CN101034432A - Packaging structure and packaging method of ultra-thin optical fingerprint interception module - Google Patents

Abstract

The invention discloses a packaging structure of an ultra-thin optical fingerprint intercepting module, which comprises: the image sensor comprises a circuit board, an image sensing module, a light emitting module and a packaging cover body. The image sensing module and the light emitting module are both disposed on the circuit board in an electrically connecting manner. The packaging cover body is arranged on the circuit board and provided with a first opening unit used for exposing the image sensing module and a second opening unit used for exposing the light-emitting module. Therefore, the invention reduces the whole volume of the packaging structure by omitting a complex optical mechanism which is difficult to assemble so as to realize an ultra-thin structure, thereby reducing the manufacturing cost and improving the yield.

Description

Packaging structure and packaging method of ultra-thin optical fingerprint interception module

technical field

The invention relates to a packaging structure and a packaging method of an ultra-thin optical fingerprint interception module, in particular to a packaging structure and a packaging method which omit a complicated and difficult-to-assemble optical mechanism.

Background technique

Please refer to FIG. 1 and FIG. 2 , which are respectively an exploded perspective view and a side sectional view of a package structure of a conventional optical fingerprint capture module. It can be seen from the figure that the package structure of the known optical fingerprint capture module includes: a package case 10a, a circuit board 20a, a cover glass 30a, an image sensing component 40a, a lens component 50a and a light emitting component 60a.

Wherein, the circuit board 20a and the upper cover glass 30a are respectively disposed on the upper and lower ends of the packaging case 10a, thereby creating upper and lower spaces 100a, 200a, the image sensing component 40a is disposed on the circuit board 20a and Located in the lower space 200a of the packaging case 10a, the lens assembly 50a is disposed between the upper and lower spaces 100a and 200a of the packaging case 10a, and the light-emitting assembly 60a is disposed in the upper space 100a and located in One side of the lens assembly 50a. Thereby, a beam of light is emitted to a document D through the light-emitting component 60a to generate a reflected light, and then the reflected light of the document D is transmitted to the image sensing component 40a by means of the lens component 50a to sense the document Image.

However, as can be seen from FIG. 1 and FIG. 2 , the volume of the optical mechanism of the packaging structure of the known optical fingerprint interception module is too large, which increases the manufacturing cost and reduces the production yield.

Contents of the invention

The purpose of the present invention is to provide a packaging structure and packaging method for an ultra-thin optical fingerprint interception module, which uses a CMOS (Complementary Metal-Oxide Semiconductor) image sensing chip to replace the known complex Optical mechanism, and cooperate with the packaging cover completed by injection molding method to bond the circuit board, and finally carry out the wire-bounding production process to complete the packaging operation (glue first and then wire to reduce the difficulty of assembly degree and increase packaging yield). Therefore, the present invention reduces the overall volume of the packaging structure to achieve an ultra-thin structure by omitting complex and difficult-to-assemble optical mechanisms, thereby reducing manufacturing costs and improving production yield.

In order to achieve the above object, the present invention provides a packaging structure of an ultra-thin optical fingerprint capture module, which includes: a circuit board, an image sensing module, a light emitting module and a packaging cover. Wherein, the image sensing module and the light emitting module are both electrically connected and arranged on the circuit board. The package cover is arranged on the circuit board, and the package cover has a first opening unit for exposing the image sensing module and a second opening unit for exposing the light emitting module.

In order to achieve the above object, the present invention provides a packaging method for an ultra-thin optical fingerprint capture module, the steps of which include: firstly, an image sensing module and a light emitting module are respectively electrically connected on a circuit board; Next, a packaging cover is provided on the circuit board, wherein the packaging cover has a first opening unit for exposing the image sensing module and a second opening unit for exposing the light emitting module; then A protective cover is provided on the packaging cover to protect the electrical contact between the light emitting module and the circuit board.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 is the three-dimensional exploded view of the package structure of known optical fingerprint interception module;

FIG. 2 is a side sectional view of a package structure of a known optical fingerprint interception module;

Fig. 3 is a three-dimensional exploded view of the packaging structure of the ultra-thin optical fingerprint interception module of the present invention;

4 is a three-dimensional combined view of the packaging structure of the ultra-thin optical fingerprint interception module of the present invention;

Fig. 5 is another three-dimensional exploded view of the packaging structure of the ultra-thin optical fingerprint interception module of the present invention (with the protective cover removed);

Fig. 6 is the A-A sectional view of Fig. 5;

7 is a cross-sectional view of the packaging structure of the ultra-thin optical fingerprint interception module of the present invention electrically connected to another circuit board; and

FIG. 8 is a flow chart of the packaging method of the ultra-thin optical fingerprint interception module of the present invention.

Among them, reference signs:

10a Encapsulation case

100a upper space 200a lower space

20a circuit board

30a cover glass

40a Image sensing components

50a lens assembly

60a Lighting components

D manuscript

1 circuit board

12 The first alignment hole

13 Conductive track

2 Image sensing module

20 CMOS image sensor chip

3 Lighting modules

30 luminous components

4 Package cover

40 The first opening unit

400 First opening

41 The second opening unit

410 second opening

42 Second alignment hole

5 Protective cover

6, 6' metal wire

7 circuit board

Detailed ways

Please refer to FIG. 3 and FIG. 4 , which are respectively a three-dimensional exploded view and a three-dimensional assembled view of the packaging structure of the ultra-thin optical fingerprint capture module of the present invention. It can be seen from the figure that the present invention provides an ultra-thin optical fingerprint capture module packaging structure, which includes: a circuit board 1 , an image sensing module 2 , a light emitting module 3 and a packaging cover 4 .

Wherein, the image sensing module 2 and the light emitting module 3 are both electrically connected and arranged on the circuit board 1, and the image sensing module 2 may be composed of one or several CMOS image sensing chips 20 , in addition, the light emitting module 3 can also be composed of one or several light emitting components 30 .

Furthermore, the image sensing module 2 or the light emitting module 3 can be electrically connected and disposed on the circuit board 1 by wire-bounding, surface mount technology (Surface Mount Technology, SMT) or any bonding method. For example, as shown in FIG. 3, the image sensing module 2 can be electrically connected to the circuit board 1 through a pair of metal wires 6, and the light emitting module 3 can be electrically connected to the circuit board 1 through several metal wires 6'. .

In addition, the packaging cover 4 is disposed on the circuit board 1, and the packaging cover 4 has a first opening unit 40 for exposing the image sensing module 2 and a first opening unit 40 for exposing the light emitting module 3. Two hole units 41 . Wherein, the first opening unit 40 may be one or several first openings 400 for correspondingly exposing the complementary metal oxide semiconductor image sensing chips 20, and the second opening unit 41 may be one or several A plurality of second openings 410 are used for correspondingly exposing the light emitting components 30 .

In addition, the present invention further includes: a protective cover 5 for protecting the metal wires 6' to ensure the electrical contact between the light emitting module 3 and the circuit board 1. Furthermore, the circuit board 1 has a pair of first alignment holes 12, and the package cover 4 has a pair of second alignment holes 42 corresponding to the pair of first alignment holes 12; therefore, through the pair The cooperation between the first alignment hole 12 and the pair of second alignment holes 42 enables the correct alignment of the circuit board 1 and the packaging cover 4 .

Please refer to FIG. 5 and FIG. 6 , which are another three-dimensional exploded view of the packaging structure of the ultra-thin optical fingerprint capture module of the present invention (with the protective cover removed) and the A-A sectional view of FIG. 5 . It can be seen from the figure that by disposing the image sensing module 2 and the light emitting module 3 on the circuit board 1 respectively, the disadvantage of bulky size of the known optical fingerprint capture module can be overcome.

Please refer to FIG. 7 , which is a cross-sectional view of the packaging structure of the ultra-thin optical fingerprint interception module of the present invention electrically connected to another circuit board. It can be seen from the figure that several conductive traces 13 are formed inside the circuit board 1 by way of circuit layout, and these conductive traces 13 are electrically connected to the corresponding metal wires 6, 6 ’ and another circuit board 7.

Please refer to FIG. 8 , which is a flow chart of the packaging method of the ultra-thin optical fingerprint capture module of the present invention. As can be seen from the flow chart, the present invention provides a packaging method for an ultra-thin optical fingerprint interception module. The steps include: first, electrically connecting an image sensing module 2 and a light emitting module 3 to a circuit board 1 respectively. on (S100); then, set a packaging cover 4 on the circuit board 1, wherein the packaging cover 4 has a first opening unit 40 for exposing the image sensing module 2 and a first opening unit 40 for exposing the The second opening unit 41 of the light-emitting module 3 (S102), wherein the package cover 4 can be arranged on the circuit board 1 by means of adhesion, and the package cover 4 is completed by injection molding; Then, a protective cover 5 is disposed on the packaging cover 4 to protect the electrical contact between the light emitting module 3 and the circuit board 1 ( S104 ).

In summary, the present invention uses the CMOS image sensing chip 20 to replace the known complex optical mechanism, and cooperates with the packaging cover 4 completed by the injection molding method to bond the circuit board, and finally The production process of wire bonding is used to complete the packaging operation. Therefore, the present invention realizes an ultra-thin structure by reducing the overall volume of the packaging structure by omitting complex and difficult-to-assemble optical mechanisms, thereby reducing manufacturing costs and improving production yield.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes All changes and modifications should belong to the scope of protection of the appended claims of the present invention.

Claims (22)

1, a kind of encapsulating structure of super-thin optical fingerprint interception module is characterized in that, comprising:

One circuit board;

One image sensing module, being arranged on this circuit board of its electric connection;

One light emitting module, being arranged on this circuit board of its electric connection; And

One encapsulation lid, it is arranged on this circuit board, and this encapsulation lid has the second perforate unit that first a perforate unit and that is used to expose this image sensing module is used to expose this light emitting module.

2, the encapsulating structure of super-thin optical fingerprint interception module according to claim 1 is characterized in that, this image sensing module is made up of one or several complementary MOS image sensor chips.

3, the encapsulating structure of super-thin optical fingerprint interception module according to claim 2 is characterized in that, this first perforate unit is that one or several are used for first perforate of those complementary MOS image sensor chips of corresponding exposure.

4, the encapsulating structure of super-thin optical fingerprint interception module according to claim 1 is characterized in that, this light emitting module is made up of one or several luminescence components.

5, the encapsulating structure of super-thin optical fingerprint interception module according to claim 4 is characterized in that, this second perforate unit is that one or several are used for second perforate of corresponding those luminescence components of exposure.

6, the encapsulating structure of super-thin optical fingerprint interception module according to claim 1 is characterized in that, what the mode of this image sensing module by routing or surface adhering technology electrically connected is arranged on this circuit board.

7, the encapsulating structure of super-thin optical fingerprint interception module according to claim 1 is characterized in that, what the mode of this light emitting module by routing or surface adhering technology electrically connected is arranged on this circuit board.

8, the encapsulating structure of super-thin optical fingerprint interception module according to claim 1 is characterized in that, this image sensing module and this light emitting module all by several plain conductors to be electrically connected at this circuit board.

9, the encapsulating structure of super-thin optical fingerprint interception module according to claim 8 is characterized in that, also further comprises: one is used to protect those plain conductors to guarantee the electrical protection lid that contacts of this light emitting module and this circuit board.

10, the encapsulating structure of super-thin optical fingerprint interception module according to claim 8, it is characterized in that, the inside of this circuit board forms several conductive traces, and those conductive traces are electrically connected between corresponding those plain conductors and another circuit board.

11, the encapsulating structure of super-thin optical fingerprint interception module according to claim 1 is characterized in that, this circuit board has a pair of first registration holes, and this encapsulation lid has a pair of and this is to corresponding second registration holes of first registration holes.

12, a kind of method for packing of super-thin optical fingerprint interception module is characterized in that, comprises the following steps:

What electrically connect respectively is provided with an image sensing module and a light emitting module on a circuit board;

One encapsulation lid is set on this circuit board, wherein this encapsulation lid has the second perforate unit that first a perforate unit and that is used to expose this image sensing module is used to expose this light emitting module; And

One protection lid is set on this encapsulation lid, to protect electrical contact the between this light emitting module and this circuit board.

13, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, this image sensing module is made up of one or several complementary MOS image sensor chips.

14, the method for packing of super-thin optical fingerprint interception module according to claim 13, it is characterized in that this first perforate unit is that one or several are used for first perforate of those complementary MOS image sensor chips of corresponding exposure.

15, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, this light emitting module is made up of one or several luminescence components.

16, the method for packing of super-thin optical fingerprint interception module according to claim 15 is characterized in that, this second perforate unit is that one or several are used for second perforate of corresponding those luminescence components of exposure.

17, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, what the mode of this image sensing module by routing or surface adhering technology electrically connected is arranged on this circuit board.

18, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, what the mode of this light emitting module by routing or surface adhering technology electrically connected is arranged on this circuit board.

19, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, this image sensing module and this light emitting module all by several plain conductors to be electrically connected at this circuit board.

20, the method for packing of super-thin optical fingerprint interception module according to claim 19, it is characterized in that, the inside of this circuit board forms several conductive traces, and those conductive traces are electrically connected between corresponding those plain conductors and another circuit board.

21, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, this circuit board has a pair of first registration holes, and this encapsulation lid has a pair of and this is to corresponding second registration holes of first registration holes.

22, the method for packing of super-thin optical fingerprint interception module according to claim 12 is characterized in that, this encapsulation lid is by being finished by injection molding method.

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