[go: up one dir, main page]

CN101155494A - heat sink - Google Patents

heat sink Download PDF

Info

Publication number
CN101155494A
CN101155494A CN200610062898.0A CN200610062898A CN101155494A CN 101155494 A CN101155494 A CN 101155494A CN 200610062898 A CN200610062898 A CN 200610062898A CN 101155494 A CN101155494 A CN 101155494A
Authority
CN
China
Prior art keywords
heat
fan
speed
generating electronic
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200610062898.0A
Other languages
Chinese (zh)
Other versions
CN100592857C (en
Inventor
叶振兴
陈明科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200610062898.0A priority Critical patent/CN100592857C/en
Priority to US11/608,805 priority patent/US20080078187A1/en
Publication of CN101155494A publication Critical patent/CN101155494A/en
Application granted granted Critical
Publication of CN100592857C publication Critical patent/CN100592857C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0211—Control thereof of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，用来给一发热电子元件散热，其包括一设于所述发热电子元件上并用来吸收所述发热电子元件热量的导热体；一将所述热量转移到外界的散热器；一根据所述发热电子元件温度可调整转速的风扇；一设于所述散热器与导热体之间的半导体制冷器，用于在所述风扇的转速高于某一特定转速时给所述发热电子元件制冷，在所述风扇的转速低于所述特定转速时停止给所述发热电子元件制冷；及一温度控制电路，用于监测所述风扇的转速并根据所述风扇的转速控制所述半导体制冷器的开启或停止。所述散热装置可有效给所述发热电子元件进行散热，还在一定程度上提高了风扇的使用寿命。

Figure 200610062898

A heat dissipation device for dissipating heat from a heat-generating electronic component, which includes a heat conductor arranged on the heat-generating electronic component and used to absorb heat from the heat-generating electronic component; a heat sink that transfers the heat to the outside; A fan whose speed can be adjusted according to the temperature of the heat-generating electronic component; a semiconductor refrigerator arranged between the radiator and the heat conductor, which is used to provide heat to the fan when the speed of the fan is higher than a certain speed. electronic component cooling, stop cooling the heating electronic components when the fan speed is lower than the specified speed; and a temperature control circuit, used to monitor the fan speed and control the fan speed according to the fan speed The start or stop of the semiconductor refrigerator. The heat dissipation device can effectively dissipate heat to the heat-generating electronic components, and also improve the service life of the fan to a certain extent.

Figure 200610062898

Description

散热装置 heat sink

技术领域technical field

本发明涉及一种散热装置，特别涉及一种用来给发热电子元件散热的散热装置。The invention relates to a heat dissipation device, in particular to a heat dissipation device for heat dissipation of electronic components.

背景技术Background technique

在计算机系统或服务器系统中，对于发热电子元件，如CPU(Central Processing Unit，中央处理器)的散热通常是应用一散热器来进行散热降温，现有的CPU散热器主要是通过与CPU直接接触的散热片将热量引出，然后利用风扇吹动空气流过散热片并将热量带走。所述风扇可监测CPU的温度并根据CPU温度的高低来改变其自身转速以达到更合理的散热效果。但是，这种CPU散热器的散热片直接与CPU接触，且其与空气的温差不大，从而导致散热效果不是很好，如果环境温度过高，那么其散热效果将会更加糟糕，很容易会导致系统转速变慢、死机、烧毁CPU等后果，而且通常CPU工作时，风扇一般一直处于高速运转状态，浪费了电能的同时也影响了风扇的使用寿命。In a computer system or a server system, for heat dissipation of electronic components such as CPU (Central Processing Unit, central processing unit), a heat sink is usually used for heat dissipation and cooling. The existing CPU heat sink is mainly through direct contact with the CPU. The heat sink draws the heat away, and then uses the fan to blow the air to flow over the heat sink and carry the heat away. The fan can monitor the temperature of the CPU and change its own speed according to the temperature of the CPU to achieve a more reasonable heat dissipation effect. However, the heat sink of this CPU heat sink directly contacts with the CPU, and the temperature difference between it and the air is not large, so that the heat dissipation effect is not very good. If the ambient temperature is too high, the heat dissipation effect will be even worse, and it is easy to This leads to the consequences of slowing down the system speed, crashing, and burning the CPU, and usually when the CPU is working, the fan is generally in a high-speed running state, which wastes electric energy and also affects the service life of the fan.

发明内容Contents of the invention

鉴于以上内容，有必要提供一种可有效地给发热电子元件散热并可提高风扇使用寿命的散热装置。In view of the above, it is necessary to provide a heat dissipation device that can effectively dissipate heat from the heat-generating electronic components and improve the service life of the fan.

一种散热装置，用来给一发热电子元件散热，其包括一设于所述发热电子元件上并用来吸收所述发热电子元件热量的导热体；一将所述热量转移到外界的散热器；一根据所述发热电子元件温度可调整转速的风扇；一设于所述散热器与导热体之间的半导体制冷器，用于在所述风扇的转速高于某一特定转速时给所述发热电子元件制冷，在所述风扇的转速低于所述特定转速时停止给所述发热电子元件制冷；及一温度控制电路，用于监测所述风扇的转速并根据所述风扇的转速控制所述半导体制冷器的开启或停止。A heat dissipation device for dissipating heat from a heat-generating electronic component, which includes a heat conductor arranged on the heat-generating electronic component and used to absorb heat from the heat-generating electronic component; a heat sink that transfers the heat to the outside; A fan whose speed can be adjusted according to the temperature of the heat-generating electronic component; a semiconductor refrigerator arranged between the radiator and the heat conductor, which is used to provide heat to the fan when the speed of the fan is higher than a certain speed. electronic component cooling, stop cooling the heating electronic components when the fan speed is lower than the specified speed; and a temperature control circuit, used to monitor the fan speed and control the fan speed according to the fan speed The start or stop of the semiconductor refrigerator.

相较于现有技术，通过所述温度控制电路侦测所述风扇的转速，并将转速信号反馈给所述半导体制冷器使其在风扇转速提高到一定转速后进一步对发热电子元件进行制冷，从而使发热电子元件工作在一个较佳的工作温度范围，这样就不会造成发热电子元件温度过高，使发热电子元件可以正常工作，同时又可以使风扇不用一直不间断的工作在高速运转状态下，一定程度上提高了风扇的使用寿命。Compared with the prior art, the speed of the fan is detected by the temperature control circuit, and the speed signal is fed back to the semiconductor refrigerator to further cool the heating electronic components after the fan speed reaches a certain speed. So that the heating electronic components work in a better working temperature range, so that the temperature of the heating electronic components will not be too high, so that the heating electronic components can work normally, and at the same time, the fan does not have to work continuously at high speed. To a certain extent, the service life of the fan is improved.

附图说明Description of drawings

下面参考附图结合具体实施方式对本发明作进一步的说明。The present invention will be further described below in combination with specific embodiments with reference to the accompanying drawings.

图1为本发明散热装置的较佳实施方式的示意图。FIG. 1 is a schematic diagram of a preferred embodiment of the heat dissipation device of the present invention.

图2为本发明散热装置的较佳实施方式的电路原理图。FIG. 2 is a circuit schematic diagram of a preferred embodiment of the heat dissipation device of the present invention.

具体实施方式Detailed ways

请共同参考图1及图2，本发明散热装置10用来给一发热电子元件，如CPU20散热，其较佳实施方式包括一风扇12、一散热器14、一半导体制冷器16、一导热体18及一温度控制电路30(可将温度控制电路30设置在放置CPU20的主板的可利用空间上)。Please refer to Fig. 1 and Fig. 2 together, the heat dissipation device 10 of the present invention is used for dissipating heat to a heating electronic component, such as CPU20, and its preferred embodiment comprises a fan 12, a radiator 14, a semiconductor cooler 16, a heat conductor 18 and a temperature control circuit 30 (the temperature control circuit 30 can be arranged on the available space of the mainboard of the CPU20).

所述CPU20与所述导热体18的底面紧密接触(通常两者之间涂有散热膏)，所述导热体18的顶面与所述半导体制冷器16吸热的一面紧密接触，所述半导体制冷器16放热的一面装设所述散热器14，所述散热器14上装设所述风扇12。所述导热体18用来吸收所述CPU20的热量，所述半导体制冷器16用来将所述导热体18吸收的热量转移到外界，所述散热器14用来将所述半导体制冷器16转移到外界的热量引出，所述风扇12用来吹动空气流过并将引出的热量带走。所述风扇12可监测所述CPU20的温度，并根据温度的高低调节自身的转速，来达到合理散热的目的，通常风扇12分为低速和高速两个挡位(根据特殊需要还可能有多个挡位)，当CPU20温度在某一特定值(如25℃)之下时，风扇12则为低速运转，当CPU20温度在所述特定值之上时，风扇12则为高速运转。所述温度控制电路30与所述风扇12及所述半导体制冷器16相连并监测所述风扇12的转速，当所述风扇12由低速转为高速时，控制所述半导体制冷器16开始制冷，当所述风扇12由高速转为低速时，控制所述半导体制冷器16停止制冷，从而使所述CPU20的温度控制在一个较佳的范围内(如20℃-30℃)。The CPU 20 is in close contact with the bottom surface of the heat conductor 18 (usually with heat dissipating paste between them), the top surface of the heat conductor 18 is in close contact with the heat-absorbing side of the semiconductor refrigerator 16, and the semiconductor The heat release side of the refrigerator 16 is provided with the radiator 14 , and the fan 12 is installed on the radiator 14 . The heat conductor 18 is used to absorb the heat of the CPU 20, the semiconductor cooler 16 is used to transfer the heat absorbed by the heat conductor 18 to the outside, and the radiator 14 is used to transfer the semiconductor cooler 16 to the outside. The heat to the outside is extracted, and the fan 12 is used to blow air to flow through and take away the extracted heat. Described fan 12 can monitor the temperature of described CPU20, and adjusts the rotating speed of oneself according to the height of temperature, reaches the purpose of reasonable heat dissipation, usually fan 12 is divided into two stalls of low speed and high speed (also may have multiple according to special needs) gear), when the temperature of the CPU 20 is below a certain value (such as 25° C.), the fan 12 operates at a low speed, and when the temperature of the CPU 20 is above the specified value, the fan 12 operates at a high speed. The temperature control circuit 30 is connected to the fan 12 and the semiconductor refrigerator 16 and monitors the speed of the fan 12. When the fan 12 changes from a low speed to a high speed, it controls the semiconductor refrigerator 16 to start cooling. When the fan 12 changes from high speed to low speed, the semiconductor refrigerator 16 is controlled to stop cooling, so that the temperature of the CPU 20 is controlled within a preferred range (such as 20° C.-30° C.).

所述温度控制电路30包括一第一直流电源端VCC、一第二直流电源端VDD、一微控制器M、一第一电阻R1、一第二电阻R2、一开关SW、一继电器K及一指示器D，所述继电器K包括一线圈J及一常开开关S，所述线圈J控制所述常开开关S的通断。所述第一直流电源端VCC及第二直流电源端VDD可直接连接到主板(未示出)的直流电源端上，本实施方式中，所述第一直流电源端VCC接到主板的+12V直流电源端上，所述第二直流电源端VDD接到主板的+3.3V直流电源端上。所述开关SW为一个按钮式开关，所述微控制器M为美国微芯科技(Microchip Technology)公司生产的型号为PIC10F200的微控制器，所述指示器D为一个发光二极管。The temperature control circuit 30 includes a first DC power supply terminal VCC, a second DC power supply terminal VDD, a microcontroller M, a first resistor R1, a second resistor R2, a switch SW, a relay K and An indicator D, the relay K includes a coil J and a normally open switch S, and the coil J controls the on and off of the normally open switch S. The first DC power supply terminal VCC and the second DC power supply terminal VDD can be directly connected to the DC power supply terminal of the main board (not shown). In this embodiment, the first DC power supply terminal VCC is connected to the main board's The +12V DC power supply terminal, and the second DC power supply terminal VDD is connected to the +3.3V DC power supply terminal of the motherboard. The switch SW is a button switch, the microcontroller M is a PIC10F200 microcontroller produced by Microchip Technology, and the indicator D is a light emitting diode.

所述微控制器M的一输入端GP0接到所述风扇12的转速信号引出端P，用于监测所述风扇12的转速，所述微控制器M的另一输入端GP1通过所述第二电阻R2与所述第二直流电源端VDD相连，并通过由所述第一电阻R1及开关SW组成的并联电路后接地。所述微控制器M的一输出端GP2通过所述继电器K的线圈J后接地，所述微控制器M的另一输出端GP3通过所述指示器D后接地。所述第一直流电源端VCC通过所述继电器K的常开开关S连接到所述半导体制冷器16一端，所述半导体制冷器16的另一端接地，所述主板的+12V直流电源用于给所述半导体制冷器16供电。One input terminal GP0 of the microcontroller M is connected to the lead-out terminal P of the rotation speed signal of the fan 12 for monitoring the rotation speed of the fan 12, and the other input terminal GP1 of the microcontroller M passes through the first The second resistor R2 is connected to the second DC power supply terminal VDD, and grounded after passing through the parallel circuit composed of the first resistor R1 and the switch SW. An output terminal GP2 of the microcontroller M is grounded after passing through the coil J of the relay K, and another output terminal GP3 of the microcontroller M is grounded after passing the indicator D. The first DC power supply terminal VCC is connected to one end of the semiconductor refrigerator 16 through the normally open switch S of the relay K, the other end of the semiconductor refrigerator 16 is grounded, and the +12V DC power supply of the main board is used for Power is supplied to the semiconductor refrigerator 16 .

所述微控制器M的程序满足：当所述输入端GP0接收到的所述风扇12的转速信号后，如果所述风扇12的转速在低速范围内时，则所述输出端GP2及GP3均为低电平，故所述继电器K将不运作，即所述常开开关S处于断开状态，所述半导体制冷器16不会运作，同时所述指示器D将处于不发光状态。当所述输入端GP0接收到的所述风扇12的转速信号后，如果所述风扇12的转速在高速范围内时，则所述输出端GP2及GP3均变为高电平，故所述继电器K将运作，即线圈J吸合所述常开开关S使其处于闭合状态，此时所述半导体制冷器16将开始运作并给所述CPU20制冷，同时所述指示器D将处于发光状态。所述开关SW用于强制开启或停止所述半导体制冷器16，将所述开关SW按下后，所述输入端GP1将从高电平转为低电平，此一电压转换信号可使所述输出端GP2及GP3的电压状态也发生相应转换，即当输出端GP2及GP3的电压为低电平时，按下开关SW后，GP2及GP3的电压转为高电平；当输出端GP2及GP3的电压为高电平时，按下开关SW后，GP2及GP3的电压转为低电平。The program of the microcontroller M satisfies: after the input terminal GP0 receives the rotation speed signal of the fan 12, if the rotation speed of the fan 12 is in the low speed range, the output terminals GP2 and GP3 are both is low level, so the relay K will not operate, that is, the normally open switch S is in an off state, the semiconductor refrigerator 16 will not operate, and the indicator D will be in a non-luminous state. After the input terminal GP0 receives the rotation speed signal of the fan 12, if the rotation speed of the fan 12 is within the high-speed range, the output terminals GP2 and GP3 both become high level, so the relay K will work, that is, the coil J pulls the normally open switch S to make it in a closed state, and at this time, the semiconductor refrigerator 16 will start to operate and cool the CPU 20 , while the indicator D will be in a light-emitting state. The switch SW is used to forcibly start or stop the semiconductor refrigerator 16. After the switch SW is pressed, the input terminal GP1 will change from high level to low level. This voltage conversion signal can make all The voltage states of the above-mentioned output terminals GP2 and GP3 also change correspondingly, that is, when the voltages of the output terminals GP2 and GP3 are at low level, after pressing the switch SW, the voltages of GP2 and GP3 become high level; When the voltage of GP3 is at a high level, after pressing the switch SW, the voltages of GP2 and GP3 are changed to a low level.

所述CPU20开始工作时，所述风扇12一开始将处于低速状态，此时所述半导体制冷器16处于非制冷状态。当CPU20温度上升到所述特定温度以上时，则所述风扇12将转为高速状态，根据上述可知，所述半导体制冷器16将开始运作并给所述CPU20进行制冷，同时所述指示器D将处于发光状态。当CPU20温度降低到所述特定温度以下时，则所述风扇12将转回为低速状态，所述半导体制冷器16也将停止运作，同时所述指示器D熄灭。这样一来，所述风扇12结合所述半导体制冷器16并通过所述温度控制电路30的控制，很好的控制了所述CPU20的温度，使CPU20的温度保持在了一个较佳的温度范围，这样CPU20既不会因为温度过高而导致系统运行速度变慢或者死机，同时所述风扇12也不用一直处于高速运转状态，从而提高了其使用寿命，一定程度上也节省了电能。When the CPU 20 starts to work, the fan 12 will be in a low-speed state initially, and the semiconductor refrigerator 16 is in a non-cooling state at this time. When the temperature of the CPU 20 rises above the specified temperature, the fan 12 will turn to a high-speed state. According to the above, the semiconductor refrigerator 16 will start to operate and cool the CPU 20, while the indicator D will be illuminated. When the temperature of the CPU 20 drops below the specified temperature, the fan 12 will turn back to a low-speed state, the semiconductor refrigerator 16 will also stop working, and the indicator D will go out simultaneously. In this way, the fan 12 is combined with the semiconductor refrigerator 16 and controlled by the temperature control circuit 30 to control the temperature of the CPU 20 well, so that the temperature of the CPU 20 is kept in a preferred temperature range. , the CPU 20 will neither cause the system to slow down or crash due to excessive temperature, and the fan 12 does not need to be in a high-speed running state all the time, thereby improving its service life and saving electric energy to a certain extent.

Claims (6)

1. heat abstractor, be used for dispelling the heat to a heat-generating electronic elements, it comprises the heat carrier of being located on the described heat-generating electronic elements and being used for absorbing described heat-generating electronic elements heat, one with radiator and the fan according to described heat-generating electronic elements temperature adjustable rotational speed of described transfer of heat to the external world, it is characterized in that: described heat abstractor also comprises the semiconductor cooler of being located between described radiator and the heat carrier, be used for when the rotating speed of described fan is higher than a certain specific rotation speeds, giving described heat-generating electronic elements refrigeration, when the rotating speed of described fan is lower than described specific rotation speeds, stop to described heat-generating electronic elements refrigeration; And a temperature-control circuit, be used to monitor the rotating speed of described fan and control the unlatching of described semiconductor cooler or stop according to the rotating speed of described fan.
2. heat abstractor as claimed in claim 1, it is characterized in that: described temperature-control circuit comprises one first dc power supply terminal, a microcontroller and a relay, described relay comprises a coil and a normal open switch, one input of described microcontroller is received the tach signal exit of described fan, one output of described microcontroller is by ground connection behind the described coil, described first dc power supply terminal is connected to an end of described semiconductor cooler, the other end ground connection of described semiconductor cooler by described normal open switch.
3. heat abstractor as claimed in claim 2, it is characterized in that: described temperature-control circuit also comprises one second dc power supply terminal, one first resistance, one second resistance and a switch, be used for enforced opening or stop described semiconductor cooler, another input of described microcontroller links to each other with described second dc power supply terminal by described second resistance, and by ground connection behind the parallel circuits of forming by described first resistance and switch.
4. heat abstractor as claimed in claim 3 is characterized in that: described switch is a push-button switch.
5. heat abstractor as claimed in claim 2 is characterized in that: described temperature-control circuit comprises that also one is used to indicate the indicating device of the operating state of described semiconductor cooler, and another output of described microcontroller is by ground connection behind the described indicating device.
6. heat abstractor as claimed in claim 5 is characterized in that: described indicating device is a light-emitting diode.
CN200610062898.0A 2006-09-29 2006-09-29 heat sink Expired - Fee Related CN100592857C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200610062898.0A CN100592857C (en) 2006-09-29 2006-09-29 heat sink
US11/608,805 US20080078187A1 (en) 2006-09-29 2006-12-09 Heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200610062898.0A CN100592857C (en) 2006-09-29 2006-09-29 heat sink

Publications (2)

Publication Number Publication Date
CN101155494A true CN101155494A (en) 2008-04-02
CN100592857C CN100592857C (en) 2010-02-24

Family

ID=39256832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610062898.0A Expired - Fee Related CN100592857C (en) 2006-09-29 2006-09-29 heat sink

Country Status (2)

Country Link
US (1) US20080078187A1 (en)
CN (1) CN100592857C (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548188A (en) * 2010-12-14 2012-07-04 联想(北京)有限公司 Printed circuit board, computer and radiating method
CN106783296A (en) * 2017-02-23 2017-05-31 深圳供电局有限公司 Intelligence low-voltage switch heat abstractor
CN108268069A (en) * 2016-12-30 2018-07-10 北京小米移动软件有限公司 Temprature control method, temperature control equipment and electronic equipment
CN108306560A (en) * 2018-02-07 2018-07-20 北京执未来科技有限公司 A kind of motor driven systems and method
CN113031672A (en) * 2019-12-25 2021-06-25 中兴通讯股份有限公司 Temperature control method, system and storage medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2472455B (en) * 2009-08-08 2016-07-06 Bibby Scient Ltd A method of controlling an apparatus having a thermoelectric cooler
JP6779479B2 (en) * 2016-05-13 2020-11-04 Ｌｅａｄｉｎｇ Ｅｄｇｅ Ａｓｓｏｃｉａｔｅｓ株式会社 Temperature control unit, temperature control system using temperature control unit, and temperature control building structure using temperature control unit
KR102282155B1 (en) 2017-03-14 2021-07-27 엘지전자 주식회사 Refrigerator
KR102274676B1 (en) * 2017-03-14 2021-07-08 엘지전자 주식회사 Refrigerator

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138645A1 (en) * 1981-09-29 1983-04-14 Dr.Ing.H.C. F. Porsche Ag, 7000 Stuttgart "ELECTRONIC OVERCURRENT PROTECTION DEVICE"
US5081558A (en) * 1990-02-02 1992-01-14 Northrop Corporation High voltage DC relays
DE4019091A1 (en) * 1990-06-15 1991-12-19 Battelle Institut E V HEAT DISCHARGE DEVICE FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
JP3069819B2 (en) * 1992-05-28 2000-07-24 富士通株式会社 Heat sink, heat sink fixture used for the heat sink, and portable electronic device using the heat sink
US5536980A (en) * 1992-11-19 1996-07-16 Texas Instruments Incorporated High voltage, high current switching apparatus
US5676199A (en) * 1993-07-23 1997-10-14 Lee; Richard M. L. Thermostat controlled cooler for a CPU
KR100310100B1 (en) * 1996-07-10 2001-12-17 윤종용 Power supply apparatus for portable computer and dc input selection circuit adapted to same
DE19846113A1 (en) * 1998-10-07 2000-04-13 Bosch Gmbh Robert Circuit arrangement consisting of an ignition element for a belt tensioner and a belt operation sensor
US6147465A (en) * 1999-03-25 2000-11-14 General Electric Company Microprocessor controlled single phase motor with external rotor having integral fan
IL136275A0 (en) * 2000-05-22 2001-05-20 Active Cool Ltd Active cooling system for cpu and semiconductors also enabling thermal acceleration
CN2499892Y (en) * 2001-09-19 2002-07-10 刘宏彩 Cooling device with temperature control for computer mainframe
IL146838A0 (en) * 2001-11-29 2002-07-25 Active Cool Ltd Active cooling system for cpu
IL147394A0 (en) * 2001-12-30 2002-08-14 Active Cool Ltd Thermoelectric active cooling system for a computer processor with reduced audible noise and emi noise audio noise
CN2541893Y (en) * 2002-03-18 2003-03-26 联想(北京)有限公司 CPU radiator with its fan rotary speed controlled by CPU temp
US6924568B2 (en) * 2002-08-06 2005-08-02 Apple Computer, Inc. Quiet fan speed control
US6935130B2 (en) * 2003-06-24 2005-08-30 Aopen Inc. Computer cooling system
KR101058935B1 (en) * 2004-05-03 2011-08-23 페어차일드코리아반도체 주식회사 Switching-mode power supplies
CN2760547Y (en) * 2004-12-24 2006-02-22 上海雷硕医疗器械有限公司 Radiating device for weak light rapid spectral analysis assembly in improved laser diagnostic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548188A (en) * 2010-12-14 2012-07-04 联想(北京)有限公司 Printed circuit board, computer and radiating method
CN108268069A (en) * 2016-12-30 2018-07-10 北京小米移动软件有限公司 Temprature control method, temperature control equipment and electronic equipment
CN106783296A (en) * 2017-02-23 2017-05-31 深圳供电局有限公司 Intelligence low-voltage switch heat abstractor
CN108306560A (en) * 2018-02-07 2018-07-20 北京执未来科技有限公司 A kind of motor driven systems and method
CN113031672A (en) * 2019-12-25 2021-06-25 中兴通讯股份有限公司 Temperature control method, system and storage medium

Also Published As

Publication number Publication date
US20080078187A1 (en) 2008-04-03
CN100592857C (en) 2010-02-24

Similar Documents

Publication Publication Date Title
CN101155494A (en) heat sink
US20040223302A1 (en) Apparatus for cooling heat generating components within a computer system enclosure
US20070091567A1 (en) Information processing device and manufacturing method of the information processing device
US20070204627A1 (en) Double-effect thermoelectric cooling apparatus
CN204333581U (en) A new type of module box
CN112714601B (en) A heat radiation structure and intelligent terminal for intelligent terminal
CN100583002C (en) Radiating model set
CN108807314A (en) A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip
CN101237756A (en) Electronic device and heat dissipation module thereof
CN104850199A (en) Notebook computer heat dissipation pad capable of cooling, and control method therefor
CN110134212A (en) A kind of server and its instant refrigeration heat-radiation structure
KR20030068633A (en) Integrated circuit cooler using thermoelectric element
CN209657233U (en) Memory device with cooling module
CN100524561C (en) Electric tool and electrical switch unit thereof
CN206235991U (en) A kind of computer radiator
CN100463148C (en) heat sink
CN104300398A (en) Distribution box with intelligent control of internal temperature
US20110225982A1 (en) Cpu cooling circuit having thermoelectric element
TW200819956A (en) Heat dissipation device
CN2836422Y (en) Thermoelectric conversion heat dissipation assembly
TWI335791B (en) Dissipating heat device
TWI811153B (en) Intelligent temperature control system for network equipment
CN104378910A (en) Cooling type PCB
RU2469374C2 (en) Dust-cleaning heat-dissipating device with two cooling fans
CN204166464U (en) Heatsink assembly and display adapter assembly with heatsink assembly

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100224

Termination date: 20140929

EXPY Termination of patent right or utility model