CN101220224B - UV solidified alkali resistant etching ink composition and uses thereof - Google Patents
UV solidified alkali resistant etching ink composition and uses thereof Download PDFInfo
- Publication number
- CN101220224B CN101220224B CN 200810000593 CN200810000593A CN101220224B CN 101220224 B CN101220224 B CN 101220224B CN 200810000593 CN200810000593 CN 200810000593 CN 200810000593 A CN200810000593 A CN 200810000593A CN 101220224 B CN101220224 B CN 101220224B
- Authority
- CN
- China
- Prior art keywords
- acid
- ink composition
- methyl
- alkali resistant
- resistant etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005530 etching Methods 0.000 title claims abstract description 54
- 239000003513 alkali Substances 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims description 46
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 239000002131 composite material Substances 0.000 claims abstract description 25
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000003999 initiator Substances 0.000 claims abstract description 8
- -1 hydroxy ester Chemical class 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 26
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 19
- 230000036211 photosensitivity Effects 0.000 claims description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 7
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 5
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 5
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 claims description 4
- 229920003987 resole Polymers 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 229960004889 salicylic acid Drugs 0.000 claims description 3
- QXIQCNFSNJEMOD-UHFFFAOYSA-N 3-hydroxybutan-2-yl prop-2-enoate Chemical group CC(O)C(C)OC(=O)C=C QXIQCNFSNJEMOD-UHFFFAOYSA-N 0.000 claims description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- VLCAYQIMSMPEBW-UHFFFAOYSA-N methyl 3-hydroxy-2-methylidenebutanoate Chemical group COC(=O)C(=C)C(C)O VLCAYQIMSMPEBW-UHFFFAOYSA-N 0.000 claims description 2
- BRRSNXCXLSVPFC-UHFFFAOYSA-N 2,3,4-Trihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1O BRRSNXCXLSVPFC-UHFFFAOYSA-N 0.000 claims 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 claims 1
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 claims 1
- YCPXWRQRBFJBPZ-UHFFFAOYSA-N 5-sulfosalicylic acid Chemical compound OC(=O)C1=CC(S(O)(=O)=O)=CC=C1O YCPXWRQRBFJBPZ-UHFFFAOYSA-N 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 238000003848 UV Light-Curing Methods 0.000 abstract description 8
- OELQSSWXRGADDE-UHFFFAOYSA-N 2-methylprop-2-eneperoxoic acid Chemical compound CC(=C)C(=O)OO OELQSSWXRGADDE-UHFFFAOYSA-N 0.000 abstract description 2
- 150000007965 phenolic acids Chemical class 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 238000001723 curing Methods 0.000 abstract 1
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- XSMJZKTTXZAXHD-UHFFFAOYSA-N ethene;2-methylprop-2-enoic acid Chemical group C=C.CC(=C)C(O)=O XSMJZKTTXZAXHD-UHFFFAOYSA-N 0.000 abstract 1
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 47
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 21
- 239000000243 solution Substances 0.000 description 17
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- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
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- 239000003795 chemical substances by application Substances 0.000 description 4
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
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- 239000007787 solid Substances 0.000 description 4
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- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
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- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001253 acrylic acids Chemical class 0.000 description 3
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
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- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical group CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
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- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 241000405217 Viola <butterfly> Species 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- GGNQRNBDZQJCCN-UHFFFAOYSA-N benzene-1,2,4-triol Chemical compound OC1=CC=C(O)C(O)=C1 GGNQRNBDZQJCCN-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- LHJQIRIGXXHNLA-UHFFFAOYSA-N calcium peroxide Chemical compound [Ca+2].[O-][O-] LHJQIRIGXXHNLA-UHFFFAOYSA-N 0.000 description 1
- 235000019402 calcium peroxide Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- 229940093500 ethoxyquin Drugs 0.000 description 1
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 description 1
