CN101014236B - A method and device for dissipating heat from electronic components on a circuit board - Google Patents

Abstract

The invention discloses a method for dissipating heat from electronic components on a circuit board. The method comprises: dividing the electronic components on the circuit board into multiple groups; Lead to each group of electronic components away from the air inlet; and guide the airflow of each group of electronic components away from the air outlet to the outside of the circuit board through the air outlet guide channel formed on the circuit board, so that the airflow that has passed through a group of electronic components The airflow of the electronic components does not pass through other groups of electronic components; wherein, the air inlet guide channel and the air outlet guide channel are arranged according to the length direction of the arrangement of the electronic components. In this way, the formation of heat stacks in the airflow direction is avoided, thereby improving the heat dissipation effect. The invention simultaneously discloses a circuit board, an air distribution device and a communication device.

Description

A method and device for dissipating heat from electronic components on a circuit board

technical field

The invention relates to the communication field, in particular to a method and device for dissipating heat from electronic components on a circuit board.

Background technique

At present, a subrack is the basic form of a complete communication device. Referring to FIG. 1 , a plurality of printed circuit boards (PCB boards 2 ) are inserted side by side in a subrack 1 . The PCB board 2 is plugged into the subrack 1 and electrically communicated with the mother board to obtain power and realize communication with other PCB boards 2 in the subrack 1 at the same time. There are various electronic heating devices on the PCB board 2 , so the airflow generally needs to flow through the PCB board 2 from bottom to top to dissipate heat for each PCB board 2 .

The following uses a 10Gb small pluggable optical transceiver module (XFP optical module) on the PCB 2 as an example for illustration. As shown in FIG. 2, the XFP optical module is an important high-speed input and output component on the communication equipment PCB 2. It can not only achieve a transmission rate of 10Gbps, but also has a compact shape, can be hot-swapped, and is easy to install. The XFP optical module is a temperature-sensitive device, and the temperature has a great influence on the stability of its transmission performance. The shell temperature of most XFP optical modules is required to be controlled below 70 degrees Celsius, so a radiator needs to be added, and sufficient airflow must be ensured to flow through the optical module.

As shown in FIG. 2 , with the rapid development of communication equipment technology, multiple XFP optical modules 3 need to be arranged side by side on a panel 4 of a PCB board 2 . This arrangement leads to a great deterioration of the heat dissipation capability of the XFP optical module 3 from the following two aspects:

1. Since the XFP optical modules 3 all have radiators, the air resistance of the optical module array is much larger than that of the adjacent area, and a large amount of airflow will be bypassed from the low air resistance area next to it, resulting in serious air volume passing through the optical module group. insufficient.

2. Along the direction of the airflow, the heat emitted by the optical module upstream of the airflow will be carried downstream, so that the temperature of the optical module at the downstream position of the airflow will rise. The closer to the air outlet side, the higher the temperature of the optical module is, It is easy to exceed the allowable maximum temperature (about 70 degrees Celsius), thereby affecting the transmission performance of the XFP optical module 3, or even failing to work normally.

A solution to the above problems is also proposed in the prior art. Referring to FIG. 3, a deflector 5 is provided on the PCB 2 to guide the bypassed airflow to the optical module, thereby increasing the airflow passing through the optical module. , so the heat dissipation performance can be improved to some extent. In the case of a large number of optical modules, this solution still cannot overcome the problem that the heat of the XFP optical module 3 is superimposed in the airflow direction, resulting in a gradual increase in temperature.

Contents of the invention

Embodiments of the present invention provide a method and device for dissipating heat from electronic components on a circuit board, so as to avoid heat stacks formed in the direction of airflow, thereby improving the heat dissipation effect.

A method for dissipating heat from electronic components on a circuit board. The electronic components on the circuit board are divided into groups; Each group of electronic components; and the airflow of each group of electronic components far away from the air outlet is guided to the outside of the circuit board through the air outlet guide channel formed on the circuit board, so that the airflow that has passed through one group of electronic components is no longer Through other groups of electronic components; among them, the first partition and the second partition are arranged on the same side of multiple groups of electronic components, and the air inlet guide channel is formed by the first partition, the second partition and the area away from the electronic components and the air outlet guide channel, and the air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection.

