CN101107397A - Polyketone fiber paper, polyketone fiber paper core material for printed wiring boards, and printed wiring boards - Google Patents
Polyketone fiber paper, polyketone fiber paper core material for printed wiring boards, and printed wiring boards Download PDFInfo
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- CN101107397A CN101107397A CNA2006800026132A CN200680002613A CN101107397A CN 101107397 A CN101107397 A CN 101107397A CN A2006800026132 A CNA2006800026132 A CN A2006800026132A CN 200680002613 A CN200680002613 A CN 200680002613A CN 101107397 A CN101107397 A CN 101107397A
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Abstract
本发明提供聚酮纤维纸、印刷布线基板用聚酮纤维纸芯材及印刷布线基板。本发明所提供的聚酮纤维纸具有高强度、高弹性，在尺寸稳定性、耐化学性、耐热性、粘合性和电气绝缘性等方面优异，且为低介电性、低吸水性，其厚度较薄，是多孔性的均匀的脂肪族聚酮纤维纸。并且，本发明还提供印刷布线基板用聚酮纤维纸芯材及使用该芯材的印刷布线基板，所述印刷布线基板为低介电性，其在尺寸稳定性、电气绝缘性、激光穿孔均匀性等方面优异。所述脂肪族聚酮纤维纸以及印刷布线基板用芯材含有1质量％～100质量％的脂肪族聚酮纤维，厚度为5μm～200μm，空隙率为30％～90％，每单位质量的强度为100MN/kg以上；所述脂肪族聚酮纤维含有下式(1)所示的重复单元且平均纤维长为0.5mm～10mm、平均纤维径为0.1μm～20μm。此外，所述印刷布线基板是将高分子树脂、低介电性高分子树脂、聚苯醚型环氧树脂浸渗或涂布于该芯材所得到的含有单层或两层以上层的印刷布线基板。式(1)为：－CH2－CH2－CO－。The invention provides polyketone fiber paper, a polyketone fiber paper core material for a printed wiring board, and a printed wiring board. The polyketone fiber paper provided by the present invention has high strength and high elasticity, is excellent in dimensional stability, chemical resistance, heat resistance, adhesion and electrical insulation, and is low dielectric and low water absorption. , its thickness is thinner, it is porous uniform aliphatic polyketone fiber paper. Moreover, the present invention also provides a polyketone fiber paper core material for a printed wiring board and a printed wiring board using the core material, the printed wiring board is low dielectric, and its dimensional stability, electrical insulation, and laser perforation are uniform. Excellent performance. The aliphatic polyketone fiber paper and the core material for printed wiring boards contain 1% to 100% by mass of aliphatic polyketone fibers, have a thickness of 5 μm to 200 μm, a porosity of 30% to 90%, and a strength per unit mass of 100MN/kg or more; the aliphatic polyketone fiber contains repeating units represented by the following formula (1), has an average fiber length of 0.5 mm to 10 mm, and an average fiber diameter of 0.1 μm to 20 μm. In addition, the printed wiring board is a printed circuit board containing a single layer or two or more layers obtained by impregnating or coating the core material with a polymer resin, a low dielectric polymer resin, and a polyphenylene ether type epoxy resin. Wiring substrate. Formula (1) is: -CH 2 -CH 2 -CO-.
Description
Technical field
The polyketone fiber paper, printed circuit board that the present invention relates to copy the aliphatic polyketone fiber that contains 1 quality %～100 quality % that method for making obtains with wet type is with polyketone fiber refill material and the printed circuit board of having used polyketone fiber refill material.
In more detail, following polyketone fiber paper involved in the present invention, printed circuit board are with polyketone fiber refill material and the printed circuit board of having used polyketone fiber refill material, it contains the aliphatic polyketone fiber, have high strength, high elasticity, excellence aspect DIMENSIONAL STABILITY, chemical resistance, heat resistance, cohesiveness and electric insulating quality, dielectricity is low, water imbibition is low, its light and thinner thickness, for porous and hole even.
Background technology
In recent years, to copying the synthetic fibre paper that paper obtains and study by using synthetic fiber to substitute wood pulp.Synthetic fibre paper has the various features of synthetic fiber concurrently because resistance to water is better, so paid close attention to existing various motions as new material.
For example, the fibrous paper of using polyester fiber to obtain is disclosed in the patent documentation 1.It is because resistance to water, chemical resistance excellence, and is used to sensible heat hole plate originals with supporter etc.But polyester fiber is a thermoplastic resin, causes DIMENSIONAL STABILITY and intensity to reduce if be exposed to the next generation thermal expansion of high temperature, so be necessary to improve heat resistance.
In addition, the fibrous paper of using aromatic polyamide fibre to obtain is disclosed in the patent documentation 2.Because it is in aspect excellences such as the intensity of mechanics, DIMENSIONAL STABILITY, heat resistances, and is used to multi-layer printed wiring base plate with base material etc.But the water imbibition of aromatic polyamide fibre is higher.Therefore, if carry out the water desorption that high-temperature process then is adsorbed, produce the expansion of printed circuit board etc., so there is room for improvement.In addition, aromatic polyamide fibre is in the raising of also expecting performance aspect other the cohesiveness of resin.
The tablet that uses the aliphatic polyketone fiber to obtain is disclosed in the patent documentation 3.Wherein disclosed sheet-like structure material water imbibition is low, and rigidity is abundant, and has intensity, DIMENSIONAL STABILITY, heat resistance and the cohesiveness of chemical resistance, mechanics, but also has the leeway of improvement.
Put down in writing following content in the patent documentation 4: the polyketone Nonwovens of 50 μ m～200 μ m thickness is applied to battery separator, and it is excellence aspect the electrolyte compatibility, but also has room for improvement.
Synthetic fibre paper is because electric insulating quality is also excellent, and it is studied with the use in the base material (core) etc. at electric material, particularly printed circuit board.
Be accompanied by the miniaturization of electronic instrument, highly integrated development, require slimming, the multiple stratification of printed circuit board day by day.
In multi-layer printed wiring base plate, then be difficult to carry out slimming if the thickness of core is thicker, if core is thin then yielding, DIMENSIONAL STABILITY is relatively poor.There are the bad problems such as electric insulating quality that expand, damage substrate itself that produce when in addition, then impregnated in the fusion weld access slot as if the water absorption rate of core is higher.In addition, if core and infiltration or coat the thermoplastic resin of this core or the resistance to impact of the relatively poor then substrate of cohesiveness of thermosetting resin relatively poor.
As the multi-layer printed wiring base plate core, when it is to use the fibrous paper that aromatic polyamide fibre obtains, need the improvement of low water absorbable, high adherence.In addition, when it is when containing the fibrous paper of polyester fiber, because its spring rate is low yielding, so aspect DIMENSIONAL STABILITY, there is the leeway of improvement.When it is glass woven fabric or glass Nonwovens, because the dielectric constant of glass is higher, suitable limited in the purposes of expectation high frequency characteristics.On the other hand, the printed circuit board that does not also occur polyketone fiber refill material on the market and use polyketone fiber paper to obtain.
Patent documentation 1: special hope 2003-171191 number
Patent documentation 2: the spy opens flat 08-190326 communique
Patent documentation 3: the spy opens the 2001-207335 communique
Patent documentation 4: special hope 2004-10408 number
Summary of the invention
The present invention proposes in order to solve the above-mentioned problems in the prior art.Promptly, the object of the present invention is to provide a kind of aliphatic polyketone fibrous paper, described aliphatic polyketone fibrous paper contains the aliphatic polyketone fiber of 1 quality %～100 quality %, have high strength, high elasticity, excellence aspect DIMENSIONAL STABILITY, chemical resistance, heat resistance, cohesiveness and electric insulating quality, and be low-dielectric, low water absorbable, its light and thinner thickness is porous uniform aliphatic polyketone fibrous paper.
In addition, the object of the present invention is to provide a kind of printed circuit board polyketone fiber refill material and printed circuit board, described printed circuit board polyketone fiber refill material excellence aspect heat resistance, cohesiveness, chemical resistance, and have low-dielectric, low water absorbable, high elasticity, its light and thinner thickness is a porous uniform printed circuit board polyketone fiber refill material; Described printed circuit board is a core with the fibrous paper that contains the aliphatic polyketone fiber, has low-dielectric, excellence aspect DIMENSIONAL STABILITY, electric insulating quality.
The inventor is in order to address the above problem, the fibrous paper that is conceived to contain the aliphatic polyketone fiber studies intensively, found that the aliphatic polyketone fibrous paper that can realize having following performance, thereby finished the present invention, described aliphatic polyketone fibrous paper is excellence aspect chemical resistance, heat resistance, DIMENSIONAL STABILITY, cohesiveness and electric insulating quality, and have low-dielectric, low water absorbable, intensity and spring rate are higher, the light and thinner thickness of weight is porous uniform aliphatic polyketone fibrous paper.
Find that in addition the printed circuit board that can be achieved as follows is with polyketone fiber refill material and printed circuit board, thereby finished the present invention, described printed circuit board polyketone fiber refill material excellence aspect heat resistance, cohesiveness, chemical resistance, and have low-dielectric, low water absorbable, high elasticity, its light and thinner thickness is a porous uniform printed circuit board polyketone fiber refill material; Used the fibrous paper that contains the aliphatic polyketone fiber in the described printed circuit board, had low-dielectric, excellence aspect DIMENSIONAL STABILITY, electric insulating quality.
That is, the 1st scheme of the present invention is a kind of polyketone fiber paper, it is characterized in that, it is the wet fiber paper that contains the aliphatic polyketone fiber of 1 quality %～100 quality %, and described aliphatic polyketone fiber contains the repetitive shown in the following formula (1).
-CH
2-CH
2-CO- (1)
The 2nd scheme of the present invention is a kind of polyketone fiber paper, it is characterized in that, it is the wet fiber paper that contains 1 quality %～99 quality % aliphatic polyketone fibers, and described aliphatic polyketone fiber contains the repetitive shown in the following formula (1).
-CH
2-CH
2-CO- (1)
The 3rd scheme of the present invention is a kind of polyketone fiber paper, it is characterized in that, it is the wet fiber paper that contains the aliphatic polyketone fiber, and described aliphatic polyketone fiber contains the repetitive shown in the following formula (1).
-CH
2-CH
2-CO- (1)
Any one scheme in the 4th scheme of the present invention such as the 1st～3 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the thickness of fibrous paper is 5 μ m～200 μ m.
Any one scheme in the 5th scheme of the present invention such as the 1st～3 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the thickness of fibrous paper is 5 μ m～100 μ m.
Any one scheme in the 6th scheme of the present invention such as the 1st～3 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the thickness of fibrous paper is 5 μ m～50 μ m.
Any one scheme in the 7th scheme of the present invention such as the 1st～6 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, is 30%～90% with the voidage of the fibrous paper shown in the following formula;
Voidage=(density/(thickness * area of fibrous paper) of the gross mass/formation fiber of the fiber of 1-formation fibrous paper) * 100.
Any one scheme in the 8th scheme of the present invention such as the 1st～7 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the intensity of the per unit mass of fibrous paper (=TENSILE STRENGTH/thickness/basic weight) is more than the 100MN/kg.
Any one scheme in the 9th scheme of the present invention such as the 1st～7 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the intensity of the per unit mass of fibrous paper (=TENSILE STRENGTH/thickness/basic weight) is more than the 200MN/kg.
Any one scheme in the 10th scheme of the present invention such as the 1st～7 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the intensity of the per unit mass of fibrous paper (=TENSILE STRENGTH/thickness/basic weight) is more than the 400MN/kg.
Any one scheme in the 11st scheme of the present invention such as the 1st～10 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the aliphatic polyketone fiber is that average fiber length is the staple fibre of 0.5mm～10mm.
Any one scheme in the 12nd scheme of the present invention such as the 1st～11 scheme of the present invention for a kind of polyketone fiber paper, is characterized in that, the average fiber of aliphatic polyketone fiber directly is 0.1 μ m～20 μ m.
The 13rd scheme of the present invention is a kind of printed circuit board polyketone fiber refill material, it is characterized in that it has used any one polyketone fiber paper in the 1st～1 2 scheme of the present invention.
The 14th scheme of the present invention such as the 13rd scheme of the present invention for a kind of printed circuit board polyketone fiber refill material, is characterized in that, polyketone fiber paper is made individual layer or two-layer above the use.
The 15th scheme of the present invention is a kind of printed circuit board, it is characterized in that, it contains any one polyketone fiber refill material and macromolecule resin in 13～14 schemes of the present invention.
The 16th scheme of the present invention such as the 15th scheme of the present invention for a kind of printed circuit board, is characterized in that, it infiltrates on polyketone fiber refill material or is coated with macromolecule resin.
Any one scheme in the 17th scheme of the present invention such as the 15th～16 scheme of the present invention, is characterized in that described macromolecule resin is the low medium electrical property high polymer resin for a kind of printed circuit board.
Any one scheme in the 18th scheme of the present invention such as the 15th～17 scheme of the present invention, be a kind of printed circuit board, it is characterized in that described macromolecule resin is for to be substituted with in the molecule or to contain average polyphenylene oxide and at least a kind of polyphenyl ether type epoxy that the curing agent that is selected from amine, novolaks phenol (novolac phenol), acid anhydrides serve as necessary composition that surpasses 1 epoxy radicals.
Any one scheme in the 19th scheme of the present invention such as the 15th～18 scheme of the present invention for a kind of printed circuit board, is characterized in that, printed circuit board contains individual layer or two-layer above layer.
The 20th scheme of the present invention is a kind of manufacture method of aliphatic polyketone fibrous paper, it is characterized in that, after the aliphatic polyketone fiber is pulled an oar in advance, carries out break process, carries out papermaking then.
The 21st scheme of the present invention such as the 20th scheme of the present invention, the manufacture method for a kind of aliphatic polyketone fibrous paper is characterized in that, handles pre-making beating with beater or refiner.
The 22nd scheme of the present invention such as the 20th scheme of the present invention, the manufacture method for a kind of aliphatic polyketone fibrous paper is characterized in that, carries out break process with high-pressure homogenizer.
Polyketone fiber paper of the present invention provides the fibrous paper with following characteristic, thereby it has and has this obvious effects of feature that did not in the past have, described fibrous paper is porous uniform fibers paper, have high strength, high elasticity rate, excellence aspect DIMENSIONAL STABILITY, heat resistance, chemical resistance, low-dielectric, low water absorbable, electric insulating quality and cohesiveness, it not only gently but also extremely thin.
In addition, printed circuit board of the present invention provides the core with following characteristic with polyketone fiber refill material, and it is porous core, has low-dielectric, have high strength and high elasticity rate, in aspect excellences such as heat resistance, chemical resistance, low water absorbable and cohesivenesss, it not only gently but also extremely thin.Further, with the fibrous paper that contains the aliphatic polyketone fiber is that the printed circuit board of core is not only light but also thin, in aspect excellences such as low-dielectric, DIMENSIONAL STABILITY, resistance to impact, electric insulating quality, laser beam perforation uniformities, it has and has this positive effect of feature that did not in the past have.
The specific embodiment
Hereinafter the present application is described in detail.
Polyketone fiber paper of the present invention is the wet fiber paper that contains the aliphatic polyketone fiber of 1 quality %～100 quality %.Polyketone fiber paper of the present invention is characterised in that, utilizes near the softening rapidly and character of the distortion fusing point of aliphatic polyketone fiber, between the aliphatic polyketone fiber or aliphatic polyketone fiber and other fiber heat fused.Further, by carrying out the manufacture method of the application record, can make not only light but also thin and for porous but even and solid fibrous paper.
Printed circuit board of the present invention contains polyketone fiber paper of the present invention with polyketone fiber refill material.
Printed circuit board of the present invention not only can only contain polyketone fiber paper of the present invention with polyketone fiber refill material, can also contain as other the composition of printed circuit board with core necessity.
The thickness of fibrous paper of the present invention is preferably 5 μ m～200 μ m.More preferably 5 μ m～100 μ m, more preferably 5 μ m～90 μ m, more preferably 5 μ m～50 μ m, more preferably 5 μ m～40 μ m, more preferably 5 μ m～20 μ m, more preferably 5 μ m～15 μ m.By the thickness that makes fibrous paper is 5 μ m～200 μ m, can similarly handle with normally used paper, and make it be imbued with processability owing to soft, can easily be out of shape, shear shape.In addition, also being suitable for gas, liquid with its gas permeability, infiltration property, printing ink trafficability characteristic etc. sees through in fibrous paper, passes through.By the thickness that makes fibrous paper is more than the 5 μ m, can keep the intensity of fibrous paper.In addition, thickness is 200 μ m when following, flexibility, excellent in workability, gas, liquid see through and by excellent.Further, if the thickness of fibrous paper is below the 200 μ m, then the heat during hot pressing fully conducts to fibrous paper inside, and the heat fused of the fiber of fibrous paper inside fully carries out, thereby shows full intensity.
Printed circuit board of the present invention is preferably 5 μ m～200 μ m similarly with the thickness of polyketone fiber refill material.More preferably 5 μ m～100 μ m, more preferably 5 μ m～90 μ m, more preferably 5 μ m～50 μ m, more preferably 5 μ m～40 μ m, more preferably 5 μ m～20 μ m, more preferably 5 μ m～15 μ m.
Voidage with the fibrous paper shown in the following formula of the present invention is preferably 30%～90%.
Voidage=(density/(thickness * area of fibrous paper) of the gross mass/formation fiber of the fiber of 1-formation fibrous paper) * 100.
More preferably 35%～85%.By making voidage is 30%～90%, can obtain light weight, porous, processability, infiltration as the feature of fibrous paper etc.Voidage is 30% when above, can obtain the speciality of lighter porous fibrous paper.In addition, voidage is 90% can obtain as the necessary intensity of fibrous paper when following.
The intensity of the per unit mass of fibrous paper of the present invention, be that the intensity (=TENSILE STRENGTH/thickness/basic weight) of per unit thickness and per unit basic weight is preferably more than the 100MN/kg.More preferably more than the 200MN/kg, more preferably more than the 400MN/kg, more preferably more than the 700MN/kg, more preferably more than the 1000MN/kg, more preferably more than the 1500MN/kg, more preferably more than the 2000MN/kg, be preferably more than the 2500MN/kg especially.By the intensity that makes per unit mass is more than the 100MN/kg, the thin solid fibrous paper that also has in processing or handle necessary intensity even can obtain light.
Employed aliphatic polyketone fiber has the structure with the repetitive shown in the following formula (1) that contains more than 90 moles of % among the present invention.
-CH
2-CH
2-CO- (1)
If repetitive is 90 moles and then can obtains high strength, high elasticity more than the % that heat resistance also can be excellent.
In addition, the degree of crystallinity of this fiber is preferably more than 30%.By making degree of crystallinity is more than 30%, can show high strength, high elasticity.
Method for making as polyketone fiber, as described in patent documentation 3, carry out hot-stretch after preferably obtaining with the wet type spin processes and make, because the polyketone fiber of making has high strength, high elasticity like this by the polyketone aqueous solution that has used zinc salt, calcium salt, isocyanates etc.
Employed aliphatic polyketone fiber is preferably that average fiber is long to be the staple fibre of 0.5mm～10mm among the present invention.More preferably average fiber length is the staple fibre of 1mm～7mm.Fiber preferably uses the staple fibre that is sheared.By making fiber long is more than the 0.5mm, the paper intensity in the time of can keeping copying paper.In addition, long by making fiber for below the 10mm, can improve the dispersing uniformity when copying paper.
In addition, in order to make not only even but also thin fibrous paper, the preferred average fiber of employed aliphatic polyketone fiber directly is below the 20 μ m among the present invention.More preferably below the 17 μ m.In addition, the intensity in order to keep making the sheet heat fused, average fiber directly is preferably more than the 0.1 μ m.More preferably more than the 1 μ m.
The present invention is preferably with other mixed with fibers of aliphatic polyketone fiber and the 99 quality %～0 quality % of 1 quality %～100 quality %.More preferably this polyketone fiber is 100 quality % or 1 quality %～99 quality %.Further preferred this polyketone fiber is 1 quality %～99 quality %, 100 quality %.The lower limit of this polyketone fiber is more preferably more than the 10 quality %, more preferably more than the 50 quality %, more preferably more than the 60 quality %, more preferably more than the 70 quality %, more preferably more than the 80 quality %.This polyketone fiber is 1 quality % when above, shows the high strength that polyketone fiber has, the speciality of high-fire resistance.In addition, can give polyketone fiber distinctive character to this fibrous paper when being 100 quality %, be the speciality that 99 quality can be given other fiber to this fibrous paper when following.
As employed other fiber among the present invention, can enumerate natural fabric, regeneration natural fabric, inorfil and/or synthetic fiber etc.For example, as natural fabric, can enumerate cellulose fibres such as silk floss, fiber crops, timber etc.As the regeneration natural fabric, can enumerate viscose, artificial fibre, solvent spinning fibre cellulose fiber etc.As inorfil, can enumerate glass fibre, carbon fiber, metal fibre etc.As synthetic fiber, can enumerate polyethylene, polypropylene, nylon, polyester, polyacrylonitrile etc.Particularly, then can further improve heat resistance if use fully aromatic polyamide fiber (to phenylene terephthalamide fiber or to phenylene diphenyl ether terephthalamide fiber (hereinafter they being called " counterpoint type aramid fibre ")) as the heat resistance synthetic fiber, Wholly aromatic polyester fiber, polyparaphenylene Ben Bing Er oxazole (PBO hereinafter referred to as) fiber, polyimide fiber, polyphenylene sulfide fibre, teflon (registration mark) fiber etc.In addition, as other fiber, with a kind or make up and two or morely mix, can make the fibrous paper that has the feature that other fiber has concurrently with this polyketone fiber.Fiber length and this polyketone fiber of these other fibers similarly is preferably the length of 0.5mm～10mm.In addition, the average fiber footpath also is preferably 0.1 μ m～20 μ m.
Polyketone fiber paper of the present invention can be copied the method for making manufacturing with wet type.With pulverizer with the above-mentioned polyketone staple fibre of 100 quality % or with this polyketone staple fibre of 1 quality %～99 quality % and other fiber of 99 quality %～1 quality % evenly mix be scattered in the water after, with the short net paper machine of cylinder paper machine, fourdrinier paper machine, inclination or make up associating paper machine that they form etc. and copy system, form this fiber on the net and evenly be dispersed into plane ply of paper.Then, carry out intensive drying, finally make polyketone fiber fuse or make polyketone fiber and other fibre fusion each other, the final strength of performance paper delivery by hot pressing etc. with drying machines such as drum dryer, Flying Dutchman, hot-air driers.
Though more than be typical manufacture method, the invention is not restricted to this manufacture method.For example with other mixed with fibers of the polyketone fiber of 1 quality %～99 quality % and 99 quality %～1 quality % the time, both can mix simultaneously, and also can pulverize the back respectively and mix, this was not limited with pulverizer.In addition, fiber dispersion in water the time, can be added additives such as emulsifying agent, dispersant, viscosity modifier, paper power reinforcing agent fiber is further disperseed, make thinner more uniform fibrous paper with intensity.But the present invention is not subjected to any qualification of the interpolation of additive.Further, before the system of copying, all or part of making beating of this polyketone fiber can be made fibril, mix after again fibril being made in all or part of making beating of other fiber, perhaps also can be with the processing of pulling an oar after polyketone fiber and other mixed with fibers.By pulling an oar, can make ply of paper more even, further strengthen ply of paper intensity, improve speed of production, improve productivity, can make thin more even more solid fibrous paper.Methods of beating both can use the device of so-called beater, also can use disc mill, high-pressure homogenizer etc.Thinner in order to make, more uniform fibrous paper with intensity is preferably pulled an oar in advance with beater or disc mill, further uses high-pressure homogenizer etc. to make the high fibrillation of fiber, fine footpathization.When making thinner, more uniform fibrous paper with intensity, preferably carry out 1 hour～4 hours pre-making beating with beater.In addition, preferably be equivalent to 10 times～200 times with the disc mill circulation.Preferred further the circulation under the condition of pressure 100MPa with high-pressure homogenizer is equivalent to 5 times～50 times and carries out break process.Freeness after the making beating is preferably 20～50 ° of SR, more preferably 25～45 ° of SR.Freeness is diluted in water so that fibre concentration is 0.2 quality % and the mean value that carries out 2 mensuration for using the SCHOPPER freeness test instrument based on JIS-P8121.Owing to, can increase number of fiber with respect to the thickness direction of fibrous paper, thereby can make thinner more uniform fibers paper by making the high fibrillation of fiber, fine footpathization.In addition, by carrying out high fibrillation, fine footpathization, the contact between the fiber increases, and is easy to show intensity behind the heat fused.But, any qualification that the present invention is not pulled an oar.Further, can make the polyketone fiber paper of 100 quality % in advance, then, on the polyketone fiber paper of 100 quality %, other fiber is copied paper or on the tow sides of polyketone fiber paper other fiber copied paper, also can put upside down this sequence of steps manufacturing in addition, manufacture method is not added qualification.
For the stronger fibrous paper of intensity that realizes per unit mass of the present invention, could realize by the fiber heat fused that will be not only light but also thin and has a fibrous paper of homogeneity.For make between the aliphatic polyketone fiber all or part of, make aliphatic polyketone fiber and other fiber heat fused, preferably under-40 ℃～+ 40 ℃ of the melting temperature of polyketone fiber, carry out hot pressing.By melting temperature carry out hot pressing more than-40 ℃, make the polyketone fiber heat fused.In addition, by melting temperature+carry out hot pressing below 40 ℃, do not produce fusion, sintering, so preferred.When the melting temperature of other fiber is lower than the melting temperature of this polyketone fiber, can makes this polyketone fiber or and then make other other fiber heat fused with other fiber.At this moment, preferably under-40 ℃～+ 40 ℃ of the melting temperature of other fiber, carry out hot pressing.Extruding linear load during for hot pressing, though can implement in known scope, in order to control thickness, the extruding linear load during hot pressing is preferably 1KN/m～200KN/m.
For polyketone fiber paper of the present invention and printed circuit board polyketone fiber refill material, can be before making substrate with identical macromolecule resin or different macromolecule resin infiltration or be applied to it and come up further to improve intensity when making substrate when making printed circuit board such as thermoplastic resin or thermosetting resin, give processability or other function to printed circuit board with polyketone fiber refill material.
Polyketone fiber paper of the present invention and printed circuit board can be used for printed circuit board with individual layer or two-layer above layer with polyketone fiber refill material.When using two-layer above thin polyketone fiber paper, the intensity of the fibrous paper more than this is two-layer is better than the single layer fibre paper with identical voidage, same thickness with the fiber formation of the same terms, can be used as high-intensity printed circuit board or high-intensity resin impregnated plate and is used for other purposes.
Printed circuit board of the present invention is made macromolecule resin infiltration or the aliphatic polyketone fibrous paper core of coating the aliphatic polyketone fiber that contains 1 quality %～100 quality %, utilize the low-dielectric of polyketone fiber refill material, this substrate itself has the feature of the electrical characteristic that realizes that low-k, low dielectric loss tangent etc. are excellent.
For employed macromolecule resin among the present invention, can enumerate thermoplastic resins such as vistanex, fluororesin; Or thermosetting resin such as phenolic resins, epoxy resin, polyimide resin etc.Particularly use when being the vistanex, polystyrene resin, fluororesin, silicone resin, polyimide resin, epoxy resin, especially polyphenyl ether type epoxy (serve as the resin of necessary composition to be substituted with in the molecule or to contain average at least a kind the curing agent that surpasses the polyphenylene oxide of 1 epoxy radicals and be selected from amine, novolaks phenol, acid anhydrides) etc. of the low medium electrical property high polymer resin below 4.0 as dielectric constant, can show very excellent electrical characteristic with the low-dielectric of polyketone fiber refill material, be suitable for radio circuit with substrate etc.
Printed circuit board of the present invention can be made in the following way: with the macromolecule resin fusion or with solvent dilution it is flowed, after its infiltration or coating polyketone fiber refill material, cool off or drying.For thermosetting resin, can further be heated to solidification temperature and make its curing.In addition, though adjust for constant thickness can be waited by extruding, printed circuit board of the present invention is not subjected to the restriction of manufacture method.
Printed circuit board of the present invention can be used for the purposes that individual layer uses.Further, preferably maximally utilise core thinner thickness feature and be used for the multi-layer printed wiring base plate etc. of following purposes etc., described purposes is: carry out the purposes that the heating and pressurizing moulding constitutes laminated board; Have in the multi-layer printed wiring base plate of printed wiring on internal layer and superficial layer across insulating barrier, constituting the purposes of above-mentioned insulating barrier and multi-layer printed wiring base plate etc.
Embodiment
Based on embodiment the present invention is carried out more specific description below, but the present invention is not subjected to any qualification of these embodiment etc.
The kind of the fiber that uses in polyketone fiber refill material at polyketone fiber paper and printed circuit board, shape etc. are as shown in table 1, and polyketone fiber paper and printed circuit board are as shown in table 2 with the structure condition and the characteristic measurement result of polyketone fiber refill material.In addition, use the characteristic measurement result of the printed circuit board that this core obtains also in table 2 illustrate.
Polyketone fiber shown in the table 1 uses the repetitive of following formula (1) to be essentially the fiber of 100 moles of %.In addition, the fiber A6 of table 1 and the conditions of beating of A7 are: making the fibre concentration that is added with defoamer shown in the embodiment 1 is that the aqueous dispersions of 1 quality % cycles through after the disc mill (Xiong Gu manages machine) that the dish gap is adjusted into 0.2mm is equivalent to 30 times, for the aqueous dispersions that fibre concentration is adjusted into 0.75 quality %, with high-pressure homogenizer (Niro Soavi) is under the condition of 100MPa at pressure, fiber is cycled through, cycling through of fiber A6 is equivalent to 10 times, and fiber A7 cycles through and is equivalent to 20 times.Further, the conditions of beating of the fiber F of table 1 is: similarly operate making solvent spinning fibre cellulose fiber (Courtaulds:TENCEL) cycle through disc mill to be equivalent to 30 times, high-pressure homogenizer and to be equivalent to 5 times.
-CH
2-CH
2-CO- (1)
[embodiment 1]
With the average fiber of 100 quality % directly is to drop into the water of heating to 50 degree after the long aliphatic polyketone staple fibre for 3mm of 10 μ m, fiber drops into high speed disintegrator (pulper), make the aqueous dispersions (fibre concentration is 2 quality %) of polyketone staple fibre, stirred then 15 minutes.Adding entry in this dispersion liquid, to make fibre concentration be 1 quality %, adds the defoamer (polyoxy alkylidene diol fatty acid ester) of 0.5 quality % with respect to fiber quality, stirred 30 minutes in the stirring at low speed groove.Further adding entry in this fiber dispersion will starch concentration and be adjusted into 0.1 quality %, add the viscosity modifier (poly(ethylene oxide)) of 20ppm, before copying paper, carry out vacuum outgas, with having cylinder paper machine that 100 orders copy gauze with after the copying the chart speed degree and form l Water Paper of 30m/min, it with surface temperature 130 ℃ Flying Dutchman heat drying, be that 275 ℃ hot pressing roller pushes with surface temperature further, obtaining thickness is that 50 μ m, voidage are 70% polyketone fiber paper.
Even preserving down, the temperature (230 ℃) that this fibrous paper is decomposed in the cellulose generation do not have variable color in 3 hours yet, and not variation of constant dimension, heat resistance, DIMENSIONAL STABILITY are also excellent.In addition, even soaking at room temperature did not change in 10 days yet in 40% sulfuric acid, 40% sodium hydrate aqueous solution and hexane, chemical resistance is also excellent.Further, even this fibrous paper is that 23 ℃, relative humidity are to preserve 3 days under 80% the condition in temperature, water absorption rate is also less than 1 quality %, so water imbibition is low.
With polyketone fiber refill material, it is in 45% epoxy resin (the high brominated bisphenol a type epoxy resin of the bisphenol A type epoxy resin of 75 parts by mass, 25 parts by mass and the 3 parts by mass curing agent dicyandiamides) solution that this fibrous paper is soaked in solid constituent as printed circuit board.This supporter is picked up from epoxy resin solution, after carrying out drying and semi-solid preparation under 160 ℃, under 185 ℃, push the substrate of manufacturing through curing and smoothing.
[embodiment 2～9]
Utilize the manufacture method identical, use the aliphatic polyketone fiber shown in the table 2 to obtain polyketone fiber paper and printed circuit board usefulness polyketone fiber refill material with embodiment 1.The part that condition is different in the manufacture method is as shown in table 2.Use this core to use the method identical to make printed circuit board with embodiment 1.
[embodiment 10]
It is in 45% epoxy resin (the polyphenyl ether type epoxy of 100 parts by mass and the curing agent dicyandiamide of the 3 parts by mass) solution that the printed circuit board that will be made by embodiment 1 is soaked in solid constituent with polyketone fiber refill material, uses the method manufacturing printed circuit board identical with embodiment 1.
[embodiment 11～15]
Utilize the manufacture method identical, use the aliphatic polyketone fiber shown in the table 2 to obtain polyketone fiber paper and printed circuit board usefulness polyketone fiber refill material with embodiment 1.The part that condition is different in the manufacture method is as shown in table 2.Use this core to use the method identical to make printed circuit board with embodiment 10.
[embodiment 16]
Average fiber at 70 quality % directly is that the long fiber length for the aliphatic polyketone staple fibre of 3mm and 30 quality % of 10 μ m, fiber is the counterpoint type aramid fibre of 3mm (Supreme Being people: add defoamer Technora), carry out aqueous dispersion with high speed disintegrator and prepare fiber dispersion.In this fiber dispersion, add viscosity modifier, before copying paper, carry out vacuum outgas, copy the cylinder paper machine of gauze and copy paper with having 100 orders, with appending surface temperature is that the surface temperature of 275 ℃ hot pressing roller is 130 ℃ a Flying Dutchman heat drying, and obtaining thickness is that 50 μ m, voidage are 70% polyketone fiber paper.
Even preserving down, the temperature (230 ℃) that this fibrous paper is decomposed at cellulose do not have variable color in 3 hours yet, and not variation of constant dimension, heat resistance, DIMENSIONAL STABILITY are also excellent.In addition, also do not change in 1 day even soak under the room temperature in 40% sulfuric acid, 40% sodium hydrate aqueous solution and hexane, chemical resistance is also excellent.Further, even this fibrous paper is that 23 ℃, relative humidity are to preserve 3 days under 80% the condition in temperature, water absorption rate only is 1 quality % also, so water imbibition is low.
With this fibrous paper as printed circuit board with polyketone fiber refill material, use the method identical to make substrate with embodiment 1.
[embodiment 17～27]
Utilize the manufacture method identical with embodiment 1, the aliphatic polyketone fiber shown in the use table 2 and other fiber obtain polyketone fiber paper and printed circuit board usefulness polyketone fiber refill material.The part that condition is different in the manufacture method is as shown in table 2.Use this core to use the method identical to make printed circuit board with embodiment 1.
[embodiment 28]
It is in 45% epoxy resin (the polyphenyl ether type epoxy of 100 parts by mass and the curing agent dicyandiamide of the 3 parts by mass) solution that the printed circuit board that will be made by embodiment 16 is soaked in solid constituent with polyketone fiber refill material, uses the method manufacturing printed circuit board identical with embodiment 1.
[comparative example 1～2]
Directly be to add defoamer during 12 μ m, fiber are grown for the glass fibre of 3mm and counterpoint type aramid fibre at average fiber respectively, carry out aqueous dispersion with high speed disintegrator and prepare fiber dispersion.In this fiber dispersion, add viscosity modifier, before copying paper, carry out vacuum outgas, copying the cylinder paper machine of gauze and copy paper with having 100 orders, is 130 ℃ Flying Dutchman heat drying with the surface temperature of appending the hot pressing roller that is heated to 350 ℃ of ceiling temperatures.But glass fibre and counterpoint type aramid fibre all do not reach softening temperature, do not show the intensity of fibrous paper.Therefore, this fibrous paper is moved on the sheet material of polytetrafluoroethylene (PTFE) after, make that employed epoxy resin solution is infiltrated up to wherein among the embodiment 1, under the condition identical, make printed circuit board with embodiment 1.
Even preserving down, the temperature (230 ℃) that glass fibre and counterpoint type aramid fibre itself decomposes at cellulose do not have variable color in 3 hours yet, and not variation of constant dimension, heat resistance, DIMENSIONAL STABILITY are also excellent.In addition, in 40% sulfuric acid, 40% sodium hydrate aqueous solution and hexane, soak 10 days under the room temperature after, glass fibre and counterpoint type aramid fibre are invaded by sodium hydrate aqueous solution as a result.Further, glass fibre and counterpoint type aramid fibre are after 23 ℃, relative humidity are to preserve 3 days under 80% the condition in temperature, though the water absorption rate of result's glass fibre is less than 1 quality %, the water absorption rate of counterpoint type aramid fibre is 4 quality %.
[comparative example 3]
Utilize the manufacture method identical with embodiment 1, use polyethylene terephthalate (polyester) fiber (kuraray:EPO43) obtains fibrous paper.
Though this fibrous paper is a low water absorbable, in heat resistance, dimensional stability test, be out of shape, aspect chemical resistance, this fibrous paper is invaded by 40% sodium hydrate aqueous solution.
With this fibrous paper as printed circuit board with polyketone fiber refill material, use the method identical to make printed circuit board with embodiment 1.
[comparative example 4]
Average fiber at 50 quality % directly is that the long pbo fiber for the counterpoint type aramid fibre of 3mm and 50 quality % of 12 μ m, fiber (spin: add defoamer ZYLON AS), carry out aqueous dispersion with high speed disintegrator and prepare fiber dispersion by Japan.In this fiber dispersion, add viscosity modifier, before copying paper, carry out vacuum outgas, copying the cylinder paper machine of gauze and copy paper with having 100 orders, is 130 ℃ Flying Dutchman heat drying with the surface temperature of appending the hot pressing roller that is heated to 350 ℃ of ceiling temperatures.But counterpoint type aramid fibre and pbo fiber all do not reach softening temperature, do not show the intensity of fibrous paper.Therefore, this fibrous paper is moved on the sheet material of polytetrafluoroethylene (PTFE) after, make that employed epoxy resin solution is infiltrated up to wherein among the embodiment 1, under the condition identical, make printed circuit board with embodiment 1.
[comparative example 5～7]
Use the manufacture method identical with embodiment 1, other fiber shown in the combination interpolation table 2 obtains printed circuit board fibrous paper core.The part that condition is different in the manufacture method is as shown in table 2.Use this core to use the method identical to make printed circuit board with embodiment 1.
With following method fibrous paper and the printed circuit board made by embodiment 1～28 and comparative example 1～7 are estimated comparison with the fibrous paper core.
TENSILE STRENGTH: use the tension type tension test instrument of constant speed, is that the test film of 100mm stretches with the draw speed of 300mm/min to the wide 15mm of being of test film, test length of a film, mensuration until the fracture peak load, with 5 mean values as TENSILE STRENGTH (kN/m).
Uneven thickness one property: utilize micrometer to measure 10 points arbitrarily, the rate of change of calculating by following formula less than be expressed as zero at 10% o'clock, be expressed as △ at 10%～20% o'clock, be 20% be expressed as when above *.
Rate of change=(measuring the minimum of a value of the maximum-mensuration thickness of thickness)/mensuration average thickness value * 100.
In addition, with following method to estimating comparison by the resulting printed circuit board of fibrous paper core that uses above-mentioned manufacturing.
Flatness: the normal reflection light of visualization substrate surface, be expressed as zero when reverberation is even, be expressed as when reverberation is inhomogeneous *.
Heat resistance: be after under 80% the atmosphere gas printed circuit board being preserved 3 days, in 260 ℃ fusion weld access slot, to soak 2 minutes the visual valuation state variation at 30 ℃, relative humidity.Zero be no change, * for there being distortion.
Further, the printed circuit board of the semi-solid preparation of the above-mentioned manufacturing of lamination carries out hot pressing in 185 ℃, after making thickness and being the laminated substrate of 1mm, is after preserving 1 day under 65% the atmosphere gas, to carry out following evaluation at 23 ℃, relative humidity.
Dielectric constant: paste Copper Foil at the substrate surface back side and make electrode, measure the dielectric constant of substrate with Agilent corporate system dielectric property analyzer (4284 type).Mensuration frequency with 1MHz is measured.
DIMENSIONAL STABILITY: for test film, with the coefficient of thermal expansion on the XY direction of linear expansivity determinator determination test sheet when changing down for 100 ℃～200 ℃.Be expressed as zero in the time of below 10ppm/ ℃, be expressed as when being expressed as more than △, 20ppm/ ℃ during 10ppm/ ℃～20ppm/ ℃ *.
[table 1]
| Fiber name | Fiber long (mm) | Average fiber footpath (μ m) | Making beating | Freeness (° SR) | |
| Fiber A1 | Polyketone fiber | 3 | 10 | Do not have | ≤10 |
| Fiber A2 | Polyketone fiber | 1 | 10 | Do not have | ≤10 |
| Fiber A3 | Polyketone fiber | 5 | 10 | Do not have | ≤10 |
| Fiber A4 | Polyketone fiber | 7 | 10 | Do not have | ≤10 |
| Fiber A5 | Polyketone fiber | 2 | 15 | Do not have | ≤10 |
| Fiber A6 | Polyketone fiber | 2 | 6 | Have | 26 |
| Fiber A7 | Polyketone fiber | 2 | 3 | Have | 43 |
| Fiber A8 | Polyketone fiber | 15 | 15 | Do not have | ≤10 |
| Fiber A9 | Polyketone fiber | 5 | 25 | Do not have | ≤10 |
| Fiber B | Glass fibre | 3 | 12 | Do not have | ≤10 |
| Fiber C | The counterpoint type aramid fibre | 3 | 12 | Do not have | ≤10 |
| Fiber D | Pbo fiber | 3 | 12 | Do not have | ≤10 |
| Fiber E | Polyester fiber | 3 | 8 | Do not have | ≤10 |
| Fiber F | Solvent spinning fibre cellulose fiber | - | - | Have | 60 |
[table 2]
| Fibrous paper and core | Substrate | |||||||||||||||
| Cooperate (quality %) | Hot pressing temperature (℃) | Hot pressing line pressure (kN/m) | Basic weight (g/m 2) | Thickness (μ m) | Thickness one property inequality | Voidage (%) | TENSILE STRENGTH (kN/m) | The intensity of unit mass (MN/kg) | Thickness (μ m) | Flatness | Heat resistance | Dielectric constant | DIMENSIONAL STABILITY | |||
| Fiber 1 | Fiber 2 | Fiber 3 | ||||||||||||||
| Embodiment 1 | Fiber A1 (100) | 275 | 100 | 20 | 50 | ○ | 70 | 0.39 | 390 | 60 | ○ | ○ | 3.7 | ○ | ||
| Embodiment 2 | Fiber A2 (100) | 265 | 70 | 20 | 67 | ○ | 77 | 0.35 | 261 | 75 | ○ | ○ | 3.7 | ○ | ||
| Embodiment 3 | Fiber A3 (100) | 267 | 200 | 30 | 76 | ○ | 70 | 0.62 | 272 | 85 | ○ | ○ | 3.7 | ○ | ||
| Embodiment 4 | Fiber A4 (100) | 270 | 200 | 30 | 68 | ○ | 66 | 0.57 | 279 | 80 | ○ | ○ | 3.6 | ○ | ||
| Embodiment 5 | Fiber A5 (100) | 265 | 70 | 50 | 156 | ○ | 75 | 0.90 | 115 | 160 | ○ | ○ | 3.7 | ○ | ||
| Embodiment 6 | Fiber A6 (100) | 267 | 70 | 40 | 80 | ○ | 62 | 0.88 | 275 | 90 | ○ | ○ | 3.6 | ○ | ||
| Embodiment 7 | Fiber A7 (100) | 270 | 200 | 7 | 11 | ○ | 51 | 0.22 | 2857 | 15 | ○ | ○ | 3.6 | ○ | ||
| Embodiment 8 | Fiber A8 (100) | 270 | 100 | 30 | 80 | △ | 71 | 0.59 | 246 | 90 | △ | ○ | 3.7 | ○ | ||
| Embodiment 9 | Fiber A9 (100) | 265 | 70 | 30 | 240 | △ | 92 | 0.10 | 14 | 250 | △ | ○ | 3.9 | △ | ||
| Embodiment 10 | Fiber A1 (100) | 275 | 100 | 20 | 50 | ○ | 70 | 0.39 | 390 | 60 | ○ | ○ | 3.3 | ○ | ||
| Embodiment 11 | Fiber A7 (100) | 267 | 100 | 8 | 19 | ○ | 68 | 0.24 | 1579 | 30 | ○ | ○ | 3.3 | ○ | ||
| Embodiment 12 | Fiber A7 (100) | 267 | 70 | 12 | 28 | ○ | 67 | 0.34 | 1012 | 40 | ○ | ○ | 3.3 | ○ | ||
| Embodiment 13 | Fiber A6 (100) | 267 | 70 | 20 | 47 | ○ | 67 | 0.52 | 553 | 60 | ○ | ○ | 3.3 | ○ | ||
| Embodiment 14 | Fiber A1 (100) | 265 | 70 | 40 | 96 | ○ | 68 | 0.72 | 188 | 120 | ○ | ○ | 3.3 | ○ | ||
| Embodiment 15 | Fiber A1 (100) | 260 | 50 | 80 | 210 | △ | 71 | 1.18 | 70 | 230 | △ | ○ | 3.3 | ○ | ||
| Embodiment 16 | Fiber A1 (70) | Fiber C (30) | 275 | 100 | 20 | 60 | ○ | 74 | 0.36 | 300 | 75 | ○ | ○ | 3.7 | ○ | |
| Embodiment 17 | Fiber A2 (80) | Fiber C (20) | 265 | 70 | 30 | 120 | ○ | 81 | 0.60 | 167 | 140 | ○ | ○ | 3.7 | ○ | |
| Embodiment 18 | Fiber A3 (20) | Fiber D (80) | 270 | 100 | 40 | 144 | ○ | 79 | 0.26 | 45 | 160 | ○ | ○ | 3.9 | ○ | |
| Embodiment 19 | Fiber A4 (50) | Fiber D (50) | 265 | 100 | 20 | 73 | ○ | 79 | 0.29 | 199 | 90 | ○ | ○ | 3.8 | ○ | |
| Embodiment 20 | Fiber A5 (80) | Fiber E (20) | 265 | 200 | 30 | 42 | ○ | 45 | 0.70 | 556 | 55 | ○ | ○ | 3.7 | ○ | |
| Embodiment 21 | Fiber A5 (70) | Fiber E (30) | 265 | 200 | 40 | 95 | ○ | 68 | 0.75 | 197 | 110 | ○ | ○ | 3.7 | ○ | |
| Embodiment 22 | Fiber A6 (80) | Fiber F (20) | 270 | 100 | 7 | 15 | ○ | 63 | 0.29 | 2762 | 25 | ○ | ○ | 3.7 | ○ | |
| Embodiment 23 | Fiber A7 (60) | Fiber F (40) | 270 | 100 | 30 | 55 | ○ | 55 | 0.52 | 315 | 70 | ○ | ○ | 3.8 | ○ | |
| Embodiment 24 | Fiber A1 (40) | Fiber C (40) | Fiber E (20) | 265 | 200 | 40 | 106 | ○ | 71 | 0.44 | 104 | 130 | ○ | ○ | 3.8 | ○ |
| Embodiment 25 | Fiber A1 (50) | Fiber A6 (30) | Fiber F (20) | 270 | 100 | 20 | 56 | ○ | 73 | 0.62 | 554 | 70 | ○ | ○ | 3.7 | ○ |
| Embodiment 26 | Fiber A8 (70) | Fiber D (30) | 270 | 70 | 30 | 133 | △ | 83 | 0.10 | 25 | 150 | △ | ○ | 3.7 | ○ | |
| Embodiment 27 | Fiber A9 (80) | Fiber E (20) | 265 | 70 | 30 | 240 | △ | 91 | 0.13 | 18 | 270 | △ | ○ | 3.9 | △ | |
| Embodiment 28 | Fiber A1 (70) | Fiber C (30) | 275 | 100 | 20 | 60 | ○ | 74 | 0.36 | 300 | 75 | ○ | ○ | 3.4 | ○ | |
| Comparative example 1 | Fiber B (100) | 350 | 200 | 60 | - | - | - | Do not show intensity | 80 | ○ | ○ | 4.4 | △ | |||
| Comparative example 2 | Fiber C (100) | 350 | 200 | 30 | - | - | - | Do not show intensity | 90 | ○ | × | 4.1 | ○ | |||
| Comparative example 3 | Fiber E (100) | 235 | 50 | 30 | 80 | ○ | 71 | 0.35 | 146 | 90 | ○ | × | 4.0 | × | ||
| Comparative example 4 | Fiber C (50) | Fiber D (50) | 350 | 200 | 20 | - | - | - | Do not show intensity | 90 | × | × | 4.1 | ○ | ||
| Comparative example 5 | Fiber C (50) | Fiber E (50) | 235 | 50 | 20 | 65 | ○ | 76 | 0.16 | 123 | 80 | ○ | × | 4.1 | × | |
| Comparative example 6 | Fiber D (50) | Fiber F (50) | - | - | 20 | 55 | ○ | 68 | 0.18 | 164 | 70 | ○ | × | 4.5 | △ | |
| Comparative example 7 | Fiber E (50) | Fiber F (50) | 235 | 100 | 20 | 50 | ○ | 65 | 0.19 | 190 | 65 | ○ | × | 4.5 | × | |
Utilizability on the industry
Polyketone fiber paper of the present invention can be used in the printed circuit board core suitably; The capacitor electrode such as aluminium electrolutic capacitor or electric double layer capacity dividing plate or dividing plate core; Separators or dividing plate core that the batteries such as fuel cell, lithium ion battery, nickel-hydrogen cell are used; Amberplex is with in the purposes such as core.
Particularly printed circuit board is suitable for the electric apparatus printed circuit board with the printed circuit board that polyketone fiber refill material and this core of use obtain, and is particularly suitable for multi-layer printed wiring base plate etc. owing to core is thinner. In addition, owing to be low-dielectric, can be used in suitably radio circuit with in the purposes such as printed circuit board.
Claims (22)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005010560 | 2005-01-18 | ||
| JP010560/2005 | 2005-01-18 | ||
| JP010573/2005 | 2005-01-18 | ||
| JP017082/2005 | 2005-01-25 | ||
| JP019556/2005 | 2005-01-27 |
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| CN101107397A true CN101107397A (en) | 2008-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800026132A Pending CN101107397A (en) | 2005-01-18 | 2006-01-16 | Polyketone fiber paper, polyketone fiber paper core material for printed wiring boards, and printed wiring boards |
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| CN (1) | CN101107397A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106700487A (en) * | 2016-12-28 | 2017-05-24 | 青岛科凯达橡塑有限公司 | Injection moulding high-wave-transparent composite and preparation method thereof |
| CN109379834A (en) * | 2018-09-21 | 2019-02-22 | 维沃移动通信有限公司 | A signal transmission device, a processing method of the signal transmission device, and a mobile terminal |
-
2006
- 2006-01-16 CN CNA2006800026132A patent/CN101107397A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106700487A (en) * | 2016-12-28 | 2017-05-24 | 青岛科凯达橡塑有限公司 | Injection moulding high-wave-transparent composite and preparation method thereof |
| CN106700487B (en) * | 2016-12-28 | 2018-10-30 | 青岛科凯达橡塑有限公司 | One kind can injection molding, high wave-penetrating composite material and preparation method thereof |
| CN109379834A (en) * | 2018-09-21 | 2019-02-22 | 维沃移动通信有限公司 | A signal transmission device, a processing method of the signal transmission device, and a mobile terminal |
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