CN100587930C - Flip-chip mounting body and flip-chip mounting method - Google Patents

Abstract

A flip-chip package and a method for mounting the package include interposing units such as pads between a circuit board having a plurality of connection terminals and an electronic component (semiconductor chip) having a plurality of electrode terminals arranged opposite to the connection terminals. In order to make the interval between the two uniform; or in the interior of the plate-shaped body having two or more protrusions, electronic components (semiconductor chips) are placed so that they are separated by a resin composed of solder powder, resin, and convective additives. The composition faces each other, and after the convective additive boils, the solder powder moves and self-assembles to form a solder layer to electrically connect the connection terminal and the electrode terminal.

Description

Flip-chip mounting body and flip-chip mounting method

technical field

[0001]

The present invention relates to a flip-chip mounting method for mounting semiconductor chips and electronic components on a circuit board, and particularly relates to flip-chip mounting that is capable of handling semiconductor chips and electronic components with narrower pitches, has high productivity, and is excellent in connection reliability body and flip-chip mounting methods.

Background technique

[0002]

In recent years, due to the high density and high integration of semiconductor integrated circuit (hereinafter referred to as "semiconductor" or "LSI") chips used in electronic equipment, the high function/multifunctionalization of electronic equipment has rapidly developed. At the same time, semiconductor The multi-pin and narrow pitch of chip electrode terminals are advancing by leaps and bounds. When mounting these semiconductor chips on a circuit board, flip-chip mounting is widely used in order to reduce wiring delays.

[0003]

Methods of mounting an LSI chip on a circuit board can be broadly classified into a method of flip-chip mounting in which the LSI chip is directly mounted on the circuit board, and a method of mounting the LSI chip in a semiconductor package first.

[0004]

In general, as a method of mounting an LSI chip having multiple pins, in a flip-chip mounting process, solder bumps (solder bumps) formed on pad electrode terminals of LSI chips arranged in an area array are used. ), the installation method of bonding with the electrodes on the circuit substrate, and in the package (package) installation, the area array type package in which the electrodes are arranged in an array on the back area of the package, and is mounted on the circuit substrate through solder balls as a medium The method is widely used in production as an excellent technology with high reliability (for example, Patent Document 1 or Patent Document 2).

[0005]

However, on the basis of the multi-pin LSI chip, along with the miniaturization of the wiring process regulations, the reduction of the size of the LSI chip, and the narrowing of the pin spacing are accelerating. In the conventional mounting method using solder bumps formed on the electrodes of the LSI chip and solder balls formed on the back electrodes of the area array type semiconductor package, the size of the electrodes is getting smaller and smaller with the narrowing of the pitch, and it is necessary to reduce the size of the solder bump and solder ball dimensions. This is because when the size of the solder bumps and solder balls is large, the molten solder overflows onto the electrode pads and short-circuits adjacent pins. However, it is very difficult to uniformly form micro-sized solder bumps and solder balls, and to bond them stably to a circuit board.

[0006]

Also, in flip-chip mounting, generally, solder bumps are formed on electrode terminals of a semiconductor chip, and the solder bumps are collectively bonded to connection terminals formed on a circuit board. However, in order to mount a next-generation semiconductor chip having more than 5,000 electrode terminals on a circuit board, it is necessary to form solder bumps corresponding to a narrow pitch of 100 μm or less. However, the current solder bump forming technology is difficult to meet this requirement.

[0007]

In addition, since it is necessary to form solder bumps corresponding to the number of electrode terminals, it is also required to improve production efficiency by shortening the mounting tact per chip in order to achieve cost reduction.

[0008]

Currently, electrode terminals of semiconductor chips are being shifted from peripheral arrangements to regional arrangements in order to cope with the increase in electrode terminals.

[0009]

In addition, according to the requirements of high density and high integration, it can be expected that the semiconductor process will develop from 90nm to 65nm and 45nm. In response to this, an insulating material having a low dielectric constant is urgently required, and in order to realize this desire, porous insulating materials are being introduced.

[0010]

However, after using a porous insulating material, in order to reduce damage to the insulating material and the active circuit, it needs to be installed with a low load. Furthermore, due to thinning of semiconductor chips, mounting with a low load is also desired in order to prevent damage during handling. In particular, in the area arrangement, it is necessary to form electrodes on the active circuit, so a mounting method with a lower load is required.

[0011]

Therefore, there is a demand for a thinner, higher-density flip-chip mounting method that can be applied to the progress of semiconductor processes in the future.

[0012]

Conventionally, as techniques for forming solder bumps, a plating method, a screen printing method, and the like have been developed. However, although the electroplating method is suitable for narrow pitches, there is a problem of low production efficiency due to complicated processes and the like. In addition, although the screen printing method has high production efficiency, it is not suitable for narrow pitches in terms of using a mask.

[0013]

Under such circumstances, several techniques for selectively forming solder bumps on semiconductor chips and circuit boards have recently been developed. These technologies are not only suitable for forming fine solder bumps, but also can form solder bumps uniformly, so they are excellent in productivity, and are attracting attention as technologies that may be suitable for mounting next-generation semiconductor chips on circuit boards.

[0014]

One of them is: use a solder paste composed of a mixture of solder powder and flux, densely apply it to the circuit board on which the electrode terminals are formed on the surface, and then heat the circuit board to melt the solder powder. A technique for selectively forming solder bumps on electrode terminals (for example, Patent Document 3).

[0015]

In addition, there is a technology called "super solder paste method". This technology applies a paste composition (chemical reaction precipitation type solder) with organic acid lead salt and metal tin as the main components to the circuit board forming the electrode terminal, and then heats the circuit board to generate Pb. A substitution reaction with Sn to selectively deposit an alloy of Pb and Sn on an electrode terminal of a circuit board (for example, Patent Document 4).

[0016]

In addition, in conventional flip-chip mounting, after mounting a semiconductor chip on a circuit board on which solder bumps are formed, it is necessary to add a resin called "filler" to fix the semiconductor chip on the circuit board. The process of injecting between the semiconductor chip and the circuit board. Therefore, there is a problem that the number of steps increases and the yield decreases.

[0017]

Therefore, flip-chip mounting technology using an anisotropic conductive material has been developed as a method of simultaneously electrically connecting electrode terminals of opposing semiconductor chips and connection terminals of a circuit board and fixing the semiconductor chip to the circuit board. This is to supply a thermosetting resin containing conductive particles between the circuit board and the semiconductor chip, and heat the thermosetting resin while applying pressure to the semiconductor chip, thereby simultaneously realizing the electrical connection and fixing of the semiconductor chip and the circuit board. method (for example, Patent Document 5).

Patent Document 1: Japanese Patent Application Laid-Open No. 11-163510

Patent Document 2: Japanese Patent Application Laid-Open No. 11-067829

Patent Document 3: Japanese Patent Laid-Open No. 2000-94179

Patent Document 4: Japanese Patent Application Laid-Open No. 1-157796

Patent Document 5: Japanese Patent Laid-Open No. 2000-332055

[0018]

However, in the solder bump forming method shown in Patent Document 3 and the super solder paste method shown in Patent Document 4, after simply coating the paste composition on the circuit board, local thickness and concentration dispersion, the amount of solder deposits differs from one connection terminal to another, so highly uniform solder bumps cannot be obtained. In addition, since these methods apply a paste-like composition on a circuit board with concavo-convexities on which connection terminals are formed on the surface, it is impossible to supply a sufficient amount of solder to the connection terminals that become protrusions. In flip-chip mounting, it is difficult to Obtain the desired height of solder bumps.

[0019]

In addition, in the flip-chip mounting method disclosed in Patent Document 5, there are many problems to be urgently solved as follows in terms of productivity and reliability.

[0020]

That is, first, since electrical conduction between electrode terminals is obtained by mechanical contact through conductive particles, it is difficult to achieve a stable conduction state. Second, since the distance varies depending on the amount of conductive particles present between the semiconductor chip and each terminal of the circuit board, electrical bonding is unstable. Third, the thermal process of hardening the thermosetting resin causes conductive particles to scatter, causing a short circuit, resulting in a decrease in yield. Fourth, due to the structure in which the semiconductor chip is exposed on the circuit board, friction, impact, etc. when the circuit board is mounted on the machine cause poor connection of the semiconductor chip and cause failures. Fifth, in order to realize a stable electrical connection, it is necessary to press and crimp with a high pressure (load), so problems such as damage to the semiconductor chip are likely to occur.

Contents of the invention

[0021]

The present invention was developed to solve the above-mentioned problems, and its object is to provide a flip-chip package and a flip-chip package that can mount a next-generation semiconductor chip having more than 5,000 electrode terminals, and that are excellent in productivity and reliability. Mounting method.

[0022]

That is to say, the electronic component package provided by the present invention (the first invention) is characterized in that it is an electronic component package including an electronic component and a circuit board component on which the electronic component is mounted, and the electronic component is mounted on the surface facing the The surface of the electronic component of the circuit substrate forms a plurality of electrode terminals; the circuit substrate forms electrode terminals in one-to-one correspondence with the plurality of electrode terminals; A structure in which a plurality of spacer members are arranged in areas other than the electrode terminal portions; the electrode terminals of the circuit board and the electrode terminals of the electronic components are electrically connected by solder bumps formed in a self-aggregating manner. connect.

[0023]

In an appropriate embodiment, the heights of the plurality of pad components are set to be the height of the solder bumps, half the length of the shortest side of the electrode terminals of the electronic components and the The height equal to or less than the sum of half the lengths of the shortest sides of the electrode terminals of the substrate.

[0024]

In a certain suitable embodiment, the plurality of pad members are made of solder.

[0025]

In a certain suitable embodiment, the plurality of pad members are made of a thermosetting resin material.

[0026]

In a certain suitable embodiment, the plurality of spacer members are made of a photocurable resin material.

[0027]

In a certain suitable embodiment, the plurality of pad members are made of a thermoplastic resin material.

[0028]

In a certain suitable embodiment, the plurality of pad members are made of a heat-melt resin material.

[0029]

In a certain suitable embodiment, the plurality of spacer members are formed by covering the magnetic core material with a resin material.

[0030]

An electronic device according to the present invention is an electronic device including the electronic component package described above.

The method for manufacturing an electronic component package according to the present invention includes: a step (a) of preparing an electronic component having a surface on which electrode terminals are arranged; and preparing a circuit having a surface on which electrode terminals are arranged corresponding to the electrode terminals of the electronic component. The step (b) of the substrate, the step (c) of forming a plurality of spacers other than the electrode terminal portion on the surface of at least one of the electronic component or the circuit substrate having the electrode terminal; A step (d) of imparting a solder resin paste containing solder powder and a convective additive that boils when the resin is heated to the circuit board; disposing the electronic component on the circuit board through the solder resin paste The step (e) of heating the solder resin paste to boil the convective additive, and forming the electrode terminals of the electronic component on the circuit board corresponding to the electrode terminals by using the resin The process (f) of electrically connecting the electrode terminals of the above-mentioned process; under the action of a plurality of pads prepared in the process, between the electrode terminals arranged on the electronic components and the corresponding electrode terminals arranged on the surface of the circuit substrate , forming a certain gap.

[0031]

Another manufacturing method of the electronic component package of the present invention, the step (a) of preparing an electronic component having a surface on which electrode terminals are arranged; preparing a circuit having a surface on which electrode terminals are arranged corresponding to the electrode terminals of the electronic component The step (b) of the substrate, the step (c) of forming a plurality of spacers other than the electrode terminal portion on the surface of at least one of the electronic component or the circuit substrate having the electrode terminal; The step (d) of arranging the electronic components on the circuit substrate: filling the solder resin paste between the electronic components and the circuit substrate with a solder resin paste containing solder powder and a convective additive that boils when the resin is heated. Step (e) of the space: heating the solder resin paste, boiling the convective additive, and using the resin, the electrode terminals of the electronic component and the electrode terminals corresponding to the electrode terminals are placed on the circuit board A step (f) of electrically connecting the formed electrode terminals; under the action of a plurality of pads prepared by said step,

A certain gap is formed between the electrode terminals arranged on the electronic component and the corresponding electrode terminals arranged on the circuit board surface.

[0032]

Another manufacturing method of the present invention is characterized in that, in the step of arranging the electronic component on the circuit board, the electronic component and the circuit board are attached and held using the plurality of spacers.

[0033]

Furthermore, the present invention provides a flip-chip package (the second invention), which is characterized in that: a circuit board (the circuit board has a plurality of connection terminals), a semiconductor chip (the semiconductor chip has a plurality of electrode terminals arranged opposite to the connection terminals) ), a plate-shaped body (the plate-shaped body is bonded in place on the inside of the semiconductor chip, and has at least two protrusions at the end); At the same time, at least the circuit board and the semiconductor chip are fixed with resin.

[0034]

Furthermore, electrodes may be provided so as to surround the electrode terminals of the circuit board, and pseudo bumps may be formed on the electrodes.

[0035]

Furthermore, the electrodes may be discretely formed.

[0036]

Furthermore, at least the front end of the protruding portion of the plate-shaped body may be made of metal or metal-coated resin, and may have wettability to solder.

[0037]

Furthermore, the circuit board and the raised portion of the plate-shaped body are bonded together by pressure bonding or ultrasonic bonding.

[0038]

Furthermore, the circuit board and the plate-shaped body can be bonded by the resin of the resin composition.

[0039]

With these configurations, since the bumps are provided, the distance between the connection terminals of the circuit board and the electrode terminals of the semiconductor chip can be kept constant, so that uniform connection can be achieved. Furthermore, since the semiconductor chip is not exposed on the circuit board, it is possible to realize a highly reliable flip-chip package that eliminates failures such as poor connection due to impact and friction during transportation.

[0040]

In addition, the flip-chip mounting method of the present invention is characterized in that a semiconductor chip having a plurality of electrode terminals is arranged facing a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board are electrically connected to the electrode terminals of the semiconductor chip. A flip-chip mounting method for connection, including: a process of aligning a semiconductor chip with a plate-shaped body having at least two protrusions at an end and then bonding it; a resin composition mainly composed of solder powder, a convection additive, and a resin The process of coating or adhering on a circuit substrate or a semiconductor chip; aligning the protrusions of the plate-shaped body on which the semiconductor chip is bonded on the circuit substrate, and then using the protrusions to make the circuit substrate and the semiconductor chip The interval between semiconductor chips becomes fixed; the process of heating the resin composition to the melting temperature of solder powder, boiling or decomposing the convective additive, and generating gas; the gas is convected and discharged between the raised parts of the plate In the process, the molten solder powder flows in the resin composition, so that the solder powder self-assembles and grows, thereby electrically connecting the connection terminal and the electrode terminal.

[0041]

Furthermore, the resin composition may be composed of a plate-like resin, a film-like resin, or a paste-like resin, and may be attached to a circuit board or a semiconductor chip.

[0042]

Furthermore, in the step of fixing the protruding portion of the plate-like body to the circuit board, it may be fixed by solder for fixing formed on the circuit board in advance.

[0043]

Furthermore, in the step of fixing the protruding portion of the plate-shaped body to the circuit board, the protruding portion of the plate-shaped body may be bonded to the circuit board by crimping or ultrasonic bonding.

[0044]

By adopting these methods, since it is possible to mount with a low load, it is possible to use a semiconductor chip with a thin profile, area arrangement, etc., and an insulating material with a low dielectric constant. Furthermore, a flip-chip mounting method excellent in firm connection and reliability of the semiconductor chip and the circuit board can be realized. Furthermore, since the bonding state between the electrode terminal and the connection terminal can be made uniform, yield and manufacturing efficiency can also be improved.

[0045]

In addition, the flip-chip package of the present invention is characterized in that it has a circuit board (the circuit board has a plurality of connection terminals), a semiconductor chip (the semiconductor chip has a plurality of electrode terminals arranged opposite to the connection terminals), a box-shaped body (the box-shaped body is bonded in place on the inside of the semiconductor chip, and has at least a hole that can be ventilated in one direction); while electrically connecting the electrode terminals of the circuit board and the electrode terminals of the semiconductor chip with a solder layer, At least the circuit board and the semiconductor chip are also fixed with resin.

[0046]

Furthermore, the box-shaped body may cover the semiconductor chip, and may be processed into a box shape having a flange protruding from the peripheral edge at the peripheral portion of the opening of the box-shaped body.

[0047]

Furthermore, the hole through which air can be ventilated in the box-shaped body may be opened only on the side wall portion of the box-shaped body to which the semiconductor chip is not bonded.

[0048]

Furthermore, by providing the electrodes so as to surround the electrode terminals of the circuit board, dummy protrusions can be formed on the electrodes.

[0049]

Furthermore, the electrodes may be discretely formed.

[0050]

Furthermore, the box-shaped body may be made of metal or metal-coated resin, and may have wettability to solder.

[0051]

Furthermore, the circuit board and the box-shaped body can be bonded together by crimping or ultrasonic bonding.

[0052]

Furthermore, the circuit board and the box-shaped body may be bonded by the resin of the resin composition.

[0053]

With these structures, since the space between the connection terminals of the circuit board and the electrodes of the semiconductor chip can be fixed by the side wall of the box-shaped body, uniform connection can be achieved and warping of the circuit board can be reduced. Furthermore, since the semiconductor chip is not exposed on the circuit board, it is possible to realize a highly reliable flip-chip package that eliminates failures such as poor connection due to impact and friction during transportation.

[0054]

In addition, the flip-chip mounting method of the present invention is characterized in that a semiconductor chip having a plurality of electrode terminals is arranged facing a circuit board having a plurality of connection terminals, and the connection terminals of the circuit board are electrically connected to the electrode terminals of the semiconductor chip. The flip-chip mounting method of connection has: the process of aligning and bonding the semiconductor chip with the box-shaped body having at least one ventilating hole opened in one direction; the main components are solder powder, convective additive and resin The process of coating or adhering the resin composition on the circuit board or semiconductor chip; aligning the box-shaped body with the semiconductor chip bonded on the circuit board, and using the side end of the opening side of the box-shaped body at the same time Part, the process of making the distance between the circuit board and the semiconductor chip fixed; the process of heating the resin composition to the melting temperature of the solder powder, boiling or decomposing the convective additive, and generating gas; gas convection, from the box-shaped body During the hole discharge process, the molten solder powder flows in the resin composition, and the solder powder self-assembles and grows, thereby electrically connecting the connection terminal and the electrode terminal.

