CN101124683B - Lighting device and lighting device - Google Patents

Abstract

The invention discloses a light-emitting device, which is provided with: a base body which extends from the upper surface to the lower surface or the side surface to form a wiring conductor; a light emitting element mounted on the upper surface of the base and electrically connected to the wiring conductor; a 1 st light-transmitting portion that covers the light-emitting element; a 2 nd translucent portion provided above the 1 st translucent portion so as to cover the 1 st translucent portion, the 2 nd translucent portion being configured by containing a phosphor for converting a wavelength of light emitted by the light emitting element in a translucent material; and a 3 rd light transmitting portion provided between the 1 st light transmitting portion and the 2 nd light transmitting portion, wherein when the refractive index of the 1 st light transmitting portion is n1, the refractive index of the 2 nd light transmitting portion is n2, and the refractive index of the 3 rd light transmitting portion is n3, relationships of n3 < n1 and n3 < n2 are satisfied. With such a configuration, high light extraction efficiency, emitted light intensity, on-axis luminosity, and brightness can be achieved.

Description

Lighting devices and lighting devices

technical field

The present invention relates to a light-emitting device that converts light emitted from a light-emitting element by a phosphor and emits it to the outside, and a lighting device using the light-emitting device. the

Background technique

FIG. 18 shows a conventional light emitting device 211 for accommodating a light emitting element 214 such as a light emitting diode (LED). As shown in FIG. 18, the light-emitting device has a mounting portion 212a on which a light-emitting element 214 is mounted in the center of the upper surface, and is mainly composed of a base 212 formed with a wiring conductor (not shown). The wiring conductor is composed of a lead terminal or a metallized wiring that electrically connects the mounting portion 212a and its periphery to the inside and outside of the light emitting device; and the housing 213, which is bonded and fixed to the substrate 212, and a through hole for accommodating the light emitting element 214 is formed in the central part, and is made of metal, resin or ceramics. the

The base body 212 is made of alumina sintered body (alumina ceramics), aluminum nitride sintered body, mullite sintered body, ceramics such as glass ceramics, or resin such as epoxy resin. When the base body 212 is made of ceramics, a metallized wiring layer is formed on the upper surface by firing a metal paste made of tungsten (W), molybdenum (Mo)-manganese (Mn), etc. at a high temperature. In addition, when the base body 212 is made of resin, when the base body 212 is molded, the lead terminal made of copper (Cu) or iron (Fe)-nickel (Ni) alloy is formed at one end. The protrusions are fixed inside the base body 212 . the

The housing 213 is made of metal such as aluminum (Al) or Fe—Ni—Co alloy, ceramics such as alumina sintered body, or resin such as epoxy resin, and is formed by cutting, die molding, extrusion molding, or the like. In addition, in the central part of the housing 213, a through hole that expands outward with the face upward is formed. Metals such as Al are covered by plating method. Furthermore, the casing 213 is bonded to the upper surface of the base body 212 by a flux material such as solder or silver flux, or a resin adhesive. the

And, the wiring conductor (not shown) formed on the surface of the base body 212 is electrically connected to the electrodes of the light-emitting element 214 through a bonding wire, and then, after forming the phosphor layer 217 on the surface of the light-emitting element 214, the The inside of body 213 is filled with transparent resin 215 and cured by thermosetting to form a light-emitting device that converts the wavelength of light from light-emitting element 214 by phosphor layer 217 to extract light having a desired wavelength spectrum. In addition, as the light-emitting element 214, a material whose emission wavelength includes the ultraviolet region of 300 to 400 nm is selected, and the color tone can be freely adjusted by adjusting the mixing ratio of the phosphor particles of the three primary colors of red, blue, and green contained in the phosphor layer 217. design.

In addition, phosphor particles are generally powder, and it is difficult to form the phosphor layer 217 from phosphor alone. Therefore, phosphor particles are usually mixed into a transparent member such as resin or glass and coated on the surface of the light emitting element 214 to form the phosphor layer. 217. the

Patent Document 1: Patent No. 3065263 Gazette

Patent Document 2: JP-A-2003-110146 Gazette

However, in the case of the conventional light-emitting device 211, there are the following problems: that is, the light emitted to the lower side of the phosphor layer 217 after wavelength conversion by the phosphor layer 217, and the light emitted from the upper side of the phosphor layer 217 after emitting light from the light-emitting element. The light emitted downward from the surface is repeatedly reflected and attenuated inside the case 213, and is absorbed by the base 212 or the light emitting element 214, resulting in a significant increase in light loss. the

In addition, there is a problem that the light emitted obliquely upward from the light-emitting element 214 is not reflected by the housing 213, but is emitted at a large emission angle outside the light-emitting device 211, so the emission angle is large and the axis Lower gloss. the

Therefore, the present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a light emitting device and an illuminating device having improved light extraction efficiency and high emitted light intensity, on-axis light intensity, and luminance. the

Contents of the invention

The light-emitting device involved in the present invention has:

a substrate having wiring conductors;

a light-emitting element mounted on the upper surface of the substrate and electrically connected to the wiring conductor; a first light-transmitting part having a curved shape and covering the light-emitting element; a second light-transmitting part, which has a curved surface shape, is provided above the first light-transmitting part in such a manner as to cover the first light-transmitting part, and is constituted by including a phosphor in the light-transmitting material, and the phosphor pairs from the light-transmitting part. The wavelength of the light emitted by the light-emitting element is converted; the third light-transmitting part is arranged between the first light-transmitting part and the second light-transmitting part, and the first light-transmitting part When the refractive index of the second translucent part is n1, the refractive index of the second translucent part is n2, and the refractive index of the third translucent part is n3, n3<n1 and n3<n2 are satisfied. In this relationship, the third translucent portion has a constant thickness over the entire lower surface of the second translucent portion. the

In addition, in the invention, preferably, the third translucent portion is formed of a gas layer. the

In addition, in the invention, preferably, the fourth light-transmitting portion having a refractive index n4 is formed so as to be in contact with the lower surface of the second light-transmitting portion, and the refractive indices n2 and n4 satisfy n2>n4. relation. the

In addition, in the invention, it is preferable that the first translucent portion is formed of a silicone resin. the

In addition, in the invention, it is preferable that the second translucent portion is formed of a silicone resin containing a phosphor. the

In addition, in the invention, it is preferable that a reflective member bonded to surround the light-emitting element is provided on the outer peripheral portion of the upper surface of the base, and the reflective member has a light-reflective inner peripheral surface. the

In addition, in the invention, it is preferable that the shape of the upper surface of the first translucent portion is concave. the

In addition, in the invention, it is preferable that the shape of the upper surface of the first translucent portion is convex. the

In addition, in the invention, it is preferable that the first translucent portion is formed only on the upper surface and side surfaces of the light emitting element. the

In addition, in the invention, it is preferable that the light-emitting element emits light having a main luminescence peak in a near-ultraviolet region or an ultraviolet region. the

In addition, in the invention, the light emitting device described in any one of the above inventions is used as a light source. the

According to the present invention, the second translucent portion containing the phosphor is connected to the third translucent portion having a lower refractive index than the second translucent portion, so that the fluorescent light contained in the second translucent portion is utilized. After the body performs wavelength conversion, the light emitted from the fluorescent body in the downward direction and the light reflected in the downward direction by the upper surface of the second light-transmitting part are totally reflected by the lower surface of the second light-transmitting part, and the light Go upwards. Therefore, the emitted light intensity increases. the

In addition, the light incident from the outside into the light-emitting device is totally reflected by the interface between the second translucent portion and the third translucent portion, so it is possible to suppress deterioration of components caused by external light, such as the first translucent portion. The strength or transmittance of the part, and the deterioration of the adhesive strength. the

In addition, since the second translucent part containing the phosphor is provided so as to cover the entire first translucent part, the light emitted from the light emitting element enters the second translucent part without leakage and is converted in wavelength. Therefore, the luminous efficiency is improved. Further, since the wavelength of the light is not only converted by a part of the second translucent portion, but also the wavelength-converted light is emitted from the entire second translucent portion, color unevenness can be suppressed on the light emitting surface. the

In addition, as the third translucent part, it is preferable to be composed of a gas layer with a refractive index of about 1.0. Compared with the case of filling resin or the like with a refractive index of about 1.5, the phosphor contained in the second translucent part After the wavelength conversion, the light emitted from the phosphor in the downward direction and the light reflected in the downward direction by the upper surface of the second translucent part can be more fully absorbed by the lower surface of the second translucent part. Reflects and enables light to travel upwards. the

In addition, a heat insulating effect can be obtained by providing a gas layer between the external environment and the light emitting element. For this reason, heat transfer from the external environment to the light emitting element can be suppressed. As a result, the wavelength variation caused by the temperature variation of the light-emitting element is suppressed, and the color variation of the light emitted from the light-emitting device can be suppressed. the

In addition, by forming the fourth light-transmitting portion having a refractive index n4 so as to be continuous with the lower surface of the second light-transmitting portion containing phosphor, even if the phosphor particles are exposed on the lower surface of the second light-transmitting portion, the The exposed phosphor particles are also covered with the fourth translucent portion. Therefore, the light emitted from the phosphor is favorably reflected by the interface between the fourth translucent portion and the third translucent portion, and light loss can be prevented. the

In addition, since the refractive index n2 of the second translucent portion is greater than the refractive index n4 of the fourth translucent portion, the light traveling upward at the interface between the second translucent portion and the fourth translucent portion is Reflection loss is reduced, and light extraction efficiency is improved. the

In addition, by providing the fourth light-transmitting portion having a lower refractive index than the second light-transmitting portion and a higher refractive index than the third light-transmitting portion on the lower surface of the second light-transmitting portion, it is possible to Part of the light traveling downward after the wavelength conversion by the translucent portion travels toward the fourth translucent portion without being reflected by the interface between the second translucent portion containing the phosphor and the fourth translucent portion. Therefore, diffuse reflection of light enclosed in the second translucent portion can be alleviated. the

For this reason, diffusely reflected light is not concentrated on the second translucent portion, and optical degradation (deterioration of moisture resistance, transmittance, adhesive strength, etc.) of the second translucent portion is suppressed. And, the wavelength-converted light incident on the fourth translucent part from the second translucent part is more efficiently reflected at the interface with the gas layer. The reflective member is disposed around the optical portion, so that the wavelength-converted light can be extracted to the outside of the light-emitting device more efficiently. the

