CN101132169A - Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof - Google Patents
Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof Download PDFInfo
- Publication number
- CN101132169A CN101132169A CNA2007100773014A CN200710077301A CN101132169A CN 101132169 A CN101132169 A CN 101132169A CN A2007100773014 A CNA2007100773014 A CN A2007100773014A CN 200710077301 A CN200710077301 A CN 200710077301A CN 101132169 A CN101132169 A CN 101132169A
- Authority
- CN
- China
- Prior art keywords
- common burning
- burning porcelain
- porcelain layer
- layer
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000013078 crystal Substances 0.000 title claims description 47
- 238000000034 method Methods 0.000 title abstract description 8
- 238000012856 packing Methods 0.000 title abstract 2
- 238000005245 sintering Methods 0.000 claims abstract description 7
- 229910052573 porcelain Inorganic materials 0.000 claims description 73
- 238000005516 engineering process Methods 0.000 claims description 16
- 238000007766 curtain coating Methods 0.000 claims description 10
- 238000004080 punching Methods 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 3
- 229910000833 kovar Inorganic materials 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
This invention relates to a technique for ceramic packing the transistor resonator, particularly the ceramic package component used for SMD transistor resonator. It is composed of: the co-sintered ceramic layer and the ceramic cover. Said co-sintered ceramic layer comprises the coincided No.1 ceramic layer and No.2 ceramic layer. Over the No.2 layer is the ceramic cover; on the upper surface of the No.1 layer is the printed convex platform, which is used for supporting transistors and guiding the electrodes, through the holes, to the basal plane soldering plate. The advantages are: simple sintering process, low production cost, reducing shielding gas protective soldering, low kovar frame material requirement, low gold-plated area, and short leading wire.
Description
Technical field
The present invention relates to a kind of ceramic packaging technology of crystal resonator, refer more particularly to a kind of SMD crystal resonator ceramic package and production technology thereof.
Background technology
Crystal resonator mainly is plastics and metallic packaging at present, because the requirement of electronical elements surface mounting technology (SMT) and miniaturization, part has use surface mount device (SMD) ceramic packaging to the high high-order product of reliability requirement, the principal element that hinders the popularization of SMD ceramic packaging is that the cost of ceramic packaging is too high, and the postorder sealing process will use parallel soldering and sealing, can make equipment investment too big like this.Existing general crystal resonator configurations such as Fig. 1 are to shown in Figure 6, it is ZL200520115009.3 that its similar structure also has China Patent No., the applying date is " a kind of ceramic package of crystal oscillator " on August 2nd, 2005, its common burning porcelain layer is by the first common burning porcelain layer (a) that is superimposed, the second common burning porcelain layer (b) and the 3rd common burning porcelain layer (c) are formed, the common burning porcelain layer is an aluminium oxide ceramics, metal turns to tungsten (W) or molybdenum (Mo), soldering one deck can cut down (Kovar) frame (6) on the 3rd common burning porcelain layer, after resonant crystal (7) installation, parallel again soldering and sealing one deck can cut down cover plate (5).It also comprises bottom surface pad (1,2,3,4) in addition, conducting resinl (8), inner via hole (9), plane conductive layer (10) and edge via (11).
The weak point of existing crystal resonator ceramic packaging structure is: its product design and complex manufacturing, the production cost height has hindered applying of SMD ceramic packaging.Its technological process of production is as shown in figure 17: the first common burning porcelain layer disperses through raw material earlier, and again through curtain coating, section, punching and seal hole operation, last planographic forms;
The second common burning porcelain layer disperses through raw material earlier, and through curtain coating, section, punching (and towards chamber), filling perforation, seal hole operation, last planographic forms again;
The 3rd common burning porcelain layer disperses through raw material earlier, and through curtain coating, section, punching (and towards chamber) and filling perforation operation, last planographic forms again;
With the first common burning porcelain layer, the second common burning porcelain layer and the 3rd common burning porcelain layer manufacture respectively finish after, make through technologies such as pressings, cutting, protection of reducing atmosphere sintering, plating, soldering, burst again.
It is as described below to trace it to its cause: a. ceramic layer is made of three layers of common burning porcelain structure, the product design complexity, and operation is various, technology cost height; B. adopt and can cut down mount structure, need be with the soldering of Ag/Cu scolder, material and technology cost height under atmosphere protection; C. it is too many to be exposed to outer metal part, needs the area of electrogilding big, gold-plated cost height; D. the user must buy when using this encapsulation and can cut down cover plate, uses Parallel Seam Sealing Technology, and equipment investment reaches the production cost height greatly.
