ternary TiNiCu/Si shape-memory alloy drive film is installed on the chord-cone structure micro-driver. The aforementioned chord-cone structure micro-actuator driven by a ternary TiNiCu shape memory alloy film also includes an electrode for connecting to an external drive power supply and a TiNiCu alloy film resistance strip for generating driving pressure. the
上述的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,所述的上、下体的结构采用硅(Si)的微机械加工经过硅(Si)的各向异性刻蚀工艺腐蚀后制备,并利用键合技术焊接成型。 The above-mentioned chord-cone structure micro-actuator driven by a ternary TiNiCu shape memory alloy film, the structure of the upper and lower bodies is prepared by silicon (Si) micromachining and silicon (Si) anisotropic etching process corrosion , and welded by bonding technology. the
上述的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,所述的扩张管和收缩管是利用硅Si的各向异性腐蚀工艺制作的,其弦锥形管的小口端的尺寸为20~30μm,其锥度以弦锥形管两壁弦切线夹角来标定,锥度值为10°~15°,管壁弦的弧度为直径4~5倍驱动腔直径圆所确定的弧,管壁外弦壁与驱动腔壁相切;管长1800~2000μm。 The above-mentioned chordal-conical micro-actuator driven by a ternary TiNiCu shape memory alloy film, the expansion tube and the contraction tube are made by using an anisotropic etching process of silicon Si, and the size of the small end of the chordal-conical tube is 20 ~30μm, the taper is calibrated by the angle between the tangent line of the two walls of the chord-conical tube. The outer chord wall is tangent to the drive cavity wall; the tube length is 1800-2000 μm. the
上述的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,所述的驱动腔是采用硅Si的各向异性刻蚀工艺经过腐蚀后获得,其上体驱动腔硅膜的厚度为10~12μm。 The above-mentioned chordal-cone structure micro-actuator driven by a ternary TiNiCu shape memory alloy film, the drive cavity is obtained after corrosion by using an anisotropic etching process of silicon Si, and the thickness of the silicon film of the upper body drive cavity is 10 ~12 μm. the
上述的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,所述的驱动薄膜为采用TiNi靶原子百分比为Ti 55.4%、Ni44.6%与纯铜靶同时共点溅射,在圆形硅膜驱动腔上膜生长厚度为30μm的驱动薄膜,并在750℃退火一小时,薄膜中铜含量的控制通过铜靶上的溅射电压来控制。 The above-mentioned chord-cone structure micro-actuator driven by a ternary TiNiCu shape memory alloy film, the drive film adopts a TiNi target atomic percentage of Ti 55.4%, Ni44.6% and a pure copper target to be simultaneously sputtered at the same point, in a circle A driving thin film with a thickness of 30 μm is grown on the driving cavity of a silicon film, and annealed at 750°C for one hour. The copper content in the thin film is controlled by the sputtering voltage on the copper target. the
上述的采用三元TiNiCu形状记忆合金膜驱动的弦锥结构微驱动器,对驱动薄膜进行图形化处理,在光刻胶的保护下利用腐蚀液成分为:HF的重量份数为15%、HNO3的重量份数为15%、H2O2的重量份数为2%、H2O的重量份数为68%,将薄膜刻蚀成厚为30μm、宽为70~80μm的环状条形结构,电阻条间距为20~30μm。 The above-mentioned chordal-cone structure micro-actuator driven by the ternary TiNiCu shape memory alloy film is used to pattern the driving film, and under the protection of the photoresist, the composition of the corrosive solution is: 15% by weight of HF, HNO 3 The parts by weight of H 2 O 2 are 15%, the parts by weight of H 2 O 2 are 2%, and the parts by weight of H 2 O are 68%. structure, the distance between resistor bars is 20-30 μm.
这个技术方案有以下有益效果: This technical solution has the following beneficial effects:
1.本发明由于采用了以上措施,与现有技术相比,制备工艺简单,驱动频率高、输出流量大、流量可控性强、功耗低、寿命长、体积小、成本低的特点。另外,本发明采用的微机械加工技术与半导体平面工艺技术相兼容,可实现与其他微检测和微控制元件及电路集成,适应于大批量生产,可广泛应用于微流量系统领域,特别适用于超大集成电路及大功率元件的冷却方面。 1. Due to the adoption of the above measures, the present invention has the characteristics of simple preparation process, high driving frequency, large output flow, strong flow controllability, low power consumption, long life, small volume and low cost compared with the prior art. In addition, the micromachining technology adopted in the present invention is compatible with semiconductor plane technology, and can be integrated with other micro-detection and micro-control elements and circuits, suitable for mass production, and can be widely used in the field of micro-flow systems, especially for Cooling of ultra-large integrated circuits and high-power components. the
2.本发明的TiNiCu/Si驱动薄膜驱动与二元TiNi合金等其它驱动薄膜驱动方式相比,其明显的优势就是它的驱动频率高,在脉冲驱动电流作用下可以得到较大的输出。采用磁控溅射TiNiCu驱动薄膜作为驱动材料,很好地解决了材料、硅基薄膜以及电极之间的结合力问题,在上万次往复运动后不产生剥离、开裂现象,同时与半导体平面工艺结合好,利于集成化设计及批量加工制作。 2. Compared with other driving modes such as binary TiNi alloys, the TiNiCu/Si driving thin film of the present invention has the obvious advantage of high driving frequency, and can obtain larger output under the action of pulse driving current. Magnetron sputtering TiNiCu driving film is used as the driving material, which solves the problem of the bonding force between the material, the silicon-based film and the electrode, and does not cause peeling or cracking after tens of thousands of reciprocating movements. At the same time, it is compatible with the semiconductor planar process A good combination is conducive to integrated design and batch processing. the
3.本发明具有结构和工艺简单、体积小,具有可控性强,输出流量大和功耗低等优点,可广泛用于液体微量传送、细胞分离及集成系统冷却等多方面领域。 3. The invention has the advantages of simple structure and process, small volume, strong controllability, large output flow and low power consumption, and can be widely used in various fields such as liquid microtransmission, cell separation and integrated system cooling. the
附图说明: Description of drawings:
附图1是采用TiNiCu驱动膜驱动弦锥微驱动器的侧剖面结构示意图;
Accompanying
附图2是刻蚀后的三元TiNiCu形状记忆合金驱动膜的俯视结构示意图; Accompanying drawing 2 is the top view structure schematic diagram of the ternary TiNiCu shape memory alloy driving film after etching;
附图3是附图1的A-A剖面图。
Accompanying
附图4是附图1的B-B剖面图,即弦锥结构微驱动器的液体流路俯视结构示意图。
本发明的具体实施方式: The specific embodiment of the present invention:
实施例1: Example 1:
本发明的构成包括:三元TiNiCu驱动薄膜的制备及弦锥泵的制作,三元TiNiCu/Si形状记忆合金驱动薄膜1和能起到压力泵作用的上体2及阀体作用的下体3三部分共同完成MEMS微流体系统的执行过程。其中上体2及下体3加工成具有压力泵作用的驱动腔4;下体3在加工驱动腔4的同时,制成具有单流向阀的阀体扩张管5和收缩管6;扩张管5和收缩管6分别与进水管道7、出水管道8相对准连接;作为形状记忆效应驱动的驱动膜1它采用TiNiCu驱动薄膜形式,它的构成包括用来接通外部驱动电源的电极9、11及用来产生驱动压力的TiNiCu合金薄膜电阻条10。
The composition of the present invention includes: the preparation of the ternary TiNiCu driving film and the production of the chordal pump, the ternary TiNiCu/Si shape memory
