CN101241869B - Chip testing and sorting machine - Google Patents

Abstract

A chip test classifier comprises a feeding box, a receiving box and an empty box which are arranged at the front end of a machine platform, wherein the feeding box can be used for bearing a chip to be tested for taking materials, the receiving box can be used for bearing the tested chip for receiving materials, the empty box can be used for receiving the empty material disc at the position of the feeding box or supplementing the empty material disc required by the position of the receiving box, a plurality of test devices with a tester, a probe card and a positioning jig are arranged at the rear end of the machine platform and used for executing chip test operation, a transfer device is transferred among the feeding box, the receiving box and the test devices and used for transferring the chip to be tested and tested, and automatic transfer and supplementing of the empty material disc among the feeding box, the receiving box and the empty box; therefore, by utilizing the time sequence collocation action of each device, the test operation can be executed after each chip is cut, and the chips are immediately and rapidly classified and collected according to the test result, thereby ensuring the test quality, and effectively improving the operation convenience and the use benefit of the productivity.

Description

Chip Test Sorter

technical field

The invention relates to a chip testing and sorting machine capable of consistently and automatically performing chip testing and sorting operations, thereby effectively improving operation convenience and testing productivity.

Background technique

In the general semiconductor manufacturing process, a large number of chips are planned on the wafer. After the wafer is manufactured, in order to ensure the yield rate of the wafer and avoid the cost waste of the subsequent packaging process, before performing the chip cutting operation, Wafer needle testing will be carried out to test whether the electrical properties of each chip on the wafer are damaged. The wafer needle testing is to place the entire wafer on the fixture of a probe card tester. The probe card testing machine is provided with a probe card connected to the tester above the jig, the probe card has a plurality of probes, the probes of the probe card are used to detect the divided chips on the wafer, and the test The data is sent to the tester, and the tester judges whether the tested chip is a good product or a defective product. If it is a defective product, it will mark the chip or the database to filter out the defective chips first. After the wafer test operation is completed, Then put the tested wafer into the wafer box and transfer it to the next wafer cutting workstation to cut the wafer into multiple chips. Picking and storing on each tray for temporary storage or preparation for packaging operations; however, the above-mentioned operation process does not carry out separate tests for each single chip after cutting. When the chip is damaged due to a little carelessness in the process, the operation process will not be able to reliably sort out the defective products, which will cause defects in the test operation and reduce the test quality.

Therefore, under the trend of comprehensive automation and test quality improvement, how to design a method that can perform individual tests on each single chip after the chip cutting operation is performed, and immediately classify the chips according to the test results. The consistent automatic execution of chip testing and classification to improve operation convenience and production capacity is the target of the industry's dedication to research and development.

Contents of the invention

The first object of the present invention is to provide a chip testing and sorting machine, including a feeding box, a receiving box, an empty box, a plurality of testing devices with testers, probe cards and positioning fixtures, and a pick-and-place device The transfer device can use the timing of each device to perform the test operation on the diced chips, and then can reliably sort out the defective products after dicing, so as to greatly improve the test quality.

The second object of the present invention is that after the automatic testing of the chips, the chip testing and sorting machine can quickly sort and store the chips according to the test results, so as to achieve consistent automatic testing and sorting, and improve the convenience of operation and the use efficiency of production efficiency.

In order to achieve the above object, the present invention provides a chip test sorter, comprising:

Supply box: it holds the chips to be tested;

Receiving box: it is to receive and accept the chips that have been tested;

Test device: It is equipped with a tester and a probe card, and a stage mechanism is provided at the position corresponding to the probe card. The stage mechanism is placed on the slide rail by the stage frame and driven by the drive source The displacement in the direction is provided on the platform with a pedestal, and the pedestal is equipped with a jig for supporting the chip. The jig of the test device is driven by a driving source to lift in the Z direction, so that the The chip on the fixture is in contact with the probe card;

Transfer device: it is equipped with a pick-and-place device for transferring the chips to be tested and tested;

Central processing unit: controls and integrates the actions of various devices.

Description of drawings

The figure is a configuration diagram of each device of the present invention;

The figure is a schematic diagram of the testing device of the present invention;

The figure is a schematic diagram 1 of the present invention performing chip testing and sorting operations;

The figure is the use schematic diagram 2 of the present invention to perform chip testing and sorting operations;

The figure is a schematic diagram 3 of the present invention performing chip testing and sorting operations;

The figure is a schematic diagram 4 of the present invention performing chip testing and sorting operations;

The figure is the use schematic diagram five of the present invention to perform chip testing and sorting operations;

The figure is a schematic diagram 6 of the present invention to perform chip testing and sorting operations;

The figure is a schematic diagram 7 of the present invention for performing chip testing and sorting operations;

The figure is the eighth schematic diagram of the use of the present invention to perform chip testing and classification operations;

The figure is a schematic diagram nine of the present invention performing chip testing and sorting operations;

Figure 10 is a schematic diagram of the present invention for performing chip testing and sorting operations.

Explanation of reference signs

〔this invention〕

Supply box 10; receiving box 20a, 20b, 20c, 20d; empty box 30; testing device 40, 40a, 40b, 40c, 40d; probe card 41, 41a; probe 411, 411a; tester 42, 42a Carrier mechanism 43,43a; Carrier 431,431a; Positioning jig 432,432a; Vacuum nozzle 433,433a; Placement device 51; second group pick and place device 52; third pick and place device 53; chips 61, 62, 63, 64, 65, 66, 67, 68.

Detailed ways

In order to further understand the present invention, now give a preferred embodiment and cooperate with the drawings, as follows in detail:

Please refer to Fig. 1, shown in Fig. 2, described chip test classifier is to be provided with feeding box 10, receiving box 20a, 20b, 20c, 20d and empty box 30 at the front end of machine table, wherein, described feeding Cassette 10 accommodates at least one tray containing chips to be tested, and can drive the tray up and down for retrieving materials. The magazines 20a, 20b, 20c, and 20d are used to store chips of different grades that have been tested. The empty magazine 30 can receive the empty trays that have been used up by the supply magazine 10, and stack the empty trays up and down. The empty trays can also be moved up and down as needed, so as to be supplemented in the receiving boxes 20a, 20b, 20c, and 20d for receiving materials. In addition, a plurality of testing devices 40 are provided at the rear end of the machine, each The test device 40 is to set up a probe card 41 with a frame with through holes, and the probe card 41 has a plurality of probes 411, and makes a plurality of probes to be positioned at the through holes of the frame, and the probe card 41 and connected to the tester 42 located at the rear, the tester 42 is used to distinguish good chips or defective chips, and then transmits the test results to the central processing unit (not shown) of the test sorter, which is processed by the central processing unit The device controls each device to cooperate and operate. In addition, a stage mechanism 43 is provided on the machine platform below the probe card 41. The stage mechanism 43 is to mount the stage 431 on a slide rail 435. The stage 431 and It can be driven by the driving source for displacement in the Y direction. A pedestal 436 that can be used for X-Y direction and θ angle fine-tuning is installed on the platform 431, and a pedestal 436 that can be driven by the driving source can be used for Z-direction lifting. The jig 432, and then use the pedestal 436 to fine-tune the alignment, the jig 432 can be moved horizontally in the Y direction to the position corresponding to the lower part of the probe card 41 through the drive of the carrier 431, and then driven up by the driving source to contact the probe The probe 411 of the card 41, and the top surface of the fixture 432 are provided with a vacuum suction nozzle 433 and a pusher 434 that can be driven and displaced by a driving source. The pusher 434 can slightly push the chip when the vacuum suction nozzle 433 absorbs the chip Displacement to facilitate the alignment test, a transfer mechanism 50 is transferred between the supply box 10, the receiving box 20a, 20b, 20c, 20d, the empty box 30 and the test device 40, which has a first X-Y-Z direction displacement One group of pick-and-place device 51, the second group of pick-and-place device 52 and the third pick-and-place device 53, wherein, the first group of pick-and-place device 51 is used to pick and place the chip to be tested, and the second group of pick-and-place device 52 is used to pick and place the chips that have been tested, and the third pick-and-place device 53 is used to transfer the empty tray of the supply magazine 10 to the empty tray 30 for storage, or to place the empty tray at the empty tray 30 Transfer and supplement to each receiving box 20a, 20b, 20c, 20d for receiving.

Please refer to FIG. 3 , a plurality of chips cut out from the wafer can be placed in a tray and placed in the supply box 10 for picking, and the transfer mechanism 50 can drive the first set of pick-and-place devices 51 is moved to the top of the supply box 10, and the chips to be tested 61, 62, 63, 64 in the tray are taken out, so as to be transferred to the next device.

Please refer to Fig. 4, shown in Fig. 5, after the first group pick-and-place device 51 of described transfer device 50 takes out several chips 61, 62, 63, 64 to be tested, each chip 61 to be tested, 62, 63, 64 are transferred to the refueling places of each test device 40a, 40b, 40c, 40d, taking the test device 40a as an example, the first group of pick-and-place devices 51 of the transfer device 50 is to place the chip to be tested 61 is transferred to the refueling place of the test device 40a, and the test device 40a also drives the stage 431a to carry the jig 432a to be positioned at the refueling place, so that the first group of pick-and-place devices 51 of the transfer device 50 will place the chip 61 to be tested. Place it on the fixture 432a, and use the vacuum suction nozzle 433a to absorb the chip 61 to be tested on the fixture 432a. In order to make the chip 61 to be tested accurately align with the probe 411a on the probe card 41a, it is a controllable pusher 434a pushes the displacement of the chip 61 to be tested, so that the chip 61 to be tested can be positioned for testing.

6 and 7, after the positioning of the chip 61 to be tested on the jig 432a is completed, the stage mechanism 43a immediately carries the jig 432a and the chip 61 to be tested to the probe of the probe card 41a. Below the pin 411a, the jig 432a is driven by the driving source to move up in the Z direction, and penetrates through the through hole of the frame, so that the chip 61 to be tested contacts the probe 411a of the probe card 41a to utilize The probe 411a makes contact with the chip 61 to be tested to perform the test operation of the chip 61. After the controller 42a determines whether the chip 61 to be tested is a good product or a defective product, the controller 42a transmits the test result to the test sorter The central processing unit (not shown in the figure) makes the central processing unit control each device to cooperate to act.

Please refer to FIG. 8 , when the test devices 40a, 40b, 40c, and 40d are respectively performing the test operations of the chips under test 61, 62, 63, and 64, the transfer device 50 can drive the first group of pick-and-place devices 51 Move to the supply magazine 10, and take out the next group of chips 65, 66, 67, 68 to be tested for testing.

Please refer to Fig. 9, Fig. 10, and Fig. 11. After the test operation is completed, the jig 432a is driven by the driving source to make a downward displacement in the Z direction, so that the tested chip 61 is separated from the probe card 41a and placed on the stage. The mechanism 43a also drives the jig 432a and the tested chip 61 to reversely move to the refueling position, and makes the vacuum suction nozzle 433a release the tested chip 61 for removal, and the transfer device 50 drives the first group of pick-and-place The device 51 and the second group of pick-and-place devices 52 are displaced to the test device 40a, and the second group of pick-and-place devices 52 are taken out of the tested chips 61 on the jig 432a. When the second group of pick-and-place devices 52 take out the tested chips After 61, control the first group of pick-and-place devices 51 to place the next chip 65 to be tested on the jig 432a of the test device 40a, so that the test operations can be performed sequentially.

Referring to Fig. 12, the transfer device 50 sequentially takes out the tested chips 61, 62, 63, 64 at each testing device 40a, 40b, 40c, 40d, and places the tested chips 65, 66, 67, 68 are placed in each test device 40a, 40b, 40c, 40d in order to execute the test operation, the central processing unit of the test sorter immediately according to the test results of each test device 40a, 40b, 40c, 40d, The second group of pick-and-place devices 52 that control the transfer device 50 respectively place the tested chips 61, 62, 63, and 64 in the trays of each receiving box 20a, 20b, 20c, and 20d for storage, such as the chip 61 If it is a good product, it is placed in the good product receiving box 20a, and if it is a defective product, it is placed in the defective product receiving box, and it can be classified and stored in real time, so as to achieve the use efficiency of consistent automatic testing and classified storage.

According to this, the present invention can use the timing of each mechanism to coordinate actions. After the chip test is completed, it can be quickly classified and stored according to the test results, and the consistent automatic test and classification can effectively improve the operation convenience and production capacity. A highly practical and progressive design.

Claims (7)

1. A chip test sorter, characterized in that, comprising: Supply box: it holds the chips to be tested; Receiving box: it is to receive and accept the chips that have been tested; Test device: It is equipped with a tester and a probe card, and a stage mechanism is provided at the position corresponding to the probe card. The stage mechanism is placed on the slide rail by the stage frame and driven by the drive source The displacement in the direction is provided on the platform with a pedestal, and the pedestal is equipped with a jig for supporting the chip. The jig of the test device is driven by a driving source to lift in the Z direction, so that the The chip on the fixture is in contact with the probe card; Transfer device: it is equipped with a pick-and-place device for transferring the chips to be tested and tested; Central processing unit: controls and integrates the actions of various devices. 2. The chip testing and sorting machine according to claim 1, characterized in that: said receiving box is subdivided into different levels of receiving boxes for storing and testing different levels of chips. 3. The chip testing and sorting machine according to claim 1, characterized in that: the pedestal of the stage mechanism can be used for fine-tuning alignment in X-Y direction and θ angle. 4. The chip testing and sorting machine according to claim 1, characterized in that: the jig of the testing device is provided with a vacuum suction nozzle and a moving piece for absorbing and positioning the chips. 5. The chip testing and sorting machine according to claim 1, characterized in that: the transfer device is provided with a first set of pick-and-place devices for picking and placing the chips to be tested and a second set of pick-and-place devices for picking and placing the tested chips. Group picker. 6. The chip testing and sorting machine according to claim 1, characterized in that: said transfer device is provided with a third pick-and-place device for transferring empty trays. 7. The chip testing and sorting machine according to claim 1, further comprising an empty box for storing empty trays.

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