CN101080822B - Light emitting diode package and fabricating method thereof - Google Patents
Light emitting diode package and fabricating method thereof Download PDFInfo
- Publication number
- CN101080822B CN101080822B CN2005800428742A CN200580042874A CN101080822B CN 101080822 B CN101080822 B CN 101080822B CN 2005800428742 A CN2005800428742 A CN 2005800428742A CN 200580042874 A CN200580042874 A CN 200580042874A CN 101080822 B CN101080822 B CN 101080822B
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- support ring
- fin
- wire
- lead
- main body
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- 230000017525 heat dissipation Effects 0.000 abstract 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Led Device Packages (AREA)
Abstract
There are provided a leadframe, a method of fabricating a light emitting diode package using the leadframe, and the light emitting diode package fabricated by the method. The leadframe includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. Consequently, since the package body can be formed by an injection molding after a heat sink is inserted into the leadframe, a LED package having structural stability and good heat dissipation can be fabricated with ease.
Description
Technical field
The present invention relates to a kind of lead frame, a kind of method of described lead frame manufacturing LED package and LED package of making by described method used, and more particularly relate to: a kind of lead frame with fin support ring, described fin support ring can be fixed to fin lead frame to be separated with package main body to prevent fin; A kind of method of using described lead frame to make LED package; And the LED package of making by described method.
Background technology
The lighting power of light-emitting diode (hereinafter being called LED) is proportional with input power in fact.Therefore, the electrical power that is input to LED by increase can obtain high lighting power.Yet the increase of input power causes the knot of LED (junction) temperature to increase.The junction temperature increase of LED causes representing that intake is converted to the loss of luminous efficiency of the transfer ratio of visible light.Therefore, need prevent that the junction temperature of LED is owing to the input power that increases rises.
The example that the LED that disclosing a kind of junction temperature of using fin to prevent LED in the 6th, 274, No. 924 United States Patent (USP)s that are entitled as " surface-mountable LED encapsulation (surface mountable LED package) " increases encapsulates.According to USP 6,274,924, the thermal coupling of fin and led circuit small pieces (die) makes the led circuit small pieces can keep low junction temperature.Therefore, higher relatively input power can be fed to the led circuit small pieces to obtain higher lighting power.
Yet the structural instability of existing LED encapsulation is because fin may separate with package main body easily.When fin separated with package main body, electric connecting wire was cut off with the closing line that is installed in the led circuit small pieces on fin top, thereby encapsulation brings irremediable damage to LED.Therefore, need to prevent that the LED that fin separates with package main body from encapsulating.
Summary of the invention
Technical problem
Therefore, a purpose of the present invention provides a kind of junction temperature that can prevent led circuit small pieces under high input power to be increased, and obtains the LED encapsulation of high lighting power whereby, with and manufacture method.
Another object of the present invention provides a kind of LED encapsulation that can prevent that fin from separating with package main body, with and manufacture method.
Another purpose of the present invention provides a kind of lead frame that is suitable for easily making the constitutionally stable LED encapsulation with good heat radiating characteristic.
Technical solution
In order to realize these and other objects, the invention provides a kind of lead frame with fin support ring, a kind of method that described lead frame makes LED package and LED package of making by described method used.
According to an aspect of the present invention, provide a kind of lead frame.Lead frame comprises the fin support ring that is used to support fin.Housing and fin support ring are spaced apart, and envelope is round the fin support ring.At least one supporting wire connects fin support ring and housing, to support described support ring.At least one separated leads is extended towards the fin support ring from housing, and spaced apart with the fin support ring.Therefore, owing to can after fin is inserted lead frame, use the inserted mode system technology to form package main body, the therefore stable LED encapsulation of manufacturing structure easily.
The fin support ring can be C type ring, and it is the ring that a part is cut.Separated leads can be extended towards the cutting part of fin support ring.
At least two supporting wires can connect fin support ring and housing.Supporting wire is arranged on the opposite side of fin support ring, makes it against housing stably to support the fin support ring.
And at least two separated leads are extended towards the fin support ring from housing.At least two separated leads and fin support ring are spaced apart.Separated leads is arranged on the other opposite side of fin support ring.
According to a further aspect in the invention, provide a kind of method of making LED package.Described method comprises prepares lead frame and fin.Lead frame comprises the fin support ring that is used to support fin.Housing and fin support ring are spaced apart, and envelope is round the fin support ring.At least one supporting wire connects fin support ring and housing, to support described support ring.At least one separated leads is extended towards the fin support ring from housing, and spaced apart with the fin support ring.Prepare fin so that insert and be fixed to the fin support ring.Fin is inserted and is fixed to the fin support ring.Then, use the inserted mode system technology to form the package main body that supports fin, supporting wire and separated leads.Package main body has each a part and the opening that exposes of the upper surface of fin that makes lead-in wire.At least one circuit of LED small pieces is installed on the upper surface of fin, and forms both closing lines at least in being electrically connected the led circuit small pieces and going between.Then, form the sealant that covers the circuit of LED small pieces.Thus, can make the LED encapsulation that can prevent that fin from separating with package main body.
Simultaneously, package main body can have the notch that partly is elongated to opening from the top edge of package main body.When using molding technique to form sealant, notch serves as the exhaust outlet of gas.Thus, use mould to form sealant easily with lens shape.Notch can extend towards opening from the relative top edge part of package main body.
From housing cutting supporting wire and separated leads, connect lead-in wire to form.Connecting lead-in wire can be in the outer bend of package main body.
The term supporting wire of this paper is meant that the housing and the fin support ring that are used for connecting lead frame make its lead-in wire against housing to support the fin support ring.The term separated leads of this paper be meant from housing extend towards the fin support ring but with the isolated lead-in wire of support ring.Simultaneously, the term of this paper connects the lead-in wire that lead-in wire is meant the LED encapsulation of waiting to be electrically connected to external circuit.Supporting wire and separated leads can be used as the lead-in wire that is connected of LED encapsulation.
According to a further aspect in the invention, provide a kind of LED package.Described encapsulation comprises the fin support ring.Fin inserts in the fin support ring.At least two connect lead-in wire and are arranged on the both sides of fin support ring with electrically isolated from one.Package main body is attached to fin and is connected lead-in wire to support fin and to be connected lead-in wire.Package main body has the opening of the upper surface exposure that makes each part that connects lead-in wire and fin.According to a further aspect in the invention, the fin support ring supports fin, separates with package main body to prevent fin.
All connect lead-in wire all can be spaced apart with the fin support ring.Otherwise, connect one of lead-in wire and can be connected to the fin support ring.
The fin support ring can be C type ring, and it is the ring that a part is cut.In the case, extend to the cutting part of fin support ring with isolated one of the lead-in wire that is connected of support ring.Thus, connecting lead-in wire can be set near fin.
The lower surface of fin outwards exposes.Therefore, the lower surface by fin dispels the heat.The protuberance that fin can have substrate and project upwards from the middle body of substrate.Protuberance inserts in the fin support ring.Thus, can under the situation of the surface area of keeping heat radiation, reduce the size of LED encapsulation.
Fin can have in addition and is used for the support ring fixing groove of fixing support ring with fastening fin support ring in a side of protuberance.Support ring fixing groove can be helical groove.The fastening of fin support ring is in the fixing groove, to firmly fix fin.
Package main body is the plastic resin that forms by injection-molded thermosetting or thermoplastic resin after fin being inserted in the fin support ring.Thus, can easily form complicated package main body, and fin is fixed firmly to package main body.
Package main body can have the notch that partly is elongated to opening from the top edge of package main body in addition.Notch can partly be elongated to opening from the relative top edge of package main body.
Package main body can have surperficial going up along the lens fixing groove of the neighboring of upper surface in addition thereon.Lens fixing groove increases the contact area between package main body and the lens, to prevent that lens are from package main body pine oil (released).
At least one circuit of LED small pieces is installed on the upper surface of fin.The circuit of LED small pieces are electrically connected to via closing line and connect lead-in wire.In addition, sealant covers the circuit of LED small pieces.Sealant protection led circuit small pieces are not subjected to the influence of external force and environment (for example, moisture).Sealant has the hardness in Shore hardness 10A arrives Shore hardness 70D scope, so that alleviate machinery and thermal stress on the led circuit small pieces.
In addition, phosphor can be arranged on the led circuit small pieces, to change from led circuit small pieces wavelength of light emitted.Phosphor can be incorporated in the sealant.
Description of drawings
By preferred embodiment with reference to the accompanying drawings to describe the present invention, will understand above-mentioned purpose of the present invention, further feature and advantage more, wherein:
Fig. 1 is the perspective view of lead frame according to an embodiment of the invention.
Fig. 2 is the technological process of describing to make according to an embodiment of the invention the method for LED encapsulation.
Fig. 3 is to describe to make the perspective view of the method for LED encapsulation according to an embodiment of the invention based on the technological process of Fig. 2 to Figure 15.
Figure 16 and Figure 17 are respectively perspective view and the plan view from above of describing LED encapsulation according to another embodiment of the present invention.
Figure 18 is a cross-sectional view of describing the LED encapsulation among Figure 16 according to another embodiment of the present invention, in the described LED encapsulation led circuit small pieces and lens is installed.
Figure 19 and Figure 20 are respectively the plan view from above of lead frame of describing to can be used for to make the LED encapsulation of another embodiment of the present invention.
Embodiment
Now will be specifically with reference to the preferred embodiments of the present invention, the example of described embodiment is described in the accompanying drawings.
Fig. 1 is the perspective view of lead frame according to an embodiment of the invention.
With reference to Fig. 1, lead frame 10 comprises fin support ring 13, and fin can insert in the fin support ring 13.Support ring 13 can form annular shape shown in Figure 1, but its shape is not limited thereto, but can form polygon annular shape.
Support ring 13 by housing 11 envelopes round.Housing 11 is spaced apart with support ring 13.Housing 11 can form square shape shown in Figure 1, but its shape is not limited thereto, but can form round-shaped or polygonal shape.
