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CN101200014B - 散热装置的制造方法 - Google Patents

散热装置的制造方法 Download PDF

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CN101200014B
CN101200014B CN2006101575266A CN200610157526A CN101200014B CN 101200014 B CN101200014 B CN 101200014B CN 2006101575266 A CN2006101575266 A CN 2006101575266A CN 200610157526 A CN200610157526 A CN 200610157526A CN 101200014 B CN101200014 B CN 101200014B
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pedestal
heat
radiating fin
heat abstractor
manufacture method
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CN101200014A (zh
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李伟
邓根平
吴宜强
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to US11/681,724 priority patent/US20080142193A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00Making other particular articles
    • B21D53/02Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/08Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of both metal tubes and sheet metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49377Tube with heat transfer means
    • Y10T29/49378Finned tube

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置的制造方法,其步骤包括:备置一基座、若干散热鳍片、若干薄片及焊接剂,其中所述薄片由耐高温材料组成,其一面具有粘性以粘附于基座上,该基座具有焊接面,焊接面上设有上下贯穿的孔,该散热鳍片具有焊接部;将该薄片牢固地粘附在基座的焊接面上以覆盖所述贯穿孔;设置该焊接剂于基座的焊接面与散热鳍片的焊接部之间,并组装整个散热装置;加热该散热装置,使焊接剂熔融涂布于基座的焊接面及散热鳍片的焊接部;冷却该散热装置,通过焊接剂冷却凝固使基座、散热鳍片紧密焊接在一起。由此,防止了锡膏进入贯穿孔发生堵塞,操作简便易于实施。

Description

散热装置的制造方法
技术领域
本发明涉及一种散热装置的制造方法,特别是指一种用于电子元件上的散热装置的制造方法。
背景技术
随着信息技术的飞速发展,计算机中央处理器的运算速度越来越快,其产生的热量也越来越多,而过多的热量若无法及时排出,将严重影响中央处理器运行时的稳定性。为此,业界通常在中央处理器顶面装设一散热装置,利用风扇与散热器的组合来协助排出热量,以确保中央处理器在适当的温度下正常工作。
现有的散热装置往往包括一贴附于中央处理器上的基座以及焊接在基座上的散热鳍片,并于基座上设有若干贯穿孔以结合螺丝将散热装置固定于中央处理器上。但是在基座与散热鳍片的焊接过程中,所述贯穿孔容易被锡膏与松香堵住,影响散热装置的安装。
基于上述不足,业界在焊接前使用螺丝螺锁进所述螺孔,基座与散热鳍片焊接完毕以后再将螺丝取出,从而防止焊接过程中锡膏与松香落入堵住贯穿孔。然而,若螺丝锁得较浅,贯穿孔仍然会被堵塞;若螺丝锁得较深,会穿透基座表面将散热鳍片顶起,影响基座与散热鳍片的热传效果。
发明内容
本发明旨在提供一种操作简便、易于实施且用于避免散热装置的贯穿孔堵塞的制造方法。
一种散热装置的制造方法,包括如下步骤:
备置一基座、若干散热鳍片、若干薄片及焊接剂,其中所述薄片由耐高温材料组成,其一面具有粘性以粘附于基座上,该基座具有焊接面,焊接面上同时设有若干上下贯穿的孔,该散热鳍片具有焊接部;
将上述薄片牢固地粘附在基座的焊接面上以覆盖所述贯穿孔;
涂附该焊接剂于基座的焊接面与散热鳍片的焊接部之间,并组装整个散热装置;
加热该散热装置,使焊接剂熔融涂布于基座的焊接面及散热鳍片的焊接部;
冷却该散热装置,通过焊接剂冷却凝固使基座、散热鳍片紧密焊接在一起。
本发明散热装置的制造方法通过在基座的贯穿孔上贴附耐高温薄片,以避免锡膏进入贯穿孔发生堵塞操作简便易于实施。
下面参照附图,结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明散热装置的立体分解图。
图2是图1散热装置的局部组合图。
图3是图1散热装置的组合图。
具体实施方式
请参阅图1至图3,本发明提供一种散热装置的制造方法,主要步骤包括:
(一)备置该散热装置的基座10、二热管20、若干散热鳍片30、若干薄片40以及焊接剂(图未示),其中该焊接剂具有助焊剂(如松香)用以辅助焊接;
该基座10呈一板状体,其底面为光滑平面,与一电子元件(图未示)表面接触。该基座10上表面为焊接面15,其顶部设有二容置热管20的凹槽12,所述二凹槽12纵向延伸,其前端相互平行且邻接,末端分叉,共同形成一“Y”状结构。基板10上设有贯穿焊接面15与下表面的带有内螺纹的四贯穿孔14,以供螺丝(图未示)将其螺锁固定于电子元件上。
热管20的横截面大致呈椭圆形,其形状与凹槽12对应呈“Y”状。二热管20包括靠近的吸热段21及连接吸热段的分开的放热段22。热管20置于凹槽12内后,其上表面与基座10上表面平齐。其中热管20的吸热段21置于贯穿孔14的中间以接近电子元件,放热段22离电子元件较远。
薄片40由耐高温材料组成,以克服焊接过程中高温的影响。薄片40形状不限,在本实施例中大致呈正方形。薄片40一表面带有粘性,以牢固粘附在基座10的贯穿孔14的上,防止焊接过程中焊接剂流入贯穿孔14内引起堵塞。
每一散热鳍片30为一片状金属体,各散热鳍片30相互平行并垂直于基座10上表面,并于其底部弯折形成若干平行基座10的折缘,以形成散热鳍片30的焊接部33。所述散热鳍片30横向垂直热管20放置。
(二)将薄片40牢固地粘附在基座10焊接面15上,并使薄片40覆盖于贯穿孔14上;
(三)组装该散热装置,在基座10的焊接面15及基座10的凹槽12表面涂抹糊状的焊接剂,然后将热管20对应放置于凹槽12内,并在热管20上表面也涂抹焊接剂后将散热鳍片30放置于基座10及热管20上;
(四)对该组装后的散热装置进行加热,使焊接剂熔融涂布于基座10、热管20、散热鳍片30之间;
(五)冷却该散热装置,焊接剂冷却凝固即可将热管20焊接至凹槽12内、将散热鳍片30紧密焊接于基座10及热管20表面。
至此,本发明散热装置的制造过程完毕,最后基座上形成了深度与基座相等的孔,孔的开口朝下,便于螺丝从下方旋入。
与现有技术相比,该散热装置的制造方法使用薄片40粘附于贯穿孔14上有效避免了在焊接过程中焊接剂流入贯穿孔14中,由此在焊接之前不需在贯穿孔14内预先安装螺丝,从而避免了在焊接前安装螺丝以及焊接后拆卸螺丝的繁琐过程,操作简便易于实施,并保证了散热鳍片30与基座10的平稳焊接,使整个散热装置焊接后牢固紧靠。