TiNiCu合金薄膜电阻条10在电极9、11的驱动电源的作用下,利用合金薄膜的形状记忆效应产生收缩与伸张,TiNiCu驱动膜产生弯曲形变,引起驱动腔4的体积和压力的变化,在扩张管5和收缩管6的配合下迫使液体在进、出水管道7、8间流动。
The TiNiCu alloy thin
该发明的工作原理是,利用TiNiCu驱动膜1的形状记忆效应,当电流加于形状记忆合金电阻条上时,产生的欧姆热量使形状记忆合金相由马氏体相向奥氏体相转变,合金形变产生驱动膜向上运动,使得具有压力泵作用的驱动腔4内的压力减小,通过微尺寸下两个扩张管5和收缩管6出现的压力损失系数的差异,扩张管5从进水管道7吸入液体;反之方波驱动电流撤销时,形状记忆合金温度降低,合金相由奥氏体相向马氏体相转变使其形状恢复,驱动膜1及上体2向下回复运动,驱动腔4内压力增大,收缩管6向出水管道8定向排出液体,因此,随着TiNiCu驱动膜1及上体2在方波电信号的作用下作周期性运动,液体就不断通过进水管道7被抽入和通过出水管道8被泵出。该发明的微驱动器的流量范围可根据不同用户的不同需求,通过对TiNiCu驱动膜1和收缩
The working principle of the invention is to use the shape memory effect of the
管及扩张管5、6的尺寸设计加以确定,当该设计尺寸确定后,该微驱动器的流量在一定的微调范围内,还可进一步通过改变施加在TiNiCu驱动膜1上的电流和频率加以调节。
The size design of the tubes and
实施例2: Example 2:
本发明的制作方法如下: The preparation method of the present invention is as follows:
TiNiCu/Si驱动薄膜的制备是通过磁控溅射工艺完成。采用TiNi靶原子百分比为Ti 55.4%、Ni44.6%与纯铜靶同时共点溅射,在圆形硅膜驱动腔上膜生长厚度为30μm的驱动薄膜,薄膜中铜含量的控制通过铜靶上的溅射电压来控制,在750℃退火一小时以获得马氏体结构相。为实现薄膜具有良好的驱动能力,制备的薄膜应具备:Ti、Ni、Cu各元素分布均匀,原子百分比为Ti 50%、Ni(44±x)%、 ,其中x≤5%;合金薄膜奥氏体与马氏体之间相转变迟滞温度ΔT≤25°,以实现薄膜具有较高的驱动频率。为实现电驱动,对制备的薄膜进行图形化处理,在光刻胶的保护下利用腐蚀液(成分为:HF(15%)/HNO3(15%)/H2O2 (2%)/H2O(68%))将薄膜刻蚀成为厚30μm、宽70-80μm的环状电阻条,电阻条间距为20-30μm。 The preparation of TiNiCu/Si driving thin film is completed by magnetron sputtering process. Using a TiNi target whose atomic percentage is Ti 55.4%, Ni44.6% and a pure copper target to be sputtered at the same time at the same time, a driving film with a thickness of 30 μm is grown on a circular silicon film driving chamber, and the copper content in the film is controlled by the copper target Controlled by the sputtering voltage, annealed at 750 °C for one hour to obtain the martensitic structure phase. In order to realize that the film has a good driving ability, the prepared film should have: the elements of Ti, Ni, and Cu are evenly distributed, and the atomic percentages are Ti 50%, Ni(44±x)%, , where x≤5%; the phase transition hysteresis temperature ΔT≤25° between austenite and martensite in the alloy film, so as to realize the high driving frequency of the film. In order to realize electrical driving, the prepared thin film is patterned, and under the protection of the photoresist, an etching solution (composition: HF (15%)/HNO 3 (15%)/H 2 O 2 (2%)/ H 2 O (68%)) etch the thin film into ring-shaped resistance strips with a thickness of 30 μm and a width of 70-80 μm, and the distance between the resistance strips is 20-30 μm.
上体2的驱动腔4的制作是在半导体[100]硅(Si)片的反面进行刻蚀,采用微机械加工工艺中的各向异性腐蚀工艺至所需的硅(Si)膜厚度10~12μm,形成圆形驱动腔4下体3的扩张管及收缩管5、6的制作同样是采用硅(Si)的微机械加工,通过腐蚀工艺形成弦锥形管形状,其弦锥形管的小口端的尺寸为20~30μm,其锥度以弦锥形管两壁弦切线夹角来标定,锥度值为10°~15°,管壁弦的弧度为直径3~4倍驱动腔直径圆所确定的弧度,管壁外弦壁与驱动腔壁相切;管长1800~2000μm。用同一工艺加工成进、出水管道7、8,其管道直径一般为1000μm。上体2和下体3之间键合采用Si-Au-Si键合技术,在下体3的正面镀一层Au金属膜,然后用光刻和化学腐蚀方法仅对需要键合的部位的金属膜予以保留,其余部分均被腐蚀掉。最后将上、下体2、3对齐,然后放到烧结炉内达到共晶温度后即可焊接键合。
The driving
实施例3: Example 3:
本发明的整体外形尺寸为12mm×8mm×3mm,其中TiNiCu/Si驱动薄膜1的