Moreover, it is preferable that the 1st translucent part is formed of silicone resin etc. Since the silicone resin is less likely to be degraded by ultraviolet rays, the reliability of sealing is improved, so that it is possible to suppress deterioration of luminous efficiency over time. the

Furthermore, it is preferable that the second translucent portion is formed of a silicone resin containing a phosphor. Since the silicone resin is less likely to be degraded by ultraviolet rays, the sealing reliability is improved, so that it is possible to suppress deterioration of luminous efficiency over time. the

In addition, it is preferable that a reflective member bonded to surround the light emitting element is provided on the outer peripheral portion of the upper surface of the substrate, and the reflective member preferably has a light reflective inner peripheral surface. Thereby, the light emitted from the light emitting element is reflected by the light reflecting surface, and travels to the upper side of the light emitting device, so the directivity of the light emission is improved. the

In addition, it is preferable that the reflective member is formed of a heat-conducting material, thereby increasing the heat-generating area of the base, thereby improving the heat dissipation of the light-emitting device. the

Moreover, it is preferable that the upper surface shape of the 1st translucent part is a concave shape. Thereby, the interface of the 1st translucent part and the 3rd translucent part functions as a concave lens which diffuses light. Therefore, the light from the light emitting element is uniformly irradiated to the entire second translucent portion, and the light emission distribution of the light emitting device is made uniform. the

Moreover, it is preferable that the upper surface shape of the 1st translucent part is a convex shape. Thereby, the interface of the 1st translucent part and the 3rd translucent part functions as a convex lens which focuses light. For this reason, the light from the light-emitting element enters the second translucent portion more efficiently, and the light-emitting intensity of the light-emitting device increases. the

In addition, it is preferable that the first translucent portion is provided only on the upper surface and side surfaces of the light emitting element. Since most of the light from the light-emitting element is emitted from the upper surface and side surfaces of the light-emitting element, reflection on the upper surface and side surfaces can be suppressed, and light extraction efficiency can be improved. the

In addition, preferably, the light-emitting element has a main luminescence peak in the near-ultraviolet region or ultraviolet region. As a result, all visible light emitted to the outside comes from light whose wavelength has been converted by the phosphor contained in the second translucent portion. As a result, when designing the color mixing ratio of light, the influence of light from the light-emitting element is reduced, and it is only necessary to adjust the composition of the phosphor. the

In addition, since the lighting device according to the present invention uses the above-mentioned light emitting device as a light source, there is provided a lighting device with improved light extraction efficiency and high emitted light intensity, axial luminosity, and luminance. the

Description of drawings

FIG. 1A is a cross-sectional view showing a first embodiment of the present invention. the

Fig. 1B is a cross-sectional view showing the first embodiment of the present invention. the

Fig. 2 is a cross-sectional view showing a second embodiment of the present invention. the

Fig. 3A is a cross-sectional view showing a third embodiment of the present invention. the

Fig. 3B is a cross-sectional view showing a third embodiment of the present invention. the

Fig. 4 is a cross-sectional view showing a fourth embodiment of the present invention. the

Fig. 5 is a cross-sectional view showing an example in which the first translucent portion is hemispherical. the

6 is a cross-sectional view showing an example of placing a lens-shaped lid. the

Fig. 7 is a cross-sectional view showing an example in which the third translucent portion is thin. the

Fig. 8 is a cross-sectional view showing a fifth embodiment of the present invention. the

Fig. 9 is a cross-sectional view showing an example in which a translucent member is hemispherical. the

Fig. 10 is a cross-sectional view showing an example in which a translucent member has a curved shape. the

Fig. 11 is a cross-sectional view showing a sixth embodiment of the present invention. the

Fig. 12 is a cutaway perspective view omitting the translucent parts of the light emitting device shown in Fig. 11 . the

13 is a cross-sectional view showing an example in which L-shaped lead terminals are provided on the lower surface of the substrate. the

14 is a plan view showing an example of a lighting device in which light emitting devices according to the present invention are arranged in an array. the

Fig. 15 is a cross-sectional view of the lighting device shown in Fig. 14 . the

Fig. 16 is a plan view showing another example of a lighting device in which light-emitting devices according to the present invention are arranged in a circular shape. the

Fig. 17 is a cross-sectional view of the lighting device shown in Fig. 16 . the

Fig. 18 is a cross-sectional view showing an example of a conventional light emitting device. the

In the figure: 1-light-emitting device, 2-substrate, 3-housing, 3a-reflecting surface, 3b-cutting part, 4-light-emitting element, 5-first translucent part, 6-fourth translucent part , 7-second light-transmitting part, G-third light-transmitting part, 9-reflecting tool, 10-light emitting device drive circuit board, 14-elastic member, 17-conductive connection member, 18-conductive path, 21 - Lead terminals. the

Implementation method

(first embodiment)

1A and 1B are cross-sectional views showing a first embodiment of the present invention. First, as shown in FIG. 1A , a light emitting device 1 is composed of a substrate 2 , a light emitting element 4 , a first translucent portion 5 , a second translucent portion 7 , a third translucent portion G, and the like. the

On the base body 2 , wiring conductors for supplying current to the light emitting element 4 are formed extending from the upper surface to the lower surface or side surfaces. the

The light emitting element 4 is mounted on the upper surface of the base 2 so as to be electrically connected to the wiring conductor of the base 2 . the

The first translucent portion 5 is formed of a translucent material and covers the light emitting element 4 . the

The second translucent part 7 is formed of a translucent material containing a phosphor that converts the wavelength of the light emitted by the light emitting element 4, and is provided on the first translucent part 5 so as to cover the first translucent part 5. above sex part 5. the

The third translucent part G is provided between the first translucent part 5 and the second translucent part 7 . the

The first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G are formed in a curved shape centered on the light emitting element 4 . the

In this embodiment, the refractive index of the first translucent portion 5 is n1, the refractive index of the second translucent portion 7 is n2, and the refractive index of the third translucent portion G is n3. In this case, the materials of the first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G are selected so as to satisfy the relationships of n3<n1 and n3<n2. the

Specifically, as the first translucent portion 5, silicone resin (refractive index: 1.41 to 1.52), epoxy resin (refractive index: 1.55 to 1.61), acrylic resin (refractive index: about 1.48), fluororesin, etc. can be used. (refractive index: about 1.31), polycarbonate resin (refractive index: about 1.59), poly(imide) resin (refractive index: about 1.68), and the like. the

In addition, as the second translucent portion 7, silicone resin (refractive index: 1.41 to 1.52), epoxy resin (refractive index: 1.55 to 1.61), acrylic resin (refractive index: about 1.48), fluororesin (refractive index: index: about 1.31), polycarbonate resin (refractive index: about 1.59), etc., and as the phosphor contained in the second light-transmitting portion 7, La ₂ O ₂ S:Eu, LiEuW ₂ O ₈ can be used , ZnS:Ag, SrAl ₂ O ₄ :Eu, ZnS:Cu, Al, ZnCdS:Ag, ZnS:Cu, (BaMgAl) ₁₀ O ₁₂ :Eu, SrCaS:Eu, (Sr, Ca, Ba, Mg) ₁₀ ( PO ₄ ) ₆ Cl ₂ :Eu etc.

In addition, as the third translucent portion G, a silicon resin, an epoxy resin, a fluororesin, or the like, or a gas layer made of air or the like can be used. In any case, the material is selected in such a manner as to satisfy the relationship of n3<n1 and n3<n2. For example, in the case where the light emitted from the light-emitting element has a main luminescence peak from the ultraviolet region to the near ultraviolet region, it is possible to use a silicone resin that has a high transmittance from the ultraviolet region to the near ultraviolet region and is not prone to yellowing or deterioration of strength, In this case, a silicone resin having a refractive index of 1.52 can be used as the first and second translucent parts 5 and 7, and a silicone resin having a refractive index of 1.41 can be used as the third translucent part. Thus, the light-emitting device of the present invention can be configured. the

With this structure, the second translucent portion 7 containing the phosphor is connected to the third translucent portion G having a lower refractive index than the second translucent portion 7, thereby utilizing the second translucent portion 7 Most of the light emitted from the phosphor in the downward direction after wavelength conversion by the phosphor contained in the phosphor and the light reflected in the downward direction by the upper surface of the second light-transmitting part 7 is reflected by the second translucent part 7 by means of total reflection or the like. 2 The lower surface of the translucent portion 7 reflects the light and makes it go upward. the

In addition, most of the light incident from the outside to the inside of the light-emitting device is reflected by the interface between the second light-transmitting portion 7 and the third light-transmitting portion G by means of total reflection. For example, the strength, transmittance, and adhesive strength of the first translucent portion 5 deteriorate. the

In addition, since the second translucent portion 7 containing phosphor is provided so as to cover the entire first translucent portion 5, the light emitted from the light emitting element 4 enters the second translucent portion 7 without leakage. Since the wavelength conversion is performed, the luminous efficiency is improved. the

In addition, as the third translucent part G, it is preferable to be composed of a gas layer with a refractive index of about 1.0, and the second translucent part 7 contains After the wavelength conversion of the fluorescent substance, most of the light emitted from the fluorescent substance in the downward direction and the light reflected in the downward direction by the upper surface of the second translucent part 7 is more transmitted by the second translucent part 7. Reflected by the lower surface of the light, it can make the light travel upward. the

In addition, a heat insulating effect can be obtained by providing a gas layer as the third translucent portion G between the external environment and the light emitting element 4 . For this reason, heat transfer from the external environment to the light emitting element 4 can be suppressed. As a result, wavelength variation caused by temperature variation of the light emitting element 4 is suppressed, thereby suppressing color variation of light emitted from the light emitting device. the

In addition, in this embodiment, it is preferable that the thickness of the 3rd translucent part G is substantially constant. The thickness of the third translucent portion G corresponds to the distance between the upper surface of the first translucent portion 5 and the lower surface of the second translucent portion 7, and preferably has an error of ±5% as a whole. the

If there are irregularities on the upper or lower surface of the third translucent portion G, and if the thickness is not substantially constant, refraction may occur on the upper and lower surfaces, and the light intensity distribution may vary. For this reason, by making the thickness of the 3rd translucent part G substantially constant, since the intensity distribution of the light incident from the 1st translucent part 5 to the 2nd translucent part 7 does not change, therefore in the 2nd translucent part G The distribution of the amount of light converted by the wavelength in the optical part 7 is also substantially uniform, and color dispersion and color unevenness on the light emitting surface can be suppressed. the

Next, in FIG. 1B , the shape of the base body 2 is carefully considered. The upper surface of the base body 2 on which the light-emitting element 4 is placed is flat, and the upper surface of the substrate 1 on which the light-emitting element 4 is placed is formed to be inclined upward toward the periphery. of the conical surface. By providing such an inclined surface, the light emitted from the light emitting element 4 is directed upward, so that the utilization efficiency of light is improved. the

(second embodiment)

Fig. 2 is a cross-sectional view showing a second embodiment of the present invention. The light-emitting device 1 is composed of a base 2, a case 3, a light-emitting element 4, a first translucent portion 5, a second translucent portion 7, a third translucent portion G, and the like. the

Wiring conductors for supplying current to the light emitting element 4 are arranged on the base body 2 from the upper surface to the lower surface or to the side surface. the

The light emitting element 4 is placed on the upper surface of the base 2 so as to be electrically connected to the wiring conductor of the base 2 . the

The casing 3 is fixed on the base 2 and has an upwardly inclined inner surface surrounding the light emitting element 4 . The inner surface of the casing 3 preferably has light reflectivity from the viewpoint of light utilization efficiency. the

The first translucent portion 5 is formed of a translucent material and covers the light emitting element 4 . the

The second light-transmitting part 7 is formed by a light-transmitting material containing a phosphor that converts the wavelength of the light emitted by the light-emitting element 4, and is above the first light-transmitting part 5 to cover the first light-transmitting part 5. Sex section 5 way set. the

The third translucent portion G is provided between the first translucent portion 5 and the second translucent portion 7 . the

The first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G have horizontal interfaces so that a multilayer structure substantially parallel to the upper surface of the base body 2 can be obtained. the

In this embodiment, the refractive index of the first translucent portion 5 is n1, the refractive index of the second translucent portion 7 is n2, and the refractive index of the third translucent portion G is n3. In this case, the materials of the first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G are selected so as to satisfy the relationships of n3<n1 and n3<n2. As specific materials, those listed in the above-mentioned embodiments can be used, and by appropriately combining these materials, the relationships of n3<n1 and n3<n2 can be satisfied. the

With this configuration, the second light-transmitting portion 7 containing the phosphor is connected to the third light-transmitting portion G whose refractive index is lower than that of the second light-transmitting portion 7. Most of the light emitted from the phosphor in the downward direction after wavelength conversion by the phosphor contained in the transparent part 7 and the light reflected in the downward direction by the upper surface of the second light-transmitting part 7 is completely reflected. , making the light travel upwards. the

In addition, most of the light incident from the outside to the inside of the light-emitting device is radiated from the interface between the second light-transmitting portion 7 and the third light-transmitting portion by means of total reflection, etc. For example, deterioration of the strength, refractive index, and adhesive strength of the first translucent portion 5 can be suppressed. the

In addition, since the second translucent part 7 is provided so as to cover the entire first translucent part 5, the light emitted from the light emitting element 4 enters the second translucent part 7 without leakage and is converted in wavelength. , so the luminous efficiency is improved. the

In addition, as the third light-transmitting portion G, it is preferable to be composed of a gas layer having a refractive index of about 1.0, and the second light-transmitting portion 7 contains After the wavelength conversion of the phosphor, the lower surface of the second translucent part 7 can reflect the light emitted from the phosphor in the downward direction and the light reflected by the upper surface of the second translucent part 7 in the downward direction. Most of the light is reflected more, and the light travels upward. the

In addition, a heat insulating effect can be obtained by providing a gas layer as the third translucent portion between the external environment and the light emitting element 4 . For this reason, heat transfer from the external environment to the light emitting element 4 can be suppressed. As a result, it is possible to suppress fluctuations in wavelength due to temperature fluctuations in the light emitting element 4 , thereby suppressing color fluctuations in light emitted from the light emitting device. the

Moreover, in this embodiment, it is preferable that the thickness of the 3rd translucent part G is substantially constant. Preferably, the thickness of the third translucent portion G corresponds to the distance between the upper surface of the first translucent portion 5 and the lower surface of the second translucent portion 7, within an error range of ±5% as a whole. the

Assuming that the upper or lower surface of the third translucent portion G has irregularities, etc., and the thickness is not substantially constant, the light intensity distribution may fluctuate due to refraction on the upper and lower surfaces. For this reason, by making the thickness of the 3rd translucent part G substantially constant, the light intensity distribution from the 1st translucent part 5 incident to the 2nd translucent part 7 does not change, therefore by the 2nd translucent part G 7. The light quantity distribution after the wavelength conversion is substantially uniform, and it is possible to suppress color dispersion or color unevenness on the light emitting surface. the

(third embodiment)

3A and 3B are cross-sectional views showing a third embodiment of the present invention. First, as shown in FIG. 3A , light emitting device 1 is composed of base 2 , case 3 , light emitting element 4 , first translucent portion 5 , second translucent portion 7 , third translucent portion G, and the like. the

On the base body 2 , wiring conductors for supplying current to the light emitting elements are formed extending from the upper surface to the lower surface. the

The light emitting element 4 is placed on the upper surface of the base 2 so as to be electrically connected to the wiring conductor of the base 2 . the

The housing 3 is fixed on the base body 2 and has an upwardly inclined inner surface surrounding the light emitting element 4 . The inner surface of the casing 3 preferably has light reflectivity from the viewpoint of light utilization efficiency. the

The first translucent portion 5 is formed of a translucent material and covers the light emitting element 4 . the

The second light-transmitting part 7 is formed by a light-transmitting material containing a phosphor that converts the wavelength of the light emitted by the light-emitting element 4, and is above the first light-transmitting part 5 to cover the first light-transmitting part 5. Sex section 5 way set. the

The third translucent portion G is provided between the first translucent portion 5 and the second translucent portion 7 . the

In this embodiment, the refractive index of the first translucent portion 5 is n1, the refractive index of the second translucent portion 7 is n2, and the refractive index of the third translucent portion G is n3. In this case, the materials of the first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G are selected so as to satisfy the relationships of n3<n1 and n3<n2. As specific materials, the materials listed in the above-mentioned embodiments can be used, and by appropriately combining these materials, the relationships of n3<n1 and n3<n2 can be satisfied. the

In addition, as shown in FIG. 3A, the lower surface of the first translucent portion 5, the upper surface of the second translucent portion 7, and the interface between the second translucent portion 7 and the third translucent portion G have The interface substantially parallel to the upper surface of the base body 2 and the shape of the upper surface of the first translucent portion 5 are preferably concave. Thereby, the interface between the 1st translucent part 5 and the 3rd translucent part G functions as a concave lens which diffuses light. Therefore, the light from the light emitting element 4 is uniformly irradiated to the entire second translucent portion 7, and the light emission distribution of the light emitting device 1 becomes uniform. the

Instead, as shown in FIG. 3B , it is preferable that the upper surface shape of the first translucent portion 5 is convex. Thereby, the interface of the 1st translucent part 5 and the 3rd translucent part G functions as a convex lens which focuses light. Therefore, the light from the light emitting element 4 enters the second translucent portion 7 efficiently, and the light emission intensity of the light emitting device 1 increases. the

Hereinafter, specific examples will be described. the

(Example 11)

A plate-shaped alumina ceramic substrate having a width of 15 mm x a depth of 15 mm x a thickness of 1 mm and a wiring conductor extending from the upper surface of the base on which the light emitting element is mounted to the outer surface of the base was prepared. the

In addition, the substrate on which the light-emitting element is placed has a pair of circular pads connected to the electrodes of the light-emitting element on the upper surface, and is formed by a metallization layer obtained by providing Mo-Mn powder. the

Also, on the surfaces of the pair of circular pads, a Ni plating layer with a thickness of 3 μm and an Au plating layer with a thickness of 3 μm were formed by electrolytic plating. the

In addition, on the upper surface of the above-mentioned substrate, in a manner surrounding the light-emitting element, a shell-shaped shell made of Al (aluminum) after chemically polishing a surface of 15mm×15mm×thickness 5mm is adhered through an adhesive material formed of acrylic resin. reflection component. In addition, this reflective member has a through hole as follows: the inner peripheral diameter _φ1 of the lower end is 5mm, the inner peripheral diameter _φ2 of the upper end is 10mm, and the inner peripheral surface is formed to widen along with the upper end. Straight slope.

Next, the electrodes of a pair of light-emitting elements that emit near-ultraviolet light having a peak at a wavelength of 405 nm and have a size of 0.35 mm×0.35 mm×thickness 0.1 mm are fixed on the above-mentioned circular pads with silver paste. mm, and composed of nitride-based compound semiconductors. the

Thereafter, the first translucent portion 5 made of silicone resin with a refractive index n1=1.41 was dropped using a dispenser so as to cover the light-emitting element to a thickness of 2.5 mm inside the reflective member. the

On the other hand, forming: La ₂ O ₂ S:E _U (red phosphor), ZnS:Cu, Al (green phosphor), (BaMgAl) ₁₀ O ₁₂ :Eu (blue phosphor) in epoxy resin ) with a refractive index n2=1.55, and a plate-shaped second translucent portion 7 having a thickness of 0.5 mm. The second light-transmitting portion is arranged above the first light-transmitting portion 5 so as to cover the entire first light-transmitting portion 5 , and is adhered to a reflective member to form a light-emitting device. At this time, the first translucent portion 5 and the second translucent portion 7 are provided with a gap of 2 mm, and this gap functions as the third translucent portion G having a refractive index n3=1. The same applies to the following examples.