In addition, lead-in wire 17a, 17b, 17c, 19a, 19b and the 19c of at least two separation extend towards support ring 13 from housing 11.The lead-in wire and the support ring 13 that separate are spaced apart.As shown in Figure 1, lead-in wire 17a, 17b, 17c, 19a, 19b and the 19c of separation can have near the vertical end that has wide region support ring 13.Simultaneously, the lead-in wire of separation can be arranged on the opposite side of support ring 13.
The number of required separated leads is decided by the type of led circuit small pieces to be installed and the configuration that is connected of number and closing line.Yet lead frame 10 can comprise the lead-in wire of a plurality of separation to make various encapsulation.The lead-in wire that separates can be arranged on the direction perpendicular to supporting wire 15a and 15b, as shown in Figure 1.
Although Fig. 1 illustrates the lead-in wire of six separation, separated leads still less can be set, or extra separated leads can further be set.
Can be by making lead frame 10 according to an embodiment of the invention with circuit small pieces compacting phosphor bronze sheet.Although Fig. 1 illustrates a lead frame 10, on a phosphor bronze sheet, can make and arrange a plurality of lead frames 10.In particular, a plurality of lead frames 10 of making on a phosphor bronze sheet are used for making in a large number the LED encapsulation.
Fig. 2 is the technological process of describing to make according to an embodiment of the invention the method for LED encapsulation.Fig. 3 is the perspective view of describing to make according to an embodiment of the invention the method for LED encapsulation to Figure 14.
With reference to Fig. 2, prepare the lead frame of describing above with reference to Fig. 1 10 (S01).Make lead frame 10 by the compacting phosphor bronze sheet, or can on a phosphor bronze sheet, make and arrange a plurality of lead frames 10.
With reference to Fig. 2 and Fig. 3, the fin 20 (S03) of the support ring 13 of lead frame 10 can be inserted and be fixed to preparation.The upper surface of led circuit small pieces above having, fin 20 is installed.Preferably, the size of the upper surface of fin 20 is littler than the internal diameter of support ring 13, easily fin is inserted in the support ring 13.And the external diameter of the sidepiece of fin 20 is greater than the internal diameter of support ring 13.
And fin 20 can have support ring fixing groove 23a to fasten to support ring 13.In addition, support ring fixing groove 23a can possess helical groove easily to fasten to support ring 13.
The protuberance 23 that fin 20 has substrate 21 and projects upwards from the middle body of substrate 21.In the case, support ring fixing groove 23a is formed on a side of protuberance 23.Substrate 21 and protuberance 23 can have cylinder form, and as shown in the figure, but its shape is not limited thereto, but can have the shape of polygon shell.Protuberance 23 forms the shape of the interior shape that is similar to support ring 13, but the invention is not restricted to this.That is to say that although support ring 13 has the annular shape, protuberance 23 can have the shape of rectangular enclosure.
With reference to Fig. 2 and Fig. 4, fin 20 is inserted and is fixed to the support ring 13 (S05) of lead frame 10.Because the external diameter of the sidepiece of fin 20 greater than the internal diameter of support ring 13, therefore can insert fin 20 and be fixed to support ring 13 by force.
When fin 20 is formed with support ring fixing groove 23a, support ring 13 is received among the support ring fixing groove 23a to support fin 20.In the case, preferably the part with support ring 13 is received among the support ring fixing groove 23a, and the remainder of support ring 13 is outwards outstanding from protuberance 23, as shown in the figure.When support ring fixing groove 23a is helical groove, fin 20 is inserted in the support ring 13 by rotation fin 20.
With reference to Fig. 2 and Fig. 5, after fin 20 is fixed to lead frame 10, use the inserted mode system technology to form package main body 30 (S07).Package main body 30 can be formed by thermosetting or thermoplastic resin by injection-molded.
Package main body 30 is formed at the circumference of fin 20 and sentences this support ring 13 of support, supporting wire 15a and 15b, lead-in wire 17a, the 17b, 17c, 19a, 19b and the 19c that separate and fin 20.Package main body is attached to fin and lead-in wire.Outwards part is outstanding from package main body 30 with the lead-in wire that separates for supporting wire.In addition, package main body 30 has upper end that makes fin 10 and the opening that goes between and expose.
With reference to Fig. 5, expose support ring 13 and lead-in wire by described opening.Otherwise as shown in Figure 6, package main body 30a can cover most of parts (except the several portions of the upper end of fin 20 and lead-in wire 17a, the 17b, 17c, 19a, 19b and the 19c that separate) of fin 20, support ring 13 and lead-in wire.For this reason, can provide some openings.
Simultaneously, package main body 30a can have notch 30n on the surface thereon, as shown in Figure 7.Notch partly is elongated to opening from the top edge respect to one another of package main body 30.Notch can have a bottom, and described bottom is higher near the opening part of package main body 30 and lower away from the opening part of package main body 30.
And, the lower surface of fin 20 is outwards exposed.In addition, a side of substrate 21 is exposed.Thus, quickened the heat radiation undertaken by fin 20.
Package main body 30 forms cylinder form, and as Fig. 5, Fig. 6 and shown in Figure 7, but its shape is not limited thereto, but can form the shape of polygon shell (for example, rectangular enclosure).
Owing to after fin 20 is coupled to lead frame 10, package main body 30 is shaped, so fin 20 is coupled to package main body 30 securely by injection-molded thermosetting or thermoplastic resin.
With reference to Fig. 2 and Fig. 8, cutting is also removed from package main body 30 outwards outstanding supporting wire 15a and 15b (S09).Therefore, the supporting wire 16a and the 16b of cutting stay on the package main body 30, and supporting wire 16a prevents that with 16b fin 20 from separating with package main body 30.
Although cut supporting wire, can cut and remove from the outwards outstanding separated leads of package main body 30 (will as the lead-in wire of current path except).As shown in Figure 9, when only needing two separated leads 17c and 19c, cut and remove remaining separated leads 17a, 17b, 19a and 19b.And, as shown in figure 10, when needs four separated leads 17a, 17c, 19a and 19c, cut and remove remaining separated leads 17b and 19b.
When the number of the separated leads that provides on the lead frame 10 encapsulates the number of required separated leads greater than LED, carry out the process of cutting and removal separated leads.If the number of the separated leads that provides on the lead frame 10 is provided the number of the separated leads that LED encapsulation is required, does not carry out cutting so and remove the process of separated leads.And even stay extra separated leads, it does not influence the operation of LED encapsulation yet.Therefore, can skip the process of cutting and removal additional separation lead-in wire.
With reference to Fig. 2 and Figure 11, led circuit small pieces 40 are installed on the upper surface of fin 20 (S11).Each of led circuit small pieces 40 can be what is called 1 die-attaching that has electrode on upper surface and the lower surface, perhaps has what is called 2 die-attachings of two electrodes on the upper surface.
If any one in the led circuit small pieces 40 is 1 die-attaching, so preferably fin 20 is made by conducting metal, and 1 engages led circuit small pieces 40 and is installed on the fin 20 by for example electrically conducting adhesive of silver-colored (Ag) epoxy resin.If all led circuit small pieces 40 all are 2 die-attachings, needn't make fin 20 by conducting metal so.And led circuit small pieces 40 can be installed on the fin 20 by other electrically conducting adhesive and silver (Ag) epoxy resin.
A plurality of led circuit small pieces 40 can be installed on the fin 20.In the case, led circuit small pieces 40 can be launched the light with different wave length.For instance, three led circuit small pieces 40 can be installed, as shown in figure 11.Three led circuit small pieces 40 can be launched the light of redness (R), green (G) and blue (B) respectively.The LED encapsulation of the light of use led circuit small pieces 40 to radiate whole colors can be provided thus.
With reference to Fig. 2 and Figure 12, led circuit small pieces 41,43 and 45 are electrically connected to lead-in wire 17a, 17b, 17c, 19a, 19b and the 19c (S13) that separates by closing line.When led circuit small pieces 41,43 and 45 all were 2 die-attachings, each of led circuit small pieces was electrically connected to the lead-in wire of two separation by two closing lines.As shown in the figure, each in the led circuit small pieces 41,43 and 45 can be electrically connected to different right separated leads.And, a common separated leads (for example, 17b) be electrically connected to each of led circuit small pieces by closing line, and other different separated leads relative with common separated leads (for example, 19a, 19b, 19c) is electrically connected to the led circuit small pieces by other closing line.In the case, each led circuit small pieces can be operated by each different electric current respectively.
With reference to Figure 13,1 die-attaching 41a and 2 die-attachings 43 and 45 can be installed together.In the case, one of separated leads 17b is electrically connected to fin 20 via closing line.Therefore, separated leads 17b is electrically connected to the lower surface of 1 die-attaching 41a by closing line and fin 20.The various combinations of 1 die-attaching and 2 die-attachings are possible, and can select the method for various connection closing lines.
And, can select the method for various connection separated leads and led circuit small pieces, and a plurality of led circuit small pieces can be one another in series, parallel connection or connection in series-parallel connect.
Simultaneously, after led circuit small pieces 41,43 and 45 being electrically connected to separated leads, come sealing LED circuit small pieces 41,43 and 45 (S15) by sealant (not shown among the figure) by closing line.Sealant protection led circuit small pieces are not subjected to the influence of external force and environment (for example, moisture).In order to alleviate machinery or the thermal stress on the led circuit small pieces, sealant is chosen as has the hardness of Shore hardness 10A in the Shore hardness 70D scope.With the opening of sealant filling package main body 30, with sealing LED circuit small pieces and closing line.
And sealant can be incorporated into phosphor.For instance, phosphor can be converted to gold-tinted with blue light, or green glow and ruddiness.Therefore, when blue-light-emitting led circuit small pieces are installed, be converted into yellow from the part of the light of LED emission, or green and red, to be provided at the LED encapsulation of external emission white light.Phosphor is not limited to the light of LED emission is converted to the phosphor of above color, and can be through selecting to be provided for also radiating the LED encapsulation of the color that the user wants except that white light.And phosphor is not limited to be incorporated in the sealant, and can be deposited on the LED.
In addition, sealant can be incorporated into diffuser.The diffuser diffusion is from the light of led circuit small pieces emissions, preventing showing led circuit small pieces and closing line from the outside, and outside radiating light equably.
By after the sealant sealing LED circuit small pieces, on package main body 30, form lens (not shown among the figure) (S17).Described lens are made by transparent resin (for example, epoxy resin or silicones) by molding technique.In the case, the notch 30n that is formed at package main body 30 tops serves as exhaust outlet, as shown in Figure 7.Lens are used for coming radiating light with constant azimuth, and if do not need can omit described lens so.Sealant can form lens shape to serve as lens.In the case, skip the process that forms lens.
With reference to Fig. 2 and Figure 14, from housing 11 cutting and separating lead-in wires 17a, 17b, 17c, 19a, 19b and 19c and make its bending (S 19).Therefore, finish the connection lead-in wire of waiting to be electrically connected to external circuit, and surface-mountable LED encapsulation is provided.The step (S09) of cutting and removal supporting wire can carried out from the step (S19) of housing 11 cutting and separating lead-in wire together.
Now LED encapsulation is according to an embodiment of the invention described with reference to Figure 14 and Figure 15.
Referring again to Figure 14, the LED encapsulation comprises fin support ring 13.Fin support ring 13 can be made by the copper alloy of for example phosphor bronze.Support ring 13 forms the annular shape, and as shown in figure 14, but its shape is not limited thereto, but can form polygon annular shape.The supporting wire 16a and the 16b of cutting stretch out from support ring 13.The opposite side that the supporting wire 16a of cutting and 16b can be arranged on support ring 13.
The fin of describing with reference to Fig. 3 20 inserts in the support ring 13.Simultaneously, connect the both sides that lead-in wire 17a, 17b, 17c, 19a, 19b and 19c are arranged on support ring with at least two, and spaced apart with support ring 13 and fin 20.Can make and connect the lead-in wire bending to carry out mounted on surface.
In addition, molded package main body 30 is to support fin 20 and to be connected lead-in wire.Package main body 30 has opening at an upper portion thereof, with a upper surface that exposes fin 20 and a part that is connected lead-in wire.Simultaneously, connect lead-in wire and penetrate the sidewall of package main body 30 and outwards outstanding.
As reference Fig. 5 description person, expose support ring 13 and supporting wire 15a and 15b by opening portion.Therefore, the top of package main body 30 is formed with groove.And as reference Fig. 6 description person, package main body (among Fig. 6 for 30a) can cover most of parts (upper end of fin 20 and be connected except the several portions that goes between) of fin 20.For this reason, can provide some openings.In addition, package main body 30 has the notch 30n that partly is elongated to opening from top edge, as shown in figure 15.
Package main body 30 is after fin 20 being inserted and be fixed to support ring 13, the plastic resin that forms by injection-molded thermosetting or thermoplastic resin.
Simultaneously, led circuit small pieces 41,43 and 45 are installed on the upper surface of fin 20.Although led circuit small pieces shown in Figure 14 are so-called 2 die-attachings, be not limited to this situation, but described led circuit small pieces can be any one or 1 die-attaching in so-called 1 die-attaching and the combination of 2 die-attachings.
By closing line the led circuit small pieces are electrically connected to the connection lead-in wire.If the led circuit small pieces are 2 die-attachings, each of led circuit small pieces is electrically connected to two connection lead-in wires via two closing lines so.If at least one in the led circuit small pieces is 1 die-attaching, via closing line fin is electrically connected at least one so and connects lead-in wire.
Connecting the led circuit small pieces all is possible with the whole bag of tricks that is connected lead-in wire, and can select the whole bag of tricks according to the desirable characteristics of LED encapsulation.
Simultaneously, with sealant (not shown among the figure) sealing LED circuit small pieces.Fill the groove on the top that is formed at package main body 30 with sealant.And sealant can be incorporated into phosphor and/or diffuser.Sealant can form lens shape.Perhaps, can on package main body 30, form lens (not shown among the figure) to cover sealant.
According to this embodiment, fin 20 is inserted in the fin support ring 13, make to prevent that fin 20 from separating with package main body 30.
In above-mentioned LED encapsulation, it is spaced apart to connect lead-in wire 17a, 17b, 17c, 19a, 19b and 19c and support ring 13.The invention is not restricted to this, and connect one of lead-in wire and can be connected to support ring 13.Now describe LED encapsulation according to another embodiment of the present invention, wherein connect one of lead-in wire and can be connected to support ring 13.
Figure 16 and Figure 17 are respectively perspective view and the plan view from above of describing LED encapsulation 50 according to another embodiment of the present invention.Figure 18 is a cross-sectional view of describing the LED encapsulation 50 among Figure 16, in the described LED encapsulation 50 led circuit small pieces and lens 75 is installed.Figure 19 and Figure 20 describe to can be used for making the plan view from above of the lead frame of LED encapsulation 50 according to another embodiment of the present invention.
To Figure 18, LED encapsulation 50 comprises fin support ring 53, inserts fin, connection lead-in wire 55 and 57 in the support ring 53, and package main body 70 with reference to Figure 16.
Connecting lead-in wire 55 stretches out from support ring 53.And it is spaced apart with support ring 53 to connect lead-in wire 57, and is arranged near the support ring 53.If support ring 53 is C type rings, connect lead-in wire 57 extending cutting parts so to support ring 53.Therefore, the end of connection lead-in wire 57 can be arranged on the position at close relatively support ring 53 centers.Therefore, compare, can use lead frame to reduce the size of package main body 70 with C type support ring 53 with lead frame shown in Figure 20.Preferably, the part of removing from support ring 53 is less than 1/4 of whole support ring size.That is to say that along with the part of removing diminishes, the interface between support ring 53 and the fin 60 increases, to strengthen electrical connection.
As Figure 19 or shown in Figure 20, connect lead-in wire 55 and originate from supporting wire 55a, described supporting wire 55a connects support ring 53 and the housing (in Fig. 1 be 11) of envelope round the fin support ring.Connecting lead-in wire 57 originates from from housing towards support ring 53 and the separated leads 57a that extends.Therefore, can make support ring 53 and lead-in wire 55a and 57a together by suppressing a phosphor bronze sheet.Except supporting wire 55a, support ring 53 also can be connected to housing by other supporting wire.Can be provided with and support ring 53 isolated separated leads 57a and extra separated leads.Simultaneously, separated leads 57a can have near the vertical end (separated leads as shown in Figure 1) that has wide region support ring 53, separates with package main body 70 to prevent separated leads.As shown in the figure, separated leads can be formed with through hole 57c.Through hole 57c admits the part of package main body 70 to prevent that separated leads 57a is from the package main body pine oil.
Package main body 70 is attached to fin 60 and is connected lead-in wire 55 and 57 to support.After inserting fin 60 in the support rings 53, by inserted mode system thermosetting or thermoplastic resin to form package main body 70.Therefore, package main body 70 is filled the latch groove of fin 60, and be attached to fin 60 and be connected go between 55 with 57 so that its engage.
And package main body 70 has the opening that a upper end that makes fin 60 and a part that is connected lead-in wire 57 expose.And described opening can expose the part of this connection lead-in wire 55.In the case, the protuberance of fin 60 can be outstanding from the upper surface of package main body 70, as shown in figure 18.Package main body 70 surface thereon upward possesses lens fixing groove 70h along the neighboring.Lens fixing groove 70h fixing lens 75 and is separated with package main body 70 to prevent lens 75.In addition, package main body 70 possesses notch 70n on the surface thereon.Notch 70n can be positioned opposite side, as shown in figure 15.
Referring again to Figure 18, led circuit small pieces 71 are installed on the fin 60.Led circuit small pieces 71 can be by for example (Ga) compound semiconductor of N is made for Al, In, and can be through selecting to have with emission the light of required wavelength.For instance, led circuit small pieces 71 are compound semiconductors of emission blue light.
Led circuit small pieces 71 can be so-called 1 die-attaching that has electrode on upper surface and lower surface respectively.Lower electrode bonds to fin 60 by for example electrically conducting adhesive of silver (Ag) epoxy resin.Connect lead-in wire 55 because fin 60 is directly electrically connected to, so led circuit small pieces 71 are electrically connected to connection lead-in wire 55 via fin.Therefore, can omit the closing line that is used to connect led circuit small pieces 71 and is connected lead-in wire 55.Simultaneously, the upper electrode of led circuit small pieces 71 is electrically connected to via closing line 73 and connects lead-in wire 57.
On the contrary, led circuit small pieces 71 can be so-called 2 die-attachings that have two electrodes on same surface.In the case, two electrodes are electrically connected to via closing line respectively and connect lead-in wire 55 and 57.Yet, be directly electrically connected to fin 60 owing to connect lead-in wire 55, so led circuit small pieces 71 can be connected to fin 60 by using closing line.Therefore, use closing line to connect the distribution technology of led circuit small pieces 71 and fin 60 than the easier execution of prior art.
Simultaneously, with sealant sealing LED circuit small pieces.Sealant can be epoxy resin or silicones.And sealant can be incorporated into the phosphor that can change from led circuit small pieces 71 wavelength of light emitted.For instance, under the situation of led circuit small pieces 71 emission blue lights, sealant is incorporated into the phosphor that blue light can be converted to gold-tinted or green glow and ruddiness.Therefore, white light is outwards launched in the LED encapsulation.
Sealant is covered by lens 75.Lens 75 can have convex lens, as shown in figure 18, make with constant azimuth from led circuit small pieces 71 emission light.Lens 75 can pass through molded transparent resin (for example, silicones or epoxy resin) and form.Lens 75 are filled this lens fixing groove 70h.Therefore, the bonding force that has increased between lens 75 and the package main body 70 encapsulates pine oil to prevent lens from LED.
Simultaneously, sealant can form lens shape, and therefore sealant can form as one with lens 75.In the case, sealant is filled the opening and the lens fixing groove 70h of this package main body 70.
