CN101072485A

CN101072485A - Radiating device

Info

Publication number: CN101072485A
Application number: CN 200610060627
Authority: CN
Inventors: 曹君; 武湛; 周世文
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2006-05-12
Filing date: 2006-05-12
Publication date: 2007-11-14
Anticipated expiration: 2026-05-12
Also published as: CN100584170C

Abstract

The heat sink includes a first base plate contacted to electronic component, a radiator, and a first heat pipe and a second heat pipe connected to the first base plate and the radiator. The radiator includes some heat elimination fins arranged in parallel with gap between fins. Both first heat pipe and a second heat pipe include a heat absorption section connected to the base plate, and a heat output section connected to the radiator. Along long direction of heat elimination fins, the heat output section of first heat pipe is arranged on top of heat elimination fins. The heat output section of second heat pipe is passed through heat elimination fins. Heat pipes in the heat sink are crossed set up in 3D space. Quantity of heat of first base seat contacted to heat source is distributed to heat elimination fins evenly in 3D space so that forced airflow generated by fan module on side of the heat sink carries away quantity of heat rapidly so as to raise heat elimination efficiency.

Description

Heat abstractor

Technical field

The invention relates to a kind of heat abstractor, particularly a kind of effectively heat-pipe radiating apparatus of cooling electronic components.

Background technology

Along with the constantly development of electronic information industry, electronic component (especially central processing unit) speed of service constantly promotes.But the heat that high-frequency high-speed produces electronic component increases thereupon, makes its temperature constantly raise, and the performance when the electronic component operation in serious threat can normally be moved for guaranteeing electronic component, must in time discharge a large amount of heats that electronic component produced.

For this reason, industry uses a kind of heat abstractor to dispel the heat usually, and these existing heat abstractors include a base and the some radiating fins that are located on the base, and this heat dissipation base bottom surface is level and smooth entity metal, is for being sticked on the central processing unit surface.And along with the central processing unit volume is more and more littler, its heating is also more concentrated, because of being confined to the heat transfer property of metal, the heat of heat dissipation base center is often too concentrated, and can't effectively be delivered to heat abstractor around, thereby have a strong impact on the integral heat sink effect, make the decreased performance of central processing unit, the work of can't remaining valid.

For overcoming the problems referred to above, industry adopts the heat abstractor of heat pipe conduction heat increasing, heat pipe is that capillary structure thing (as powder sintered thing, groove structure, screen net structure etc.) is set in the metal body, and the sealing hydraulic fluid (as water, alcohol etc.) of packing into, be evacuated to vacuum state then, rely on carry out liquid gas two phase change after hydraulic fluid is heated and absorb, release heat because Heat Transfer of Heat Pipe on Heat Pipe non-directional and heat transfer distances are long, and the lifting of heat abstractor performance is had bigger lifting.The TaiWan, China patent announcement discloses a kind of heat-pipe type radiator No. 1681113, and it comprises U-shaped heat pipe, radiating fin and base plate.The mid portion of this U-shaped heat pipe is welded on the base plate, and its two straight ended is arranged between the radiating fin.The heat transferred that electronic component produces is to pedestal, then by heat pipe with heat transferred to the radiating fin on top, by radiating fin heat is dispersed in the surrounding air at last, reach the purpose of cooling electronic components.But,, still can not maximum heat be distributed on the radiating fin quickly and evenly, so performance is still to be hoisted because of the heat transfer direction of this heat-pipe type radiator is single.

Summary of the invention

In view of this, be necessary in fact the heat abstractor that provides a kind of radiating efficiency high with heat pipe.

A kind of heat abstractor, comprise one with first substrate, a radiator of electronic component contact and at least one first heat pipe and at least one second heat pipe that described first substrate is connected with radiator, described radiator comprises the radiating fin that some parallel interval are arranged, described first heat pipe includes an endotherm section that is connected with described substrate and a heat release section that is connected with described radiator with second heat pipe, the heat release section of described first heat pipe is arranged in the top of radiating fin along the radiating fin length direction, and the heat release section of described second heat pipe is arranged in the radiating fin.

Prior art is compared, the heat pipe of above-mentioned heat abstractor is arranged in a crossed manner in three dimensions, because of the heat of first pedestal that will contact with thermal source is evenly distributed on the radiating fin at three-dimensional, rapidly heat is taken away so that heat abstractor one crosswind is fanned the forced draft of module generation, thereby improved radiating efficiency.

With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.

Description of drawings

Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.

Fig. 2 is the assembly drawing of heat abstractor among Fig. 1.

Fig. 3 is the inversion exploded view of heat abstractor of the present invention.

Fig. 4 is the assembly drawing of heat abstractor among Fig. 3.

Embodiment

See also Fig. 1 to Fig. 4, the heat abstractor of one embodiment of the present invention is to be used for being installed on the central processing unit heat-generating electronic elements such as (figure do not show) it is dispelled the heat.This heat abstractor comprises that first substrate 10, that contacts with electronic component is positioned at the fan module 70 that second heat pipe 60 and that first heat pipe 50 and that top board 40, that second substrate 20 on first substrate 10, some radiating fins 30, that is parallel on second substrate 20 be attached at radiating fin 30 tops is used to conduct heat to radiating fin 30 is used to conduct the heat to top board 40 is installed in this heat abstractor one side.

First substrate 10 is made by heat conductivility good metal materials such as copper, aluminium.This first substrate 10 roughly is square, its upper surface symmetry offers two slightly L-

shaped semicircle grooves

12 and 14, these

grooves

12 and 14 straight part be all perpendicular to the lateral margin of first substrate 10, and their bent part is positioned at the centre of substrate 10 and with respect to the diagonal symmetric arrangement of substrate 10.

Second substrate 10 is made by heat conductivility good metal materials such as copper, aluminium.The shape size of this second substrate 20 is consistent with first substrate 10, and its lower surface offers

groove

12 and 14

corresponding groove

22 and 24 with first substrate 10.This second substrate 20 can be combined together with first substrate 10 by welding or mode such as stickup, makes the corresponding respectively formation two circular containing holes of

groove

12,22 and

groove

14,24 simultaneously.In addition, this second substrate 20 two to oppose side edge one end respectively correspondence offer screw 26, this screw 26 is used for screwing togather and fan attachment module 70 with screw (figure do not show).

Some radiating fins 30 are vertically installed on second substrate 20, and equidistant parallel ground is arranged mutually, and all is parallel to

substrate

10,20 1 lateral margins, and 30 of adjacent radiating fins form air duct.Each radiating fin 30 vertical in the same way respectively bending in two ends relatively up and down is extended with a flanging 31, and the two ends flanging 31 of these radiating fins 30 forms two planes up and down continuously, and its lower plane combines by welding manner with second pedestal, 20 upper surfaces.Each radiating fin 30 center also is provided with a perforation 32 simultaneously, and the vertical bending of each 32 inner peripheral of boring a hole is extended with flanging 320, thereby the flanging of these perforation 32 320 forms the interior composition surface of a pipeline continuously.

Top board 40 shapes size is consistent with first and

second substrate

10,20, all be roughly square, make by heat conductivility good metal materials such as copper, aluminium, offer a straight semi-circular recesses 42 on the end face of this top board 40, this groove 42 is parallel with radiating fin 30 length directions, is positioned at the centre position of top board 40.A screw 44 that is used for fixing fan module 70 is respectively offered at the two ends of the relative both side edges of this top board 40 corresponding first and

second substrates

10,20.

First and

second heat pipe

50,60 extends perpendicular to the plane bending at U-shaped heat pipe place by an end of a flat segments of U-shaped heat pipe and forms.This first heat pipe 50 comprises one first endotherm section 54, one first heat transfer segment 56 and one first heat release section 58, wherein these first heat transfer segment, 56 1 ends connect first endotherm section 54, the other end connects the one the first heat release section 58, these first endotherm section, 54 L-shaped bendings, wherein the free end portion of first endotherm section, 54 L-shaped bendings is vertical mutually in twos with first heat transfer segment 56 and first heat release section 58.This second heat pipe 60 comprises one second endotherm section 64, one second heat transfer segment 66 and second heat release section 68, its shape structure is roughly the same with first heat pipe 50, and its main difference is the length of the length of this second heat transfer segment 66 less than first heat transfer segment 56 corresponding with it.This first heat pipe 50 is striden and is located at this heat abstractor both sides up and down, first endotherm section 54 of its L-shaped bending is placed in the groove 12 and the 24 L shaped containing holes that form of first and

second substrate

10,20, the gas channel that its first heat transfer segment 56 forms over against radiating fin 30, its first heat release section 58 is embedded in the semi-circular recesses 42 of top board 40.Second endotherm section 64 of these second heat pipe, 60 L-shaped bendings is placed in the groove 14 and the 24 L shaped containing holes that form of first and

second substrate

10,20, its second heat transfer segment 66 is positioned at a side parallel with radiating fin 30, adjacent with endotherm section 56 sides of living in of first heat pipe 50, in the pipeline that the perforation 32 that its second heat release section 68 is arranged in radiating fin 30 centers and flanging 320 form.

The air duct that the side that fan module 70 is installed on heat abstractor forms over against radiating fin 30 is taken away heat on the radiating fin 30 rapidly to produce forced draft.A lateral margin 71 is extended in each the vertical bending of the relative both sides of this heat radiation module 70, the two ends of this lateral margin 71 are provided with the perforation 712 corresponding with the screw 44 of the screw 26 of second substrate 20 and top board 40, thereby can be fixed on heat abstractor one side with the screw fit module 70 that will dispel the heat.

First and

second heat pipe

50,60 of above-mentioned heat abstractor be not be parallel to each other and ground in same plane along stretching layout, but it is arranged in a crossed manner in three dimensions, therefore the heat of first pedestal 10 that will contact with thermal source with more a spot of heat pipe relatively is evenly distributed on the radiating fin 30 at three-dimensional, rapidly heat is taken away so that heat abstractor one crosswind is fanned the forced draft of module 70 generations, thereby improved radiating efficiency.

Be understandable that, second substrate 20 of above-mentioned heat abstractor can omit, but directly radiating fin 31 bottoms offer with first substrate 10 on

groove

12 and 14 corresponding groove, thereby be combined to form the heat release section 54 of ccontaining first heat pipe 50 and heat release section 64 storage tanks of second heat pipe 60 with

groove

12 and 14.

Claims

1. heat abstractor, comprise one with first substrate, a radiator of electronic component contact and one first heat pipe and one second heat pipe that is connected described first substrate and radiator, described radiator comprises the radiating fin that some parallel interval are arranged, described first heat pipe includes an endotherm section that is connected with described substrate and a heat release section that is connected with described radiator with second heat pipe, it is characterized in that: the heat release section of described first heat pipe is arranged in the top of radiating fin along the radiating fin length direction, and the heat release section of described second heat pipe is arranged in the radiating fin.

2. heat abstractor as claimed in claim 1 is characterized in that: described radiator comprises a top board that combines with the described first heat pipe heat release section.

3. heat abstractor as claimed in claim 2 is characterized in that: a groove that is used for the ccontaining described first heat pipe heat release section is offered in described cover top surface centre position.

4. heat abstractor as claimed in claim 3 is characterized in that: described radiating fin middle part forms a perforation, and the perforation of all radiating fins forms the pipeline of the ccontaining second heat pipe heat release section, and this pipeline is vertical with described top board groove.

5. heat abstractor as claimed in claim 1 is characterized in that: described first heat pipe comprises respectively with second heat pipe and is connected endotherm section and heat release section and first heat transfer segment that is uneven in length and second heat transfer segment.

6. heat abstractor as claimed in claim 5 is characterized in that: all L-shaped bending of the endotherm section of described heat pipe, and each self-corresponding heat transfer segment of the free end portion and its of their endotherm sections and heat release section are vertical mutually in twos.

7. as claim 5 or 6 described heat abstractors, it is characterized in that: the L shaped groove that offers ccontaining first heat pipe heat-absorbing section and second heat pipe heat-absorbing section on described first substrate.

8. heat abstractor as claimed in claim 7 is characterized in that: comprise second substrate that combines with first substrate, described radiating fin is arranged on second substrate.

9. heat abstractor as claimed in claim 8 is characterized in that: described first base plate bottom offers groove, and the groove fit of these grooves and second substrate forms the containing hole of ccontaining first heat pipe heat-absorbing section and second heat pipe heat-absorbing section.

10. heat abstractor as claimed in claim 1 is characterized in that: comprise the fan module that is installed on the radiator sidepiece, this fan module is over against the air duct that forms between radiating fin.