(Example 12)

Except that the thickness is 0.5mm, the fourth light-transmitting part 6 formed in the shape of a plate with a refractive index n=1.41 made of silicone resin is closely attached to the lower surface of the second light-transmitting part 7, the same as the embodiment. 11 Similarly, a light emitting device is formed. Here, although the refractive index n4 of the 4th translucent part 6 is smaller than the refractive index of the 2nd translucent part 7, it differs from Example 11. As shown in FIG. the

(Comparative Example 11)

In addition to filling the interior of the light-emitting device surrounded by the inner peripheral surface of the reflective member and the second light-transmitting portion 7 with the first light-transmitting portion 5, the third light-transmitting portion G and the fourth light-transmitting portion are not provided. Except for 6, a light-emitting device was formed in the same manner as in Example 12. the

When measuring the total beam power of each of Examples 11, 12 and Comparative Example 11, the total beam power of Example 11 was about 3% higher than that of Comparative Example 11, and the total beam power of Example 12 was about 3% higher than that of Comparative Example. 11, about 7% more. Therefore, it was confirmed that Example 11 and Example 12 had better luminous efficiency than Comparative Example 11. the

(fourth embodiment)

Fig. 4 is a sectional view showing a fourth embodiment of the present invention. The light emitting device 1 is composed of a base 2, a case 3, a light emitting element 4, a first translucent portion 5, a second translucent portion 7, a third translucent portion G, a fourth translucent portion 6, and the like. the

The substrate 2 is made of alumina ceramics, aluminum nitride sintered body, mullite sintered body, ceramics such as glass ceramics, resin such as epoxy resin, or metal, and serves as a support for supporting the light emitting element 4 components to function. the

When the base body 2 is made of ceramics, wiring conductors (not shown) for electrically connecting the light emitting elements 4 are formed on the upper surface of the base body 2 or its periphery. The wiring conductor is led out to the outer surface of the base body 2 and connected to the external circuit board 4, whereby the light emitting element 4 and the external circuit board are electrically connected. the

As a method of connecting the light-emitting element 4 to the wiring conductor, a method of connecting by wire connection (not shown) or a flip-chip method of connecting the lower surface of the light-emitting element 4 through a solder pad (not shown) can be used. Chip-wise approach. Preferably, it can be connected by flip chip (flip chip) connection. Thus, since the wiring conductor can be provided directly under the light emitting element 4 , it is not necessary to provide a space for arranging the wiring conductor on the upper surface of the substrate 2 around the light emitting element 4 . Therefore, the light emitted from the light emitting element 4 can be effectively suppressed from being absorbed by the wiring conductor space of the base body 2 to reduce the light emission intensity, and the light emitting device 1 can be miniaturized. the

When the base body 2 is made of ceramics, the wiring conductor is formed of, for example, a metallized layer of metal powder such as W, Mo, Cu, silver (Ag), or the like. Alternatively, an input/output terminal made of an insulator formed with a wiring conductor is fitted and connected to a through-hole provided in the base body 2 to provide it. In addition, when the base body 2 is made of resin, it is formed by embedding lead terminals such as Fe—Ni—Co alloy or the like. the

In addition, it is also possible to cover the exposed surface of the wiring conductor with a metal with excellent corrosion resistance such as Ni or gold (Au) with a thickness of 1 to 20 μm, so as to effectively prevent the oxidation and corrosion of the wiring conductor and obtain strong luminescence at the same time. Connection of element 4 and wiring conductors. Therefore, on the exposed surface of the wiring conductor, a Ni plating layer with a thickness of approximately 1 to 10 μm and an Au plating layer with a thickness of approximately 0.1 to 3 μm are sequentially applied by an electrolytic plating method or an electroless plating method. the

The case 3 is formed of metal such as Al or Fe—Ni—Co alloy, ceramics such as alumina ceramics, or resin such as epoxy resin, and is formed by cutting, die molding, extrusion molding, or the like. the

In addition, it is preferable that the arithmetic mean roughness Ra of the surface of the inner peripheral surface of the housing 3 is 0.1 μm or less. As a result, light from the light emitting element 4 can be favorably reflected to the upper side of the light emitting device 1 . When Ra exceeds 0.1 μm, it is difficult to reflect light upward by the inner peripheral surface of the case 3 of the light emitting element 4, and it is easy to be reflected by the inside of the light emitting device 1. As a result, the transmission loss of light inside the light emitting device 1 tends to be large, and it is difficult to emit light to the outside of the light emitting device 1 at a desired emission angle. the

In addition, phosphors of three primary colors, such as red, blue, and green, are mixed into a light-transmitting part such as epoxy resin, silicone resin, acrylic resin, or glass, and the upper surface of the second light-transmitting part is coated or loaded. The second translucent portion 7 is formed. Various materials can be used as the phosphor, for example, La ₂ O ₂ S:Eu (Eu-doped La ₂ O ₂ S) phosphor can be used for red, and ZnS:Cu, Al phosphor can be used for green Phosphors such as phosphors and blue (BaMgAl) ₁₀ O ₁₂ :Eu phosphors are used. In addition, such phosphors are not limited to one kind, and a plurality of phosphors may be mixed in any ratio, thereby enabling output of light having a desired emission spectrum and color.

Moreover, it is preferable that the thickness of the 2nd translucent part 7 is 0.1-1 mm. Accordingly, it is possible to efficiently convert the wavelength of the light emitted from the light emitting element 4 . If the thickness of phosphor layer 7 is less than 0.1 mm, the ratio of light emitted from light emitting element 4 that passes through phosphor layer 7 without wavelength conversion by phosphor layer 7 increases, and the wavelength conversion efficiency tends to decrease. In addition, when the thickness exceeds 1 mm, the light after wavelength conversion by the phosphor layer 7 is easily absorbed by the phosphor layer 7, and the emitted light intensity tends to decrease. the

In addition, the first translucent portion 5 is formed to cover the light emitting element 4 . The first translucent portion 5 may be made of a material that has a small difference in refractive index from the light emitting element 4 and has a high light transmittance from the ultraviolet region to the visible light region. For example, the first translucent portion 5, It is made of transparent resin such as silicone resin and epoxy resin, or low-melting point glass, sol-gel (ゾル-ゲル) glass, or the like. Accordingly, it is possible to suppress the occurrence of reflection loss of light due to the difference in refractive index between the light emitting element 4 and the first translucent portion 5 . the

Preferably, the first translucent portion 5 is made of silicone resin. Since the silicone resin is less likely to be degraded by light such as ultraviolet light emitted from the light emitting element 4, a light emitting device with high sealing reliability can be provided. the

Moreover, it is preferable that the 1st translucent part 5 is hemispherical as shown in FIG. As a result, the traveling direction of the light emitted from the light-emitting element 4 can form an angle perpendicular to the upper surface of the first translucent portion 5 , so that it can be completely reflected without being totally reflected by the upper surface of the first translucent portion 5 . , extract light efficiently, and can be used as a light-emitting device 1 with high emission light intensity. the

In addition, as the third translucent portion G, a silicone resin, an epoxy resin, a fluororesin, or the like can be used, or a gas layer composed of air or the like can be used. In any case, the material is selected so as to satisfy the relationship of n3<n1 and n3<n2. For example, when light emitted from a light-emitting element has a main luminescence peak in the outer region, a silicone resin that has a high transmittance from the ultraviolet region to the near-ultraviolet region and is less prone to yellowing or deterioration of strength can be used. In this case, as the first and second translucent parts 5, 7, a silicone resin with a refractive index of 1.52 is used, and as the third translucent part, a silicone resin with a refractive index of 1.41 is used. Thus, the light-emitting device of the present invention can be configured. the

Preferably, the fourth translucent portion 6 is formed on the lower surface of the second translucent portion 7 . Thus, even if the phosphor is exposed to the lower surface of the second translucent portion 7, by covering the exposed phosphor with the fourth translucent portion 6, it is possible to use the lower surface of the fourth translucent portion 6 to protect the phosphor from the phosphor. The emitted light undergoes good total reflection, and the light travels upward. Therefore, it is possible to obtain a light-emitting device 1 that prevents light from being absorbed by the substrate 2 and the light-emitting element 4 by directly emitting light from the phosphor through the gap, and further improves light extraction efficiency. the

Such a 4th translucent part 6 may also be provided in such a manner as to cover the first translucent part 5 with a gap between the first translucent part 5, and is formed from the ultraviolet range to the visible light range. Made of materials with high light transmittance. In this way, since the 4th translucent part 6 is provided so as to cover the 1st translucent part with a gap between the 1st translucent part 6, the upper surface of the 1st translucent part 5 can When the light emitted in a wide range is incident on the lower surface of the fourth translucent portion 6 , it can travel upward at a right angle with respect to the base 2 . Therefore, by making the length of the optical path transmitted through the second light-transmitting portion 7 close to the entire second light-transmitting portion 7, color unevenness caused by a difference in wavelength conversion efficiency can be effectively prevented. By making the light-emitting device 1 Emitting light with good on-axis directivity can improve the intensity of emitted light, on-axis luminosity, and brightness. the

In addition, since the lower surface of the fourth translucent part 6 is connected to the third translucent part G composed of an air layer with a lower refractive index, it is possible to use the lower surface of the fourth translucent part 6 to The upper surface of the second light-transmitting portion 7 performs total reflection on most of the light reflected in the downward direction, which can effectively prevent the light from being repeatedly reflected and attenuated by the inside of the housing 3 or absorbed by the base body 2 or the light-emitting element 4. , so that the reduction in light extraction efficiency can be effectively suppressed. the

In addition, the third translucent part G, that is, the gap between the first translucent part 5 and the second translucent part 7 or the gap between the first translucent part 5 and the fourth translucent part 6, It does not necessarily have to be an air layer as long as it is smaller than the refractive index of the first translucent portion 5 or the fourth translucent portion 6 or the second translucent portion 7 constituting the phosphor layer. For example, another gas layer may be used, or a layer of a light-transmitting portion having a low refractive index may be used. the

The 4th translucent part 6 can be made of a material that has a small refractive index difference with the 2nd translucent part 7 and has a high transmittance with respect to light from the ultraviolet region to the visible region. For example, the 4th translucent part The optical portion 6 is made of transparent resin such as silicone resin or epoxy resin, low-melting glass, sol-gel glass, or the like. Preferably, the fourth translucent portion 6 is made of the same material as the second translucent portion 7 constituting the phosphor layer. Thus, it is possible to satisfactorily transmit light at the interface between the second translucent portion 7 and the fourth translucent portion 6 to further reduce light loss, and to effectively prevent: The stress caused by the difference in the coefficient of thermal expansion between the fourth light-transmitting parts 6 causes them to peel off. the

