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CN101221916B - Wire punching machine - Google Patents

Wire punching machine Download PDF

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Publication number
CN101221916B
CN101221916B CN200710003713A CN200710003713A CN101221916B CN 101221916 B CN101221916 B CN 101221916B CN 200710003713 A CN200710003713 A CN 200710003713A CN 200710003713 A CN200710003713 A CN 200710003713A CN 101221916 B CN101221916 B CN 101221916B
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CN
China
Prior art keywords
pressing plate
hole
bonding machine
wire bonding
extension block
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Application number
CN200710003713A
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Chinese (zh)
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CN101221916A (en
Inventor
洪志明
陈文福
陈岳熙
刘振钦
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Advanced Semiconductor Engineering Inc
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Advanced Semiconductor Engineering Inc
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Priority to CN200710003713A priority Critical patent/CN101221916B/en
Publication of CN101221916A publication Critical patent/CN101221916A/en
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Publication of CN101221916B publication Critical patent/CN101221916B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

The invention discloses a wire bonding machine table which is suitable for bonding a chip wire on a loader to a plurality of pads on the loader. The routing machine table comprises a base, a hot plate, a pressing plate, a pair of fixing seats, a pair of extension blocks and a welding needle, wherein the hot plate is positioned on the base; the pressure plate is arranged above the hot plate in a mode of moving up and down so as to press a carrier on the hot plate; the pair of fixing seats is arranged on two opposite sides of the pressure plate, wherein the length of the pressure plate is not matched with the distance between the two fixing seats; the two extension blocks are bridged between the fixed seat and the pressure plate; and the welding pins are positioned above the pressure plate and used for forming a plurality of routing wires which are electrically connected with the chip and the connecting pads of the loader.

Description

Wire bonding machine table
Technical field
The present invention relates to a kind of wire bonding machine table, and particularly relevant in a kind of wire bonding machine table in order to connect the prolongation piece of pressing plate and holder.
Background technology
The chip that completes via manufacture of semiconductor needs usually to make chip and its carrier constitute electric connection via routing joint (Wire bonding) or alternate manner that chip could see through the routing lead and electrically connect with the external world like this.
Fig. 1 is a kind of schematic diagram of existing wire bonding machine table.Please refer to wire bonding machine table shown in Figure 1, traditional 100 mainly comprises: pedestal 110, hot plate 120, pressing plate 130, a pair of holder 140, a pair of adapter 150, and a capillary 160.
The hot plate 120 that is positioned on the pedestal 110 is in order to heating wires frame and gold thread, to finish the joint of soldered ball.Pressing plate 130 is to be disposed on the hot plate 120 in mode moving up and down, and it can grip a carrier 200 that is positioned on the hot plate 120 by pressing plate 130 and hot plate 120.In addition, pressing plate 130 has an opening 132, to expose the connection pad (not shown) on the carrier 200 and the chip 210 of the side of being fixed thereon.Holder 140 is to be disposed at the relative both sides of pressing plate 130.Adapter 150 is to be arranged between pressing plate 130 and the holder 140; Be provided with a trip in the adapter 150, make the outer rim of pressing plate 130 see through this trip and be fixed in the adapter 150; Be to be fixed together between adapter 150 and the holder 140 by the mode of three screws 152 (only illustrating a screw among the figure) with locking.Capillary 160 is the tops that are positioned at pressing plate 130, in order to form the many routing leads 220 that electrically connect chip 210 and carrier 200.
Because the size of the pairing operating area of wire bonding machine table of different type of machines is all inequality, therefore, the length of the employed pressing plate of wire bonding machine table of every kind of type is also all different.If but the type of wire bonding machine table when upgrading, because the cause that the working region varies in size, original pressing plate can't be repeated to use, and will cause a kind of waste like this.
In addition, owing to be to be bonded together between adapter 150 and the holder 140 by the mode of three screws 152 with locking, therefore adapter 150 has the problem of horizontal direction or vertical direction displacement easily, make at the pressure force of the vertical direction of pressing plate 130 inhomogeneous, thereby have influence on the yield of line connection process.
Moreover, thisly utilize three screws 152 with the mode that adapter 150 and holder 140 lock together, can make that not only the number of required part is more, also can prolong the time of assembling simultaneously.
Summary of the invention
Main purpose of the present invention is to provide a kind of wire bonding machine table, its pressing plate is to be fixed on the holder through prolonging piece, like this can be so that the pressing plate of same size can be arranged in pairs or groups the prolongation piece of different size, thereby can be applied on the wire bonding machine table of different type of machines.
For reaching above-mentioned purpose, the present invention adopts following technical scheme: a kind of wire bonding machine table, it is applicable to and is engaged to several connection pads on this carrier with being positioned at a chip routing on the carrier, this wire bonding machine table includes a pedestal, a hot plate that is positioned on the described pedestal, a pressing plate that is disposed at described hot plate top in mode moving up and down, the a pair of holder that is disposed at the relative both sides of described pressing plate, the a pair of prolongation piece that is used for bridging between described holder and the described pressing plate, and capillary that is positioned at described pressing plate top, wherein said pressing plate is to be used for carrier that is positioned on the described hot plate of pressing, the length of described pressing plate is the distance that does not match between described two holders, described pressing plate has an opening, to expose chip and the described connection pad that is positioned on the described carrier; And described capillary is to be used for forming the routing lead that most bars electrically connect these connection pads of described chip and described carrier.
Above-mentioned prolongation piece has the section of a Z type, and the one end has a through hole, sealed described prolongation piece and described pressing plate for a screw passes described through hole, and its other end is to utilize the mode of trip to be fixed on the described holder.
The two ends of above-mentioned prolongation piece can also be to have one first through hole and one second through hole respectively, sealed described prolongation piece and described pressing plate for one first screw passes described first through hole, and supply one second screw to pass described second through hole and sealed described prolongation piece and described holder.