[0055]

Furthermore, the resin composition may be composed of a plate-like resin, a film-like resin, or a paste-like resin, and may be attached to a circuit board or a semiconductor chip.

[0056]

Furthermore, in the step of fixing the side end portion of the box-shaped body on the opening side to the circuit board, it may be fixed by solder for fixing formed on the circuit board in advance.

[0057]

Furthermore, in the step of fixing the side end portion of the box-shaped body on the opening side to the circuit board, the box-shaped body may be bonded to the circuit board by crimping or ultrasonic bonding.

[0058]

Further, the step of fixing the side end of the box-shaped body on the opening side to the circuit board may be to place the resin composition between the circuit board and the semiconductor chip, and press the side end of the box-shaped body on the opening side. The process up to the contact with the circuit board.

[0059]

By adopting these methods, since it is possible to mount with a low load, it is possible to use a semiconductor chip with a thin profile, area arrangement, etc., and an insulating material with a low dielectric constant. Furthermore, a flip-chip mounting method excellent in firm connection and reliability of the semiconductor chip and the circuit board can be realized. In addition, since the bonding state between the electrode terminal and the connection terminal can be made uniform, yield and manufacturing efficiency can also be improved.

[0060]

After adopting the present invention, a plurality of electrode terminals are formed on the surface of the electronic component facing the electronic component on the electronic component and the circuit board on which the electronic component is mounted. In the structure in which an electrode terminal is formed corresponding to each of the plurality of electrode terminals on the substrate, and a plurality of adjustment members are arranged in an area other than the electrode terminal of the connected circuit board and the electrode terminal portion of the electronic component, the The electrode terminals of the circuit board and the electrode terminals of the electronic component are electrically connected by self-assembled solder. In this way, with high precision, it is easy to realize an appropriate distance between the actually installed corresponding electrodes and uniformly connected gap distances. The gap distance between the electrodes of the electronic component to be mounted and the electrodes of the circuit board corresponding thereto can be easily realized with high precision as an appropriate distance for forming the solder bumps formed by self-collection to collectively connect them therebetween. As a result, an electronic component package excellent in both productivity and reliability can be realized.

[0061]

Furthermore, after adopting the flip-chip mounting body and its mounting method of the present invention, while it can become a method of mounting the connection between the semiconductor chip and the circuit board firmly, it is also because the semiconductor chip is mounted on the circuit board on which the semiconductor chip is mounted. Since it is not exposed, failures such as shock during transportation and poor connection due to friction are less likely to occur, and a flip-chip package with excellent reliability can be realized. Furthermore, since the joining state between the electrode terminal and the connection terminal can be made uniform, the effect of improving yield and manufacturing efficiency can also be produced.

Description of drawings

[0062]

1( a ) to ( c ) are schematic cross-sectional views of the electronic component package in the manufacturing process of the electronic component package using solder bump forming technology.

2( a ) to ( e ) are schematic cross-sectional views of the package in the manufacturing process of the electronic component package in one aspect of the present invention.

FIG. 3 is a flowchart of the manufacturing process of the electronic component package in one aspect of the present invention.

4( a ) to ( e ) are schematic cross-sectional views of the package in the manufacturing process of the electronic component package in another aspect of the present invention.

5 is a flow chart of the manufacturing process of the electronic component package in another aspect of the present invention.

6 is a graph showing an ideal gap distance between the back electrode of the semiconductor package and the electrode terminal of the circuit board according to the embodiment of the present invention.

7( a ) to ( e ) are schematic cross-sectional views of the package in the manufacturing process of the electronic component package in another aspect of the present invention.

8( a ) is a perspective view showing a flip chip package according to the first embodiment of the present invention, and ( b ) is a sectional view taken along line A to A of FIG. 8( a ).

Fig. 9 is a schematic cross-sectional view illustrating the steps of the flip chip mounting body and the flip chip mounting method in the first embodiment of the present invention.

10( a ) is a perspective view of the plate-shaped body of FIG. 3( a ) viewed obliquely from below, and (b) is a perspective view of the plate-shaped body mounted with the semiconductor chip of FIG. 3( b ) viewed obliquely from below.

FIG. 11( a ) is a perspective view showing a flip-chip mounted body in a second embodiment of the present invention, and ( b ) is a cross-sectional view taken along line A to A of FIG. 5( a ).

Fig. 12 is a schematic process cross-sectional view illustrating a flip-chip mounted body and a flip-chip mounting method in a second embodiment of the present invention.

13( a ) is a perspective view of the box-shaped body of FIG. 6( a ) viewed obliquely from below, and (b) is a perspective view of the box-shaped body mounted with the semiconductor chip of FIG. 6( b ) viewed obliquely from below.

Symbol Description

[0063]

10 Semiconductor packages (electronic components)

11 Rear electrode terminal

20 spacer

21, 22 joining pad

23 core material

24 resin material

30 solder paste

31 convection

40 circuit substrate

41 electrode terminal

50 solder bumps

100 Electronic-part mounting body (electronic-part mounting body)

110 circuit substrate

111 connection terminal

112 convective additive

113 solder resin paste

121 element electrodes

122 solder bumps

201, 307, 401, 510 circuit boards

204, 308, 402, 511 connecting terminals

407 resin

306 resin composition

206, 304, 404, 507 semiconductor chips

207, 305, 406, 508 electrode terminals

208, 313, 405, 514 solder layers

200, 400 flip-chip mounting body

202, 302 raised part

203, 407, 509 resin composition

205, 301 plates

209, 314 pseudobump (pseudbump)

210, 309 electrodes

403, 504 box body

303 vacuum suction device

310 bonding electrode

311, 512 heater

312, 513 gas

408, 506 holes

409, 505 flange

501 handling device

502 hinge

Detailed ways

[0064]

Next, the first invention will be described.

[0065]

The present applicant has developed a proprietary technology that can self-assemble solder under specified conditions to form solder bumps or perform flip-chip mounting, which is described in Japanese Patent Application No. 2004-257206 and Japanese Patent Application No. 2004-267919 . Here, Japanese Patent Application No. 2004-257206 and Japanese Patent Application No. 2004-267919 are cited as a part of this specification.

[0066]

Next, referring to FIG. 1( a ) to FIG. 1( c ), the technique of self-assembly to form solder bumps will be briefly described.

[0067]

First, as shown in FIG. 1( a ), a circuit board 110 on which a plurality of connection terminals 111 are formed is supplied with metal particles (for example, solder powder) and a convective additive 112 not shown in the figure. In addition, the convection additive 112 is an additive that generates convection after boiling when the solder resin paste 113 is heated, as described above.

[0068]

Next, as shown in FIG. 1( b ), the semiconductor chip 120 having a plurality of element electrodes 121 is brought into contact with the surface of the solder resin paste 113 . At this time, the element electrodes 121 of the semiconductor chip 120 are arranged to face the connection terminals 111 of the circuit board 110 . Then, in this state, the solder resin paste 113 is heated. Here, the heating temperature of the solder resin paste 113 is higher than the melting point of the metal particles and the boiling point of the convective additive 112 .

[0069]

The heated and melted metal particles are bonded to each other in the solder resin paste 113 , and self-assemble between the connection terminal 111 and the element electrode 121 with high wettability as shown in FIG. 1( c ). In this way, the connection body 122 electrically connecting the element electrode 121 of the semiconductor chip 120 and the connection terminal 111 of the circuit board 110 is formed. Then, the resin in the solder resin paste 113 is cured to fix the semiconductor chip 120 on the circuit board 110 .

[0070]

The above technique is characterized in that when the solder resin paste 113 is heated, the convective additive 112 contained in the solder resin paste 113 boils, and the boiling convective additive 112 causes convection in the solder resin paste 113, thereby promoting dispersion in the solder resin paste 113. movement of metal particles. In this way, the metal particles can be bonded uniformly, and the connection bodies (solder bumps) 122 can be formed by self-assembly. Here, it can be considered that the solder resin paste 113 functions as a "sea" in which the metal particles can freely float and move. However, since the process of bonding metal particles to each other ends in a very short time, no matter how many "seas" in which metal particles can move freely are installed, the bonding can only be performed locally. The combination of the paste 113 and the convection caused by the convection additive 112 can form the solder bumps 122 self-assembled. In addition, the solder bumps 122 are self-assembled and formed self-integratedly as a property of the solder bumps.

[0071]

The purpose of the above-mentioned method is to add a means for emphatically moving the melted solder powder by adding a convective additive to the resin composition containing the solder powder. In addition, the convective additive may be a solvent that boils or evaporates after heating, and hardly remains in the resin composition after the process is completed.

