CN101133295A - 热管及其制造方法 - Google Patents
热管及其制造方法 Download PDFInfo
- Publication number
- CN101133295A CN101133295A CNA2006800005969A CN200680000596A CN101133295A CN 101133295 A CN101133295 A CN 101133295A CN A2006800005969 A CNA2006800005969 A CN A2006800005969A CN 200680000596 A CN200680000596 A CN 200680000596A CN 101133295 A CN101133295 A CN 101133295A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- intermediate plate
- cold
- hole
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/09—Heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49366—Sheet joined to sheet
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005253016 | 2005-09-01 | ||
JP253016/2005 | 2005-09-01 | ||
JP2005350157 | 2005-12-05 | ||
JP350157/2005 | 2005-12-05 | ||
PCT/JP2006/301925 WO2007029359A1 (en) | 2005-09-01 | 2006-01-31 | Heat pipe and method for manufacturing same |
JPPCT/JP2006/301925 | 2006-01-31 | ||
PCT/JP2006/317249 WO2007026833A1 (ja) | 2005-09-01 | 2006-08-31 | ヒートパイプ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101133295A true CN101133295A (zh) | 2008-02-27 |
CN101133295B CN101133295B (zh) | 2010-05-19 |
Family
ID=37835494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800005969A Active CN101133295B (zh) | 2005-09-01 | 2006-08-31 | 热管及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8534348B2 (zh) |
JP (1) | JP4047918B2 (zh) |
KR (1) | KR101202539B1 (zh) |
CN (1) | CN101133295B (zh) |
CA (1) | CA2614471A1 (zh) |
TW (1) | TWI299781B (zh) |
WO (2) | WO2007029359A1 (zh) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101922881A (zh) * | 2009-06-09 | 2010-12-22 | 索尼公司 | 热传输装置及其制造方法 |
CN101968327A (zh) * | 2010-09-07 | 2011-02-09 | 万建红 | 柔性常压热管制造方法 |
CN102029512A (zh) * | 2009-10-02 | 2011-04-27 | 林德股份公司 | 热交换器 |
CN102066864A (zh) * | 2008-03-26 | 2011-05-18 | 株式会社渊上微 | 热管、热管的制造方法以及带有热管功能的电路板 |
CN102203939A (zh) * | 2008-09-05 | 2011-09-28 | 莫列斯喜入有限公司 | 热管和电子装置 |
CN102338581A (zh) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | 热虹吸板结构 |
CN102338583A (zh) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | 一种压力差驱动热板 |
CN102593083A (zh) * | 2011-01-18 | 2012-07-18 | 奇鋐科技股份有限公司 | 一种具有亲水性化合物薄膜的散热单元及亲水性化合物薄膜沉积方法 |
CN103796484A (zh) * | 2012-10-31 | 2014-05-14 | 英业达科技有限公司 | 电子装置 |
CN103796479A (zh) * | 2012-10-31 | 2014-05-14 | 英业达科技有限公司 | 电子装置 |
CN108458612A (zh) * | 2017-02-21 | 2018-08-28 | Ibt株式会社 | 用于电视的板型真空传热装置 |
CN110476033A (zh) * | 2017-04-28 | 2019-11-19 | 株式会社村田制作所 | 均热板 |
CN110573821A (zh) * | 2017-04-28 | 2019-12-13 | 株式会社村田制作所 | 均热板 |
CN110710342A (zh) * | 2017-05-29 | 2020-01-17 | 株式会社Cgi | 薄板型热管及其制造方法 |
CN111220013A (zh) * | 2020-03-12 | 2020-06-02 | 深圳威铂驰热技术有限公司 | 一种超薄均温板及其制造工艺 |