Above-mentioned prolongation piece can also be the section with a Y type, it has a clamping part and reaches and a connected fixed part, have a groove in the described clamping part, with a side of clamping and fixing described pressing plate, and described fixed part is to be fixed on the described holder.Described clamping part has a through hole, sealed described prolongation piece and described pressing plate for a screw passes described through hole, and described fixed part then is to utilize the mode of trip to be fixed on the described holder.
The clamping part of above-mentioned prolongation piece and fixed part can also be to have one first through hole and one second through hole respectively, sealed described prolongation piece and described pressing plate for one first screw passes described first through hole, and supply one second screw to pass described second through hole and sealed described prolongation piece and described holder.
Compared to prior art, the pressing plate of wire bonding machine table of the present invention is to be fixed on the holder by prolonging piece, therefore, the pressing plate of same size can arrange in pairs or groups different size the prolongation piece and be applied on the wire bonding machine table of different type of machines.In this way, when the type of wire bonding machine table was upgraded, pressing plate still can be reused, and a prolongation piece that only needs to change different size gets final product.In addition, owing to prolong piece is to bridge between holder and the pressing plate through trip or sealed mode, therefore, adapter is to utilize three screws to be locked on the holder in the prior art, prolongation piece of the present invention does not more have the problem of horizontal direction or vertical direction displacement, and the vertical direction pressing power of pressing plate can be comparatively even, to promote the yield of line connection process.Moreover an end of prolongation piece of the present invention is to utilize the mode of trip to be fixed on the holder, and the other end is to utilize single screw or the mode of trip is fixed on the pressing plate, not only can reduce the number of part effectively, also can shorten the time of assembling.
Description of drawings
Fig. 1 is the schematic diagram of existing a kind of wire bonding machine table.
Fig. 2 is the schematic side view according to a wire bonding machine table of the first embodiment of the present invention.
Fig. 3 is the schematic side view according to a wire bonding machine table of the second embodiment of the present invention.
Fig. 4 is the schematic side view according to a wire bonding machine table of the third embodiment of the present invention.
Fig. 5 is the schematic side view according to a wire bonding machine table of the fourth embodiment of the present invention.
Embodiment
In order to make above-mentioned purpose of the present invention and other purpose, feature and advantage become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Fig. 2 is the schematic side view according to a wire bonding machine table of the first embodiment of the present invention.Please refer to shown in Figure 2ly, wire bonding machine table 300 of the present invention is suitable for routing and engages the connection pad 402 of a carrier 400 and the chip 410 of the side of being fixed thereon, and the two can be electrically connected via routing lead 420.
This wire bonding machine table 300 comprises a pedestal 310, hot plate 320, pressing plate 330, a pair of holder 340, a pair of prolongation piece 350 and a capillary 360.Hot plate 320 is to be positioned on the pedestal 310, and when carrying out the routing processing procedure, this hot plate 320 is in order to the gold thread in heating wires frame and the capillary 360, to finish the joint of soldered ball.Pressing plate 330 is the tops that are disposed at hot plate 320 in mode moving up and down, and when desiring to carry out the routing processing procedure, this pressing plate 330 can rise, and hot plate 320 can descend, and to grip carrier 400, makes its unlikely rocking in the process of routing.In addition, pressing plate 330 has an opening 332, and Bu Fen carrier 400 and the chip 410 that is arranged in carrier 400 tops can come out from opening 332 like this, so that carry out line connection process.
A pair of holder 340 is the left and right sides that are disposed at pressing plate 330, and the length of above-mentioned pressing plate 330 is not match this to the distance between the holder 340, promptly has one apart from d between the edge of holder 340 and pressing plate 330.Two to prolong pieces 350 be to bridge between holder 340 and the pressing plate 330, its length be corresponding to above-mentioned apart from d, like this can be so that pressing plate 330 is fixed on the holder 340 by prolongation piece 350.In this embodiment, two prolongation pieces 350 all have a Z type profile.Prolong an end that is adjacent to pressing plate 330 on the piece 350 two and all have a through hole 352, this through hole 352 can be sealed with pressing plate 330 and prolongation piece 350 for a screw 370 passes, and prolong an end that is adjacent to pressing plate 330 on the pieces 350 two all is to utilize the mode of trip to be fixed in the holder 340, and can avoid adapter of the prior art in this way is to utilize three screws to be locked on the holder and the problem of generation level or vertical offset.Yet the two ends that prolong piece 350 also can and be individually fixed on pressing plate 330 and the holder 340 through alternate manner, and the present invention does not impose any restrictions this.
