CN101192066A - Method for obtaining heat dissipation parameters - Google Patents

Abstract

A method for obtaining heat dissipation parameters is applied to an electronic device having at least one heat dissipation fan, a fan speed control unit corresponding to the heat dissipation fan and a temperature measurement unit, wherein the heat dissipation fan is used for dissipating heat of an electronic element of the electronic device, the method comprises providing a signal generator with adjustable duty cycle, and then enabling the signal generator to correspondingly output different fan speed regulation signals to the fan speed control unit of the electronic device by adjusting different duty cycles, so that the fan speed control unit adjusts the rotating speed of the heat dissipation fan according to different fan speed regulation signals, and matches the temperature measurement unit to detect the temperature of the electronic element, so as to perform a heat dissipation test procedure for testing the heat dissipation effect of the heat dissipation fan under the condition of a preset heat dissipation requirement, thereby obtaining the heat dissipation parameters of the heat dissipation fan, thereby being used for establishing a Fan rotating Speed Control (FSC) strategy.

Description

How to get cooling parameters

technical field

The present invention relates to a method for obtaining heat dissipation parameters, more specifically, an electronic device that is applied to at least one heat dissipation fan, a fan speed control unit corresponding to the heat dissipation fan, and a temperature measurement unit, wherein the heat dissipation fan is A heat dissipation parameter acquisition method for heat dissipation of electronic components of the electronic device.

Background technique

With the rapid development of electronic technology, the degree of circuit integration is getting higher and higher, although the volume of electronic products is still decreasing, but at the same time, the sharp increase in heat makes the importance of heat dissipation technology particularly prominent.

Take the central processing unit (CPU) in the most typical server as an example. As we all know, the development of the current central processing unit has stepped into a new direction. The central processing unit of Intel Corporation has begun to adopt the 65nm manufacturing method, and the corresponding The popular product is the "dual-core" (dual-core) processor, although its performance has been improved qualitatively, but the heat has also increased significantly. According to the data, Intel will fully adopt the dual-core architecture in the near future. Servers are no exception. Therefore, the cooling fan mounted on the main board of the server corresponding to the CPU must undergo more rigorous testing before leaving the factory to better meet the heat dissipation needs of the CPU.

In the past, the enterprise's server cooling fan testing process was generally first passed through the heat dissipation test department after the design of the pulse width modulation (PWM) logic circuit on the motherboard was completed, and then handed over to the firmware department to test the chips on the motherboard (such as BMC chips). Write a simple cooling fan control program code to realize the circuit function (that is to say, the chip can output PWM signal through the cooling fan control program code to control the speed of the cooling fan), and then return to the cooling test department to perform the test on the motherboard. The heat dissipation test procedure of the cooling fan, for example, at what temperature, the cooling fan can meet the heat dissipation requirements at the minimum speed (lowest noise); at what temperature, the fan speed can be achieved without fan speed (no noise) According to the requirements of the maximum speed, whether it can meet the requirements of heat dissipation, etc., pass these tests to obtain the relevant parameters of the cooling fan, and finally feed back the relevant parameters to the firmware department, so that the firmware department can formulate the fan speed control according to it ( Fan Speed Control (FSC) strategy, and write the automatic control program of the cooling fan on the motherboard chip according to the fan speed control strategy.

Since the above heat dissipation test program for obtaining the relevant parameters of the heat dissipation fan must wait for the firmware department to preliminarily compile the simple heat dissipation fan control program code based on the logic circuit designed by the heat dissipation test department, it can be carried out without doubt. As a result, the overall heat dissipation test program time is prolonged, and the efficiency is very low.

In addition, the PWM signal generation chip on the motherboard, taking the BMC chip as an example, its function of generating PWM signals is not complete, so it will cause certain restrictions on the speed control of the cooling fan. If you buy a special waveform generator to generate On the one hand, the PWM signal is expensive, and on the other hand, because only the PWM waveform generation function can be used, it will waste the use of equipment.

To sum up, how to provide a method for obtaining heat dissipation parameters to avoid the above existing deficiencies has become a problem to be solved at present.

Contents of the invention

In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a method for obtaining heat dissipation parameters, which can obtain the heat dissipation parameters of the cooling fan by directly performing the heat dissipation test program by simulating PWM signals.

Another object of the present invention is to provide a method for obtaining heat dissipation parameters without waiting for the compilation of a simple heat dissipation fan control program code, so as to shorten the overall heat dissipation test program time and improve work efficiency.

Another object of the present invention is to provide a method for obtaining heat dissipation parameters without speed control limitation.

Another object of the present invention is to provide a low-cost method for obtaining heat dissipation parameters.

In order to achieve the above object, the present invention provides a method for obtaining heat dissipation parameters, which is applied to an electronic device having at least one heat dissipation fan, a fan speed control unit corresponding to the heat dissipation fan, and a temperature measurement unit, wherein the heat dissipation fan is used for the The electronic components of the electronic device dissipate heat, and the method includes the following steps: providing a signal generator with an adjustable duty cycle; and by adjusting different duty cycles, the signal generator outputs different fan speeds accordingly The signal is sent to the fan speed control unit of the electronic device, so that the fan speed control unit adjusts the speed of the cooling fan according to different fan speed control signals, and cooperates with the temperature detection unit to detect the temperature of the electronic component to perform The heat dissipation test program is used to test the heat dissipation effect of the heat dissipation fan under the preset heat dissipation requirements, and then the heat dissipation parameters of the heat dissipation fan can be obtained, so as to formulate a fan speed control (Fan Speed Control; FSC) strategy.

In a preferred embodiment of the present invention, the signal generator is a self-excited oscillation circuit with an adjustable duty cycle; the fan speed regulation signal is a periodic square wave signal; the heat dissipation test program at least includes the following steps: (1) Test whether the heat dissipation requirement cannot be met when the heat dissipation fan is at the maximum speed, if yes, proceed to step (2), if not, proceed to step (3); (2) replace the heat dissipation fan with a higher power, and Return to step (1); and (3) test and obtain at what temperature, the cooling fan can meet the heat dissipation requirement at the minimum speed, and at what temperature, the cooling fan does not need to be operated, This heat dissipation requirement can be met.

Compared with the prior art, the heat dissipation parameter acquisition method of the present invention mainly uses a signal generator to output different fan speed regulation signals according to different duty ratios, that is, the fan speed regulation signal replaces the fan speed regulation signal required in the prior art. The simple cooling fan control program code written in the chip by the firmware department, so that the chip can pass the PWM signal output by the cooling fan control program code to control the speed of the cooling fan, and accordingly, the heat dissipation test can be directly performed program to obtain the heat dissipation parameters of the cooling fan, which not only greatly shortens the overall heat dissipation test program time and improves work efficiency, but also obtains a signal generator (self-excited oscillation circuit) through a simple design, making the heat dissipation test program no speed Control restrictions and the risk of high costs.

Description of drawings

Fig. 1 is a flow chart, in order to illustrate the embodiment step flow of the method for obtaining heat dissipation parameters of the present invention;

Fig. 2 is a block diagram, used for explaining the embodiment of the step flow of the embodiment of the method for obtaining heat dissipation parameters of the present invention;

3 is a circuit diagram for illustrating the working principle of the signal generator used in the method for obtaining heat dissipation parameters of the present invention; and

FIG. 4 is a flow chart for illustrating the steps of the heat dissipation test program in the heat dissipation parameter acquisition method of the present invention.

Description of main component symbols

1 electronic device

10 electronic components

11 cooling fan

12 fan speed control unit

13 temperature measurement unit

2 signal generators

S1 to S2 steps

Steps S10 to S12

Detailed ways

The following is a description of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

Please refer to FIG. 1 and FIG. 2 , which are flow charts and block diagrams respectively, which are used to illustrate the flow of steps in an embodiment of the method for obtaining heat dissipation parameters of the present invention and an embodiment of its application. As shown in the figure, the method for obtaining heat dissipation parameters of the present invention is applied to an electronic device 1 having at least one heat dissipation fan 11, a fan speed control unit 12 corresponding to the heat dissipation fan 11, and a temperature measurement unit 13, wherein the heat dissipation fan 11 is used To dissipate heat from the electronic components 10 in the electronic device 1 .

In this embodiment, the electronic device 1 is implemented as a server (Server), and the electronic component 10 is implemented as a central processing unit (CPU) in the server, and the cooling fan 11 is the CPU in the server Cooling fan 11, of course, other components such as electronic components such as capacitors or inductors that generate heat can also dissipate heat through this cooling fan 11, so the heat dissipation object is not limited to this embodiment, and the electronic device 1 can also be a home computer, etc. As a data processing device, the person to whom the present invention is applied only needs to meet the conditions of having a cooling fan 11 , a fan speed control unit 12 for controlling the speed of the cooling fan 11 , and a temperature measuring unit 13 .

The method for obtaining heat dissipation parameters includes the following steps:

Step S1, providing a signal generator 2 with adjustable duty cycle. In this embodiment, step S1 is to firstly provide a signal generator 2 that can adjust the duty cycle and output the fan speed regulation signal corresponding to the duty cycle. Then proceed to step S2.

Step S2, by adjusting different duty ratios, the signal generator 2 correspondingly outputs different fan speed control signals to the fan speed control unit 12 of the electronic device 1, so that the fan speed control unit 12 adjusts according to different fan speeds. The speed signal adjusts the speed of the cooling fan 11, and cooperates with the temperature detection unit 13 to detect the temperature of the electronic component 10, so as to test the heat dissipation effect of the cooling fan 11 under the preset heat dissipation requirements. According to the heat dissipation test program, the heat dissipation parameters of the heat dissipation fan 11 can be obtained, so as to formulate a fan speed control (Fan Speed Control; FSC) strategy.

In this embodiment, the signal generator 2 is used to output different fan speed control signals to the fan speed control unit 12 of the electronic device 1 by adjusting different duty ratios, so that the fan speed control unit 12. Adjust the speed of the cooling fan 11 according to different fan speed regulation signals, and use the temperature measurement unit 13 to detect the temperature of the electronic component 10, so as to test the cooling fan under the preset heat dissipation requirements. The heat dissipation test program of the heat dissipation effect of the heat dissipation fan 1 can further obtain heat dissipation parameters of the heat dissipation fan, so as to formulate a fan speed control strategy.

Further, please refer to FIG. 3 together. In actual implementation, the signal generator 2 can be a self-excited oscillation circuit with an adjustable duty cycle. As shown in the figure, according to the principle of self-excited oscillation, resistors R1 and R2 form a The positive feedback (feedback) line, when there is an output voltage Vo, feeds back the voltage V+ of the positive phase terminal of the operational amplifier (OP-AMP; Operational Amplifier) (V+=(R1/R1+R2)×Vo). The negative feedback circuit is a charging and discharging circuit composed of a variable resistor Rw, a resistor R4, and a capacitor C.

The operational amplifier is used here as a comparator to compare the voltage Vc and V+ across the capacitor C to determine whether the polarity of the output voltage Vo is positive or negative, and the polarity of Vo determines the current through the capacitor C Whether it is charging (increasing Vc) or discharging (decreasing Vc), and the level of Vc is compared with V+ again to determine the polarity of the output voltage Vo, so that the comparison process is repeated repeatedly, and the output terminal The aforementioned fan speed regulation signal is generated in the self-excited oscillating circuit as a periodic square wave signal, and the frequency of the periodic square wave signal can be calculated according to the following formula 1.

f ₀ =1/2×(Rw+R4)×C×1n(1+2R1/R2)…Formula 1

Based on the above, the change of the duty cycle (T=1/f ₀ ) of the fan speed control signal (ie the periodic square wave signal) can determine the change of the speed of the cooling fan 11, and the diodes D1 and D2 cooperate The variable resistor Rw can realize the adjustable function of the duty cycle of the fan speed control signal (that is, the periodic square wave signal). Specifically, when the variable resistor Rw is adjusted by its adjustable cantilever, the resistance value becomes When it is large, the charging time constant will be greater than the discharging time constant, so that the duty cycle of the fan speed control signal (that is, the periodic square wave signal) increases. Relatively, when the fan speed control signal is sent to the fan speed control When unit 12, then make this cooling fan 11 rotate speeds increase, likewise, variable resistance Rw is adjusted by its adjustable cantilever, when resistance value becomes maximum value, this fan speed regulation signal (that is, this periodical square wave signal ) has the largest duty cycle, thus enabling the cooling fan 11 to run at full speed; on the contrary, the variable resistor Rw is adjusted by its adjustable cantilever so that the resistance becomes smaller, and the fan speed regulation signal (that is, the periodic square wave The duty cycle of the signal) will decrease correspondingly, relatively, the rotating speed of the cooling fan 11 can be reduced. Similarly, the variable resistor Rw is adjusted by its adjustable cantilever so that the resistance value becomes the minimum value , the duty cycle of the fan speed regulation signal (that is, the periodic square wave signal) is the smallest, so that the cooling fan 11 can be reduced to the lowest speed.

From the above description, it can be seen that by adjusting the duty ratio of the fan speed control signal (that is, the periodic square wave signal) generated by the signal generator 2, the function of controlling the speed of the cooling fan 11 can be realized, so as to further match the temperature measurement The unit 13 detects the temperature of the electronic component 10, and performs a heat dissipation test program for testing the heat dissipation effect of the heat dissipation fan 11 under the preset heat dissipation requirements, and after the heat dissipation test program is completed, it can be obtained. The heat dissipation parameters of the heat dissipation fan 11 are used to formulate a fan speed control strategy.

It should be noted that the above-mentioned heat dissipation requirements refer to the conditions that the heat dissipation effect of the heat dissipation fan 11 needs to meet in the heat dissipation test program, which can be parameters such as temperature, and are used to determine whether the heat dissipation effect of the heat dissipation fan 11 is satisfactory. Judgment that meets the heat dissipation requirements.

Next, please refer to FIG. 4 together, which is used to illustrate the embodiment step flow of the heat dissipation test program. The heat dissipation test program at least includes the following steps:

Step S10, testing whether the heat dissipation requirement cannot be met when the cooling fan 11 is at the maximum speed, if yes, proceed to step S11, if not, proceed to step S12;

In step S11, replace the cooling fan 11 with higher power, and return to step S10; and

In step S12, it is tested and obtained at what temperature, the cooling fan 11 can meet the heat dissipation requirement at the minimum speed, and at what temperature, the cooling fan 11 can meet the cooling requirement without running the cooling fan 11. thermal requirements. In this embodiment, step S12 is used to obtain the temperature measured by the temperature measuring unit 13 on the electronic component 10 under the condition of minimum noise and no noise, but this heat dissipation test procedure is only an example for illustration. It is not intended to limit the test procedures that can be performed with this thermal test procedure.

To sum up, the heat dissipation parameter acquisition method of the present invention mainly uses a signal generator to output different fan speed regulation signals according to different duty ratios, that is, the fan speed regulation signal replaces the firmware department in the prior art. The simple heat dissipation fan control program code written in the chip, so that the chip can pass the PWM signal output by the heat dissipation fan control program code to control the speed of the heat dissipation fan, and accordingly, the heat dissipation test program can be directly carried out. In order to obtain the heat dissipation parameters of the heat dissipation fan, it not only greatly shortens the overall heat dissipation test program time and improves work efficiency, but also obtains a signal generator (self-excited oscillation circuit) through simple circuit design, so that the heat dissipation test program has no speed control restrictions and high costs. The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be listed in the claims.

Claims (4)

1. radiation parameter obtaining method, be applied to have at least one radiator fan, in the electronic installation to fan control speed unit that should radiator fan and warm measurement unit, wherein, this radiator fan dispels the heat in order to the electronic component to this electronic installation, and this radiation parameter obtaining method comprises the steps:

The signal generator that can adjust dutycycle is provided; And

By adjusting different dutycycles, make the fan control speed unit of the different fan speed-regulating signal of the corresponding output of this signal generator to this electronic installation, so that the rotating speed of this radiator fan is adjusted in this fan control speed unit according to different fan speed-regulating signals, and this temperature measurement unit of arranging in pairs or groups temperature detecting that this electronic component is carried out, under the condition that requires with the heat radiation that is used to preset, test the heat radiation test procedure of the radiating effect of this radiator fan, and then can obtain the radiation parameter of this radiator fan, thereby for formulating the rotation speed of the fan control strategy.

2. radiation parameter obtaining method according to claim 1, wherein, this signal generator is for adjusting the self-maintained circuit of dutycycle.

3. radiation parameter obtaining method according to claim 1, wherein, this fan speed-regulating signal is a periodic square wave signal.

4. radiation parameter obtaining method according to claim 1, wherein, this heat radiation test procedure comprises the steps: at least

(1) test in this radiator fan during at maximum (top) speed, whether can't meet this heat radiation requirement, if, then proceed to step (2), if not, then proceed to step (3);

(2) change the radiator fan of higher-wattage, and return to step (1); And

(3) test and must under which kind of temperature, this radiator fan is in minimum speed, can meet this heat radiation requirement and under which kind of temperature, do not need the running of this radiator fan, can meet this heat radiation requirement.

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