It will be apparent to those skilled in the art that the present invention although this paper has described and illustrated with reference to the preferred embodiments of the present invention, can in described preferred embodiment, make various modifications and variations under the situation that does not break away from the spirit and scope of the present invention.Therefore, wish that the present invention contains the modifications and variations in the scope of appended claims and equivalent thereof of the present invention.
Industrial usability
By above description, according to embodiments of the invention, provide the LED encapsulation of adopting fin to have good heat radiation and therefore obtaining high lighting power, with and manufacture method. And, owing to prevent that with the fin support ring fin from separating with the encapsulation main body, therefore can provide constitutionally stable LED encapsulation. In addition, provide the lead frame that is suitable for making easily the LED encapsulation with structural stability and good heat radiation.
Claims (19)
1. LED package comprises:
The fin support ring has an opening;
Fin, it inserts in the opening of described fin support ring, and described fin has a upper surface, and when described fin inserted in the described fin support ring, the upper surface of described fin can extend on the upper surface of described fin support ring;
The Light-Emitting Diode circuit small pieces is installed on the upper surface of described fin;
Package main body supports described fin and described fin support ring, and described package main body has an opening, to expose the upper surface of described fin;
First group of lead-in wire, outstanding outside one first side direction of package main body, and each lead-in wire in described first group of lead-in wire all has an end, and be comparable to described fin support ring, and the end of each lead-in wire is spaced apart from each other in first group of lead-in wire, and spaced apart with described fin support ring; And
Second group of lead-in wire, outstanding outside one second side direction of package main body, and each lead-in wire in described second group of lead-in wire all has an end, and be comparable to described fin support ring, and the end of each lead-in wire is spaced apart from each other in second group of lead-in wire, and spaced apart with described fin support ring
Wherein the upper surface of fin extends at least partially on the upper surface of package main body, makes that the Light-Emitting Diode circuit small pieces on the upper surface that is installed in fin is installed to be at least partially on the upper surface of package main body.
2. LED package according to claim 1 is characterized in that, more comprises:
First supporting wire is connected to described fin support ring, and extends into a side of package main body; And
Second supporting wire is connected to described fin support ring, and extends into the opposite side of package main body.
3. LED package according to claim 1 is characterized in that, described LED package comprises a plurality of circuit of LED small pieces that are arranged on the fin, and described first group of lead-in wire is electrically connected to the circuit of LED small pieces respectively.
4. LED package according to claim 1 is characterized in that, described fin support ring is the C type ring with cutting part.
5. LED package according to claim 1 is characterized in that, the protuberance that described fin has substrate and projects upwards from the middle body of described substrate, and described protuberance is inserted in the described fin support ring.
6. LED package according to claim 5 is characterized in that, described protuberance is constructed to be received in the circuit of LED small pieces on the protuberance.
7. LED package according to claim 5 is characterized in that, described fin further is included in the support ring fixing groove in order to the described support ring of fixing of a side of described protuberance.
8. LED package according to claim 7 is characterized in that, described support ring fixing groove is a helical groove.
9. LED package according to claim 1 is characterized in that, described package main body is the plastic resin that forms by the injection-molded thermosetting resin after described fin being inserted in the described fin support ring.
10. LED package according to claim 9 is characterized in that described package main body comprises the notch that partly is elongated to described opening from the relative top edge of described package main body.
11. LED package according to claim 9 is characterized in that, described package main body has lens fixing groove along the neighboring of its upper surface.
12. LED package according to claim 1 is characterized in that, further comprises:
Sealant, it covers the top of described circuit of LED small pieces,
Wherein after inserting in the fin support ring, form package main body, make described package main body be engaged to described fin support ring and fin, so that described fin of package main body fixing and fin support ring at fin.
13. LED package according to claim 12 is characterized in that, described sealant has the hardness in Shore hardness 10A arrives the scope of Shore hardness 70D.
14. LED package according to claim 12 is characterized in that, further comprises:
Phosphor, it is arranged on the described circuit of LED small pieces, described phosphor converted from described circuit of LED small pieces wavelength of light emitted to another wavelength.
15. a method of making LED package comprises:
Prepare lead frame, described lead frame comprises:
The fin support ring has an opening;
Housing, with described fin support ring spaced apart and the envelope round described fin support ring;
At least one supporting wire is used to connect described fin support ring and described housing;
First component is from lead-in wire, extend from the described fin support ring of first side direction of described housing, and described first component each separated leads in lead-in wire all has an end, be comparable to described fin support ring, and each separated leads of described first component in lead-in wire is terminal separated from each other, and separates with described fin support ring; And
Second component is from lead-in wire, extend from the described fin support ring of second side direction of described housing, and described second component each separated leads in lead-in wire all has an end, be comparable to described fin support ring, and each separated leads of described second component in lead-in wire is terminal separated from each other, and separates with described fin support ring;
One fin is inserted in the opening of described fin support ring;
After described fin is inserted into described fin support ring, form to expose the first surface of described fin and a package main body of second surface, make described fin and described fin support ring by described package main body institute fixing; And
At least one circuit of LED small pieces is installed on the described first surface of described fin.