A method for dissipating heat from electronic components on a circuit board. The electronic components on the circuit board are divided into groups; Each group of electronic components; and the airflow of each group of electronic components far away from the air outlet is guided to the outside of the circuit board through the air outlet guide channel formed on the circuit board, so that the airflow that has passed through one group of electronic components is no longer Pass through other groups of electronic components; among them, the motherboard is provided on the circuit board, and the first partition is provided on the same side of the motherboard, and the air inlet guide channel is formed by the first partition, the motherboard and the area away from the electronic components and the air outlet guide channel, and the air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection.

A circuit board comprising:

Printed circuit board PCB;

a panel fixed to one side of the PCB;

electronic components installed on the PCB, the electronic components are divided into at least two groups and arranged along the length direction of the panel;

The air inlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air inlet guide channel respectively guides the airflow to each group of electronic components away from the air inlet;

The air outlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air outlet guide channel guides the airflow of each group of electronic components away from the air outlet to the outside of the PCB board, and The air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection;

Wherein, the air inlet guide channel and the air outlet guide channel intersect in the adjacent areas of two adjacent groups of electronic components, and the electronic components are arranged on the side of the PCB board close to the panel. When the PCB board is relatively shallow, the A first partition is provided on a side of the electronic component away from the panel, and the first partition and a region away from the electronic component form the air inlet guide channel and the air outlet guide channel.

A circuit board comprising:

Printed circuit board PCB;

a panel fixed to one side of the PCB;

electronic components installed on the PCB, the electronic components are divided into at least two groups and arranged along the length direction of the panel;

The air inlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air inlet guide channel respectively guides the airflow to each group of electronic components away from the air inlet;

The air outlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air outlet guide channel guides the airflow of each group of electronic components away from the air outlet to the outside of the PCB board, and The air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection; the air inlet guide channel and the air outlet guide channel intersect in adjacent areas of two adjacent groups of electronic components;

a backplane, arranged on the side of the PCB opposite to the panel;

Wherein, the electronic component is arranged on the side of the PCB close to the backboard, and the side of the electronic component away from the backboard is provided with a partition, and the partition and the panel form the air inlet guide channel and Outlet guide channel.

A circuit board comprising:

Printed circuit board PCB;

a panel fixed to one side of the PCB;

electronic components installed on the PCB, the electronic components are divided into at least two groups and arranged along the length direction of the panel;

The air inlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air inlet guide channel respectively guides the airflow to each group of electronic components away from the air inlet;

The air outlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air outlet guide channel guides the airflow of each group of electronic components away from the air outlet to the outside of the PCB board, and The air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection; the air inlet guide channel and the air outlet guide channel intersect in adjacent areas of two adjacent groups of electronic components;

The backplane is arranged on the side of the PCB opposite to the panel.

Wherein, the electronic component is arranged in the adjacent area of the panel and the back plate, and a partition is provided on the side of the electronic component close to the panel, and the air inlet guide is formed by the partition and the panel. channel and the air outlet guide channel; or, the electronic component is arranged in the adjacent area between the panel and the back plate, and a partition is provided on the side of the electronic component close to the back plate, and the partition The air inlet guide channel and the air outlet guide channel are formed with the back plate.

An air distribution device for use on a circuit board, comprising:

Distribution part, with two airflow channels that are staggered and isolated;

a spacer, fixed on opposite sides of the distribution part, and extending away from the distribution part, so as to extend the two airflow passages;

Wherein, when the airflow distribution device is arranged on the circuit board, the air inlet guiding channel formed by the two airflow channels on the circuit board guides the airflow to each group of electronic components away from the air inlet respectively, and the two airflow channels The air outlet guide channel formed on the circuit board guides the airflow passing through each group of electronic components away from the air outlet to the outside of the circuit board, so that the airflow that has passed through one group of electronic components will not pass through other groups of electronic components. Components; the air inlet guide channel and the air outlet guide channel are arranged according to the length direction of the arrangement of the electronic components.

A communication device, comprising a box, a motherboard installed in the box, and a plurality of circuit boards inserted into the motherboard; the circuit boards include:

Printed circuit board PCB;

a panel fixed to one side of the PCB;

Electronic components installed on the side of the PCB close to the panel, the electronic components are at least divided into two groups and arranged along the length direction of the panel;

The air inlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air inlet guide channel respectively guides the airflow to each group of electronic components away from the air inlet;

The air outlet guide channel is arranged on the PCB board along the length direction of the arrangement of the electronic components, and the air outlet guide channel guides the airflow of each group of electronic components away from the air outlet to the outside of the PCB board, and The air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection,

Wherein, when the PCB board is relatively shallow, a first partition is provided on the side of the electronic component away from the panel, and the first partition and the area away from the electronic component form the air inlet guide channel and Outlet guide channel.

In the embodiment of the present invention, the temperature-sensitive electronic components on the circuit board are divided into multiple groups, and the airflow is respectively guided to each group of electronic components away from the air inlet through the air inlet guide channel formed on the circuit board; and The airflow passing through each group of electronic components away from the air outlet is guided to the outside of the circuit board through the air outlet guide channel formed on the circuit board; in this way, the airflow that has passed through one group of electronic components will not pass through any other group. Electronic components, thereby avoiding the formation of heat stacks in the airflow direction, thereby improving the heat dissipation effect and prolonging the service life of temperature-sensitive electronic components.

Description of drawings

FIG. 1 is a schematic diagram of a subrack and a PCB board in a communication device in the prior art;

Fig. 2 is a schematic diagram of the structure of the first PCB board in the prior art;

Fig. 3 is a schematic diagram of the structure of the second PCB board in the prior art;

Fig. 4 is a schematic diagram of grouping of XFP optical modules on the PCB in an embodiment of the present invention;

Fig. 5 is the schematic diagram of the structure of the first PCB board in the embodiment of the present invention;

6A and 6B are schematic diagrams of the structure of the second PCB board in the embodiment of the present invention;

Fig. 7 is the PCB board schematic diagram that adds cover plate in the embodiment of the present invention;

Fig. 8 is a schematic diagram of the structure of the third PCB board in the embodiment of the present invention;

Fig. 9 is a schematic diagram of the structure of the fourth PCB board in the embodiment of the present invention;

Fig. 10 is a schematic structural diagram of the first air distribution device in the embodiment of the present invention;

Fig. 11 is a schematic structural diagram of the second air distribution device in the embodiment of the present invention;

Fig. 12 is a schematic diagram of the structure of the fifth PCB board in the embodiment of the present invention;

Fig. 13 is a schematic diagram of the structure of the sixth PCB board in the embodiment of the present invention.

Detailed ways

In this embodiment, the electronic components on the circuit board are divided into multiple groups, after the airflow is introduced from the air inlet of the circuit board, the airflow is respectively guided to each group of electronic components far away from the air inlet by the air inlet guide channel, and The airflow passing through each group of electronic components away from the air outlet is guided to the outside of the circuit board by the air outlet guiding channel, so that the airflow that has passed through one group of electronic components does not pass through other groups of electronic components.

The electronic components may be various temperature-sensitive electronic components, for example, a pluggable optical transceiver module (XFP optical module). The electronic components arranged on the printed circuit board (PCB board) are divided into two groups or more than two groups, and the air inlet guide channel and the air outlet guide channel are arranged on the PCB board along the length direction of the arrangement of the electronic components. channel, and the air outlet guide channel and the air inlet guide channel are isolated from each other at the intersection; in order to reduce wind resistance, a certain distance can be separated between two adjacent groups of electronic components on the PCB board, and the air inlet guide The guide channel and the air outlet guide channel intersect and extend to the corresponding electronic components within this distance; in certain cases, the corresponding air inlet channels can also be set without a distance between two adjacent groups of electronic components on the PCB board. The guide channel and the air outlet guide channel do not affect the implementation effect of this embodiment.

The following takes the PCB board 2 provided with a small pluggable optical transceiver module (XFP optical module) as an example for detailed introduction.

Referring to Figure 4, the XFP optical modules 3 on the PCB board 2 are divided into two groups, and there is a certain distance between the first group of XFP optical modules 6 and the second group of XFP optical modules 7, each XFP optical module 3 The heat sinks are installed on each group of XFP optical modules 3. The height of the heat sink downstream of the airflow in each group of XFP optical modules 3 is slightly lower than the height of the optical module heat sink upstream of the airflow. In this way, unnecessary wind resistance can be reduced as much as possible, so that all XFP optical module 3 has close heat dissipation capability.

5, the first group of XFP optical modules 6 and the second group of XFP optical modules 7 are provided on the side away from the panel 4, and the first partition 8 is set at a certain distance from the first partition 8. Two partitions 9, the first partition 8, the second partition 9 and the area away from the XFP optical module 3 form the air inlet guide passage shown in Figure 5 (as shown in dotted lines in Figure 5) and the air outlet The guide channel (as shown by the solid line in FIG. 5 ), the air inlet guide channel and the air outlet guide channel are isolated from each other.

