CN101193526A - Heat radiation method for high-power electronic part and heat radiation device using this method - Google Patents
Heat radiation method for high-power electronic part and heat radiation device using this method Download PDFInfo
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Abstract
The invention relates to a technology for heat dissipation, in particular, a method of heat dissipation and a device of heat dissipation for a large power electronic device. The invention adopts a two-level cyclic cooling device, among which, a first level cooling device is a cyclic liquid cooling device, and the cyclic liquid of the cyclic liquid cooling device exchanges heat with a radiator fixed with a heating electronic device so as to cool the heating device on the radiator; while a second cyclic cooling device is a heat pump refrigerating plant which cools the cyclic liquid. The invention cools the large power electronic device by combining liquid cooling and evaporative cooling. The invention has the advantages of small volume, manageable temperature, low noise, low cost, and high efficiency of heat exchange, etc.
Description
Technical field
The present invention relates to a kind of heat dissipation technology and heat abstractor of electronic device, the heat abstractor of particularly a kind of high-power electronic device heat dissipating method of the electronic device that is used for big dissipation power and this method of use.
Background technology:
Power electronic element is mainly used in the electric power change of current, rectifying installation, and driven by power equipment is in the power amplification in broadcasting/transmission of television, forwarding unit and the high-power communication apparatus, power absorption, the large power supply.Under big electric current and powerful operating state, the dissipation power of these electronic devices is very big usually, especially for the power amplifier tube in digital broadcasting/transmission of television, forwarding unit and the high power digital communication apparatus.In order to reduce cost, reduce volume, all developing to improving single tube power output direction, corresponding dissipation power also improves greatly, therefore will produce a large amount of heats when operate as normal.These heats are if untimely derivation effectively will make the working temperature of electronic device raise rapidly, thereby directly influence the reliability service of electronic equipment, and shorten the working life of electronic equipment greatly.
Have three kinds for traditionally the method for these high-power electronic device coolings, a kind of is air blast cooling; A kind of is liquid cooling; Another kind is an evaporative cooling.
Air blast cooling is that the electronic component that will generate heat is installed on the radiator, by fan the relative cold air of surrounding environment is blown on the fin of radiator and take away heat, the shortcoming of this cooling means is: concerning high power device, because the heat that produces is big, taking away these heats just needs the radiator that a bulky high thermal conductivity can material, and therefore the result who causes is that volume, weight, the cost of cooling system improves greatly; Need the blower fan of a plurality of big flows that radiator is forced blowing,, therefore make the overall dimension of electronic equipment and cost improve greatly because the flow of blower fan and overall dimension and cost are directly proportional; Adopt the electronic equipment of air blast cooling to require very high to ambient temperature, humidity and cleannes, these powerful electronic equipments generally can only be in office work, and needing to install powerful air conditioner freezes, dehumidifies, cleanliness factor for the air that guarantees to enter the electronic equipment internal cooling, also need to install dirt catcher additional air is filtered dirt, so just strengthen windage, reduced the efficient of blower fan; Blower fan produces very big noise when work, surrounding environment is had very big harmful effect; Therefore, air blast cooling only is suitable for low power electronic equipment, or be operated in the good environment in, the small power electric subset.
Evaporative cooling is to adopt water, ammonia, CO traditionally
2, SO
2Deng as cold-producing medium, heater element is installed on the evaporation plate, and low-pressure, liquid refrigerant is evaporated in evaporation plate and absorbed heat, and by being installed in the outer or outdoor condenser of machine the refrigerator vapor condensation is become liquid, and cycle heat exchange makes the electronic component cooling.Because the ammonia toxic side effect adopts water, CO usually
2, SO
2Deng making cold-producing medium, and adopt this cold-producing medium the cooling system off-premises station or bulky, cost is high, and is more suitable to the electronic equipment of super high power.Now, the people is also arranged in research and utilization Buddhist Lyons or the method electronic equipment cooled off as the refrigerating system of cold-producing medium of the substitute in Buddhist Lyons, this refrigerating method is owing to be used for domestic air conditioning and refrigerator in a large number, make the refrigeration plant cost reduce greatly, it is a refrigerating method that market prospects are arranged very much, but because this transpiration-cooled thermal inertia is big, the difficult control of temperature, make electronic component cold excessively easily, thereby reduce the useful life of electronic equipment, therefore to be actually used in the cooling system of electronic equipment, also need to carry out a large amount of research.
