CN101087505A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN101087505A CN101087505A CN 200610060978 CN200610060978A CN101087505A CN 101087505 A CN101087505 A CN 101087505A CN 200610060978 CN200610060978 CN 200610060978 CN 200610060978 A CN200610060978 A CN 200610060978A CN 101087505 A CN101087505 A CN 101087505A
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- China
- Prior art keywords
- heat
- fin
- heat abstractor
- conducting base
- ventilation hole
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Abstract
The invention relates to a radiating device. The radiating device includes at least one radiating piece; the radiating piece possesses several airways, the surface of inner wall of the airway is bigger than sum of end surface of two ends of airway. The airway increases the radiating area of the radiating device and enlarges air convection; radiating effect can be increased, at the same time volume of the radiating device can be decreased.
Description
Technical field
The present invention relates to a kind of heat abstractor, especially for the heat abstractor of electronic devices and components.
Background technology
Continuous lifting along with electronic installation usefulness, heat abstractor or cooling system have become one of accessory indispensable in the existing electronic installation, if it is, gently then cause the usefulness variation, heavy then can cause burning of electronic installation because the heat energy that electronic installation produced does not suitably discharge in addition.Heat abstractor is important especially for microelectronic element, for example integrated circuit.Because along with the increase of integrated level and the progress of encapsulation technology, make the area of integrated circuit constantly dwindle, the heat that the while unit are is accumulated also relatively can be higher, so the heat abstractor of high heat dissipation efficiency is an actively research and development object of electronic industry circle institute always.
A kind of heat abstractor of prior art as shown in Figure 1, this heat abstractor 10 is arranged on the surface-mounted integrated circuit 1 by welding manner, this surface-mounted integrated circuit 1 surface is provided with a plurality of electronic devices and components.
This heat abstractor 10 comprises a heat-conducting base 11 and a plurality of fin 12.This heat-conducting base 11 is vertically set on this surface-mounted integrated circuit 1, these a plurality of fin 12 and these heat-conducting base 11 one.These a plurality of fin 12 are the rectangular flat that a plurality of parallel interval are provided with, and the surface of all parallel this surface-mounted integrated circuit 1 of each fin 12 is provided with, and extend on these heat-conducting base 11 surfaces certainly.
The heat-conducting base 11 of this heat abstractor 10 and the common formation of these a plurality of fin 12 outer surfaces one cooling system.The energy conduction that produces when this surface-mounted integrated circuit 1 work is to this heat-conducting base 11, the surface of this heat-conducting base 11 conducts to surrounding air with partial heat energy, simultaneously another part heat is conducted to these a plurality of fin 12, by these fin 12 surfaces another part heat is conducted to ambient air then, thereby play thermolysis.These a plurality of fin 12 spaced and parallel settings, the interval of 12 formation of per two adjacent fin forms gas flow 13, and the portion of hot air-flow can flow along these gas flow 13 directions.
Yet, though the portion of hot air-flow can flow along gas flow 13 directions that septal direction forms, but the heat-conducting base 11 of this heat abstractor 10 and these a plurality of fin 12 mutual vertical settings, so on perpendicular to gas flow 13 directions, gas then can not flow, and therefore, reduces the gas flow effect of heat abstractor 10, cause gas-flow resistance to increase, also influence radiating effect.
In addition,, then need to increase fin 12 areas in order to obtain big area of dissipation, thus the volume of heat abstractor 10 unavoidably increased, and then cause the electronic installation volume of this heat abstractor 1 of whole use to become big.
Summary of the invention
The heat abstractor volume reaches the not good problem of radiating effect greatly in the prior art in order to overcome, and the invention provides that a kind of volume is little, the heat abstractor of good heat dissipation effect.
A kind of heat abstractor, it comprises at least one fin, this fin is provided with a plurality of ventilation holes, the interior side-wall surface of this ventilation hole long-pending greater than this ventilation hole two ends end section area and.
Compared with prior art, heat abstractor of the present invention is by being provided with a plurality of ventilation holes on this fin, and the long-pending end section area greater than this ventilation hole of the interior side-wall surface of this ventilation hole, and then increase heat abstractor and air contact area improve radiating effect; Reduce to use the fin volume by a plurality of ventilation hole modes are set simultaneously, and then reduce the volume of entire heat dissipation device.
Description of drawings
Fig. 1 is that the prior art heat abstractor is arranged on the schematic perspective view on the surface-mounted integrated circuit.
Fig. 2 is that heat abstractor that first embodiment of the invention discloses is arranged on the schematic perspective view on the surface-mounted integrated circuit.
Fig. 3 is that heat abstractor that second embodiment of the invention discloses is arranged on the schematic perspective view on the surface-mounted integrated circuit.
Fig. 4 is that heat abstractor that third embodiment of the invention discloses is arranged on the schematic perspective view on the surface-mounted integrated circuit.
Fig. 5 is the heat abstractor schematic perspective view that four embodiment of the invention discloses.