Moreover, it is preferable to make the 1st translucent part 5 into silicone resin. Since the silicone resin is less likely to be degraded by light such as ultraviolet light emitted from the light emitting element 4, it is possible to provide a light emitting device with high sealing reliability. the

In addition, regarding the thickness of the first translucent part 5, or the distance (width of the gap) between the first translucent part 5 and the second translucent part 7, the first translucent part 5 and the fourth translucent part The distance between the optical parts 6 (the width of the gap) and the thickness of the fourth translucent part 6 can be determined by considering the interface between the first translucent part 5 and the second translucent part 7 or the thickness of the first translucent part. 5 and the reflection efficiency of the interface of the fourth translucent part 6 is appropriately selected. the

In addition, assuming that the thickness of the light-emitting device is the same, it is preferable that, as shown in FIG. The interval of 7 (the width of the gap), or the interval between the upper surface of the first translucent part 5 and the fourth translucent part 6 (the width of the gap) may be smaller than the thickness of the first translucent part 5 . Thus, by reducing the thermal expansion coefficient of the gap and sufficiently absorbing the stress caused by the thermal expansion of the gap by the first translucent portion 5, light emission of the light emitting element 4 due to stress generated in the light emitting element 4 can be prevented favorably. Characteristics change. the

On the other hand, from the viewpoint of reducing light loss, assuming that the thickness of the light-emitting device is the same, the total thickness of the first light-transmitting portion 5 and the second light-transmitting portion 6 (without the second light-transmitting portion 6) may be In the case of the translucent part 6, it is the thickness of the first translucent part 5), the width of the gap (the interval between the first translucent part 5 and the second translucent part 6 or the first translucent part 5 and the second translucent portion 7) is small. Thus, in the path through which the light emitted from the light-emitting element 4 passes before being emitted to the outside, the ratio of the air layer with high transmittance can be increased, and it is possible to suppress being enclosed in the light-emitting device or being caused by repeated diffuse reflection. resulting in light transmission loss. the

In addition, as shown in FIG. 6, on the upper surface of the case 3, glass, sapphire, quartz or epoxy resin, silicone resin, acrylic resin, polycarbonate resin, poly(imide) resin may be placed and fixed. Cover body 8 made of transparent parts such as resin (plastics). At this time, the light-emitting element 4, the wiring conductor, the connection lead, the first light-transmitting portion 5, and the fourth light-transmitting portion 6 mounted inside the case 3 can be protected, and the inside of the light-emitting device 1 can be protected. Hermetic sealing enables the light-emitting element 4 to work stably for a long time. Also, by forming the cover in a lens shape and adding the function of an optical lens, light can be taken out of the light emitting device 1 with a desired emission angle and intensity distribution by focusing or diverging light. the

In addition, the light-emitting device 1 of this embodiment is used by installing a single device in a predetermined arrangement, or arranging a plurality of devices in, for example, a grid, a stagger, or a radial form, or in the following manner: Install and use as a light source in a predetermined arrangement: that is, a circular or polygonal light-emitting device group composed of a plurality of light-emitting devices is formed concentrically, thereby becoming the lighting device of the present invention. Accordingly, it is possible to provide an illuminating device with improved light extraction efficiency and high emitted light intensity, axial luminosity, and luminance. the

In addition, since the light emission caused by the recoupling of electrons in the light emitting element 4 made of semiconductor is used, it is possible to achieve low power consumption and long life compared with conventional lighting devices using discharge, and it is possible to become a small-sized lighting with little heat generation. device. As a result, fluctuations in the central wavelength of light generated from the light emitting element 4 can be suppressed, and light can be irradiated with a stable emitted light intensity and emitted light angle (light distribution) over a long period of time, and it is possible to suppress the irradiation surface. A lighting device with uneven color or deviation of illuminance distribution. the

In addition, in the lighting device of the present invention, not only a plurality of light emitting devices 1 are provided in a predetermined arrangement, but one light emitting device 1 may be provided in a predetermined arrangement. the

Specific examples will be described below. the

(Example 21)

First, an alumina ceramic substrate to be the base 2 is prepared. The substrate 2 is a cuboid with a width of 8 mm x a depth of 8 mm x a thickness of 0.5 mm. the

In addition, a wiring conductor is formed extending from the upper surface of the base body 2 on which the light-emitting element 4 is mounted to the outer surface of the base body 2 . The wiring conductor on the upper surface of the substrate 2 on which the light-emitting element 4 is placed is formed into a circular pad with a diameter of 0.1 mm by a metallization layer composed of Mo-Mn powder, and the surface is covered with a 3 μm thick pad. Ni plating. In addition, the wiring conductor inside the base body 2 is formed by a so-called through hole, which is an electrical connection portion formed by a through-conductor. The via holes are also formed of metallized conductors made of Mo—Mn powder. the

In addition, the base body 2 and the case 3 were connected by an adhesive, and then the light-emitting element 4 was covered, and the inside of the case 3 was placed in a hemispherical shape with a radius of 0.4 mm. The first translucent part 5 made of epoxy resin, and a gap of 1.1 mm is provided from the zenith of the hemispherical shape in the height direction, and the first translucent part 5 is covered on the upper part of the case. The inner side of 3 is bonded with a plate-shaped fourth translucent portion 6 made of silicone resin with a refractive index of 1.41 and having a thickness of 0.1 mm. In addition, the light-emitting device 1 of the present invention is formed by covering the upper surface of the fourth translucent part 6 with the first translucent part 7. The second translucent part 7 is made of a translucent silicone resin. The member is formed by including phosphors composed of La ₂ O ₂ S:Eu for red, ZnS:Cu, Al for green, and (BaMgAl) ₁₀ O ₁₂ :Eu for blue.

(Comparative Example 21)

On the other hand, as Comparative Example 21, a device having the same lens as in Example 21 was configured except that the inside of the housing 3 was filled with the first translucent portion 5 with a thickness of 1.5 mm. the

For Example 21 and Comparative Example 21 prepared in this way, each total beam intensity was measured, and the total beam intensity of Example 21 was about 10% higher than that of Comparative Example 21. It was found that the method of Example 21 was superior. the

(fifth embodiment)

8 to 10 are sectional views showing a fifth embodiment of the present invention. The light-emitting device 1 is composed of a base 2 , a light-emitting element 4 , a first translucent portion 5 , a second translucent portion 7 , and a third translucent portion G. As shown in FIG. the

The substrate 2 is made of alumina ceramics, aluminum nitride sintered body, mullite sintered body, ceramics such as glass ceramics, resin such as epoxy resin, or metal, and serves as a supporting member for supporting the light emitting element 4. function. the

When the base body 2 is made of ceramics, wiring conductors (not shown) for electrically connecting the light emitting elements are formed on the upper surface of the base body 2 and its periphery. The wiring conductor is led out to the outer surface of the base body 2 to be connected to the external circuit board, thereby realizing the electrical connection between the light emitting element 4 and the external circuit board. the

The first translucent portion 5 is formed of a translucent material and covers the upper surface of the light emitting element 4 . the

The second translucent part 7 is formed of a translucent material containing a phosphor that converts the wavelength of the light emitted by the light emitting element 4, and is provided on the first translucent part 5 in such a manner as to cover the first translucent part 5. above sex part 5. the

The third translucent portion G is provided between the first translucent portion 5 and the second translucent portion 7 . the

In this embodiment, the refractive index of the first translucent portion 5 is n1, the refractive index of the second translucent portion 7 is n2, and the refractive index of the third translucent portion G is n3. In this case, the materials of the first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G are selected so as to satisfy the relationships of n3<n1 and n3<n2. As specific materials, the materials listed in the above-mentioned embodiments can be used, and by appropriately combining these materials, the relationships of n3<n1 and n3<n2 can be satisfied. By satisfying the relationship set in this way, light use efficiency can be improved as described above. the

In addition, in FIGS. 8 to 10, on the surface and inside of the base body 2, a conductive path 18 for electrically conducting the inside and outside of the light emitting device 1, such as metallization using metal powders such as W, Mo, and Mn, is formed. The electrode of the light emitting element 4 is electrically connected to the portion of the conductive path 18 exposed on the upper surface of the base body 2 . In addition, the conductive path 18 is connected to an external circuit through a lead terminal made of a metal such as Cu, Fe—Ni alloy, or the like at a portion exposed to the outside such as the lower surface of the base body 2 . Thus, the light emitting element 4 is electrically connected to an external circuit through the conductive path 18 . the

In addition, regarding the conductive path 18, it is also possible to coat the exposed surface with Ni or gold (Au) and other metals with excellent corrosion resistance, such as Ni or gold (Au), to effectively prevent the conductive path 18 from being oxidized and corroded. The electrical connection between the conductive path 18 and the light emitting element 4 and the connection between the conductive path 18 and the conductive adhesive member 17 are strengthened. Therefore, it is preferable that the exposed surface of the conductive path 18 is sequentially coated with a Ni plating layer with a thickness of approximately 1-10 μm or an Au plating layer with a thickness of approximately 0.1-3 μm by electrolytic plating or electroless plating. the

The housing 3 is made of metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, ceramics such as alumina sintered body, or resin such as epoxy resin, and is formed by cutting, mold molding, extrusion molding, etc. technology and formed into a shell shape. In addition, the central portion of the housing 3 is formed as a through hole that expands outward as it goes upward, and the inner peripheral surface of the through hole serves as a light reflection surface. the

Such a light reflecting surface is formed by smoothing the inner peripheral surface by cutting, molding techniques such as die molding and extrusion molding, and coating the inner peripheral surface with metal such as Al by evaporation or plating. Furthermore, the case 3 is connected to the upper main surface of the base 2 with a solder material such as solder or silver solder, or a resin adhesive. the

The light-emitting element 4 of the present invention is flip-chip connected by means of a conductive connecting member 17 such as Au-Sn eutectic solder as shown in FIGS. The path 18 is connected and mounted on the base body 2 . Or, on the upper surface of the base body 2, it is mounted by inorganic adhesives such as solder or sol-gel glass, low-melting point glass, or organic adhesives such as epoxy resin, and the electrodes of the light-emitting element 4 are connected to the circuit path 18 by connecting wires. electrical connection. the

In addition, when the light-emitting element 4 is flip-chip mounted on the conductive path 18 as shown in FIGS. , and a third light-transmitting portion G made of silicone resin having a lower refractive index than the first light-transmitting portion 5 is formed. Thus, the light emitted from the light emitting element 4 travels from the upper surface of the light emitting element 4 with a smaller refractive index difference to the third translucent portion G than from the lower surface of the light emitting element 4 with a large refractive index difference. Or it is easy to advance to the 3rd translucent part G sideways to the 1st translucent part 5. As a result, it is possible to effectively prevent the light emitted from the light-emitting element 4 from being transmitted by a conductive connection member such as an Au-containing solder material such as an Au-Sn alloy that connects the electrode positioned below the light-emitting element and the conductive path 18. 17 absorbs and reduces the luminous efficiency. the

In addition, in FIG. 8, the first translucent part 5 is provided on the upper surface of the light emitting element 4, and the second translucent part is provided above the first translucent part so as to cover the entire first translucent part. . Thus, the light emitted from the light-emitting element 4 can be made to travel well above the light-emitting element 4, and the absorption of the conductive connecting member 17 can be suppressed, and by satisfying the relationships of n3<n1 and n3<n2, efficiency can be achieved. The light from the light emitting element 4 is emitted higher. the

In addition, in FIGS. 9 and 10 , the upper surface and side surfaces of the light emitting element 4 are covered with the first translucent member 5 . As a result, the light emitted from the light emitting element 4 can travel well above and to the side of the light emitting element 4, so that the absorption of the conductive connecting member 17 can be suppressed, and by satisfying the relationship of n3<n1 and n3<n2 , the light from the light emitting element 4 can be emitted more efficiently. the

Moreover, in above-mentioned FIGS. 8-10, it is preferable to make the 3rd translucent part G into a gas layer. That is, compared with the case where a transparent material made of resin or the like is arranged as the third light-transmitting portion G under the light-emitting element 4, there is no heat generated by the light-emitting element 4 that causes the The thermal expansion of the third translucent portion G formed below the third translucent portion G can suppress the stress generated by the thermal expansion of the third translucent portion G and cause the light-emitting element 4 to be peeled off from the conductive path 18, thereby enabling good electrical conduction. And can make the light emitting device work normally. the

The second translucent part 7 is formed so as to cover the whole of the first translucent part 5. As the installation method, a method such as the following can be utilized: After the second translucent part 7 is formed into a desired shape in advance, it is placed on the first translucent part 5 through a gap, or it will become the third translucent part 5 on the first translucent part 5. The silicone resin of part G is coated to a desired thickness and can be thermally cured sequentially. After that, after kneading the phosphor and the transparent material, the precursor of the wavelength conversion member in liquid state is formed by using a coating machine. 2. The translucent part 7 is hardened by an oven. the

In addition, it is more preferable to coat the first light-transmitting portion 5 on the light-emitting element 4 before connecting the light-emitting element 4 to the base body 2 because it can be formed relatively simply. For example, semiconductors used to form light-emitting layers such as n-type gallium nitride and p-type gallium nitride can be grown by molecular beam epitaxy (Epi) on a wafer (エヨハ) of a transparent substrate such as sapphire, after which electrodes can be formed to obtain a light-emitting element 4 discs. Next, in the state where the sapphire wafer is attached to a support member such as an ultraviolet curable film, a liquid light-transmitting member precursor that becomes the first light-transmitting portion 5 is applied by a spin coating method or a spraying method, and can be once The first light-transmitting portion 5 is overlaid on a large number of light-emitting elements 4 . Thereafter, the sapphire wafer is cut into individual pieces by a circular saw and placed on the substrate 2, whereby the first light-transmitting portion 5 formed on the upper surface can be easily obtained at low cost and with good reproducibility. The light emitting element 4. the

Alternatively, in a state where the wafer of light-emitting elements 4 is cut and separated into individual light-emitting elements 4 at intervals, the first light-transmitting portion 5 is once provided on each light-emitting element 4, thereby The upper surface or the upper surface and side surfaces of the light emitting element 4 can be surrounded by the first translucent portion 5 easily, at low cost, and with good reproducibility. the

In this way, the first light-transmitting portion 5 is covered on the light-emitting element 4 before the light-emitting element 4 is bonded to the base body 2, thereby preventing the following situation: For example, when a single light-emitting element 4 is mounted on a light-emitting element accommodating package Like when the first translucent part 5 is formed later, the thickness of the first translucent part 5 does not become the desired thickness and becomes a defective product, and not only the light emitting element 4 but also the package for accommodating the light emitting element becomes useless. Thereby, the manufacturing yield can be improved. the

In addition, in the present embodiment, it is preferable that at least a part of the surface of the first translucent portion 5 including the region on the light emitting element 4 is curved as shown in FIG. 9 . More preferably, the overall shape of the first translucent portion 5 is a hemispherical shape centered on the center of gravity of the light emitting portion of the light emitting element 4 . Thus, the angle formed by the traveling direction of the light emitted from the light emitting element 4 to the first translucent portion 5 and the interface between the first translucent portion 5 and the third translucent portion G can be approximately 90 degrees, Therefore, the probability of the interface reflecting light can be greatly reduced. the

Such a hemispherical first light-transmitting portion 5 extends from the upper surface of the light-emitting element 4 to the side to cover the liquid light-transmitting material precursor, and by utilizing the surface tension acting on the corners of the light-emitting element 4, it can The hemispherical shape centering on the light emitting element 4 can be easily realized, and by curing this, the first translucent portion 5 can be formed. In addition, the shape of the first translucent portion 5 may be as close as possible to the cubic shape of the light emitting element 4 , and the term “hemispherical” here also includes a curved surface shape in which a hemisphere is distorted as shown in FIG. 10 . the

In addition, the light-emitting device 1 of the present invention is installed in such a manner that one device is arranged in a predetermined manner, and the light-emitting device 1 of the present invention is used as a light source, or a plurality of devices are arranged, for example, in a grid pattern, a zigzag pattern, or a radial pattern. , or set in a predetermined arrangement as follows and use the light-emitting device 1 of the present invention as a light source: that is, a circular or polygonal light-emitting device composed of a plurality of light-emitting devices is formed concentrically in multiple groups. group, and thus can become the lighting device of the present invention. Thereby, since the light emission caused by the recoupling of electrons of the light emitting element 4 made of a semiconductor is utilized, it is possible to achieve lower power consumption and a longer life than conventional lighting devices using discharge, and to obtain a small and compact lighting device that generates little heat. lighting fixtures. As a result, it is possible to obtain an illuminating device capable of suppressing fluctuations in the central wavelength of light generated from the light emitting element 4 and irradiating light with stable emitted light intensity and emitted light angle (light distribution) over a long period of time. , and can suppress the color unevenness of the irradiated surface or the deviation of the illuminance distribution. the

(sixth embodiment)

Fig. 11 is a cross-sectional view showing a sixth embodiment of the present invention. The light emitting device 1 is composed of a base 2, a housing 3, a light emitting element 4, a first translucent part 5, a second translucent part 7, a third translucent part G, an elastic member 14, etc., and is configured to emit light as a whole. Component storage package. the

The casing 3 is mounted on the upper surface of the base body 2 and has a reflective surface 3 a surrounding the light emitting element 4 . Between the outer peripheral surface and the lower surface of the housing 3, a notch portion 3b is formed. the

The elastic member 14 is an annular member having an inverted L-shaped cross section. The upper portion of the elastic member 14 is embedded in the notch portion 3b, and the lower portion of the elastic member 14 is disposed on the side of the base body 2 . the

The first translucent portion 5 is formed of a translucent material and covers the light emitting member 4 . the

The second light-transmitting member 7 is formed of a light-transmitting material containing a phosphor that converts the wavelength of the light emitted by the light-emitting element 4, and is above the first light-transmitting portion 5 to cover the first light-transmitting portion 5. Sex section 5 way set. the

The third translucent portion G is provided between the first translucent portion 5 and the second translucent portion 7 . the

In this embodiment, the refractive index of the first translucent portion 5 is n1, the refractive index of the second translucent portion 7 is n2, and the refractive index of the third translucent portion G is n3. In this case, the materials of the first translucent portion 5 , the second translucent portion 7 , and the third translucent portion G are selected so as to satisfy the relationships of n3<n1 and n3<n2. As specific materials, the materials listed in the above-mentioned embodiments can be used, and by appropriately combining these materials, the relationships of n3<n1 and n3<n2 can be satisfied. By satisfying such a relationship, the utilization efficiency of light is improved as described above. the

The base body 2 functions as a support member for supporting and mounting the light emitting element 4 and a heat radiation member for releasing heat of the light emitting element 4 . On the upper surface of the base body 2, the light emitting element 4 is provided with a resin adhesive, tin (Sn)-lead (Pb) solder, Au-Sn or other low-melting-point solder material, or the like. In addition, the heat of the light emitting element 4 is transferred to the base body 2 through the resin adhesive or the low-melting point solder material, and is efficiently dissipated to the outside, so that the workability of the light emitting element 4 can be maintained satisfactorily. In addition, the light emitted from the light emitting element 4 is reflected by the reflective surface 3 a and emitted to the outside. the

In addition, the base body 2 is made of ceramics such as alumina sintered body (alumina ceramics), aluminum nitride sintered body, and glass ceramics. In addition, a wiring conductor extending from the vicinity of the upper surface of the base body 2 on which the light emitting element 2 is mounted to the outside of the light emitting element housing package is formed. the

In addition, the wiring conductor formed on the base 2 is formed of metallized layers such as W, Mo, Mn, Cu, etc., for example, a metal paste obtained by adding and mixing an organic solvent or a solvent to powder such as W, and printing and coating. It is formed on the base 2 by laying in a predetermined pattern and firing. Preferably, on the surface of the wiring conductor, a metal such as a Ni layer with a thickness of 0.5 to 9 μm and an Au layer with a thickness of 0.5 to 5 μm is coated by a plating method in order to firmly connect a connecting wire (not shown) for oxidation prevention. layer. the

In addition, the case 3 is formed so as to surround the light emitting element 4 on the upper surface of the base 2 , and a notch 3 b is formed between the lower surface and the outer peripheral surface of the case 3 . Furthermore, the housing 3 is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe)-Ni-cobalt (Co) alloy, Fe-Ni alloy, or resin, ceramics, etc., and when the housing 3 is made of metal Next, since the inner peripheral surface is mirror-finished by grinding or the like, the inner peripheral surface can be turned into a reflective surface 3 a capable of reflecting visible light emitted from the light emitting element 4 well. the

In addition, when the housing 3 is made of resin or ceramics, a metal layer is formed on the inner peripheral surface by plating or evaporation, thereby making the inner peripheral surface reflective enough to reflect visible light emitted from the light emitting element 4 well. Surface 3a. Case 3 is preferably made of Al or SUS from the standpoint of making it easier to manufacture reflective surface 3 a with high reflection efficiency of visible light from light emitting element 4 and from the standpoint of preventing corrosion due to oxidation or the like. the

In addition, when the case 3 is made of metal, it can be formed into the above-mentioned predetermined shape by applying conventionally known metal processing such as cutting, rolling, and drawing to an ingot of the material. the

The elastic member 14 of the present invention is made of a material whose longitudinal modulus is smaller than that of the casing 3 . Preferably, the longitudinal modulus of the elastic member 14 is 1/5 or less of the longitudinal modulus of the casing 3 . By having a longitudinal elastic modulus smaller than that of the case 3, the base 2 and the case 3 expand or contract even when the heat generated by the light-emitting element 4 during operation or the temperature change of the external environment is repeatedly applied to the base 2 and the case 3 , the elastic member 14 can also be used to effectively relax the stress caused by the deformation, so that the influence exerted on the housing 3 can be greatly reduced. the

In addition, the elastic member 14 is attached to the case 3 by embedding the upper part in the notch 3b of the case 3 and disposing the lower part on the side of the base 2, and is made of, for example, epoxy resin or liquid crystal polymer ( LCP) or other highly heat-resistant thermosetting resin or thermoplastic resin, the longitudinal modulus of the elastic member 14 can maintain a value of 10 [MPa] to 20 [MPa]. This is because the elastic member 14 serves as a buffer material by maintaining the value of the longitudinal modulus as described above, and even if the heat generated during the operation of the light-emitting element 4 or the temperature change of the external environment is repeatedly applied to the base 2, the elastic member 14 will not be damaged. The generation of large thermal stress can be suppressed, so the generation of cracks on the base 2 can be suppressed, and the peeling of the base 2 and the casing 3 can be suppressed. the

As a result, electrical connection failures such as disconnection in the wiring conductors and the like can be suppressed, the pattern of the light beam (light beam) emitted from the light-emitting element 4 and reflected by the housing 3 can be constant, and the emission angle of light can be constant. Make the light intensity distribution expressed by a single light beam or their aggregate into a desired value and pattern. the

Also, if the longitudinal modulus of the elastic member 14 is greater than 70 [MPa], it will be difficult to relax the stress generated in the base body 2 and the case 3 when the light-emitting element 4 generates heat, which tends to be unsuitable. In addition, if the elastic member 14 has a longitudinal elastic modulus smaller than 5 [MPa], the elastic member 14 tends to be less effective in supporting the case 3 and the case 3 cannot be stably fixed to the base 2 . Therefore, the modulus of longitudinal elasticity of the elastic member 14 is preferably 5 [MPa] to 70 [MPa], more preferably 10 [MPa] to 20 [MPa]. the

In addition, it is preferable that, as described in FIG. 11 , when the elastic member 14 is bonded to the upper surface of the base body 2 and the elastic member 14 with lower thermal conductivity than the case 3 is used, the elasticity with lower thermal conductivity can be utilized. The component suppresses heat conduction from the base body 2 to the housing 3 . For example, even if the base 2 is deformed by the heat of the light-emitting element 4, the elastic member 14 connecting the base 2 and the case 3 can relax the stress caused by the deformation, and the influence on the case 3 can be greatly reduced. reduce. Therefore, it is possible to output stable light without unevenness in the intensity distribution of light emitted from the light emitting element housing package or the illuminance distribution in the irradiation surface, and to achieve high reliability and stable performance over a long period of time. Make the lighting device work. the

In addition, when the light-emitting element housing package is connected to the external connection substrate, an external connection terminal is provided on the lower surface of the base body 2 so as to protrude outward from the base body 2 when viewed from one end, or connected on the bottom surface of the base body 2. In many cases, a conductive connection material is directly provided and connected to the connection pad formed on the lower surface. This is because, for example, as shown in FIG. 13, when an L-shaped lead terminal 21 is provided on the lower surface of the base body 2 and the elastic member 14 as an external connection terminal, even if, for example, the light emitting element 4 The stress generated during heating causes the L-shaped lead terminal 21 to contact the base 2, and the L-shaped lead terminal 21 contacts the elastic member 14 formed on the side of the base 2 to prevent contact with the base 2, or Even if they touch, the stress can be buffered by the elastic member 14 , thus effectively preventing notches, cracks and cracks of the substrate caused by the contact between the L-shaped lead terminal 21 and the substrate 2 . As a result, the light emitting element 4 can be housed airtight, and the light emitting element 4 can be normally and stably operated for a long period of time. the

In addition, when the L-shaped lead terminal 21 is provided on the lower surface of the base body 2 in this way, it is preferable that, as shown in FIG. A stepped portion is provided in a manner, and the L-shaped lead terminal 21 is connected to the stepped portion. By providing the L-shaped lead terminal 21 at the stepped portion, it is possible to suppress a short circuit between the external connection board and the L-shaped lead terminal 21 . the

In addition, when the conductive bonding material is directly provided on the connection pad formed on the lower surface of the base body 2 to mount the light emitting element housing package and the external connection substrate, even when the conductive bonding material is melted, the connection between the external connection substrate and the external connection substrate, for example, The conductive bonding material is extruded between the housing and packaging of the light-emitting element, and climbs up along the base 2. Since the elastic member 14 exists in the part of the casing 3 in the past, the casing 3 and the conductive bonding material are difficult to separate. touch. Therefore, even if the case 3 is made of metal or the like, since the case 3 and the conductive bonding material do not come into contact easily, electrical short circuit can be effectively prevented. the

When the base body 2 is made of ceramics, etc., by arranging the lower part of the elastic member 14 on the side of the base body 2 and installing it on the housing 3, by means of the lower part of the elastic member 14 positioned on the side, The progress of the light that leaks to the outside is hindered, and it is possible to prevent the light from leaking to the outside. As a result, even when the light-emitting device of the present invention is used as a display device, good visibility can be obtained without blurring of light. the

In addition, it is preferable to provide a gap between the lower part of the elastic member 14 and the side of the base 2, and because the heat generated from the light emitting element 4 can be transferred to the base 2, and the heat can be released from the gap between the base 2 and the elastic member 14. , so better. In addition, since deterioration of the light-emitting element 4 can be prevented by improving heat dissipation, deformation of the light-emitting element housing package due to heat can be prevented more effectively, which is preferable. the

In addition, more preferably, the notched portion 3 b of the case 3 may be provided annularly along the outer peripheral surface of the case 3 . Thus, between the base body 2 and the case 3, there is an outer air layer with a large capacity before the ring-shaped circumferential groove portion 3b, and it is possible to prevent the heat generated when the light-emitting element 4 is in operation from being transferred from the base body 2 to the case. 3. As a result, the bending moment transmitted from the case 3 to the base 2 can be suppressed, and the occurrence of cracks and cracks in the base 2 can be effectively prevented. the

In addition, further, the volume of the housing 3 can be reduced, and the area connecting the base body 2 and the housing 3 can be reduced, thereby suppressing: Stress concentrated at the junction of the base body 2 and the housing 3 . As a result, it is possible to further suppress cracking and peeling of the base body 2 , or the joint portion of the base body 2 and the case 3 . the

In addition, if the elastic member 14 is annularly provided along the outer peripheral surface of the case 3, an external connection terminal is provided on the lower surface of the base body 2 so as to protrude from the base body 2 with one end surface viewed from above, and the light-emitting element is accommodated. When the package is bonded to an external connection substrate, even if the position of the external connection terminal is displaced due to, for example, stress generated when the light-emitting element 4 generates heat, the stress generated by the elastic member 14 touching the base 2 is formed by forming It is more preferable to be cushioned by the annular elastic member 14 . As a result, it is possible to more effectively prevent the occurrence of notches, cracks, cracks, etc. in the base body 2 or the outer peripheral portion of the base body 2, and by housing the light-emitting element 4 in an airtight manner, the light-emitting element can be kept normal and stable for a long time. work. the

In addition, regarding the case 3 , it is preferable that only the upper surface of the cutout portion 3 b is joined to the elastic member 14 . Accordingly, the casing 3 is easily and moderately deformed, and the restraint by the elastic member 12 can be moderately released. As a result, even if the elastic member 14 or the base body 2 is skewed, it is possible to effectively suppress the distortion of the case 3 due to the skew. In addition, a gap may be formed between a portion of the lower surface of the case 3 located inside the elastic member 14 and the upper surface of the base 2 . This makes it difficult for heat to transfer from the base 2 to the reflective surface 3a, which is preferable. the

In addition, it is preferable that the reflective surface 3 a is inclined at an angle of 35 to 70 with respect to the upper surface of the base body 2 . Thus, the light of the light-emitting element 4 mounted on the upper surface of the base body 2 can be well reflected by the inclined reflection surface 3a, and the light can be well emitted to the outside within the range of the emission angle of 45 degrees, and extremely The luminous efficiency, brightness and luminosity of the light-emitting device using the light-emitting element housing package of the present invention are greatly improved. In addition, the so-called emission angle of light is the spread angle of light passing through the center of the light-emitting element 4 and perpendicular to the plane of the substrate 2. If the shape of the opening in the cross section of the housing 3 is circular, the emission angle crosses the reflection The entire circumference of the surface 3a is fixed. In addition, in the case where the opening shape in the cross section of the casing 3 has a deviation such as an ellipse shape, the emission angle is its maximum value. the

In addition, if the angle formed by the reflective surface 3a and the upper surface of the substrate 2 is less than 35 degrees, the reflection angle becomes wider than 45 degrees, the amount of scattered light increases, and the brightness and luminosity of light tend to decrease. On the other hand, if the angle exceeds 70 degrees, the light of the light emitting element 4 is not emitted well to the outside of the light emitting element housing package, but is easily diffusely reflected in the light emitting element housing package. the

In addition, when the shape of the reflective surface 3a is an inverted cone, it is preferable that the angle formed by the reflective surface 3a and the upper surface of the base body 2 is 35 to 70 degrees across the entire circumference. In addition, when the shape of the reflective surface 3 a is a quadrangular pyramid, it is preferable that at least a pair of facing inner surfaces are inclined at 35 to 70 degrees with respect to the upper surface of the base body 2 . The luminous efficiency can be greatly improved by virtue of the fact that the entire surface of the inner surface is inclined at 35-70 degrees relative to the upper surface of the base body 2 . the

Moreover, it is preferable that the arithmetic mean roughness Ra of the reflective surface 3a is 0.004-4 micrometers. That is, when the arithmetic average roughness Ra of the reflective surface 3a exceeds 4 μm, it is difficult to emit the light of the light emitting element 4 housed in the light emitting element housing package to the top of the light emitting element housing package by regular reflection, and the light intensity is attenuated. , and are prone to deviation. In addition, when the calculated average roughness of the reflective surface 3a is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. In addition, in order to set the Ra of the reflective surface 3 a within the above range, it can be formed by conventionally known electrolytic polishing, chemical polishing, or cutting. In addition, a method of forming by transfer processing utilizing the surface accuracy of the mold may also be employed. the

In addition, the connection between the case 3 and the elastic member 14, or the connection between the case 3 and the base 2, can be achieved by a silicon-based or epoxy-based resin adhesive, a metal solder material such as Ag-Cu solder, or a Pb-Au-Sn adhesive. -Au-Sn-silicon (Si), Sn-Ag-Cu and other solder, etc. In addition, such an adhesive or an adhesive material such as solder is not particularly limited as long as it is appropriately selected in consideration of the materials and thermal expansion coefficients of the base body 2 , elastic member 14 , and case 3 . In addition, when high reliability of bonding between the base body 2 and the elastic member 14 and between the elastic member 14 and the case 3 is required, it is preferable to bond by a metal solder material or solder. the

In addition, when focusing on the characteristics of the light emitting device, in order to prevent the casing 3 and the elastic member 14 from being misaligned due to the bonding material, they may be joined by a caulking method. In the riveting method, the position of the housing 3 can be fundamentally determined, and the positional displacement or inclination of the housing 3 in the manufacturing process of the light-emitting element housing package can be suppressed, and the center of the elastic member 14 and the housing 3 can be aligned. The shafts are aligned and joined with high precision. As a result, the optical axis of the light emitting element 4 and the central axis of the case 3 that reflects light can be aligned with high precision in the light emitting element housing package manufacturing process. Therefore, it is possible to manufacture a light-emitting device having desired light intensity distribution, illuminance distribution, and luminescent color. the

In addition, the relationship between the thermal expansion coefficients of the elastic member 14 and the housing 3 may be α1<α2 when the thermal expansion coefficient of the elastic member 14 is α1 and the thermal expansion coefficient of the housing 3 is α2. Thus, the elastic member 14 alleviates the difference in thermal expansion coefficient between the case 3 and the base 2 , thereby effectively suppressing the generation of stress due to the difference in thermal expansion between the base 2 and the case 3 and the elastic member 14 . Therefore, the manufacturing process of the light-emitting element housing package and the stress caused by thermal expansion and heat absorption during operation of the light-emitting device can be relaxed, and inclination and deformation of the case 3 can be suppressed. the

In this way, the light-emitting element housing package of the present invention mounts the light-emitting element 4 on the upper surface of the base body 2, and connects the light-emitting element 4 and the external external circuit of the light-emitting element housing package through Au or Al or the like to connect wires and wiring conductors. Electrical conduction. Furthermore, the first translucent portion 5 is formed to cover the side and upper surfaces of the light emitting element 4 or the entire light emitting element 4 by filling and curing a translucent material such as a transparent resin inside the case 3. And, form the 2nd light-transmitting portion 7 with a gap between the 1st light-transmitting portion 5, and if necessary, use solder or a resin adhesive to bond a light-transmitting cover (not shown) on the upper surface of the housing 3. shown), thus forming the light-emitting device of the present invention. Alternatively, after forming the first light-transmitting portion 5, a third light-transmitting portion G made of silicone resin or the like is formed, and a second light-transmitting portion G is formed on its upper surface so as to cover the entire first light-transmitting portion 5. 7, and if necessary, on the upper surface of the housing 3, use solder or resin adhesive to bond a light-transmitting cover, so that the wavelength of the light from the light-emitting element 4 can be converted by the phosphor, and A light emitting device that extracts light having a desired wavelength spectrum. the

In addition, the light-emitting device of the present invention is arranged so that one device is arranged in a predetermined arrangement, or a plurality of devices are arranged in a grid, zigzag, or radial pattern, or arranged in a predetermined arrangement as follows : That is, a circular or polygonal light-emitting device group composed of a plurality of light-emitting devices is formed concentrically in multiple groups, thereby making it possible to become a lighting device. Thereby, intensity unevenness can be suppressed compared with the conventional illuminating device. the

In addition, the light-emitting device of the present invention is installed in a predetermined arrangement as a light source, and optically designed reflectors, optical lenses, light-diffusing plates, etc. A lighting device with a light distribution of light. the

In addition, the present invention is not limited to the above-described embodiments, and various changes can be made without departing from the gist of the present invention. For example, by joining an optical lens or a plate-shaped light-transmitting cover for arbitrarily focusing and diffusing the light emitted from the light-emitting device with solder or a resin adhesive, the light can be taken out at a desired emission angle, And can improve long-term reliability. In addition, in order to suppress light loss due to connecting wires, it is also possible to use a light emitting device in which metallized wiring is formed on the substrate 1, and the light emitting device 3 is electrically connected to the metallized wiring by soldering. Install the chip. the

The light-emitting device 1 according to each of the above-mentioned embodiments is installed in a predetermined arrangement as a light source, but by providing an optically designed reflector, an optical lens, a light-diffusing plate, etc. in any shape around these light-emitting devices 1, it can become A lighting device that can emit light with any light distribution. the

For example, as shown in the plan view shown in FIG. 14 and the cross-sectional view shown in FIG. 15 , a plurality of light emitting devices 1 are arranged in multiple rows on the light emitting device driving circuit board 10 and arranged in arbitrary shapes around the light emitting device 1 . In the case where the optically designed reflection tool 9 constitutes the lighting device, it is preferable that among the plurality of light emitting devices 1 arranged in an adjacent row, the distance between the adjacent light emitting devices 1 is not the shortest, that is, the so-called zigzag arrangement. shape. the

That is, when the light-emitting devices 1 are arranged in a grid, the light-emitting devices 1 used as light sources are arranged in a straight line, and the glare becomes stronger. It becomes jagged, suppresses glare, and reduces discomfort even to human eyes. the

In addition, by increasing the distance between adjacent light emitting devices 1, the interference of heat between adjacent light emitting devices 1 can be effectively suppressed, and the heat interference in the light emitting device drive circuit board 10 on which the light emitting devices 1 are mounted can be suppressed. Closed (こもる) can efficiently dissipate heat to the outside of the light-emitting device 1 . As a result, it is possible to produce a lighting device that has stable optical characteristics over a long period of time and has a long life without causing discomfort to human eyes. the

In addition, for the lighting device, as shown in the top view shown in FIG. 16 and the cross-sectional view shown in FIG. 17 , a circular or polygonal shape composed of a plurality of light emitting devices 1 is formed concentrically on the light emitting device driving circuit board 10 . In the case of an illuminating device with a group of light emitting devices 1, it is preferable that the number of arrangement of the light emitting devices 1 in one circular or polygonal light emitting device group be more on the outer peripheral side than on the central side of the illuminating device. Thereby, more light-emitting devices 1 can be arranged while maintaining an appropriate distance between the light-emitting devices 1 , and the illuminance of the lighting device can be further improved. the

In addition, by reducing the density of the light emitting devices 1 in the central portion of the lighting device, it is possible to suppress heat suffocation in the central portion of the light emitting device drive circuit board 10 . Therefore, the temperature distribution in the light-emitting device driving circuit board 10 becomes uniform, and heat can be transferred more efficiently to an external circuit board or a heat sink for installing the lighting device. As a result, the light-emitting device 1 can operate stably over a long period of time, and a long-life lighting device can be produced. the

Such lighting devices include, for example, general lighting fixtures used indoors or outdoors, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store and display lighting fixtures, and street lighting fixtures. , guide lighting appliances and signal devices, lighting appliances for the stage and studio (studio), advertising lights, lighting poles (poles), underwater lighting lights, flash (ストロボ) lights, spot lights, utility poles Anti-crime lighting, non-use lighting, pocket lamps, electric bulletin boards, or dimmers, automatic flashers, backlights for displays, animation devices, decorations, illuminated switches, light sensors embedded in, etc. , medical lights, car lights, etc. the

In addition, this invention is not limited to the example of embodiment mentioned above and an Example, As long as it does not deviate from the scope of this invention, various changes are possible without any hindrance. the

According to the present invention, it is possible to provide a light emitting device and an illuminating device having high light extraction efficiency, emitted light intensity, on-axis luminosity, and luminance. the

Claims (4)

1. A light emitting device, characterized in that, With: a substrate having a wiring conductor; a light emitting element placed on the upper surface of the substrate and electrically connected to the wiring conductor; a first translucent part, which has a curved shape and covers the light-emitting element; The second translucent part has a curved shape, is provided above the first translucent part so as to cover the first translucent part, and is formed by including a phosphor in the translucent material , the phosphor converts the wavelength of light emitted from the light-emitting element; a third translucent part provided between the first translucent part and the second translucent part, When the refractive index of the first translucent part is n1, the refractive index of the second translucent part is n2, and the refractive index of the third translucent part is n3, it satisfies The relationship between n3<n1 and n3<n2, The third translucent portion has a constant thickness over the entire lower surface of the second translucent portion. 2. The lighting device according to claim 1, characterized in that, The third translucent portion is a gas layer. 3. The lighting device according to claim 1 or 2, characterized in that, It further has a fourth translucent portion having a refractive index n4 and is provided on the lower surface of the second translucent portion, and the refractive indices n2 and n4 satisfy the relationship of n2>n4. 4. A lighting device, characterized in that, The light-emitting device described in any one of claims 1 to 3 is used as a light source.

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