[0072]

In the above technique, as shown in FIG. 1( b ), it is necessary to form an appropriate constant gap distance between the element electrode 121 of the semiconductor chip 120 and the connection terminal 111 of the circuit board 110 via the solder resin paste 113 . That is to say, if the distance between the semiconductor chip 120 and the circuit substrate 110 is too close, there will be a problem that the connecting body 122 cannot be formed at the connection portion without the gap; There is a problem that the connecting body 122 cannot be formed at the connecting parts that are in contact with each other.

[0073]

Therefore, the inventors of the present invention worked hard to study the content of the self-assembled solder joint technology that needs to solve the problem that the connected body cannot be formed, found a solution to the problem, and formed the present invention.

[0074]

Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, for the sake of concise description, the same reference numerals are assigned to components having substantially the same functions. In addition, this invention is not limited to the following embodiment.

[0075]

Next, the electronic component package 100 according to the embodiment of the present invention and its manufacturing method will be described with reference to FIGS. 2 to 7 .

[0076]

2( a ) to 2( e ) are schematic cross-sectional views showing the electronic component package according to the present embodiment during the main process and at the time of completion, and FIG. 3 is a flowchart of the mounting process.

[0077]

In FIG. 2( a), 10 represents a cross-sectional structure of a semiconductor package having an area array terminal arrangement used in the electronic component package 100 of the present embodiment, 11 is a rear electrode terminal arranged in an area array, and 20 is made of a semiconductor package having a high melting point. A pad made of solder, 21 denotes a bonding pad to which the pad is bonded.

[0078]

In FIG. 2( b ), 40 represents a cross-sectional structure of a circuit board used in the electronic component package 100 of this embodiment, and 41 is connected to the back surface electrode terminals 11 formed on the semiconductor package 10 in a one-to-one correspondence. 22 denotes an electrode terminal formed on the surface of the circuit board 40 to be bonded to the pad 20, and 30 denotes a solder paste.

[0079]

First, as shown in FIG. 2( a ), a member having a bonding pad 21 and a pad 20 formed thereon is prepared at a predetermined position of a semiconductor package 10 having a back electrode terminal 11 on one surface ( S01 ). The material of the bonding boss 21 must be a material that can be bonded and held after being coated with a material such as solder used for the spacer 20 . As an example, a metal such as Cu may be plated with gold (Au) in the same manner as the back electrode terminal 11 of a common semiconductor package 10 . The spacer 20 is preferably composed of high-melting-point solder having a high melting temperature of the solder powder material contained in the solder paste 30 described later. For example, the solder powder material contained in the solder paste 30 is PbSn eutectic solder (melting point 183° C.), and the refractory solder of the pad 20 is SnAgCu-based material (melting point 220° C.).

[0080]

On the other hand, a circuit having a desired wiring pattern (not shown) is prepared, and the bonding protrusions 22 respectively corresponding to the electrode terminals 41 of the back surface electrode terminals 11 of the semiconductor package 10 and the pads 20 are formed on one surface thereof. Substrate 40 (S02).

[0081]

As shown in FIG. 2( b ), the semiconductor package 10 is mounted at a predetermined position on the circuit board 40 with the spacer 20 interposed therebetween ( S03 ). At this time, a predetermined gap is provided between the rear electrode terminal 11 formed on the semiconductor package 10 and the corresponding electrode terminal 41 formed on the circuit board 40 .

[0082]

After the semiconductor package 10 is mounted, as shown in FIG. 2( c ), the solder resin paste 30 in which solder powder and convective additives are added is poured into the gap between the semiconductor package 10 and the circuit board 40 for filling (S04).

[0083]

The convective additive is a material that boils when the resin is heated, such as an organic solvent. When the solder resin paste 30 is heated, as shown in FIG. 2( d ), the convective additive in the solder resin paste 30 boils to generate convection in the resin. Then, as shown in FIG. 2( e ), the solder powder in the solder resin paste 30 self-assembles to form a solder bump 50 . The back surface electrode terminals 11 of the semiconductor package 10 and the electrode terminals 41 of the circuit board 40 are collectively connected by the solder bumps 50 ( S05 ).

[0084]

In addition, in the steps after the semiconductor package 10 mounting step ( S03 ), for example, handling such as sandwiching the semiconductor package 10 and the circuit board 40 is required so that the semiconductor package 10 does not come off from the circuit board 40 .

[0085]

In the present embodiment, since it is possible to precisely and easily set a predetermined appropriate gap distance between the back surface electrode terminals 11 of the semiconductor package 10 and the corresponding electrode terminals 41 of the circuit board 40 , it is possible to prevent There arises a problem that the connection protrusion 50 is not formed.

[0086]

Next, a modified example of the manufacturing method of this embodiment will be described with reference to FIGS. 4( a ) to 4 ( e ) and FIG. 5 .

4( a ) to 4( e ) are schematic cross-sectional views during main steps and at the time of completion of the electronic component package according to the modified example of the present embodiment. Furthermore, FIG. 5 is a flowchart of this mounting process.

[0087]

In this embodiment, first, as shown in FIG. ).

[0088]

As shown in FIG. 4 (b), prepare to have the required wiring pattern (not shown), and form electrode terminals 41 and pads 20 corresponding to the back electrode terminals 11 of the semiconductor package 10 respectively on one surface thereof. A required amount of solder resin paste 30 is applied to a predetermined position on the surface of the circuit board 40 of the bonding boss 22 (S06).

[0089]

As shown in FIG. 4( c ), the semiconductor package 10 is mounted at a predetermined position on the circuit board 40 in contact with the solder resin paste 30 via the pad 20 ( S03 ).

[0090]

When the solder resin paste 30 is heated, as shown in FIG. 4( d ), the convective additive in the solder resin paste 30 boils to generate convection 31 in the resin. Then, as shown in FIG. 4( e ), the solder powder in the solder resin paste 30 self-assembles to form a solder bump 50 . The back surface electrode terminals 11 of the semiconductor package 10 and the electrode terminals 41 of the circuit board 40 are collectively connected by the solder bumps 50 ( S05 ).

[0091]

In addition, in the steps after the semiconductor package 10 mounting step ( S03 ), for example, handling such as sandwiching the semiconductor package 10 and the circuit board 40 is required so that the semiconductor package 10 does not come off from the circuit board 40 .

[0092]

In the modified example of this embodiment, the step of pouring the solder resin paste 30 into the gap between the semiconductor package 10 and the circuit board 40 ( S4 ) can be omitted by applying the solder resin paste 30 on the surface of the circuit board 40 in advance. In this way, since the solder resin paste 30 does not need to have flowability, the range of material selection can be expanded.

[0093]

In the above-described embodiment, after the step (S03) of mounting the semiconductor package 10 on the circuit board 40, the pad 20 member formed with solder is used for holding by solder bonding, thereby preventing the semiconductor package 10 from being disconnected from the circuit board 40. fall off. In addition, it goes without saying that the same effect can also be obtained by applying the solder resin paste 30 to one side of the semiconductor package 10 in advance.

[0094]

In the above-described embodiment, in order to form a gap with high precision, the number of spacers 20 formed is preferably three or more. This is because the semiconductor package 10 mounted on the circuit board 40 does not tilt, and the gap distance accuracy is high.

[0095]

In the above-mentioned embodiment, the ideal gap distance between the back electrode terminal 11 of the semiconductor package 10 and the electrode terminal of the circuit board 40 is as shown in FIG. If the length is min.Lp and the length of the shortest side of the electrode terminal 41 on the circuit board 40 side is min.Ls, then the maximum gap distance is preferably less than half of min.Lp and min.Ls. The reason is that if the solder bump 50 formed between the back surface electrode terminal 11 of the semiconductor package 10 and the electrode terminal of the circuit board 40 exceeds this distance, there is a high possibility of overflowing onto the electrode terminals 11 and 41 to cause a short circuit.

[0096]

In the above-described embodiment, high-temperature solder is used as the pad 20 . However, the same effect can also be obtained by using a resin material having various adhesive properties such as thermosetting resin, light-curing resin, thermoplastic resin, and hot-melt resin.

[0097]

Furthermore, as shown in FIGS. 7(a) to (e), for example, a core material 23 of a thermosetting resin material 24 covering a fully cured thermosetting resin with an adhesive thermosetting resin material 24 leaving an uncured portion may be used. The bonding resin of the structure covers the composite structure of the magnetic core liner.

[0098]

Here, examples of thermosetting resins include epoxy resins, phenol resins, cyanate resins, poly(di)phenylene ether resins, or mixtures thereof.

[0099]

Photocurable resins are resins that undergo a polymerization reaction after being irradiated with predetermined ultraviolet rays. For example, as the radical polymerization type, acrylic oligomers such as polyester acrylate, urethane acrylate, and epoxy acrylate are used. And unsaturated polyester, enethiol (enthiol) or their compounds. Examples of cationic catalyst polymerizations include epoxy resins such as glycidyl ethers and alicyclic epoxy resins, oxetanes, vinyl ethers, or compounds thereof.

[0100]

Examples of thermoplastic resins include polyethylene (PE), polypropylene (PP), polystyrene (PS), acrylic blue/styrene resin (AS), acrylic blue/butadiene/styrene resin (ABS) , methacrylic resin (PMMA), vinyl chloride (PVC), etc.

[0101]

Examples of the hot-melt resin material include EVA (vinyl acetate), PA (polyamide), PP (polypropylene), and rubber.

[0102]

The solder resin paste 30 of the above-mentioned embodiment contains, as described above, solder powder and a convective additive that boils when the resin is heated. In other words, the solder resin paste 30 is composed of a resin, solder powder (not shown) dispersed in the resin, and a convective additive (not shown) that boils when the resin is heated. In this embodiment, as resin, use thermosetting resin (for example epoxy resin); , isopropanol, butyl acetate, butyl carbitol, ethylene glycol, etc. can be used. The content of solder powder is preferably 30 vol% or less. The content of the convective additive in the resin is not particularly limited, but it is most preferably contained in the resin at a ratio of 0.1 to 20% by weight.

[0103]

In addition, as mentioned above, the so-called "convection" of the convection additive refers to convection as a form of movement. As long as the boiling convection additive moves in the resin, it imparts kinetic energy to the metal particles (solder powder) dispersed in the resin, and starts to move. Any form of motion that promotes movement of the metal particles is acceptable. In addition, as convective additives, in addition to substances that generate convective flow after boiling themselves, convective additives that generate gases (gases such as H ₂ O, CO ₂ , N ₂ ) after heating resins can also be used. As examples of such substances, A compound containing crystal water, a thermally decomposed compound, or a blowing agent may be cited.

[0104]

The formation time of the solder bump 50 in Fig. 2(b)-(c) and Fig. 4(d)-Fig. Second). In addition, in forming the solder bump 50, a preheating step of heating the solder resin paste 30 in advance may be introduced.

[0105]

The solder bumps 50 are self-integrated with respect to the rear electrode terminal 11 and the electrode terminal 41 while being self-assembled. In this way, there is substantially no displacement between the back electrode terminals 11 and the electrode terminals 41 and the solder bumps 50 , and the solder bumps 50 can be automatically formed corresponding to the patterns of the back electrode terminals 11 and the electrode terminals 41 .

[0106]

Since the solder bump 50 is formed by self-assembly of solder powder in the solder resin paste 30, the resin constituting the solder resin paste 30 does not substantially contain conductive particles, and the adjacent solder bumps 50 are constituted. ) and the resin insulation of the solder resin paste 30 in FIG. 4( e ). In addition, the convective additive becomes a gas after being heated, and is discharged to the outside so that it can be removed from the solder resin paste 30 . In addition, after forming the solder bumps 50 and rinsing the solder resin paste 30, it is also possible to fill with another resin (or the same type of resin).

[0107]

After curing the resin (or other resins) constituting the solder resin paste 30 , the electronic component package 100 of this embodiment shown in FIG. 2( e ) and FIG. 4( e ) can be obtained. However, when filling with other resins, resins other than thermosetting resins (photocurable resins, thermoplastic resins, etc.) can also be used as the resin constituting the solder resin paste 30 .

[0108]

As mentioned above, although this invention was described by suitable embodiment, these descriptions are not limiting matters, and it cannot be overemphasized that various changes are possible.

[0109]

The LSI chips constituting the semiconductor package 10 are typically memory ICs, logic ICs, or system LSIs, but the types thereof are not particularly limited. In the embodiment of the present invention described above, the LSI chip is used as the semiconductor package 10, but it is not limited to the semiconductor package 10, and can also be used as a bare chip mounting unit using flip-chip technology, for example. Furthermore, the semiconductor package 10 may be modularized by semiconductor elements such as bare chips via transition pieces (intermediate substrates). This module includes a plurality of electrodes (terminals for mounting), and examples of such a module include an RF module, a power supply module, and the like. In addition, instead of implementing modularization with a transition piece, a component-built-in board module (for example, SIMPACTM) provided with a plurality of terminals for mounting may be used.

[0110]

In addition, the mounted body 100 according to the embodiment of the present invention can be mounted in a thin and compact electronic device in which the mounting area is limited. In addition, not limited to mobile phones, it can also be used for PDAs and notebook computers, and can also be used for other purposes (such as digital cameras, wall-mounted flat-screen TVs (FPD; black-screen displays)).

[0111]

Hereinafter, the second invention will be described

[0112]

The applicant of this patent proposed a novel flip-chip mounting method for next-generation semiconductor chips (Japanese Patent Application No. 2004-267919). Moreover, the present invention describes a flip-chip mounting method that can obtain better effects based on the above-mentioned patent application.

[0113]

The present invention is based on the same technical viewpoint as the flip-chip mounting method described in FIG. 1, and realizes a new flip-chip mounting method that is stronger and more reliable. Furthermore, after implementing the present invention, it is possible to manufacture a flip-chip package with high productivity.

[0114]

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the drawings are arbitrarily enlarged for easy understanding.

[0115]

(first embodiment)

8( a ) is a perspective view showing a flip-chip mounted body in the first embodiment of the present invention, and FIG. 8( b ) is a cross-sectional view taken along line A to A of FIG. 8( a ).

[0116]

In FIG. 8 , the flip-chip package 200 according to the first embodiment of the present invention uses a solder layer 208 to connect a plurality of connection terminals 204 formed on a circuit board 201 and a plurality of electrode terminals 207 arranged opposite to each other. The semiconductor chip 206 is electrically connected to the structure. Further, four protrusions 202 are formed to cover the semiconductor chip 206 near the corners of the plate-like body 205 bonded to the side opposite to the surface on which the electrode terminals 207 of the semiconductor chip 206 are formed. The four protrusions 202 of the plate-shaped body 205 are directly (eg, crimped or soldered) bonded to the circuit board 201 . In addition, when the protruding portion 202 is bonded to the circuit board 201 at least by solder, a material obtained by coating a metal or resin with good solder wettability can be used. Furthermore, in the space formed by the circuit board 201 and the plate-shaped body 205, at least the semiconductor chip 206 and the circuit board are fixed together with the resin 203 covering its periphery and the solder layer 208 electrically connecting the connection terminal 204 and the electrode terminal 207. 201.

[0117]

Also, electrodes 210 are provided to surround the connection terminals 204 of the circuit board 201 that are bonded to the electrode terminals 207 of the semiconductor chip 206 , and solder powder is melted and assembled thereon to form the dummy bumps 209 . Furthermore, when the solder powder is heated and melted, it melts and collects as dummy protrusions 209 on the electrode 210 to be captured, so that it cannot be scattered to the outside. In this way, a short circuit caused by solder powder flowing out of the plate-shaped body 205 can be prevented, and a highly reliable flip-chip package 200 can be obtained.

[0118]

In addition, after adopting the flip-chip mounting body 200 of the present invention, the height can be specified by the protrusion 202 of the plate-shaped body 205, so the distance between the semiconductor chip 206 and the circuit board 201 is constant, and a uniform flip-chip mounting body 200 can be formed. . Therefore, if the distance between the semiconductor chip 206 and the circuit board 201 is set in advance, and the length of the protrusion 202 is determined to be an optimum distance, the connection terminal 204 and the electrode terminal 207 can be connected with a certain amount of solder. As a result, a stable and firm bonded state can be realized, and warping of the circuit board can be suppressed, thereby realizing flip chip package 200 having excellent reliability.

[0119]

In addition, in the first embodiment of the present invention, the description was given using the plate-shaped body having four protrusions, but the present invention is not limited thereto. For example, while the shape of the protrusion can be arbitrarily designed, it is only necessary to form at least one opening. In addition, when it is provided only near the corners of the plate-shaped body, at least three protrusions are sufficient, so that the plate-shaped body can be held stably. Furthermore, when the protrusions are provided on the opposite side surfaces of the plate-shaped body, if the position can be stably maintained in a stationary state, there is no doubt that only two protrusions will suffice.

[0120]

In addition, according to the flip-chip package of the present invention, the semiconductor chip inside can be protected by the plate-shaped body. Furthermore, since it is not subjected to friction, impact, etc. during transportation or the like, reliability can be greatly improved. For example, even for a semiconductor chip with a thickness of about 30 μm, if a plate-shaped body with a thickness of about 100 μm is used, sufficient strength can be obtained in terms of handling.

[0121]

Next, referring to FIGS. 9 and 10 , the flip chip mounted body and the flip chip mounting method according to the first embodiment of the present invention will be described.

[0122]

Fig. 9 is a schematic cross-sectional view illustrating the steps of the flip chip mounting body and the flip chip mounting method in the first embodiment of the present invention. In addition, FIG. 10 (a) is a perspective view of the plate-shaped body of FIG. 9 (a) viewed obliquely from below, and FIG. 10 (b) is a perspective view of the plate-shaped body mounted with the semiconductor chip of FIG. 9 (b) obliquely observed from below .

