CN101024260A - Polishing pad with surface texture and its manufacturing method and manufacturing device - Google Patents
Polishing pad with surface texture and its manufacturing method and manufacturing device Download PDFInfo
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- CN101024260A CN101024260A CNA2006100576859A CN200610057685A CN101024260A CN 101024260 A CN101024260 A CN 101024260A CN A2006100576859 A CNA2006100576859 A CN A2006100576859A CN 200610057685 A CN200610057685 A CN 200610057685A CN 101024260 A CN101024260 A CN 101024260A
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- 238000005498 polishing Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract 17
- 239000000463 material Substances 0.000 claims description 77
- 238000000034 method Methods 0.000 claims description 29
- 239000002131 composite material Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 229920001410 Microfiber Polymers 0.000 claims 1
- 239000003658 microfiber Substances 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 abstract 1
- 239000002649 leather substitute Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 16
- 238000009434 installation Methods 0.000 description 14
- 210000002421 cell wall Anatomy 0.000 description 12
- 230000000977 initiatory effect Effects 0.000 description 9
- 239000008267 milk Substances 0.000 description 7
- 210000004080 milk Anatomy 0.000 description 7
- 235000013336 milk Nutrition 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000005304 optical glass Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The invention relates to a polishing pad with surface grains and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: providing a substrate having a surface for polishing an article to be polished; (b) providing a high-energy laser which can move freely; and (c) forming a surface texture on the surface of the substrate using the high energy laser. Therefore, the manufactured polishing pad does not generate burrs or deformation, and can keep good flowing of abrasive slurry during use, so that an object to be polished can not be scratched. In addition, the required surface texture can be rapidly and accurately manufactured by a high-energy laser mode, and the reproducibility is extremely high.
Description
Technical field
The present invention relates to a kind of have surface grain containing polishing cushion and its manufacture method and manufacturing installation, in particular to a kind of utilization movably high energy laser be processed to form surface grain containing polishing cushion and its manufacture method and manufacturing installation.
Background technology
Polishing generally is meant in cmp (CMP) processing procedure, for the abrasion control that just is rough surface, it is to utilize the grinding milk contain fine particle on average to be scattered in the upper surface of a polishing pad, rubs mill with the hands to repeat the rule action after simultaneously a polished object being propped up described polishing pad.Described polished object is such as objects such as semiconductor, medium base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panels.For the distribution of keeping described grinding milk with flow and cmp after planarization and grinding efficiency, can offer a plurality of grooves on the upper surface of described polishing pad usually or form a surface pattern.Therefore, described polishing pad is vulnerable to the influence of described groove or described surface pattern for the polishing effect of described polished object.
With reference to figure 1, the demonstration TaiWan, China is announced the manufacture method with surface grain containing polishing cushion that patent disclosed No. 491758.Shown in Figure 1 is a kind of method of serigraphy, and its step is as described below.One flexible parent metal 10 is provided by a reel, and with by silk screen model that another reel provided 11 for and column position, described silk screen model 11 has plurality of patterns 111.Place with described silk screen model 11 with a polymerism raw material 12 to contact, force by a scraper 13 to enter and pattern 111 by described silk screen model 11, and contact described flexible parent metal 10.Then, the polymerism raw material 12 on described silk screen model 11 and the described flexible parent metal 10 wears out by one and distinguishes 14, and described aging district 14 can be a kind of baker or UV radiation, with the polymerism raw material 12 on the aging described flexible parent metal 10, makes the aging coating 15 of its formation.Described silk screen model 11 removes after wearing out and reels.At last, the flexible parent metal with described aging coating 15 10 of gained can cut into a plurality of polishing pads after reeling.
In addition, United States Patent (USP) discloses for No. 5489233 to be made by mould molding (embossing), embossing (pressing), cast (casting), cutting (cutting) or photoetching modes such as (photolithograph) and has surface grain containing polishing cushion.
Yet the surface grain containing polishing cushion made from cutting way that has is easy to generate burr and detritus, and semiconductor, medium base material, integrated circuit, LCD flat panel glass, optical glass or the surface of photoelectric panel are produced scratch.Other with modes such as mould molding, embossing and cast made have a surface grain containing polishing cushion, its surface is subjected to the influence of hot pressing and is easy to generate distortion and influences flowing of grinding milk.Moreover in the processing procedure of mould molding and serigraphy, a kind of surface pattern needs a kind of mould or silk screen, can't stablize other polishing pad that produces same furrow width and ditch depth.