Liquid cooling is by water at low temperature, wet goods liquid heat-conducting medium, in the conduit in the coldplate of heater element is installed with certain traffic flow, and the heat that heater element produces is taken away in absorption, the cooling fluid that has absorbed heat is drained, or to cooling fluid employing air blast cooling, recycle, thereby realize the heat-generating electronic elements cooling purpose.This method efficiently solves that the electronic equipment volume is huge, noise is big, to the demanding problem of operational environment, simultaneous temperature is easy to control.Shortcomings such as but that adopts at present carries out the method that outdoor air blast cooling is cooled off to cooling fluid, and it is not high to exist radiating efficiency, and outdoor cooling segment is bulky; What in addition the coldplate of heater element cooling is adopted at present is as shown in Figure 1, 2 structure, radiator 1 is to be formed by the materials processing of heat conduction good metal, process a plurality of cooling fluid through holes 35 at the length direction of radiator 1, the two ends of the cooling fluid through hole 35 of radiator 1 are provided with the U type pipe 23 that connects cooling fluid through hole 35, form snakelike cooling passage; Heater element 2 usefulness welding, crimping, the method that is spirally connected are fixed on the radiator 1 of cooling passage top.The heat that heater element produced in when work is transmitted in the cooling fluid that circulates with certain flow rate by radiator and is pulled away, to reach cooling purpose.There is the shortcoming that consumptive material is many, processing cost is high in this heating panel.
Therefore, adopt which kind of method, provide a kind of price low, the heat abstractor that is used for high-power electronic device that volume is little, heat exchange efficiency is high is a difficult problem of high-power electronic device manufacturing.
Summary of the invention:
Technical problem to be solved by this invention is, the existing deficiency of heat abstractor at existing above-mentioned high-power electronic device, a kind of radiating effect that improves big power consumption electronic original part is provided, the useful life of improving the electronic equipment reliability of operation and improving electronic equipment, reduce the size of electronic equipment itself and the size of cooling system, make it miniaturization, microminiaturization, be convenient to processing, the heat abstractor of the high-power electronic device heat dissipating method that cost is low and this method of use.
Above-mentioned technical problem of the present invention is realized by following technical scheme.
A kind of high-power electronic device heat dissipating method, adopt the two-stage cooling back installation, wherein: first order cooling back installation is the circulation fluid cooling device, circulation fluid in the described circulation fluid cooling device carries out heat exchange with the radiator that heat-generating electronic elements is housed, and the heater element on the radiator is cooled off; Second level cooling back installation is the heat pump refrigerating device, and described heat pump refrigerating device cools off circulation fluid.
Described high-power electronic device heat dissipating method is characterized in that: the liquid-solid phase point of the cooling fluid in the described circulation fluid cooling device is not less than subzero 20 ℃, and boiling point is not less than 90 ℃.
Described high-power electronic device heat dissipating method is characterized in that: the cooling fluid in the described circulation fluid cooling device is 30%～60% the ethylene glycol aqueous solution, and adds certain proportion anticorrisive agent and stabilizer, or water or oil.
Described high-power electronic device heat dissipating method is characterized in that: described circulation fluid cools off by the vaporization chamber of described heat pump refrigerating device.
The present invention also provides a kind of high-power electronic device heat abstractor that adopts above-mentioned heat dissipating method.
A kind of high-power electronic device heat abstractor that adopts said method comprises; Radiator, circulation fluid cooling device and the heat pump refrigerating device of electronic device are installed, it is characterized in that:
Be provided with the circulation fluid passage in the described radiator;
Described circulation fluid cooling device comprises liquid storage cooling tank and circulating pump, and the outlet of liquid storage cooling tank connects the inlet of radiator circulation fluid passage by circulating pump, and the outlet of radiator circulation fluid passage connects the inlet of liquid storage cooling tank by return duct;
Described heat pump refrigerating device comprises compression pump, condenser and evaporator, and described evaporator is arranged in the described liquid storage cooling tank, and the compression delivery side of pump connects the inlet of condenser, and the outlet of condenser connects the inlet of evaporator, and the outlet of evaporator connects the inlet of compression pump.
Described high-power electronic device heat abstractor is characterized in that: described radiator is rectangle radiating tube or square-outside and round-inside radiating tube, and described high-power electronic device is fixedly arranged on the outer surface of described radiating tube; The radiating tube of described formation radiator is a plurality of, is connected to become the series connection coil-type radiator with the U-shaped pipe to each other; Or two ends are connected to become the multitube parallel radiator with many siphunculus.