CN112797828A (zh) * | 2017-09-28 | 2021-05-14 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室的制造方法 |
CN114061345A (zh) * | 2020-07-31 | 2022-02-18 | 尼得科超众科技股份有限公司 | 热传导部件和热传导部件的制造方法 |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5160945B2 (ja) * | 2008-04-21 | 2013-03-13 | 日本モレックス株式会社 | ヒートパイプおよび電子機器 |
JP4557055B2 (ja) * | 2008-06-25 | 2010-10-06 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
EP2318779A2 (en) * | 2008-07-10 | 2011-05-11 | Infinia Corporation | Thermal energy storage device |
TW201015041A (en) * | 2008-10-03 | 2010-04-16 | Golden Sun News Tech Co Ltd | Smoothing-manufacture method to bury the heat-pipe evaporating segment into the heat-conduction base |
KR101007174B1 (ko) * | 2008-11-05 | 2011-01-12 | 한국전자통신연구원 | 박형 냉각소자 |
JP5180883B2 (ja) * | 2009-03-12 | 2013-04-10 | モレックス インコーポレイテド | 冷却装置および電子機器 |
JP2010243077A (ja) * | 2009-04-07 | 2010-10-28 | Sony Corp | 熱輸送デバイスの製造方法、熱輸送デバイス、電子機器及びカシメピン |
JP5404261B2 (ja) | 2009-04-16 | 2014-01-29 | モレックス インコーポレイテド | 冷却装置、電子基板、電子機器 |
KR101077410B1 (ko) * | 2009-05-15 | 2011-10-26 | 삼성전기주식회사 | 방열부재를 구비한 전자부품 내장형 인쇄회로기판 및 그 제조방법 |
JP5714836B2 (ja) * | 2010-04-17 | 2015-05-07 | モレックス インコーポレイテドMolex Incorporated | 熱輸送ユニット、電子基板、電子機器 |
FR2960218B1 (fr) * | 2010-05-21 | 2012-08-03 | Thales Sa | Dispositif de dissipation thermique pour equipement spatial, notamment pour satellite |
US8997840B2 (en) * | 2011-03-11 | 2015-04-07 | Asia Vital Components Co., Ltd. | Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound film |
TWI429848B (zh) * | 2011-11-25 | 2014-03-11 | Ind Tech Res Inst | 均熱結構與其製法及具有該均熱結構之散熱模組 |
US20130333238A1 (en) * | 2012-06-19 | 2013-12-19 | General Electric Company | Waste heat recovery and storage system for a dishwashing appliance |
US10458716B2 (en) | 2014-11-04 | 2019-10-29 | Roccor, Llc | Conformal thermal ground planes |
US9664458B2 (en) * | 2014-12-25 | 2017-05-30 | Asia Vital Components Co., Ltd. | Supporting structure for vapor chamber |
DE112016001221T5 (de) | 2015-03-16 | 2017-12-21 | Dana Canada Corporation | Wärmetauscher mit Oberflächenmuster aufweisenden Platten zur Verbesserung der Ebenheit und Verfahren zum Herstellen derselben |
US10123456B2 (en) * | 2015-10-28 | 2018-11-06 | Raytheon Company | Phase change material heat sink using additive manufacturing and method |
WO2017195254A1 (ja) | 2016-05-09 | 2017-11-16 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
JP6623296B2 (ja) | 2016-07-01 | 2019-12-18 | 古河電気工業株式会社 | ベーパーチャンバ |
JP6291000B2 (ja) * | 2016-09-01 | 2018-03-07 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
KR101826339B1 (ko) * | 2017-05-29 | 2018-02-06 | 주식회사 씨지아이 | 관체를 이용한 박판형 히트파이프 제조방법 |
CN109285820B (zh) * | 2017-07-20 | 2021-01-22 | 京东方科技集团股份有限公司 | 散热结构及其制作方法、显示装置 |
JP6696631B2 (ja) | 2017-09-29 | 2020-05-20 | 株式会社村田製作所 | ベーパーチャンバー |
JP6915493B2 (ja) * | 2017-10-16 | 2021-08-04 | 大日本印刷株式会社 | ベーパーチャンバ用金属シート、ベーパーチャンバおよびベーパーチャンバの製造方法 |
TWI699507B (zh) * | 2017-12-13 | 2020-07-21 | 奇鋐科技股份有限公司 | 散熱裝置單體及其散熱裝置及其製造方法 |
JP6951267B2 (ja) * | 2018-01-22 | 2021-10-20 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
JP6943786B2 (ja) * | 2018-02-05 | 2021-10-06 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP6400240B1 (ja) * | 2018-02-05 | 2018-10-03 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP6920231B2 (ja) * | 2018-02-06 | 2021-08-18 | 新光電気工業株式会社 | ループ型ヒートパイプ |
JP7027253B2 (ja) * | 2018-05-30 | 2022-03-01 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7153515B2 (ja) * | 2018-09-25 | 2022-10-14 | 新光電気工業株式会社 | ループ型ヒートパイプ |
JP7302207B2 (ja) | 2019-03-14 | 2023-07-04 | セイコーエプソン株式会社 | 冷却装置及びプロジェクター |
JP7448136B2 (ja) * | 2020-01-07 | 2024-03-12 | 国立大学法人 鹿児島大学 | ベーパチャンバ |
JP7041445B2 (ja) * | 2020-02-05 | 2022-03-24 | 健治 大沢 | 冷媒液導通柱及び冷媒液導通柱を採用しているヒートパイプ |
CN111356345A (zh) * | 2020-04-08 | 2020-06-30 | 江苏精研科技股份有限公司 | 一种手机中框 |
WO2021203787A1 (zh) * | 2020-04-09 | 2021-10-14 | 浙江嘉熙科技股份有限公司 | 热超导传热板及散热器 |
CN111521051B (zh) * | 2020-04-09 | 2025-02-07 | 浙江嘉熙科技股份有限公司 | 热超导传热板及散热器 |
WO2021208070A1 (zh) * | 2020-04-17 | 2021-10-21 | 李克勤 | 层叠式薄型散热装置及其制造方法 |
US11473850B2 (en) | 2020-05-15 | 2022-10-18 | Murata Manufacturing Co., Ltd. | Vapor chamber |
US11013145B1 (en) | 2020-05-15 | 2021-05-18 | Murata Manufacturing Co., Ltd. | Vapor chamber |
US11473849B2 (en) | 2020-05-15 | 2022-10-18 | Murata Manufacturing Co., Ltd. | Vapor chamber |
US11585606B2 (en) | 2020-05-15 | 2023-02-21 | Murata Manufacturing Co., Ltd. | Vapor chamber |
JPWO2021256328A1 (zh) * | 2020-06-15 | 2021-12-23 | ||
CN113883937A (zh) * | 2020-07-03 | 2022-01-04 | 台达电子工业股份有限公司 | 均温板 |
TWI726765B (zh) * | 2020-07-08 | 2021-05-01 | 雙鴻科技股份有限公司 | 均溫板 |
KR20230087578A (ko) * | 2020-10-16 | 2023-06-16 | 허니웰 인터내셔날 인코포레이티드 | 신규한 히트 파이프 구성 |
EP4300572A4 (en) * | 2021-02-26 | 2025-01-15 | Kyocera Corp | THERMAL DEVICE |
WO2024034279A1 (ja) * | 2022-08-08 | 2024-02-15 | 株式会社村田製作所 | 熱拡散デバイス及び電子機器 |
CN117641825A (zh) * | 2022-08-18 | 2024-03-01 | 北京小米移动软件有限公司 | 均温板、壳体组件及电子设备 |
US12181204B2 (en) * | 2022-09-22 | 2024-12-31 | Haier Us Appliance Solutions, Inc. | Wireless anti-condensation system for a refrigerator appliance mullion |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6033238B2 (ja) | 1981-06-22 | 1985-08-01 | 株式会社日立製作所 | 冷媒封入用容器の端部構造 |
JPS59173690A (ja) | 1983-03-18 | 1984-10-01 | Ngk Spark Plug Co Ltd | ヒ−トパイプ構造ic基板 |
JPS60133290A (ja) | 1983-12-21 | 1985-07-16 | Hitachi Ltd | ヒ−トパイプ |
DE3862511D1 (de) * | 1987-04-28 | 1991-05-29 | Sig Schweiz Industrieges | Siegelbacke fuer verpackungsmaschinen. |
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
JPH09126670A (ja) | 1995-10-30 | 1997-05-16 | Furukawa Electric Co Ltd:The | ヒートパイプ式ヒートシンク |
US6167948B1 (en) | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
DE19710783C2 (de) * | 1997-03-17 | 2003-08-21 | Curamik Electronics Gmbh | Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise |
JP3890685B2 (ja) * | 1997-07-11 | 2007-03-07 | 株式会社デンソー | 沸騰冷却装置 |
JPH11201671A (ja) | 1998-01-14 | 1999-07-30 | Fujine Sangyo:Kk | 密閉型熱移動体の作動液充填密閉方法及びその装置 |
JPH11287578A (ja) | 1998-03-31 | 1999-10-19 | Fujikura Ltd | 平板状ヒートパイプの製造方法 |
US7051793B1 (en) * | 1998-04-20 | 2006-05-30 | Jurgen Schulz-Harder | Cooler for electrical components |
JP2001147084A (ja) | 1999-09-07 | 2001-05-29 | Furukawa Electric Co Ltd:The | ウイックおよび薄型平面型ヒートパイプ |
TW452642B (en) * | 1999-09-07 | 2001-09-01 | Furukawa Electric Co Ltd | Wick, plate type heat pipe and container |
JP4424883B2 (ja) * | 2000-02-25 | 2010-03-03 | 富士通株式会社 | 薄型ヒートパイプおよびその製造方法 |
JP2002039693A (ja) | 2000-07-21 | 2002-02-06 | Toufuji Denki Kk | フラット型ヒートパイプ |
US6871701B2 (en) * | 2001-04-09 | 2005-03-29 | The Furukawa Electric Co., Ltd. | Plate-type heat pipe and method for manufacturing the same |
JP4088079B2 (ja) | 2002-02-12 | 2008-05-21 | ティーエス ヒートロニクス 株式会社 | プレート型ヒートパイプ |
JP4057455B2 (ja) * | 2002-05-08 | 2008-03-05 | 古河電気工業株式会社 | 薄型シート状ヒートパイプ |
TWI247873B (en) | 2002-08-21 | 2006-01-21 | Samsung Electronics Co Ltd | Flat heat transferring device and method of fabricating the same |
JP2004311519A (ja) | 2003-04-02 | 2004-11-04 | Denso Corp | 沸騰冷却装置 |
JP2004353902A (ja) | 2003-05-27 | 2004-12-16 | Sony Corp | 冷却装置 |
TWM245479U (en) | 2003-10-01 | 2004-10-01 | Chin-Wen Wang | Improved supporting structure of tablet type heat pipe |
US20060238984A1 (en) * | 2005-04-20 | 2006-10-26 | Belady Christian L | Thermal dissipation device with thermal compound recesses |
-
2006
- 2006-01-31 US US10/583,504 patent/US8534348B2/en active Active
- 2006-01-31 WO PCT/JP2006/301925 patent/WO2007029359A1/en not_active Application Discontinuation
- 2006-03-15 TW TW095108714A patent/TWI299781B/zh active
- 2006-08-31 KR KR1020077002522A patent/KR101202539B1/ko active Active
- 2006-08-31 CN CN2006800005969A patent/CN101133295B/zh active Active
- 2006-08-31 WO PCT/JP2006/317249 patent/WO2007026833A1/ja active Search and Examination
- 2006-08-31 CA CA002614471A patent/CA2614471A1/en not_active Abandoned
- 2006-08-31 US US11/573,534 patent/US20080135214A1/en not_active Abandoned
- 2006-08-31 JP JP2007501638A patent/JP4047918B2/ja active Active
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102066864A (zh) * | 2008-03-26 | 2011-05-18 | 株式会社渊上微 | 热管、热管的制造方法以及带有热管功能的电路板 |
CN102066864B (zh) * | 2008-03-26 | 2014-04-30 | 株式会社渊上微 | 热管、热管的制造方法以及带有热管功能的电路板 |
CN102203939A (zh) * | 2008-09-05 | 2011-09-28 | 莫列斯喜入有限公司 | 热管和电子装置 |
CN102203939B (zh) * | 2008-09-05 | 2014-07-09 | 莫列斯日本有限公司 | 热管和电子装置 |
CN101922881A (zh) * | 2009-06-09 | 2010-12-22 | 索尼公司 | 热传输装置及其制造方法 |
CN101922881B (zh) * | 2009-06-09 | 2012-07-18 | 索尼公司 | 热传输装置及其制造方法 |
CN102029512B (zh) * | 2009-10-02 | 2015-04-01 | 林德股份公司 | 热交换器 |
CN102029512A (zh) * | 2009-10-02 | 2011-04-27 | 林德股份公司 | 热交换器 |
CN102338583A (zh) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | 一种压力差驱动热板 |
CN102338581B (zh) * | 2010-07-23 | 2013-10-30 | 奇鋐科技股份有限公司 | 热虹吸板结构 |
CN102338581A (zh) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | 热虹吸板结构 |
CN102338583B (zh) * | 2010-07-23 | 2014-05-07 | 奇鋐科技股份有限公司 | 一种压力差驱动热板 |
CN101968327B (zh) * | 2010-09-07 | 2013-08-28 | 万建红 | 柔性常压热管制造方法 |
CN101968327A (zh) * | 2010-09-07 | 2011-02-09 | 万建红 | 柔性常压热管制造方法 |
CN102593083A (zh) * | 2011-01-18 | 2012-07-18 | 奇鋐科技股份有限公司 | 一种具有亲水性化合物薄膜的散热单元及亲水性化合物薄膜沉积方法 |
CN102593083B (zh) * | 2011-01-18 | 2016-01-20 | 奇鋐科技股份有限公司 | 一种具有亲水性化合物薄膜的散热单元及亲水性化合物薄膜沉积方法 |
CN103796479A (zh) * | 2012-10-31 | 2014-05-14 | 英业达科技有限公司 | 电子装置 |
CN103796484A (zh) * | 2012-10-31 | 2014-05-14 | 英业达科技有限公司 | 电子装置 |
CN103796484B (zh) * | 2012-10-31 | 2016-07-06 | 英业达科技有限公司 | 电子装置 |
CN103796479B (zh) * | 2012-10-31 | 2017-05-31 | 英业达科技有限公司 | 电子装置 |
CN108458612A (zh) * | 2017-02-21 | 2018-08-28 | Ibt株式会社 | 用于电视的板型真空传热装置 |
US11058031B2 (en) | 2017-04-28 | 2021-07-06 | Murata Manufacturing Co., Ltd | Vapor chamber |
CN110573821A (zh) * | 2017-04-28 | 2019-12-13 | 株式会社村田制作所 | 均热板 |
CN110476033A (zh) * | 2017-04-28 | 2019-11-19 | 株式会社村田制作所 | 均热板 |
CN110476033B (zh) * | 2017-04-28 | 2022-05-10 | 株式会社村田制作所 | 均热板 |
CN110710342A (zh) * | 2017-05-29 | 2020-01-17 | 株式会社Cgi | 薄板型热管及其制造方法 |
CN110710342B (zh) * | 2017-05-29 | 2020-12-08 | 株式会社Cgi | 薄板型热管及其制造方法 |
CN112797828A (zh) * | 2017-09-28 | 2021-05-14 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室的制造方法 |
CN112797828B (zh) * | 2017-09-28 | 2022-07-15 | 大日本印刷株式会社 | 蒸发室、电子设备以及蒸发室的制造方法 |
US12167571B2 (en) | 2017-09-28 | 2024-12-10 | Dai Nippon Printing Co., Ltd. | Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber |
CN111220013A (zh) * | 2020-03-12 | 2020-06-02 | 深圳威铂驰热技术有限公司 | 一种超薄均温板及其制造工艺 |
CN114061345A (zh) * | 2020-07-31 | 2022-02-18 | 尼得科超众科技股份有限公司 | 热传导部件和热传导部件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080135214A1 (en) | 2008-06-12 |
JPWO2007026833A1 (ja) | 2009-03-26 |
CN101133295B (zh) | 2010-05-19 |
JP4047918B2 (ja) | 2008-02-13 |
US20070056711A1 (en) | 2007-03-15 |
WO2007026833A1 (ja) | 2007-03-08 |
CA2614471A1 (en) | 2007-03-08 |
TW200710363A (en) | 2007-03-16 |
TWI299781B (en) | 2008-08-11 |
KR101202539B1 (ko) | 2012-11-19 |
WO2007029359A1 (en) | 2007-03-15 |
US8534348B2 (en) | 2013-09-17 |
KR20080048438A (ko) | 2008-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101133295B (zh) | 热管及其制造方法 | |
JP4112602B2 (ja) | ヒートパイプ | |
CN101421577B (zh) | 热管及其制造方法 | |
US7225861B2 (en) | Bubble cycling heat exchanger | |
US8316921B2 (en) | Plate type heat pipe and heat sink using the same | |
KR100775013B1 (ko) | 판형 열전달 장치 | |
US6631077B2 (en) | Heat spreader with oscillating flow | |
KR100238769B1 (ko) | 히트 파이프 | |
US8813834B2 (en) | Quick temperature-equlizing heat-dissipating device | |
EP2003703A9 (en) | Heat pipe | |
JP6413306B2 (ja) | ヒートパイプ内蔵フレーム板及び電子機器 | |
CN106358420A (zh) | 散热模块 | |
TWI409425B (zh) | 熱管 | |
US20060137860A1 (en) | Heat flux based microchannel heat exchanger architecture for two phase and single phase flows | |
CN101676672B (zh) | 均温板 | |
US10497640B2 (en) | Heat pipe | |
US20100326631A1 (en) | Plate-type heat pipe | |
JPWO2013005622A1 (ja) | 冷却装置およびその製造方法 | |
CN201623955U (zh) | 薄型化均温板及具有该均温板的散热模块 | |
TWI842472B (zh) | 均溫板裝置 | |
TWM630119U (zh) | 散熱件 | |
JP2002364990A (ja) | 板型ヒートパイプ | |
KR20220137264A (ko) | 방열 모듈 | |
KR100486710B1 (ko) | 미세 윅(Wick) 구조를 갖는 씨피엘(CPL) 냉각장치의 증발기 | |
CN221784549U (zh) | 一种均热装置及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: MOLEX KIIRE CO., LTD. Free format text: FORMER OWNER: FUCHIGAMI MIRCO CO., LTD. Effective date: 20150728 Owner name: JAPAN MOLEX CO., LTD. Free format text: FORMER OWNER: MOLEX KIIRE CO., LTD. Effective date: 20150728 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150728 Address after: Kanagawa Patentee after: Japan Morisse Co.,Ltd. Address before: Kagoshima County, Japan Patentee before: MOLEX KIIRE Co.,Ltd. Effective date of registration: 20150728 Address after: Kagoshima County, Japan Patentee after: MOLEX KIIRE Co.,Ltd. Address before: Kagoshima County, Japan Patentee before: FUCHIGAMI MICRO CO.,LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160719 Address after: Japan Kagawa County nakatado District tadotsu South duck 200 GA 17648502 Patentee after: SHIKOKU INSTRUMENTATION Co.,Ltd. Address before: Kanagawa Patentee before: Japan Morisse Co.,Ltd. |