- 235000019285 ethoxyquin Nutrition 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 229960005219 gentisic acid Drugs 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical group CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- 229960001708 magnesium carbonate Drugs 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- AJAZMOFONMJGNP-WMZOPIPTSA-N n-[(2s)-4-methyl-1-oxo-1-[[(2s)-3-oxo-4-(pyridin-2-ylsulfonylamino)butan-2-yl]amino]pentan-2-yl]-1-benzofuran-2-carboxamide Chemical compound O=C([C@H](C)NC(=O)[C@@H](NC(=O)C=1OC2=CC=CC=C2C=1)CC(C)C)CNS(=O)(=O)C1=CC=CC=N1 AJAZMOFONMJGNP-WMZOPIPTSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002896 organic halogen compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- JXAZAUKOWVKTLO-UHFFFAOYSA-L sodium pyrosulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OS([O-])(=O)=O JXAZAUKOWVKTLO-UHFFFAOYSA-L 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- YFDSDPIBEUFTMI-UHFFFAOYSA-N tribromoethanol Chemical compound OCC(Br)(Br)Br YFDSDPIBEUFTMI-UHFFFAOYSA-N 0.000 description 1
- 229950004616 tribromoethanol Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- MECHNRXZTMCUDQ-RKHKHRCZSA-N vitamin D2 Chemical compound C1(/[C@@H]2CC[C@@H]([C@]2(CCC1)C)[C@H](C)/C=C/[C@H](C)C(C)C)=C\C=C1\C[C@@H](O)CCC1=C MECHNRXZTMCUDQ-RKHKHRCZSA-N 0.000 description 1
- 235000001892 vitamin D2 Nutrition 0.000 description 1
- 239000011653 vitamin D2 Substances 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides an alkali-resistant UV curing etching resistant printing ink composite which contains strong lye solube resin, photosensitive initiator, photosensitive diluent and filler; wherein, the molecules of the strong lye solube resin contain at least one phenolic hydroxyl without carboxyl, and the strong lye solube resin is selected from one of the following compounds: (1) the compound which is obtained by the hydroxide radical of (methyl) acrylic acid hydroxy ester being epiphytically reacted with the hydroxide radical of phenolic acid; (2) the compound which is obtained by theepoxy group of (methyl) acrylic acid ethylene oxidic ester being reacted with the hydroxide radical of phenolic acid; (3) lye solube phenolic resin. The cured film formed by using the alkali-resistan t UV curing etching resistant printing ink composite of the invention has good curing etching resistant property, has good solubility in alkali solution and is easy to remove film by alkali solution after being etched.
Description
Technical field
The present invention relates to a kind of UV solidified alkali resistant etching ink composition and application thereof, this ink composite can be applicable to the making of printed circuit board circuit.
Background technology
UV curing anti-etching printing ink composition has widely in the field that makes single-clad board and multilayer line internal layer circuit to be used.In the making processes of printed circuit board (PCB), by UV curing anti-etching printing ink composition is printed onto on the metal substrate, after using suitable mask to form cured film, substrate is carried out etching with etching solution, remove cured film and obtain printed circuit board (PCB) with strong base solution afterwards through photocuring.Wherein,, can select the etching solution of different acid-basicity for use, and need employed UV cured printing ink composition to have corresponding etching resistence according to different baseplate materials.
In existing UV curing anti-etching printing ink composition, the main functional group that contains in the molecule is that the etched performance of ink composite alkali resistance of carboxyl is not good; Other alkali resistance etching performances preferably ink composite by reducing carboxyl functional group to reach this purpose, though this has improved the alkali resistance etching performance, but cause the cured film of its formation poorly soluble in strong base solution, in subsequent technique, be difficult for being removed.Therefore, need a kind of alkali resistance etching performance of exploitation good and in subsequent process, take off the good UV curing anti-etching printing ink composition of film properties.
Summary of the invention
In order to solve the problems referred to above that existing UV curing anti-etching printing ink composition exists, the invention provides the good and easy UV curing anti-etching printing ink composition that takes off film with strong base solution of a kind of alkali resistance etching performance.
UV solidified alkali resistant etching ink composition of the present invention comprises strong lye soluble resin, photosensitivity initiator, photosensitivity thinner and filler, at least contains a phenolic hydroxyl group in the molecule of wherein said strong lye soluble resin and do not contain carboxyl, and described strong lye soluble resin is selected from following arbitrary compounds:
(1) compound that the shrink reaction obtains takes place in the carboxyl of hydroxyl of (methyl) crylic acid hydroxy ester and phenol acid;
(2) compound that obtains of the carboxyl reaction of epoxy group(ing) of (methyl) glycidyl acrylate and phenol acid;
(3) buck resol resin.