Claims (6)

1.一种散热装置的制造方法,包括如下步骤:
备置一基座、若干散热鳍片、若干薄片及焊接剂,其中所述薄片由耐高温材料组成,其一面具有粘性以粘附于基座上,该基座具有焊接面同时设有若干上下贯穿的孔,该散热鳍片具有焊接部;
将该薄片粘附在基座的焊接面上以覆盖所述贯穿孔;
涂附该焊接剂于基座的焊接面与散热鳍片的焊接部之间,使散热鳍片的焊接部贴附于基座的焊接面上;
加热该散热装置,使焊接剂熔融涂布于基座的焊接面及散热鳍片的焊接部;
冷却该散热装置,通过焊接剂冷却凝固使基座、散热鳍片紧密焊接在一起。
2.如权利要求1所述的散热装置的制造方法,其特征在于:所述基座顶部设有二凹槽,二热管容置于凹槽内。
3.如权利要求2所述的散热装置的制造方法,其特征在于:所述热管与基座及散热鳍片焊接。
4.如权利要求3所述的散热装置的制造方法,其特征在于:所述二凹槽于基座上纵向延伸,且并排呈一“Y”状。
5.如权利要求2所述的散热装置的制造方法,其特征在于:所述二热管包括相互靠近的吸热段及分开的放热段,所述贯穿孔分布于该热管吸热段两侧。
6.如权利要求1所述的散热装置的制造方法,其特征在于:所述散热鳍片为一片状金属体,其底部弯折形成若干平行基座的折缘,以形成散热鳍片的焊接部。
CN2006101575266A 2006-12-13 2006-12-13 散热装置的制造方法 Expired - Fee Related CN101200014B (zh)

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US11/681,724 US20080142193A1 (en) 2006-12-13 2007-03-02 Method of manufacturing a heat dissipation device and a heat dissipation device obtained thereby

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CN101998809A (zh) * 2009-08-26 2011-03-30 富瑞精密组件(昆山)有限公司 散热装置
CN102802377A (zh) * 2011-05-26 2012-11-28 讯凯国际股份有限公司 具有并列式热管的散热器及其制作方法
CN104253097B (zh) * 2013-06-27 2017-02-01 纬创资通股份有限公司 散热装置及通过注塑体接合形成的散热装置的制造方法
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