The extended part of the wind-in guide channel and the air-out guide channel is groove-shaped (ie groove 10), and forms an upper and lower layer structure; between the first group of XFP optical modules 6 and the second group of XFP optical modules 7 at a distance. The first partition 8 arranged next to the first group of XFP optical modules 6 extends to the side of the panel 4 of the second group of XFP optical modules 7 in this distance, and the first partition arranged next to the second group of XFP optical modules 7 The baffle 8 extends to the second baffle 9 in this distance, thus forming the lower air inlet guide channel shown in FIG. The plate 8 extends to the second partition 9 in this distance, and the first partition 8 arranged next to the second group of XFP optical modules 7 extends to the panel 4 of the first group of XFP optical modules 6 in this distance. side, thus forming the upper air outlet guide channel shown in Figure 5.

When the airflow used to cool the XFP optical module 3 is introduced by the air inlet, the air inlet guide channel guides the airflow to the second group of XFP optical modules 7 away from the air inlet, so that the first group of XFP optical modules 6 and the second group of XFP optical modules 7 can obtain the cooling airflow of the same temperature; when the cooling airflow passes through the two groups of XFP optical modules respectively, the air outlet guide channel will guide the airflow of the first group of XFP optical modules 6 away from the air outlet. Lead to the outside of the PCB board 2, so that the airflow that has cooled the XFP optical module will not pass through any group of XFP optical modules again, thereby avoiding the heat superposition of the airflow and ensuring the transmission performance of the XFP optical module.

In this embodiment, an airflow regulating plate 11 can also be provided near the air inlet of the second partition 9, and the airflow regulating plate 11 can be rotated in a direction close to or away from the panel 4, thereby controlling the size of the input cooling airflow.

On the other hand, referring to Fig. 6A, the extension part of the air inlet guide channel and the air outlet guide channel can also be set as a guide 12, and the air inlet guide channel and the air outlet guide channel pass through the guide channel. The through holes 13 distributed on the through member 12 extend to the first group of XFP optical modules 6 or the second group of XFP optical modules 7 . As shown in Figure 6B, when the cooling air flow is introduced from the air inlet, the air inlet guide channel will guide the cooling air flow into the through hole 13 on the right side of the guide member 12, and the cooling air flow will be guided to the second through hole 13. Group of XFP optical modules 7; and the cooling air flow through the first group of XFP optical modules 6 is guided to the air outlet guide channel by the through hole 13 on the left side of the guide member 12, and the cooling air flow is guided by the air outlet guide channel Exported to the outside of PCB board 2.

In a specific example, the spacing between the PCB boards 2 in the sub-box 1 is 22mm, and correspondingly, the height of the first partition 8, the second partition 9 and the panel 4 is also 22mm, and in the air inlet guide At the intersection of the passage and the air outlet guide passage, the respective heights of the two passages are 11mm. In this way, when the PCB board 2 is inserted into the sub-box 1, the previous PCB board 2 can act as a cover to guide the air inlet. The channel and the air outlet guide channel are sealed. If the distance between the PCB boards 2 is large, a corresponding cover plate can be configured for the PCB board 2 to seal the air inlet guide channel and the air outlet guide channel. Referring to FIG. 7, the cover plate 14 can be fixed on One or more parts of the panel 4, the first partition 8 and the second partition 9. For example, it is detachably fixed on the panel 4 and the first partition 8 , or glued on one or more parts of the panel 4 , the first partition 8 and the second partition 9 .

By analogy, when the XFP optical modules on the PCB 2 are divided into three or more groups according to actual needs, the above method is also applicable. Referring to Figure 8, taking three groups as an example, the first partition 8 is also set on the side away from the panel 4 of the first group of XFP optical modules 15, the second group of XFP optical modules 16 and the third group of XFP optical modules 17, And a second partition 9 is set at a certain distance from the first partition 8, the first partition 8, the second partition 9 and the area away from the XFP optical module form a wind inlet as shown in Figure 8 The guide channel and the air outlet guide channel, the air inlet guide channel and the air outlet guide channel are isolated from each other.

The extensions of the air inlet guide channel and the air outlet guide channel are formed by grooves 10 forming the upper and lower layers, or by cuboid components 12 distributed with through holes 13; there is a gap between two adjacent groups of electronic components. Distance; the air-inlet guide channel extends to the second group of XFP optical modules 16 and the third group of XFP optical modules 17 through the groove 10 or the through hole 13 in this distance, and the air-out guide channel is in this section The distance extends to the first group of XFP optical modules 15 and the second group of XFP optical modules 16 through the groove 10 or the through hole 13 .

When the airflow used to cool the XFP optical module is introduced by the air inlet, the air inlet guide channel guides the airflow to the second group of XFP optical modules 16 and the third group of XFP optical modules 17 away from the air inlet. In this way, The first group of XFP optical modules 15, the second group of XFP optical modules 16 and the third group of XFP optical modules 17 can obtain the cooling airflow at the same temperature; when the cooling airflow passes through the three groups of XFP optical modules respectively, the air outlet guide channel will The airflow passing through the first group of XFP optical modules 15 and the second group of XFP optical modules 16 away from the air outlet is guided to the outside of the PCB board 2, so that the airflow that has cooled the XFP optical modules will not pass through any group of XFP again The optical module also avoids the heat superposition of the airflow and ensures the transmission performance of the XFP optical module.

In this embodiment, at the intersection of the air inlet channel and the air outlet channel, the air inlet channel is on the lower layer and the air outlet channel is on the upper layer. If the relationship between the upper and lower layers of the two channels is reversed, the same processing effect can also be achieved. And in specific cases, referring to shown in Figure 9, if the PCB board 2 is relatively shallow, then when the PCB board 2 is inserted into the motherboard 21, the position where the motherboard 21 contacts the PCB board 2 can play the role of the second partition in Figure 5 9, at this time, the second partition 9 may not be provided.

In this embodiment, there is also provided an air distribution device used on the PCB board 2, as shown in FIG. and isolated two air flow passages, the two air flow passages can be formed by the groove 10 forming the upper and lower structure, and can also be formed by the through hole 13; side, and extend away from the distribution part 18, so as to extend the two airflow passages. Further, the airflow adjustment plate 11 can be set on the spacer 20; like this, when the airflow distribution device is pasted or detachably fixed on the PCB board 2 as shown in Figure 4, the device is connected to the PCB board 2 Combined, when the XFP optical module 3 is cooled, the same airflow distribution effect as that of the PCB board 2 shown in FIG. 5 can be achieved.

When the PCB board 2 matched with the air distribution device is relatively shallow, the air distribution device may not be provided with spacers 20 , wherein the structure is shown in FIG. 11 . When this structure is applied on a circuit board, a structure as shown in FIG. 9 is formed.

The air flow distribution device can also be equipped with a cover plate for sealing the two air flow channels (including the part and the extension part in the distribution part 18), and when the upper and lower layers of the two air flow channels are exchanged, it will also achieve The same air distribution effect.

For the situation where XFP optical modules are divided into three or more groups, as long as multiple air distribution devices are connected and structural adjustments are made according to actual needs, the desired effect can be achieved.

On the other hand, in some cases, other temperature-sensitive electronic components are used on the PCB 2 , and at this time, the method mentioned in the above-mentioned embodiments may also be used to dissipate heat from the electronic components.

For example, as shown in FIG. 12 , on the PCB 2 , the electronic components 22 are arranged on one side of the backplane 23 along the direction of the panel 4 , and the backplane 23 and the panel 4 are respectively arranged on opposite sides of the PCB 2 ; When it is necessary to dissipate heat from the electronic components 22, the electronic components 22 are grouped, and a partition is arranged on the side of the electronic components 22 close to the panel 4, and the corresponding air inlet guide channel and the air outlet are formed by the partition and the panel 4. Channels are directed to achieve the desired cooling effect.

As another example, as shown in FIG. 13 , on the PCB board 2 , the backplane 23 is arranged on the side opposite to the panel 4 , and the electronic components 24 are arranged between the panel 4 and the backplane 23 along the direction of the panel 4 area; when the electronic components 24 need to be radiated, the electronic components 24 are grouped, and a partition is arranged on the side of the electronic components 24 close to the panel 4, and the corresponding air inlet guide channel and the panel 4 are formed by the partition and the panel 4 Air outlet guide channel; or, a partition is set on the side of the electronic component 24 near the back plate 23, and the corresponding air inlet guide channel and the air outlet guide channel are formed by the partition and the back plate 23, so that the required cooling effect.

To sum up, in the embodiment of the present invention, the temperature-sensitive electronic components on the PCB board 2 are divided into multiple groups, and the cooling airflow is respectively guided through the air inlet channel and the air guide channel formed on the PCB board 2 To each group of electronic components away from the air inlet; and through the air outlet guide channel formed on the PCB 2, the cooling airflow of each group of electronic components away from the air outlet is guided to the outside of the PCB 2; like this, it has been The airflow passing through one set of electronic components does not pass through any other set of electronic components, thereby avoiding the formation of heat stacks in the airflow direction, thereby improving the heat dissipation effect and prolonging the service life of the electronic components.

Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (31)

1. the method to the performing heat radiation of electric component on the circuit board is characterized in that, the described electronic unit on the circuit board is divided into many groups; By the inlet air guiding channel that on circuit board, forms air-flow is directed into respectively and respectively to organize electronic unit away from air intake vent; And will direct into the outside of this circuit board through air-flow away from every group of electronic unit of air outlet by the air-out guiding channel that on circuit board, forms, make air-flow through one group of electronic unit no longer through other group electronic units; Wherein, homonymy at many group electronic units is provided with first dividing plate and second partition, form inlet air guiding channel and air-out guiding channel by first dividing plate, second partition and away from the zone of electronic unit, and air-out guiding channel and inlet air guiding channel are isolated mutually at infall.

2. the method for claim 1, it is characterized in that, a plurality of described multicircuit plates are installed in the casing, forming the inlet air guiding channel on another circuit board of sealing and the cover plate of air-out guiding channel between adjacent two circuit boards by one of them circuit board, perhaps, at the inlet air guiding channel and the air-out guiding channel that adopt between adjacent two circuit boards on circuit board of cover plate for sealing.

3. method as claimed in claim 1 or 2 is characterized in that, regulates the air-flow size that enters described inlet air guiding channel by gas flow adjusting flange at described air intake vent.

4. the method to the performing heat radiation of electric component on the circuit board is characterized in that, the described electronic unit on the circuit board is divided into many groups; By the inlet air guiding channel that on circuit board, forms air-flow is directed into respectively and respectively to organize electronic unit away from air intake vent; And will direct into the outside of this circuit board through air-flow away from every group of electronic unit of air outlet by the air-out guiding channel that on circuit board, forms, make air-flow through one group of electronic unit no longer through other group electronic units; Wherein, circuit board is provided with motherboard, and be provided with first dividing plate at the motherboard homonymy, form inlet air guiding channel and air-out guiding channel, and air-out guiding channel and inlet air guiding channel are isolated mutually at infall by first dividing plate, motherboard and away from the zone of electronic unit.

5. method as claimed in claim 4, it is characterized in that, a plurality of described multicircuit plates are installed in the casing, forming the inlet air guiding channel on another circuit board of sealing and the cover plate of air-out guiding channel between adjacent two circuit boards by one of them circuit board, perhaps, at the inlet air guiding channel and the air-out guiding channel that adopt between adjacent two circuit boards on circuit board of cover plate for sealing.

6. as claim 4 or 5 described methods, it is characterized in that, regulate the air-flow size that enters described inlet air guiding channel by gas flow adjusting flange at described air intake vent.

7. a circuit board is characterized in that, comprising:

Printing board PCB;

Panel is fixed on the side of described PCB;

Electronic unit is installed on the described PCB, and described electronic unit is divided into two groups and arrange along the length direction of described panel at least;

The inlet air guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this inlet air guiding channel directs into air-flow respectively and respectively organizes electronic unit away from air intake vent;

The air-out guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this air-out guiding channel will be respectively directs into outside the pcb board through the air-flow away from every group of electronic unit of air outlet, and air-out guiding channel and described inlet air guiding channel are isolated mutually at infall;

Wherein, described inlet air guiding channel and air-out guiding channel intersect at the adjacent area of two adjacent groups electronic unit, described electronic unit is arranged on the pcb board near panel one side, when pcb board is more shallow, be provided with first dividing plate at described electronic unit away from a side of described panel, this first dividing plate forms described inlet air guiding channel and air-out guiding channel with zone away from described electronic unit.

8. circuit board as claimed in claim 7 is characterized in that, and is non-when more shallow at pcb board, further second partition is set keeping at a certain distance away with described first dividing plate, and this first, second dividing plate constitutes described inlet air guiding channel and air-out guiding channel.

9. circuit board as claimed in claim 8 is characterized in that, the described second partition of air intake vent one side is provided with gas flow adjusting flange.

10. circuit board as claimed in claim 7 is characterized in that, also comprises:

Cover plate is arranged on the described pcb board and seals described inlet air guiding channel and air-out guiding channel.

11. as any described circuit board of claim 7 to 10, it is characterized in that, be spaced a distance between the two adjacent groups electronic unit; Described inlet air guiding channel extends to wherein one group of electronic unit at this segment distance, air-flow is directed into this group of electronic unit, described air-out guiding channel extends to another group electronic unit at this segment distance, to derive the air-flow of organizing electronic unit through this another.

12. circuit board as claimed in claim 11 is characterized in that, the extension of described inlet air guiding channel and air-out guiding channel is a groove shaped, and forms the levels structure at infall; Perhaps

The extension of described inlet air guiding channel and air-out guiding channel is a conduction element that is arranged between the described two adjacent groups electronic unit, and the through hole that described inlet air guiding channel and air-out guiding channel distribute on this conduction element extends to corresponding one group of electronic unit.

13. circuit board as claimed in claim 11 is characterized in that, the radiator of electronic unit is low early and high after distribution along the flow direction of air-flow in every group of electronic unit.

14. a circuit board is characterized in that, comprising:

Printing board PCB;

Panel is fixed on the side of described PCB;

Electronic unit is installed on the described PCB, and described electronic unit is divided into two groups and arrange along the length direction of described panel at least;

The inlet air guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this inlet air guiding channel directs into air-flow respectively and respectively organizes electronic unit away from air intake vent;

The air-out guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this air-out guiding channel will be respectively directs into outside the pcb board through the air-flow away from every group of electronic unit of air outlet, and air-out guiding channel and described inlet air guiding channel are isolated mutually at infall; Described inlet air guiding channel and air-out guiding channel intersect at the adjacent area of two adjacent groups electronic unit;

Backboard is arranged on described PCB and goes up a side relative with described panel;

Wherein, described electronic unit is arranged on close backboard one side on the pcb board, and described electronic unit is provided with dividing plate away from described backboard one side, forms described inlet air guiding channel and air-out guiding channel by this dividing plate and described panel.

15. circuit board as claimed in claim 14 is characterized in that, also comprises:

Cover plate is arranged on the described pcb board and seals described inlet air guiding channel and air-out guiding channel.

16. as claim 14 or 15 described circuit boards, it is characterized in that, be spaced a distance between the two adjacent groups electronic unit; Described inlet air guiding channel extends to wherein one group of electronic unit at this segment distance, air-flow is directed into this group of electronic unit, described air-out guiding channel extends to another group electronic unit at this segment distance, to derive the air-flow of organizing electronic unit through this another.

17. circuit board as claimed in claim 16 is characterized in that, the extension of described inlet air guiding channel and air-out guiding channel is a groove shaped, and forms the levels structure at infall; Perhaps

The extension of described inlet air guiding channel and air-out guiding channel is a conduction element that is arranged between the described two adjacent groups electronic unit, and the through hole that described inlet air guiding channel and air-out guiding channel distribute on this conduction element extends to corresponding one group of electronic unit.

18. circuit board as claimed in claim 16 is characterized in that, the radiator of electronic unit is low early and high after distribution along the flow direction of air-flow in every group of electronic unit.

19. a circuit board is characterized in that, comprising:

Printing board PCB;

Panel is fixed on the side of described PCB;

Electronic unit is installed on the described PCB, and described electronic unit is divided into two groups and arrange along the length direction of described panel at least;

The inlet air guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this inlet air guiding channel directs into air-flow respectively and respectively organizes electronic unit away from air intake vent;

The air-out guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this air-out guiding channel will be respectively directs into outside the pcb board through the air-flow away from every group of electronic unit of air outlet, and air-out guiding channel and described inlet air guiding channel are isolated mutually at infall; Described inlet air guiding channel and air-out guiding channel intersect at the adjacent area of two adjacent groups electronic unit;

Backboard is arranged on described PCB and goes up a side relative with described panel;

Wherein, described electronic unit is arranged on the adjacent area of described panel and described backboard, and described electronic unit is provided with dividing plate near panel one side, forms described inlet air guiding channel and described air-out guiding channel by described dividing plate and described panel; Perhaps, described electronic unit is arranged on the adjacent area of described panel and described backboard, and described electronic unit is provided with dividing plate near backboard one side, forms described inlet air guiding channel and described air-out guiding channel by described dividing plate and described backboard.

20. circuit board as claimed in claim 19 is characterized in that, also comprises:

Cover plate is arranged on the described pcb board and seals described inlet air guiding channel and air-out guiding channel.

21. as claim 19 or 20 described circuit boards, it is characterized in that, be spaced a distance between the two adjacent groups electronic unit; Described inlet air guiding channel extends to wherein one group of electronic unit at this segment distance, air-flow is directed into this group of electronic unit, described air-out guiding channel extends to another group electronic unit at this segment distance, to derive the air-flow of organizing electronic unit through this another.

22. circuit board as claimed in claim 21 is characterized in that, the extension of described inlet air guiding channel and air-out guiding channel is a groove shaped, and forms the levels structure at infall; Perhaps

The extension of described inlet air guiding channel and air-out guiding channel is a conduction element that is arranged between the described two adjacent groups electronic unit, and the through hole that described inlet air guiding channel and air-out guiding channel distribute on this conduction element extends to corresponding one group of electronic unit.

23. circuit board as claimed in claim 21 is characterized in that, the radiator of electronic unit is low early and high after distribution along the mobile side of air-flow in every group of electronic unit.

24. a flow distributor that is used on the circuit board is characterized in that, comprising:

Distribution member has two gas channels staggered and that isolate;

Parting bead is fixed on the relative both sides of described distribution member, and extends to the direction away from this distribution member, to prolong described two gas channels;

Wherein, when described flow distributor is arranged on the circuit board, the inlet air guiding channel that described two gas channels form on circuit board directs into air-flow respectively and respectively organizes electronic unit away from air intake vent, and the air-out guiding channel that forms on circuit board of described two gas channels will direct into the outside of this circuit board through the air-flow away from every group of electronic unit of air outlet, make air-flow through one group of electronic unit no longer through other group electronic units; The length direction setting that described inlet air guiding channel and air-out guiding channel are arranged according to electronic unit.

25. flow distributor as claimed in claim 24 is characterized in that, described two gas channels are made of groove, and form the levels structure; Perhaps

Described two gas channels are made of through hole.

26. flow distributor as claimed in claim 24 is characterized in that, every side is provided with two relative parting beads in the described relative both sides.

27. as any described flow distributor of claim 24 to 26, it is characterized in that, also comprise:

Cover plate is fixed with described distribution member and parting bead, seals described two gas channels.

28. a communicator comprises casing, is installed in the motherboard in the described casing, and a plurality of circuit boards that insert described motherboard; It is characterized in that described circuit board comprises:

Printing board PCB;

Panel is fixed on the side of described PCB;

Electronic unit is installed in described PCB and goes up a side near described panel, and described electronic unit is divided into two groups and arrange along the length direction of described panel at least;

The inlet air guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this inlet air guiding channel directs into air-flow respectively and respectively organizes electronic unit away from air intake vent;

The air-out guiding channel, the length direction setting that described electronic unit is arranged in described pcb board upper edge, this air-out guiding channel will be respectively directs into outside the pcb board through the air-flow away from every group of electronic unit of air outlet, and air-out guiding channel and described inlet air guiding channel are isolated mutually at infall

Wherein, when pcb board is more shallow, be provided with first dividing plate at described electronic unit away from a side of described panel, this first dividing plate forms described inlet air guiding channel and air-out guiding channel with zone away from described electronic unit.

29. communicator as claimed in claim 28 is characterized in that, and is non-when more shallow at pcb board, further is provided with second partition keeping at a certain distance away with described first dividing plate, this first, second dividing plate constitutes described inlet air guiding channel and air-out guiding channel.

30. communicator as claimed in claim 28 is characterized in that, also comprises:

Cover plate is arranged on the described pcb board and seals described inlet air guiding channel and air-out guiding channel.

31. as claim 28,29 or 30 described communicators, it is characterized in that, be spaced a distance between the two adjacent groups electronic unit; Described inlet air guiding channel extends to wherein one group of electronic unit at this segment distance, air-flow is directed into this group of electronic unit, described air-out guiding channel extends to another group electronic unit at this segment distance, to derive the air-flow of organizing electronic unit through this another.

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