Based on the weak point of the general encapsulation technology of above-mentioned crystal resonator, the inventor has designed the present invention's " a kind of SMD crystal resonator ceramic package ".
Summary of the invention
The present invention is directed to above-mentioned the deficiencies in the prior art technical problem to be solved is: provide a kind of and reduce production costs, promote the popularization of SMD crystal resonator ceramic packaging, improve the reliability of crystal resonator and satisfy SMT and SMD crystal resonator ceramic package that miniaturization requires.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of SMD crystal resonator ceramic package, comprise common burning porcelain layer and ceramic cover plate, described common burning porcelain layer is made up of the first common burning porcelain layer that is superimposed and the second common burning porcelain layer, be provided with one in order to hold the cavity of crystal in the second common burning porcelain layer, be covered with one deck ceramic cover plate in the top of the second common burning porcelain layer, support crystal and the boss of the electrode on the resonant crystal in the upside of the first common burning porcelain layer being used to of being provided with that printing forms by via on the ground floor and bottom surface pad conducting, wherein boss comprises that the support rim that is used for support function and two are used to conduct electricity and the support conducting boss of support function, the main effect of support rim is exactly for resonant crystal provides oscillation space, is provided with the via that is used for conducting bottom surface pad and resonant crystal in the periphery of the first common burning porcelain layer.
The upside of the described first common burning porcelain layer also is provided with a plane conductive layer.
Described via is edge via or inner via hole.
A kind of SMD crystal resonator production technology of ceramic package,
The first common burning porcelain layer disperses through raw material earlier, and again through curtain coating, section, punching and seal hole (or filling perforation) operation, last planographic forms;
The second common burning porcelain layer disperses through raw material earlier, manufactures and forms through curtain coating, section, punching (and towards chamber) operation again;
The above-mentioned first common burning porcelain layer and the second common burning porcelain layer manufacture finish after, with the stacked first common burning porcelain layer upside of being located at of second common burning porcelain, make the common burning porcelain layer via pressing, cutting, protection of reducing atmosphere sintering, plating and burst operation again;
The earlier dry-pressing formed back of ceramic cover plate sintering in air forms, and burns the ceramic layer sealing together by low temperature glass or resin then.
A kind of SMD crystal resonator of the present invention with the beneficial effect of ceramic package is:
A. the crystal oscillation on the ceramic packaging adopts typography to make with boss, and common burning porcelain flaggy number reduces to 2 layers, simplification common burning porcelain technology, minimizing production cost from 3 layers.
B. remove and to cut down frame and can cut down cover plate, and use ceramic cover plate low temperature glass or resin-sealed.Reduce the protection of reducing atmosphere soldering processes and reduced and to have cut down frame material, reduced production cost.
C. design is gone up and is reduced the metal part that exposes, thereby has reduced gold-plated area, has reduced production cost.Reduced the quantity of via and the length of conducting wiring simultaneously, the product electrical property is improved.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the front view of existing crystal resonator ceramic packaging (not with cutting down cover plate);
Fig. 2 is the cross-sectional view of existing crystal resonator;
Fig. 3 is the front view of the first common burning porcelain layer of existing crystal resonator;
Fig. 4 is the lateral side view of the first common burning porcelain layer of existing crystal resonator;
Fig. 5 is the front view of the second common burning porcelain layer of existing crystal resonator;
Fig. 6 is the front view of the 3rd common burning porcelain layer of existing crystal resonator;
Fig. 7 is the front view of the embodiment of the invention one (not with ceramic cover plate);
Fig. 8 is the embodiment of the invention one cross-sectional view of (comprising crystal);
Fig. 9 is the rear structure schematic diagram of the embodiment of the invention one;
Figure 10 is the front view of the second common burning porcelain layer in the embodiment of the invention one;
Figure 11 is the front view of the first common burning porcelain layer in the embodiment of the invention one;
Figure 12 is the front view of the embodiment of the invention two (not with ceramic cover plate);
Figure 13 is the embodiment of the invention two cross-sectional view of (comprising crystal);
Figure 14 is the rear structure schematic diagram of the embodiment of the invention two;
Figure 15 is the front view of the second common burning porcelain layer in the embodiment of the invention two;
Figure 16 is the front view of the first common burning porcelain layer in the embodiment of the invention two;
Figure 17 is the technological process of production figure of existing common burning porcelain layer;
Figure 18 is common burning porcelain layer technological process of production figure of the present invention.
