CN101095033A - Laser-based material processing methods, system and subsystem for use therein for precision energy control - Google Patents
Laser-based material processing methods, system and subsystem for use therein for precision energy control Download PDFInfo
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- CN101095033A CN101095033A CN 200580045693 CN200580045693A CN101095033A CN 101095033 A CN101095033 A CN 101095033A CN 200580045693 CN200580045693 CN 200580045693 CN 200580045693 A CN200580045693 A CN 200580045693A CN 101095033 A CN101095033 A CN 101095033A
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Abstract
A laser-based material processing method, system and subsystem for use therein for precision energy control are provided, wherein a bulk attenuator is switched across an RF driver output to greatly lower the overall RF output and resulting laser energy per pulse. The value of the attenuator determines the range of energies achievable, pj or fractions of pj's. More than one attenuator and switch can be used to achieve multiple energy ranges. After the bulk attenuator is switched in, the laser energy is greatly reduced and the RF driver can then be run again near full RF power where the SNR is much better. The input voltage from a DAC is also much higher so it is also not at the low end of its range where it is also noisy due to poor SNR. The method and system provides increased dynamic range, greater extinction (lower possible energies), better accuracy and stability due to higher SNR of the DAC input voltage and higher SNR in the RF driver.
Description
The cross reference of relevant patent and application
The application requires the interests of the U.S. Provisional Application file sequence number 60/643,341 of submit applications on Dec 30th, 2004.Therefore the application all comprises following United States Patent (USP) and patent application document here: 6,791,059,6,744,288,6,727,458,6,573,473,6,381,259,2002/0167581,2004/0134896 and 6,559,412.These patents and announcement are transferred to assignee of the present invention.
Invention field
The present invention relates generally to accurately, at a high speed, based on the material processed of laser, for example little processing of target material.Such application is the reparation based on laser of redundant semiconductor memory.
Background technology
Along with semiconductor and DRAM designs rule is progressive to littler geometry, need littler laser facula to remove littler, programmable more closely link (link) at interval.Along with the geometry of link becomes littler, the energy that needs to handle each laser pulse of each link becomes littler, and this is because less link material is removed.When handling littler link geometry, also require littler laser spot size to avoid destroying adjacent link or other structure.Because the energy density in the littler laser spot size, hot spot is higher, thereby requires the energy of each pulse lower to remove link material.
Controlling more accurately of laser energy to keeping every pulse or every group pulse accurately and constant energy is favourable.Can realize stable material removal and more reliable link processing with improved control.Accurate control like this is favourable to laser treatment and accurate little processing usually.
Except handle link, the operation of Optical Maser System also comprises laser beam is registered to usually wants processed device, object construction or other material.
U.S. Patent number 5,196,867 and 6,947,454 is related to the present invention with the U. S. application file of announcing 2005/0270631,2005/0270630 and 2005/0270629.
Need be based on the precision of material handling system improvement is provided for processing and alignment function of laser, there is very wide dynamic range in this system in energy control.Except wide dynamic range, this system also needs good resolution, stability, decay (extinction) and accuracy in energy is provided with.
Summary of the invention
The purpose of this invention is to provide the improved laser processing method and the system that are used for accurately controlling laser output energy.
Another object of the present invention provides and is used for laser material disposal route and the system that accurately controls laser output energy in the enough big dynamic range operated in detection and laser treatment.
One aspect of the present invention is a feature with the energy control method of accurately controlling laser output energy in wide dynamic range.
Another aspect of the present invention is a feature with the laser material disposal system that realizes this method.
Embodiments of the invention are provided at control of very high resolving power energy and the decay in the wide dynamic range.Compare previous method and system, improve the accuracy and the stability of each energy setting greatly and expect.
On realization is of the present invention, in target and other target, provide material processing method based on laser.This method comprises with first laser with first energy density exports radiative material.First energy density is enough high to be exported and the material results of interaction as first laser to produce detectable laser emission, and enough low to avoid the substantial change of material.Described method further comprises at least a portion that detects detectable laser emission, to produce the data of representing material properties, analyzes data, and handles output based on the data of being analyzed with laser material and come the radiation target material.Material processed output has the processing energy density, and it is fully greater than first energy density, thus and enough high physical attribute processing target material with the change target material.
Described method can comprise further that producing first control signal exports with accurate control first laser.
Described method can comprise further that producing second control signal handles output with accurate control material.
Described method can further comprise at least one control signal is arranged in the high s/n ratio opereating specification, is accurately controlled in wide dynamic range so that output of first laser and material processed are exported.