Capillary 360 is to be positioned at pressing plate 330 tops, and when carrying out line connection process, this capillary 360 is in order to form the many routing leads 420 that electrically connect the connection pad 402 on chip 410 and the carrier 400.
Owing to prolonging piece 350 is to be fixed in the holder 340 by Fastening tenon structure, therefore, prolongs the problem that piece 350 does not have horizontal direction or vertical direction displacement.In this way, the vertical direction pressing power of pressing plate 330 can be comparatively even, to promote the yield of line connection process.In addition, when operation, only need these pressing plate 330 collocation are had the prolongation piece 350 of different length, can make it be applicable to the wire bonding machine table of different type of machines.
Fig. 3 is the schematic side view according to a wire bonding machine table of the second embodiment of the present invention.Please refer to shown in Figure 3, the structure of this wire bonding machine table 300 ' structure with the wire bonding machine table 300 shown in Fig. 2 haply is identical, and its difference is: the two ends of prolongation piece 350 ' in a second embodiment have one first through hole 352a and one second through hole 352b respectively, sealed prolongation piece 350 and pressing plate 330 for one first screw 370a passes the first through hole 352a, and supply one second screw 370b to pass the second through hole 352b and sealed prolongation piece 350 and holder 340.
Fig. 4 is the schematic side view according to a wire bonding machine table of the third embodiment of the present invention.Please refer to shown in Figure 4, this wire bonding machine table 300 " structure the structure with the wire bonding machine table 300 shown in Fig. 2 is identical haply; and its difference is: prolong piece 350 " section with a Y type, and it has a clamping part 354 and a connected fixed part 356, has a groove 354a in the clamping part 354, with clamping and fix one side of pressing plate 330, and fixed part 356 is to be fixed on the holder 340.In this way, pressing plate 330 can see through the prolongation piece 350 with Y type profile equally " and be fixed on the holder 340.In this embodiment, prolong piece 350 " clamping part 354 have a through hole 352; the sealed prolongation piece 350 for a screw 370 passes through hole 352 " and pressing plate 330, and prolong piece 350 " fixed part 356 be to utilize the mode of trip to be fixed on the holder 340.Owing to have the prolongation piece 350 of Y type profile " be that mode with clamping is fixed in pressing plate 330 in the clamping part 354, therefore, pressing plate 330 is difficult for loosening skew, so just can firmly push down carrier 400, with the yield of lifting line connection process.
Fig. 5 is the schematic side view according to a wire bonding machine table of the fourth embodiment of the present invention.Please refer to shown in Figure 5, this wire bonding machine table 300 " ' structure haply with the wire bonding machine table 300 shown in Fig. 4 " structure identical, and its difference is: the prolongation piece 350 in the 4th embodiment " ' clamping part 354 and fixed part 356 have one first through hole 352a and one second through hole 352b respectively; sealed prolongation piece 350 and pressing plate 330 for one first screw 370a passes the first through hole 352a, and pass the second through hole 352b and sealed prolongation piece 350 and holder 340 for one second screw 370b.
In sum, the pressing plate of wire bonding machine table of the present invention is to be fixed on the holder by prolonging piece, therefore, the pressing plate of same size can arrange in pairs or groups different size the prolongation piece and be applied on the wire bonding machine table of different type of machines.In this way, when the type of wire bonding machine table was upgraded, pressing plate still can be reused, and a prolongation piece that only needs to change different size gets final product.
In addition, owing to prolong piece is to bridge between holder and the pressing plate through trip or sealed mode, therefore, adapter is to utilize three screws to be locked on the holder in the prior art, prolongation piece of the present invention does not more have the problem of horizontal direction or vertical direction displacement, and the vertical direction pressing power of pressing plate can be comparatively even, to promote the yield of line connection process.
Moreover an end of prolongation piece of the present invention is to utilize the mode of trip to be fixed on the holder, and the other end is to utilize single screw or the mode of trip is fixed on the pressing plate, not only can reduce the number of part effectively, also can shorten the time of assembling.

Claims (8)

1.一种打线机台，其适用于将位于一个承载器上的一个芯片打线接合至所述承载器上的若干个接垫，该打线机台包括有一个基座、一个位于所述基座上的热板、一个以可上下移动的方式配置于所述热板上方的压板、一对配置于所述压板的相对两侧的固定座，以及一个位于所述压板上方的焊针，其中所述压板是用来压合位于所述热板上的所述承载器，所述压板具有一个开口，以暴露出位于所述承载器上的所述芯片及所述接垫；所述焊针是用来形成多数条电性连接所述芯片及所述承载器的这些接垫的打线导线；其特征在于：所述压板的长度是不匹配于所述的两个固定座之间的距离，而所述打线机台还包括有一对延长块，其用来桥接于所述固定座与所述压板之间。1. A wire bonding machine, which is suitable for bonding a chip on a carrier to several pads on the carrier, the wire bonding machine includes a base, a A hot plate on the base, a pressing plate arranged above the hot plate in a manner that can move up and down, a pair of fixing seats arranged on opposite sides of the pressing plate, and a welding pin located above the pressing plate , wherein the press plate is used to press the carrier on the hot plate, the press plate has an opening to expose the chip and the pad on the carrier; the Solder pins are used to form a plurality of bonding wires electrically connected to the pads of the chip and the carrier; it is characterized in that: the length of the pressing plate does not match between the two fixing seats distance, and the bonding machine table also includes a pair of extension blocks, which are used to bridge between the fixing base and the pressing plate. 2.如权利要求1所述的打线机台，其特征在于：所述延长块具有一个Z型的纵剖面。2. The wire bonding machine as claimed in claim 1, wherein the extension block has a Z-shaped longitudinal section. 3.如权利要求2所述的打线机台，其特征在于：所述延长块的一端具有一个贯穿孔，以供一个螺丝穿过所述贯穿孔而锁合所述延长块及所述压板，而其另一端是利用卡榫的方式固定于所述固定座上。3. The wire bonding machine according to claim 2, wherein one end of the extension block has a through hole for a screw to pass through the through hole to lock the extension block and the pressing plate , and the other end is fixed on the fixed seat by means of tenons. 4.如权利要求2所述的打线机台，其特征在于：所述延长块的两端分别具有一个第一贯穿孔及一个第二贯穿孔，以供一个第一螺丝穿过所述第一贯穿孔而锁合所述延长块及所述压板，且供一个第二螺丝穿过所述第二贯穿孔而锁合所述延长块及所述固定座。4. The wire bonding machine as claimed in claim 2, characterized in that: the two ends of the extension block respectively have a first through hole and a second through hole for a first screw to pass through the second through hole. A through hole locks the extension block and the pressing plate, and a second screw passes through the second through hole to lock the extension block and the fixing seat. 5.如权利要求1所述的打线机台，其特征在于：所述延长块具有一个Y型的纵剖面。5. The wire bonding machine as claimed in claim 1, wherein the extension block has a Y-shaped longitudinal section. 6.如权利要求5所述的打线机台，其特征在于：所述延长块具有一个夹持部及一个与其连接的固定部，所述夹持部中具有一个凹槽，以夹持及固定所述压板的一个侧边，而所述固定部是固定于所述固定座上。6. The wire bonding machine as claimed in claim 5, wherein the extension block has a clamping portion and a fixing portion connected thereto, and the clamping portion has a groove for clamping and One side of the pressing plate is fixed, and the fixing part is fixed on the fixing seat. 7.如权利要求6所述的打线机台，其特征在于：所述延长块的夹持部均具有一个贯穿孔，以供一个螺丝穿过所述贯穿孔而锁合所述延长块及所述压板，而所述延长块的固定部是利用卡榫的方式固定于所述固定座上。7. The wire bonding machine as claimed in claim 6, characterized in that: the clamping portion of the extension block has a through hole for a screw to pass through the through hole to lock the extension block and The pressing plate and the fixing part of the extension block are fixed on the fixing seat by means of tenons. 8.如权利要求6所述的打线机台，其特征在于：所述延长块的夹持部及固定部分别具有一个第一贯穿孔及一个第二贯穿孔，以供一个第一螺丝穿过所述第一贯穿孔而锁合所述延长块及所述压板，且供一个第二螺丝穿过所述第二贯穿孔而锁合所述延长块及所述固定座。8. The wire bonding machine according to claim 6, wherein the clamping portion and the fixing portion of the extension block respectively have a first through hole and a second through hole for a first screw to pass through. The extension block and the pressing plate are locked through the first through hole, and a second screw is passed through the second through hole to lock the extension block and the fixing seat.
CN200710003713A 2007-01-09 2007-01-09 Wire punching machine Active CN101221916B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200710003713A CN101221916B (en) 2007-01-09 2007-01-09 Wire punching machine

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Application Number Priority Date Filing Date Title
CN200710003713A CN101221916B (en) 2007-01-09 2007-01-09 Wire punching machine

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CN101221916A CN101221916A (en) 2008-07-16
CN101221916B true CN101221916B (en) 2010-05-19

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605833A (en) * 1984-03-15 1986-08-12 Westinghouse Electric Corp. Lead bonding of integrated circuit chips
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
US6321970B1 (en) * 1995-12-18 2001-11-27 Micron Technology, Inc. Wire bonding machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605833A (en) * 1984-03-15 1986-08-12 Westinghouse Electric Corp. Lead bonding of integrated circuit chips
US6321970B1 (en) * 1995-12-18 2001-11-27 Micron Technology, Inc. Wire bonding machine
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly

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