CN101168217A - Laser array microhole forming device and method - Google Patents

Abstract

The invention discloses a laser array microhole forming device and method. The steps are as follows: setting the microhole plate aperture, hole spacing and hole type parameters, making processing files; setting laser power, pulse width, pulse repetition frequency and pulse number; Setting of positioning scanning parameters; workpiece positioning: visual system positioning, vacuum negative pressure adsorption probe guide plate; setting and opening the auxiliary gas pressure and flow rate, and starting processing; after processing, measure the aperture, hole spacing and hole type parameters. The device includes: high repetition rate, ultra-short pulse ultraviolet solid-state laser, laser beam generator, collimator beam expander, shutter, beam positioning scanning device, CCD visual alignment system, XYZ displacement work platform, vacuum negative pressure adsorption film holder. The beneficial effects of the present invention are: to overcome the defects of the existing mechanical punching methods such as low efficiency, easily damaged “punches” and changes in aperture size, and directly press-cast the dynamic digital hologram on the surface of the precious metal commemorative coin material, making the commemorative coin more Ornamental.

Description

Laser array microhole forming device and method

technical field

The invention relates to a laser precision drilling and processing array microholes on a polymer dielectric insulating material, a laser array microhole forming device for precision machining of array microholes on a probe guide plate of a semiconductor chip test card in the integrated circuit industry with method.

Background technique

Laser micro-hole forming technology is to use the characteristics of the interaction between laser beam and matter to micro-drill materials (including metals and non-metals), involving multi-disciplinary comprehensive technologies such as optics, mechanics, electricity, materials, control and detection. Laser drilling is widely used in high-tech industries such as automobiles, microelectronics, optical communications, aerospace, biomedicine, solar energy and fuel cell new energy, improving or replacing some traditional processing methods. Different from traditional infrared laser beam drilling and thermal energy processing, this invention selects short-wavelength, high-quality ultraviolet solid-state laser beams, designs and manufactures ultraviolet laser focusing systems that reach or approach the diffraction limit, and obtains fine focused beams. The high-energy "cold light" characteristic of drilling micro-hole processing greatly reduces the heat-affected zone at the edge of the aperture and improves the precision of the hole pattern. The semiconductor integrated circuit industry is developing rapidly. Computers, notebook computers, mobile phone circuit boards, and portable consumer electronics use high-density multilayer PCBs, which are compact and miniaturized. The requirements for semiconductor chip production, testing, and packaging continue to increase. The number of pins, high-density and multi-layer circuit boards are developing, and their structures are more compact and their volumes are shrinking. The traditional mechanical drilling or punching methods can no longer meet the development needs of chip circuits to high pin count, high density, and a new generation of multi-layer circuit boards. Laser micro-hole processing is used. The traditional laser drilling is a fixed beam single pulse processing unit micro-hole, the invention adopts the beam deflection scanning mode, the laser beam is controlled by the computer program, and the data file is output to the real object according to the required parameters such as aperture, hole spacing and hole type. processing,

Contents of the invention

The purpose of the present invention is to overcome the shortcomings of the existing semiconductor chip test probe card mechanical punching method, and to provide a laser array micro-hole for precision machining of the micro-holes of the semiconductor chip test card probe guide plate array in the integrated circuit industry. Hole forming apparatus and method.

The technical scheme of the present invention is: a kind of manufacturing method of laser array microhole, and its steps are:

1. Set the hole diameter, hole spacing and hole type parameters required for the probe card array microplate, and make computer-controlled processing files;

2. Start up and set laser parameters: laser power, laser pulse width, pulse repetition frequency and pulse number; setting of beam positioning and scanning parameters;

3. Place workpiece positioning and alignment: vision system registration positioning, vacuum negative pressure adsorption probe guide plate;

4. Set and start the auxiliary gas pressure and flow rate for processing, and start processing;

5. After the micro-hole array is processed, the hole diameter, hole spacing and hole type parameters are measured, and the qualified products are packaged.

