CN101040373B - Method for encapsulating an electronic component using a plastic object, and plastic object - Google Patents
Method for encapsulating an electronic component using a plastic object, and plastic object Download PDFInfo
- Publication number
- CN101040373B CN101040373B CN200580030617.7A CN200580030617A CN101040373B CN 101040373 B CN101040373 B CN 101040373B CN 200580030617 A CN200580030617 A CN 200580030617A CN 101040373 B CN101040373 B CN 101040373B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- modification
- thermoplastic plastic
- plastic object
- discharged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000004033 plastic Substances 0.000 title claims description 42
- 229920003023 plastic Polymers 0.000 title claims description 42
- 239000000463 material Substances 0.000 claims abstract description 45
- 229920001169 thermoplastic Polymers 0.000 claims description 32
- 230000004048 modification Effects 0.000 claims description 21
- 238000012986 modification Methods 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 241000446313 Lamella Species 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- -1 polyethylene Polymers 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 230000005251 gamma ray Effects 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 150000002978 peroxides Chemical class 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000013626 chemical specie Substances 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 claims 1
- 230000005865 ionizing radiation Effects 0.000 claims 1
- 239000012815 thermoplastic material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000002285 radioactive effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 241000252203 Clupea harengus Species 0.000 description 1
- GUTLYIVDDKVIGB-OUBTZVSYSA-N Cobalt-60 Chemical compound [60Co] GUTLYIVDDKVIGB-OUBTZVSYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 230000003187 abdominal effect Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 235000019514 herring Nutrition 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a method for encapsulating an electronic component in a mould by the processing steps of: placing the component into a mould cavity, feeding encapsulating material, and curing the encapsulating material, wherein the electronic component is shielded by an object. The invention also relates to an object.
Description
Technical field
The present invention relates to a kind of in mould the encapsulating electronic components method.The invention still further relates to a kind ofly during providing encapsulating material, be used for partly shielding effect electronic component at least or be connected to the thermoplastic plastic object of the carrier of electronic component to electronic component.
Background technology
At the electronic component that is placed on usually on the carrier, more specifically for example in the encapsulation of semiconductor circuit, the encapsulating material shielding that subelement and/or carrier can be arranged.At the adhesive sheet material that adhere to product that be used to encapsulate of this utilization according to prior art.At least before arranging lamella, lamella herein can have permanent adhesion or can be by for example not long ago improving the adhesion that the temperature of thin slice strengthens in the lamella setting usually.Another selection is to utilize non-adhesive foil material (being also referred to as release film).Such non-adhesive foil material wherein is fixed on screening-off position to sheeting by exerting pressure with wanting encapsulating products to be placed in the mould, and wherein sheeting is to having shielding action on the part in the recessed carrier that will be closed.After packaging process, encapsulating products can separate with simple form from thin slice, and can not damage the remaining bonding agent that is retained in the encapsulating products.Yet the use of non-adhesive foil material has the shortcoming that increases cost.Usually can only have to have sufficiently high quality after all to work under the maximum conditions that in the electronic package process, occur by expendable sheeting.This sheeting is expensive.
US 2004/0018659 discloses the manufacture method that a kind of manufacturing has the thin surface mounted semiconductor device of unleaded structure, utilizes the intermediate adhesion sheet that has adhesive layer thus in first step, and semiconductor element adheres on it.This element provides electric wire and is encapsulated in sealing or the potting resin.In the step in the end, this bonding sheet separates and scraps from semiconductor device.The method of US 2004/0018659 uses bonding sheet with temporary transient fixedly semiconductor element.By heat effect, the bonding strength of electron beam or this sheet of ultraviolet light correctability.
Summary of the invention
The purpose of this invention is to provide a kind of cladding material of improving one's methods and using in the method that is used at the mould encapsulating electronic components, expense was lower when it in use kept the advantage of prior art.
The present invention provides the method for type described in the preamble for this purpose, be characterised in that make can discharge object and the electronic component that will encapsulate contacts before, at least modification is used to connect the contact-making surface that can discharge object and electronic component, so that arrange chain link in the strand of plastics.These plastics preferred thermoplastic plastics.Although have only several microns the extremely thin superficial layer may be enough, yet must carry out this modification to the segment thickness of this object at least.In addition, modification is necessary for the fusing point (it is lower than the temperature in the mould in the encapsulation process before modification) that makes thermoplastics and no longer is in the temperature range in these temperature in the mould.In fact the fusing point that this means modified thermoplastic is brought up at least 160 ℃, but preferred at least 175 ℃, or modification causes fusing point thoroughly to disappear.The arrangement that is positioned at (big molecule) intermolecular chain link is also referred to as the crosslinked of molecule; Therefore take place under these temperature that the disappearance of the fusing point (or fusion scope) of expectation will exist in mould.Because increased the chain link number between the thermoplastics molecule in the modifying process, the character of thermoplastic is affected so that obtain to have more heat cured material.Thereby use relatively cheap plastics (with use according to prior art by fluorine-containing polymer, for example the non-sticky made of PTFE and ETFE discharges thin slice and compares) can realize desired shielding.Further advantage is to produce the degree of freedom that extra being used to determines the expected performance of this object (exposure period applies the intensity of radioactive ray, direction of radioactive ray or the like) at least.Yet another kind of the selection is the character that changes this object within this object.This means two relative herring bones that for example can shine material and be less than middle heart or abdominal part that the characteristic of this object edge is than the belly of center and acute irradiation more heating plastic more like this.Be otherwise noted that term " electronic component " in present patent application is interpreted as that also expression is connected to the joint product that this carrier of a carrier constitutes by having one or more electronic components.This carrier also is called as " lead frame " or " plate ".Can select with lamella existing electronic component and/or the carrier of partly shielding effect at least, thereby make and keep cladding material partly not have encapsulating material or fraction encapsulating material (for example being called for example thin part of the encapsulating material of escape orifice).This is particularly advantageous in the encapsulation that is placed on the electronic component on the carrier with continuous opening, and carrier must be coated on the side in the process of carrying out packaging process (is for example MAP QFN of no lead packages at this example).
Dependence make the ionization radioactive ray for example the form of gamma ray act on lamella and/or can the modified plastics object by on object, introducing electron beam.The modification of thermoplastics lamella molecular structure is included in and arranges more multichain joint between the macromolecular chain of thermoplasticity (crosslinked).Additional chain link will help to cancel the fusing point/softening range in the temperature range that has temperature in mould.By using emitting isotope cobalt 60 to act on the lamella, can easily obtain such molecular structure modification as the gamma ray that the energy in the gamma radiation equipment produces.The other method that reaching the desired chain link number between plastic molecules increases is included in lamella and introduces electron beam.Here usually under high vacuum and tool use the negative electrode of heating to produce electronics.When shining relatively large sheeting simultaneously, such irradiation thereby caused the minimum cost of per unit sheeting.Use the advantage of ionization radiation be parent material can be very simple and the effect ionization radiation be unique variation to existing method.
Also can come the modified plastics object, in the strand of thermoplastics or between the strand of thermoplastics, form chain link with chemical mode thus by in object, disposing substance (material).The example that is fit to the material of this purposes is that free radical forms material, for example peroxide and silane.Cause that the chemical method that chain link number between the plastic molecules increases has the advantage that does not need to use radiation source, with and cause expecting increasing or the fusing point/fusion range of disappearance plastics with controlled manner.
This modification can be carried out with a large amount of processing of mode in batches in the time cycle of determining easily.Lamellose modification can be carried out procedure of processing A respectively carrying out the optimized position of modification)-C) carry out.On the contrary, the modification of thermoplastic plastic object can also be carried out in mode continuously.In this case, can carry out object illumination or interpolation compound in " flexible operation " (" douceur ") mode of preferred compactness according to producing lathe or sealed in unit.
