CN101068008A - CPU radiator - Google Patents
CPU radiator Download PDFInfo
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- CN101068008A CN101068008A CN 200710074565 CN200710074565A CN101068008A CN 101068008 A CN101068008 A CN 101068008A CN 200710074565 CN200710074565 CN 200710074565 CN 200710074565 A CN200710074565 A CN 200710074565A CN 101068008 A CN101068008 A CN 101068008A
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- heat
- absorbing block
- fin
- fan
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- 238000001704 evaporation Methods 0.000 claims abstract description 29
- 230000008020 evaporation Effects 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000009833 condensation Methods 0.000 claims description 16
- 230000005494 condensation Effects 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 230000003416 augmentation Effects 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 238000009423 ventilation Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- RSMUVYRMZCOLBH-UHFFFAOYSA-N metsulfuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)NC1=NC(C)=NC(OC)=N1 RSMUVYRMZCOLBH-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This invention relates to a radiator applying thermal L shaped tubes, in which, the rib plates are in a convection intensified heat-conduction structure to reduce size of radiators, a high wind pressure centrifugal fan or a multi-stage axial fan is applied to increase wind volume and radiating volume. This invention improves the match of decalescence block and evaporation section to reduce cost of material and production.
Description
Affiliated technical field
The present invention relates to the dissipation from electronic devices technology, especially adopt heat pipe principle, main by heat-absorbing block, heat pipe with fin and fan radiator that form, that be used to cool off CPU.
Background technology
Along with the increase of semiconductor integrated circuit number of transistors, the caloric value of device is also along with increase.The heating of current CPU chip of computer and heat dissipation problem have become the obstacle in the computer evolution, and the radiator that simple aluminium base fin adds fan structure has not satisfied requirement, and heat-pipe type radiator has all generally been adopted by the desktop cpu radiator.
The basic problem of desktop cpu radiator has at present: size is huge, and heaviness, heat dissipation capacity are not high, the price height.Volume as the V-NARDO of Asus radiator is 90 (L) * 98 (W) * 101 (H) mm, net weight 0.52Kg, and price is up to more than 400 yuan of RMB.These problems have hindered heat-pipe type radiator and have used widely in desktop computer.The generation of these problems is that manufacturing processing technic, operation are more unreasonable, poor efficiency, cost height because design is unreasonable, and it is unintelligible to show heat transfer theory.
In all diabatic processes of radiator, cross-ventilation heat transfer resistance maximum, existing radiator increases the size and the quantity of fin simply, hope improves heat dissipation capacity by increasing radiating surface, so not only increased the volume of radiator, also increased the cost cost, and therefore heat dissipation capacity is effectively improved not, also can reduce on the contrary sometimes, this be because, area of dissipation increases, and the flow through resistance of fin of air also increases, thereby causes air mass flow to descend, the air themperature of the feasible fin of flowing through improves, the mean temperature of radiator and the temperature difference of condensation segment tube wall of flowing through descends, and also has fin efficiency to descend, and so just influenced the cross-ventilation heat-transfer effect.
For fan used in the computer CPU radiator all is mini-fan, and blast is very low, as 70 * 70mm, and the aerofoil fan of thick 20mm, the non-resistance maximum quantity of wind when rotating speed is 3000RPM is 0.7m
3/ min, blast are the 2.5mm water column, when fin density and area is big, when resistance is big, air quantity will descend rapidly.By increasing fan dimension and air heat exchanger circulation area, solve the problem of air quantity, area of dissipation, consequently heat sink size is huge, and cost improves.Because the installation dimension area of radiator is limited on the computer main board, in order to satisfy installation requirement, has generally adopted U type heat pipe, heat pipe is bent into the U type, distance between condensation segment and the evaporation section, this heat conduction in the heat pipe, and also the cost of heat pipe has also improved.
Also have the heat transfer between evaporation section and the heat-absorbing block to get the brush-off,, need copper material as adopting soldering, heat-absorbing block cost height not only, evaporation section has only the heating surface area of half; Adopt up and down that piece compresses, owing between the piece slit is arranged up and down, thereby also have only the contact area with following piece just to work, do not bring into play the interior evaporating surface of whole evaporation section.
