CN101215099B - Flat glass substrate attenuation etching liquid - Google Patents
Flat glass substrate attenuation etching liquid Download PDFInfo
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- CN101215099B CN101215099B CN2008100562639A CN200810056263A CN101215099B CN 101215099 B CN101215099 B CN 101215099B CN 2008100562639 A CN2008100562639 A CN 2008100562639A CN 200810056263 A CN200810056263 A CN 200810056263A CN 101215099 B CN101215099 B CN 101215099B
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Abstract
The invention relates to a reduction etching liquid for base plates of sheet glass, components percentage by weight of which comprise: hydrofluoric acid holding 5-25%, strong acid holding 5-30% and pure water holding 45-90%. The reduction etching liquid for base plates of sheet glass of the invention is less in volatilization and toxicity. The using rate of the etching liquid is high and etching speed is rapid and stable. Costs of waste liquor treatment and subsequent treatment are low. The etching effect is excellent. Therefore, the invention has wide prospects for application.
Description
Technical field
The present invention relates to a kind of sheet glass attenuation etching liquid, the etching liquid for thinning glass substrate of especially a kind of flat-panel monitor and all kinds of display module (comprising that LCD (liquid-crystal display/screen), PDP (plasma display/screen), TP (touch-screen), OLED (organic light-emitting diode (OLED) display screen) etc. show product).
Background technology
Along with the development of electronic technology and technique of display, the glass substrate slimming has become prerequisite and the power that terminal shows the product slimming as the core that shows the product slimming.The slimming technology that shows the product glass substrate at present, or claim its thinning technique, mainly contain two kinds of physical grinding polishing attenuate and chemical milling attenuates, and the mainstream technology of technical superiority just progressively becomes glass substrate slimming such as the chemical milling attenuate is fast with its speed, efficient is high, investment is low.Production with TFT-LCD (Thin Film Transistor-LCD) is example, the main flow thickness that present glass substrate is former is 0.5mm, it also is the minimal thickness that present TFT-LCD array substrate production technique can arrive, do not meet the requirement that terminal shows the product slimming, this is also just demonstrating glass substrate thinning value of technology place., compare with the physical grinding attenuate to 0.25mm (two-sided 0.5mm behind the one-tenth box) even thinner Technology for the thinning glass substrate that 0.5mm (two-sided 1.0mm behind the one-tenth box) is thick, the advantage of chemical milling attenuate is just apparent.Existing chemical milling thinning technique adopts single hydrofluoric acid to carry out attenuate as etching solution, but there is following shortcoming in this etching solution:
1, toxicity is big, volatile.Need adopt higher temperature condition and hydrofluoric acid concentration when particularly preparing in the production process, thereby volatilize a large amount of hydrofluoric acid gas easily, toxicity is big, and is dangerous high.
2, the etch-rate instability and the utilization ratio of etching solution is lower in the production process.
3, because the utilization ratio of etching solution is lower, so the liquid waste disposal amount is big, and difficult treatment, and the treatment cost of waste liquor that matches with it is higher.
4, resultant is difficult to remove.Hydrofluoric acid and glass reaction generate a large amount of white indissoluble things; not only be difficult to remove from glass surface; and can be further attached in the equipment, pipeline is first-class, cause problems such as product surface weak effect, line clogging, equipment downtime, even cause security incident.
Summary of the invention
The purpose of this invention is to provide a kind of flat glass substrate attenuation etching liquid, effectively overcome the defective that prior art adopts single hydrofluoric acid etch liquid to bring.
For achieving the above object, the invention provides a kind of flat glass substrate attenuation etching liquid, comprise the moiety of following weight percent: hydrofluoric acid 5-25%, strong acid 5-30%, pure water 45-90%.
Described strong acid can be nitric acid and phosphoric acid, wherein nitric acid 3-20%, phosphoric acid 2-10% can also be nitric acid and sulfuric acid, wherein nitric acid 2-10%, sulfuric acid 3-20%, can also further be nitric acid, phosphoric acid and sulfuric acid, wherein nitric acid 1-8%, phosphatase 11-8%, sulfuric acid 3-14%.
The invention provides a kind of flat glass substrate attenuation etching liquid, have the following advantages:
1, etching solution volatilization less, toxicity is little.Etching solution of the present invention has adopted the less acids of other toxicity to cooperate hydrofluoric acid to play a role, make the concentration and the consumption of hydrofluoric acid reduce significantly, and the toxicity of the relative hydrofluoric acid of acids such as sulfuric acid, nitric acid, phosphoric acid and volatility all can be little a lot, significantly improved the security and the feature of environmental protection of etching solution.
2, etching solution utilization ratio height, etch-rate is stablized soon.Because the volatilization of etching solution of the present invention is few, adds the booster action of other acids to hydrofluoric acid, make the utilization ratio of etching solution have and significantly improve, prolonged the working life of etching solution greatly; Etching solution of the present invention adds strong acid with respect to single hydrofluoric acid or other etching solutions in etching solution simultaneously, on the one hand because H
+Increase make and glass main component SiO
2The composition HF that the activity that reacts is the highest
2 -Complexing ion increases, on the other hand also because H
+The glass etching reaction there is certain katalysis, adds in other acids such as NO
3 -, SO
4 2-, PO
4 3-Introducing partly changed the resultant (single hydrofluoric acid resultant of reaction mostly is indissoluble things such as fluorochemical, silicofluoric acid salt) of reaction, making that resultant of reaction is easier removes from glass surface, thus under the same process condition etch-rate can improve the 2-3 micron/minute; And because the adding of other acids makes the concentration of hydrofluoric acid and consumption reduce significantly, etch-rate also obviously reduces the etch-rate that can keep relative stability to the susceptibility of hydrofluoric acid concentration in ± 1% concentration deviation.
3, because the raising of the utilization ratio of etching solution of the present invention, so the waste liquid generation significantly reduces, and handles comparatively simply, and the treatment cost of waste liquor that matches with it also reduces greatly.
4, etch effect is better.Because the adding of other acids, changed the resultant character after the glass etching, the salt viscosity that generates is less, remove from glass surface easily, cooperate special etching solution circulation and flow system simultaneously, greatly improved the surface effect of etching rear plate glass substrate, thickness evenness can be reduced to below 1%, good article rate obviously improves, and the ratio of subsequent disposal such as product polishing reduces more than 50%, has reduced the input cost of subsequent disposal significantly.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Embodiment
Embodiment 1
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 5%, nitric acid 5%, pure water 90%.
Under 25-30 ℃, etch-rate can reach about 3 microns/minute, and thickness evenness after the etching＜1% can keep speed relatively stable in ± 2% concentration deviation, and the etching solution utilization ratio is about 5%.
Embodiment 2
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 15%, nitric acid 10%, pure water 75%.
Under 25-30 ℃, etch-rate can reach about 7 microns/minute, and thickness evenness after the etching＜2% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 15%.
Embodiment 3
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 25%, nitric acid 30%, pure water 45%.
Under 25-30 ℃, etch-rate can reach about 10 microns/minute, and thickness evenness after the etching＜5% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 10%.
Embodiment 4
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 5%, phosphoric acid 5%, pure water 90%.
Under 25-30 ℃, etch-rate can reach about 4 microns/minute, and thickness evenness after the etching＜1% can keep speed relatively stable in ± 2% concentration deviation, and the etching solution utilization ratio is about 5%.
Embodiment 5
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 15%, phosphatase 11 5%, pure water 70%.
Under 25-30 ℃, etch-rate can reach about 7 microns/minute, and thickness evenness after the etching＜2% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 15%.
Embodiment 6
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 25%, phosphoric acid 30%, pure water 45%.
Under 25-30 ℃, etch-rate can reach about 9 microns/minute, and thickness evenness after the etching＜5% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 10%.
Embodiment 7
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 5%, sulfuric acid 5%, pure water 90%.
Under 25-30 ℃, etch-rate can reach about 4 microns/minute, and thickness evenness after the etching＜1% can keep speed relatively stable in ± 2% concentration deviation, and the etching solution utilization ratio is about 5%.
Embodiment 8
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 15%, sulfuric acid 15%, pure water 70%.
Under 25-30 ℃, etch-rate can reach about 7 microns/minute, and thickness evenness after the etching＜2% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 15%.
Embodiment 9
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 25%, sulfuric acid 30%, pure water 45%.
Under 25-30 ℃, etch-rate can reach about 10 microns/minute, and thickness evenness after the etching＜5% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 10%.
Embodiment 10
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 5%, nitric acid 3%, phosphoric acid 2%, pure water 90%.
Under 25-30 ℃, etch-rate can reach about 4 microns/minute, and thickness evenness after the etching＜1% can keep speed relatively stable in ± 2% concentration deviation, and the etching solution utilization ratio is about 5%.
Embodiment 11
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 15%, nitric acid 10%, phosphatase 11 0%, pure water 65%.
Under 25-30 ℃, etch-rate can reach about 7 microns/minute, and thickness evenness after the etching＜2% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 15%.
Embodiment 12
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 25%, nitric acid 20%, phosphatase 11 0%, pure water 45%.
Under 25-30 ℃, etch-rate can reach about 10 microns/minute, and thickness evenness after the etching＜5% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 10%.
Embodiment 13
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 5%, nitric acid 2%, sulfuric acid 3%, pure water 90%.
Under 25-30 ℃, etch-rate can reach about 4 microns/minute, and thickness evenness after the etching＜1% can keep speed relatively stable in ± 2% concentration deviation, and the etching solution utilization ratio is about 5%.
Embodiment 14
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 15%, nitric acid 8%, sulfuric acid 10%, pure water 67%.
Under 25-30 ℃, etch-rate can reach about 7 microns/minute, and thickness evenness after the etching＜2% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 15%.
Embodiment 15
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 25%, nitric acid 10%, sulfuric acid 20%, pure water 45%.
Under 25-30 ℃, etch-rate can reach about 10 microns/minute, and thickness evenness after the etching＜5% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 10%.
Embodiment 16
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 5%, nitric acid 1%, phosphatase 11 %, sulfuric acid 3%, pure water 90%.
Under 25-30 ℃, etch-rate can reach about 4 microns/minute, and thickness evenness after the etching＜1% can keep speed relatively stable in ± 2% concentration deviation, and the etching solution utilization ratio is about 5%.
Embodiment 17
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 12%, nitric acid 2%, phosphoric acid 3%, sulfuric acid 10%, pure water 73%.
Under 25-30 ℃, etch-rate can reach about 7 microns/minute, and thickness evenness after the etching＜2% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 15%.
Embodiment 18
Flat glass substrate attenuation etching liquid comprises the moiety of following weight percent: hydrofluoric acid 25%, nitric acid 8%, phosphoric acid 8%, sulfuric acid 14%, pure water 45%.
Under 25-30 ℃, etch-rate can reach about 10 microns/minute, and thickness evenness after the etching＜5% can keep speed relatively stable in ± 1% concentration deviation, and the etching solution utilization ratio is about 10%.
Flat glass substrate attenuation etching liquid of the present invention is that the technology implementation of 0.5mm is as follows with the glass substrate of TFT-LCD (Thin Film Transistor-LCD) from the 1.0mm attenuate:
With size is 300*351mm, thickness is that the glass substrate of the TFT-LCD (Thin Film Transistor-LCD) of 1.000mm seals with acidproof UV envelope frame glue in the slit all around, after the cleaning of etching front surface, glass substrate is erect in the etching anchor clamps that are positioned over special use, being soaked into preparation has in the etching bath of etching solution of the present invention, control the etching solution temperature simultaneously at 25 ℃-30 ℃, through about 1 hour, glass substrate is proposed, again through flushing, processing such as air-dry can reach the thickness of target glass substrate, the thickness evenness of measuring glass substrate is less than 2%, and thickness is in 0.5mm ± 0.010mm scope.
Flat glass substrate attenuation etching liquid of the present invention is applied in the etching reduction processing technology of glasswork, glasswork can be to show the product flat glass substrate, also can be that LCD (liquid-crystal display/screen), PDP (plasma display/screen), TP (touch-screen), OLED (organic light-emitting diode (OLED) display screen) etc. show other glasswork outside the product flat glass substrate.
It should be noted last that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (3)
1. a flat glass substrate attenuation etching liquid is characterized in that, comprises the moiety of following weight percent: hydrofluoric acid 5-25%, strong acid 5-30%, pure water 45-90%;
Described strong acid is nitric acid and phosphoric acid, wherein nitric acid 3-20%, phosphoric acid 2-10%.
2. a flat glass substrate attenuation etching liquid is characterized in that, comprises the moiety of following weight percent: hydrofluoric acid 5-25%, strong acid 5-30%, pure water 45-90%;
Described strong acid is nitric acid and sulfuric acid, wherein nitric acid 2-10%, sulfuric acid 3-20%.
3. a flat glass substrate attenuation etching liquid is characterized in that, comprises the moiety of following weight percent: hydrofluoric acid 5-25%, strong acid 5-30%, pure water 45-90%;
Described strong acid is nitric acid, phosphoric acid and sulfuric acid, wherein nitric acid 1-8%, phosphatase 11-8%, sulfuric acid 3-14%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100562639A CN101215099B (en) | 2008-01-16 | 2008-01-16 | Flat glass substrate attenuation etching liquid |
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|---|---|---|---|
| CN2008100562639A CN101215099B (en) | 2008-01-16 | 2008-01-16 | Flat glass substrate attenuation etching liquid |
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| CN101215099A CN101215099A (en) | 2008-07-09 |
| CN101215099B true CN101215099B (en) | 2011-02-02 |
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| CN101774767B (en) * | 2010-02-08 | 2012-08-22 | 绵阳艾萨斯电子材料有限公司 | Glass substrate etching solution for flat display |
| US20130125590A1 (en) * | 2011-11-23 | 2013-05-23 | Jiangwei Feng | Reconditioning glass-forming molds |
| CN103253868B (en) * | 2012-02-17 | 2016-01-13 | 江西沃格光电股份有限公司 | The thining method of the thinning pretreatment fluid of liquid crystal display and liquid crystal display |
| CN102643027B (en) * | 2012-04-26 | 2015-01-07 | 深圳南玻显示器件科技有限公司 | Glass etching liquid and glass etching method |
| US9745220B2 (en) | 2013-06-21 | 2017-08-29 | Corning Incorporated | Etch rate enhancement at low temperatures |
| JP6535226B2 (en) * | 2014-07-11 | 2019-06-26 | 東京応化工業株式会社 | Glass processing method, glass etching solution, and glass substrate |
| CN104445971B (en) * | 2014-11-24 | 2017-02-01 | 京东方科技集团股份有限公司 | Etching solution |
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| CN115703670A (en) * | 2021-08-06 | 2023-02-17 | 江西华派光电科技有限公司 | Glass etching thinning process and etching solution |
| CN114292030A (en) * | 2021-12-29 | 2022-04-08 | 武汉创维光显电子有限公司 | Glass substrate thinning method, glass panel and electronic equipment |
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