Embodiment
With reference to Fig. 7 to Figure 16, the present invention implements like this:
A kind of SMD crystal resonator ceramic package, comprise bottom surface pad 1 and bottom surface pad 2, common burning porcelain layer and ceramic cover plate 3, described common burning porcelain layer is made up of the first common burning porcelain layer a that is superimposed and the second common burning porcelain layer b, be provided with a ceramic cover plate 3 in the top of the second common burning porcelain layer b, support crystal and the boss of the electrode on the resonant crystal 4 in the upside of the first common burning porcelain layer a being used to of being provided with that printing forms by via on the ground floor and bottom surface pad conducting, wherein boss comprises that the support rim C that is used for support function and two are used to conduct electricity and the support conducting boss A of support function, B, the main effect of support rim C is exactly to provide oscillation space for resonant crystal 4, be provided with in the periphery of the first common burning porcelain layer a and be used for conducting bottom surface pad 1,2 and the via 6 of resonance crystal 4, via 6 is edge vias in the present embodiment, and it also can be inner via hole.
The upside of the first common burning porcelain layer a also is provided with a plane conductive layer 7 in the present embodiment.
As shown in figure 18, a kind of SMD crystal resonator of the present invention production technology of ceramic package:
The first common burning porcelain layer disperses through raw material earlier, and again through curtain coating, section, punching and seal hole (or filling perforation) operation, last planographic forms;
The second common burning porcelain layer is manufactured and is formed through curtain coating, section, punching (and towards chamber) operation more earlier through the raw material dispersion step;
The above-mentioned first common burning porcelain layer and the second common burning porcelain layer manufacture finish after, with the stacked first common burning porcelain layer upside of being located at of second common burning porcelain, make the common burning porcelain layer via pressing, cutting, protection of reducing atmosphere sintering, plating and burst operation again;
The earlier dry-pressing formed back of ceramic cover plate sintering in air forms, and burns the ceramic layer sealing together by low temperature glass or resin then.
The above, only be of the preferred embodiment of a kind of SMD crystal resonator of the present invention with ceramic package and production technology thereof, be not that technical scope of the present invention is imposed any restrictions, every foundation technical spirit of the present invention all still belongs in the scope of the technology of the present invention any trickle modification, equivalent variations and modification that top embodiment did.
Claims (5)
1. SMD crystal resonator ceramic package, comprise common burning porcelain layer and ceramic cover plate, the invention is characterized in: described common burning porcelain layer is made up of the first common burning porcelain layer that is superimposed and the second common burning porcelain layer, be provided with one in order to hold the cavity of crystal in the second common burning porcelain layer, be covered with one deck ceramic cover plate in the top of the second common burning porcelain layer, support crystal and the boss of the electrode on the crystal in the upside of the first common burning porcelain layer being used to of being provided with that printing forms, be provided with the via that is used for conducting bottom surface pad and resonant crystal in the periphery of the first common burning porcelain layer by via on the ground floor and bottom surface pad conducting.
2. a kind of SMD crystal resonator ceramic package according to claim 1 is characterized in that the upside of the described first common burning porcelain layer also is provided with a plane conductive layer.
3. a kind of SMD crystal resonator ceramic package according to claim 1 is characterized in that described via is edge via or inner via hole.
4. a SMD crystal resonator is with the production technology of ceramic package, and it is characterized in that: the first common burning porcelain layer disperses through raw material earlier, again through curtain coating,
Punching, seal hole operation, last planographic forms;
The second common burning porcelain layer disperses through raw material earlier, again through curtain coating,
Punching
Operation is manufactured and is formed;
The above-mentioned first common burning porcelain layer and the second common burning porcelain layer manufacture finish after, with the stacked first common burning porcelain layer upside of being located at of second common burning porcelain, again via
, cutting,
Plating and burst operation are made the common burning porcelain layer;
The earlier dry-pressing formed back of ceramic cover plate sintering in air forms, and burns the ceramic layer sealing together by low temperature glass or resin then.
