CN101045988A - Production apparatus for surface modification of metal plate and band - Google Patents
Production apparatus for surface modification of metal plate and band Download PDFInfo
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- CN101045988A CN101045988A CN 200610020606 CN200610020606A CN101045988A CN 101045988 A CN101045988 A CN 101045988A CN 200610020606 CN200610020606 CN 200610020606 CN 200610020606 A CN200610020606 A CN 200610020606A CN 101045988 A CN101045988 A CN 101045988A
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Abstract
The production apparatus for surface modification of metal plate and band includes one vacuum case, one vacuum group, one metal plate and band unwinding and winding mechanism, at least one electronic gun for heating to evaporate metal material, and one plasma unit to ionize metal vapor into metal ion. The linear electronic gun evaporates the metal material to form metal vapor, the metal vapor is ionized in the high density plasma area to form metal ion, and the metal ion under the action of electric field force is deposited fast onto metal plate or band applied with negative bias, so as to form new metal layer with great binding force and reach the aim of modifying the metal material. The production apparatus has great production capacity and low cost, and modified surface has compact micro structure and is smooth.
Description
Technical field:
The present invention relates to a kind of production unit of surface modification of metal plate and band, a kind ofly metallic vapor is not had the ionization of arc spot method plasma body become behind the metal ion particularly at the production unit that deposits to rapidly under the effect of electric field on the metal plate and belt that is modified.
Background technology:
Vacuum-evaporation winding film plating production unit is a very sophisticated vacuum coating film equipment, all was used to utilize crucible evaporation aluminium in the past, plates the layer of aluminum film fast on plastics film or paper, is used for industries such as electric smelting device, packing.Developed into afterwards with electron beam gun rapid evaporation metallic substance, and made metal vapor deposition on metal plate and belt, be used for rotproofing metal plate and belt.Because the deposition of evaporation plating only depends on hot kinetic energy, its bound energy only is the several electrons volt, and the coatings quality does not reach higher anti-anticorrosion and anti abrasive modification function.
At the beginning of the eighties in last century, ion-plating technique has appearred, be typically and adopt the vacuum cathode arc (to be commonly called as multi-arc ion coating, on the meaning of strictness, being called multi sphere is not enough science, but people have been accustomed to this call) ion beam coating equipment, the metallics that it can evaporate arc is under the effect of plasma body, be ionized into metal ion, its ionization level can reach more than 60%.When the metal base that is modified had certain negative bias, metal ion deposited to the metallic surface fast under effect of electric field, and its bound energy can reach up to a hundred ev, thereby can reach the purpose to material modification.For example use this method (as drill bit, milling cutter, pinion cutter etc.) on various speedy steel cutting-tools to plate one deck titanium or nickel, thickness 2～4 μ can make and improve several times to tens times (look different cutter with technology and different) in work-ing life in its.Adopt this method to have two main shortcomings: the one, the filming equipment of this vacuum cathode arc can fly out a spot of " drop " when " ablate metals material ", causes the defective of quality product.In order to overcome this shortcoming, the vacuum cathode arc ion beam coating equipment that the employing that has adds a magnetic deflection filter type has only by the metal ion of ionization to be deflected the arrival substrate surface, and " drop " then can't pass through divertor, thereby improves the quality of product.As foreign patent: US 5997705, US 6350356; The method of the employing magnetron sputtering that also has, can sputter the good metallics of homogeneity (but sputter rate is than low many of the vaporator rate of Vacuum Arc), the screen electric arc that adopts configuration to cover the entire target area comes the ionization metallics again, reaches the effect of ion plating, as patent: CN2700341Y.Another shortcoming of this method is sedimentation rate lower (evaporation plating relatively), and the sedimentation rate that can reach 1 μ m/min has been goodish result.
The most advanced technology that the metal plate and belt modification is adopted is at present: utilize electron beam gun two-forty evaporated metal material to form steam, the plasma body that utilizes the whole bag of tricks to produce then is ionized into ion with metallic vapor, under effect of electric field, the metal ion fast deposition is to the metallic substrate surface that is modified, form new functional metallic membrane, reach the purpose of ion film plating modification, and the method that plasma body forms has varied, for example: hollow cathode arc method (Hollwcathode arc), rod cathode arc method (Rod cathode arc), microwave method (Microwave), ionic fluid method (Ionbeam), magnetic controlled plasma methods (Magnetron Plasma) etc. all are the ten minutes proven technique.But these methods all must have a cover to produce the equipment of plasma body, and except forming the increase of complex structure and cost, its ionization probability to metallic vapor neither be very desirable, reaches 50% at most.
Summary of the invention:
The objective of the invention is in order to overcome above deficiency, thereby provide a kind of output height, cost is low, metal ion is deposited on the metal plate and belt fast, form the very strong new metal level of bonding force reaches production unit to the surface modification of metal plate and band of metal plate and belt modification purpose under effect of electric field.
The object of the present invention is achieved like this:
The production unit of surface modification of metal plate and band of the present invention, comprise at least one of vacuum chamber, vacuum suction unit, metal plate and belt unwinding and rewinding mechanism, heating evaporation metallic substance, be provided with the plasma body that metallic vapor is ionized into metal ion around the metallic vapor between metal plate and belt and metallic substance electron beam gun.Adopt the various metallic substance of electron beam gun rapid evaporation, the metallic vapor that is evaporated out is become metal ion by the gas ions ionization, under effect of electric field, deposit on the metal plate and belt that is modified rapidly then, realized the modification of metal plate and belt is handled, adopt the electron gun evaporation metallic substance, the ion-plating technique that utilizes plasma body that the metallic vapor ionization is formed again is higher tens times than the sedimentation rate that adopts vacuum cathode arc ion film plating.Therefore can reach high yield, low cost with this equipment, and with the modified surface compact micro structure of this equipment acquisition, surface smoothing.
The production unit of above-mentioned surface modification of metal plate and band, the electron beam gun of heating evaporation metallic substance and etching metal plate and belt is linear electron beam gun, adopt linear electron beam gun to come the structure of evaporated metal material, it is many electron beam gun or single structure that electron beam gun is adopted the scan mode evaporated metal to have substituted traditional usefulness, make flow of metal vapors more even in the metal plate and belt width range that is modified, available two electron beam gun evaporate the metallic substance in the crucible or a metal bar simultaneously, also can evaporate the metallic substance in two crucibles or two metal bars respectively.
The production unit of above-mentioned surface modification of metal plate and band, plasma body is the hollow anode of a closure, form the plasma body of no arc spot, the deflection beam of electron beam gun emission passes the metal material surface that the plasma body center arrives evaporation, during the sub-beam evaporation metallic substance of the forceful electric power that utilizes electron beam gun to send, there is 10% energy can produce the radiation of light and form plasma body approximately, utilize this plasma body incoming call from metallic vapor, be called as no arc spot and excite sedimentation, the feature that adopts no arc spot to intensify sedimentary structure is to be provided with the hollow anode that metallic vapor is ionized into a closure of metal ion around metallic vapor, form the plasma body of no arc spot, this equipment can make the ionization level of metallic vapor up to 60%, because plasma electrode is the structure of rectangle or the hollow shaped as frames of closed loop such as annular or runway shape, the positively charged position, and metallic substance all is a negative potential with the base material that is modified, therefore electronics is vibration back and forth between metallic substance and modification base material at this spatial movement locus, just absorbed when last energy is very low by the anode of the shaped as frame of hollow closed loop, this has just increased the electronic motion distance very significantly, therefore the probability of collision of electronics and metallic vapor improves greatly, makes the specific ionization of metallic vapor improve greatly.Electron beam gun ejected electron bundle is to pass plasma slab to enter the evaporation of metal material, this electron beam and metallic vapor have certain probability of collision, make metallic vapor ionization, produce low-velocity electron, the same generation vibration in this electric field structure of this electronics adds in the ionizing event of plasma body.By the electron beam evaporation metallic vapor, there is nearly 10% energy to be absorbed and produces optical radiation by the metallic vapor place, form plasma body, play the effect of ionized metal particle again equally, these three just constitute this production unit structure and have higher ionization probability.This production unit structure is not introduced the equipment that forms plasma body simultaneously, can not produce arc discharge, therefore is no arc spot.
The production unit of above-mentioned surface modification of metal plate and band, metallic substance are at least one chromium matter bars, to metal plate and belt chrome-faced modification, improve metal plate and belt surface hardness and antiseptic power.Also compare because of formation chromium coating on sheet metal strip that adopts aforesaid method energy economy and the electrodeposited chromium layers that plating, chemical plating method promptly consume energy and serious environment pollution obtains that matter is close and the past is traditional, very significantly economic benefit and social benefit are arranged, energy-conservation reaching more than 70%, thoroughly stopping the chromium heavy metal has and 2/3rds enters atmosphere and water surrounding, causes environmental pollution, is the economy technology and the equipment outlet of environmental protection again for metallic substance chromium plating (Cr) searches out one.
The production unit of above-mentioned surface modification of metal plate and band, metallic substance are the rotatable columniform metal bars of being convenient to water flowing refrigerative hollow structure that has.
The production unit of above-mentioned surface modification of metal plate and band, the vacuum chamber inner-wall spraying has polytetrafluorethylecoatings coatings, to reduce the adhesion of metallic vapor to the vacuum chamber inwall, prevent that adherent clipped wire slag from dropping to the metal plate and belt surface and influencing coating quality, simultaneously when the remetal roll coil of strip, can conveniently clean the vacuum chamber inwall, prevent in vacuum chamber inwall slagging scorification fouling.
The production unit of above-mentioned surface modification of metal plate and band, the vacuum chamber body wall has the sandwich structure of logical water coolant.The production unit of above-mentioned surface modification of metal plate and band, vacuum chamber be provided with make metal ion on the metal plate and belt substrate surface, carry out chemical reaction, form compound modified layer reactant gases charge into mechanism.Send into reactant gases from supplying gas into mouth mechanism, then can the realization response plated film, for example plate compound layers such as TiN, TiC, CrO2, CrN.
The production unit of above-mentioned surface modification of metal plate and band is provided with one at least to the metal plate and belt heating unit in the vacuum chamber.After the heating of metal plate and belt surface, can improve metal plate and belt surface and metal ion bonding strength and production rate, improve the product coating quality.
The production unit of above-mentioned surface modification of metal plate and band has the crucible of depositing metallic substance.
The production unit of above-mentioned surface modification of metal plate and band, the metal plate and belt base material that is modified has certain negative bias, and its value is 0～-150V is adjustable.When the metal plate and belt that is modified has certain negative bias (or ground connection), because the plasma electrode positively charged position of rectangle hollow basket structure, and metallic substance all is a negative potential with the metal plate and belt that is modified, therefore electronics is vibration back and forth between metallic substance and modification base material at this spatial movement locus, just absorbed when last energy is very low by the anode of hollow, this has just increased the electronic motion distance very significantly, therefore the probability of collision of electronics and metallic vapor improves greatly, makes the specific ionization of metallic vapor improve greatly.
The production unit of above-mentioned surface modification of metal plate and band, metal plate and belt are provided with and adopt linear electron beam gun the metal plate and belt surface to be carried out the metal plate and belt wiper mechanism of etching activation treatment before modification.Adopt the etching pre-treatment structure of line style electron beam gun as metal plate and belt, the degree of depth of etching in the time of can controlling the metal plate and belt pre-treatment by the power of regulating electron beam gun, and accomplish with plated film requirement speed synchronous, metal plate and belt is after etching is cleaned, can improve metal plate and belt surface and metal ion bonding strength, improve the product coating quality.Simultaneously, also improved the metal plate and belt surface temperature during to metal plate and belt pre-treatment etching, can reduce metal plate and belt heating unit power.
The production unit of above-mentioned surface modification of metal plate and band, metal plate and belt are provided with ion source mechanism carries out the etching activation treatment to the metal plate and belt surface ion source wiper mechanism before modification.
Production unit of the present invention is to metal plate and belt plating metal on surface layer, particularly chromium plating (Cr), with traditional electroplating chemical chromium plating (Cr) energy consumption height (electroplate energy benefit only 10-20%), (chromium only has 1/3rd plated with gold to belong to the strip surface to serious environment pollution in the electroplate liquid, two of its excess-three branch enters atmosphere and water surrounding) technology carried out the essence change, for metallic substance chromium plating (Cr) search out one be economy again environmental protection technology and the equipment outlet.Thereby the invention provides that a kind of output height, cost are low, metal ion is deposited on the metal plate and belt fast under effect of electric field, form the very strong new metal level of bonding force and reach production unit the surface modification of metal plate and band of metal plate and belt modification purpose, the metal plate and belt modified surface compact micro structure that this device fabrication obtains, surface smoothing.
Description of drawings:
Fig. 1 is a production equipment structural representation of the present invention.
Fig. 2 be among Fig. 1 A to view.
Production equipment perspective view of the present invention when Fig. 3 is the remetal roll coil of strip.
Fig. 4 is production equipment metal ionization of the present invention mechanism partial enlarged drawing.
Fig. 5 be among Fig. 4 B to view.
Fig. 6 is linear electron gun evaporation metallic substance, usefulness plasma body ionization metallics plated film synoptic diagram for production equipment of the present invention adopts.
Fig. 7 places the metallic substance synoptic diagram for production equipment of the present invention adopts crucible.
Fig. 8 be among Fig. 7 C to view.
Fig. 9 is the rotatable columniform metal bar synoptic diagram of being convenient to water flowing refrigerative hollow structure that has for production equipment of the present invention adopts.
Embodiment:
Embodiment 1:
Fig. 1～Fig. 6 has provided the embodiment of the invention 1 figure.Referring to Fig. 1～Fig. 6, the vacuum chamber 1 that sandwich structure 2 with logical water coolant is arranged in apparatus of the present invention, vacuum suction unit 3, metal plate and belt unreeling structure 4, metal plate and belt rolling-up mechanism 5, two electron beam gun 6 of heating evaporation metallic substance, be provided with plasma body positive electrode 11 around the metallic vapor 9 between metal plate and belt 7 and metallic substance 8, the well heater 25 of heating of metal strip 7, the intensive plasma body 18 that produces is ionized into metallics 10 with metallic vapor 9, metal plate and belt 7 is before modification, be provided with and adopt linear electron beam gun the metal plate and belt surface to be carried out the metal plate and belt wiper mechanism 12 of etching activation treatment, metal plate and belt unwinding and rewinding mechanism 4,5 can pass in and out vacuum chamber on the guide rail 16 in frame 15 under supporting mechanism 13 drives, can be convenient for changing the surface of the metal sheet roll coil of strip and cleaning vacuum chamber inwall polytetrafluorethylecoatings coatings 17.The charging into mechanism 14 and can send into reactant gases 20 of reactant gases.
In present embodiment 1, metallic substance 8 adopts cylindric, and with the linear electron beam 19 scanning evaporated metal materials 8 that linear electron beam gun 6 produces, its homogeneity is best (referring to Fig. 5).
Production unit adopts the structure formation of the plating of reeling, and vacuum chamber size: φ 2800 * 1000 adopts stainless steel to make, every stove can plate a volume, and coil diameter is φ 1100 to the maximum, and the width of metal plate and belt is 600mm, thickness is 0.1～0.3mm, and the travelling speed of metal plate and belt is that 0.2m～2m/s is adjustable.
When production unit of the present invention is worked, metal plate and belt 7 is packed into after the decontamination of deoiling and is unreeled 4 places, treat to begin plated film after vacuum chamber 3 is evacuated to 5 * 10-2Pa, the one side of metal plate and belt 7 is earlier with bar shaped ion source 12 pre-treatment of the linear electron beam gun of 20KW power or commercially available 20KW power, enter again by in the metallic vapor of linear electron beam gun 6 evaporations of 60-100KW power, metallic vapor becomes metal ion 10 after plasma body 18 ionization of no arc spot, metal plate and belt adds negative bias (30V), is deposited on the surface of metal plate and belt 7 metal (for example Cr) that is plated; When metal plate and belt 7 arrives another with the linear electron beam gun of preceding same configuration or bar shaped ion source 12, another side is pretreated, enter another and the linear electron beam gun 6 of preceding same configuration then, its metallic vapor is in the effect of no arc spot plasma body 18, be ionized into metal ion, deposited at last on another surface of metal plate and belt, realized the purpose of the two-sided plating of metal plate and belt.By the metal plate and belt 7 that plated in rolling place 5 by rolling, after treating that this volume metal plate and belt has plated, vacuum chamber amplifies gas, whole reel system 13 withdraws from vacuum chamber 1, the metal plate and belt of rolling is hung, put into another volume not metallizing strip of having cleaned again in unreeling the place, find time after reel system 13 being pushed (the reel system resting support is to utilize motor transmission system prolonging track turnover vacuum chamber) vacuum chamber sealing, enter multiple plated film program again.Except that lifting and removing stage makeup and costume, the whole service process all is programming control (PLC) automatically, and is shown by CRT.
As sending into reactant gases 20 into mouth mechanism 14 from supplying gas, then can the realization response plated film, for example plate compound layers such as TiN, TiC, CrO2, CrN.
Embodiment 2:
Fig. 7, Fig. 8 have provided the embodiment of the invention 2 figure.Present embodiment 2 basic with embodiment 1 with, not existing together is that metal is positioned in the crucible 21, employing scanning electron rifle 23 evaporated metal materials 22,24 are sweep trace of electron beam.
Embodiment 3:
Fig. 9 has provided the embodiment of the invention 3 figure.Present embodiment 3 basic with embodiment 1 with, not existing together, to be metallic substance 25 columniformly have a metal bar of being convenient to water flowing refrigerative hollow structure for what rotate.
The various embodiments described above are that foregoing of the present invention is further described, but this should be interpreted as that the scope of the above-mentioned theme of the present invention only limits to the foregoing description.All technology that realizes based on foregoing all belong to scope of the present invention.
Claims (13)
1, the production unit of surface modification of metal plate and band, comprise at least one of vacuum chamber, vacuum suction unit, metal plate and belt unwinding and rewinding mechanism, heating evaporation metallic substance electron beam gun, it is characterized in that between metal plate and belt and metallic substance metallic vapor around be provided with the plasma body that metallic vapor is ionized into metal ion.
2, the production unit of surface modification of metal plate and band according to claim 1, the electron beam gun that it is characterized in that the heating evaporation metallic substance are linear electron beam gun.
3, according to the production unit of the described surface modification of metal plate and band of claim 1, it is characterized in that plasma body is the hollow anode of a closure, form the plasma body of no arc spot, the deflection beam of electron beam gun emission passes the metal material surface that the plasma body center arrives evaporation.
4,, it is characterized in that metallic substance is an at least one chromium matter bar according to the production unit of claim 1 or 2 described surface modification of metal plate and band.
5,, it is characterized in that metallic substance is the rotatable columniform metal bar of being convenient to water flowing refrigerative hollow structure that has according to the production unit of claim 1 or 2 described surface modification of metal plate and band.
6,, it is characterized in that the vacuum chamber inner-wall spraying has polytetrafluorethylecoatings coatings according to the production unit of claim 1 or 2 described surface modification of metal plate and band.
7,, it is characterized in that the vacuum chamber body wall has the sandwich structure of logical water coolant according to the production unit of claim 1 or 2 described surface modification of metal plate and band.
8, according to the production unit of claim 1 or 2 described surface modification of metal plate and band, it is characterized in that vacuum chamber be provided with make metal ion on the metal plate and belt substrate surface, carry out chemical reaction, form compound modified layer reactant gases charge into mechanism.
9,, it is characterized in that being provided with at least in the vacuum chamber heating unit that sheet metal strip is heated according to the production unit of the described surface modification of metal plate and band of claim 1.
10, according to the production unit of claim 1 or 2 described surface modification of metal plate and band, it is characterized in that having the crucible of depositing metallic substance.
11, according to the production unit of claim 1 or 2 described surface modification of metal plate and band, it is characterized in that the metal plate and belt base material that is modified has negative bias, its value is 0～-150V is adjustable.
12, according to the production unit of the described surface modification of metal plate and band of claim 1, it is characterized in that metal plate and belt before modification, be provided with and adopt linear electron beam gun the metal plate and belt surface to be carried out the metal plate and belt wiper mechanism of etching activation treatment.
13, according to the production unit of the described surface modification of metal plate and band of claim 1, it is characterized in that metal plate and belt before modification, be provided with ion source mechanism carries out the etching activation treatment to the metal plate and belt surface ion source wiper mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610020606 CN101045988A (en) | 2006-03-30 | 2006-03-30 | Production apparatus for surface modification of metal plate and band |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610020606 CN101045988A (en) | 2006-03-30 | 2006-03-30 | Production apparatus for surface modification of metal plate and band |
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| CN101045988A true CN101045988A (en) | 2007-10-03 |
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| CN 200610020606 Pending CN101045988A (en) | 2006-03-30 | 2006-03-30 | Production apparatus for surface modification of metal plate and band |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313538A (en) * | 2014-11-18 | 2015-01-28 | 京东方科技集团股份有限公司 | Vacuum evaporation device and method |
| CN108333493A (en) * | 2017-12-22 | 2018-07-27 | 兰州空间技术物理研究所 | Hollow cathode vacuum electronic emitting performance test device, method and screening technique |
| CN118028762A (en) * | 2024-04-12 | 2024-05-14 | 山东省宝丰镀膜有限公司 | Suspension type winding magnetic control cathode bombardment evaporation film forming system |
-
2006
- 2006-03-30 CN CN 200610020606 patent/CN101045988A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313538A (en) * | 2014-11-18 | 2015-01-28 | 京东方科技集团股份有限公司 | Vacuum evaporation device and method |
| CN104313538B (en) * | 2014-11-18 | 2018-09-21 | 京东方科技集团股份有限公司 | Evaporated device and evaporation coating method |
| CN108333493A (en) * | 2017-12-22 | 2018-07-27 | 兰州空间技术物理研究所 | Hollow cathode vacuum electronic emitting performance test device, method and screening technique |
| CN118028762A (en) * | 2024-04-12 | 2024-05-14 | 山东省宝丰镀膜有限公司 | Suspension type winding magnetic control cathode bombardment evaporation film forming system |
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Open date: 20071003 |