With reference to figure 2, the demonstration TaiWan, China is announced the device of No. 590855 manufacturing polishing pad that patent disclosed.Described device 2 comprises a platform 21, a laser aid 22 and computer numerical control controller 23.Described platform 21 is in order to placing a base material 24, and described platform 21 can be rotated motion and three-dimensional moving.Described laser aid 22 is radiated on the surface of described base material 24 in order to produce a laser 25, to form a surface pattern on the surface of described base material 24.Described device 2 moves described platform 21 according to input pattern 26, can make described surface pattern form various micropore, hole or channel patterns.Yet, because described platform 21 is quite heavy and sensitive inadequately, doing three-dimensional move and during rotation when it, there is speed slowly and the low shortcoming of precision.
Therefore, what be necessary to provide a kind of innovation and tool progressive has surface grain containing polishing cushion and its manufacture method and a manufacturing installation, to address the above problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture method with surface grain containing polishing cushion, may further comprise the steps:
(a) provide a base material, described base material has a surface that is used to polish a polished object;
(b) provide a high energy laser that can move freely; With
(c) utilize described high energy laser on the described surface of described base material, to form a surface pattern.
Whereby, made polishing pad can not produce the situation of burr or distortion, can allow grinding milk keep good flowing in use, and can the polished object of scratch.In addition, can produce required surface pattern fast and correctly in the mode of high energy laser, and repeatability is high.
In a preferred embodiment, described step (c) further comprises:
(c1) provide a processing graphic pattern; With
(c2) utilize described high energy laser on the described surface of described polishing pad, to form a surface pattern according to described processing graphic pattern.
Whereby, can design different processing graphic patterns with furrow width, the ditch depth of the groove of the described surface pattern of any adjustment or can form the groove of inclination.
Another object of the present invention is to provide a kind of manufacturing installation, comprise a platform, a high energy laser generation device and a reflection unit with surface grain containing polishing cushion.Described platform is in order to placing a base material, and described base material has a surface, and described surface is in order to polish a polished object.Described high energy laser generation device is in order to produce a high energy laser.Described reflection unit is in order to reflecting described high energy laser to the described surface of described base material, and forms a surface pattern on the described surface of described base material.Whereby, rotate apace via described reflection unit or move and to make described high energy laser on described surface, form described surface pattern apace.
Description of drawings
Fig. 1 shows the manufacture method with surface grain containing polishing cushion of announcing No. 491758 by TaiWan, China patent disclosing;
Fig. 2 shows that TaiWan, China announces the device of No. 590855 manufacturing polishing pad that patent disclosed;
Fig. 3 shows that the present invention has the flow process of the manufacture method of surface grain containing polishing cushion;
Fig. 4 shows the schematic diagram of manufacturing installation first embodiment of polishing pad of the present invention;
Fig. 5 shows the schematic diagram of manufacturing installation second embodiment of polishing pad of the present invention;
Fig. 6 shows the schematic diagram of manufacturing installation the 3rd embodiment of polishing pad of the present invention;
Fig. 7 shows the schematic diagram of the surface pattern that example 1 is processed into;
Fig. 8 shows the schematic diagram of the surface pattern that example 2 is processed into;
Fig. 9 shows the schematic diagram of the surface pattern that example 3 is processed into;
Figure 10 shows the schematic diagram of the surface pattern that example 4 is processed into;
Figure 11 shows the schematic diagram of the surface pattern that example 5 is processed into;
Figure 12 a shows in the example 6 cross-sectional schematic of the circular groove of inner ring;
Figure 12 b shows the cross-sectional schematic of the circular groove of the 38th circle in the example 6; With
Figure 12 c shows the cross-sectional schematic of the circular groove of outmost turns in the example 6.
The specific embodiment
The invention provides a kind of have surface grain containing polishing cushion and its manufacture method, described polishing pad is to be applied in cmp (CMP) processing procedure a polished object be ground or polishes.Described polished object includes but not limited to objects such as semiconductor, medium base material, integrated circuit, LCD flat panel glass, optical glass and photoelectric panel.
With reference to figure 3, the manufacture method of polishing pad of the present invention may further comprise the steps:
(a) provide a base material, described base material has a surface that is used to polish a polished object, as step S21;
(b) provide a high energy laser that can move freely, as step S22; With
(c) utilize the described high energy laser that can move freely on the described surface of described base material, to form a surface pattern, as step S23.
In the step S21 of the inventive method, described base material is one not have the polishing pad of any routine of surface pattern, itself has had the function (but polishing effect and bad) of polishing.Preferably, the material of described base material is a kind of artificial leather, and more preferably, the material of described base material is PU plate, PU and fiber Composite or PU and superfine fibre Composite.
In the step S22 of the inventive method, described high energy laser is provided by a high energy laser generation device that can move freely.Its detailed presentation mode has further narration hereinafter.Preferably, step S23 of the present invention comprises two steps:
(c1) provide a processing graphic pattern; With
(c2) utilize the described high energy laser that can move freely on the described surface of described base material, to form a surface pattern according to described processing graphic pattern.
Wherein said processing graphic pattern is provided by a data processing equipment (a for example computer), and it is to be designed in advance by the user to finish.Described data processing equipment is to be electrically connected with described high energy laser generation device, makes described high energy laser generation device to utilize described high energy laser to form a surface pattern on the described surface of described base material according to described processing graphic pattern.Described processing graphic pattern includes but not limited to following pattern: 1. the sub-shape figure of checked spun antung that intersects of straight line; 2. the sub-shape figure of checked spun antung that intersects of straight line and comprise a plurality of roundlets hole; 3. concentric circles figure; 4. concentric circles figure and comprise a plurality of roundlets hole and 5. literal or symbol figure.
" surface pattern " used herein speech is meant lines or the pattern that is made of a plurality of grooves or circle hole on the described surface of described base material, it is formed according to the partial volume that above-mentioned processing graphic pattern removes described base material with laser processing mode.The corresponding described processing graphic pattern of described surface pattern, its vertical view includes but not limited to following pattern: 1. a plurality of staggered straight-line grooves that are perpendicular to one another (corresponding above-mentioned the 1st kind of processing graphic pattern); 2. a plurality of staggered straight-line grooves and comprise a plurality of holes (corresponding above-mentioned the 2nd kind of processing graphic pattern) of being perpendicular to one another; 3. the circular groove of plural number circle different radii, and described circular groove is concentric (corresponding above-mentioned the 3rd kind of processing graphic pattern); 4. concentric circles figure and comprise the groove (above-mentioned the 5th kind of processing graphic pattern of correspondence) of a plurality of holes (corresponding above-mentioned the 4th kind of processing graphic pattern) and 5. a plurality of literal or symbol profile.
With reference to figure 4, show the schematic diagram of manufacturing installation first embodiment of polishing pad of the present invention.Described manufacturing installation 3 comprises a platform 31, a high energy laser generation device (a for example laser aid 32), a data processing equipment 33.Described platform 31 is in order to placing a base material 34, and described base material 34 has a surface 341, and described surperficial 341 is in order to polishing one polished object in other processing procedure.In the present embodiment, described high energy laser generation device is a laser aid 32, and it further comprises a laser head 321, in order to produce a high energy laser 35.Described data processing equipment 33 is controlled described laser aid 32 according to the processing graphic pattern of input, so that described high energy laser 35 forms surface pattern on described surperficial 341.
In the present embodiment, the position of described platform 31 is fixed, and the position of described laser aid 32 also is fixing.Two ends of described high energy laser 35 are respectively an initiating terminal 351 and a processing end 352, and described initiating terminal 351 is sent by described laser aid 32, and described processing end 352 is in order to contact and processes described base material 34.Therefore described high energy laser is straight line outward appearances from described initiating terminal 351 to described processing end 352, and because described laser head 321 is rotatable, and described processing end can be done the circumference formula and moves, and forms circular arc or circular groove.In the surface pattern after utilizing the processing unit (plant) of present embodiment to process, have an inclination angle between the vertical direction on the cell wall of described groove and the described surface of described base material, in for example above-mentioned the 3rd kind concentrically ringed surface pattern, inclination angle between the vertical direction on the cell wall of the circular groove of each circle and the described surface of described base material is all different, and described inclination angle is to increase progressively to the outer ring from inner ring.
With reference to figure 5, show the schematic diagram of manufacturing installation second embodiment of polishing pad of the present invention.Described manufacturing installation 4 comprises a platform 41, a high energy laser generation device (a for example laser aid 42), a data processing equipment 43.Described platform 41 is in order to placing a base material 44, and described base material 44 has a surface 441, and described surperficial 441 is in order to polishing one polished object in other processing procedure.In the present embodiment, described high energy laser generation device is a laser aid 42, and it further comprises a laser head 421, in order to produce a high energy laser 45.Described data processing equipment 43 is controlled described laser aid 42 according to the processing graphic pattern of input, so that described high energy laser 45 forms surface pattern on described surperficial 441.
In the present embodiment, the position of described platform 41 is fixed, and described laser aid 42 can move in the horizontal direction.Two ends of described high energy laser 45 are respectively an initiating terminal 451 and a processing end 452, and described initiating terminal 451 is sent by described laser aid 42, and described processing end 452 is in order to contact and processes described base material 44.Described high energy laser 45 is straight line outward appearances from described initiating terminal 451 to described processing end 452, and in the process that described laser aid 42 moves, described high energy laser 45 keeps vertical with the surface 441 of described base material 44, and form the linear groove, and the cell wall of described groove is vertical haply with the described surface of described base material.
With reference to figure 6, show the schematic diagram of manufacturing installation the 3rd embodiment of polishing pad of the present invention.Described manufacturing installation 5 comprises a platform 51, a high energy laser generation device (a for example laser aid 52), a data processing equipment 53 and a reflection unit 56.Described platform 51 is in order to placing a base material 54, and described base material 54 has a surface 541, and described surperficial 541 is in order to polishing one polished object in other processing procedure.In the present embodiment, described high energy laser generation device is a laser aid 52, and it further comprises a laser head 521, in order to produce a high energy laser 55.Described data processing equipment 53 is controlled described laser aid 52 and described reflection unit 56 according to the processing graphic pattern of input, make the described high energy laser 55 of described reflection unit 56 reflections described surperficial 541 to described base material 54, and in described base material 54 described surperficial 541 on form a surface pattern.
In the present embodiment, the position of described platform 51 is fixed, and the position of described laser aid 52 is fixed.Two ends of described high energy laser 55 are respectively an initiating terminal 551 and a processing end 552, and described initiating terminal 551 is sent by described laser aid 52, and described processing end 552 is in order to contact and processes described base material 54.Described high energy laser 55 is made up of plurality of sections to 552 at described processing end described initiating terminal 551, and described section has different directions respectively.In the present embodiment, described reflection unit 56 comprises one or more eyeglass, and described eyeglass is removable or rotatable, and can apace described processing end 552 be reflexed to the desired position.Yet be understandable that described reflection unit 56 also can be other device with reflection function.
The present invention has a surface grain containing polishing cushion about a kind of in addition, and it comprises a base material and a surface pattern.Described base material has a surface, and described surface is in order to polishing a polished object, and described surface pattern is to be formed on the described surface of described base material by a high energy laser that can move freely.
Preferably, the material of described base material is a kind of artificial leather, and more preferably, the material of described base material is PU plate, PU and fiber Composite or PU and superfine fibre Composite.
Preferably, high energy laser energy of the present invention be 10W to 85W, frequency be 500Hz to 10KHz, sweep speed is that 100mm/sec is to 5000mm/sec.Preferably, described surface pattern is to be formed on a surface of described polishing pad according to a processing graphic pattern by a high energy laser.Wherein said processing graphic pattern is provided by a data processing equipment (a for example computer), and it is to be designed in advance by the user to finish.Described processing graphic pattern includes but not limited to following pattern: 1. the sub-shape figure of checked spun antung that intersects of straight line; 2. the sub-shape figure of checked spun antung that intersects of straight line and comprise a plurality of roundlets hole; 3. concentric circles figure and 4. concentric circles figures and comprise a plurality of roundlets hole and 5. literal or symbol figure.
Surface pattern on the described polishing pad is lines or the pattern that is made of a plurality of grooves or circle hole, it is corresponding described processing graphic pattern, so its vertical view includes but not limited to following pattern: 1. a plurality of staggered straight-line grooves that are perpendicular to one another (corresponding above-mentioned the 1st kind of processing graphic pattern); 2. a plurality of staggered straight-line grooves and comprise a plurality of holes (corresponding above-mentioned the 2nd kind of processing graphic pattern) of being perpendicular to one another; 3. the circular groove of plural number circle different radii, and described circular groove is for (corresponding above-mentioned the 3rd kind of processing graphic pattern) and 4. concentric circles figures with one heart and comprises the groove (above-mentioned the 5th kind of processing graphic pattern of correspondence) of a plurality of holes (corresponding above-mentioned the 4th kind of processing graphic pattern) and 5. a plurality of literal or symbol profile.
In the present invention, under normal conditions, the cell wall of described groove is all perpendicular to the described surface of described base material.Yet under some specific situation, have an inclination angle between the vertical direction on the cell wall of described groove and the described surface of described base material, in for example above-mentioned the 3rd kind concentrically ringed surface pattern, inclination angle between the vertical direction on the cell wall of the circular groove of each circle and the described surface of described base material is all different, and described inclination angle is to increase progressively to the outer ring from inner ring.
Now described in detail the present invention, but do not meaned the content that the present invention only is confined to these examples and is disclosed with following example.
Example 1:
At first, provide a base material, described base material has a surface that is used to polish a polished object, and the material of described base material is the PU artificial leather.Then, set processing graphic pattern in a computer, the processing graphic pattern of this example is the sub-shape figure of checked spun antung that straight line intersects.Then, provide a high energy laser, the parameter of the high energy laser of this example is: sweep speed 850mm/sec, frequency 10kHz, energy 37W.
With reference to figure 7, show the schematic diagram of the surface pattern that example 1 is processed into.Form the circular polishing pad of the diameter 51cm with surface pattern via the parameter of above-mentioned high energy laser and the output of the processing graphic pattern in the computer in the delineation of the surface of described PU artificial leather.Described surface pattern comprises a plurality of straight-line grooves.The cell wall of described groove is perpendicular to the surface of described PU artificial leather.To watch be to be perpendicular to one another staggered and to form a plurality of positive cubic lattice to described groove by overlooking, and the length of side of each positive cubic lattice is 2mm.The furrow width that records described groove with sweep electron microscope (SEM) is that 0.45mm, ditch depth are 0.6mm.
Example 2:
At first, provide a base material, described base material has a surface that is used to polish a polished object, and the material of described base material is the PU artificial leather.Then, set processing graphic pattern in a computer, the processing graphic pattern of this example is the sub-shape figure of checked spun antung of straight line intersection and comprises a plurality of roundlets hole.Then, provide a high energy laser, the parameter of the high energy laser of this example is: sweep speed 430mm/sec, frequency 10kHz, energy 35W.
With reference to figure 8, show the schematic diagram of the surface pattern that example 2 is processed into.Form the circular polishing pad of the diameter 51cm with surface pattern via the parameter of above-mentioned high energy laser and the output of the processing graphic pattern in the computer in the delineation of the surface of described PU artificial leather.Described surface pattern comprises a plurality of straight-line grooves and comprises a plurality of holes.The cell wall of described groove and hole is perpendicular to the surface of described PU artificial leather.To watch be to be perpendicular to one another staggered and to form a plurality of positive cubic lattice to described groove by overlooking, and the length of side of each positive cubic lattice is 3.1mm.The furrow width that records described groove with sweep electron microscope (SEM) is that 0.8mm, ditch depth are 0.45mm.Described groove is perpendicular to one another staggered and forms a plurality of cross-points, and described hole is positioned on the described cross-point, and the diameter of each hole is 1.2mm.Described hole can allow grinding milk keep good flowing, and can the polished object of scratch.
Example 3:
At first, provide a base material, described base material has a surface that is used to polish a polished object, and the material of described base material is the PU artificial leather.Then, set processing graphic pattern in a computer, the processing graphic pattern of this example is the concentric circles figure.Then, provide a high energy laser, the parameter of the high energy laser of this example is: sweep speed 2000mm/sec, frequency 10kHz, energy 32W.