5. SMD crystal resonator according to claim 4 is characterized in that with the production technology of ceramic package the described first common burning porcelain layer disperses through raw material earlier, again through curtain coating,
Punching, filling perforation operation, last planographic forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100773014A CN101132169A (en) | 2007-09-19 | 2007-09-19 | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100773014A CN101132169A (en) | 2007-09-19 | 2007-09-19 | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101132169A true CN101132169A (en) | 2008-02-27 |
Family
ID=39129322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100773014A Pending CN101132169A (en) | 2007-09-19 | 2007-09-19 | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101132169A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076171A (en) * | 2010-12-22 | 2011-05-25 | 广东大普通信技术有限公司 | Printed circuit board packaging method and crystal oscillator |
| WO2012045214A1 (en) * | 2010-10-08 | 2012-04-12 | 潮州三环（集团）股份有限公司 | Ceramic packaging base having convex platforms |
| CN102545823A (en) * | 2010-12-28 | 2012-07-04 | 日本电波工业株式会社 | Surface mount crystal oscillator and substrate sheet |
| CN101594120B (en) * | 2008-05-28 | 2012-07-25 | 上海晶赛电子有限公司 | Manufacturing method of ceramic packaged sheet type quartz crystal frequency device |
| CN102865939A (en) * | 2012-09-12 | 2013-01-09 | 上海大学 | Laser bonding temperature acquisition system for photoelectric device packaging and method for photoelectric device packaging |
| CN103681522A (en) * | 2012-09-18 | 2014-03-26 | 三菱电机株式会社 | Semiconductor device |
| CN103840790A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Cold pressure welding ceramic package case and crystal oscillator using the same |
| CN103840788A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Energy-storage-soldered ceramic packaging shell and crystal oscillator using shell |
| CN103840791A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Low-temperature glass-ceramic package case and crystal oscillator using the same |
| CN103840789A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Single-layer ceramic packaging shell and crystal oscillator using shell |
| CN103928447A (en) * | 2013-01-14 | 2014-07-16 | 内蒙航天动力机械测试所 | Large-power full-airtight semiconductor module packaging structure |
| CN109156080A (en) * | 2016-05-16 | 2019-01-04 | 株式会社村田制作所 | Ceramic electronic components |
| WO2020134597A1 (en) * | 2018-12-29 | 2020-07-02 | 中芯集成电路（宁波）有限公司上海分公司 | Integrated structure of crystal resonator and control circuit, and method for integration thereof |
| WO2020134601A1 (en) * | 2018-12-29 | 2020-07-02 | 中芯集成电路（宁波）有限公司上海分公司 | Integrated structure of and integrated method for crystal resonator and control circuit |
| WO2020134604A1 (en) * | 2018-12-29 | 2020-07-02 | 中芯集成电路（宁波）有限公司上海分公司 | Integration structure of crystal oscillator and control circuit and integration method therefor |
| CN114453740A (en) * | 2022-02-25 | 2022-05-10 | 中国人民解放军国防科技大学 | A kind of assembly device and method of quartz resonator based on laser welding |
-
2007
- 2007-09-19 CN CNA2007100773014A patent/CN101132169A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594120B (en) * | 2008-05-28 | 2012-07-25 | 上海晶赛电子有限公司 | Manufacturing method of ceramic packaged sheet type quartz crystal frequency device |
| WO2012045214A1 (en) * | 2010-10-08 | 2012-04-12 | 潮州三环（集团）股份有限公司 | Ceramic packaging base having convex platforms |
| CN102076171A (en) * | 2010-12-22 | 2011-05-25 | 广东大普通信技术有限公司 | Printed circuit board packaging method and crystal oscillator |
| CN102545823A (en) * | 2010-12-28 | 2012-07-04 | 日本电波工业株式会社 | Surface mount crystal oscillator and substrate sheet |
| CN102545823B (en) * | 2010-12-28 | 2014-10-01 | 日本电波工业株式会社 | Surface mount crystal oscillators and substrate wafers |
| CN102865939B (en) * | 2012-09-12 | 2014-07-09 | 上海大学 | Laser bonding temperature acquisition system for photoelectric device packaging and method for photoelectric device packaging |
| CN102865939A (en) * | 2012-09-12 | 2013-01-09 | 上海大学 | Laser bonding temperature acquisition system for photoelectric device packaging and method for photoelectric device packaging |
| CN103681522A (en) * | 2012-09-18 | 2014-03-26 | 三菱电机株式会社 | Semiconductor device |
| CN103840791A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Low-temperature glass-ceramic package case and crystal oscillator using the same |
| CN103840789A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Single-layer ceramic packaging shell and crystal oscillator using shell |
| CN103840788A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Energy-storage-soldered ceramic packaging shell and crystal oscillator using shell |
| CN103840790A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Cold pressure welding ceramic package case and crystal oscillator using the same |
| CN103928447A (en) * | 2013-01-14 | 2014-07-16 | 内蒙航天动力机械测试所 | Large-power full-airtight semiconductor module packaging structure |
| CN103928447B (en) * | 2013-01-14 | 2016-09-28 | 内蒙航天动力机械测试所 | A kind of high-power complete airtight semiconductor module encapsulating structure |
| CN109156080A (en) * | 2016-05-16 | 2019-01-04 | 株式会社村田制作所 | Ceramic electronic components |
| CN109156080B (en) * | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | Ceramic electronic component |
| WO2020134597A1 (en) * | 2018-12-29 | 2020-07-02 | 中芯集成电路（宁波）有限公司上海分公司 | Integrated structure of crystal resonator and control circuit, and method for integration thereof |
| WO2020134601A1 (en) * | 2018-12-29 | 2020-07-02 | 中芯集成电路（宁波）有限公司上海分公司 | Integrated structure of and integrated method for crystal resonator and control circuit |
| WO2020134604A1 (en) * | 2018-12-29 | 2020-07-02 | 中芯集成电路（宁波）有限公司上海分公司 | Integration structure of crystal oscillator and control circuit and integration method therefor |
| CN114453740A (en) * | 2022-02-25 | 2022-05-10 | 中国人民解放军国防科技大学 | A kind of assembly device and method of quartz resonator based on laser welding |
| CN114453740B (en) * | 2022-02-25 | 2023-10-17 | 中国人民解放军国防科技大学 | An assembly device and method for quartz resonator based on laser welding |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101132169A (en) | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof | |
| CN105122443B (en) | High-frequency component and the high-frequency model for having it | |
| US20140177179A1 (en) | Wiring substrate, electronic device, and electronic module | |
| CN106062946B (en) | Electronic unit storage packaging part and electronic device | |
| JP2008258478A (en) | Electronic component device and its manufacturing method | |
| CN103840790A (en) | Cold pressure welding ceramic package case and crystal oscillator using the same | |
| CN201130926Y (en) | Ceramic packing piece for SMD crystal resonator | |
| CN203014757U (en) | Cold pressure welding ceramic sealed housing and crystal oscillator employing same | |
| JP7163409B2 (en) | Substrate for mounting electronic device and electronic device | |
| CN201490984U (en) | Quartz crystal resonator | |
| CN209544336U (en) | A kind of ceramic packaging substrate compoboard improving flatness | |
| CN103956343B (en) | A kind of chip-packaging structure and processing technology thereof | |
| JP4570301B2 (en) | Electronic component storage container | |
| CN201378591Y (en) | Surface-mounted metal wall ceramic substrate shell | |
| CN214672573U (en) | Multi-chip sintered ceramic packaging structure | |
| US10879184B2 (en) | Electronic device mounting board, electronic package, and electronic module | |
| CN110832773B (en) | Packages for storing electronic components, electronic devices and electronic modules | |
| CN200956368Y (en) | Mounted package casing for semiconductor power device | |
| CN209046605U (en) | A kind of Novel resonator | |
| CN217280737U (en) | Large-size ceramic low-temperature glass sealing structure | |
| CN2497487Y (en) | Ceramic packing case of surface acoustic wave device | |
| JP3538774B2 (en) | Wiring board | |
| CN219937047U (en) | Integrated chip packaging structure | |
| CN217544602U (en) | Surface-mounted chip packaging structure | |
| CN201340851Y (en) | Mounting type packaging casing of semiconductor power device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: CHAOZHOU SANHUAN ( GROUP ) CO., LTD. Free format text: FORMER OWNER: YANG SHAOHUA Effective date: 20081114 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20081114 Address after: Guangdong Chaozhou Huan San Huan industrial city, postal code: 515646 Applicant after: Chaozhou Three-Circle (Group) Co., Ltd. Address before: 7, building 205, Che Kung Temple Industrial Zone, Shenzhen, Guangdong, Futian District Province, China: 518000 Applicant before: Yang Shaohua |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |