The specific embodiment
The specific embodiment one: electron beam to braze is repaired the method for high-temperature alloy blades in the present embodiment, it is characterized in that this method realizes by following steps: (one) with sander with 2500~3500 rev/mins speed grind off to repair damage on the high-temperature alloy blades 60~100% and with the injury region grooving of polishing, to be that 0~90 ° 80 orders~800 purpose solders or alloy powder and mass concentration are that 95~99.5% acetone or commercially available general soldering binding agent are mixed into paste with the angle of wetting of blade mother metal, and paste mixture be put into the groove that polish and groove is filled up; (2) leave standstill 1~5 minute, the high-temperature alloy blades that will repair is put into vacuum chamber, and vacuumizing the vacuum that makes in the vacuum chamber is 4.50~5.30 * 10
-2Pa, being 100~150mm, line input mode in electron gun and the operating distance that will repair damage location, to add scanning, scan frequency be that 500~1000Hz, accelerating potential are that 55~60kV, focus current be that 1500~2700mA, temperature gather way are that 5~100 ℃/s, scan amplitude are that VX=0~30, VY=0~30 and sweep trace of electron beam are under the condition of function waveform track the high-temperature alloy blades damage location to be carried out soldering in order time to defocus; (3) when solder or alloy powder melt fully, lower the temperature with the speed of 5~100 ℃/s, take out high-temperature alloy blades when temperature is reduced to room temperature, high-temperature alloy blades is repaired.
Present embodiment is particularly useful for the reparation of aero-engine high temperature blade.
The method renovation technique of electron beam to braze reparation high-temperature alloy blades is simple in the present embodiment, repairing efficiency is short, one-period only needs 5min~10min, only needs the position heating to damage, and blade is reduced to 0.1~10% of original method at high-temperature residence time during reparation.
The specific embodiment two: the difference of the present embodiment and the specific embodiment one is that step () high-temperature alloy blades is blade of aviation engine, moving turbine blade or guide vane; Solder is the BCo-1 solder in a kind of or cobalt-based solder among BNi-1 solder, BNi-2 solder, BNi-3 solder, BNi-4 solder, BNi-5 solder, BNi-6 solder, BNi-7 solder, BNi-8 solder, B п p24, B п p27 or the B п p11 in the nickel-based solder, and alloy powder is nickel-base alloy powder ZX.Ni17 or cobalt-base alloys powder ZX.Co55.Other step is identical with the specific embodiment one.
The specific embodiment three: the difference of the present embodiment and the specific embodiment one be in the step () with sander with 2800~3200 rev/mins speed grind off to repair damage on the high-temperature alloy blades 70~90% and with the injury region grooving of polishing.Other step is identical with the specific embodiment one.
The specific embodiment four: the difference of the present embodiment and the specific embodiment one is in the step () will to be that 150 orders~700 purpose solders of 5~88 ° or alloy powder and mass concentration are that 95~99.5% acetone or commercially available general soldering binding agent are mixed into paste with the angle of wetting of blade mother metal.Other step is identical with the specific embodiment one.
The specific embodiment five: the difference of the present embodiment and the specific embodiment one is in the step () will to be that 100 orders~650 purpose solders of 35 ° or alloy powder and mass concentration are that 96~99% acetone or commercially available general soldering binding agent are mixed into paste with the angle of wetting of blade mother metal.Other step is identical with the specific embodiment one.
The specific embodiment six: the difference of the present embodiment and the specific embodiment one is in (one) will to be that 35 ° 600 purpose solders or alloy powder and mass concentration are that 99% acetone is mixed into paste with the angle of wetting of blade mother metal.Other step is identical with the specific embodiment one.
The specific embodiment seven: it is 5.25 * 10 that the difference of the present embodiment and the specific embodiment one is to vacuumize in the step (two) vacuum that makes in the vacuum chamber
-2Pa.Other step is identical with the specific embodiment one.
The specific embodiment eight: the difference of the present embodiment and the specific embodiment one is that the function waveform track is a triangular trajectory in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment nine: the difference of the present embodiment and the specific embodiment one is that the function waveform track is a circular trace in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment ten: present embodiment is that with the difference of the specific embodiment one the function waveform track is for mixing the shape track in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment 11: the difference of the present embodiment and the specific embodiment one is that the function waveform track is square track in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment 12: the difference of the present embodiment and the specific embodiment one is that step (two) electron gun and the operating distance that will repair damage location are 110~145mm.Other step is identical with the specific embodiment one.
The specific embodiment 13: the difference of the present embodiment and the specific embodiment one is that step (two) electron gun and the operating distance that will repair damage location are 135mm.Other step is identical with the specific embodiment one.
The specific embodiment 14: the difference of the present embodiment and the specific embodiment one is that scan frequency is 550~950Hz in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment 15: the difference of the present embodiment and the specific embodiment one is that scan frequency is 800Hz in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment 16: the difference of the present embodiment and the specific embodiment one is that operating current is 1900~2600mA in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment 17: the difference of the present embodiment and the specific embodiment one is that operating current is 2400mA in the step (two).Other step is identical with the specific embodiment one.
The specific embodiment 18: the difference of the present embodiment and the specific embodiment one is that it is 10~95 ℃/s that the middle temperature of step (two) gathers way.Other step is identical with the specific embodiment one.
The specific embodiment 19: the difference of the present embodiment and the specific embodiment one is that it is 20 ℃/s that the middle temperature of step (two) gathers way.Other step is identical with the specific embodiment one.
The specific embodiment 20: the difference of the present embodiment and the specific embodiment one is that it is 40 ℃/s that the middle temperature of step (two) gathers way.Other step is identical with the specific embodiment one.
The specific embodiment 21: the difference of the present embodiment and the specific embodiment one is that it is 60 ℃/s that the middle temperature of step (two) gathers way.Other step is identical with the specific embodiment one.
The specific embodiment 22: the difference of the present embodiment and the specific embodiment one is that it is 80 ℃/s that the middle temperature of step (two) gathers way.Other step is identical with the specific embodiment one.
The specific embodiment 23: the difference of the present embodiment and the specific embodiment one be in the step (two) the line input mode under defocus add scanning, scan amplitude is VX=8~24, VY=8~24.Other step is identical with the specific embodiment one.
The specific embodiment 24: the difference of the present embodiment and the specific embodiment one be in the step (two) the line input mode under defocus add scanning, scan amplitude is VX=12, VY=12.Other step is identical with the specific embodiment one.
The specific embodiment 25: the difference of the present embodiment and the specific embodiment one is in the step (two) that be 120~140mm at electron gun with the operating distance that will repair damage location, the line input mode under defocus and add scanning, scan frequency is 600~900Hz, accelerating potential is 56~59kV, focus current is 2000~2500mA, it is 20~90 ℃/s that temperature gathers way, scan amplitude is VX=5~25, VY=5~25 and sweep trace of electron beam are under the condition of the circular trace in the function waveform track high-temperature alloy blades damage location to be carried out soldering.Other step is identical with the specific embodiment one.
The specific embodiment 26: the difference of the present embodiment and the specific embodiment one is in the step (two) that be 125mm at electron gun with the operating distance that will repair damage location, the line input mode under defocus and add scanning, scan frequency is 1000Hz, accelerating potential is 55kV, focus current is 1790mA, it is 80 ℃/s that temperature gathers way, scan amplitude is VX=10, VY=10 and sweep trace of electron beam are under the condition of the square track in the function waveform track high-temperature alloy blades damage location to be carried out soldering.Other step is identical with the specific embodiment one.
The specific embodiment 27: the difference of the present embodiment and the specific embodiment one is in the step (three) to lower the temperature with the speed of 20~80 ℃/s when solder or alloy powder melt fully.Other step is identical with the specific embodiment one.
The specific embodiment 28: the difference of the present embodiment and the specific embodiment one is in the step (three) to lower the temperature with the speed of 60 ℃/s when solder or alloy powder melt fully.Other step is identical with the specific embodiment one.
The specific embodiment 29: the difference of the present embodiment and the specific embodiment one is in the step (three) to lower the temperature with the speed of 40 ℃/s when solder or alloy powder melt fully.Other step is identical with the specific embodiment one.