[0123]

First, as shown in FIG. 9( a ), the plate-shaped object 301 is sucked and conveyed by the vacuum suction device 303 . Furthermore, as shown in FIG. 10( a ), the plate-shaped body 301 is provided with four protrusions 302 near the corners.

[0124]

Next, as shown in FIG. 9( b ), the semiconductor chip 304 is bonded or suction-fixed at a predetermined position inside the plate-like body 301 . Here, as shown in FIG. 10( b ), a plurality of electrode terminals 305 are provided on the lower surface of the semiconductor chip 304 . Then, on the surface of the electrode terminal 305 of the semiconductor chip 304, a resin composition 306 mainly composed of thin plate-shaped solder powder, a convective additive, and a resin is adhered.

[0125]

Next, as shown in FIG. 9( c ), it is moved to a predetermined position on the circuit board 307 using a transfer device (not shown). Then, for example, using an image processing device, the connection terminals 308 of the circuit board 307 and the electrode terminals 305 of the semiconductor chip 304 are aligned so that the circuit board 307 and the plate-shaped body 301 are in contact with each other via the protrusions 302 . Thus, the electrode terminals 305 of the semiconductor chip 304 and the connection terminals 308 of the circuit board 307 face each other at predetermined intervals by the protrusions 302 of the plate-shaped body 301 . Here, the "predetermined interval" means at least the level at which the electrode terminals 305 of the semiconductor chip 304 and the connection terminals 308 of the circuit board 307 are not in contact, and is the level at which molten solder powder described below can be immersed. For example, considering the thickness of the semiconductor chip 304, etc., the height of the protrusion 302 is adjusted so that the distance between the electrode terminal 305 of the semiconductor chip 304 and the connection terminal 308 of the circuit board 307 is about 10 μm to 50 μm. In addition, on the circuit board 307 , bonding electrodes 310 different from the plurality of connection terminals 308 may be provided as necessary so as to bond electrodes 309 for forming pseudo-protrusions described below and the protrusions 302 of the plate-shaped body 301 .

[0126]

In addition, the alignment by the image processing device can be performed by, for example, recognizing the bonding electrodes 310 for bonding the plate-like body 301 disposed on the circuit board 307 and the circuit board 307 . In addition, of course, the resin composition 306 may be bonded to the circuit board 307 .

[0127]

Next, as shown in FIG. 9( d), in the state where the plate-shaped body 301 carrying the semiconductor chip 304 is in contact with the circuit board 307 using a vacuum suction device 303, for example, using a heating device 311 such as an infrared heater, heat at 150° C. A temperature of ~250° C. is externally heated to a temperature at which the solder powder in the resin composition 306 melts.

[0128]

After this heating, the convective additive (not shown) in the resin composition 306 boils or vaporizes, and the solder powder (not shown) also becomes molten solder powder. Then, the molten solder powder in the resin composition 306 is moved by convection while the gas 312 is discharged to the outside through between the protrusions 302 of the plate-shaped body 301 .

[0129]

Furthermore, the moved melted solder powder self-assembles and grows between the electrode terminals 305 of the semiconductor chip 304 and the connection terminals 308 of the circuit board 307 which are arranged facing each other and have good wettability.

[0130]

In this way, as shown in FIG. 9( e), while forming the solder layer 313 electrically connecting the electrode terminal 305 and the connection terminal 308, the resin in the resin composition 306 is hardened, and the vacuum suction device 303 is taken out to produce The flip-chip mounting body 200 is produced.

[0131]

In addition, on the electrode 310 on which the dummy protrusion is formed, the melted solder powder self-assembles and grows to form the dummy protrusion 314 . After the dummy protrusions 314 are formed, the molten solder powder that is not used to form the solder layer 313 is caught on the electrode 310 on which the dummy protrusions are formed, and thus can be prevented from flowing out to the outside.

[0132]

In addition, the electrode 310 which forms the dummy protrusion does not necessarily need to be provided if the solder powder does not scatter or does not cause a problem even if it does scatter.

[0133]

In addition, in the first embodiment, an example was described in which the solder layer 313 is formed while the circuit board 307 and the plate-shaped body 301 are held by the vacuum suction device 303 , but the present invention is not limited thereto. For example, after the protruding portion 302 of the plate-shaped body 301 is fixed to the circuit board 307 by pressure bonding or ultrasonic bonding, the treatment after the heating step may be performed. For example, it can be manufactured automatically using a reflow soldering apparatus or the like.

[0134]

In addition, in the first embodiment, the thin plate-shaped resin composition is bonded to the semiconductor chip or the circuit board and then heated, but the present invention is not limited thereto. For example, after bonding the protruding portion 302 of the plate-shaped body 301 to the circuit board 307, a paste-like resin composition may be injected between the semiconductor chip 304 and the circuit board 307 with a certain distance therebetween, followed by heating.

[0135]

In this way, since the intermediate body of the flip-chip package in which a plurality of circuit boards and plate-like objects are fixed can be produced and processed in one heating step, the production efficiency can be further improved.

[0136]

In addition, it is also possible to form a solder film in advance on the protruding part 302 of the plate-shaped body 301 having metal or at least the protruding part 302 coated with metal at the front end and the electrode 310 of the circuit board 307, and after the heat treatment is completed, At this moment, the circuit board 307 and the plate-shaped body 301 are bonded and fixed by solder. Furthermore, a solder film is formed with a material having a melting point higher than that of the solder powder in the resin composition 306, for example, a melting point of 300° C., and after the solder film is locally melted, for example, with a laser, the circuit board 307 and the bump are joined by solder. Section 302 performs subsequent steps. At this time, the subsequent steps can be performed with the vacuum suction device 303 taken out. However, in the step of heating resin composition 306 , it is necessary to perform subsequent heat treatment at a temperature lower than the melting point (300° C.) of the solder film, for example, so that bumps 302 and electrodes 310 of circuit board 307 do not come off.

[0137]

In addition, when the melting point of the solder film is the same as the melting point of the solder powder in the resin composition 306, the plate-shaped body 301 and the circuit board 307 are bonded after the heating is completed. In this way, the circuit board and the plate-like body can be reliably fixed without increasing the number of steps.

[0138]

In addition, in the first embodiment, an example in which there is a gap between the semiconductor chip and the projecting portion of the plate-shaped body was described for clarity. However, it is also possible to employ a structure in which all semiconductor chips are provided in the protrusions. In this way, further miniaturization can be achieved.

[0139]

In addition, in the first embodiment, the resin composition 306 was described by taking a thin plate-like resin as an example, but the present invention is not limited thereto. For example: Paste-like and jelly-like resins can of course also be applied.

[0140]

As described above, according to the first embodiment of the present invention, flip-chip mounting of semiconductor chips can be realized by a very simple and reliable method.

[0141]

In addition, since the semiconductor chip is protected by the plate-shaped body, it is also possible to prevent connection failures caused by shocks during transportation, etc., so that a flip-chip package excellent in reliability and productivity can be realized.

[0142]

(second embodiment)

FIG. 11( a ) is a perspective view showing a flip-chip mounted body in a second embodiment of the present invention, and FIG. 11( b ) is a cross-sectional view taken along line A to A of FIG. 11( a ).

[0143]

In FIG. 11 , a flip-chip package 400 according to the second embodiment of the present invention adopts a plurality of connection terminals 402 formed on a circuit board 401 and a plurality of semiconductor chips 404 arranged oppositely through a solder layer 405 . The structure in which the electrode terminals 406 are electrically connected. Furthermore, the box-shaped body 403 bonded to the side opposite to the electrode terminal 406 of the semiconductor chip 404 is configured to cover the semiconductor chip 404 . Furthermore, the box-shaped body 403 has a flange 409 on its periphery, and also has a plurality of holes 408 for internal and external ventilation, and is bonded to the circuit board 401 through the flange 409 as a medium, for example, by using a resin adhesive. In addition, although the bonding using a resin adhesive was described above, various methods such as pressure bonding, welding, and ultrasonic bonding may be used to mount the box-shaped body 403 on the circuit board 401 . In addition, as the box-shaped body 403, resin, metal, or resin coated with metal can also be used. Furthermore, in order to protect the semiconductor chip 404 from static electricity, the box-shaped body 403 may use, for example, a conductive resin mixed with carbon or the like. Furthermore, of course, in order to shield electromagnetic waves, for example, conductive resin mixed with nickel may be used for the box-shaped body 403 .

[0144]

In addition, circuit board 401 and box-shaped body 403 fix at least semiconductor chip 404 and circuit board 401 together by solder layer 405 electrically connecting connection terminal 402 and electrode terminal 406 and resin 407 covering its periphery. Here, the resin 407 used to fix the box-shaped body 403 may be the same material as the resin in the resin composition, or a different material may be used. In this case, after the solder layer 405 is formed, the resin composition resin is temporarily removed, and then another resin is injected and filled through the hole 408 of the box-shaped body 403 again.

[0145]

In addition, in the second embodiment of the present invention, electrodes for preventing scattering of solder powder as described in the first embodiment are not provided around the portion of the circuit board 401 where the semiconductor chip 404 is bonded. The reason for this is that the flange 409 prevents the outflow of solder powder and prevents them from being scattered to the outside. Needless to say, in the case of a box-shaped body without a flange 409 or a box-shaped body with a large hole, it is possible to form dummy protrusions by providing electrodes for preventing solder powder from scattering, as in the first embodiment.

[0146]

According to the second embodiment of the invention, with a simple structure, it is possible to prevent a short circuit caused by solder powder flowing out and scattering to the outside, and a highly reliable flip-chip package can be obtained.

[0147]

In addition, since the semiconductor chip can be completely surrounded by the box-shaped body, it has excellent mechanical strength against deformation, and can reduce radiation of electromagnetic waves and the like after being constructed with conductive materials.

[0148]

In addition, since the height of the side surfaces of the box-shaped body 403 can be used to keep the distance between the semiconductor chip 404 and the circuit board 401 constant, the uniformity of the height and size of the solder layer 405 when the semiconductor chip 404 is mounted can be ensured. Therefore, the interval between the semiconductor chip 404 and the circuit board 401 is set in advance, and the height of the side surface of the box-shaped body 403 is determined so as to become an optimum distance, so that the connection terminal 402 and the electrode terminal 406 can be connected with a certain amount of solder, thereby enabling A flip-chip package 400 having a very stable and reliable bonded state and excellent reliability is realized.

[0149]

In addition, in the second embodiment of the present invention, an example was given in which the hole 408 of the box-shaped body 403 is relatively large and the number of arrangement is relatively small. However, it goes without saying that the number and size of the holes 408 are arbitrary, and various modified examples are conceivable.

[0150]

In addition, according to the flip-chip package of the present invention, the semiconductor chip inside can be protected by the box-shaped body. Furthermore, it is because the semiconductor chip is not subjected to friction, impact, or the like during transportation or the like. Use can greatly improve reliability.

[0151]

Next, referring to FIG. 12 and FIG. 13 , a flip chip mounted body and a flip chip mounting method according to a second embodiment of the present invention will be described.

[0152]

Fig. 12 is a schematic process cross-sectional view illustrating a flip-chip mounted body and a flip-chip mounting method in a second embodiment of the present invention. In addition, FIG. 13 (a) is a perspective view of the box-shaped body of FIG. 12 (a) viewed from obliquely below, and FIG. 13 (b) is a perspective view of the box-shaped body of the semiconductor chip of FIG. .

[0153]

First, as shown in FIG. 12( a ), a preliminarily formed box-shaped body 504 is held and conveyed by a rolling arm 503 . Here, the conveying device 501 has, at its front end, a rolling arm 503 for clamping a conveyed object, and a hinge 502 for opening and closing the rolling arm 503 and being rotatable. Furthermore, as shown in FIG. 13( a ), the box-shaped body 504 has a plurality of holes 506 through which air can pass through its side surface, and has a flange 505 at the opening of its end surface.

[0154]

Next, as shown in FIG. 12( b ), the semiconductor chip 507 is bonded or suction-fixed at a predetermined position inside the box-shaped body 504 . Furthermore, as shown in FIG. 13(b), a plurality of electrode terminals 508 are provided on the lower surface of the semiconductor chip 507. As shown in FIG.

[0155]

Next, as shown in FIG. 12(c), a resin composition 509 mainly composed of solder powder, a convective additive, and a resin is applied to a circuit board 501 in advance, and a handling device 501 is used to bond a semiconductor chip 507. The box-shaped body 504 moves to the upper part of the predetermined position. Then, for example, using an image processing device, the connection terminals 511 of the circuit board 501 and the electrode terminals 508 of the semiconductor chip 507 are aligned so that the circuit board 510 and the flange 505 of the box-shaped body 504 are in contact. Thus, the electrode terminals 508 of the semiconductor chip 507 and the connection terminals 511 of the circuit board 510 face each other at predetermined intervals due to the height of the flange 505 and the side surface of the box-shaped body 504 . Here, the "predetermined interval" is the degree at least where the electrode terminals 508 of the semiconductor chip 507 and the connection terminals 511 of the circuit board 510 are not in contact, and is the degree to which molten solder powder described below can be immersed.

[0156]

In addition, the alignment by the image processing apparatus can be performed by recognizing, for example, a mark (not shown) formed on the circuit board 510 and the flange 505 of the box-shaped body 504 .

[0157]

Next, as shown in FIG. 12( d), in a state in which the box-shaped body 504 carrying the semiconductor chip 507 is in contact with the circuit board 510 through the carrier device 501, for example, using a heating device 512 such as an infrared heater, The solder powder in the resin composition 306 is heated from the outside at a temperature of about 150° C. to 250° C. to melt.

[0158]

After this heating, the convective additive (not shown) in the resin composition 509 boils or vaporizes, and the solder powder (not shown) also becomes molten solder powder. Then, the molten solder powder in the resin composition 509 is moved by convection while the gas 513 is discharged to the outside through the hole 408 of the box-shaped body 504 .

[0159]

Furthermore, the molten solder powder that has been moved gathers and grows by itself between the electrode terminal 508 of the semiconductor chip 507 with good wettability and the connection terminal 511 of the circuit board 510 disposed opposite to each other, thereby forming a gap between the electrode terminal 508 and the connection terminal 511. form an electrical connection between them.

[0160]

In this way, as shown in FIG. 12( e), while forming the solder layer 514 electrically connecting the electrode terminal 508 and the connection terminal 511, the resin in the resin composition 509 is cured, and the carrier device 501 is taken out to produce a The flip chip mounting body 400 .

[0161]

At this time, the resin in the resin composition 509 is softened, and while bonding the semiconductor chip 507 and the circuit board 510, it also flows into the gap between the flange 505 of the box-shaped body 504 and the circuit board 510, and the box-shaped body 504 and the circuit board are bonded and fixed. 510.

[0162]

In addition, in the second embodiment of the present invention, no electrode for preventing solder spatter is provided. But no doubt it can also be set.

[0163]

In addition, in the second embodiment of the present invention, the box-shaped body 504 in which the flange 505 is formed is described. However, there is no doubt that the flange 505 may not be present, and the flange 505 may not be on the outside of the box-shaped body 504, but may be inwardly curved.

[0164]

As described above, according to the second embodiment of the present invention, flip-chip mounting of semiconductor chips can be realized by a very simple and reliable method.

[0165]

In addition, since the semiconductor chip is protected by the box-shaped body, it is also possible to prevent connection failures caused by impacts during transportation, etc., so that a flip-chip package excellent in reliability and productivity can be realized.

[0166]

In addition, in the second embodiment of the present invention, the case where the hole 506 is relatively large was described, but many smaller holes may be provided. At this time, it can also be expected that the resin in the resin composition 509 will eventually clog the pores 506 . As a result, since the semiconductor chip 507 is completely isolated from outside air, humidity and the like cannot penetrate, and the life and reliability of the connection between the semiconductor chip and the solder layer and the like are improved.

[0167]

As mentioned above, although the semi-invention was described by each embodiment, these descriptions are not limiting matters, Various deformation|transformation is possible. For example, as a resin containing solder powder and a convective additive, a thermosetting resin is described as an example. However, for example, photocurable resins having fluidity at or above the melting temperature of solder powder, and resins for combined use of these resins may also be used.

[0168]

In addition, in each embodiment of the present invention, the case where there is one semiconductor chip has been described. However, it is also possible to arrange a plurality of them on the circuit board at the same time, and to perform the work of each process.

[0169]

In addition, in each embodiment of the present invention, description has been made using a shape in which the plate-shaped body and the box-shaped body are bent at right angles. But it is not limited to this. For example, it can also be conical. In this way, the processing of the plate-shaped body and the box-shaped body is easy, and the cost can be reduced.

[0170]

In addition, in each embodiment of the present invention, as the resin in the resin composition, epoxy resin, unsaturated polyester resin, polybutadiene resin, polyimide resin, polyamide resin, cyanide resin, etc. One of the salt resins is used as the main resin.

[0171]

Furthermore, in each embodiment of the present invention, as convective additives, decomposed sodium bicarbonate, ammonium metaborate (ammonium methaborate), aluminum hydroxide, dorsonite, barium metaborate (barium methaborate) can also be used, as boiling evaporation Type, you can use butyl carbitol (butyl carbitol), flux (flux), isobutyl alcohol (isobutyl alcohol), xylene, isopentyl alcohol (isopentyl alcohol), butyl acetate (butyl acetate), four Medium or high boiling point solvents such as vinyl chloride, methylisobutylketon, ethyl carbitol, butyl carbitol, and styrene.

[0172]

The present invention is not only suitable for flip-chip mounting of next-generation semiconductor chips with increasingly narrow pitches, but also useful in fields requiring flip-chip mounting with excellent productivity and reliability.

Claims (18)

1. A method of manufacturing an electronic component package, the electronic component package comprising an electronic component and a circuit board on which the electronic component is mounted, the manufacturing method comprising: Process a of preparing an electronic component having a surface on which electrode terminals are arranged; Step b of preparing a circuit board having a surface on which electrode terminals are arranged corresponding to electrode terminals of the electronic component; Step c of forming a plurality of spacers on at least one of the electronic component or the circuit board, other than the electrode terminal portion on the surface having the electrode terminal; The step d of applying a solder resin paste containing solder powder and a convective additive that boils when the resin is heated to at least one of the electronic component or the circuit board; a step e of arranging the electronic component on the circuit board via the solder resin paste; and The solder resin paste is heated to boil the convective additive, the solder powder melted in the resin flows in the resin by the resin, and the solder powder self-assembles and grows, thereby a step f of electrically connecting electrode terminals of the electronic component to electrode terminals formed on the circuit board corresponding to the electrode terminals, On the electronic component, a plurality of electrode terminals are formed on the surface of the electronic component facing the circuit substrate; On the circuit substrate, electrode terminals are formed in one-to-one correspondence with the plurality of electrode terminals; In areas other than the electrode terminals of the connected circuit board and the electrode terminal portions of the electronic components, the electrode terminals arranged on the electronic components and correspondingly placed on the electronic components are passed through the plurality of spacer members prepared in the above process. A certain gap is formed between the electrode terminals arranged on the circuit substrate surface, The electrode terminals of the circuit board and the electrode terminals of the electronic component are electrically connected by self-assembled solder bumps. 2. The method of manufacturing an electronic component package according to claim 1, wherein in the step of arranging the electronic component on the circuit board, the electronic component is placed using the plurality of spacers. Adhesion and retention with the circuit board. 3. The method of manufacturing an electronic component package according to claim 1, wherein electrodes are provided so as to surround said electrode terminals of said circuit board, and dummy protrusions are formed on said electrodes. 4. A method of manufacturing an electronic component package, the electronic component package comprising an electronic component and a circuit board on which the electronic component is mounted, the manufacturing method comprising: Process a of preparing an electronic component having a surface on which electrode terminals are arranged; a step b of preparing a circuit substrate having a surface on which electrode terminals are arranged corresponding to electrode terminals of the electronic component, Step c of forming a plurality of spacers on at least one of the electronic component or the circuit board, other than the electrode terminal portion on the surface having the electrode terminal; a step d of arranging the electronic component on the circuit substrate; a step e of filling a solder resin paste containing solder powder and a convective additive that boils when the resin is heated, into a space formed between the electronic component and the circuit substrate; and The solder resin paste is heated to boil the convective additive, the solder powder melted in the resin flows in the resin by the resin, and the solder powder self-assembles and grows, thereby a step f of electrically connecting electrode terminals of the electronic component to electrode terminals formed on the circuit board corresponding to the electrode terminals, On the electronic component, a plurality of electrode terminals are formed on the surface of the electronic component facing the circuit substrate; On the circuit substrate, electrode terminals are formed in one-to-one correspondence with the plurality of electrode terminals; In areas other than the electrode terminals of the connected circuit board and the electrode terminal portions of the electronic components, the electrode terminals arranged on the electronic components and correspondingly placed on the electronic components are passed through the plurality of spacer members prepared in the above process. A certain gap is formed between the electrode terminals arranged on the circuit substrate surface, The electrode terminals of the circuit board and the electrode terminals of the electronic component are electrically connected by self-assembled solder bumps. 5. The method of manufacturing an electronic component package according to claim 4, wherein in the step of arranging the electronic component on the circuit board, the electronic component is placed using the plurality of spacers. Adhesion and retention with the circuit board. 6. The method of manufacturing an electronic component package according to claim 4, wherein electrodes are provided so as to surround said electrode terminals of said circuit board, and dummy protrusions are formed on said electrodes. 7. A flip-chip mounting method, comprising arranging a semiconductor chip having a plurality of electrode terminals and a circuit substrate having a plurality of connection terminals facing each other, and electrically connecting the connection terminals of the circuit substrate to the electrode terminals of the semiconductor chip The flip-chip mounting method, The flip-chip installation method has: A process of aligning the semiconductor chip to a plate-shaped body having at least two protrusions at the end; Coating or attaching a resin composition mainly composed of solder powder, a convective additive, and a resin on the circuit board or the semiconductor chip; The protrusions of the plate-shaped body to which the semiconductor chip is bonded are arranged in alignment on the circuit substrate, and the circuit substrate and the semiconductor chip are aligned by using the protrusions. The fixed interval becomes a certain process; heating the resin composition to a temperature at which the solder powder melts, boiling or decomposing the convective additive to generate gas; and During the gas convection and discharge from between the protrusions of the plate-shaped body, the molten solder powder flows in the resin composition, and the solder powder self-assembles and grows. , thereby electrically connecting the connecting terminal to the electrode terminal. 8. The flip-chip mounting method according to claim 7, wherein the resin composition is composed of a plate-like resin, a film-like resin or a paste-like resin, and is attached to the circuit board or the semiconductor chip. superior. 9. The flip-chip mounting method according to claim 7 or 8, characterized in that the step of fixing the raised portion of the plate-shaped body on the circuit board is performed by using Fix with the solder formed on it. 10. The flip-chip mounting method according to claim 7 or 8, wherein the process of fixing the raised portion of the plate-shaped body to the circuit board is carried out by crimping or ultrasonic bonding, The protrusion portion of the plate-shaped body is joined to the circuit board. 11. A method of manufacturing a flip-chip package, comprising arranging a semiconductor chip having a plurality of electrode terminals and a circuit board having a plurality of connection terminals facing each other, and connecting the connection terminals of the circuit board to the electrodes of the semiconductor chip Flip-chip mounting method for terminal electrical connection, The flip-chip installation method has: a process of aligning bonding the semiconductor chip to the inside of a box-shaped body having a ventilated hole open in at least one direction; Coating or attaching a resin composition mainly composed of solder powder, a convective additive, and a resin on the circuit board or the semiconductor chip; The box-shaped body to which the semiconductor chip is bonded is aligned and arranged on the circuit substrate, and at the same time, the side end of the box-shaped body on the opening side is used to make the connection between the circuit substrate and the semiconductor chip The fixed interval becomes a certain process; heating the resin composition to a temperature at which the solder powder melts, boiling or decomposing the convective additive to generate gas; and During the gas convection and discharge from the hole of the box-shaped body, the melted solder powder flows in the resin composition, the solder powder self-assembles and grows, and the a step of electrically connecting the connecting terminal to the electrode terminal, The flip-chip mounting body has: a circuit substrate having a plurality of connection terminals; a semiconductor chip having a plurality of electrode terminals arranged opposite to the connection terminals; and A box-shaped body, the inside of the box-shaped body is aligned with the semiconductor chip, and the box-shaped body has at least one ventilating hole open in one direction, The connection terminal of the circuit board and the electrode terminal of the semiconductor chip are electrically connected by a solder layer, and at least the circuit board and the semiconductor chip are fixed with a resin. 12. The method of manufacturing a flip-chip package according to claim 11, wherein electrodes are provided so as to surround the connection terminals of the circuit board, and dummy protrusions are formed on the electrodes. 13. The method of manufacturing a flip-chip package according to claim 11, wherein the circuit board and the box-shaped body are bonded together by pressure bonding or ultrasonic bonding. 14. A flip-chip mounting method, comprising arranging a semiconductor chip having a plurality of electrode terminals and a circuit board having a plurality of connection terminals facing each other, and electrically connecting the connection terminals of the circuit board to the electrode terminals of the semiconductor chip The flip-chip mounting method, The flip-chip installation method has: a process of aligning bonding the semiconductor chip to the inside of a box-shaped body having a ventilated hole open in at least one direction; Coating or attaching a resin composition mainly composed of solder powder, a convective additive, and a resin on the circuit board or the semiconductor chip; The box-shaped body to which the semiconductor chip is bonded is aligned and arranged on the circuit substrate, and at the same time, the side end of the box-shaped body on the opening side is used to make the connection between the circuit substrate and the semiconductor chip The fixed interval becomes a certain process; heating the resin composition to a temperature at which the solder powder melts, boiling or decomposing the convective additive to generate gas; and During the gas convection and discharge from the hole of the box-shaped body, the melted solder powder flows in the resin composition, the solder powder self-assembles and grows, and the A step of electrically connecting the connection terminal to the electrode terminal. 15. The flip-chip mounting method according to claim 14, wherein the resin composition is composed of a plate-like resin, a film-like resin or a paste-like resin, and is attached to the circuit board or the semiconductor chip. superior. 16. The flip chip mounting method according to claim 14, characterized in that the step of fixing the side end of the box-shaped body on the opening side to the circuit board uses The formed fixing is fixed with solder. 17. The flip chip mounting method according to claim 14, characterized in that the step of fixing the side end of the box-shaped body on the opening side to the circuit board is performed by crimping or ultrasonic bonding. The box-shaped body is bonded to the circuit substrate. 18. The flip chip mounting method according to claim 14, wherein in the step of fixing the side end of the box-shaped body on the opening side to the circuit board, the resin composition is interposed Between the circuit board and the semiconductor chip, the side end portion of the box-shaped body on the side of the opening is pressed until it comes into contact with the circuit board.

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