CN100596266C - Electronic component mounting device and mounting method - Google Patents

Abstract

An electronic component mounting device has a holding table (12) for holding a substrate; X, Y, and Theta drive sources (14, 19, 20) for driving the holding table in horizontal directions; a mountingtool (5) for holding an electronic component (4) and mounting it on the upper surface of a side section of the substrate, a backup tool (22) provided so that it can be driven in the vertical directionand supporting the lower surface of the side section of the substrate when the electronic component is mounted on the upper surface of the side section of the substrate; a camera (24) for imaging thesubstrate and the electronic component before the electronic component is mounted on the substrate; and a control device (25) positionally aligning the substrate and the electronic component based onan image signal from the camera, causing the backup tool to be lifted to support the lower surface of the side section of the substrate, making the camera re-image the substrate in that state, and causing the substrate and the electronic component to be positionally re-aligned if there is a positional displacement between the substrate and the electronic component.

Description

Electronic component mounting device and mounting method

technical field

The present invention relates to an electronic component mounting device and a mounting method for surface mounting electronic components on a side portion of a substrate.

Background technique

For example, an electronic component such as a TCP (Tape Carrier Package) is press-mounted on a substrate such as a liquid crystal cell via an anisotropic conductive member as an adhesive material. The above-mentioned substrate is constituted by bonding two glass plates at a predetermined interval through a sealant, sealing liquid crystal between these glass plates, and attaching polarizing plates to the outer surfaces of the glass plates. And, on the substrate of the above-mentioned structure, on the side of one glass plate, on the upper surface (inner surface when bonding) protruding outward from the side of the other glass plate, along the side of the The above-mentioned anisotropic conductive member with double-sided adhesiveness is bonded in a tape shape in the longitudinal direction, and the above-mentioned electronic component is mounted through the anisotropic conductive member.

When electronic components are mounted on the side upper surface of the substrate, it is necessary to precisely align the outer leads formed on the electronic components with respect to the unit-side leads formed on the substrate. Recently, the density of the wiring pattern is gradually increasing. For example, the width of the lead wire reaches about 20 μm, and the interval between adjacent outer wires reaches about 50 μm. Therefore, it is sometimes necessary to arrange the electronic components in the pitch direction of the above-mentioned unit side leads. The precise positioning of the substrate can reliably connect the leads to each other electrically.

A mounting device for mounting the electronic component on the substrate includes a holding table for holding the substrate. In the state where the side portion of the substrate on which the electronic component is mounted protrudes outward from the side edge of the above-mentioned holding table, and the lower surface of the side portion is held by a backing tool, the electronic component held on the mounting tool is mounted on the side of the above-mentioned substrate. on the upper surface of the side.

Before the electronic component is mounted on the substrate, a pair of alignment marks provided on the substrate and the electronic component is imaged by a camera, and the substrate and the electronic component are aligned based on the imaging result. Then, after the substrate and the electronic component are vertically aligned, the side lower surface of the substrate is supported by the backing tool, and the mounting tool is lowered in this state to mount the electronic component on the substrate.

In addition, before the side lower surface of the board is supported by the backing tool, the board and the electronic component are positioned based on the imaging signal picked up by the camera. Before mounting electronic components on the side upper surface of the positioned substrate, its side lower surface is supported by the above-mentioned backing tool. At this time, the sides of the substrate are lifted up by the backing tool.

When the side portion of the substrate is lifted up by the backing tool, the position of the side portion of the substrate may be shifted relative to the electronic component before the lifting. This positional deviation may occur due to deflection of the substrate, and when the substrate is held on the holding table in a state where stress remains, this positional deviation may be caused by a change in the state of stress due to lifting.

However, in the past, before the side portion of the substrate is supported by the backing tool, the substrate and the electronic components are imaged by a camera, and after they are aligned according to the imaging signal, the lower surface of the side portion of the substrate is supported by the backing tool, and then the above-mentioned Installation tool to install electronic components.

That is, even if the side portion of the substrate deviates from the electronic component due to the side lower surface of the substrate being lifted and supported by the backing tool, the positional deviation is not corrected, and the electronic component is directly mounted. Therefore, there is a possibility that the mounting accuracy of the electronic component may be lowered, and the lead wires between the substrate and the electronic component may not be reliably electrically connected.

