CN101071276A - Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method - Google Patents
Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method Download PDFInfo
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- 238000006073 displacement reaction Methods 0.000 title claims abstract description 445
- 238000005259 measurement Methods 0.000 title claims abstract description 171
- 238000004519 manufacturing process Methods 0.000 title description 4
- 238000000691 measurement method Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 514
- 238000000034 method Methods 0.000 claims description 63
- 230000008569 process Effects 0.000 claims description 48
- 230000033001 locomotion Effects 0.000 claims description 34
- 238000012940 design transfer Methods 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 19
- 238000002955 isolation Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 62
- 230000000875 corresponding effect Effects 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 238000007689 inspection Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 238000007654 immersion Methods 0.000 description 6
- 230000007261 regionalization Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000008521 reorganization Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000002314 autoradiolysis reaction Methods 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003722 extracellular fluid Anatomy 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/53—Automatic registration or positioning of originals with respect to each other or the photosensitive layer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Condensed Matter Physics & Semiconductors (AREA)
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- Length Measuring Devices By Optical Means (AREA)
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Abstract
A displacement measurement system, in particular for measuring the displacement of a substrate table in a lithographic apparatus relative to a reference frame is presented. The displacement measure system includes a plurality of displacement sensors mounted to the substrate table and a target associated with each displacement sensor mounted to the reference frame.
Description
Technical field
The present invention relates to displacement measurement system, utilize lithographic equipment, the displacement measurement method of this system and be used for the method for manufacturing installation.
Background technology
Lithographic equipment is that a kind of pattern that will want is applied to substrate, is generally the machine on the target part of substrate.Lithographic equipment can be used for for example manufacturing of integrated circuit (IC).Under the sort of situation, can utilize the pattern that is called as mask or graticule in addition to form device and generate the circuit pattern that will on the single layer of IC, form.This pattern can be transferred to target part on the substrate (as the silicon chip) part of one or several tube cores (as comprise).The transfer of pattern is usually by means of the imaging on the radiation sensitive material layer that is provided with on the substrate (photoresist).Usually, single substrate will comprise by the network of the adjacent target of continuous patternization part.Known lithographic equipment comprises so-called steeper and scanner, in steeper, makes each target part illuminated by whole pattern exposure is partly gone up to target; In scanner, make each target part illuminated along assigned direction (" direction of scanning ") scan pattern and while along parallel or antiparallel scanning direction substrate with this direction by beam of radiation.Also pattern can be formed device from pattern by imprinted pattern on substrate and be transferred to substrate.
In lithographic equipment, typically can be at substrate table upper support substrate.Before the substrate, can in metering region, check and/or measure substrate in design transfer.Subsequently, by substrate table substrate-transfer is arrived wherein with the zone of design transfer to substrate.Be accurately positioned with respect to substrate and/or other patterns of on substrate, having formed in order to ensure the pattern of transferring to substrate, be desirably in measure and/or checking process during and during image transfer pin-point accuracy ground understand the position of substrate and mobile.This can be by measuring substrate with respect to the position of the substrate table that supports and monitor the position of substrate table subsequently and/or move and obtain.
For the position of measuring substrate table and/or move, known system typically utilized the target on one of them of the substrate table that is installed to lithographic equipment and reference frame and be installed to substrate table and the another one of reference frame on sensor, but described sensor measurement target is with respect to the position of sensor or move.Yet the moving range of desired substrate table is relatively large because substrate table should can measure and/or check therein substrate any part the zone and wherein design transfer can be moved between the zone of any part of substrate.In addition, in some lithographic equipment, be provided with two substrate tables so that with design transfer in a substrate of the first substrate table upper support, can check and/or measure another substrate of the second substrate table upper support.In this equipment, the moving range of desired substrate table even bigger, because be provided with additional space, the substrate table of the substrate that feasible support just is being examined and/or is measuring can be transferred to wherein can be with the zone of design transfer to substrate, and support the substrate table that has made design transfer substrate so far should continue to move to wherein with substrate from the position of substrate table removal, the new substrate position of packing the position of substrate table into and wherein checking and/or measuring new substrate wherein.In other words, two substrate tables should exchange.
The moving range of substrate table is big more, system is set so that with the position of desired higher accuracy horizontal survey substrate table and/or move and can become difficult more and/or expensive more.Specifically, the target that will be used for position transducer therein is installed to the system of substrate table, and moving range is big more, and system is just complicated more and keep desired precision and will become difficult more.For target wherein be fix and be installed to for example system of reference frame, the moving range of substrate table is big more, target just should be big more.If general objective may be expensive, because in their gamut, make normally difficulty of general objective with expected accuracy.Therefore, the moving range that increases substrate table has significantly increased the cost of the position that is used for measuring substrate table and/or mobile system.
Summary of the invention
Expectation provides a kind of can be used to accurately measuring the position of substrate table and/or mobile system under the condition of cost that do not exceed the quata in big moving range.
According to embodiments of the invention, a kind of displacement measurement system that is configured to measurement component with respect to the displacement of reference component is provided, it comprises: the first, second, third and the 4th target, each target are installed to reference component and are arranged and make the target surface of each target be arranged essentially parallel to reference field; And the first, second, third and the 4th displacement transducer, each displacement transducer is arranged to the displacement of the appropriate section of measurement component with respect to the target surface of respective objects; Wherein first and the triple motion sensor be configured to measure respectively and be arranged essentially parallel to the displacement of first and the third parts first direction, parts that are positioned at reference field with respect to the target surface of the first and the 3rd target; And the second and the 4th displacement transducer be configured to measure respectively and be arranged essentially parallel to the second direction that is positioned at reference field and be substantially perpendicular to the displacement of the second and the 4th parts first direction, parts with respect to the target surface of the second and the 4th target.
According to embodiments of the invention, a kind of lithographic equipment is provided, it comprises the substrate table that is constructed to support substrates and is configured to is measuring the displacement measurement system of substrate table with respect to the displacement of reference component with design transfer during the process of substrate; Wherein displacement measurement system comprises at least one target that is installed to reference component and is configured to measure at least a portion of substrate table at least one displacement transducer with respect to the displacement of at least one target; And this lithographic equipment also comprises second displacement measurement system, it is configured at least to return in the part of substrate table measures the displacement of substrate table with respect to the base of lithographic equipment during moving, and wherein substrate table can be with the unloading position of substrate from the substrate table removal from design transfer being moved to the position of substrate.
According to embodiments of the invention, a kind of method that is used for measurement component with respect to the displacement of reference component is provided, and this method comprises utilizes the first, second, third and the 4th displacement transducer to distinguish the displacement of the appropriate section of measurement component with respect to the target surface of the first, second, third and the 4th target; Wherein the first, second, third and the 4th target is installed to reference component and is arranged and makes each target surface be arranged essentially parallel to reference field; First and the triple motion sensor measure respectively and be arranged essentially parallel to the displacement of first and the third parts first direction, parts that are positioned at reference field with respect to the target surface of the first and the 3rd target; And the second and the 4th displacement transducer measure respectively and be arranged essentially parallel to the second direction that is positioned at reference field and be substantially perpendicular to the displacement of the second and the 4th parts first direction, parts with respect to the target surface of the second and the 4th target.
According to embodiments of the invention, a kind of device producing method is provided, this method comprises that pattern is formed device from pattern to be transferred on the substrate, wherein in that design transfer substrate during the process of substrate is supported on substrate table; And during this process, utilize displacement measurement system to measure the displacement of substrate table with respect to reference component, this displacement measurement system comprises at least one target that is installed to reference component and is configured to measure at least a portion of substrate table at least one displacement transducer with respect to the displacement of at least one target; And return in the part of substrate at least and measure the displacement of substrate table with respect to the base of lithographic equipment during moving, wherein substrate table is from wherein moving to the position of design transfer to substrate with the unloading position of substrate from the platform removal.
Description of drawings
Now will be described embodiments of the invention by way of example and with reference to accompanying schematic figure, corresponding in the accompanying drawings Reference numeral is represented corresponding part, and wherein:
Fig. 1 has described the lithographic equipment according to the embodiment of the invention;
Fig. 2 has described the configuration according to the displacement measurement system of the embodiment of the invention;
Fig. 3 a to 3f has described the layout according to the lithographic equipment of the embodiment of the invention;
Fig. 4 a and 4b have described the modification of the layout of describing among Fig. 3 a to 3f in more detail;
Fig. 5 a, 5b and 5c have described the modification according to the layout of the lithographic equipment of embodiment;
Fig. 6 a to 6f has described the layout according to the lithographic equipment of the embodiment of the invention;
Fig. 7 a to 7h has described the layout according to the lithographic equipment of the embodiment of the invention;
Fig. 8 a to 8h described according to embodiment the modification of lithographic equipment;
Fig. 9 a to 9h has described the modification according to the lithographic equipment of the embodiment of the invention.
Embodiment
Fig. 1 has schematically described the lithographic equipment according to one embodiment of the invention.This equipment comprises illuminator (luminaire) IL, and it is configured to regulate beam of radiation B (for example UV radiation or DUV radiation); Supporting structure (for example mask platform) MT, it is constructed to support pattern to form device (for example mask) MA, and be configured to pattern to be formed the pinpoint first locating device PM of device and link to each other according to some parameter; Substrate table (for example wafer station) WT, it is constructed to support substrate (as the wafer of photoresist coating) W, and be configured to the pinpoint second locating device PW of substrate to be linked to each other according to some parameter; And optical projection system (as the refraction type projection lens system) PS, it is configured to project on the target portion C (for example comprising one or more tube cores) of substrate W formed the pattern that device MA gives beam of radiation B by pattern.
Illuminator can comprise the various types of optical elements that radiation carried out orientation, shaping and/or control, such as the optical element of refraction optical element, reflective optical devices, magnetooptics element, electromagnetism optical element, electrostatic optics element or other type or any combination wherein.