With reference to figure 9, show the schematic diagram of the surface pattern that example 3 is processed into.Form the circular polishing pad of the diameter 51cm with surface pattern via the parameter of above-mentioned high energy laser and the output of the processing graphic pattern in the computer in the delineation of the surface of described PU artificial leather.Described surface pattern is the circular groove that comprises plural number circle different radii, and described circular groove is concentric.The cell wall of described groove is perpendicular to the surface of described PU artificial leather.To watch be 75 circle concentric circles to described groove by overlooking, and the distance between neighboring concentric circle is 2.9mm.The furrow width that records described groove with sweep electron microscope (SEM) is that 0.8mm, ditch depth are 0.45mm.
Example 4:
At first, provide a base material, described base material has a surface that is used to polish a polished object, and the material of described base material is the PU artificial leather.Then, set processing graphic pattern in a computer, the processing graphic pattern of this example is the concentric circles figure and comprises a plurality of roundlets hole.Then, provide a high energy laser, the parameter of the high energy laser of this example is: sweep speed 2000mm/sec, frequency 10kHz, energy 32W.
With reference to Figure 10, show the schematic diagram of the surface pattern that example 4 is processed into.Form the circular polishing pad of the diameter 51cm with surface pattern via the parameter of above-mentioned high energy laser and the output of the processing graphic pattern in the computer in the delineation of the surface of described PU artificial leather.Described surface pattern comprises circular groove and a plurality of hole of plural number circle different radii, and described circular groove is concentric.The cell wall of described groove is perpendicular to the surface of described PU artificial leather.To watch be 75 circle concentric circles to described groove by overlooking, and the distance between neighboring concentric circle is 2.9mm.The furrow width that records described groove with sweep electron microscope (SEM) is that 0.8mm, ditch depth are 0.45mm.Described hole is positioned on the described circular groove, and the diameter of each hole is 1.5mm.Described hole can allow grinding milk keep good flowing, and can the polished object of scratch.The distribution mode of described hole is that the number of circular groove hole of past more outer ring is many more and intensive more, and promptly the distribution density of described hole is to be increased progressively to the outer ring by inner ring.In Figure 10, inner ring is that first lap does not have hole, and second circle has two equidistant holes, and the 3rd circle has 2
(3-1)Individual equidistant hole, the 4th circle has 2
(4-1)Individual equidistant hole, n circle promptly have 2 (
N-1)Individual equidistant hole.
Example 5:
At first, provide a base material, described base material has a surface that is used to polish a polished object, and the material of described base material is the PU artificial leather.Then, set processing graphic pattern in a computer, the processing graphic pattern of this example is concentric circles figure, a plurality of radial straight lines and a plurality of roundlets hole.Then, provide a high energy laser, the parameter of the high energy laser of this example is: sweep speed 2000mm/sec, frequency 10kHz, energy 32W.
With reference to Figure 11, show the schematic diagram of the surface pattern that example 5 is processed into.Form the circular polishing pad of the diameter 51cm with surface pattern via the parameter of above-mentioned high energy laser and the output of the processing graphic pattern in the computer in the delineation of the surface of described PU artificial leather.Described surface pattern comprises circular groove, a plurality of straight-line grooves and a plurality of hole of plural number circle different radii, and described circular groove is concentric, described straight-line groove is radial, and described straight-line groove is to intersect with described circular groove and form described cross-point.Part described hole is positioned on the described cross-point, and another part described hole is positioned on the circular groove.
In Figure 11, the distance between the neighboring concentric circle is 2.9mm.The furrow width that records described groove with sweep electron microscope (SEM) is that 0.8mm, ditch depth are 0.45mm.The diameter of each hole is 1.5mm.Described hole can allow grinding milk keep good flowing, and can the polished object of scratch.The distribution mode of described hole is that the number of circular groove hole of past more outer ring is many more and intensive more, and promptly the distribution density of described hole is to be increased progressively to the outer ring by inner ring.
Example 6:
At first, provide a base material, described base material has a surface that is used to polish a polished object, and the material of described base material is the PU artificial leather.Then, set processing graphic pattern in a computer, the processing graphic pattern of this example is the concentric circles figure.Then, provide a high energy laser, the parameter of the high energy laser of this example is: sweep speed 2000mm/sec, frequency 10kHz, energy 30W.
Form the circular polishing pad of the diameter 51cm with surface pattern via the parameter of above-mentioned high energy laser and the output of the processing graphic pattern in the computer in the delineation of the surface of described PU artificial leather.Described surface pattern comprises the circular groove of plural number circle different radii, and described circular groove is concentric.To watch be 75 circle concentric circles to described groove by overlooking, and the distance between neighboring concentric circle is 2.8mm.The furrow width that records described groove with sweep electron microscope (SEM) is that 0.8mm, ditch depth are 0.45mm.Different with example 3 is, in this example, have an inclination angle between the vertical direction on the surface of the cell wall of described groove and described PU artificial leather, and the inclination angle between the vertical direction on the cell wall of the circular groove of each circle and the described surface of described base material is all different, and described inclination angle is to be increased progressively to the outer ring by inner ring, the inclination angle of wherein inner ring is 0 degree (shown in Figure 12 a), the inclined angle alpha of the 38th circle groove in the middle of being positioned at
1Be 10 degree (shown in Figure 12 b), the inclined angle alpha of outmost turns groove
2Be 20 degree (shown in Figure 12 c).
But the foregoing description only is explanation principle of the present invention and its effect, but not in order to restriction the present invention.Therefore, the those skilled in the art can make amendment to the foregoing description under the situation of spirit of the present invention and change.Interest field of the present invention should be listed as above-mentioned claims.
Claims (23)
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2006100576859A CN101024260A (en) | 2006-02-24 | 2006-02-24 | Polishing pad with surface texture and its manufacturing method and manufacturing device |
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| CNA2006100576859A CN101024260A (en) | 2006-02-24 | 2006-02-24 | Polishing pad with surface texture and its manufacturing method and manufacturing device |
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| CN101024260A true CN101024260A (en) | 2007-08-29 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102211319A (en) * | 2010-04-08 | 2011-10-12 | 三芳化学工业股份有限公司 | Method of manufacturing polishing pad and polishing pad |
| CN102498549A (en) * | 2009-07-16 | 2012-06-13 | 嘉柏微电子材料股份公司 | Grooved cmp polishing pad |
| US9862071B2 (en) | 2009-09-22 | 2018-01-09 | San Fang Chemical Industry Co., Ltd. | Method for manufacturing polishing pad and polishing pad |
| CN109531453A (en) * | 2018-11-29 | 2019-03-29 | 深圳市汉通实业有限公司 | A kind of spiral shape polished leather production method |
| CN113165120A (en) * | 2018-10-30 | 2021-07-23 | 浜松光子学株式会社 | Laser processing device and laser processing method |
| US11897056B2 (en) | 2018-10-30 | 2024-02-13 | Hamamatsu Photonics K.K. | Laser processing device and laser processing method |
| US12275091B2 (en) | 2018-10-30 | 2025-04-15 | Hamamatsu Photonics K.K. | Laser processing apparatus and laser processing method |
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| CN102498549A (en) * | 2009-07-16 | 2012-06-13 | 嘉柏微电子材料股份公司 | Grooved cmp polishing pad |
| US9862071B2 (en) | 2009-09-22 | 2018-01-09 | San Fang Chemical Industry Co., Ltd. | Method for manufacturing polishing pad and polishing pad |
| CN102211319A (en) * | 2010-04-08 | 2011-10-12 | 三芳化学工业股份有限公司 | Method of manufacturing polishing pad and polishing pad |
| CN113165120A (en) * | 2018-10-30 | 2021-07-23 | 浜松光子学株式会社 | Laser processing device and laser processing method |
| US11833611B2 (en) | 2018-10-30 | 2023-12-05 | Hamamatsu Photonics K.K. | Laser machining device |
| US11897056B2 (en) | 2018-10-30 | 2024-02-13 | Hamamatsu Photonics K.K. | Laser processing device and laser processing method |
| US12275091B2 (en) | 2018-10-30 | 2025-04-15 | Hamamatsu Photonics K.K. | Laser processing apparatus and laser processing method |
| CN109531453A (en) * | 2018-11-29 | 2019-03-29 | 深圳市汉通实业有限公司 | A kind of spiral shape polished leather production method |
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