Contents of the invention

The present invention provides an electronic component mounting device and a mounting method capable of mounting an electronic component on a substrate after correcting the positional deviation caused by supporting the substrate with a backing tool.

The present invention is a mounting device for mounting electronic components on the side upper surface of a substrate, which is characterized in that it includes: a holding mechanism for holding the above-mentioned substrate; a driving mechanism for driving the holding mechanism in a horizontal direction; a mounting mechanism for holding the above-mentioned Electronic components and mounting the electronic components on the side upper surface of the above-mentioned substrate; the back support tool is provided in a manner that can be driven in the vertical direction, and the above-mentioned electronic components are mounted on the side of the above-mentioned substrate by the above-mentioned mounting mechanism When on the surface, the side lower surface of the substrate is supported; the imaging mechanism, before the electronic component is mounted on the substrate, takes an image of the substrate and the electronic component; After the above-mentioned substrate and electronic components are aligned by the imaging signal, the above-mentioned backing tool is raised to support the side lower surface of the above-mentioned substrate. In this state, the above-mentioned substrate is imaged again by the above-mentioned imaging mechanism. When there is positional deviation, the alignment of the said board|substrate and the said electronic component is performed again.

In addition, the present invention is a mounting method for mounting an electronic component on a side upper surface of a substrate, comprising: an imaging step of imaging a portion of the substrate on which the electronic component is mounted and the electronic component; Alignment process, aligning the above-mentioned substrate and the above-mentioned electronic components according to the above-mentioned imaging; supporting process, supporting the side lower surface of the aligned substrate by the backing tool; judging process, again photographing the substrate supported by the backing tool Judging whether there is a positional deviation between the substrate and the above-mentioned electronic components; re-alignment process, re-aligning the above-mentioned substrate when there is a positional deviation; and installation process, when there is no positional deviation between the above-mentioned substrate and the above-mentioned electronic components, The electronic component is mounted on the upper surface of the side plate of the substrate supported by the backing tool.

Description of drawings

FIG. 1 is a schematic configuration diagram showing a mounting device and a supply device that supplies electronic components to the mounting device according to one embodiment of the present invention.

Fig. 2 is a side view showing the mounting device.

Fig. 3 is a side view showing a backing tool portion of the mounting device.

4 is a perspective view showing alignment marks provided on a substrate and an electronic component.

Fig. 5 is a block diagram of a control circuit for controlling the mounting device.

FIG. 6 is a flowchart showing a part of the process of mounting an electronic component on a substrate.

Fig. 7 is a flow chart showing a step subsequent to the step shown in Fig. 6 .

Detailed ways

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a supply device for electronic components and a mounting device for mounting electronic components supplied from the supply device on a substrate. The supply device includes a component supply table 1 . The component supply table 1 is provided with four mounting parts 2 (only three are shown) at intervals of 90 degrees in the circumferential direction, and is rotationally driven by the first driving source 3 so as to be different from each other by a predetermined angle, for example, 90 degrees. Electronic components 4 such as TCP are supplied to each of the loading sections 2 described above by a suction arm not shown in the figure or the like.

The electronic component 4 supplied and placed on the mounting portion 2 of the component supply table 1 is delivered to a mounting tool 5 constituting the mounting device. The mounting tools 5 are arranged at intervals of 90 degrees along the circumferential direction of the index table 7 rotationally driven by the second drive source 6 so as to be 90 degrees apart. The above-mentioned installation tool 5 has a pressure cylinder 8 and a suction head 11 mounted on the rod 9 of the pressure cylinder 8 .

The suction head 11 is rotationally driven synchronously with the component supply table 1 and the index table 7 , and is positioned above the mounting portion 2 of the component supply table 1 . In this state, when the pressure cylinder 8 is driven, the suction head 11 descends to suction and hold the electronic component 4 supplied and placed on the placement unit 2 .

The electronic component 4 sucked and held by the suction head 11 is mounted on the side upper surface of the substrate W such as a liquid crystal display panel. The substrate W is sucked and held on the upper surface of the holding table 12 as a holding mechanism so that the side portion on which the electronic component 4 is mounted protrudes outward from the side edge of the holding table 12 .

As shown in FIG. 2 , the above-mentioned holding table 12 can be driven in the XY direction and the θ direction. That is, the holding table 12 is provided on the X stage 13 so as to be drivable in the X direction indicated by the arrow by the X driving source 14 . On the lower surface of the X table 13, a pair of receiving members 13a are provided along the Y direction perpendicular to the X direction. These receiving members 13 a are supported by the base 15 so as to be movable along a pair of Y guide rails 16 provided along the above-mentioned Y direction.