Because the strong lye soluble resin in the ink composite of the present invention contains phenolic hydroxyl group and does not contain carboxyl, so the raising of alkali resistance etching performance, and be easy to be dissolved in the strong base solution.Ink composite of the present invention can tolerate the alkaline etching liquid of pH≤9, and dissolves in the alkaline solution of pH＞10.Use UV solidified alkali resistant etching ink composition of the present invention, not only make the etched superior performance of cured film alkali resistance of final formation, and the solvability of formed cured film in strong base solution is good, is easy to take off film with strong base solution after etching.Therefore can effectively improve the efficient of automatic production of circuit card and the quality of product.
Therefore, the present invention also provides the application of aforementioned printing ink, is used to make a kind of printed circuit board circuit.
Embodiment
Particularly, UV solidified alkali resistant etching ink composition of the present invention comprises strong lye soluble resin, photosensitivity initiator, photosensitivity thinner and filler, at least contains a phenolic hydroxyl group in the molecule of wherein said strong lye soluble resin and do not contain carboxyl, and described strong lye soluble resin is selected from following arbitrary compounds:
(1) compound that the shrink reaction obtains takes place in the carboxyl of hydroxyl of (methyl) crylic acid hydroxy ester and phenol acid;
(2) compound that obtains of the carboxyl reaction of epoxy group(ing) of (methyl) glycidyl acrylate and phenol acid;
(3) buck resol resin.
In the present invention, " (methyl) crylic acid hydroxy ester " is meant crylic acid hydroxy ester or methacrylic acid hydroxyl ester and the mixture of the two, commonly used having (methyl) Propylene glycol monoacrylate and (methyl) Hydroxyethyl acrylate etc.Wherein said " (methyl) vinylformic acid " is vinylformic acid, methacrylic acid or its mixture.Can do similarly explanation to other similar method for expressing among the application.
At least contain a carboxyl and a phenolic hydroxyl group in the described phenol acid molecule, commonly used for example has: m-Salicylic acid (3-hydroxybenzoic acid), P-hydroxybenzoic acid (4-hydroxybenzenecarboxylic acid), salicylic acid (Whitfield's ointment, 2-hydroxybenzoic acid), 2, the 3-resorcylic acid, 2, the 4-resorcylic acid, 2,5-resorcylic acid (5-hydroxyl Whitfield's ointment, gentisinic acid), 2, the 6-resorcylic acid, 3, the 4-resorcylic acid, 3, the 5-resorcylic acid, 2,3, the 4-trihydroxybenzoic acid, 3,4,5-trihydroxybenzoic acid (gallic acid), 5-sulphosalicylic acid (2-hydroxy-5-sulfobenzoic acid) etc., the perhaps compound of following general formula:
R wherein
1, R
2, R
3, R
4Can be the identical or different group that is selected from carboxyl (COOH), hydroxyl (OH), hydrogen (H), halogen and low alkyl group.These compounds can use the mixture that also can be used as two or more materials to use separately.
In the present invention, low alkyl group is meant the alkyl of 1-8 carbon atom, the alkyl of preferred 1-6 carbon atom.
Described buck resol resin can be the product that A and two kinds of substance reactions of B obtain, and wherein A is formaldehyde, phenyl aldehyde or both mixtures; B is phenol, ortho-cresol, meta-cresol, p-cresol, 2,3-xylenol, 2,6-xylenol, 3,4-xylenol, 3, the mixture of phenolic compound such as 5-xylenol, pyrogallol, Phloroglucinol, hydroxyquinol or above-mentioned phenols.
Described photosensitivity initiator has no particular limits, and commonly used for example has: benzoin and benzoin alkyl oxides such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether; Methyl phenyl ketone, 2,2-dimethoxy-2-phenyl methyl phenyl ketone, 2,2-diethoxy-2-phenyl methyl phenyl ketone, 1, acetophenones such as 1-dichloroacetophenone; 2-methyl isophthalic acid-[4-(methyl sulfo-) phenyl]-2-morpholinyl acetone-1,2-benzyl-2-dimethyl amido-1-(4-morpholinyl phenyl)-butane-1-ketone, N, N-dimethyl amido acetophenones; 2-methylanthraquinone, 2-ethyl-anthraquinone, anthraquinone classes such as 2-tertiary butyl anthraquinone, 1-chloroanthraquinone; 2,4-5 methyl thioxanthone, 2,4-diethyl thioxanthone, 2-clopenthixal ketone, 2, thioxanthene ketones such as 4-di-isopropyl thioxanthone; Ketal classes such as methyl phenyl ketone dimethyl ketal, benzyl dimethyl ketal; Organo-peroxide such as benzoyl peroxide, dicumyl peroxide; 2,4, mercaptan compounds such as 5-three aromatic base imidazoles diploids, hibon, 2-sulfenyl benzoglyoxaline, 2-sulfenyl benzoxazole, 2-sulfurio benzo thiazole; 2,4,6-three-s-triazine; Organohalogen compounds such as tribromo-ethanol, trisbromomethyl phenyl ketone; Benzophenone, 4,4 '-Benzophenones such as two diethyl amido benzophenone; 2,4,6-trimethylbenzoyl diphenylphosphine oxide compound etc.More than cited light trigger can use separately or use as the mixture of two or more materials.Also can add for example N of light-initiated auxiliary agent, N-dimethyl amine yl benzoic acid ethyl ester, N, tertiary amines such as N-dimethyl amine yl benzoic acid isopentyl ester, amyl group-4-dimethyl amido benzoic ether and triethylamine, trolamine.
Described photosensitivity thinner is the photosensitivity monomer that contains unsaturated group, and commonly used for example has: (methyl) Hydroxyethyl acrylate, three (methyl) vinylformic acid pentaerythritol ester, five (methyl) vinylformic acid dipentaerythritol ester etc. contain (methyl) esters of acrylic acid of hydroxyl; Simple function (methyl) esters of acrylic acids such as (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) butyl acrylate, (methyl) lauryl acrylate; 1, two (methyl) acrylate, two of 6-hexylene glycol contract/two (methyl) acrylate, two of tripropylene glycol contract/difunctionality (methyl) esters of acrylic acids such as two (methyl) acrylate of triethylene Glycol, two (methyl) acrylate of ethoxyquin dihydroxyphenyl propane, two (methyl) acrylate of neopentyl glycol diethoxy/propoxy-; Multifunctional (methyl) esters of acrylic acids such as three (methyl) vinylformic acid trihydroxymethylpropanyl ester, four (methyl) vinylformic acid pentaerythritol ester, six (methyl) vinylformic acid dipentaerythritol ester; The ethoxylation multi-functional acrylate; The propoxylation multi-functional acrylate.These photosensitivity monomers that contain unsaturated group can use separately or use as the mixture of two or more materials.
Filler of the present invention has no particular limits, and commonly used for example has: the mineral filler that calcium dioxide, talcum powder, barium sulfate, gas-phase silica, silicon-dioxide, clay, magnesiumcarbonate, lime carbonate, aluminum oxide, mica powder, kaolin etc. are commonly used.The cure shrinkage that filler can suppress to film, and improve characteristics such as sticking power, hardness.
In addition, also can choose wantonly in the UV solidified alkali resistant etching ink composition of the present invention and comprise the non-photosensitivity thinner, can be used for non-photosensitivity thinner of the present invention and for example be: pure ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol list ether, dipropylene glycol monobutyl ether; Acetate esters such as ethyl acetate, butylacetate, ethylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetic ester, diethylene glycol monoethyl ether acetic ester, butyl carbitol acetate, propylene glycol methyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetic ester, dipropylene glycol monomethyl ether acetic ester, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetic ester; Ketones solvents such as butanone, pimelinketone, isophorone; Aromatic solvents such as toluene, dimethylbenzene, durene; Oil series solvents such as petroleum naphtha, oxidation petroleum naphtha, solvent naphtha.These solvents can use separately or use as the mixture of two or more materials.
Also can contain tinting pigment in the UV solidified alkali resistant etching ink composition of the present invention, for example tinting pigment commonly used such as phthalocyanine green, phthalocyanine blue, Viola crystallina, titanium dioxide, carbon black.Can contain additives such as heat polymerization inhibitors, thixotroping tackifier, dispersion agent, flow agent, defoamer in addition.
In UV solidified alkali resistant etching ink composition of the present invention, the content of strong lye soluble resin is 5-80%, is preferably 20-70%; The content of photosensitivity thinner is 5-60%, is preferably 5-50%; The content of photosensitivity initiator is 0.1-30%; The content of filler is 0-60%, is preferably 5-50%.
The present invention also provides the application of aforementioned printing ink, is used to make a kind of printed circuit board circuit.
Below in conjunction with embodiment the present invention is further specified, but the present invention is not limited only to following embodiment.
Embodiment 1
At first synthesize and be used for strong lye soluble resin of the present invention: add glycidyl methacrylate 142g at reactor, Whitfield's ointment 138g, Resorcinol 0.5g, be heated to 95-105 ℃ of reaction 10 hours, stopped reaction when measuring acid number less than 5mg KOH/g, cooling discharging obtains the liquid strong lye soluble resin (a) of burgundy.
With the blue 1g of strong lye soluble resin (a) 40g, photosensitivity thinner Hydroxyethyl acrylate 23g, photosensitivity initiator 907 (Ciba company photosensitizers) 6g, filler talcum powder 20g, barium sulfate 10g, pigment titanium cyanines that obtains, and as dispersion agent 0.5g, flow agent 0.5g and the defoamer 0.2g of auxiliary agent, mix and with three-roll grinder grind to fineness less than 15 μ m, obtain a kind of UV solidified alkali resistant etching ink composition of the present invention.
Embodiment 2
In reactor, add hydroxyethyl methylacrylate 234g, Whitfield's ointment 138g, Resorcinol 0.2g, sodium pyrosulfate 8g 130-140 ℃ of reaction 20 hours, steams 17ml water, and cooling discharging obtains the liquid strong lye soluble resin (b) of burgundy.
The strong lye soluble resin (b) that only contains a unsaturated group in the molecule that obtains is replaced strong lye soluble resin (a) among the embodiment 1, make ink composite by the method identical with embodiment 1.
Embodiment 3
In reactor, add glycidyl methacrylate 142g, m-Salicylic acid 138g, Resorcinol 0.5g, be heated to 80-90 ℃ of reaction 8 hours, stopped reaction when measuring acid number less than 5mg KOH/g, cooling discharging obtains the liquid strong lye soluble resin (c) of burgundy.
The strong lye soluble resin (c) that only contains a unsaturated group in the molecule that obtains is replaced strong lye soluble resin (a) among the embodiment 1, make ink composite by the method identical with embodiment 1.
Comparative example 1
In reactor, add 200 gram bisphenol A type epoxy resin (E20 resins, epoxy equivalent (weight) 500) (production of Wuxi resin processing plant), 200 gram ethylene glycol ether acetates, 28.8 gram vinylformic acid, 0.5 gram Resorcinol and 2 gram N, N-dimethylbenzyl ammonia, and, measure its acid number less than 5mg KOH/g 90-95 ℃ thermotonus 20 hours.Add 82 gram Tetra hydro Phthalic anhydrides again, in 90 ℃ thermotonuses 6 hours, obtaining acid number was 61mg KOH/g, and solid content is 63% lurid resin liquid (d).
The buck soluble resin (d) that only contains a unsaturated group in the molecule that obtains and contain carboxyl is replaced strong lye soluble resin (a) among the embodiment 1, make ink composite by the method identical with embodiment 1.
Comparative example 2
In reactor, add 200g F48 Resins, epoxy (Wuxi resin processing plant) (epoxy equivalent (weight) 240), add 200g butyl glycol ether acetic ester, 0.5g Resorcinol, 57.6g vinylformic acid, 2gN, the N-dimethyl benzylamine, in 90 ℃ of reactions 20 hours, measure acid number less than 5mg KOH/g, add Tetra hydro Phthalic anhydride 82g, 90 ℃ were reacted 6 hours, and getting acid number is that 61mg KOH/g, solid content are 63% shallow yellow transparent solution (e).
The solution (e) of the resin that contains carboxyl that obtains is replaced strong lye soluble resin (a) among the embodiment 1, use the method identical to make the anti-etching printing ink composition with embodiment 1.
Comparative example 3
In reactor, add 200g o-cresol epoxy resin (epoxy equivalent (weight) 250) (Wuxi resin processing plant product), the 200g ethyl cellosolve acetate, 0.5g Resorcinol, 57.6g vinylformic acid, 2g N, the N-dimethyl benzylamine, 90 ℃ were reacted 20 hours, measured acid number less than 5mg KOH/g, added Tetra hydro Phthalic anhydride 82g, 90 ℃ were reacted 6 hours, and obtaining acid number is that 61mg KOH/g, solid content are 63% shallow yellow transparent solution (f).
The solution (f) of the resin that contains carboxyl that obtains is replaced strong lye soluble resin (a) among the embodiment 1, use the method identical to make the anti-etching printing ink composition with embodiment 1.
Comparative example 4 (the UV solidified alkali resistant etching ink composition of prior art)
In reactor, add 200g bisphenol A type epoxy resin (E20 resin, epoxy equivalent (weight) 500) (Wuxi resin processing plant product), 200g ethyl cellosolve acetate, 0.5g Resorcinol, 57.6g vinylformic acid, 2g N, the N-dimethyl benzylamine, 90 ℃ were reacted 20 hours, measure acid number less than 5mgKOH/g, add Tetra hydro Phthalic anhydride 82g, 90 ℃ were reacted 6 hours, and obtaining acid number is that 30mgKOH/g, solid content are 63% shallow yellow transparent solution (g).
The solution (g) of the resin that contains carboxyl that obtains is replaced strong lye soluble resin (a) among the embodiment 1, replace Hydroxyethyl acrylate, use the method identical to make the anti-etching printing ink composition with embodiment 1 with Viscoat 295.
Application Example
Primary process with ink composite manufacturing test model of the present invention is:
Frictioning with 100T polyester net and 75 degree hardness are printed in ink composite on the wiring board substrate of dry cleansing, the substrate that then this is scribbled ink composite high voltage mercury lamp (ultraviolet lamp) down irradiation (irradiation energy was 1000mj/cm 20 seconds
2).
For the ink composite of the present invention among each embodiment relatively and the prior art ink composite in each comparative example in light solidified, alkali resistance etching with take off difference aspect the film, show and estimate by the following method:
Light solidified: make test sample plate as stated above, push with hand afterwards, the check contact drying.Evaluation method: it is excellent not having finger mark, finger mark is arranged but tack-free for good, and sticking hand is for poor.
Alkali resistance etching: the test sample plate that makes is soaked in 5 minutes (30 ℃ of normal temperature) in the cupric chloride ammoniacal liquor etching solution, takes out then, wash with water totally, dry up, press adhesive tape intersection cross-hatching test ink composition sticking power.Evaluation method: do not come off fully for excellent, only drawing the ruling edge has and comes off on a small quantity for very, has more than lattice to come off for poor.
Take off film: make test sample plate, the aqueous sodium hydroxide solution of 3% (quality) is sprayed on model ink combination object plane, write down ink composite and take off except that the time with 0.5 kilogram of pressure.Evaluation method: 15 seconds is excellent, and 25 seconds is good, is poor more than 35 seconds.
The evaluation result of various ink composites is listed in table 1.
Table 1
By the anti-etching printing ink composition that the strong lye soluble resin of the present invention among the visible embodiment of the result of table 1 is made, its light solidified, alkali resistance etching, take off film and be excellent.Though the anti-etching printing ink composition of comparative example 1,2 and 3 can obtain light solidified, take off the good cured film of film, it is alkali resistance ammoniacal liquor etching solution not; The anti-etching printing ink composition of comparative example 4 has certain alkali resistance etching performance, but it is poor to take off film.
Claims (12)
1. UV solidified alkali resistant etching ink composition, comprise strong lye soluble resin, photosensitivity initiator, photosensitivity thinner and filler, it is characterized in that: contain a phenolic hydroxyl group in the molecule of described strong lye soluble resin at least and do not contain carboxyl, and described strong lye soluble resin is selected from following arbitrary compounds:
(1) compound that the shrink reaction obtains takes place in the carboxyl of hydroxyl of (methyl) crylic acid hydroxy ester and phenol acid;
(2) compound that obtains of the carboxyl reaction of epoxy group(ing) of (methyl) glycidyl acrylate and phenol acid;
(3) buck resol resin.
2. the described UV solidified alkali resistant etching ink composition of claim 1 is characterized in that: described (methyl) crylic acid hydroxy ester is selected from (methyl) Propylene glycol monoacrylate and (methyl) Hydroxyethyl acrylate and composition thereof; Describedly be selected from m-Salicylic acid, P-hydroxybenzoic acid, salicylic acid, 2 for phenol acid, 3-resorcylic acid, 2,4-resorcylic acid, 2,5-resorcylic acid, 2,6-resorcylic acid, 3,4-resorcylic acid, 3,5-resorcylic acid, 2,3,4-trihydroxybenzoic acid, 3,4, one or more in the compound of 5-trihydroxybenzoic acid, 5-sulphosalicylic acid and following general formula
R wherein
1, R
2, R
3, R
4Be the identical or different group that is selected from carboxyl, hydroxyl, hydrogen, halogen and low alkyl group.
3. the described UV solidified alkali resistant etching ink composition of claim 2, it is characterized in that: described (methyl) crylic acid hydroxy ester is selected from hydroxyethyl methylacrylate.
4. the described UV solidified alkali resistant etching ink composition of claim 2, it is characterized in that: described phenol acid is selected from Whitfield's ointment and m-Salicylic acid.
5. the described UV solidified alkali resistant etching ink composition of any one among the claim 1-4 is characterized in that: the content of described strong lye soluble resin is the 5-80% of this ink composite gross weight.
6. the described UV solidified alkali resistant etching ink composition of claim 5 is characterized in that: the content of described strong lye soluble resin is the 20-70% of this ink composite gross weight.
7. the described UV solidified alkali resistant etching ink composition of any one among the claim 1-4 is characterized in that: the content of described photosensitivity thinner is the 5-60% of this ink composite gross weight.
8. the described UV solidified alkali resistant etching ink composition of claim 7 is characterized in that: the content of described photosensitivity thinner is the 5-50% of this ink composite gross weight.
9. the described UV solidified alkali resistant etching ink composition of any one among the claim 1-4 is characterized in that: the content of described photosensitivity initiator is the 0.1-30% of this ink composite gross weight.
10. the described UV solidified alkali resistant etching ink composition of any one among the claim 1-4 is characterized in that: the content of described filler is the 0-60% of this ink composite gross weight.
11. the described UV solidified alkali resistant etching ink composition of claim 10 is characterized in that: the content of described filler is the 5-50% of this ink composite gross weight.
12. the application of the ink composite of one of claim 1-11 is used to make a kind of printed circuit board circuit.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10048582B2 (en) | 2015-12-16 | 2018-08-14 | Industrial Technology Research Institute | Photo-imprinting resin composition, photo-imprinting resin film and patterning process |
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| JP6497639B2 (en) * | 2014-03-04 | 2019-04-10 | アイカ工業株式会社 | Thermosetting resin composition, cured product and method for producing modified phenolic resin |
| EP3210947A1 (en) * | 2016-02-29 | 2017-08-30 | Agfa-Gevaert | Method of manufacturing an etched glass article |
| CN107329368B (en) * | 2017-07-05 | 2020-08-14 | 江苏广信感光新材料股份有限公司 | Alkali-soluble photosensitive composition, and preparation method and application thereof |
| CN109486283A (en) * | 2018-10-26 | 2019-03-19 | 珠海君奥新材料科技有限公司 | The anti-etching ink jet ink composition of radical cation hybrid UV-curing |
| CN114874658A (en) * | 2021-12-03 | 2022-08-09 | 佛山市西伦化工有限公司 | Etching-resistant UV (ultraviolet) ink and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1693387A (en) * | 2005-05-23 | 2005-11-09 | 容大油墨（惠州）有限公司 | A kind of liquid photosensitive solder resist ink and its circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1693387A (en) * | 2005-05-23 | 2005-11-09 | 容大油墨（惠州）有限公司 | A kind of liquid photosensitive solder resist ink and its circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10048582B2 (en) | 2015-12-16 | 2018-08-14 | Industrial Technology Research Institute | Photo-imprinting resin composition, photo-imprinting resin film and patterning process |
| TWI643901B (en) * | 2015-12-16 | 2018-12-11 | 財團法人工業技術研究院 | Photo-imprinting resin composition, photo-imprinting resin film and patterning process |
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