尺寸厚度为30μm、最大直径为4mm的圆环条,在TiNiCu/Si驱动薄膜1的两端连接处9、11引线电极,用于与驱动电源相接,驱动电源采用方波,工作电压5V,频率范围30~120Hz。
The overall external dimension of the present invention is 12mm * 8mm * 3mm, wherein the TiNiCu/Si drive thin film 1
A circular strip with a thickness of 30 μm and a maximum diameter of 4 mm,
当该微驱动器用在进行流体微量传送时,与硅无化学反应的液体与进水管道7相接,出水管道8接液体收集端。在驱动电源的作用下,TiNiCu/Si驱动薄膜1改变驱动腔4的体积,使得泵的内外存在压差。液体不断经进水管道7被抽入,再经出水管道8被泵出,最终达到微驱动器对液体输送和控制的目的。
When the micro-driver is used for microtransmission of fluid, the liquid which has no chemical reaction with silicon is connected to the
TiNiCu/Si驱动薄膜1的制作工艺是:
The manufacturing process of TiNiCu/Si driving
采用TiNi靶(原子百分比为Ti 55.4%、Ni44.6%)与纯铜靶同时共点溅射,在圆形硅膜驱动腔上膜生长厚度为30μm的驱动薄膜,薄膜中铜含量的控制通过铜靶上的溅射电压来控制。在750℃退火一小时。制备的薄膜应具备:Ti、Ni、Cu各元素分布均匀,原子百分比为Ti 50%、Ni(44±x)%、 ,其中x≤5%; A TiNi target (Ti 55.4%, Ni 44.6%) and a pure copper target are sputtered at the same time at the same time, and a driving film with a thickness of 30 μm is grown on a circular silicon film driving cavity, and the copper content in the film is controlled by The sputtering voltage on the copper target is controlled. Anneal at 750°C for one hour. The prepared film should have: Ti, Ni, Cu elements are evenly distributed, and the atomic percentages are Ti 50%, Ni(44±x)%, , where x≤5%;
在光刻胶的保护下利用腐蚀液(成分为:HF(15%)/HNO3(15%)/H2O2(2%)/H2O(68%))将薄膜刻蚀成为厚30μm、宽70-80μm的环状电阻条10及电阻条引脚9、11,电阻条间距为20-30μm。在掩模保护条件下电阻条引脚上真空蒸发制备铝膜后连接外引线。 Under the protection of photoresist , the film is etched into thick Ring resistance strips 10 with a width of 30 μm and a width of 70-80 μm and pins 9 and 11 of the resistance strips, the distance between the resistance strips is 20-30 μm. Under the condition of mask protection, the aluminum film is prepared by vacuum evaporation on the pin of the resistance strip, and then the outer lead is connected.
上体2的驱动腔4及下体3结构的制作是采用硅的各向异性腐蚀工艺腐蚀制成。具有相同驱动腔结构的上体[1]与下体[2]之间的键合采用Si-Au-Si键合,在下体2正面镀Au,膜厚为1μm,然后用光刻和化学腐蚀方法对仅需键合区域的金属膜予以保留,其余均被腐蚀掉。最后将上、下体1、2对齐,放在烧结炉内在650℃温度后即可键合。
The driving
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN1542277A (en) * | 2003-06-04 | 2004-11-03 | 中国科学院长春光学精密机械与物理研 | Pneumatic microfluidic transport method and its device |
WO2004094821A2 (en) * | 2003-04-22 | 2004-11-04 | The Regents Of The University Of California | Micromembrane shape memory alloy pump |
-
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1054119A (en) * | 1989-12-27 | 1991-08-28 | 精工爱普生株式会社 | Microelectrochemical pump and manufacturing method thereof |
WO2004094821A2 (en) * | 2003-04-22 | 2004-11-04 | The Regents Of The University Of California | Micromembrane shape memory alloy pump |
CN1542277A (en) * | 2003-06-04 | 2004-11-03 | 中国科学院长春光学精密机械与物理研 | Pneumatic microfluidic transport method and its device |
Non-Patent Citations (2)
Title |
---|
丁桂甫,徐东,赵小林.镍钛合金形状记忆薄膜的化学刻蚀.《微细加工技术》.1999,(第3期), * |
刘玲,谢海波,傅新.NiTi/Si薄膜驱动微型无阀泵的系统研究.《机械科学与技术》.2003,第22卷(第6期), * |
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