An internally threaded body 17 is provided on the lower surface of the above-mentioned X stage 13, and a threaded shaft 18 is screwed into the internally threaded body 17. As shown in FIG. The threaded shaft 18 is rotationally driven by a Y drive source 19 . Thereby, the said X stage 13 is driven to a Y direction. Furthermore, the part of the holding table 12 holding the above-mentioned substrate W is driven in the rotation direction on the horizontal plane by the θ drive source 20 . Accordingly, the holding table 12 can be driven in the X, Y directions, and θ directions.

A support body 21 is erected on one end portion of the base 15 extending in the X direction. A backing tool 22 having the same width as the support body 21 is provided at the upper end of the support body 21 . The backing tool 22 is driven in the vertical direction indicated by the arrow Z in FIGS. 1 to 3 by a Z drive source 23 such as a pressure cylinder built in the support body 21 shown in FIGS. 1 and 3 . FIG. 3 shows the state after the backing tool 22 is lowered, and FIGS. 1 and 2 show the state after it is raised.

As shown in FIG. 3 , a pair of cameras 24 constituting an imaging mechanism are provided on both sides in the width direction of the support body 21 . As shown in FIG. 4 , a pair of cameras 24 monitor the pair of first alignment marks m1 provided on the above-mentioned electronic component 4 and the two sides of the terminal portion 27 of the electronic component 4 mounted on the above-mentioned substrate W in the same field of view. A pair of 2nd alignment mark m2 is imaged.

That is, the electronic component 4 has a pair of first alignment marks m1 formed at a predetermined interval on one side thereof, and a pair of second alignment marks m1 is formed on the substrate W at the same interval as the pair of first alignment marks m1. Alignment mark m2.

As shown in FIG. 5 , imaging signals of a pair of cameras 24 are input to a control device 25 . The control device 25 converts the signal from the camera 24 into a digital signal, and calculates the amount of positional deviation between the first alignment mark m1 of each pair of electronic components 4 and the second alignment mark m2 of the substrate W based on the conversion.

Then, the X drive source 14 , Y drive source 19 and θ drive source 20 are driven based on the calculation results, and the holding table 12 is driven in the X, Y and θ directions to align the substrate W and the electronic component 4 . That is, the substrate W is aligned with respect to the electronic component 4 held on the mounting tool 5 .

After aligning the substrate W with respect to the electronic component 4 , the control device 25 drives the Z drive source 23 in the upward direction, and supports the bottom surface of the end portion of the substrate W on which the electronic component 4 is mounted by the backing tool 22 .

As shown in FIG. 3 , the width dimension of the backing tool 22 is set to be slightly smaller than the interval between the pair of first alignment marks m1 provided on the electronic component 4 . That is, the width dimension of the electronic component 4 is larger than the width dimension of the backing tool 22 . The width dimension of the above-mentioned mounting tool 5 is set to be substantially the same as the width dimension of the above-mentioned backing tool 22 .

Thereby, the above-mentioned substrate W is positioned on the teaching position, and the electronic component 4 held on the above-mentioned mounting tool 5 is positioned by the rotation of the above-mentioned index table 7 above the substrate W. A pair of cameras 24 on both sides in the width direction of the support body 21 captures images of the second alignment mark m2 of the substrate W and the first alignment mark m1 of the electronic component 4 in the vertical direction from below within the same field of view.

Next, the operation when the electronic component is mounted on the side upper surface of the substrate W by the mounting apparatus configured as described above will be described with reference to the flow charts shown in FIGS. 6 and 7 .

First, in step 1 (hereinafter referred to as step S), the substrate W is supplied onto the holding table 12 , and the substrate W is sucked and held on the above-mentioned holding table 12 . In S2, the above-mentioned holding table 12 is driven to the previously taught position. Accordingly, the side portion of the substrate W on which the electronic component 4 is mounted is positioned above the backing tool 22 . Next, in S3, the index table 7 is rotationally driven, and the mounting tool 5 holding the electronic component 4 is positioned near the side portion of the substrate W described above.

After positioning the electronic component 4 and the substrate W to the preset teaching position, in S4, through a pair of cameras 24, a pair of first and second pairs respectively arranged on the electronic component 4 and the substrate W are The bit marks m1 and m2 are respectively imaged. That is, each camera 24 images the 1st and 2nd alignment marks m1 and m2 which are positioned close to each other with a slight difference in height within the same field of view.

The imaging signal of the camera 24 is input into the control apparatus 25, and image processing is performed. Thereby, in S5, the positional displacement amount between each 1st alignment mark m1 and the 2nd alignment mark m2 is calculated. That is, the positional displacement amounts in the X, Y, and θ directions between the electronic component 4 and the substrate W are calculated.

Next, in S6 , the control device 25 drives the above-mentioned holding table 12 , that is, the substrate W in the X, Y, and θ directions based on the calculated amount of positional deviation, and aligns the substrate W with respect to the electronic component 4 . After aligning the board|substrate W with respect to the electronic component 4, in S7, the backing tool 22 is driven to the upward direction by the Z drive source 23. Thereby, the lower surface of the portion of the substrate W where the electronic component 4 is mounted is lifted up by the backing tool 22 and supported.

After the side part of the board|substrate W is supported by the backing tool 22, in S8, the 2nd alignment mark m2 provided on the board|substrate W is imaged again by a pair of camera 24. That is, the coordinates of the second alignment mark m2 of the substrate W and the first alignment mark m1 of the electronic component 4 are calculated and compared in a state where the side portion of the substrate W is pushed up by the backing tool 22 . Next, in S9 , it is determined whether or not positional displacement has occurred between the substrate W and the electronic component 4 based on the calculated coordinates of the first and second alignment marks m1 and m2 .

When there is no positional deviation between the electronic component 4 and the substrate W, the process proceeds to S10. In S10, the mounting tool 5 is driven in the downward direction to mount the attracted and held electronic component 4 on the substrate W.

When the positional deviation between the electronic component 4 and the substrate W has occurred due to the substrate W being pushed up by the backing tool 22 , the process proceeds to S11 , and the backing tool 22 is driven in the downward direction in S11 . Next, the substrate W is driven in the X, Y, and θ directions, and the position of the substrate W relative to the electronic component 4 is corrected based on the amount of positional deviation obtained in S8. After the positional deviation of the substrate W is corrected, the process returns to S7 and the above operations are repeated.

When aligning the substrate W again in S11, the backing tool 22 is lowered. Therefore, even if the substrate W is driven in the X, Y, and θ directions, the lower surface of the substrate W does not slide on the upper end surface of the backing tool, so that the substrate W can be aligned smoothly and reliably.

In this way, when mounting the electronic component 4 on the substrate W, the electronic component 4 and the substrate W are aligned based on the imaging result of the camera 24 , and then the side lower surface of the substrate W is supported by the backing tool 22 . And before the electronic component 4 is mounted on the board|substrate W, the board|substrate W is imaged again by the camera 24. As shown in FIG. As a result, if a positional deviation occurs between the electronic component 4 and the substrate W, the backing tool 22 is lowered to reposition the substrate W again.

That is, when the electronic component 4 is mounted on the substrate W, even if the substrate W is deflected by lifting the substrate W with the backing tool 22 and the position of the substrate W relative to the electronic component 4 deviates, the The electronic component 4 is mounted after correcting the positional deviation. Therefore, it is possible to mount the electronic component 4 with respect to the substrate W with high positioning accuracy.

In addition, in the above-mentioned one embodiment, after the side lower surface of the substrate is supported by the backing tool, the electronic component and the substrate are imaged by the camera, and the positioning correction of the substrate based on the image is repeated, but in general, The positional deviation caused by the support of the substrate by the backing tool can usually be corrected by one correction, and there is almost no positional deviation when the substrate is lifted and supported by the backing tool next.

Therefore, it can also be designed that the positional deviation correction is performed only once when the substrate is supported by the backing tool, and the positional deviation between the electronic component and the substrate is not detected when the substrate is supported by the backing tool for the second time, and the above-mentioned electronic component is directly mounted. onto the substrate.

In addition, in the above-mentioned embodiment, in the case where a positional deviation occurs between the electronic component and the substrate, in S11, the backing tool is driven in the lowering direction and the alignment is performed, but even if the backing tool is not lowered, the alignment is performed. does not matter.

If alignment is performed without lowering the backing tool, the positioned substrate does not need to be lifted up again by the backing tool, so the possibility of positional deviation of the substrate due to the lifting can be eliminated.

Furthermore, if alignment is performed without lowering the backing tool, after the position correction of the substrate and the electronic component in the X, Y, and θ directions is performed, the electronic component can be mounted on the backing tool without raising the backing tool. On the substrate, it is possible to shorten the production interval time required for mounting.

In addition, in the above-mentioned embodiment, the substrate is driven in the X, Y, and θ directions to perform alignment with respect to the electronic components, but if the mounting tool for supplying the electronic components to the substrate is not installed on the In the state of driving in the X, Y, and θ directions, the position correction of the electronic component may be performed instead of the position correction of the substrate.

If electronic components are aligned in the X, Y, and θ directions instead of the substrate, inertial force and vibration can be reduced compared The time required for alignment can be further shortened, and the alignment accuracy and mounting accuracy can be improved, and further, productivity can be improved by shortening the production interval time.

Industrial Applicability

According to the present invention, after aligning the substrate and the electronic component, the side of the substrate is supported by the backing tool, and the substrate is imaged again to confirm whether there is a positional deviation, and if there is a positional deviation, it is corrected, so it is possible to compare Electronic parts are mounted on the substrate with high precision.

Claims (7)

1. A mounting device for electronic components, which mounts the electronic components on the side upper surface of the substrate, characterized in that it includes: a holding mechanism for holding the above-mentioned substrate; A driving mechanism drives the holding mechanism in a horizontal direction; a mounting mechanism holding the electronic component and mounting the electronic component on the side upper surface of the substrate; a backing tool configured to be drivable in an up-and-down direction, and to support the side lower surface of the substrate when the electronic component is mounted on the side upper surface of the substrate by the mounting mechanism; an imaging mechanism for imaging the substrate and the electronic components before mounting the electronic components on the substrate; and The control mechanism, after aligning the above-mentioned substrate and the electronic component based on the imaging signal from the imaging mechanism, raises the above-mentioned backing tool to support the side lower surface of the above-mentioned substrate. Imaging, and when there is a positional deviation between the substrate and the electronic component, alignment of the substrate and the electronic component is performed again. 2. The electronic component mounting apparatus according to claim 1, wherein when there is a positional deviation between the substrate and the electronic component, the control mechanism lowers the backing tool to reinstall the substrate and the electronic component. of counterpoint. 3. The electronic component mounting apparatus according to claim 1, wherein a pair of first alignment marks are provided at predetermined intervals on the position of the substrate on which the electronic component is mounted, and on the electronic component in the same manner as A pair of second alignment marks are provided at intervals corresponding to the first alignment marks, and the width dimension of the backing tool is set to be smaller than the interval between the pair of second alignment marks, The above-mentioned imaging mechanism is a pair of cameras, and the pair of cameras respectively monitors one of the first and second alignment marks and the other of the first and second alignment marks at opposite positions within the same field of view. camera. 4. The mounting device for electronic components according to claim 1, wherein the mounting mechanism is a plurality of mounting heads arranged at predetermined intervals along the circumferential direction of the index table, and the alignment between the substrate and the electronic components is performed by The drive mechanism drives the substrate in the horizontal direction. 5. A method for installing an electronic component, wherein the electronic component is mounted on the side upper surface of the substrate, characterized in that it comprises: an imaging step of imaging a portion of the substrate on which the electronic component is mounted and the electronic component; Alignment process, aligning the above-mentioned substrate and the above-mentioned electronic components according to the above-mentioned imaging; The supporting process, supporting the side lower surface of the aligned substrate through a backing tool; The judging step is to take an image of the substrate supported by the backing tool again to judge whether there is a positional deviation between the substrate and the above-mentioned electronic components; Re-alignment process, when there is a position deviation, the above-mentioned substrate is re-aligned; and In the mounting step, when there is no positional displacement between the substrate and the electronic component, the electronic component is mounted on the side upper surface of the substrate supported by the backing tool. 6. The electronic component mounting method according to claim 5, wherein the backing tool is lowered when the substrate is aligned again. 7. The method of mounting an electronic component according to claim 5, wherein a pair of first alignment marks is provided on the substrate, a pair of second alignment marks is provided on the electronic component, and they are in the same field of view. The above-mentioned 1st alignment mark and the 2nd alignment mark are imaged inside.

Images