Embodiment
Seeing also Fig. 2, is heat abstractor 20 schematic perspective views that first embodiment of the invention discloses.This heat abstractor 20 is arranged on the surface-mounted integrated circuit 2.This surface-mounted integrated circuit 2 is a rectangle printed circuit board (PCB), and it is provided with a plurality of electronic devices and components.
This heat abstractor 20 comprises a heat-conducting base 21 and a plurality of fin 22.This heat-conducting base 21 is arranged on this surface-mounted integrated circuit 2 by welding manner.These a plurality of fin 22 are the flat board that one group of parallel interval is provided with, and these a plurality of fin 22 are one with this heat-conducting base 21, all vertical this heat-conducting base 21 of each fin 22 is provided with, array is distributed with a plurality of ventilation holes 23 on each fin 22, this ventilation hole 23 is manholes, the ventilation hole 23 of per two adjacent column and adjacent lines is all staggered, is cellular and arranges.
In this heat abstractor 20, form the gas flow of a direction between per two adjacent fin 22.Corresponding ventilation hole 23 forms the gas flow of other direction again on this fin 22, and intersects mutually with the gas flow direction of 22 of per two adjacent fin.Wherein heat-conducting base 21 and this fin 22 respectively can be made by copper, copper alloy, aluminum or aluminum alloy etc.
Simultaneously, be arranged at ventilation hole 23 radiuses on this fin 22 less than the thickness of this fin 22.The radius of getting this ventilation hole 23 is r, and the thickness of this fin 22 is d, because these ventilation hole 23 end cross sections are circular, so its end area is 2 π r
2After ventilation hole 23 is set, form new surface area 2 π rd.And this circular radius r is less than these fin 22 thickness d, then 2 π r
2＜2 π rd, that is, the interior side-wall surface of this ventilation hole 23 long-pending greater than these ventilation hole 23 two ends cross sections and, thereby increase the contact area of this fin 23 and air.
When these surface-mounted integrated circuit 2 work, the heat of its generation conducts to the heat-conducting base 21 of this heat abstractor 20, this heat-conducting base 21 by with air contacting surface conduction portion heat to ambient cold air, simultaneously another part thermal energy conduction to these a plurality of fin 22, this fin 22 same by the surface conductive heat that contacts with air to ambient cold air.With regard to gas with regard to flowing in this heat abstractor 20, gas around this heat abstractor 20 can flow along the gas flow direction of 22 of per two adjacent fin, can flow along the direction of ventilation hole 23 again simultaneously, form a combined type multithread to heat abstractor 20.And on the gas flow direction, the hot-air of cold air on every side and heat abstractor 20 releases place mutual bump on the gas flow direction, thereby release heat better improve radiating efficiency.
This heat abstractor 20 constitutes a cooling system by the surface that this heat-conducting base 21 and this fin 22 contact with air, and the heat that this surface-mounted integrated circuit 2 is produced effectively sheds, and guarantees that electronic devices and components are functional on it.
Certainly, this fin 22 can also be engaged with each other with low thermal resistance adhesive agents such as tin cream or heat-conducting glues and be welded on this heat-conducting base 21.
Compared to prior art, the heat abstractor 20 that this execution mode disclosed adopts the structure that ventilation hole 23 is set on fin 22, increase this heat abstractor 2 and air contact area, improves radiating efficiency.Simultaneously, in this embodiment, only use a small amount of fin 22 just can play better heat radiating effect, effectively reduce the overall volume of heat abstractor 2.
Seeing also Fig. 3 again, is that heat abstractor 30 that second embodiment of the invention discloses is arranged on the schematic perspective view on the surface-mounted integrated circuit 3.
In this embodiment, these heat abstractor 30 adhesive agents by low thermal resistance rates such as tin creams are arranged on this collective's circuit board 3.This heat abstractor 30 comprises a fin 32, and a plurality of ventilation holes 33 are set on it, and these a plurality of ventilation holes 33 are cellular and are distributed on this fin 32.Wherein this fin 32 can be made by copper, copper alloy, aluminum or aluminum alloy, and these ventilation hole 33 radiuses are less than these fin 32 thickness.
In this embodiment, this fin 32 is set directly on this surface-mounted integrated circuit 3, increases this heat abstractor 30 and air contacting surface area, guarantee that this heat abstractor has significant radiating effect by this ventilation hole 33.Simultaneously, reduce use heat-conducting base 11, further reduced heat abstractor 30 volumes compared to prior art.
Seeing also Fig. 4, is that heat abstractor 40 that third embodiment of the invention discloses is arranged on the schematic perspective view on the surface-mounted integrated circuit 4.Wherein the heat abstractor 30 that disclosed of the heat abstractor 40 of this execution mode and second execution mode comprises a fin 42 equally, it is provided with a plurality of ventilation holes 43, wherein difference is: a plurality of ventilation holes 43 that are arranged on these fin 42 surfaces are matrix arranges, and these fin 42 two ends ventilation holes 43 are arranged and arranged to dredging gradual change by close along direction from bottom to top.
Seeing also Fig. 5, is heat abstractor 50 schematic perspective views that four embodiment of the invention discloses.The heat abstractor 50 that this execution mode disclosed comprises a fin 52 and a plurality of ventilation hole 53 that is arranged on this fin 52 equally, wherein difference is: this ventilation hole 53 is rectangular, and these ventilation hole 53 interior side-wall surface long-pending greater than these ventilation hole 53 ends two rectangular cross-sectional area and, that is, these ventilation hole 53 madial wall areas are greater than these ventilation hole 53 end section areas.
Claims (10)
1. heat abstractor, it comprises at least one fin, it is characterized in that: this fin is provided with a plurality of ventilation holes, the interior side-wall surface of this ventilation hole long-pending greater than these ventilation hole two ends the end section area and.
2. heat abstractor as claimed in claim 1 is characterized in that: this heat abstractor also comprises a heat-conducting base, and this fin is arranged on this heat-conducting base.
3. heat abstractor as claimed in claim 2 is characterized in that: this fin is vertically set on this heat-conducting base.
4. heat abstractor as claimed in claim 2 is characterized in that: this fin engages with this heat-conducting base in the welding processing mode.
5. heat abstractor as claimed in claim 2 is characterized in that: this fin and this heat-conducting base are one.
6. heat abstractor as claimed in claim 2 is characterized in that: this heat-conducting base is made by copper, copper alloy, aluminum or aluminum alloy.
7. heat abstractor as claimed in claim 1 is characterized in that: this heat abstractor comprises a plurality of fin, and this a plurality of fin space certain interval be arranged in parallel.
8. heat abstractor as claimed in claim 1 is characterized in that: the cross section of this ventilation hole is circle or rectangle.
9. heat abstractor as claimed in claim 1 is characterized in that: these a plurality of ventilation holes are cellular distribution.
10. heat abstractor as claimed in claim 1 is characterized in that: these a plurality of ventilation holes are matrix and arrange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610060978 CN101087505A (en) | 2006-06-07 | 2006-06-07 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610060978 CN101087505A (en) | 2006-06-07 | 2006-06-07 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101087505A true CN101087505A (en) | 2007-12-12 |
Family
ID=38938189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610060978 Pending CN101087505A (en) | 2006-06-07 | 2006-06-07 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101087505A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827512A (en) * | 2010-04-15 | 2010-09-08 | 镇江市东亚电子散热器有限公司 | Heat radiating method of high-power electronic device and rolling type fin inserting heat radiator |
| CN102185093A (en) * | 2011-04-08 | 2011-09-14 | 陕西科技大学 | Active cool type radiating substrate using air convection |
| CN103177775A (en) * | 2011-12-20 | 2013-06-26 | 昆山新力精密五金有限公司 | Radiating fin group with improved structure |
| CN103429058A (en) * | 2013-07-26 | 2013-12-04 | 昆山维金五金制品有限公司 | Radiating fin |
| CN104039120A (en) * | 2014-06-30 | 2014-09-10 | 吴文武 | Cooling device |
| CN105228414A (en) * | 2015-10-08 | 2016-01-06 | 姜超 | A kind of diode of high heat dispersion |
| CN106028630A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board and mobile terminal with same |
| CN108260273A (en) * | 2016-12-29 | 2018-07-06 | 盟创科技股份有限公司 | Network communication device and electronic module and heat dissipation substrate structure thereof |
-
2006
- 2006-06-07 CN CN 200610060978 patent/CN101087505A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101827512A (en) * | 2010-04-15 | 2010-09-08 | 镇江市东亚电子散热器有限公司 | Heat radiating method of high-power electronic device and rolling type fin inserting heat radiator |
| CN101827512B (en) * | 2010-04-15 | 2012-11-14 | 镇江市东亚电子散热器有限公司 | Heat radiating method of high-power electronic device and rolling type fin inserting heat radiator |
| CN102185093A (en) * | 2011-04-08 | 2011-09-14 | 陕西科技大学 | Active cool type radiating substrate using air convection |
| CN103177775A (en) * | 2011-12-20 | 2013-06-26 | 昆山新力精密五金有限公司 | Radiating fin group with improved structure |
| CN103177775B (en) * | 2011-12-20 | 2015-02-25 | 昆山新力精密五金有限公司 | Radiating fin group with improved structure |
| CN103429058A (en) * | 2013-07-26 | 2013-12-04 | 昆山维金五金制品有限公司 | Radiating fin |
| CN104039120A (en) * | 2014-06-30 | 2014-09-10 | 吴文武 | Cooling device |
| CN105228414A (en) * | 2015-10-08 | 2016-01-06 | 姜超 | A kind of diode of high heat dispersion |
| CN106028630A (en) * | 2016-07-28 | 2016-10-12 | 广东欧珀移动通信有限公司 | Circuit board and mobile terminal with same |
| CN108260273A (en) * | 2016-12-29 | 2018-07-06 | 盟创科技股份有限公司 | Network communication device and electronic module and heat dissipation substrate structure thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |