CN101141867A - Method for combining heat conduction pipe and heat radiation fin - Google Patents

Abstract

The invention discloses a method for combining a heat conduction pipe and heat dissipation fins, which comprises the steps of firstly providing a heat dissipation fin with an opening, placing the heat conduction pipe and a tin tube in the opening, sleeving the heat conduction pipe in the tin tube, and then carrying out a heat treatment process to combine the heat conduction pipe and the heat dissipation fins through the melted tin tube. The invention uses tin tube as medium material between the heat conduction tube and the heat radiation fin, so that the heat conduction tube and the heat radiation fin are combined with each other in maximum contact area, thus not only easily controlling the use amount of the medium material and simplifying the manufacturing process, but also greatly improving the combination strength and the heat radiation efficiency due to large-scale contact area between the heat conduction tube and the heat radiation fin.

Description

Combination method of heat pipe and cooling fins

technical field

The invention relates to a method for combining heat conduction pipes and heat dissipation fins, in particular to a method for combining heat conduction pipes and heat dissipation fins by welding.

Background technique

With the improvement of computer computing performance, internal electronic components, such as central processing unit (Central Processing Unit, CPU), hard disk drive (Hard Disk Drive, HDD), etc., process data faster and higher, and the volume of electronic components tends to be miniaturized As a result, the density per unit area is getting higher and higher, and the heat generated by related electronic components also increases. Excessively high temperature will seriously affect the stability and efficiency of computer operation, and also shorten the life of electronic components. shorten. Therefore, cooling devices such as cooling fins (Fin) have become an indispensable equipment for computer devices, and cooling fins installed on electronic components can quickly dissipate the heat energy emitted by electronic components, while reducing The overall temperature of the computer unit.

In order to adapt to the continuous improvement of the heat energy of today's electronic components, a high-efficiency heat dissipation device that uses heat pipes (HeatPipe) to heat dissipation fins has been developed, which greatly improves the traditional heat dissipation fins that only use metal heat conduction to dissipate heat, resulting in poor heat dissipation efficiency. restrictions, so heat pipes have been widely used in heat dissipation modules. The combination method of heat dissipation pipes and heat dissipation fins in the prior art is to set perforations on the heat dissipation fins, and coat the heat conduction medium such as solder paste on the perforations of the heat dissipation fins or the heat dissipation pipes, and then penetrate the heat dissipation pipes into the heat dissipation fins. In the perforation of the sheet, welding is finally performed to combine the heat pipe and the heat dissipation fins.

Since the solder paste in the prior art is viscous, it is difficult for the heat pipe with solder paste to penetrate into the perforation of the heat dissipation fin, and it is difficult to accurately control the amount of solder paste applied, and too much solder paste will overflow In addition to perforation, it not only affects the appearance of the product, but also affects the heat transfer efficiency due to impurity contamination, and too little solder paste will lead to poor bonding between the heat sink and fins, making product quality difficult to control. In view of this, on February 1, 2006, Taiwan Patent Publication No. M286920 disclosed a combined structure of heat pipes and cooling fins, cutting the cooling fins to form a tongue structure, and bending the tongue structure Openings are formed at an angle to allow plate-like dielectrics or paste-like dielectrics to be placed into the heat dissipation fins. After heating, the dielectrics melt and flow into the gap between the heat pipe and the heat dissipation fins, and after cooling and solidification, The heat pipe and the heat dissipation fin are combined with each other.

Although the No. M286920 patent can improve the problem that the amount of solder paste is not easy to control, the contact area between the plate or paste medium and the heat pipe and heat dissipation fins is still quite limited, and the heat pipe and heat dissipation fins will be due to contact. If the area is too small, there is a problem of poor bonding strength.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for combining heat pipes and heat dissipation fins, so as to improve the uneven application of solder paste in the prior art, the amount of application is difficult to grasp, and the bonding strength is not good due to the small contact area. The problem.

The method for combining heat pipes and heat dissipation fins disclosed in the present invention firstly provides a heat dissipation fin, and the heat dissipation fin has a through opening, then inserts heat conduction pipes and tin pipes into the opening, and the heat conduction pipes are arranged on the tin Among the tubes, a heat treatment process is finally performed on the heat dissipation fins with the heat conduction tubes and the tin tubes, and the heat conduction tubes and the heat dissipation fins are combined by melting the tin tubes.

The effect of the present invention is that the tin pipe is used as the medium between the heat pipe and the heat dissipation fin, so that the heat pipe and the heat dissipation fin are closely combined with the largest contact area, not only the weight of the combined medium is easy to control, and the process is more simplified, but also The bonding strength between the heat pipe and the heat dissipation fins can be improved, and the overall heat dissipation efficiency can be improved.

The above descriptions about the contents of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principles of the present invention, and provide further explanations of the claims of the present invention.

Description of drawings

Fig. 1 is a flowchart of the steps of the first embodiment of the present invention;

Fig. 2A is a schematic diagram of step decomposition of the first embodiment of the present invention;

Fig. 2B is a schematic diagram of step decomposition of the first embodiment of the present invention;

Fig. 2C is a schematic diagram of step decomposition of the first embodiment of the present invention;

Fig. 2D is a schematic diagram of step decomposition of the first embodiment of the present invention;

FIG. 2E is a schematic diagram of step decomposition of the first embodiment of the present invention;

Fig. 3 is a flowchart of the steps of the second embodiment of the present invention;

Fig. 4A is a schematic diagram of step decomposition of the second embodiment of the present invention;

Fig. 4B is a schematic diagram of step decomposition of the second embodiment of the present invention;

FIG. 4C is an exploded schematic diagram of the steps of the second embodiment of the present invention; and

FIG. 4D is an exploded schematic view of the steps of the second embodiment of the present invention.

Among them, reference signs:

Step 100: Providing a cooling fin with an opening

Step 110: Put the Tin Tube in the Opening

Step 120: Reaming the Tin Tube

Step 130: Put the heat pipe into the tin tube

Step 140: Perform a heat treatment process

Step 200: Provide a cooling fin with an opening

Step 210: Put the heat pipe into the tin tube

Step 220: Putting a tin tube with a heat pipe into the opening

Step 230: Perform a heat treatment process

300: cooling fins

310: opening

400: tin tube

500: heat pipe

600: Reamer

Detailed ways

FIG. 1 and FIG. 2A to FIG. 2E are a flow chart and a three-dimensional schematic diagram of the steps of the first embodiment of the present invention. As shown in the figure, the method for combining the heat pipe 500 and the heat dissipation fin 300 disclosed in the present invention firstly provides a heat dissipation fin 300 (step 100), and one end of the heat dissipation fin 300 has a heat dissipation fin that penetrates the heat dissipation fin in the axial direction. 300 opening 310, then insert a tin tube 400 in the opening 310 (step 110), and carry out a tin tube reaming process (step 120) to the tin tube 400 that is arranged on the heat dissipation fin 300, pass a reamer 600 is inserted into the opening 310 provided with the tin tube 400, and the opening 310 is enlarged to the original size, and the material hardness of the reaming member 600 is greater than that of the tin tube 400, so that the tin tube 400 is extruded and deformed to the same size as the tin tube 400 during the hole reaming process. The outer diameter of the reaming member 600 is the same size, and then a heat pipe 500 is placed in the tin pipe 400 (step 130), and the outer diameter of the heat pipe 500 is consistent with the inner diameter of the opening 310, so that the heat pipe 500 is tightly fitted. Put into the tin tube 400, and then carry out a heat treatment process (step 140) on the heat dissipation fin 300 having the tin tube 400 and the heat conduction tube 500, so as to thermally melt the tin tube 400 disposed between the heat conduction tube 500 and the heat dissipation fin 300 , and through the evenly melted tin tube 400, the heat pipe 500 and the heat dissipation fin 300 are combined with each other with the largest contact area.

FIG. 3 and FIG. 4A to FIG. 4D are a flow chart and a three-dimensional schematic diagram of the steps of the second embodiment of the present invention. As shown in the figure, first provide a heat dissipation fin 300 (step 200), and one end of the heat dissipation fin 300 has an opening 310 passing through the heat dissipation fin 300 in the axial direction, and then insert a heat pipe 500 into a tin pipe 400 (step 210), and the heat pipe 500 is fixed in the hollow structure of the tin pipe 400 in a tightly fitting manner, and then the tin pipe 400 with the heat pipe 500 is placed in the opening 310 (step 220), and the inner diameter of the opening 310 The size is consistent with the outer diameter of the tin tube 400, so that when the tin tube 400 and the heat pipe 500 are inserted into the opening 310, they are in close contact with the inner wall of the opening 310 and there is no gap (Gap). Finally, a heat treatment process (step 230) is performed to The tin tube 400 disposed between the heat pipe 500 and the heat dissipation fin 300 is thermally melted, and the heat pipe 500 and the heat dissipation fin 300 are combined with each other with a maximum contact area through the evenly melted tin pipe 400 .

Wherein, flux can also be added to the tin tube 400 as the medium, which will further enhance the bonding strength between the heat pipe 500 and the heat dissipation fin 300 . In addition, in order to prevent workers from causing harm to the human body due to the high-temperature volatilization of lead alloy solder or the dust generated by processing, the tin tube 400 disclosed in the present invention is made of lead-free solder to meet the current industrial safety regulations that countries around the world attach great importance to. Require.

Compared with the prior art, the present invention uses a tin tube as the medium between the heat pipe and the heat dissipation fins, so that the heat conduction pipe and the heat dissipation fins are combined with each other with the largest contact area, which is not only easy to control the amount of the medium used, but also The manufacturing process is simplified, and the bonding strength and heat dissipation efficiency are greatly improved due to the large contact area between the heat pipe and the cooling fins.

Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (3)

1. A method for combining heat conduction pipes and cooling fins, comprising the following steps: providing a heat dissipation fin, and the heat dissipation fin has a through opening; inserting a tin tube into the opening; inserting a heat pipe into the tin pipe; and A heat treatment process is performed to melt the tin pipe and combine the heat pipe and the heat dissipation fins. 2 . The method for combining heat pipes and cooling fins according to claim 1 , further comprising performing a tin pipe hole expansion process after the step of placing the tin pipe in the opening is completed. 3 . 3. A method for combining heat pipes and cooling fins, comprising the following steps: providing a heat dissipation fin, and the heat dissipation fin has a through opening; placing a heat pipe in a tin tube; inserting a tin tube with the heat pipe into the opening; and A heat treatment process is performed to melt the tin pipe and combine the heat pipe and the heat dissipation fins.

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