Supporting structure is supporting pattern and is forming device (promptly carrying its weight).Supporting structure is supporting pattern formation device with the orientation that depends on pattern formation device, the design of lithographic equipment and the mode of other condition (for example, whether pattern formation device remains in the vacuum environment).Supporting structure can be used machinery, vacuum, static or other tensioning technique supports pattern and forms device.Supporting structure can be for example to be fixed as required or movably framework or platform.Supporting structure can guarantee that pattern forms device and is positioned at desired position such as relative optical projection system.Here, any usage of term " graticule " or " mask " can be considered to more general term " pattern formation device " be synonym.
Term as used herein " pattern formation device " should broadly be construed as denoting and can be used to give the xsect of beam of radiation so that partly produce any device of pattern in the target of substrate with pattern.If should be noted in the discussion above that for example pattern comprises phase shift feature or so-called supplemental characteristic, the pattern of then giving beam of radiation may not be the pattern of wanting in the lucky target part corresponding to substrate.Usually, giving the pattern of beam of radiation will be corresponding to certain functional layer in the device that is just forming in target part, for example integrated circuit.
It can be transmission-type or reflective that pattern forms device.The example that pattern forms device comprises mask, array of programmable mirrors and Programmable LCD panel.Mask is well-known in the photolithography field, and comprises mask-type and various hybrid mask types as binary, alternation phase shift and attenuating phase-shift.An example of programmable mirror array adopts the arranged in matrix of micromirror, and each mirror can tilt individually with the beam of radiation along the incident of different directions reflection institute.Tilting mirror is given pattern in by mirror matrix institute radiation reflected beam.
Here used term " optical projection system " should be broadly interpreted as and comprise various types of optical projection systems, comprise refraction type, reflective, reflected refraction formula, magnetic-type, electromagnetic type and electrostatic optical system or its combination in any, this for example should be according to used exposing radiation or other factors as using immersion liquid or using the situation of vacuum come suitably to determine.Term " projecting lens " any use in this article all should be regarded as having identical implication with more general term " optical projection system ".
As described herein-in, equipment is transmission-type (as using transmission mask).On the other hand, equipment can also be reflection type (as using the type of array of programmable mirrors above-mentioned, or using reflection mask).
Lithographic equipment can be the sort of type with two (twin-stages) or a plurality of substrate table (and/or two or more supporting structure).In this " multistage " formula machine, additional platform can use in parallel, perhaps can on one or more platforms, carry out preliminary step and will be one or more other platform be used for exposing.
Lithographic equipment can also be following type, and wherein at least a portion of substrate can be had liquid high index, for example water and covers, so that fill the space between projection system and the substrate.Immersion liquid can also be used for other spaces of lithographic equipment, for example space between mask and the projection system.Immersion technique is known in the field of the numerical aperture that increases projection system.Term as used herein " submergence " does not also mean that for example the structure of substrate must be immersed in the liquid, but only means at exposure period interstitial fluid body and be positioned between projection system and the substrate.
With reference to figure 1, luminaire IL receives the beam of radiation from radiation source S O.This source and lithographic equipment can be independent entity, for example when radiation source is excimer laser.In this case, radiation source should not be regarded as having formed the part of lithographic equipment, and beam of radiation is delivered to the luminaire IL from source SO by means of beam transfer system BD, and beam transfer system BD for example comprises suitable guiding mirror and/or beam expander.In other cases, this source can be an integral part of lithographic equipment, when for example being mercury vapor lamp in this source.Source SO and luminaire IL and beam transfer system BD (if necessary) can be described as radiating system together.
Luminaire IL can comprise regulating device AD, and it is used to regulate the angle intensity distributions of beam of radiation.As a rule, can regulate the outside and/or the inner radial scope (being called σ-outside and σ-inside usually) of the intensity distributions in the pupil plane of luminaire at least.In addition, luminaire IL generally includes various other devices, for example integrator IN and condenser CO.Luminaire is used for regulating beam of radiation, so that it has required homogeneity and intensity distributions on its xsect.
Beam of radiation B is incident on the pattern that is fixed on the supporting structure (for example mask table MT) and forms on the device (for example mask MA), and forms device and patterning by this pattern.After passing mask MA, beam of radiation B is by optical projection system PS, its with beam focusing on the target portion C of substrate W.By means of the second locating device PW and position transducer IF (for example interferometer, linear encoder or capacitive transducer), substrate table WT can accurately move, so that for example different target portion C is positioned in the path of beam of radiation B.Similarly, available first locating device PM and another location sensor (clearly not illustrating in Fig. 1) come with respect to the path of beam of radiation B pattern formation device MA to be carried out accurate localization, after for example mechanically retrieving from the mask storehouse or in scanning process.As a rule, long stroke module (coarse localization) and short stroke module (accurately location) by means of a part that forms the first locating device PM can realize the motion of mask table MT.Similarly, adopt the long stroke module and the short stroke module of a part that forms the second locating device PW, can realize the motion of substrate table WT.Under the situation that adopts ledex (opposite with scanner), mask table MT can only link to each other with short-stroke actuator, or is fixed.Mask MA and substrate W can adopt mask alignment mark M1, M2 and substrate alignment mark P1, P2 to aim at.Occupied the application-specific target part though substrate alignment mark is shown as, yet they can be in the space between the target part (they are called line sheet alignment mark).Similarly, be provided with on the mask MA above under the situation of a tube core, mask alignment mark can be between tube core.
Described device can be used at least a following pattern:
1. in step mode, mask table MT and substrate table WT keep static basically, and the whole pattern of giving beam of radiation is projected to (being single static exposure) on the target portion C by disposable.Move substrate table WT along X and/or Y direction then, make different target portion C be exposed.In step mode, the full-size of exposure area has limited the size of the target portion C of imaging in single static exposure.
2. in scan pattern, mask table MT and substrate table WT are synchronously scanned, and the pattern of giving beam of radiation simultaneously is projected to (being single dynamic exposure) on the target portion C.Substrate table WT is determined by amplification (dwindling) and the image reversal characteristic of optical projection system PS with respect to the speed and the direction of mask table MT.In scan pattern, the full-size of exposure area has limited the width (on the non-direction of scanning) of the target part in the single dynamic exposure, and the length of scanning motion has determined the height (on the direction of scanning) of target part.
3. in another pattern, support the mask table MT that pattern able to programme forms device and keep motionless basically, substrate table WT is moved or is scanned, and the pattern of giving beam of radiation is projected on the target portion C.In this pattern, usually,, use impulse radiation source and after substrate table WT moves or between the continuous radiation pulse, as required pattern able to programme is formed device at every turn and upgrade in scan period.Can at an easy rate this operator scheme be applied to utilize pattern able to programme to form the maskless lithography art of device (type of array of programmable mirrors as mentioned above).
Can also use combination and/or the variation or the diverse pattern of above-mentioned pattern.
Fig. 2 has described the displacement measurement system 10 according to the embodiment of the invention.As what describe below and discuss, can be used for measuring the displacement of substrate table in the lithographic equipment particularly according to all displacement measurement systems of the embodiment of the invention.Yet although do not describe in detail below, the embodiment of the invention also can be used to measure and is used for the displacement that pattern forms the support of device in the lithographic equipment.Can utilize the measurement of lithographic equipment inner part displacement so that control moving of these parts.For example, the feedback control loop that is used to be configured to the actuator of moving-member can compare the actual displacement of the substrate table that recorded by displacement measurement system and desired power is put on parts so that make the difference minimum with the expection displacement.In addition, should recognize that embodiments of the invention can also be used for other environment and generally can be used to measure the displacement of any internal system part with respect to reference component.
In described layout, displacement measurement system 10 can be used to measure the displacement of substrate table 11 with respect to reference frame 13, and substrate table 11 is configured to support substrates 12.Displacement measurement system 10 can be arranged in the zone of lithographic equipment, in this lithographic equipment, for example the exposure of the beam of radiation by utilizing patterning and with design transfer to substrate 12.Perhaps, for example displacement measurement system 10 can be arranged in the part of lithographic equipment, checks and/or measure substrate 12, i.e. metering units in the part of this lithographic equipment.
In order to measure the displacement of substrate table 11, be provided with appropriate section 11a, 11b that a plurality of displacement transducers 21,22,23,24 are used for measuring substrate table 11,11c, 11d displacement with respect to the respective objects 31,32,33,34 that is installed to reference frame 13 with respect to reference frame 13.The target that wherein is installed to the separation of reference frame is used for this layout that each displacement transducer rather than utilization be installed to the single general objective of reference frame to make can provide bigger moving range for substrate table under the situation that does not make any single target become too big.Should recognize that for enough precision are provided, target has the least possible defective.Yet target is big more, just is difficult to make target with enough low ratio of defects and so also expensive more more.Has cost when therefore, the cost of single general objective is obviously greater than combination with general objective a plurality of littler targets of the same area.
In addition, in this layout, by relatively from the path of the zero level radiation of benchmark diffraction grating with from the benchmark grating, from the target diffraction grating be reflected or further diffracted first order diffraction radiation of returning and negative first order diffraction radiation at least one of them, measure on the direction that is substantially perpendicular to the diffraction grating plane, the target diffraction grating is possible with respect to the displacement of benchmark diffraction grating.As additional or as alternative,, the relative displacement that also can use other layout to come the grating of measuring vertical on the direction on diffraction grating plane.
Therefore, in the layout that Fig. 2 describes, target 31,32,33,34 can be the target diffraction grating, for example is arranged to make the target surface of each target be arranged essentially parallel to reference field.In addition, each comprised radiation source of displacement transducer 21,22,23,24, benchmark diffraction grating and radiation sensor.Yet other layouts are possible and within the scope of the invention.For example, one or more parts of displacement transducer can be arranged to separate with substrate table.For example, radiation source and/or radiation sensor can be arranged to respectively separate with substrate table 11 and for example be arranged to use that fiber optic cables provide radiation or are received from the radiation that the target diffraction grating returns as the benchmark diffraction grating.
In addition, the target diffraction grating can be one dimension diffraction grating (being a plurality of stripeds), and it can be substantially perpendicular on the direction on target diffraction grating plane and/or be positioned at the plane that is arranged essentially parallel to target diffraction grating plane and be substantially perpendicular to displacement measurement on the direction of stripe direction.Perhaps, one or more in the target diffraction grating 31,32,33,34 can be two-dimensional diffraction gratings, and it can be substantially perpendicular to the direction on target diffraction grating plane and be arranged in displacement measurement on one of them direction of two orthogonal directionss on the plane that is arranged essentially parallel to target diffraction grating plane.Therefore, each of the displacement transducer 21,22,23,24 of the described layout of Fig. 2 can be configured to measure the direction that is substantially perpendicular to plane, target 31,32,33,34 place and be positioned at appropriate section 11a, 11b (promptly on one of them direction of x as shown in Figure 2, y and z direction), substrate table 11 on wherein one or more directions of two orthogonal directionss on this plane, 11c, the 11d displacement with respect to reference frame 13.
In the specific arrangements of the described embodiment of the invention of Fig. 2, first displacement transducer 21 and triple motion sensor 23 are arranged to measure appropriate section 11a, 11c on the y direction, substrate table 11 the displacement with respect to reference frame.Second displacement transducer 22 and the 4th displacement transducer 24 are configured to appropriate section 11b on the measurement of x direction, substrate table 11, the displacement of 11d.Therefore, the displacement of third part 11c on displacement by the 11a of first on the y direction relatively, substrate table and the y direction, substrate table determines that substrate table 11 is possible around the rotation of z axle.Substrate table 11 is determined also and can be undertaken by the second portion 11b of the substrate table 11 that relatively records and the displacement in the x direction of the 4th part 11d around z axle rotation.
Determine substrate table 11 around z axle rotation determine it is useful because it makes it possible to accurately to determine any part of substrate table, promptly is not equipped with the displacement in the x and y direction of the part (for example corresponding position of point on the substrate 12 that just is being exposed with pattern) of displacement transducer.For example, the product of the displacement measurement that the displacement on the y direction of the point of being paid close attention on the substrate table 11 can be by increasing the 11a of first on the y direction of being determined by first displacement transducer 21, substrate table 11 spacing on the x direction of the part 11a of the angular displacement of z axle and institute's focus and substrate table 11 is determined.Similarly calculating can be carried out based on the displacement measurement on the y direction that is recorded by the triple motion sensor.
Correspondingly, the displacement of the x direction of any point of being paid close attention on the substrate table 11 measured value that can be used to the displacement on any one x direction of second displacement transducer 22 and the 4th displacement transducer 24 is determined.Therefore, be used to determine fully the displacement (in other words, promptly linear in the x and y direction move and around the rotation of z axle) of any point on the substrate table 11 in the x-y plane from wherein any three displacement measurement of four displacement transducers 21,22,23,24.Should recognize that although displacement transducer 21,22,23,24 is arranged to towards the corner of substrate table 11 in the layout that Fig. 2 describes, usually they need not to be such.Yet the spacing of displacement transducer is big more, and is just high more and precision that therefore the displacement of any point is determined on the substrate table 11 is high more around the precision of determining of the swing offset of z axle.In addition, additional sensor can be set, for example so that extra redundancy to be provided.
Further each of configuration bit displacement sensor 21,22,23,24 is so that measure appropriate section 11a, 11b, 11c and 11d on the z direction, substrate table 11 the displacement with respect to related objective 31,32,33,34 in mode discussed above.Should recognize, with identical mode discussed above, relatively the z displacement that is recorded by paired displacement transducer can be used to determine that substrate table 11 is with respect to the rotation of reference frame 13 around x and y axle.Successively, can use these measured values so that determine the z displacement of any part of substrate table 11.In addition, in the same manner as described above, measure substrate table 11 with respect to reference frame 13 around the rotation of x and y axle and therefore determine the true z displacement of any part on the substrate table 11 according to wherein any three sensors of four displacement transducers 21,22,23,24.
Should recognize, be not that structure displacement transducer 21,22,23,24 is measured the displacement of appropriate section on one of them direction of z direction and x and y direction, substrate table 11 with respect to related objective, but be provided with especially additional displacement transducer with measure on the z direction, substrate table is with respect to the displacement of related objective.Z direction displacement transducer can be positioned at the position of direct contiguous x and y direction displacement transducer.Perhaps, can one or more z direction displacement transducers be set the some positions on substrate table 11, separate they and x and y direction displacement transducer the 21,22,23, the 24th.In addition, although z direction displacement transducer can use the target identical with x and y direction displacement transducer 21,22,23,24, as additional or, also can be z direction displacement transducer additional object be set as alternative.
Therefore, will appreciate that, utilize the configuration of displacement transducer as discussed above, use four or more wherein any three sensors of displacement transducer 21,22,23,24 to determine that on all six-freedom degrees the displacement of the substrate 12 of the displacement of any part of substrate table 11 or substrate table 11 upper supports is possible.This ability is useful, because as described in Figure 2, may be desirably between the target 31,32,33,34 and has space 25.Space 25 feasible inspection and/or measurement or the exposures that for example can carry out substrate are set, the displacement of simultaneous displacement measuring system 10 monitoring substrate tables 11.Therefore, for example,, beam of radiation 26 passes to substrate 12, so that carry out exposure or the inspection and/or the measurement of substrate 12 respectively from projecting lens or metering system 27 thereby may needing to pass space 25.
Yet, when substrate table 11 moves when making the different piece of substrate 12 can be exposed, measure and/or check, one of them of displacement transducer 21,22,23,24 may move to its can not be on its respective objects projection radiation but make radiation pass the position in space 25.For example, if the substrate table that Fig. 2 describes plans to move to its maximum point of y and the maximum point of its x (corresponding to exposure, measure or check the point of minimum x and y place on the substrate 12), second displacement transducer 22 can not make beam of radiation project on its respective objects 32 and so with inoperative.Yet, still may be in the displacement of determining any point on substrate table 11 or the substrate 12 on all six-freedom degrees, because its excess-three displacement transducer 21,23,24 still can work.
Should recognize that although the sensor of the substrate table displacement on measurement of x, y and the z direction is mentioned in top description, embodiments of the invention are not limited to use the displacement transducer of the displacement of measuring the substrate table on these directions.Specifically, sensor one or more sensors or separation, additional can be measured on the different directions displacement of (for example locating to one of them 45 ° of x, y and z axle) substrate table.In addition, may be useful although the displacement transducer of the displacement of measuring the substrate table on the mutually orthogonal direction is set, this is optional.
It is to be further appreciated that Fig. 2 is to draw in proportion schematically and not.Specifically, substrate table 11 and metering/exposing unit 27 are described according to the mode of wide on the z direction 31,32,33,34.Just figure is more clear so to be done in order to make, in fact these parts will be close to each other significantly and/or metering/exposing unit 27 can extend through space 25.
In addition, the size of target 31,32,33,34 is determined according to the moving range that substrate table 10 requires.Adjacent target can contact with each other or between them less space can be set.
Fig. 3 a, 3b, 3c and 3d have described the layout according to the embodiment of the invention.As described, this layout comprises and corresponding first displacement measurement system 40 of the displacement measurement system of above-mentioned Fig. 2.Specifically, this displacement measurement system comprises first target 41, second target 42, the 3rd target 43 and the 4th target 44 that is installed to reference frame and the displacement transducer 51,52,53,54 that is installed to substrate table 50, and the appropriate section that displacement transducer 51,52,53,54 is arranged to measure substrate table 50 is with respect to the displacement of respective objects 41,42,43,44 and therefore with respect to the displacement of reference frame.In described layout, first displacement measurement system 40 is arranged, and makes it can measure the displacement of substrate table 50 with respect to reference frame by all positions that exposure system 55 is exposed at substrate.
Can also make substrate table 50 move to the position that wherein can measure and/or check any part of substrate by metering units 56.For example, can be before shifting measure by metering units 56 and/or the detailed inspection substrate pattern is exposed on substrate by exposing unit 55.Therefore, be desirably in by metering units 56 check and/or measuring process during, by being transferred to the displacement of accurately measuring substrate table 50 during the another one during the pattern exposure of exposing unit 55 and from one.Therefore, be provided with second displacement measurement system 45 is used for measuring substrate table 50 during inspection of being carried out by metering units 56 and/or measuring process displacement.Second displacement measurement system 45 is formed by the 5th target 46, the 6th target 47, the 7th target 48, the 8th target 49 and as the displacement transducer 51,52,53,54 of the part of first displacement measurement system 40.In other words, some parts is used for first displacement measurement system 40 and second displacement measurement system 45 jointly.
Described as Fig. 3 a, when position substrate platform 50 makes that inspection and/or measuring process can be carried out by metering units 56, arrange that first displacement transducer 51 is with the displacement with respect to the 5th target 46 of the appropriate section of measuring substrate table 50, locate second displacement transducer 52 with the displacement of the appropriate section of measuring substrate table 50 with respect to the 6th target 47, locate triple motion sensor 53 with the appropriate section of measuring substrate table 50 with respect to the displacement of the 7th target 48 and locate the 4th displacement transducer 54 with the displacement of the appropriate section of measuring substrate table 50 with respect to the 8th target 49.Therefore, when substrate table 50 positioned at the operating characteristic of inspection of being implemented by metering units 56 and/or measuring process with its same way as that exposure is allowed when positioning at the substrate by exposing unit 55, substrate table 50 can accurately be determined by second displacement measurement system 45 with respect to the displacement of reference frame.In addition, can arrange first displacement measurement system 40 and second displacement measurement system 45 as described, make for the desired gamut motion of exposure substrate and check and/or measure the desired gamut motion of substrate, four displacement measurement sensors 51,52,53,54 wherein three always can measure of the displacement of the appropriate section of substrate table 50 with respect to one of them target.
Therefore, as top discussion and description, if arrange that wherein two displacement transducers 51,53 are measured the displacement on the y direction and arranged wherein two displacements that displacement transducer 52,54 comes on the measurement of x direction, then the gamut that the gamut that requires at exposure process moves and inspection and/or measuring process require moves, and any part of determining substrate table 50 in the x-y plane fully is possible with respect to the displacement of reference frame.In addition, once more as discussed above, if each of arranging displacement transducer 51,52,53,54 in addition is to measure the displacement on the z direction, another gamut that requires at exposure process moves and the gamut of inspection and/or measuring process requirement moves, and any part of definite fully substrate table 50 is possible with respect to the displacement of reference frame on all six-freedom degrees.
As described by the sequence of positions of substrate table 50 among Fig. 3 a, 3b, 3c and the 3d, under the situation of the precision of not losing displacement measurement, substrate table 50 from check and/or measuring position (Fig. 3 a is described) to move to exposure position (Fig. 3 d is described) also be possible.This may be a problem that has at the displacement measurement system of the separate targets of each displacement transducer, because when substrate table 50 shifts out any one desired moving range of exposure process and inspection and/or measuring process, displacement transducer 51,52,53,54 must be from a goal displacement to another target.Boundary between target, displacement transducer will can not provide reliable displacement measurement.Yet, by on each position of gauge position and exposure position for each displacement transducer provides the target of separating, can make the size of target and therefore cost keep minimum.
Therefore, described as Fig. 3 a, 3b, 3c and 3d, can arrange displacement measurement system, make in one of them of displacement transducer 51,52,53,54 during by the border between a target and the next target, its excess-three displacement transducer is Displacement Measurement (so that as discussed above, can determine the whole displacement of substrate table 50) accurately.
In order to reach this point, the careful relative position of substrate table 50 top offset sensors 51,52,53,54 and the border between the target arranged of expectation.Specifically, for any two displacement transducers, be desirably in the spacing that spacing between the moving direction top offset sensor of substrate table 50 is different from this direction coboundary near corresponding border between the target.Therefore, described as Fig. 3 b, for example the space D 1 between second displacement transducer 52 and the triple motion sensor 53 is different from border between the 5th target 46 and the 6th target 47 and the spacing between the border between the 7th target 48 and the 8th target 49 (it is zero) on the y direction on the y direction.Therefore, shown in Fig. 3 b, triple motion sensor 53 beginning its before the transfer of the 7th target 48 to the 8th targets 49, second displacement transducer 52 has been finished its transfer from the 6th target 47 to the 5th targets 46.
As other example, the space D 2 on the y direction between first displacement transducer 51 and second displacement transducer 52 is different from the border between first target 41 and second target 42 and the space D 3 between the border between second target 42 and the 5th target 46 on the y direction.Therefore, the beginning of first displacement transducer 51 its before the transfer of second target, 42 to first targets 41, second displacement transducer 52 has been finished its transfer from the 5th target 46 to second targets 42.
Described as Fig. 3 a to 3f, the spacing between two displacement transducers on a kind of moving direction of guaranteeing substrate table 50 is different from this direction the spacing on corresponding border between two targets and guarantees that it is with respect to the set point on the substrate table 50 displacement transducer 51,52,53,54 to be arranged in the diverse location on the y direction on the substrate table 50 that displacement transducer intersects the possibility of (cross).Add as alternative or conduct, the position on the border between the respective objects can interlock on the y direction.For example, the position on the y direction on border may be different from position on the y direction on border between the 3rd target 43 and the 4th target 44 between first target 41 and second target 42.Similarly, position between second target 42 and the 5th target 46 on the y direction on border may be different from the position on the y direction on border between the 3rd target 43 and the 8th target 49, and the position on the y direction on border may be different from position on the y direction on border between the 7th target 48 and the 8th target 49 between the 5th target 46 and the 6th target 47.
In addition, should recognize that Fig. 3 e as discussed above and 3f are described, during exposure process, substrate table 50 can move past moving range so that allow exposing unit 55 exposure to be projected any part of substrate in the x-y plane.During such moving range, in each stage, one of them of displacement transducer 51,52,53,54 no longer aimed at one of them of target 41,42,43,44 but aimed at the space between the target.Therefore, that expectation is guaranteed to require in the x-y plane so that implement in the whole moving range of exposure process, have only a displacement transducer 51,52,53,54 at any one time with target 41,42,43,44 between the space aim at.In order to ensure this point, in one embodiment, the length D4 in space is less than space D 5, D6 that aim on the y direction or between the paired sensor of separating with less relatively amount on the x direction between the target 41,42,43,44.For example, therefore space D 5 between triple motion sensor 53 and the 4th displacement transducer 54 and the space D 6 between first displacement transducer 51 and second displacement transducer 52 greater than the gap lengths D4 on the y direction.Similarly, the gap length D7 on the x direction is less than space D 8 that aim on the x direction or on the x direction of the paired displacement transducer that has less relatively spacing on the y direction.Therefore, for example the space D 8 on the x direction of first displacement transducer 51 and the 4th displacement transducer 54 greater than the gap length D7 on the x direction.
Should recognize that the size in space is selected in the corresponding way between the target 46,47,48,49 of second displacement measurement system.
For clarity sake, Fig. 3 a, 3b, 3c and 3d do not describe reference frame.Yet,, first to the 8th target can be installed on the single reference frame 60 as Fig. 4 a schematic description.This can be installed to again on the mete-wand frame, for example the miscellaneous part as the lithographic equipment of exposing unit, metering units or any one several portions can be installed to the mete-wand frame.Reference frame 60 can be mete-wand frame itself alternatively.For example make the vibration isolation support of vibration transmission minimum the mete-wand frame can be installed to the base of lithographic equipment from base to the mete-wand frame.
Perhaps, describe as Fig. 4 b, can will be installed to first reference frame 61 and will be installed to second reference frame 62 that separates with target 41,42,43,44 that first displacement measurement system 40 is associated with the target 46,47,48,49 that second displacement measurement system 55 is associated.The reference frame 61,62 that separates can for example be installed on the mete-wand frame of lithographic equipment again.Therefore, it will be minimum shifting to any vibration of another one from one of them of corresponding reference frame, thereby make the minimum that influences to the measurement carried out with respect to another reference frame.
Should recognize, miscellaneous part can be installed to reference frame 61,62.For example in the layout that Fig. 4 b describes, exposing unit 55 or its part can be installed to first reference frame 61.Similarly, metering units 56 or its part can be installed to second reference frame 62.Therefore, by the reference frame 61,62 that separation is set, from any vibration of metering units 56 for example will be as much as possible to substrate table 50 with respect to first reference frame 61 and therefore again with respect to the almost not influence of measurement of the displacement of exposing unit 55.
Fig. 5 a and 5b have described the modification of the described layout of Fig. 3 a to 3f.Specifically, the target 71,72,73,74 that provides for first displacement measurement system (for example use during the exposure process) is to separate with the target 75,76,77,78 (using during metering process) that provides for second displacement measurement system.Therefore, can accurately determine the displacement of substrate table during the position that wherein can carry out exposure in order to ensure the position transfer of describing from Fig. 5 a at substrate table, wherein can carry out metering, between the target 75,76,77,78 of the target 71,72,73,74 of first displacement measurement system and second displacement measurement system, be provided with additional object 79.As previously mentioned, arrange the position of all targets and the position of displacement transducer, make displacement transducer at least wherein three displacement measurement (promptly not and the space between the target or the boundary alignment between the target) always can be provided.Therefore, will appreciate that, can increase the spacing between exposing unit and the metering units, thereby under the situation of the full-size that does not increase target (and therefore cost) and do not reducing substrate table and provide additional space for miscellaneous part under with respect to the situation of the precision of the displacement measurement of reference frame.
Should recognize, can replace one or more additional object 79 by the prolongation that the one or more targets in second target 72, the 3rd target 73, the 5th target 75 and the 8th target 78 are provided.For example, as it is described to show Fig. 5 c of a part of first displacement measurement system and second displacement measurement system, and second target 72 can have towards the 5th target 75 and stretches and share the prolongation 72a on border with the prolongation 75a of the 5th target.Similarly, the 3rd target 73 and the 8th target 78 can have and stretch toward each other and separately prolongation 73a, the 78a on shared border.
Be arranged at the place between the target 75,76,77,78 of the target 71,72,73,74 of first displacement measurement system and second displacement measurement system in additional object 79, if the common reference frame is used for the target (in the corresponding mode of describing with Fig. 4 A) of first displacement measurement system and second displacement measurement system, then additional object 79 can be installed on the common reference frame identical with the target of first displacement measurement system and second displacement measurement system.The reference frame of Fen Liing is respectively applied in the layout of target of first displacement measurement system and second displacement measurement system therein, additional object 79 can be installed on arbitrary reference frame or some additional object 79 can be installed on the reference frame and other additional object 79 are installed on another reference frame.Perhaps, in both cases, additional object 79 can be installed to respect at the target of first displacement measurement system and second displacement measurement system and the reference frame that is provided with is one fully independently on the reference frame or additional object 79 directly can be installed on the mete-wand frame of lithographic equipment.
Fig. 6 a, 6b, 6c, 6d, 6e and 6f have described the system according to the embodiment of the invention.A plurality of layouts are with corresponding as the described embodiment of Fig. 3 a, 3b, 3c and 3d and therefore, common trait indicates with identical Reference numeral and will no longer repeat its detailed description.It is to be further appreciated that the relevant modification of embodiment discussed above and previously discussed also can be used for the 3rd embodiment.
Difference between the embodiment shown in embodiment shown in Fig. 6 a-f and Fig. 3 a-d is to be provided with second substrate table 80.Second substrate table 80 may be identical with first substrate table 50 and comprises displacement transducer 81,82,83,84.The benefit of this system is, when pattern is exposed on a substrate of one of them upper support of substrate table, can check and/or measures by second substrate of 56 pairs of other substrate table upper supports of metering units.Therefore, can increase the turnout of equipment.
Second substrate table 80 works in the mode identical with substrate table 50.Therefore, the displacement transducer 81,82,83,84 of second substrate table 80 can be measured the displacement with respect to first target 41, second target 42, the 3rd target 43, the 4th target 44, thereby play the effect of first displacement measurement system 40 and can measure displacement, thereby play the effect of second displacement measurement system 45 with respect to the 5th target 46, the 6th target 47, the 7th target 48, the 8th target 49.
Yet, as Fig. 6 a, 6b, 6c and 6d are described, in order to ensure first substrate table 50 and second substrate table, 80 commutative positions, promptly a more than displacement transducer can't provide under the situation of displacement measurement on each substrate table not existing, first substrate table 50 can be shifted to the gauge position of describing as Fig. 6 f from the exposure position of describing as Fig. 6 a, and (it can move to as following further discussion from here, can with substrate from the substrate table removal and with new substrate pack into substrate table the position and move to gauge position make can utilize metering units 56 to check and/or measure new substrate), and second substrate table 80 can move to the exposure position of describing as Fig. 6 f (and recovery) from the gauge position of describing as Fig. 6 a, thereby stop associated substrate platform 50,80 displacement definite fully may expect to amplify some target 41,42,46.This has increased the cost of target, because target is big more, is difficult in gamut also expensive more according to desired precision manufacturing and target more.
In addition, if lithographic equipment is so-called immersion lithographic apparatus, may need to increase the size of some target 41,44.In this equipment, the exposure of radiation pattern on substrate carried out by liquid level.This makes that the performance of lithographic equipment is higher.For the application with controlling liquid is provided, exposing unit 55 comprises shower nozzle, and this shower nozzle provides liquid to the part of wherein carrying out exposure and removing the substrate of edge's liquid.One of difficult point in this system comprises the starting of shower nozzle and stops.Therefore, expectation provides the lithographic equipment that wherein needn't stop and starting shower nozzle between the substrate exposure of back.This can obtain in so-called by for example using " wet exchange ".The layout that Fig. 6 a to 6f describes is provided with for this wet exchange.
Described as Fig. 6 b, the part of exchange process comprises that first substrate table 50 and second substrate table 80 move to appropriate section and make them adjacent one another are at once, for example contact or very approaching on the y direction.As what describe in Fig. 6 b, first substrate table 50 and second substrate table 80 may be aimed at, but this is optional.Subsequently, first substrate table 50 and second substrate table 80 move to second substrate table 80 at the consistent contact point (being shower nozzle) that makes between the exposing unit 55 that moves on the y direction from first substrate table 50.When first substrate table 50 and second substrate table 80 very near to or in contact with the time, needn't close shower nozzle, because it is transferred to second substrate table 80 from first substrate table 50.After described transfer has been finished as Fig. 6 c, can remove as the described substrate table 50,80 of Fig. 6 d, and, feasiblely can move and its displacement can be measured and second substrate table 80 is movable to exposure position and its displacement can use first displacement measurement system to measure by second displacement measurement system towards gauge position as described first substrate table 50 of Fig. 6 f then for example as the described position that on the y direction, oppositely moves to of Fig. 6 e.In case corresponding exposure and metering process are finished, and can repeat this process so that gain substrate table once more.
Described as Fig. 6 a to 6f, second substrate table 80 is changed to from gauge position the process of exposure position, first substrate table 50 and second substrate table 80 center on each other in clockwise mode and move.As discussed above, turn back to exposure position from gauge position, can repeat this process in order to gain substrate, make win substrate table 50.Yet substrate table 50,80 can comprise that the interim pipe cable of communicating by letter between the parts of for example control system in the remainder of the device that is used to provide power for example and is included in for example displacement transducer in the substrate table and lithographic equipment connects.Therefore, for fear of demand to the complication system that is used to connect interim pipe cable, be used to gain the process of substrate table 50,80, just make first substrate table 50 turn back to exposure position and make second substrate table 80 turn back to the process of gauge position, may be different from the conversion of the substrate table 50,80 of Fig. 6 a to 6f description, because substrate table can be in counterclockwise mode around moving each other.Therefore, move to exposure position in order to make second substrate table 80 from gauge position, substrate table 50,80 is around turning clockwise each other and in order to make first substrate table 50 turn back to exposure position, substrate table is around rotation (or vice versa) counterclockwise each other.In this layout, directly having guaranteed interim pipe cable or connected to other of substrate table can the phase mutual interference.
After the exposure process on the substrate was finished, the substrate table that supports this substrate turns back to gauge position as discussed above and then turns back to can be with substrate from the substrate unloading position of substrate table removal and the substrate " loaded " position that turns back to the substrate table of new substrate can being packed into subsequently.Mobile subsequently substrate table makes and can carry out measurement and/or checking process by metering units on new substrate.
Can select substrate unloading position and substrate " loaded " position, make during substrate unloading and substrate loading operation substrate table remain on second displacement measurement system 45 wherein and can measure in the zone of displacement of substrate table.Therefore, can utilize the displacement measurement of the substrate table that records by second displacement measurement system 45 to control towards mobile and the moving mobile, of substrate " loaded " position from the substrate unloading position to the substrate " loaded " position from the substrate " loaded " position to the position that can carry out inspection and/or measuring process.
Substrate unloading position and substrate " loaded " position can be arranged to adjacent one another are, the displacement that can measure substrate table in the outermost edge of the second displacement measurement system inner region.For example, can arrange them, make concerning each that substrate table is on the negative y direction its highest distance position, and is described as Fig. 6 a to 6f.Automatic wafer processor can be set so that respectively substrate is installed on the substrate table from the substrate table removal and with substrate.Yet automatically wafer processor may move relatively slowly, and the result be substrate in a period of time from substrate table is removed after automatically wafer processor may be positioned on the position of operation of interference second displacement measurement system.For example wafer processor can stop one or more displacement transducers that beam of radiation is projected on the related objective automatically.Therefore, in order to ensure the displacement that during moving, always can measure substrate table, may expect not to be directly to move to the substrate " loaded " position but to be desirably in it is moved past and then directly before the substrate " loaded " position is advanced, to make substrate table directly move away from automatic crystal processor from the substrate unloading position from the substrate unloading position to the substrate " loaded " position.For example, described as Fig. 6 a to 6f, wherein substrate unloading position and substrate " loaded " position are set in the layout at the distal-most edge place of the negative y direction of second displacement measuring equipment, substrate table can be at first advance away from the substrate unloading position on positive y direction, is arranged essentially parallel to that the x direction moves and then arrive the substrate " loaded " position forward on negative y direction.So, the displacement of continuous coverage substrate table is possible during moving from the substrate unloading position to the substrate " loaded " position, because for example the neither one displacement transducer is crossed over border wafer processor one of them the operation of having blured displacement transducer automatically simultaneously between the target.
Fig. 7 a to 7c has described the lithographic equipment according to the embodiment of the invention.As the embodiment shown in Fig. 6 a-f, this configuration comprise be used for respectively measuring on the exposure position and gauge position on first displacement measurement system and second displacement measurement system of displacement of substrate table.In addition, this equipment comprises two substrate tables 50,80, makes can check and/or measure by metering units at second substrate of second substrate table, 80 upper supports simultaneously in substrate exposure of first substrate table, 50 upper supports.Identical parts utilization indicates with the used identical Reference numeral of the embodiment of front and its difference will only be discussed.Will appreciate that the modification about first to the 3rd embodiment discussion also can be used for the embodiment shown in Fig. 7 a-h above.
As the embodiment shown in Fig. 6 a-f, described as Fig. 7 b and 7c, phase one of process of changing the position of first substrate table 50 and second substrate table 80 is that second substrate table 80 is transferred to exposure position.As previously mentioned, conversion can be used for wherein using the lithographic equipment of submergence exposure and can be used to make shower nozzle to be transferred to second substrate table 80 and to need not to close shower from first substrate table 50 in the wet exchange that the y direction moves.Yet different with the layout of the 3rd embodiment, the size of target 41,42,43,44 does not increase.In other words, the target 41,42,43,44 of first displacement measurement system 40 is only big as necessary, so that the range of movement of desired substrate table 50 is provided during exposure process.Therefore, when wet exchange was proceeded, described as Fig. 7 b, first displacement transducer 51 of first substrate table 50 and the 4th displacement transducer 54 were crossed the border of first target 41 and the 4th target 44 respectively.Therefore, according to the 4th embodiment, be provided with other target 91,92 so that be used for measuring the displacement of substrate table 50 at first displacement transducer 51 and the 4th displacement transducer 54 of first substrate table 50.Similarly, as then in Fig. 7 c to 7g, describing, being provided with the displacement measurement that other target 93,94,95,96 makes the substrate table 50 of winning can continue to carry out, therefore even first substrate table 50 moves and leaves second substrate table 80 that is in exposure position fully, and first displacement transducer 51 of first substrate table 50 and second displacement transducer 52 can't be measured displacement with respect to the target that is used for first displacement measurement system 40 and second displacement measurement system 45.Therefore, during as the described transfer process of Fig. 7 a to 7h, the displacement of first substrate table 50 is recorded by the triple motion measuring system of the displacement transducer 51,52,53,54 that comprises first substrate table 50 and a plurality of target and additional object 91,92,93,94,95,96, and described a plurality of targets comprise some target of using in the mat woven of fine bamboo strips one displacement measurement system 44 and second displacement measurement system 45.
Can select the position of additional object 91,92,93,94,95,96 ( target 91 and 92 is not shown in Fig. 7 c) especially so that guarantee the displacement transducer of sufficient amount and aim at the respective objects that always can determine the displacement of substrate table.For example, can carefully be chosen on the x direction and separate with the target of second displacement measurement system 45 with first displacement measurement system 44, be elongated on the y direction and after wet exchange has been finished, during gauge position moves, be used for the position that first displacement transducer 51 and second displacement transducer 52 for substrate table provide the additional object 95 of target from exposure position at substrate table.Specifically, can be located, it is punctual with 95 pairs elongated of additional object to make at first displacement transducer 51 and second displacement transducer 52, triple motion sensor 53 and the 4th displacement transducer 54 can be aimed at first target 41 and/or second target 42 of first displacement measurement system, when substrate table 50 is mobile on the y direction, need not to cross the space between the target 41,42,43,44 of first displacement measurement system.
Similarly, can locate the border between additional object 91,92,93,94,95,96 and any other target, make at the moving of the substrate table of expection, any displacement transducer on the substrate table on the moving direction between given moving direction on spacing be different from moving of expection during by these displacement transducers the spacing on this direction on the corresponding border between approaching two targets.Therefore, it is possible guaranteeing to have only at any one time a displacement transducer to cross over the border between two targets and reliable displacement measurement can't be provided.
In order to make used target, to be specially the size minimum of additional object, can deployment arrangements, make during first substrate table 50 is transferred to gauge position from exposure position, have only sometimes wherein two displacement transducers can Displacement Measurement (all the other two or can not aim at the mark or can not and two targets between boundary alignment).Therefore, always can on all six-freedom degrees, determine the displacement of substrate table 50 in order to ensure the triple motion measuring system, for example can revise one or more in the displacement transducer, if the equipment of making only works on the x-y plane, its can measurement of x and the y direction on the displacement of appropriate section of substrate table, if and the displacement on all six-freedom degrees of monitoring of tools, then its can measurement of x, the displacement of the appropriate section of the substrate table on y and the z direction.Therefore, determine fully that on desired degree the displacement of substrate table 50 is possible, even have only wherein two displacement transducers can Displacement Measurement, if one of them of these two sensors is modified sensor one of them.
In this system through modification, if the rotation of substrate table around x and y axle determined in expectation, for example for the precise displacement on the z direction of some points of the substrate table of those that determine to remove place displacement transducer putting, then modified sensor also comprises second point that z direction top offset is measured, and described z direction top offset measure second separates with the initial point of z displacement measurement in this sensor.Yet, because the finite size of displacement transducer, spacing is less relatively and therefore may be not as by relatively the determined angular displacement of z displacement measurement from the displacement transducer of two separation is accurate by any angular displacement of relatively determining of two z displacement measurement.
Yet, should recognize, turn back to gauge position from exposure position and (it may be in the zone of the second displacement measurement system work to substrate unloading/" loaded " position thus at substrate table, be gauge position) process in, during mobile during metrological operation when mobile, from the gauge position to the exposure position and between exposure period when mobile accurately Displacement Measurement may be unessential.This is especially real, because can immediately substrate be removed from substrate table after substrate table turns back to metering region.Therefore, potential shortcoming discussed above is provable is not to be consequential.In addition, should recognize, if it is high that the expectation precision that makes substrate table turn back to the triple motion measuring system of measuring position from exposure position is measured during being respectively applied for exposure process and metering process first displacement measurement system of displacement of substrate table and second displacement measurement system, the expectation precision that is used for the additional object 91,92,93,94,95,96 of triple motion measuring system separately may be high unlike the accuracy requirement of the target that is used for first displacement measurement system and second displacement measurement system.Therefore, can use not too expensive target.
For for simplicity, the layout of describing among Fig. 7 a to 7h has only been described and has been used for exchanging in clockwise manner the additional object of first substrate table 50 and second substrate table 80.As top just Fig. 6 a-f embodiment discussed, in order to change back substrate table,, make first substrate table 50 turn back to exposure position promptly according to the described layout of Fig. 7 h, substrate table can exchange as described the continuation in clockwise manner of Fig. 7 a to 7h.Perhaps, as discussed above, can dispose this equipment, make that the conversion of substrate table can be clockwise and counterclockwise for what replace, so that avoid for example arriving the conflict of the interim pipe cable of substrate table between connecting.For this layout is provided, (complimentary) additional object (not shown) of one group of complementation should be set at the opposite side of the target that is used for first displacement measurement system and second displacement measurement system for the additional object 93,94,95,96 shown in Fig. 7 a to 7h.
Fig. 8 a to 8h has described the modification of the embodiment shown in Fig. 7 a-h.The layout that many variations and Fig. 7 a to 7h describe is identical and its difference will only be discussed.Similarly, identical Reference numeral is used for specifying common ground.
The main difference of the layout of describing among the layout of describing among Fig. 7 a to 7h and Fig. 8 a to 8h is: described in Fig. 8 d, 8e and 8f, utilization consistent first substrate table 50 that moves and second substrate table 80 on x direction rather than y direction are carried out wet exchange process, and the immersion liquid shower nozzle is transferred to second substrate table 80 from first substrate table 50 during this wet exchange process.For this layout is provided, be provided with additional object 100,101,102,103 so that when second substrate table, 80 shift-ins are used for the position of wet exchange, accurately measure the displacement of second substrate table 80, and additional object the 104,105,106, the 107th, desired does not move and returns the displacement of accurately measuring first substrate table 50 when this can measure the gauge position of its displacement by second displacement measurement system 45 once more so that do not block second substrate table 80 at first substrate table 50 from wet exchange.Therefore, as the layout that Fig. 7 a to 7h describes, utilize additional object 100,101,102,103,104,105,106,107 and be used for first displacement measurement system equally and the combination of the target of second displacement measurement system is provided with the triple motion measuring system.
As the described layout of Fig. 7 a to 7h, can select the position of the additional object 100,101,102,103,104,105,106,107 of the layout described among Fig. 8 a to 8h always to aim at the respective objects that can determine the substrate table displacement with the displacement transducer of guaranteeing sufficient amount.For example, can locate border between each and any other target of additional object 100,101,102,103,104,105,106,107 and make and move for any expection of platform, on the substrate table on the moving direction any displacement transducer between spacing be different from expection move in by the spacing on this direction on corresponding border between approaching two targets of displacement transducer.In addition, can select the size of additional object 100,101,102,103,104,105,106,107 and position to guarantee having only a displacement transducer above the space between the target, to aim on any position of substrate table during its expection is moved.
About the embodiment shown in Fig. 8 a-h, at least substrate table is being transferred to from metering region the process of exposure area, displacement measurement system may be as the displacement of the accurate measurement substrate table of displacement measurement of first displacement measurement system 40 and second displacement measurement system 45.Yet only the whole displacement from the metering region to the exposure area is accurately measured in expectation.Therefore, if the terminal point of displacement can accurately determine with respect to starting point, just can loosen being used for the triple motion accuracy of measurement system requirement of several portions of Displacement Measurement.
Should recognize, above just the modification discussed of Fig. 7 a to 7h also can be used for the layout described among Fig. 8 a to 8h.Specifically, it is to be further appreciated that the additional object of describing among Fig. 8 a to 8h only is employed so that carry out those additional object of the clockwise exchange of substrate table.If plan to provide the clockwise and exchange counterclockwise that replaces of first substrate table 50 and second substrate table 80, additional object can be set.
Although in Fig. 7 a to 8h, the additional object that is used for the triple motion measuring system separately is described as the target of a plurality of separation, but should recognize, in described any modification, additional object any wherein two can make up to form single additional object.
Fig. 9 a to 9h has described the operation according to the lithographic equipment of the embodiment of the invention.As the embodiment shown in Fig. 6 a-f and Fig. 7 a-h, this equipment comprises first substrate table 50 and second substrate table 80 and is arranged to measures first displacement measurement system 40 and second displacement measurement system 45 of the displacement of substrate table 50 and substrate table 80 in exposure area and metering region respectively.Described as Fig. 9 b and 9c, provide the wet exchange of y direction so that the immersion liquid shower nozzle is transferred to second substrate table 80 from first substrate table 50.Thereafter, the displacement of second substrate table 80 can utilize first displacement measurement system 40 to determine.Described as Fig. 9 d and 9e, first substrate table 50 is moved beyond the control of first displacement system 40 and turns back to gauge position, and first substrate table 50 can be moved to substrate unloading position and substrate " loaded " position again from here.
Described as Fig. 9 d and 9e, during returning of first substrate table 50 moved, the displacement transducer of not enough quantity may be able to be determined the displacement of substrate table.Therefore, first displacement measurement system and second displacement measurement system can not provide enough precision so that control moving of substrate table.Therefore, the triple motion measuring system is set is used for utilizing increment chi (incremental rule) for example or any other suitable displacement sensor substrate table position with respect to the base of lithographic equipment, rather than with respect to the position of reference frame.
Should recognize that it is accurate that the triple motion measuring system may obviously be not so good as first displacement measurement system and second displacement measurement system.This is because first displacement measurement system and second displacement measurement system are measured the displacement of substrate table with respect to for example reference frame, by means of making the minimum vibration isolator of vibration transfer from the base to the reference frame that this reference frame is installed to base.On the contrary, the triple motion measuring system is measured substrate table directly with respect to the displacement of base.Therefore, any vibration of transferring to the lithographic equipment base by miscellaneous part will reduce the precision of displacement measurement.Yet,, therefore do not need the height of substrate table displacement accurately to control because this system just uses after only the exposure on substrate has been finished.On the contrary, as what be provided with by the layout of describing among Fig. 9 a to 9h, the displacement that substrate table is measured on pin-point accuracy ground during metering process of second displacement measurement system, then for example utilize additional object 79 with top with regard to second, third, the mode discussed of the 4th embodiment is transferred to the exposure area with substrate table and makes and continue the displacement that pin-point accuracy ground is measured the displacement of this substrate table and utilized first displacement measurement system, 40 pin-point accuracy ground measurement substrate table subsequently, finish until exposure process.
Described as Fig. 9 g, the triple motion measuring system may be enough accurate in case make substrate that first substrate table 50 turns back to wherein exposure from substrate table 50 by the position of removal.Thereafter, described as Fig. 9 h, first substrate table 50 can be transferred to the position that wherein new substrate is loaded into substrate table.Before substrate is carried out metering process, may expect accurately to determine the absolute position of substrate table, on this position with respect to the target load substrates of second displacement measurement system.Therefore, expectation use location measuring system is measured the absolute position of substrate table with respect to reference frame.In case determined the absolute position of substrate table with respect to reference frame, utilize the continuation of the substrate table displacement of first displacement measurement system and second displacement measurement system to measure can be used for the position of the substrate table of determining any moment, finish until exposure.
Being used for measuring substrate table can be for example at US 6,875 with respect to the position measuring system of the absolute position of reference frame, disclosed position measuring system in 992, and US 6,875, and 992 content is incorporated into this paper by reference.In this position transducer, radiation source is installed on the reference frame and with beam of radiation and guides to the reverberator that is installed on the substrate table, and but described reverberator is constructed to along being parallel to travel path of incident light the light of the return path that has been shifted reflection autoradiolysis emission.Displacement depends on the position of substrate table and is measured by the two-dimensional radiation detecting device that contiguous radiation source is installed.Three such devices can be combined in the system so that measure the position of substrate table on all six-freedom degrees.Yet this process may be changed some times of expense, thereby has reduced the turnout of this equipment.For example, the whole TACT time of this equipment may be 7 seconds and determine that the time that the position spent of substrate table may be 0.3 second.Therefore make equipment postpone this time quantum and represent tangible turnout loss so that measure the position of substrate table.
Yet, according to specific embodiment of the present invention, can dispose and be used for determining the position transducer of substrate table with respect to the absolute position of the target of second displacement measurement system, make position measurement to carry out simultaneously substrate is loaded on the substrate table.Therefore, not free loss and therefore do not have the turnout loss.In addition, with for example in the above just the layout of the embodiment discussion of Fig. 6 a-f and 7a-h compare, this layout may be useful, and wherein the displacement of substrate table utilizes high precision measuring system to carry out continuous coverage and wherein do not determine the absolute position of substrate table in normal handling in the cycle.This is because in this layout, because substrate processing may stop displacement transducer can measure displacement with respect to target in a period of time, with substrate after substrate table unloading, substrate table can be moved to before the substrate " loaded " position, substrate table may need to keep motionless.Because when substrate table moves to the substrate " loaded " position, determine the absolute position of substrate table, so this problem is eliminated in the embodiment shown in Fig. 9 a-h.Therefore, any inaccuracy in the moving of the substrate table from the unloading position to the " loaded " position is not correlated with, and does not need to make substrate table to remain on the substrate unloading position to have removed space between displacement transducer and the target until wafer processor.
Should recognize, during substrate is loaded into the process of substrate table, measures substrate table and can use with any embodiment of the present invention discussed above with respect to the process of the position of reference frame.Specifically, if triple motion measuring system accurate words unlike first displacement measurement system and second displacement measurement system, with regard to the embodiment of Fig. 7 a-h, this may be particularly useful.
Also will be understood that, embodiment as Fig. 6 a-f and 7a-h, the direct embodiment of arrangenent diagram 9a-h makes win substrate table 50 and second substrate table 80 repeat conversion by clockwise exchange or also can be arranged through clockwise exchange and hocket conversion counterclockwise.
Although may specifically mention in this article in IC makes and use lithographic equipment, but be to be understood that, lithographic equipment as herein described may have other application, for example, make guidance and check pattern, flat-panel monitor, LCD (LCD) and the thin-film head etc. of integrated optics system, magnetic domain memory.Should recognize, in this available applicable cases, herein any usage of term " wafer " or " tube core " can be considered to respectively with more general term " substrate " or " target part " be synonym.Substrate mentioned in this article can be processed in for example guide piece (track) (a kind of instrument that usually photoresist layer is put on the photoresist of the substrate and the exposure of developing), metering outfit and/or checking tool before or after the exposure.In place applicatory, the disclosure of this paper is applicable to this and other substrate processing instruments.In addition, for example in order to form multilayer IC, substrate can be through processing more than once, so that the term as used herein substrate also can refer to comprise the substrate of a plurality of treated layers.
Although may specifically mention in the situation of optical lithography above and use embodiments of the invention, will recognize that the present invention can be used for other application, imprint lithography for example, and, the invention is not restricted to optical lithography in the place that situation allows.In imprint lithography, the image that pattern forms in the device is limited to the pattern that forms on the substrate.The image that pattern forms device can be pressed into the photoresist layer of supplying with substrate, by adding electromagnetic radiation, heating, pressurization or its combination photoresist is solidified on substrate.After photoresist is cured, pattern is formed device move apart photoresist, and pattern is stayed in the photoresist.
Term as used herein " radiation " and " beam " comprise all types of electromagnetic radiation, comprise ultraviolet (UV) radiation (for example have about 365,355,248,193,157 126nm or about 365,355,248,193,157 or the wavelength of 126nm) and extreme ultraviolet (EUV) radiation (for example having the wavelength of scope in 5-20nm) and as the particle beams of ion beam or electron beam.
In the place that situation allows, term " lens " can refer to any of various types of opticses or combination, comprises refractive optical components, reflection optics, magnetooptics parts, electromagnetism optics and electrostatic optics parts.
Though in the above specific embodiment of the present invention is described, will recognize, can implement the present invention with described different mode.For example, the form of computer program disclosed method, that comprise one or more sequence of machine-readable instruction above the present invention can adopt and describe perhaps adopts the form that such computer program is stored in data storage medium (for example semiconductor memory, disk or CD) wherein.
Top description is to be used for explanation rather than restriction.Thereby, it will be apparent to those skilled in the art that as long as the scope of the claims of being stated below not deviating from can be made amendment to described the present invention.
Claims (24)
1. displacement measurement system that is configured to measurement component with respect to the displacement of reference component comprises:
The first, second, third and the 4th target, each target are installed on the described reference component and are arranged and make the target surface of each target be arranged essentially parallel to reference field; And
The first, second, third and the 4th displacement transducer, each displacement transducer are arranged to measure the displacement of the appropriate section of described parts with respect to the target surface of respective objects;
Wherein said first and the triple motion sensor be configured to measure respectively along first and third part of the described parts of the direction that is arranged essentially parallel to the first direction that is positioned at described reference field with respect to described first and the displacement of the target surface of the 3rd target; And
The described second and the 4th displacement transducer is configured to measure respectively along the second and the 4th part of described parts of direction that is arranged essentially parallel to the second direction that is positioned at described reference field and is substantially perpendicular to described first direction with respect to described second and the displacement of the target surface of the 4th target.
2. lithographic equipment comprises:
First displacement measurement system according to claim 1, wherein said parts are the substrate tables that are constructed to support substrates, and wherein said first displacement measurement system is arranged at least design transfer is being measured the displacement of described substrate table with respect to reference component during the process of described substrate; And
Second displacement measurement system, be arranged to the described one or many of design transfer being carried out at least described substrate before the process of described substrate measure and the process checked during measure of the displacement of described substrate table with respect to described reference component, described second displacement measurement system comprises:
Five, the 6th, the 7th and the 8th target, each target are installed to described reference component and are arranged and make the target surface of each target be arranged essentially parallel to described reference field; And
The first, second, third and the 4th displacement transducer of described first displacement measurement system;
Wherein said first and the triple motion sensor be configured to measure respectively along the displacement of first and third part of the described substrate table of the direction that is arranged essentially parallel to described first direction with respect to the target surface of the 5th and the 7th target; And
The wherein said second and the 4th displacement transducer is configured to measure respectively along the displacement with respect to the target surface of the 6th and the 8th target of the second and the 4th part of the described substrate table of the direction that is arranged essentially parallel to described second direction.
3. lithographic equipment as claimed in claim 2, wherein arrange described first and second displacement measurement systems, make when described substrate table when described second displacement measurement system is measured described substrate table and is moved to described first displacement measurement system and measure described substrate table with respect to the design transfer position of the displacement of described reference component with respect to the gauge position of the displacement of described reference component, the described first, second, third and the 4th displacement transducer at least wherein three always can measure of the displacement of described substrate table with respect to the target surface of target.
4. lithographic equipment as claimed in claim 3 wherein arranges that at described substrate table described first and second displacement measurement systems make the right spacing of any displacement transducer on the moving direction of the described substrate table that is arranged essentially parallel to described reference field be different from the spacing on the described moving direction on a pair of border between the adjacent target that will be crossed over by described displacement transducer during moving on the moving direction respectively.
5. lithographic equipment as claimed in claim 2, also comprise one or more additional object, each additional object is installed on the described reference component between the target of described first and second displacement systems and is made each target surface of described one or more additional object be arranged essentially parallel to described reference field
Wherein arrange described lithographic equipment, make described substrate table during described second displacement measurement system is measured described substrate table and measured described substrate table with respect to the gauge position of the displacement of described reference component and described first displacement measurement system and move between with respect to the design transfer position of the displacement of described reference component, one of them appropriate section that is configured to measure described substrate table at least of the described first, second, third and the 4th displacement measurement sensor is with respect to one of them the displacement of target surface of described one or more additional object.
6. lithographic equipment as claimed in claim 2 also comprises:
Second substrate table, it is configured to support substrates, and
Five, the 6th, the 7th and the 8th displacement transducer, each displacement transducer is arranged to the appropriate section of measuring described second substrate table corresponding to the mode of described first, second, third and tetrameric measurement of described first substrate table by the described first, second, third and the 4th displacement transducer respectively with respect to described first, second, third and the displacement of the target surface of the 4th target, perhaps with respect to the displacement of the target surface of the 5th, the 6th, the 7th and the 8th target.
7. lithographic equipment as claimed in claim 2, also comprise the triple motion measuring system, it is arranged to measure described substrate table from described first displacement measurement system at described substrate table and moves to respect to the design transfer position of the displacement of described reference component substrate is measured the displacement of described substrate table with respect to described reference component during the substrate table of the unloading position of described substrate table removal returns mobile at least a portion.
8. lithographic equipment as claimed in claim 7, wherein said triple motion measuring system comprises that at least one substrate table returns target, and each substrate table returns target is installed to described reference component and is arranged the target surface that makes described at least one substrate table return target and be arranged essentially parallel to described reference field; And
The wherein said first, second, third and the 4th displacement measurement sensor is arranged and makes during the substrate table of described substrate table returns mobile at least a portion, and one of them appropriate section that can measure described substrate table at least of the described first, second, third and the 4th displacement measurement sensor is returned one of them the displacement of target surface of target with respect to described at least one substrate table.
9. lithographic equipment as claimed in claim 8, the wherein said first, second, third and the 4th displacement transducer one of them is configured to be convenient to measure along the displacement with respect to the target surface of target of the appropriate section of the described substrate table of the direction that is arranged essentially parallel to described first and second directions at least.
10. lithographic equipment as claimed in claim 7, the target of wherein said first and second displacement measurement systems is installed to and is made described first and second displacement measurement systems measure the displacement of described substrate table with respect to described mete-wand frame on the mete-wand frame, and described triple motion measuring system is measured the displacement of described substrate table with respect to the base of described lithographic equipment.
11. lithographic equipment as claimed in claim 10 also comprises position measuring system, it is constructed to return and measure the position of described substrate table with respect to described reference component after moving finishing described substrate table.
12. lithographic equipment as claimed in claim 11, wherein said position measuring system are arranged to measure the position of described substrate table with respect to described reference component when substrate is loaded onto described substrate table.
13. lithographic equipment as claimed in claim 7, wherein said first and second displacement measurement systems are configured to be convenient to than the displacement of the higher described substrate table of precision measure of described triple motion measuring system with respect to described reference component.
14. lithographic equipment as claimed in claim 2 also comprises first and second reference frames, each reference frame is installed to separately on the described reference component;
The wherein said first, second, third and the 4th target is installed on described first reference frame, and described the 5th, the 6th, the 7th and the 8th target is installed on described second reference frame.
15. lithographic equipment as claimed in claim 2, wherein said reference component are the mete-wand frames.
16. displacement measurement system as claimed in claim 1, wherein said first, second third and fourth displacement transducer one of them also is configured to measure along the displacement with respect to the respective objects surface of the appropriate section of the described parts of the direction that is arranged essentially parallel to third direction at least, described third direction is substantially perpendicular to described first and second directions.
17. lithographic equipment as claimed in claim 2, the wherein said first, second, third and the 4th displacement transducer one of them also is configured to measure along the appropriate section of the described substrate table of the direction that is arranged essentially parallel to third direction respectively with respect to the displacement on the surface of described the 5th, the 6th, the 7th and the 8th target at least, described third direction is substantially perpendicular to described first and second directions.
18. a lithographic equipment comprises:
Substrate table, it is constructed to support substrates;
First displacement measurement system, it is configured to design transfer is being measured the displacement of described substrate table with respect to reference component during the process of described substrate, and described first displacement measurement system comprises at least one target that is installed to described reference component and is configured to measure at least a portion of described substrate table at least one displacement transducer with respect to the displacement of described at least one target; And
Second displacement measurement system, it is configured at least to measure the displacement of described substrate table with respect to the base of described lithographic equipment during substrate table returns a mobile part, described substrate table return move described in substrate table can be from described design transfer to the position of described substrate being moved to the unloading position of substrate from described substrate table removal.
19. lithographic equipment as claimed in claim 18 wherein utilizes one or more vibration isolation supports described reference component to be installed to the base of described lithographic equipment.
20. lithographic equipment as claimed in claim 18 also comprises position measuring system, its be constructed to finish described substrate table return move after definite described substrate table with respect to the position of described reference component.
21. lithographic equipment as claimed in claim 20, wherein said position measuring system are arranged to measure the position of described substrate table with respect to described reference component when substrate is loaded onto described substrate table.
22. a method that is used for measurement component with respect to the displacement of reference component, described method comprises:
Utilize the first, second, third and the 4th displacement transducer to measure the displacement of the appropriate section of described parts with respect to the target surface of the first, second, third and the 4th target respectively, the described first, second, third and the 4th target is installed on the described reference component and is arranged and makes each target surface of the described first, second, third and the 4th target be arranged essentially parallel to reference field;
Wherein said first and the triple motion sensor measure respectively along first and third part of the described parts of the direction that is arranged essentially parallel to the first direction that is positioned at described reference field with respect to described first and the displacement of the target surface of the 3rd target; And
The wherein said second and the 4th displacement transducer is measured respectively along the second and the 4th part of described parts of direction that is arranged essentially parallel to the second direction that is positioned at described reference field and is substantially perpendicular to described first direction with respect to described second and the displacement of the target surface of the 4th target.
23. a device producing method, described method comprises:
Pattern is formed device from pattern transfer on the substrate, and
During transfer utilize as the method for claim 21 measure support as described in the displacement of substrate table of substrate.
24. a device producing method comprises:
Pattern is formed device from pattern transfer on the substrate, during transfer described substrate is supported on substrate table;
During described transfer, utilize displacement measurement system to measure of the displacement of described substrate table with respect to reference component, described displacement measurement system comprises at least one target and at least one displacement transducer that is installed to described reference component, and described at least one displacement transducer is configured to measure the displacement of at least a portion of described substrate table with respect to described at least one target; And
At least during substrate table returns a mobile part, measure of the displacement of described substrate table with respect to the base of described lithographic equipment, described substrate table return move described in substrate table from the position of described design transfer to described substrate moved to the position of described substrate from described removal.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/430,196 | 2006-05-09 | ||
| US11/430196 | 2006-05-09 | ||
| US11/430,196 US7483120B2 (en) | 2006-05-09 | 2006-05-09 | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
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| CN101071276A true CN101071276A (en) | 2007-11-14 |
| CN101071276B CN101071276B (en) | 2011-12-14 |
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| US (1) | US7483120B2 (en) |
| JP (1) | JP4660503B2 (en) |
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Cited By (10)
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| CN101733755A (en) * | 2008-11-07 | 2010-06-16 | 精工爱普生株式会社 | Robot system, robot control device and method for controlling robot |
| CN102269935A (en) * | 2010-06-07 | 2011-12-07 | Asml荷兰有限公司 | Displacement device, lithographic apparatus and positioning method |
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| DE102013220196A1 (en) | 2013-10-07 | 2015-04-09 | Dr. Johannes Heidenhain Gmbh | Optical position measuring device |
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| CN103644849B (en) * | 2013-12-12 | 2016-02-03 | 哈尔滨工业大学 | A kind of three dimensional grating displacement measurement system surveying vertical displacement |
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| TWI629475B (en) * | 2017-04-18 | 2018-07-11 | 財團法人工業技術研究院 | Contactless dual plane position method and device thereof |
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Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0447222A (en) | 1990-06-13 | 1992-02-17 | Olympus Optical Co Ltd | Highly accurate position comparator |
| DE4033556A1 (en) * | 1990-10-22 | 1992-04-23 | Suess Kg Karl | MEASURING ARRANGEMENT FOR X, Y, (PHI) COORDINATE TABLES |
| NL9100215A (en) | 1991-02-07 | 1992-09-01 | Asm Lithography Bv | Apparatus for the repetitive imaging of a mask pattern on a substrate. |
| JPH05129184A (en) * | 1991-10-30 | 1993-05-25 | Canon Inc | Projection aligner |
| JPH07270122A (en) | 1994-03-30 | 1995-10-20 | Canon Inc | Displacement detection device, aligner provided with said displacement detection device and manufacture of device |
| US5757507A (en) | 1995-11-20 | 1998-05-26 | International Business Machines Corporation | Method of measuring bias and edge overlay error for sub-0.5 micron ground rules |
| JPH09320921A (en) | 1996-05-24 | 1997-12-12 | Nikon Corp | Measuring method of base line quantity and projection aligner |
| DE69738910D1 (en) | 1996-11-28 | 2008-09-25 | Nikon Corp | ALIGNMENT DEVICE AND EXPOSURE METHOD |
| KR100512450B1 (en) | 1996-12-24 | 2006-01-27 | 에이에스엠엘 네델란즈 비.브이. | Two-dimensionally stabilized positioning device with two object holders and lithographic device with such positioning device |
| JPH10318791A (en) | 1997-05-14 | 1998-12-04 | Sony Precision Technol Inc | Scale device |
| JP2001118773A (en) | 1999-10-18 | 2001-04-27 | Nikon Corp | Stage device and exposure system |
| EP1111471B1 (en) | 1999-12-21 | 2005-11-23 | ASML Netherlands B.V. | Lithographic projection apparatus with collision preventing device |
| TWI231405B (en) * | 1999-12-22 | 2005-04-21 | Asml Netherlands Bv | Lithographic projection apparatus, position detection device, and method of manufacturing a device using a lithographic projection apparatus |
| US7289212B2 (en) | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
| JP2002289515A (en) | 2000-12-28 | 2002-10-04 | Nikon Corp | Method for manufacturing product, method for manufacturing aligner, aligner, and method for manufacturing device |
| US6665054B2 (en) | 2001-10-22 | 2003-12-16 | Nikon Corporation | Two stage method |
| US6781694B2 (en) | 2002-07-16 | 2004-08-24 | Mitutoyo Corporation | Two-dimensional scale structures and method usable in an absolute position transducer |
| TWI246114B (en) * | 2002-09-24 | 2005-12-21 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| JP4362862B2 (en) | 2003-04-01 | 2009-11-11 | 株式会社ニコン | Stage apparatus and exposure apparatus |
| JP4071733B2 (en) * | 2003-04-17 | 2008-04-02 | エーエスエムエル ネザーランズ ビー．ブイ． | Lithographic apparatus, device manufacturing method, and computer program |
| EP1624481A4 (en) | 2003-05-15 | 2008-01-30 | Nikon Corp | Exposure apparatus and method for manufacturing device |
| EP1486827B1 (en) | 2003-06-11 | 2011-11-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE602004024782D1 (en) | 2003-06-19 | 2010-02-04 | Nippon Kogaku Kk | EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD |
| EP1510870A1 (en) | 2003-08-29 | 2005-03-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US6977713B2 (en) * | 2003-12-08 | 2005-12-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4586367B2 (en) * | 2004-01-14 | 2010-11-24 | 株式会社ニコン | Stage apparatus and exposure apparatus |
| US7102729B2 (en) | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
| GB0403576D0 (en) | 2004-02-18 | 2004-03-24 | Prior Scient Instr Ltd | Stage apparatus |
| US7161659B2 (en) | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
| US7515281B2 (en) * | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2006
- 2006-05-09 US US11/430,196 patent/US7483120B2/en active Active
-
2007
- 2007-05-02 JP JP2007121336A patent/JP4660503B2/en active Active
- 2007-05-02 TW TW096115612A patent/TWI328720B/en active
- 2007-05-08 CN CN200710102990XA patent/CN101071276B/en active Active
- 2007-05-08 KR KR1020070044531A patent/KR100901476B1/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20070109871A (en) | 2007-11-15 |
| JP4660503B2 (en) | 2011-03-30 |
| TW200801859A (en) | 2008-01-01 |
| US20070263197A1 (en) | 2007-11-15 |
| US7483120B2 (en) | 2009-01-27 |
| JP2007318119A (en) | 2007-12-06 |
| TWI328720B (en) | 2010-08-11 |
| KR100901476B1 (en) | 2009-06-08 |
| CN101071276B (en) | 2011-12-14 |
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