Summary of the invention
The invention provides a kind of heat-pipe type radiator, strengthen the cross-ventilation heat exchange, reduce cross-ventilation heat exchanger (fin part) size, adopt high blast fan, overcome the high windage that the air heat exchanger densification brings, improve air quantity, improve heat dissipation capacity, optimize the structure of entire radiator, make it compact, small and exquisite, the cost cost also reduces, and reduces the installation dimension of radiator on mainboard, is convenient to various computer main boards and installs.
The technical solution adopted in the present invention is: the main parts of radiator have: heat-absorbing block, heat pipe, fin and fan.Fin is a nest plate type, and fin is arranged on the condensation segment of heat pipe, and the evaporation section of heat pipe is fastened on the heat-absorbing block, this is similar with existing heat-pipe type radiator, and the invention is characterized in: suction pipe becomes the L type, and an end is a condensation segment, the other end is an evaporation section, becomes 80 °～hexagonal angle between condensation segment and the evaporation section; Heat-absorbing block adopts aluminum or aluminum alloy to make, and the embedding hole is arranged, and the evaporation section of heat pipe is embedded in the embedding hole; Fin has adopted short rib shape or waveform augmentation of heat transfer structure, or a pitch of fins is 0.7 to 1.5mm dull and stereotyped rib; Fan has adopted centrifugal fan, or the movable vane switched in opposite of adjacent two-stage or between be provided with the multistage axial flow formula fan of directing vane.
Existing desktop computer, mainboard all is vertical placement, and the radiating surface of cpu chip is also just vertical, and the heat-absorbing block of radiator is also just vertical to be placed.Radiator of the present invention, the evaporation section of installation requirement heat pipe is vertical, and condensation segment is last, and like this at heat pipe bending section and evaporation section, liquid refrigerant refluxes and can utilize action of gravity maximumly in the heat pipe.When the angle of evaporation section and condensation segment during greater than 90 °, liquid refrigerant refluxes and can utilize action of gravity in the condensation segment; When both angles during less than 90 °, the siphon power that liquid refrigerant refluxes and must rely on the capillary pipe structure in the pipe to produce in the heat pipe condenser section, angle is more little, siphon pressure reduction requires big more, is unfavorable for heat conduction in the heat pipe, simultaneously, space utilization is not compact, and the present invention gets angle and is not less than 80 °.For utilizing action of gravity to reflux as far as possible, should get angle during design greater than 90 °, but angle is too big, overall dimensions strengthens, and structure is not compact, and the air heat exchanger of inclination may produce interference with other element or the parts on the mainboard, generally get 100 °～110 ° for good, maximum is no more than 120 °.If chip level is placed, heat pipe evaporator section level then, condensation segment is established, and heat pipe is in the gravity reflux state fully.
Though fine copper is higher nearly 1.7 times than fine aluminium conductive coefficient, for the heat conduction in the heat-absorbing block, the heat-absorbing block that copper material and aluminium are made is significantly difference not.But the weight of copper is 3.2 times of aluminium, and the price of Unit Weight copper is more expensive more than 2 times than aluminium, thereby heat-absorbing block made of copper than the material cost of aluminum how nearly 6 times.In addition, aluminium machine-shaping is much easier, adopt extrusion process, extrude into the cross section rectangular section bar consistent (the embedding hole is extrusion forming just), cut into Pork-piecesly again, do processing slightly and then become heat-absorbing block with heat-absorbing block, such manufacturing efficient height, thereby adopt aluminium to make heat-absorbing block, not only cost of material is low, and processing charges is also low.
Short rib shape augmentation of heat transfer structure, it is the most effective structure of fin cross-ventilation augmentation of heat transfer, divide fork row short rib shape and shutter short rib shape are arranged, its essential characteristic is: the surface that air is flowed through is die-cut into a section discontinuous surface, air whenever flow through one section (short rib), boundary layer on it all is in the The initial segment in boundary layer, makes whole heat convection surface make full use of the favourable characteristics that the boundary layer The initial segment is thin, thermal resistance is little, heat exchange coefficient is high.
Waveform configuration, its augmentation of heat transfer principle is: on air-flow direction, fin is processed to waveform, and air can form vortex when flowing through the concave surface of waved surface, can form the fluid break-off in some areas at the convex surface place in downstream, these phenomenons can both make the raising that strengthened of conducting heat.
Also must think better of this parameter of a pitch of fins between the fin in the air heat exchanger design, according to experimental study, the cross-ventilation heat exchange coefficient is directly proportional with roughly 0.7 power of a pitch of fins, that is to say that reducing a pitch of fins not only can increase fin quantity, be heat exchange area, can also greatly improve the cross-ventilation heat exchange coefficient.A best pitch of fins should be lower than 1 millimeter, but also will consider other factors in actual design.For dull and stereotyped fin, a pitch of fins should be not more than 1.5 millimeters, considers production technology, and the hazards of dust gathering pollution, and a pitch of fins should be less than 0.7 millimeter.For the fin that has adopted waveform and short rib shape augmentation of heat transfer structure, a pitch of fins should be not less than 0.7, is not more than 2.0 millimeters, and the width of short rib is in 2.0 millimeter.
Fin is encrypted, and adopts enhanced heat exchange structure, has improved air flow resistance widely.Single-stage axial fan blast deficiency does not overcome the air flow resistance of fin, causes air quantity sharply to descend, and has not satisfied requirement.Centrifugal fan, the blast height can satisfy above requirement.The single-stage axial fan is not all right, can adopt multistage, but can not be superimposed showing two or more tube-axial fans simply, effect is very low like this.Because air through the one-level fan, is driven by electric fan (this is called movable vane), axial velocity is arranged, also have circumferential speed, become helical flow, identical if the back force one wind agitates leaf to turn to, then further increase circumferential speed, promptly increased helical flow, helical flow is unfavorable for improving blast, air quantity.If between the two-stage movable vane, directing vane is set, the air directing vane of flowing through, circumferential speed is eliminated, the partial velocity kinetic energy of air converts pressure potential to, air-flow direction is more suitable for the angle of attack of the relative air of back one-level movable vane, the structure of directing vane is set between this two adjacent movable vanes, is the normal structure of multistage axial flow formula blower fan, air compressor machine.Adopt another kind of structure, two successive stages movable vane switched in opposite, back one-level movable vane not only plays a part further driving air, provides kinetic energy to air, also play a part directing vane, diffusion converts kinetic energy to pressure potential, eliminates circumferential speed and helical flow and increases, effectively improve blast, the air quantity of fan, help improving heat dissipation capacity.
In sum, the present invention will make the heat spreader structures compactness, and volume is small and exquisite, and erection space reduces, and material cost and manufacturing cost descend, and heat dissipation capacity effectively improves.
The present invention is further described below in conjunction with drawings and Examples.
Description of drawings
Fig. 1, the 3rd, feature profile schematic diagram of the present invention.
Fig. 2,4, the 5th, heat-absorbing block cross section characteristic generalized section.
Fig. 6 is a nest plate type structural gap heat exchanger characteristics generalized section.
Fig. 7 is the feature schematic diagram of fork row short rib shape augmentation of heat transfer structure fin.
Fig. 8 is an A-A cutaway view among Fig. 7.
Fig. 9 is the feature schematic diagram of shutter short rib shape augmentation of heat transfer structure fin.
Figure 10 is a B-B cutaway view among Fig. 9.
Figure 11 is the feature profile schematic diagram of waveform augmentation of heat transfer structure fin.
Among the figure, 1, heat-absorbing block, 2, heat pipe, 3, condensation segment, 4, fin, 5, fan, 6, evaporation section, 7, the embedding hole, 8, directing vane, 9, movable vane, 10, sole piece, 11, briquetting.
Embodiment
Radiator shown in Figure 1, fan (5) is a centrifugal fan, and heat pipe (2) is bent into the L type, and condensation segment (3) and evaporation section (6) are at an angle of 90.Fig. 2 shows the cross-sectional view of its heat-absorbing block (1), and the evaporation section (6) of heat pipe (2) is embedded in the embedding hole (7) of heat-absorbing block (1).To reduce the distance between evaporation section (6) and the condensation segment (3) during design as far as possible, only be the distance of the bending section of heat pipe (1) among the figure, so not only can improve the heat transfer rate in the heat pipe, all right shortening heat length of tube, promptly reduce cost, reduce heat sink size.Pipe inner capillary tube structure sheaf is the heat pipe of copper powder sinter molding, and minimum bending radius is restricted, and is to being three times in the heat pipe diameter, too big greatly, for shortening the distance between evaporation section and the condensation segment, on the bending section of heat pipe fin can be set partly.
Radiator shown in Figure 3, fan (5) are multistage (two-stage) tube-axial fan, are provided with directing vane (8) between the two-stage movable vane (9).Fig. 4 shows the cross section of its heat-absorbing block (1), and embedding hole (7) have a breach, open the back side at heat-absorbing block, and the embedding aperture aberration has two lips, and breach is embedded in the inside as lip with the heat pipe evaporator section bag.This structure has made things convenient for the quick assembling of heat pipe evaporator section and heat-absorbing block, the embedding hole (7) that preceding operation (extrusion process) is made is bigger slightly than the diameter of evaporation section, be convenient to heat pipe evaporator section and insert heat-absorbing block embedding hole, adopt a wedge workpiece to be pressed on two lips in embedding hole, exert pressure, make the two lips distortion of embedding hole, the breach kerf spacing reduces, the effect of breach is just at this, the embedding hole dwindles, heat pipe evaporator section is subjected to radial compression, can make evaporation section border and heat-absorbing block contact matching even like this, solves the contact heat resistance problem between them effectively.If scribble heat-conducting cream during plug-in mounting, then thermal contact conductance is more reliable.The area that evaporation section is big is as far as possible lived by the embedding of heat-absorbing block bag, helps the heat transfer between heat-absorbing block and the evaporation section, brings into play all evapn heat-transfer area in the evaporation section effectively.
Fig. 5 shows another kind of heat-absorbing block structure, heat-absorbing block is made of two kinds of parts, sole piece (10) and briquetting (11), faying face has between the two adopted the concavo-convex structure that matches, and the embedding hole (7) that sole piece (10) and briquetting (11) cooperate the back to constitute is littler than heat pipe evaporation section, and it is preceding to press-fit briquetting (11), evaporation section can insert at an easy rate, after press-fiting briquetting (11), the evaporation section border is closely wrapped to be embedded in the heat-absorbing block, has solved contact heat resistance problem therebetween reliably.The effect of concavo-convex faying face, it is the contact heat resistance problem that solves between sole piece (10) and the briquetting (11), be processed with tolerance owing to make, can not guarantee heat pipe evaporator section and sole piece (10) and close-fitting while of briquetting (11), guarantee the tight contact of top and bottom between sole piece (10) and the briquetting (11) again, have the contact heat resistance problem.Adopt the concaveconvex structure faying face, concavo-convex is tight fit, just guarantees that concavo-convex side closely contacts, and the heat of sole piece (10) passes on the briquetting (11) by concavo-convex side, has so just solved contact heat resistance problem therebetween.
Fig. 6 shows the nest plate type structure, and flange and condenser pipe (3) transmission of heat by contact of fin (4) by the fin root has the problem of contact heat resistance here, addressed this problem two kinds of technologies: one, weld two, expand tube.When having only fin and condenser pipe all to be copper material, just be fit to adopt soldering.Expansion tube process is a kind of simple, efficient is high, cost is low technology, in producing, generally adopt many other products, as the air heat exchanger in the air-conditioning (condenser, evaporator), and be not subjected to materials limitations, thereby reduced the manufacturing process cost and the cost of raw material.
In order to be fit to existing various computer main boards, be convenient to install, and satisfy condensation segment and fin requirement up, radiator installation dimension maximum is not greater than 80 * 80mm, preferably get 70 * 70mm, the length of fin does not surpass 70mm like this, and it is 6mm that heat pipe is selected diameter for use, and the centre distance between the heat pipe should be at 18～24mm.Getting centre-to-centre spacing is 23mm, then uses three pipes, and fin is long to be 69mm, the wide 14mm that gets of fin, pitch of fins 1.0mm.The high 70mm of air heat exchanger, then the cross-ventilation heat exchange area is 0.14m
2, adopting fork row short rib shape fin, wind speed reaches 2m/s, and the cross-ventilation heat exchange coefficient can reach 100W/m
2℃, the temperature difference of air heat exchanger needs only 10 ℃, and heat dissipation capacity just reaches 140W.
Claims (4)
1, a kind of radiator that is used to cool off CPU, include: heat-absorbing block (1), heat pipe (2), fin (4) and fan (5), fin (4) is a nest plate type, fin (4) is arranged on the condensation segment (3) of heat pipe (2), the evaporation section (6) of heat pipe (2) is fastened on the heat-absorbing block (1), it is characterized in that: heat pipe (2) becomes the L type, becomes 80 °～hexagonal angle between evaporation section (6) and the condensation segment (3); Heat-absorbing block (1) adopts aluminum or aluminum alloy to make, and embedding hole (7) is arranged; Fin (4) has adopted short rib shape or waveform augmentation of heat transfer structure, or a pitch of fins is the dull and stereotyped rib of 0.7mm to 1.5mm; Fan (5) has adopted centrifugal fan, or the movable vane of adjacent two-stage (9) switched in opposite or between be provided with the multistage axial flow formula fan of directing vane (8).
2, radiator according to claim 1 is characterized in that: embedding hole (7) the band breach in the heat-absorbing block (1), open at heat-absorbing block (1) back side; Extruding radial distortion shrinkage cavity technology has been adopted in assembling between evaporation section (6) and the heat-absorbing block (1).
3, radiator according to claim 1 is characterized in that: heat-absorbing block (1) is made of a sole piece (10) and one or more briquetting (11), and the faying face between sole piece (10) and the briquetting (11) has adopted the concavo-convex structure that matches.
4, according to claim 2 or 3 described radiators, it is characterized in that: extrusion process has been adopted in the manufacturing of heat-absorbing block (1), and embedding hole (7) are formed by extrusion process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710074565 CN101068008A (en) | 2007-05-25 | 2007-05-25 | CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710074565 CN101068008A (en) | 2007-05-25 | 2007-05-25 | CPU radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101068008A true CN101068008A (en) | 2007-11-07 |
Family
ID=38880504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710074565 Pending CN101068008A (en) | 2007-05-25 | 2007-05-25 | CPU radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101068008A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101510533A (en) * | 2009-03-24 | 2009-08-19 | 赵耀华 | Novel microelectronic device radiator |
| CN101655656B (en) * | 2008-08-20 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN102052718A (en) * | 2009-11-06 | 2011-05-11 | 苏州海派特热能设备有限公司 | Split heat pipe heat exchanger for machine room |
| CN114760813A (en) * | 2022-04-01 | 2022-07-15 | 乐山希尔电子股份有限公司 | Heat dissipation method of electronic integrated module |
| CN116294301A (en) * | 2022-12-05 | 2023-06-23 | 大连理工大学 | Pump-assisted capillary force-driven two-phase fluid thermal management system |
-
2007
- 2007-05-25 CN CN 200710074565 patent/CN101068008A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101655656B (en) * | 2008-08-20 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| US8087788B2 (en) | 2008-08-20 | 2012-01-03 | Hon Hai Precision Co., Ltd. | Projector with cooling configuration |
| CN101510533A (en) * | 2009-03-24 | 2009-08-19 | 赵耀华 | Novel microelectronic device radiator |
| CN101510533B (en) * | 2009-03-24 | 2011-06-15 | 赵耀华 | Novel microelectronic device radiator |
| CN102052718A (en) * | 2009-11-06 | 2011-05-11 | 苏州海派特热能设备有限公司 | Split heat pipe heat exchanger for machine room |
| CN114760813A (en) * | 2022-04-01 | 2022-07-15 | 乐山希尔电子股份有限公司 | Heat dissipation method of electronic integrated module |
| CN116294301A (en) * | 2022-12-05 | 2023-06-23 | 大连理工大学 | Pump-assisted capillary force-driven two-phase fluid thermal management system |
| CN116294301B (en) * | 2022-12-05 | 2024-05-03 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid thermal management system |
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Open date: 20071107 |