A laser array microhole forming device of the present invention is characterized in that it includes: a high repetition rate, ultra-short pulse ultraviolet solid-state laser, a laser beam generator, a collimated beam expander, a shutter, a beam positioning scanning device, a CCD vision Alignment system, XYZ (liftable) precision displacement work platform, vacuum negative pressure adsorption sheet holder.

The beneficial effects of the present invention are: as the density of integrated circuit chips continues to increase, the present invention adopts high repetition frequency and ultra-short pulse ultraviolet laser to process the array microholes, which overcomes the high cost of processing the test card probe guide plate by the existing mechanical punching method. Due to defects such as low density stitches, easy damage to the "punch" of contact processing, and changes in aperture size, the colorful and dynamic digital hologram is directly die-cast on the surface of the precious metal commemorative coin material, making the commemorative coin more ornamental and modern. The characteristics of the integration of high technology and artistry.

Description of drawings

Fig. 1 is a microhole diagram with a vertical hole wall and a test probe guide plate array;

Fig. 2 is a block diagram of a laser array microhole forming device;

Fig. 3 is the structural diagram of Embodiment 1 of the laser array microhole forming device;

Fig. 4 is the structural diagram of Embodiment 2 of the laser array microhole forming device;

Fig. 5 is the manufacturing steps and flowchart of the chip test probe card.

Detailed ways

The diagram of microholes with vertical hole walls and test probe guide plate arrays is shown in Figure 1. The manufacturing method of the laser array microholes on the probe guide plate of the chip test card consists of the following steps, as shown in Figure 5. : 1. Chip test point coordinates and probe specification parameters; 2. Set the aperture, hole spacing and hole type parameters of the arrayed microholes; 3. Make processing files; 4. Turn on the machine and set the laser and system control parameters.

(Laser power, laser pulse width, pulse repetition frequency and pulse number) set beam positioning scanning parameters or rotating beam generator and focusing mirror focus tracking control parameters; 5. Workpiece positioning registration, vacuum suction sheet; 6. Turn on auxiliary gas , Array micro-hole processing; 7. After the processing is completed, the hole diameter, hole spacing and hole type parameters are measured and packaged.

A laser array microhole forming device, as shown in Figure 2, it includes: a high repetition rate, ultra-short pulse ultraviolet solid-state laser 1, a laser beam generator 2, a collimating beam expander 3, a shutter 4, and a beam positioning scanning device 5. CCD visual alignment system 6. XYZ (liftable) precision displacement work platform 7. Vacuum negative pressure adsorption film holder 8.

Example 1:

As shown in Fig. 3, a kind of laser array microhole forming device it comprises: high repetition rate, ultra-short pulse ultraviolet solid-state laser 1, laser beam generator 2, collimating beam expander 3, shutter 4 (laser energy controller ), the described beam positioning scanning device 5 is composed of XY beam positioning scanner 10, telecentric f-theta scanning focusing objective lens 11, CCD vision alignment system 6, XYZ (liftable) precision displacement work platform 7, vacuum negative pressure Adsorption sheet rack 8, array microporous workpiece 9.

Example 2:

As shown in Figure 4, the laser array microhole forming device includes: a high repetition rate, ultra-short pulse ultraviolet solid-state laser 1, laser beam generator 2, collimating beam expander 3, shutter 4 (laser energy controller ), the beam positioning scanning device 5 is composed of an aperture adjustable rotating beam generator 12, a focal plane automatic tracking focusing objective lens 13, a CCD visual alignment system 6, an XYZ (liftable) precision displacement work platform 7, and a vacuum negative pressure Adsorption sheet rack 8, array microporous workpiece 9.

1. Using telecentric f-theta focusing scanning objective lens method:

Set the hole diameter, hole spacing and hole type parameters required by the probe card array microplate, and make computer-controlled processing files: according to the hole diameter, hole spacing, coordinate position and hole type parameters required by the probe card array microplate , to form the control data file of the required processing graphics. Production and processing of microhole array probe guide plate; laser array microhole forming device and main optical path are high repetition rate, ultra-short pulse ultraviolet solid-state laser, laser beam, collimated beam expander, shutter (laser energy controller), XY beam positioning scanner, telecentric f-theta scanning focusing objective lens, CCD visual alignment system, XYZ (liftable) precision displacement work platform, vacuum negative pressure adsorption film holder, array micro-hole workpiece, various parameters and surface finish Meet the specified requirements.

2. Using rotating beam automatic focal plane tracking method:

As above, set the hole diameter, hole spacing and hole type parameters required by the probe card array microplate, and make computer-controlled processing files: according to the hole diameter, hole spacing, coordinate position and hole required by the probe card array microplate Type parameters to form the control data file of the required processing graphics. Production and processing of microhole array probe guide plate; laser array microhole forming device and main optical path are high repetition rate, ultra-short pulse ultraviolet solid-state laser, laser beam, collimated beam expander, shutter (laser energy controller), Aperture adjustable rotating beam generator, focal plane automatic tracking and focusing objective lens, CCD visual alignment system, XYZ (liftable) precision displacement work platform, vacuum negative pressure adsorption film holder, array microporous workpiece, various parameters and surface finish Meet the specified requirements.

Main application features of the present invention: microfabrication of large-scale integrated circuit chip test probe card (Probe Card), multi-layer high-density PCB microchannel drilling, laser fine machining in high-brightness LED chip technology, diamond jewelry micro-engraving, Password anti-counterfeiting micromachining and other means of high hardness, high brittleness, and high-melting point materials that cannot be processed by other means. Fine processing of precision dimensions (micron and sub-micron manufacturing technology); high density (thousands of chips in a 2-inch chip area) micropore) processing, etc. Probe Cards are used before packaging IC integrated circuits and liquid crystal display panels. Probes are used to perform functional tests to screen out defective products and improve the final yield. The future probe card test requirements will face ultra fine pitch (ultra fine pitch), area array testing (area array testing), high pin counts, high test times (high touch down) and low cost (low cost) and other challenges. The newly developed "3D three-dimensional probe card" technology adopts 3D suspension microstructure processing technology, high hardness micro-electroforming technology and other micro/nano precision micro-processing technology, which has broken through the minimum pitch (min.pitch) of traditional manual assembly. ) and the maximum number of pins (max.pin counts), the development of an integrated probe card will promote the development of nano-IC and high-resolution display testing opportunities in the domestic industry in the future.

Claims (4)

1. A manufacturing method of laser array microholes, characterized in that, the method steps are: 1) Set the hole diameter, hole spacing and hole type parameters required by the probe card array microplate, and make computer-controlled processing files; 2) Start up and set laser parameters: laser power, laser pulse width, pulse repetition frequency and pulse number; setting of beam positioning and scanning parameters; 3) Positioning and alignment of workpiece placement: vision system registration positioning, vacuum negative pressure adsorption probe guide plate; 4) Set and start the auxiliary gas pressure and flow rate for processing, and start processing; 5) After the micro-hole array is processed, the hole diameter, hole spacing and hole type parameters are measured, and the qualified products are packaged. 2. A laser array microhole forming device, characterized in that it includes: high repetition rate, ultra-short pulse ultraviolet solid-state laser, laser beam generator, collimated beam expander, shutter, beam positioning scanning device, CCD vision Alignment system, XYZ (liftable) precision displacement work platform, vacuum negative pressure adsorption sheet holder. 3 . The laser array microhole forming device according to claim 2 , wherein the beam positioning and scanning device is composed of an XY beam positioning scanner and a telecentric f-theta scanning focusing objective lens. 4 . 4 . The laser array microhole forming device according to claim 2 , wherein the beam positioning and scanning device is composed of a rotating beam generator with adjustable aperture and a focal plane auto-tracking focusing objective lens.

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