The control signal of described at least one setting can be the analog or digital signal, and the step of described setting can comprise in modulation, amplification, decay, compression, expansion, scale (scaling), delay, coding and the displacement (shifting) that the control signal of described at least one setting is carried out at least one.
Described method can further comprise the control signal of described at least one setting that optionally decays, and handles in exporting at least one to produce output of suitable first laser and suitable laser material.
The control signal of described at least one setting can be the RF signal, and the step of described optionally decay can realize by the switching pad network.
Described material can be target material.
Described processing energy density can be about 1000 times of first energy density.
Described material properties can be light attribute or hot attribute.
Described material properties can be space attribute.
Described data can be represented the position of target material.
Further, on realization is of the present invention, in target and other target, provide material handling system based on laser.Described system comprises the pulse laser system that is used to produce first pulse laser beam and second pulse laser beam, and the material of first pulse laser beam and object interacts to produce laser emission, and second pulse laser beam is the processing target material in the laser treatment operation.Described system further comprises the steady arm that at least one is used to support this object.Described system further comprises measurement subsystem, and measuring operation is carried out in its response at least a portion laser emission, and produces corresponding measuring-signal.Described system further comprises system controller, described at least one steady arm of its response measurement signal controlling and pulse laser system.Described system further comprises and is connected to system controller with the transmission and the beam Propagation and the focus pack of focussed laser beam.Described system further comprises modulator that is used for modulating lasering beam and the energy controller that is connected to modulator, and this energy controller is used for operating the laser output energy of accurately controlling laser beam in the enough big dynamic range for measurement and laser treatment.
Described energy controller can comprise the switching pad network.
Described modulator can be acousto-optical device.
Described modulator can be electro-optical device.
Still further, on realization is of the present invention, in target and other target, provide the position that is used for beyond the laser output source accurately to control the method for the laser energy of laser output.Described method comprises regulates laser energy to obtain scanning energy, and this scanning energy is in the enough low energy range with the ground of non-destructive in measuring operation scanning object.Described method further comprises regulates laser energy to obtain handling energy, and this processing energy is in the energy range of enough height with the target material of handled object.
Still further, on realization is of the present invention, in target and other target, provide a subsystem, be used for being positioned at the laser energy that laser output source photomodulator place in addition accurately controls laser output.Described subsystem comprises the energy controller that produces the output control signal that is used for modulator, is wherein operating Be Controlled in the enough big dynamic range from the laser output energy of modulator for measurement and laser treatment.
Described energy controller can comprise the switching pad network.
Described photomodulator can comprise acousto-optical device.
Described photomodulator can comprise electro-optical device.
According to following description, the claim of enclosing and accompanying drawing, these and other feature of the present invention, aspect and advantage will become better understood.
Description of drawings
Fig. 1 is the concise structure figure that an embodiment of the laser material disposal system that comprises accurate energy control is shown.
Embodiment
To the present invention open in the reference of " energy control " also usually applicable to " power control ", " strength control ", " peak power control ", " average power control " or similar about function.
Storage repairing method/system based on laser
The application documents of following representational patent and announcement are usually directed to be used for the micro-machined method and system based on laser, especially relate to memory repair:
Name is called the United States Patent (USP) 6,791,059 (after this being called the `059 patent) of " laser treatment ";
Name is called the United States Patent (USP) 6,774,288 (after this being called the `288 patent) of " high speed accurate positioning device ";
Name be called " be used for the processing target material high-effect, based on the method and system of laser " United States Patent (USP) 6,727,458 (after this being called the `458 patent);
Name is called the United States Patent (USP) 6,573,473 (after this being called the `473 patent) of " be used for accurate locator material and handle the waist of laser beam to handle the method and system of the microstructure in the laser treatment zone ";
Name is called the United States Patent (USP) 6,381,259 (after this being called the `259 patent) of " control laser polarization ";
Name is called the U.S. Patent application file 2002/0167581 (after this being called the `581 application documents) of the announcement of " based on the method and system of the multiple material devices of laser treatment of heat ";
Name is called the U.S. Patent application file 2004/0134896 (after this being called the `896 application documents) of the announcement of " being used to use picosecond laser to carry out the method and system based on laser that memory link is handled "; With
Name is called the United States Patent (USP) 6,559,412 (after this being called the `419 patent) of " laser treatment ".
At least the following part of quoting of top file is particularly suitable for understanding each feature of the present invention, aspect and advantage.
Fig. 5 of `059 patent and corresponding text relate to the laser processing system that is used to melt silk, wherein provide modulator (attenuator) for pulse choice and energy control.
Fig. 1 of `471 patent and corresponding text relate to the laser processing system that is used to melt silk, wherein provide modulator (attenuator) for pulse choice and energy control.Produce the laser output that has less than the wavelength of .55 micron at least one embodiment.
A lot of figure in `581 and `896 application documents and the `458 patent and corresponding text comprise the modulator that at least one is used for strobe pulse and controls laser energy.
Figure 10 of `581 application documents, 11,12,13,14 and 14b and corresponding text relate to exemplary calibration and measuring method and system.The relevant application documents that name is called " be used for the method and system of the relative accurately waist of position pulse laser beam and be used for the method and system of control transmission to the energy of object construction " come forth as U.S. Patent application file 2002/0166845.
The `288 patent illustrates the i.e. example of " wafer stage " of wafer orientation device, and this device can be used for realizing at least one embodiment of the present invention.
Fig. 4 of `473 patent-6 and corresponding text and the other the 7th are listed as the 60th and walk to the 9th row eighth row and be usually directed to be used in material processed and use calibration and the Poewr control method that especially melts in the silk.
General introduction
One aspect of the present invention is a feature with the laser material disposal route.Described method comprises: export radiative material with first laser with first energy density, first energy density is enough high to be exported and the material results of interaction as first laser to produce detectable laser emission, and enough low to avoid the substantial change of material; At least a portion that detects detectable radiation is to produce the data represented value of material properties; Analyze data; Handle output and come the radiation target material with having the laser material of handling energy density, handle energy density substantially greater than first energy density, and enough high physical attribute and so processing target material to change target material.
Described method can comprise that producing first control signal exports with accurate control first laser.
Described method can comprise that also the generation laser material is handled or second control signal is handled output with accurate control laser material.
Described method can comprise that also with first and second control signals at least one is arranged in the higher signal to noise ratio (S/N ratio) opereating specification, is accurately controlled in wide dynamic range so that output of first laser and material processed are exported.
Described at least one control signal can be the analog or digital signal.The step that described at least one control signal can comprise at least one modulation, amplification, decay, compression, expansion, scale, delay, coding and the described signal of displacement is set.
The signal that described method also optionally comprises at least one described setting that decays is handled in exporting at least one to produce suitable first laser output and suitable laser material.
The signal of described setting can be the RF signal, and the step of described optionally decay can realize with the switching pad network.
Described at least one embodiment material can be target material.
The energy density of described laser material processing output can be about 1000 times of first energy density.
Described material properties can be light attribute or hot attribute.
Described material properties can be space attribute.
Described data also can be represented the position of material.
Another aspect of the present invention is a feature with the system that realizes top laser processing method.Fig. 1 illustrates system 100 of the present invention.Exemplary system comprise pulse laser system 103, at least one steady arm (i.e. motion objective table) 105, measurement subsystem or install 140, system controller (control computer) 115, beam Propagation and focus pack 130, modulator (AOM) 101 and energy controller 150, energy controller 150 be used for for measure and dynamic range that the laser treatment operation is enough big in accurately control laser and export energy 110.
Described modulator can be acousto-optical device 101.
Described modulator can be the electro-optical device with the controller that is used to control voltage.
Detection to calibration, measurement or imaging
With reference to figure 1, in a lot of laser processing systems such as system 100, use and detect 140 scannings of (promptly measuring) device and measure or additionally analyze various parts.These parts are usually in interesting areas.By being in scan laser energy on the parts, observing parts handling wavelength, or can realize calibrating by above-mentioned combination with the visible illumination zone with array camera.When with 103 scannings of processing laser instrument, laser energy 110 at first is set to non-destruction level under modulator 101 controls, and the calibration target on the device 112 (not showing) is scanned or is additionally detected then.Analyzed and position target is determined from the energy of calibration target reflection.As an example, the typical energy of requirement can be lower than 1000 times of link processing energy.When spot size more hour, require the energy that is used to scan just more and more lower.More and more lower scanning energy requires and can in the amount control circuit good decay arranged.Preferably, system 101 can be reduced to energy and be in close proximity to zero can keep the control that energy is provided with.
The control of wide dynamic range energy/power
High accuracy on the laser machining device and the control of high bandwidth energy use the attached RF driver 102 of acousto-optic modulator (AOM) 101 and control AOM 101 to finish usually.
When wafer or motion objective table 105 moved with constant speed, laser instrument 103 led (pulsation rate) state of operation at constant high q usually.At most of time durations, laser energy is set to " closing " state by energy management system.If desired a pulse (or pulsegroup) (1) handle link or other target material, aim at the mark or focus on, then adjust laser energy.Adjust energy by the RF power that changes AOM 101.
| The control of high resolving power energy | |||||||
| High-energy scope (blasting (blasting)) | Low-yield scope (scanning) | ||||||
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
| High scope M4XX ceiling capacity (uj) | RF driver decay property (db) | M435 least energy (nj) | 16 bit DAC resolution (nj) (65535 bit) | Decay or numerical value are (db) | Low scope M4XX ceiling capacity (nj) | Low scope least energy (pj) | Resolution (pj) |
| 1.0 | -40 | 0.10 | 0.015259 | -1 | 794.3282347 | 79.43282347 | 12.12067193 |
| 1.0 | -40 | 0.10 | 0.015259 | -2 | 630.9573445 | 63.09573445 | 9.6279194 |
| 1.0 | -40 | 0.10 | 0.015259 | -4 | 398.1071706 | 39.81071706 | 6.07472603 |
| High scope M4XX ceiling capacity (uj) | RF driver decay property (db) | M435 least energy (nj) | 16 bit DAC resolution (nj) (65535 bit) | Decay or numerical value are (db) | Low scope M4XX ceiling capacity (nj) | Low scope least energy (pj) | Resolution (pj) |
| 1.0 | -40 | 0.10 | 0.015259 | -8 | 158.4893192 | 15.84893192 | 2.41839199 |
| 1.0 | -40 | 0.10 | 0.015259 | -16 | 25.11886432 | 2.51188643 | 0.38328930 |
| 1.0 | -40 | 0.10 | 0.015259 | -32 | 0.630957344 | 0.06309573 | 0.00962779 |
The 1-4 row of this table have shown the typical ideal situation of memory repair link blasting.From the order of system controller 115 or respond laser energy input and the 16 bit DAC 120 of the 1.0 μ j (little Jiao) of other technical requirement, minimum obtainable energy (decay) is 0.10nj (receives joule) for response.The resolution that reaches is 0.015nj.Problem be DAC 120 and RF driver 102 all in the very low side operation of its scope, wherein signal is very little and with noise.Because signal to noise ratio (SNR) is poor in the input drive signal of RF driver 102 and RF driver 102, can not realize the resolution and the decay property of this ideal situation usually.
In improved enforcement, selectable volume damper device 125 is crossed the output of FR driver and is switched to lower many total RF output and final every pulsed laser energy (pressing modelling as 5-8 row in the table).The value of attenuator 125 is determined obtainable energy range, the part of pj shown in the situation (picojoule) or pj.
In at least one embodiment, can use more than an attenuator and switch to obtain a plurality of energy ranges.
The more important of noting is, after connecting volume damper device 125, laser energy reduces greatly and RF driver 102 can near the operation once more much better full RF power of SNR then.Input voltage from DAC120 is also much higher, thus input voltage also not at the low side of its scope, wherein since the relatively poor input voltage of SNR at the low side of its scope also with noise.This embodiment has illustrated various advantage of the present invention: the dynamic range of increase, bigger decay (lower as far as possible energy), higher accuracy and stability, the latter be because the SNR of DAC input voltage is higher and RF driver 102 in SNR higher.
Exemplary operation is particularly suited for memory repair, but can be suitable in the little process operation based on laser of other precision, using: for example mark, repair accent, micropunch, little shaping, figure processing, flat pannel display or thin film circuit reparation, and the similar high-speed applications that needs the accurate energy control of laser pulse, this laser pulse strikes target material.
The embodiment of Fig. 1 illustrates acousto-optic modulator 101 and RF controller.Other embodiment can comprise electric light (E-O) modulator, for example pockels cell (pockels cell), slab guide modulator or other optical switch of operating in suitable range of control.The function that several such devices are input voltage usually with polarization is controlled.Be similar to " segmentation " shown in Figure 1 or the conversion of switch, or other suitable voltage scale, be used in the laser processing system that utilizes the E-O modulator and improve performance.
Embodiments of the invention also can be used in the system that includes mode locking lasing light emitter or gain switch lasing light emitter.As an example, pulse width can be in about 1 psec (or shorter) in the scope of hundreds of nanosecond (or longer).Use individual pulse or a plurality of pulse can realize the processing of target material.
Further, at least one embodiment of the present invention can realize at infrared, visible and UV wavelength, and can have superiority especially the short wavelength.
Accurately calibration
Preferably, system of the present invention is accurately calibrated in whole wide dynamic range.Calibration is used for providing transport property between the digital value of DAC 120 inputs and laser output 110.One or more detecting devices 141 can be included in the measurement mechanism 140, and measurement mechanism 140 is coupled to system controller usually effectively.In at least one embodiment, " power instrument " 143 can be placed on wafer stage 105 or near wafer stage 105, with direct Laser Measurement power, energy or other pulse characteristic.
Though exemplify and described embodiments of the invention, intention is not that these embodiment exemplify and describe all possible forms of the invention.More properly, the speech that uses in this instructions is to describe rather than the speech of restriction, and should be understood that and can carry out various variations and without departing from the spirit and scope of the present invention.
Claims (21)
1. material processing method based on laser comprises:
With the first laser output radiation material with first energy density, described first energy density is enough high to be exported and described material results of interaction as described first laser to produce detectable laser emission, and enough low to avoid the substantial change of described material;
Detect at least a portion of described detectable laser emission, to produce the data of the attribute of representing described material;
Analyze described data; With
Handle output according to the data of described analysis with laser material and come the radiation target material, described material processed output has the processing energy density, described processing energy density is fully greater than described first energy density, thereby and enough highly handles described target material with the physical attribute that changes described target material.
2. the method for claim 1 further comprises producing first control signal with described first laser output of accurate control.
3. method as claimed in claim 2 further comprises producing second control signal with the described material processed output of accurate control.
4. method as claimed in claim 3 further comprises at least one described control signal is arranged in the high s/n ratio opereating specification, so that output of described first laser and the output of described material processed are accurately controlled in wide dynamic range.
5. method as claimed in claim 4, the control signal of wherein said at least one setting is the analog or digital signal, and the step of wherein said setting can comprise in modulation, amplification, decay, compression, expansion, scale, delay, coding and the displacement that the control signal of described at least one setting is carried out at least one.
6. method as claimed in claim 4 further comprises the control signal of described at least one setting that optionally decays, and handles in exporting at least one to produce suitable first laser output and suitable laser material.
7. method as claimed in claim 6, the control signal of wherein said at least one setting are the RF signal, and the step of wherein said optionally decay realizes by the switching pad network.
8. the method for claim 1, wherein said material is described target material.
9. the method for claim 1, wherein said processing energy density is about 1000 times of described first energy density.
10. the method for claim 1, the attribute of wherein said material is light attribute or hot attribute.
11. the method for claim 1, the attribute of wherein said material are space attribute.
12. the method for claim 1, the position of the described target material of wherein said data representation.
13. the material handling system based on laser comprises:
Pulse laser system, it is used to produce first pulse laser beam and second pulse laser beam, and the material of described first pulse laser beam and object interacts to produce laser emission, reaches described second pulse laser beam processing target material in the laser treatment operation;
At least one steady arm, it is used to support described object;
Measurement subsystem, measuring operation is carried out in the described laser emission of its response at least a portion, and produces corresponding measuring-signal;
System controller, it responds described measuring-signal described at least one steady arm of control and described pulse laser system;
Beam Propagation and focus pack, it is connected to described system controller with transmission with focus on described laser beam;
Modulator is used to modulate described laser beam; With
Energy controller, it is connected to described modulator, and described energy controller is used for operating the laser output energy of accurately controlling described laser beam in the enough big dynamic range for described measurement and laser treatment.
14. system as claimed in claim 13, wherein said energy controller comprises the switching pad network.
15. system as claimed in claim 13, wherein said modulator comprises acousto-optical device.
16. system as claimed in claim 13, wherein said modulator comprises electro-optical device.
17. a method, the laser energy that described laser is exported is accurately controlled in its position that is used for beyond the source of laser output, and described method comprises:
Regulate described laser energy to obtain scanning energy, described scanning energy is in the enough low energy range with the ground of non-destructive in measuring operation scanning object; With
Regulate described laser energy handling energy, described processing energy is in the energy range of enough height with the target material of handling described object.
18. a subsystem, its photomodulator place that is used for beyond the source that is positioned at laser output accurately controls the laser energy that described laser is exported, and described subsystem comprises:
Energy controller, its generation are used for the output control signal of described modulator, are wherein operating Be Controlled in the enough big dynamic range from the laser output energy of described modulator for measurement and laser treatment.
19. subsystem as claimed in claim 18, wherein said energy controller comprises the switching pad network.
20. subsystem as claimed in claim 18, wherein said photomodulator comprises acousto-optical device.
21. subsystem as claimed in claim 18, wherein said photomodulator comprises electro-optical device.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64034104P | 2004-12-30 | 2004-12-30 | |
| US60/640,341 | 2004-12-30 | ||
| US11/317,047 | 2005-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101095033A true CN101095033A (en) | 2007-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200580045693 Pending CN101095033A (en) | 2004-12-30 | 2005-12-28 | Laser-based material processing methods, system and subsystem for use therein for precision energy control |
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|---|---|
| CN (1) | CN101095033A (en) |
| TW (1) | TW200638646A (en) |
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