Described high-power electronic device heat abstractor is characterized in that: the endoporus of described radiating tube is provided with longitudinal fin.
Described high-power electronic device heat abstractor is characterized in that: the outlet of circulating pump in described circulation fluid cooling device is provided with knockout, connects a plurality of radiators respectively by knockout.
Described high-power electronic device heat abstractor is characterized in that: be provided with injection spray pipe in the inlet of described liquid storage cooling tank; Described return duct connects the injection spray pipe in the liquid storage cooling tank inlet.
Described high-power electronic device heat abstractor is characterized in that: be connected in series pressure sensor between the circulating pump of described circulation fluid cooling device and the radiator, be connected in series temperature sensor and flowmeter between the inlet of radiator and liquid storage cooling tank.
Described high-power electronic device heat abstractor is characterized in that: described liquid storage cooling tank is made up of for three layers inner bag, heat-insulation layer and shell, and heat-insulation layer is located between inner bag and the shell; Top in tank body is provided with permeability cell, is provided with dust cover in the permeability cell.
The invention has the advantages that:
Adopt liquid cooling high-power electronic component to be cooled off, have that volume is little, easy temperature control system, noise is low, cost is low, the heat exchange efficiency advantages of higher in conjunction with evaporative cooling.
In order to illustrate method of the present invention, apparatus structure, effect better, enumerate specific embodiment now and also be described in detail in conjunction with the accompanying drawings.
Description of drawings
Fig. 1 is the front view of existing high-power electronic device liquid cooling heat radiator.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is a high-power electronic device construction for heat radiating device schematic diagram of the present invention.
Fig. 4 is the front view of the radiator in the high-power electronic device heat abstractor of the present invention.
Fig. 5 is the vertical view of Fig. 4 radiator.
Fig. 6 is the radiating tube schematic cross-section of pie graph 4 radiators.
Fig. 7 is the high-power electronic device scheme of installation.
Fig. 8 is Fig. 7 vertical view.
Fig. 9 is a kind of embodiment schematic diagram of high-power electronic device heat abstractor liquid storage cooling tank of the present invention.
Figure 10 is Fig. 9 sectional view.
Figure 11 is the another kind of embodiment schematic diagram of high-power electronic device heat abstractor liquid storage cooling tank of the present invention.
Figure 12 is the sectional view of Figure 11.
Embodiment
A kind of high-power electronic device heat dissipating method provided by the present invention, this method adopts the two-stage cooling back installation, wherein: first order cooling back installation is the circulation fluid cooling device, circulation fluid in the described circulation fluid cooling device carries out heat exchange with the radiator that heat-generating electronic elements is housed, and the heater element on the radiator is cooled off; Second level cooling back installation is the heat pump refrigerating device, and described heat pump refrigerating device cools off circulation fluid.The liquid-solid phase point of the cooling fluid in the described circulation fluid cooling device is not less than subzero 20 ℃, and boiling point is not less than 90 ℃.Thereby reach the operating temperature range of control cooling fluid, avoid Yin Wendu to cross low or too high and cause component failure.Specifically be to adopt 30%～60% the ethylene glycol aqueous solution, and adding certain proportion anticorrisive agent and stabilizer, adopt 30%～60% the ethylene glycol aqueous solution, and add the certain proportion anticorrisive agent and stabilizer is done cooling fluid, can reduce the corrosion of cooling fluid, prolong the useful life of cooling system the metal surface.Also can adopt the substitute R600a in Buddhist Lyons.Also can be water or oil
Described circulation fluid cools off by the evaporator room of described heat pump refrigerating device.
The present invention also provides a kind of high-power electronic device heat abstractor that adopts above-mentioned heat dissipating method.Fig. 3 is a high-power electronic device construction for heat radiating device schematic diagram of the present invention.As shown in the figure, high-power electronic device heat abstractor of the present invention comprises; Radiator 1, circulation fluid cooling device 20 and the heat pump refrigerating device 30 of electronic device are installed, wherein: be provided with circulation fluid passage 19 in the described radiator 1; Described circulation fluid cooling device 20 comprises liquid storage cooling tank 8 and circulating pump 15, the outlet of liquid storage cooling tank 8 connects the inlet of the circulation fluid passage 19 of radiator 1 by circulating pump 15, and the outlet of the circulation fluid passage 19 of radiator 1 connects the inlet of liquid storage cooling tank 8 by return duct 5;
Described heat pump refrigerating device 30 comprises compression pump 14, condenser 12 and evaporator 7, described evaporator 7 is arranged in the liquid storage cooling tank 8 of described circulation fluid cooling device 20, the outlet of compression pump 14 connects the inlet of condenser 12, the outlet of condenser 12 connects the inlet of evaporator 7, the outlet of evaporator 7 connects the inlet of compression pump 14, forms a refrigeration cycle.Between the evaporator 7 of described heat pump refrigerating device 30 and condenser 12, also be serially connected with fluid reservoir 11 and expansion valve 10, between compression pump 14 and condenser 12, also be serially connected with oil water separator 13.Described heat pump refrigerating device 30, i.e. air conditioner in the household electrical appliances also can be made up of outside the cabinet or machine room that described off-premises station can be arranged at high-power electronic device indoor set and off-premises station two parts.
The heat that heat-generating electronic elements 2 produces is derived heat by the cooling fluid in the radiator circulation fluid passage 19.Specifically be, the cooling fluid 6 through being cooled to uniform temperature produces certain flow by liquid pump 15, enters in the circulation fluid passage 19 of radiator 1 through woven hose 18, and cooling fluid mobile heat of taking away the heater element generation in radiator circulation fluid passage 19 also heats up; The cooling fluid that has been heated flow back into liquid storage cooling tank 8 through return duct 5; So far finish first order liquid cooling circulation cooling.
Liquid refrigerant enters evaporator 7 from fluid reservoir 11 through expansion valve 10, and the vaporization of expanding in evaporator 7 absorbs a large amount of heats, liquid storage cooling tank 8 internal temperatures that evaporator 7 is set is reduced, as the refrigerating chamber or the refrigerating chamber of refrigerator; Temperature in the liquid storage cooling tank 8 can be regulated as required automatically.The high temperature coolant that has absorbed heat enters liquid storage cooling tank 8 and carries out heat exchange with evaporator 7, with and reach to the cooling fluid cooling purpose, compressor 14 extracts evaporator mesolow gaseous refrigerant and makes it supercharging becomes high temperature and high pressure gaseous refrigerant, enter condenser 12 through oil water separator 13, condenser 12 through air blast cooling in the surrounding air heat-shift, make cold-producing medium liquefaction, enter fluid reservoir 11, finish the double evaporation-cooling cool cycles.
A kind of embodiment schematic diagram of liquid storage cooling tank shown in Figure 9.The liquid storage cooling tank has two major functions, and the one, the storage cooling fluid, the 2nd, in the liquid storage cooling tank, carry out evaporative cooling.In order to make cooling fluid in described liquid storage cooling tank 8, better carry out heat exchange, in the inlet of described liquid storage cooling tank 8, be provided with injection spray pipe 9; Described return duct 5 connects the injection spray pipe 9 in liquid storage cooling tank 8 inlets.By injection spray pipe 9 with the cooling fluid atomizing spray on evaporator 7 surfaces, carry out heat exchange with cold-producing medium in the evaporator 7, to reach to the cooling fluid cooling purpose.The cooling fluid of taking away the heater element heat enters injection spray pipe 9 from cooling liquid inlet 7, several spray heads are installed above the injection spray pipe 9, make cooling fluid atomizing or half atomizing spray to evaporator 7 surface cool, cooling fluid enters the electronic equipment cooling that circulates from cooling liquid outlet; Cold-producing medium enters evaporator 7 from refrigerant inlet 87, and absorbs the heat of vaporization gasification of cooling fluid, enters compressor from refrigerant outlet 88 and finishes the evaporative cooling circulation;
For preventing that the cold in the liquid storage cooling tank 8 scatters and disappears, described liquid storage cooling tank 8 is made up of inner bag 81, heat-insulation layer 82 and shell 83, and shown in Fig. 9,10,11, heat-insulation layer 82 is located between inner bag 81 and the shell 83; Be provided with permeability cell 84 in the top of tank body 8, permeability cell 84 is provided with dust cover 85.The main effect of permeability cell 84 and dust cover 85 has 2, and the one, make that air links to each other with ambient atmosphere in the case, the case inner and outer air pressure is equated, another effect is to be the additional cooling fluid of liquid reserve tank by permeability cell 84; Evaporator 7 usefulness supports are fixed on the liquid reserve tank inwall; Injection spray pipe 9 is fixed on the case lid, and can dismantle together in company with case lid, to be convenient to maintenance.As shown in figure 11, evaporator also can adopt the mode of immersion to cool off.
Be connected in series pressure sensor 16 between the circulating pump of described circulation fluid cooling device and the radiator, between the inlet of radiator and liquid storage cooling tank, be connected in series temperature sensor 3 and flowmeter 4.Temperature sensor 3, flowmeter 4, pressure sensor 16 are finished the monitoring of temperature in the system, flow and pressure, to realize automatic control.
Outlet of circulating pump in described circulation fluid cooling device is provided with knockout 17 (see figure 3)s, connects a plurality of radiators respectively by knockout, cools off simultaneously for multiple electronic equipment or a plurality of electronic unit.
For realizing second purpose of the present invention, the invention still further relates to a kind of new heat spreader structures, described radiator is rectangle radiating tube or square-outside and round-inside radiating tube, shown in Fig. 4-6.Radiator body is that a kind of external diameter is square radiating tube 22, and internal diameter is oval-shapedly to be made by heat conductivility good metal material, and described high-power electronic device 21 is fixedly arranged on the outer surface of described radiating tube 22; The radiating tube of described formation radiator is a plurality of, is connected to become the series connection coil-type radiator with U-shaped pipe 23 to each other; Or two ends are connected to become the multitube parallel radiator with many siphunculus.
Shown in Figure 4 is that radiating tube passes through loop such as composition such as U type pipe 23 grades; U-shaped pipe 23 is tightly connected with flange 24 with radiating tube; Radiating tube is fixing with bracing frame 25.
It shown in Fig. 7,8 the high-power electronic device scheme of installation., in order to reduce the thermal resistance between heating electronic original part and the radiator, heat-generating electronic elements 21 usefulness scolding tin are welded in earlier on the red copper pedestal 26, then the contact-making surface of this module and radiator are coated silicone grease, use screw in compression.Certainly, under the situation of ifs circuit good stability, also better heat-radiation effect can directly heat-generating electronic elements be welded on the radiating tube.
According to test, under the situation of same traffic, the big more radiating effect of the contact-making surface of heat-generating electronic elements and cooling fluid is good more, therefore the square-section is more satisfactory, but because place, four angles, square-section stress is concentrated easy deformation under the situation of thin-walled, therefore, the present invention is an elliptic cross-section with Cross section Design, in order to increase area of dissipation, can process sawtooth on tube wall.Certainly, circular cross-section is convenient to processing, and heat dispersion is inferior to two kinds of fronts.
The endoporus of described radiating tube is provided with longitudinal fin.
Claims (10)
1. high-power electronic device heat dissipating method, adopt the two-stage cooling back installation, wherein: first order cooling back installation is the circulation fluid cooling device, circulation fluid in the described circulation fluid cooling device carries out heat exchange with the radiator that heat-generating electronic elements is housed, and the heater element on the radiator is cooled off; Second level cooling back installation is the heat pump refrigerating device, and described heat pump refrigerating device cools off circulation fluid.
2. high-power electronic device heat dissipating method according to claim 1 is characterized in that: the liquid-solid phase point of the cooling fluid in the described circulation fluid cooling device is not less than subzero 20 ℃, and boiling point is not less than 90 ℃.
3. high-power electronic device heat dissipating method according to claim 1, it is characterized in that: the cooling fluid in the described circulation fluid cooling device is 30%～60% the ethylene glycol aqueous solution, and add certain proportion anticorrisive agent and stabilizer, also can adopt water or oil.
4. high-power electronic device heat dissipating method according to claim 1 is characterized in that: described circulation fluid cools off by the vaporization chamber of described heat pump refrigerating device.
5. a high-power electronic device heat abstractor that adopts said method comprises; Radiator, circulation fluid cooling device and the heat pump refrigerating device of electronic device are installed, it is characterized in that:
Be provided with the circulation fluid passage in the described radiator;
Described circulation fluid cooling device comprises liquid storage cooling tank and circulating pump, and the outlet of liquid storage cooling tank connects the inlet of radiator circulation fluid passage by circulating pump, and the outlet of radiator circulation fluid passage connects the inlet of liquid storage cooling tank by return duct;
Described heat pump refrigerating device comprises compression pump, condenser and evaporator, and described evaporator is arranged in the described liquid storage cooling tank, and the compression delivery side of pump connects the inlet of condenser, and the outlet of condenser connects the inlet of evaporator, and the outlet of evaporator connects the inlet of compression pump.
6. high-power electronic device heat abstractor according to claim 5 is characterized in that: described radiator is rectangle radiating tube or square-outside and round-inside radiating tube, and described high-power electronic device is fixedly arranged on the outer surface of described radiating tube; The radiating tube of described formation radiator is a plurality of, is connected to become the series connection coil-type radiator with the U-shaped pipe to each other; Or two ends are connected to become the multitube parallel radiator with many siphunculus; The endoporus of described radiating tube is provided with longitudinal fin.
7. high-power electronic device heat abstractor according to claim 5 is characterized in that: the outlet of circulating pump in described circulation fluid cooling device is provided with knockout, connects a plurality of radiators respectively by knockout.
8. high-power electronic device heat abstractor according to claim 5 is characterized in that: be provided with injection spray pipe in the inlet of described liquid storage cooling tank; Described return duct connects the injection spray pipe in the liquid storage cooling tank inlet.
9. high-power electronic device heat abstractor according to claim 5, it is characterized in that: be connected in series pressure sensor between the circulating pump of described circulation fluid cooling device and the radiator, between the inlet of radiator and liquid storage cooling tank, be connected in series temperature sensor and flowmeter.
10. high-power electronic device heat abstractor according to claim 5 is characterized in that: described liquid storage cooling tank is made up of for three layers inner bag, heat-insulation layer and shell, and heat-insulation layer is located between inner bag and the shell; Top in tank body is provided with permeability cell, is provided with dust cover in the permeability cell.
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|---|---|---|---|
| CNA2006101454721A CN101193526A (en) | 2006-11-20 | 2006-11-20 | Heat radiation method for high-power electronic part and heat radiation device using this method |
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| CNA2006101454721A CN101193526A (en) | 2006-11-20 | 2006-11-20 | Heat radiation method for high-power electronic part and heat radiation device using this method |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102016432A (en) * | 2008-06-12 | 2011-04-13 | 大金工业株式会社 | air conditioner |
| CN102316709A (en) * | 2011-09-10 | 2012-01-11 | 西安飞豹科技发展公司 | Vehicle-mounted high-power liquid cooling equipment |
| CN102364406A (en) * | 2011-09-19 | 2012-02-29 | 浪潮电子信息产业股份有限公司 | A method for controlling dynamic cooling and heat dissipation of a cabinet |
| CN102573425A (en) * | 2012-01-18 | 2012-07-11 | 邬刚 | Energy-saving double-circulation system of machine room |
| CN101827509B (en) * | 2009-03-03 | 2012-09-05 | 赵继永 | Phase-change energy accumulation and temperature control device of sealing equipment |
| CN103490597A (en) * | 2013-09-27 | 2014-01-01 | 深圳市禾望电气有限公司 | Cooling system of converter |
| CN104764291A (en) * | 2015-03-19 | 2015-07-08 | 西安理华节能技术有限公司 | Two-phase liquid cooling system |
| CN105268112A (en) * | 2015-09-10 | 2016-01-27 | 安徽航天生物科技股份有限公司 | Water cooling device for photon therapeutic device LED chip |
| CN105828575A (en) * | 2016-03-28 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Jet flow two-phase heat transfer cold plate and cooling system for track traffic |
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| CN107452697A (en) * | 2016-04-13 | 2017-12-08 | Abb瑞士股份有限公司 | The cooling of wide bandgap semiconductor device |
| CN108121376A (en) * | 2017-12-21 | 2018-06-05 | 北京无线电测量研究所 | A kind of dehydrating unit of the closed electronic equipment of large size liquid-cooling heat radiation |
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| CN109116890A (en) * | 2017-06-26 | 2019-01-01 | 研祥智能科技股份有限公司 | A kind of temperature control system and method |
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| CN115426850A (en) * | 2022-09-21 | 2022-12-02 | 上海分分充新能源技术有限公司 | Mixed liquid cooling system and control method |
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2006
- 2006-11-20 CN CNA2006101454721A patent/CN101193526A/en active Pending
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| CN102016432A (en) * | 2008-06-12 | 2011-04-13 | 大金工业株式会社 | air conditioner |
| CN101827509B (en) * | 2009-03-03 | 2012-09-05 | 赵继永 | Phase-change energy accumulation and temperature control device of sealing equipment |
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| CN102364406A (en) * | 2011-09-19 | 2012-02-29 | 浪潮电子信息产业股份有限公司 | A method for controlling dynamic cooling and heat dissipation of a cabinet |
| CN102573425A (en) * | 2012-01-18 | 2012-07-11 | 邬刚 | Energy-saving double-circulation system of machine room |
| CN102573425B (en) * | 2012-01-18 | 2015-07-08 | 邬刚 | Energy-saving double-circulation system of machine room |
| CN103490597B (en) * | 2013-09-27 | 2016-08-17 | 深圳市禾望电气股份有限公司 | A kind of cooling system of current transformer |
| CN103490597A (en) * | 2013-09-27 | 2014-01-01 | 深圳市禾望电气有限公司 | Cooling system of converter |
| CN104764291A (en) * | 2015-03-19 | 2015-07-08 | 西安理华节能技术有限公司 | Two-phase liquid cooling system |
| CN105268112A (en) * | 2015-09-10 | 2016-01-27 | 安徽航天生物科技股份有限公司 | Water cooling device for photon therapeutic device LED chip |
| CN106790770A (en) * | 2015-11-19 | 2017-05-31 | 中兴通讯股份有限公司 | A kind of water cooling plant, terminal bonnet and mobile terminal |
| CN105828575A (en) * | 2016-03-28 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Jet flow two-phase heat transfer cold plate and cooling system for track traffic |
| CN107452697A (en) * | 2016-04-13 | 2017-12-08 | Abb瑞士股份有限公司 | The cooling of wide bandgap semiconductor device |
| CN107452697B (en) * | 2016-04-13 | 2021-05-11 | Abb瑞士股份有限公司 | Power device, method of cooling a semiconductor module, and method of operating a power device |
| CN105934138A (en) * | 2016-06-16 | 2016-09-07 | 广东合新材料研究院有限公司 | Working medium contact cooling system for high-power electromagnetic generators and working method of working medium contact cooling system |
| CN105934139A (en) * | 2016-06-16 | 2016-09-07 | 广东合新材料研究院有限公司 | Working medium contact cooling system for high-power devices and working method of working medium contact cooling system |
| CN109116890A (en) * | 2017-06-26 | 2019-01-01 | 研祥智能科技股份有限公司 | A kind of temperature control system and method |
| CN109755193A (en) * | 2017-11-01 | 2019-05-14 | 中车株洲电力机车研究所有限公司 | power module life test cooling device |
| CN109755193B (en) * | 2017-11-01 | 2020-09-29 | 中车株洲电力机车研究所有限公司 | Cooling device for service life test of power module |
| CN108121376A (en) * | 2017-12-21 | 2018-06-05 | 北京无线电测量研究所 | A kind of dehydrating unit of the closed electronic equipment of large size liquid-cooling heat radiation |
| CN108278748A (en) * | 2017-12-27 | 2018-07-13 | 宁波奥克斯电气股份有限公司 | The moisture-proof control method and air-conditioning of air conditioner electric control plate |
| CN108278748B (en) * | 2017-12-27 | 2020-10-16 | 宁波奥克斯电气股份有限公司 | Moisture-proof control method for air conditioner electric control board and air conditioner |
| CN109413830A (en) * | 2018-12-28 | 2019-03-01 | 江苏天瑞仪器股份有限公司 | One kind being used for high-power X-ray tube cooling back installation |
| CN111629558A (en) * | 2019-02-28 | 2020-09-04 | Ovh公司 | Cooling device with primary and secondary cooling device for cooling electronic devices |
| CN115426850A (en) * | 2022-09-21 | 2022-12-02 | 上海分分充新能源技术有限公司 | Mixed liquid cooling system and control method |
| CN117780744A (en) * | 2024-02-27 | 2024-03-29 | 智奇铁路设备有限公司 | Hydraulic oil circulation cooling device |
| CN117780744B (en) * | 2024-02-27 | 2024-05-10 | 智奇铁路设备有限公司 | Hydraulic oil circulation cooling device |
| CN118442729A (en) * | 2024-07-05 | 2024-08-06 | 天津欧适能新能源科技有限公司 | Air source heat pump and hydraulic module integrated machine |
| CN118442729B (en) * | 2024-07-05 | 2024-08-30 | 天津欧适能新能源科技有限公司 | Air source heat pump and hydraulic module integrated machine |
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