16. method according to claim 15 is characterized in that, further comprises:
Cut described supporting wire and described separated leads from described housing, to form a plurality of connection lead-in wires, first surface is a upper surface, and second surface is a lower surface.
17. method according to claim 15 is characterized in that, further comprises:
Form the sealant that covers described circuit of LED small pieces.
18. a LED package comprises:
The fin support ring has an opening;
Fin is inserted in the opening of described fin support ring, and described fin has an essence plane and is used as upper surface, and when described fin inserted the fin support ring, the upper surface of fin can extend on the fin support ring;
The circuit of LED small pieces are installed on the upper surface of described fin;
Package main body support described fin and described fin support ring, and described package main body has an opening on the upper surface of described fin;
First lead-in wire is stretched from first epitaxial lateral overgrowth of package main body, and is had an end, is comparable to described fin support ring, and the end and the described fin support ring of described first lead-in wire are separated; And
Second lead-in wire is stretched from second epitaxial lateral overgrowth of package main body, and is had an end, is comparable to described fin support ring.
19. LED package according to claim 18 is characterized in that, the top of described fin is set, and makes the position of circuit of LED small pieces on the top that is higher than described package main body.
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040106936 | 2004-12-16 | ||
| KR1020040106936A KR100579397B1 (en) | 2004-12-16 | 2004-12-16 | Light Emitting Diode Package with Heatsink Directly Connected to Leadframe |
| KR10-2004-0106936 | 2004-12-16 | ||
| KR10-2004-0113722 | 2004-12-28 | ||
| KR1020040113722 | 2004-12-28 | ||
| KR1020040113722A KR100579388B1 (en) | 2004-12-28 | 2004-12-28 | Light Emitting Diode Package Adopting Heat Sink with Spiral Groove |
| KR10-2005-0000269 | 2005-01-03 | ||
| KR20050000269A KR100635779B1 (en) | 2005-01-03 | 2005-01-03 | Lead frame having heat sink support ring, light emitting diode package manufacturing method using same and light emitting diode package manufactured by same |
| KR1020050000269 | 2005-01-03 | ||
| PCT/KR2005/001043 WO2006065007A1 (en) | 2004-12-16 | 2005-04-12 | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101080822A CN101080822A (en) | 2007-11-28 |
| CN101080822B true CN101080822B (en) | 2011-05-11 |
Family
ID=37181476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005800428742A Expired - Fee Related CN101080822B (en) | 2004-12-16 | 2005-04-12 | Light emitting diode package and fabricating method thereof |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100579397B1 (en) |
| CN (1) | CN101080822B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100878398B1 (en) | 2006-11-21 | 2009-01-13 | 삼성전기주식회사 | High output LED package and manufacturing method |
| WO2010104276A2 (en) * | 2009-03-10 | 2010-09-16 | Nepes Led Corporation | Led leadframe package, led package using the same, and method of manufacturing the led package |
| TWI422074B (en) * | 2010-01-07 | 2014-01-01 | 首爾半導體股份有限公司 | Aspherical LED lens and light-emitting element containing the same |
| US9054077B2 (en) * | 2010-03-10 | 2015-06-09 | Altera Corporation | Package having spaced apart heat sink |
| KR20120022410A (en) * | 2010-09-02 | 2012-03-12 | 삼성엘이디 주식회사 | Light emitting diode package and manufaturing method thereof |
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power LED bracket and LED packaging method using the bracket |
| KR101825473B1 (en) * | 2011-02-16 | 2018-02-05 | 삼성전자 주식회사 | Light emitting device package and method of fabricating the same |
| DE102011083691B4 (en) * | 2011-09-29 | 2020-03-12 | Osram Gmbh | OPTOELECTRONIC SEMICONDUCTOR COMPONENT |
| CN103171080A (en) * | 2011-12-21 | 2013-06-26 | 顺德工业股份有限公司 | Manufacturing method of light-emitting device packaging bracket |
| CN103840068B (en) * | 2013-12-31 | 2017-09-19 | 杨毅 | Wavelength conversion device and light emitting device |
| US11335619B2 (en) | 2017-12-27 | 2022-05-17 | Mitsubishi Electric Corporation | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176203A (en) | 2000-09-29 | 2002-06-21 | Omron Corp | Light emitting device and light emitting device array |
| JP3938100B2 (en) | 2003-05-15 | 2007-06-27 | 邦裕 服部 | LED lamp and LED lighting fixture |
-
2004
- 2004-12-16 KR KR1020040106936A patent/KR100579397B1/en not_active Expired - Fee Related
-
2005
- 2005-04-12 CN CN2005800428742A patent/CN101080822B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
Non-Patent Citations (4)
| Title |
|---|
| JP实开平5-46062U 1993.06.18 |
| JP特开2002-359403A 2002.12.13 |
| JP特开平11-110790A 1999.04.23 |
| JP特开平5-53252A 1993.03.05 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101080822A (en) | 2007-11-28 |
| KR100579397B1 (en) | 2006-05-12 |
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