In preferred distortion, the thermoplastic plastic object of modification comprises a lamella.Such lamella can be suitable for only once or repeatedly use, and the application that can not become the sheeting of problem cause in packaging system.On the other hand, also to pay attention to other object, for example the object to exist, for example piece than the thick material portion-form.This is particularly suitable for repeatedly using.A kind of may be that piece and packaging system is integrated so that when between mold component, clamping the element be used to encapsulate this piece can discharge the carrier of engaged element/element, it need not carry out extra process to encapsulant (is piece in this situation).
At procedure of processing B) process in, for tab laminate being come on the electronic component of encapsulation, be desirably in the electronic component that clamping is used to encapsulate between at least two mold components with enough pressure.This mould (having at least two mold components that can replace each other) is by large-scale application.
The present invention also is provided at the thermoplastic plastic object that the supply encapsulating material is used for partly shielding effect electronic component at least in the middle of the process of electronic component or is connected to the carrier of electronic component, it is characterized in that the molecular structure of plastic object contact-making surface provides chain link in macromolecular chain or between the macromolecular chain at least.This thermoplastic plastic object can comprise that for example polyethylene, polypropylene and/or PE-X form polyolefin.In the encapsulation process of electronic component, can't use this material as encapsulant so far.Except the plastics of in this section, mentioning, can also use certainly by these material derived copolymers and mixture (wherein these materials are main component).These materials (copolymer and mixture) also fall within protection scope of the present invention.
In a preferred embodiment, by the support layer supports plastic object.This supporting layer preferably includes polymer (for example polyester such as polyethylene terephthalate).On the contrary, supporting layer also can be formed by non-plastic material.Owing to have multi-layer body, the desired characteristic of releasable material (non-adhesive) can combine with other desired characteristic of this object, for example with respect to the minimum essential requirement of mechanical load capacity aspect.If for example supporting layer is strengthened by twin shaft then this latter can be increased.
In preferred distortion, form thermoplastic plastic object by plastic sheet.The application of sheeting is known in essence and the ancillary equipment that herein needs also is available on market.Notice that already used non-cohesive material is by for example expensive fluoropolymer manufacturing of senior raw material.These materials have than the higher fusing point of processing temperature and are non-stickies.Non-sticky can be understood implication and be taken place for essentially no at least polar bond between thin slice and substrate; Except that not having (molecule) polar bond, yet under the situation of non-cohesive material, can there be so-called " blocking-up ", a kind of phenomenon that has a large amount of frictional resistance at the storeroom that connects in the non-sticky mode that shows.The blocking-up phenomenon also will be present on the decision degree according in the modified plastics object of the present invention, and even the good sealing function of reinforced plastics object.The degree that blocking-up takes place partly relies on temperature conditions.
Except using the plastics sheet materials, also can use and form thermoplastic plastic object by unit of plastic.Thereby such piece can for example form the part of module of part sealed in unit and can repeatedly be utilized so that the sealing effectiveness of expectation to be provided again, and can not cause the logistic complicated more with respect to the sealed in unit operation.
Based on can further illustrating the present invention in the unrestricted embodiment of imitateing shown in the following accompanying drawing.
This:
Description of drawings
Fig. 1 shows the schematic diagram of the method according to this invention,
Fig. 2 A shows the example according to single sheet of the present invention,
Fig. 2 B shows the example according to composite wafer of the present invention, and
Fig. 3 shows the example according to homogenous material unit of plastic of the present invention.
Embodiment
Fig. 1 shows the many volume plastics sheet materials 2 that are placed on the pallet 1 and are transported process radiation source 3.Radiation source 3 is made up of the radioisotopic container 4 that is provided with cobalt within it.If must interrupt the effect of radiation source 3, then it can be dropped in the basin 5.
The roll of plastic foil material 6 of shining is adjacent to sealed in unit 7 and places.Between the mold component 8,9 of sealed in unit 7, be provided with and be installed in the electronic component 11 on the carrier 10 so that the die space 12 in upper die part 8 can embracing element 11.Carrier 10 is placed on from the sheeting that has shone 13 of roller 6 debatchings away from a side of element 11.After encapsulation operation is carried out, advance the sheeting 13 of irradiation so that the electronic component 14 of encapsulation moves on to the outside of sealed in unit.In case encapsulating electronic components 14 is along with the sheeting 15 of the carrier 17 that is associated from irradiation unloads, the employed sheeting that has shone 15 will be around to roller 16 now.
Fig. 2 A illustrates the volume 20 of the opened irradiated thermoplastic plastic foil material 21 of part.Clearly show that sheeting 21 is made up of the homogenous material layer.Fig. 2 B shows the volume 22 of the thermoplastic plastic foil material of being made up of two material layers 24,25 23.The material layer 24 on top for example by the supporting layer 25 of polyethylene manufacturing and bottom for example by the polyethylene terephthalate manufacturing.For these layers that are connected to each other, can between two material layers 24,25, use the adhesive phase that one deck is extremely thin thereby do not illustrate in the figure, this adhesive phase for example is made up of acrylate glue.
Fig. 3 schematically shows the sectional view of the sealed in unit 30 with two mould parts 31,32 separated from each other.In the die cavity 33 recessed upper mold part 32.The groove of placing therein according to unit of plastic 35 of the present invention 34 is arranged in the lower mold half 31.By placing the lead frame (not shown) on piece 35, this piece 35 will be given prominence in the process of sealed in unit 30 operations and after the close die part 31,32, and seal the lead frame that is placed on the piece 35, and piece 35 does not adhere on the lead frame.
Claims (22)
1. the method for an encapsulating electronic components in mould comprises following procedure of processing:
A) place the electronic component that will encapsulate in die cavity,
B) inject encapsulating material to die cavity, and
C) the partly solidified at least encapsulating material in die cavity,
Wherein at procedure of processing B) in the process by the discharged object of the plastics manufacturing partly shielding effect electronic component that will encapsulate at least,
It is characterized in that
This can discharge object is non-viscosity, and make can discharge object and the electronic component that will encapsulate contacts before, at least be used to connect and discharge object and be modified to the contact-making surface of electronic component, cause in the strand of plastics and arrange chain link, but wherein with inviscid releaser structural reform increasing its fusing point, thereby obtain to have more heat cured material.
2. the method for claim 1, it is characterized in that by ionizing radiation is acted on the object and modification by the discharged object of plastics manufacturing.
3. method as claimed in claim 2, it is characterized in that by gamma ray is acted on the object and modification by the discharged object of plastics manufacturing.
4. the method for claim 1 is characterized in that by the electron beam alignment object is come the discharged object of modification by the plastics manufacturing.
5. the method for claim 1 is characterized in that modification forms chain link with chemical species whereby by the discharged object of plastics manufacturing between the thermoplastics molecule by substance is set in object.
6. method as claimed in claim 5 is characterized in that being used to form intermolecular chain link and adds to being made up of the substance that forms free radical to the small part substance in this object.
7. as claim 5 or 6 described methods, it is characterized in that being used to form intermolecular chain link and add to forming by peroxide and/or silane to the small part substance in this object.
8. method as claimed in claim 7 is characterized in that being carried out in mode in batches by the modification of the discharged object of plastics manufacturing.
9. method as claimed in claim 7 is characterized in that being carried out in a continuous manner by the modification of the discharged object of plastics manufacturing.
10. method as claimed in claim 9 is characterized in that by the single erosion of the modification of the discharged object of plastics manufacturing ground at procedure of processing A)-carry out in C).
11. method as claimed in claim 10 is characterized in that the discharged object by the plastics manufacturing of modification comprises lamella.
12. method as claimed in claim 10 is characterized in that the discharged object by the plastics manufacturing of modification is a module.
13. thermoplastic plastic object, it is during providing encapsulating material to electronic component, be used for partly shielding effect electronic component at least or be connected to the carrier of electronic component, it is characterized in that this plastic object be non-sticky and at least the macromolecular structure of the contact-making surface of this plastic object chain link between strand is provided, make that the chain link between the molecules of thermoplastic materials influences the character of thermoplastic so that obtain to have more heat cured material.
14. thermoplastic plastic object as claimed in claim 13 is characterized in that this thermoplastic plastic object comprises polyolefin.
15., it is characterized in that this plastic object comprises polyethylene as claim 13 or 14 described thermoplastic plastic object.
16. thermoplastic plastic object as claimed in claim 15 is characterized in that this plastic object comprises polypropylene.
17. thermoplastic plastic object as claimed in claim 16 is characterized in that this plastic object passes through support layer supports.
18. thermoplastic plastic object as claimed in claim 17 is characterized in that this supporting layer comprises polymer.
19. the thermoplastic plastic object described in claim 17 or 18 is characterized in that this supporting layer is strengthened by twin shaft.
20. thermoplastic plastic object as claimed in claim 18 is characterized in that this supporting layer comprises polyethylene terephthalate.
21. thermoplastic plastic object as claimed in claim 20 is characterized in that this thermoplastic plastic object is formed by the plastic tab layer.
22. thermoplastic plastic object as claimed in claim 20 is characterized in that this thermoplastic plastic object is formed by plastic module.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1026749A NL1026749C2 (en) | 2004-07-30 | 2004-07-30 | Method of enclosing an electronic component with the aid of a plastic object and a plastic object. |
| NL1026749 | 2004-07-30 | ||
| PCT/NL2005/000544 WO2006011791A2 (en) | 2004-07-30 | 2005-07-26 | Method for encapsulating an electronic component using a plastic object, and plastic object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101040373A CN101040373A (en) | 2007-09-19 |
| CN101040373B true CN101040373B (en) | 2010-06-23 |
Family
ID=34974386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200580030617.7A Expired - Fee Related CN101040373B (en) | 2004-07-30 | 2005-07-26 | Method for encapsulating an electronic component using a plastic object, and plastic object |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN101040373B (en) |
| MY (1) | MY151694A (en) |
| NL (1) | NL1026749C2 (en) |
| TW (1) | TWI373830B (en) |
| WO (1) | WO2006011791A2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1195424A (en) * | 1995-07-11 | 1998-10-07 | 美国3M公司 | Semiconductor wafer processing adhesives and tapes |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0726071B2 (en) * | 1989-03-27 | 1995-03-22 | 積水化学工業株式会社 | Release liner |
| US6235387B1 (en) * | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| JP2000263714A (en) * | 1999-03-09 | 2000-09-26 | Minnesota Mining & Mfg Co <3M> | Fluorine-base release sheet and manufacture thereof |
| NL1020594C2 (en) * | 2002-05-14 | 2003-11-17 | Fico Bv | Method for enveloping an electronic component with the aid of a foil layer. |
| JP2004063615A (en) * | 2002-07-26 | 2004-02-26 | Nitto Denko Corp | Semiconductor device, manufacturing method thereof and adhesive sheet for manufacturing the same |
-
2004
- 2004-07-30 NL NL1026749A patent/NL1026749C2/en not_active IP Right Cessation
-
2005
- 2005-07-26 WO PCT/NL2005/000544 patent/WO2006011791A2/en active Application Filing
- 2005-07-26 CN CN200580030617.7A patent/CN101040373B/en not_active Expired - Fee Related
- 2005-07-28 TW TW94125562A patent/TWI373830B/en active
- 2005-07-29 MY MYPI20053504 patent/MY151694A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1195424A (en) * | 1995-07-11 | 1998-10-07 | 美国3M公司 | Semiconductor wafer processing adhesives and tapes |
Non-Patent Citations (2)
| Title |
|---|
| JP平2-252781A 1990.10.11 |
| 同上. |
Also Published As
| Publication number | Publication date |
|---|---|
| NL1026749C2 (en) | 2005-08-19 |
| WO2006011791A3 (en) | 2006-09-14 |
| WO2006011791A2 (en) | 2006-02-02 |
| CN101040373A (en) | 2007-09-19 |
| MY151694A (en) | 2014-06-30 |
| TWI373830B (en) | 2012-10-01 |
| TW200614453A (en) | 2006-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3112413B1 (en) | Radiation pre-crosslinked polyolefin adhesive film, preparation method therefor, encapsulating method and assembly with same | |
| US4872825A (en) | Method and apparatus for making encapsulated electronic circuit devices | |
| US6428650B1 (en) | Cover for an optical device and method for making same | |
| TWI786104B (en) | Photovoltaic module, photovoltaic encapsulant and method of producing a photovoltaic module | |
| CN111081802B (en) | Manufacturing process of pre-crosslinked photovoltaic modules and photovoltaic modules | |
| JPH09107061A (en) | Lead frame without dam bar for sealing of molded component capsule | |
| DE112015001143T5 (en) | Mold release film, method for its production and method for producing a semiconductor package | |
| CN103804774A (en) | Radiation pre-crosslinked ethylene-vinyl acetate (EVA) resin film and preparation method thereof | |
| JP2001518718A (en) | Methods for improving polymer materials for use in solar cell applications | |
| KR102684590B1 (en) | Method for manufacturing resin-molded product, molding die and resin molding device | |
| JP4030897B2 (en) | Plastic bonding method | |
| CN104558802A (en) | Surface radiation pre-crosslinking ethylene-vinyl acetate resin film for photovoltaic module and preparation method of resin film | |
| JPH08340015A (en) | Liquid molding before package for component encapsule | |
| CN110148671A (en) | Organic electronic device encapsulation multilayer light-cured resin covers packaging method comprehensively | |
| US20020136872A1 (en) | Lead frame laminate and method for manufacturing semiconductor parts | |
| US7863094B2 (en) | Method for removing bubbles from adhesive layer of semiconductor chip package | |
| CN1865375A (en) | Adhesive sheet for cutting and cutting method using the adhesive sheet | |
| CN101040373B (en) | Method for encapsulating an electronic component using a plastic object, and plastic object | |
| US20060105493A1 (en) | Encapsulation of organic devices | |
| KR101448343B1 (en) | Eva sheet for solar cell sealing and method of manufacturing thereof | |
| CN113614888A (en) | Protective film, method for attaching protective film, and method for manufacturing semiconductor component | |
| EP0935288B1 (en) | Sealed structure of semiconductor circuit and method for production thereof | |
| CN85104878A (en) | Package for electronic circuit device and method and apparatus for manufacturing the same | |
| TWI791250B (en) | Component for preventing resin leakage, component supply mechanism for preventing resin leakage, resin molding device, and manufacturing method of resin molded product | |
| JP2021064745A (en) | Sealing film, sealing film-coated electronic component-mounted substrate ane electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Leshan Fei Ge mould Co.,Ltd. Assignor: Fico B.V. Contract record no.: 2011990000743 Denomination of invention: Method for encapsulating an electronic component using a plastic object, and plastic object Granted publication date: 20100623 License type: Exclusive License Open date: 20070919 Record date: 20110803 |
|
| ASS | Succession or assignment of patent right |
Owner name: BESI NETHERLANDS B. V. Free format text: FORMER OWNER: FICO INTERNATIONAL B. V. Effective date: 20130816 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: FICO INTERNATIONAL B. V. Free format text: FORMER NAME: FICO B.V. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Holland Patentee after: FLYCO International Ltd. Address before: Holland Patentee before: Fico B.V. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130816 Address after: Holland Patentee after: BESI NETHERLANDS B.V. Address before: Holland Patentee before: FLYCO International Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100623 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |