[go: up one dir, main page]

CN101231546A - 散热装置组合 - Google Patents

散热装置组合 Download PDF

Info

Publication number
CN101231546A
CN101231546A CNA2007102001047A CN200710200104A CN101231546A CN 101231546 A CN101231546 A CN 101231546A CN A2007102001047 A CNA2007102001047 A CN A2007102001047A CN 200710200104 A CN200710200104 A CN 200710200104A CN 101231546 A CN101231546 A CN 101231546A
Authority
CN
China
Prior art keywords
heat abstractor
radiating fin
fin group
abstractor combination
heating radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007102001047A
Other languages
English (en)
Inventor
叶振兴
孙珂
陈明科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNA2007102001047A priority Critical patent/CN101231546A/zh
Priority to US11/857,452 priority patent/US20080174952A1/en
Publication of CN101231546A publication Critical patent/CN101231546A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置组合，包括一散热器及一装设于一电脑主板一侧的扣具，所述散热器卡合于所述扣具并可相对于所述扣具转动。本发明散热装置组合使得中央处理器散热装置的出风口可根据北桥的位置来改变方向，从而有效地帮助北桥散热。

Description

散热装置组合
技术领域
本发明涉及一种散热装置组合，尤指一种电脑主板的中央处理器散热装置组合。
背景技术
随着电脑的日益普及和其性能的不断提高，散热问题也越来越受到人们的重视。目前电脑主板上中央处理器的散热装置的各个组成部分之间及中央处理器的相对位置和形态通常都是固定的，这使得散热装置的出风口方向是单一固定的；另，由于不同主板上的中央处理器和北桥的相对位置是不尽相同的，这就使得中央处理器散热装置的出风口的风流不能保证有效的流经北桥，从而对北桥的散热不利。
发明内容
鉴于以上内容，有必要提供一种能够改变散热器出风口方向的中央处理器的散热装置组合。
一种散热装置组合，包括一散热器及一装设于一电脑主板一侧的扣具，所述散热器卡合于所述扣具并可相对于所述扣具转动
本发明散热装置组合，其散热器及扣具可相对转动，使得散热器的出风口可根据北桥的位置来改变方向，从而有效地帮助北桥散热。同时，对于主板的设计人员来讲，本发明也为北桥的布线提供了更多的选择。
附图说明
下面参考附图结合具体实施方式对本发明作进一步的说明。
图1为本发明散热装置组合较佳实施方式的立体分解图。
图2为本发明散热装置组合较佳实施方式的散热器的另一方向立体图。
图3为本发明散热装置组合较佳实施方式于一电脑主板的安装过程示意图。
图4为本发明散热装置组合较佳实施方式的使用状态图。
图5为本发明散热装置组合较佳实施方式的另一使用状态图。
具体实施方式
请参考图1及图3，本发明散热装置组合1的较佳实施方式包括一风扇装置50、一散热器10、一扣具40及一背板60，用于为一电脑主板2散热。
风扇装置50包括一风扇体52及一装设风扇体52的安装板54，风扇体52四个角分别设有安装孔57，安装板54的两端分别向下延伸出若干卡钩56，安装板54中心对应风扇体52的出风口(图未示)设一孔，安装板54四个角分别对应风扇体52的安装孔57设有螺孔59。风扇体52和安装板54通过装入对应的安装孔57和螺孔59的螺钉58连接在一起。
请结合图2，散热器10包括一底座20及一连接于底座20上的散热鳍片组30。底座20包括一用于承载连接所述散热鳍片组30的方板形承载部22和一与承载部22一体的呈扁圆柱体状的扣合部24，承载部22与扣合部24之间形成一圆环形凹槽26。散热鳍片组30概呈长方体状，其包括平行排列并垂直于底座20的承载部22的若干散热鳍片，使得由散热鳍片组30内的风流只能由该等散热鳍片的两末端流出，从而于散热鳍片组30的周侧面上形成两个出风口32和38，出风口32和38于靠近散热器10顶面处各形成一卡槽34。所述散热器10装插若干呈“C”形的热管36，其中，热管36的上段装插在散热鳍片组30内，所述热管36的下段装插在散热鳍片组30与底座20之间，以此来提高散热鳍片组30与底座20的热交换效率。
扣具40包括一圆形扣环42及于扣环42外侧对称延伸出的四个凸舌44，扣环42为具有微小弹性形变能力的材料如树脂、硬塑料等所制成，扣环42可转动地卡扣入散热器10底座20的凹槽26内，每个凸舌44上设有一孔46，每一孔46内装设有一螺钉48，螺钉48由上至下套设有弹簧49和卡环47，弹簧49位于凸舌44上方，卡环47位于凸舌44下方而使螺钉不脱离凸舌44。
背板60为“十”字形，其中心设一圆孔并在四个末端处各设有一螺孔62。
请继续参考图3，装配时，风扇装置50的安装板54上的卡钩56对应卡扣于散热器10的散热鳍片组30的卡槽34内，将扣具40的扣环42卡扣入散热器10底座20的凹槽26内，这里，扣环42与凹槽26之间的间隙使得扣环42可相对于凹槽26转动。将上述过程装配组成的部分置于电脑主板2的中央处理器上方，将背板60对应置于电脑主板2的中央处理器下方，并将背板60通过螺钉48与散热装置组合1的扣具40连接。
如图4和图5所示，在使用散热装置组合1时，当螺钉48未旋紧时，散热器10可相对于所述扣具40转动，由于从散热器10的出风口32和38流出的风流不是发散的，而是有指向性的，于是可根据电脑主板2上面北桥4a或4b的不同位置来转动散热器10，使散热器10上的出风口32或38指向北桥4a或4b，帮助北桥4a或4b充分散热。然后将螺钉48旋紧，散热器10的底座20的扣合部24被扣具40及电脑主板2压紧，散热器10被紧固于电脑主板2。
另外，为了更好地集中从散热器10流出的风流，可将其出风口32和38中的一个封闭，另一个为北桥4a或4b提供风流，从而使北桥4a或4b获得更好的散热效果。

Claims (10)

1.一种散热装置组合，包括一散热器及一装设于一电脑主板一侧的扣具，其特征在于：所述散热器卡合于所述扣具并可相对于所述扣具转动。
2.如权利要求1所述的散热装置组合，其特征在于：所述散热器包括一底座及一连接于所述底座上的散热鳍片组，所述底座包括一用于承载所述散热鳍片组的承载部和一呈扁圆柱体状的扣合部，所述承载部与所述扣合部之间形成一圆环形凹槽，所述扣具包括一圆形扣环，所述扣环可转动地卡扣入所述凹槽内。
3.如权利要求2所述的散热装置组合，其特征在于：所述散热鳍片组上形成至少一出风口。
4.如权利要求3所述的散热装置组合，其特征在于：所述散热鳍片组呈长方体状，其包括平行排列的若干散热鳍片。
5.如权利要求4所述的散热装置组合，其特征在于：所述散热鳍片组沿所述散热鳍片的方向于其两端各形成一出风口。
6.如权利要求5所述的散热装置组合，其特征在于：所述扣具于其扣环外侧延伸出若干凸舌，每个凸舌上设有一孔，所述孔内装设有一螺钉，所述螺钉上套设有一弹簧，所述弹簧顶靠于所述凸舌，所述电脑主板的另一侧设有一背板，所述背板对应所述若干螺钉设有若干螺孔，所述若干螺钉穿过所述电脑主板螺锁于对应螺孔。
7.如权利要求5所述的散热装置组合，其特征在于：所述散热装置组合进一步包括一装设于所述散热器散热鳍片组顶端的风扇装置。
8.如权利要求7所述的散热装置组合，其特征在于：所述散热器的散热鳍片组的两个出风口于靠近顶面处各形成一卡槽，所述风扇装置包括一风扇体及一装设所述风扇体的安装板，所述安装板的两端分别向下延伸出若干卡钩，所述若干卡钩对应卡扣于所述散热鳍片组的卡槽内。
9.如权利要求8所述的散热装置组合，其特征在于：所述散热器还包括若干呈“C”形的热管，每一热管的上段装插在所述散热鳍片组内，下段装插在所述散热鳍片组与所述底座之间。
10.如权利要求9所述的散热装置组合，其特征在于：所述散热器的底座的承载部和扣合部是一体的，所述承载部呈方板形。
CNA2007102001047A 2007-01-24 2007-01-24 散热装置组合 Pending CN101231546A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNA2007102001047A CN101231546A (zh) 2007-01-24 2007-01-24 散热装置组合
US11/857,452 US20080174952A1 (en) 2007-01-24 2007-09-19 Heat dissipation assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007102001047A CN101231546A (zh) 2007-01-24 2007-01-24 散热装置组合

Publications (1)

Publication Number Publication Date
CN101231546A true CN101231546A (zh) 2008-07-30

Family

ID=39640973

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007102001047A Pending CN101231546A (zh) 2007-01-24 2007-01-24 散热装置组合

Country Status (2)

Country Link
US (1) US20080174952A1 (zh)
CN (1) CN101231546A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114710945A (zh) * 2022-06-07 2022-07-05 广东电网有限责任公司广州供电局 一种配电变压器绕组加热头的快速散热装置及方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101668406B (zh) * 2008-09-01 2011-11-09 鸿富锦精密工业（深圳）有限公司 电子装置及其支撑件
CN101776942B (zh) * 2009-01-13 2013-04-24 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN102843894B (zh) * 2011-06-22 2016-12-21 富瑞精密组件（昆山）有限公司 散热装置及其风扇固定架
CN102955535A (zh) * 2011-08-22 2013-03-06 鸿富锦精密工业(武汉)有限公司 支撑装置
US9507391B2 (en) 2011-11-28 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat sink with orientable fins
US9429370B1 (en) * 2014-05-27 2016-08-30 Unigen Corporation Heat sink with flat heat pipe
US9933693B2 (en) * 2016-01-20 2018-04-03 Seiko Epson Corporation Optical device, light source device, and projector
US10667378B1 (en) * 2019-01-14 2020-05-26 Eagle Technology, Llc Electronic assemblies having embedded passive heat pipes and associated method
US11071195B1 (en) 2020-06-05 2021-07-20 Google Llc Heatsink and stiffener mount with integrated alignment
TWI831065B (zh) * 2020-10-27 2024-02-01 英屬開曼群島商鴻騰精密科技股份有限公司 電連接器
US20230004200A1 (en) * 2021-07-01 2023-01-05 Portwell Inc. Board device of single board computer
US11991864B2 (en) 2022-03-16 2024-05-21 Google Llc Load vectoring heat sink

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397919A (en) * 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US6698499B1 (en) * 1996-02-01 2004-03-02 Agilent Technologies, Inc. Cooling device and method
US5864464A (en) * 1997-06-09 1999-01-26 Lin; Alex Heat sink for integrated circuit
TW477437U (en) * 1998-06-23 2002-02-21 Foxconn Prec Components Co Ltd Assembled-type CPU heat sink
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6075699A (en) * 1999-01-29 2000-06-13 Chip Coolers, Inc. Heat sink assembly with snap-in legs
US6293331B1 (en) * 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US6386274B1 (en) * 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6640882B2 (en) * 2001-07-31 2003-11-04 Agilent Technologies, Inc. Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan
US6944023B2 (en) * 2002-11-15 2005-09-13 Celestica International Inc. System and method for mounting a heat sink
US6828673B2 (en) * 2003-02-18 2004-12-07 John Ficorilli Heat sink assembly
TWM246683U (en) * 2003-08-13 2004-10-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
TWM246687U (en) * 2003-10-28 2004-10-11 Hon Hai Prec Ind Co Ltd Heat dissipation device
TWM246991U (en) * 2003-11-21 2004-10-11 Hon Hai Prec Ind Co Ltd Mounting assembly for heat sink
US7130192B2 (en) * 2004-04-27 2006-10-31 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
CN2799931Y (zh) * 2004-12-03 2006-07-26 鸿富锦精密工业（深圳）有限公司 风扇固定装置
US7362578B2 (en) * 2005-08-16 2008-04-22 Tyco Electronics Corporation Heat sink fastening system
US7283368B2 (en) * 2005-10-21 2007-10-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating assembly
US7289322B2 (en) * 2005-10-24 2007-10-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20080066898A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114710945A (zh) * 2022-06-07 2022-07-05 广东电网有限责任公司广州供电局 一种配电变压器绕组加热头的快速散热装置及方法

Also Published As

Publication number Publication date
US20080174952A1 (en) 2008-07-24

Similar Documents

Publication Publication Date Title
CN101231546A (zh) 散热装置组合
US9379039B2 (en) Heat transfer for electronic equipment
US8514574B2 (en) Heat dissipating apparatus
US7701708B2 (en) Heat dissipation assembly
US7426112B2 (en) Heat dissipating module
US7474527B2 (en) Desktop personal computer and thermal module thereof
US20120106064A1 (en) Computer system
CN102056461A (zh) 散热装置
US9179576B2 (en) Computer power supply
US8902580B2 (en) Heat dissipation device with fastener
US20110017430A1 (en) Thermal module
US20040032718A1 (en) Heatsink with improved heat dissipation capability
TWM246685U (en) Heat sink assembly
US20100246123A1 (en) Cooling device
CN102056454A (zh) 具防呆结构的散热装置及采用该散热装置的电子装置
US20110090647A1 (en) Printed circuit board assembly
US20090120613A1 (en) Heat sink
US9320176B2 (en) Heat dissipation system and rack-mount server using the same
CN201230436Y (zh) 散热装置组合
CN102843894B (zh) 散热装置及其风扇固定架
US20120113587A1 (en) Dual cpu and heat dissipating structure thereof
CN100470777C (zh) 散热装置
CN210119749U (zh) 散热装置及笔记本电脑
TW202312589A (zh) 介面卡組件及使用其之電路板模組
CN102591432A (zh) 电子装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20080730